CN118102608A - Optical communication packaging substrate and processing method thereof - Google Patents
Optical communication packaging substrate and processing method thereof Download PDFInfo
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- CN118102608A CN118102608A CN202410225402.5A CN202410225402A CN118102608A CN 118102608 A CN118102608 A CN 118102608A CN 202410225402 A CN202410225402 A CN 202410225402A CN 118102608 A CN118102608 A CN 118102608A
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- lead
- area
- packaging
- optical communication
- dry film
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- 239000000758 substrate Substances 0.000 title claims abstract description 58
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 53
- 238000004891 communication Methods 0.000 title claims abstract description 35
- 230000003287 optical effect Effects 0.000 title claims abstract description 35
- 238000003672 processing method Methods 0.000 title claims abstract description 20
- 238000004519 manufacturing process Methods 0.000 claims abstract description 33
- 229910052737 gold Inorganic materials 0.000 claims abstract description 21
- 239000010931 gold Substances 0.000 claims abstract description 21
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims abstract description 20
- 238000004381 surface treatment Methods 0.000 claims abstract description 12
- 238000005530 etching Methods 0.000 claims abstract description 11
- 238000003466 welding Methods 0.000 claims abstract description 9
- 238000007689 inspection Methods 0.000 claims abstract description 7
- 238000005259 measurement Methods 0.000 claims abstract description 7
- 230000002265 prevention Effects 0.000 claims abstract description 6
- 238000000034 method Methods 0.000 claims description 24
- 238000012545 processing Methods 0.000 claims description 23
- 238000011161 development Methods 0.000 claims description 11
- 238000007747 plating Methods 0.000 claims description 11
- 239000011248 coating agent Substances 0.000 claims description 10
- 238000000576 coating method Methods 0.000 claims description 10
- 229910052751 metal Inorganic materials 0.000 claims description 9
- 239000002184 metal Substances 0.000 claims description 9
- 239000011265 semifinished product Substances 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 239000010949 copper Substances 0.000 claims description 5
- 238000009713 electroplating Methods 0.000 claims description 5
- 239000003814 drug Substances 0.000 claims description 4
- 238000005516 engineering process Methods 0.000 claims description 4
- 239000007888 film coating Substances 0.000 claims description 4
- 238000009501 film coating Methods 0.000 claims description 4
- 238000003780 insertion Methods 0.000 claims description 4
- 230000037431 insertion Effects 0.000 claims description 4
- 239000007788 liquid Substances 0.000 claims description 4
- 239000002253 acid Substances 0.000 claims description 3
- 238000007772 electroless plating Methods 0.000 claims description 3
- 238000000605 extraction Methods 0.000 claims description 3
- 238000010329 laser etching Methods 0.000 claims description 3
- 238000003486 chemical etching Methods 0.000 claims description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 abstract description 5
- 239000010410 layer Substances 0.000 description 19
- 239000000047 product Substances 0.000 description 14
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- 229910000679 solder Inorganic materials 0.000 description 5
- 239000000243 solution Substances 0.000 description 4
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 3
- MSNOMDLPLDYDME-UHFFFAOYSA-N gold nickel Chemical compound [Ni].[Au] MSNOMDLPLDYDME-UHFFFAOYSA-N 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 238000013461 design Methods 0.000 description 2
- 239000011229 interlayer Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- BSIDXUHWUKTRQL-UHFFFAOYSA-N nickel palladium Chemical compound [Ni].[Pd] BSIDXUHWUKTRQL-UHFFFAOYSA-N 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 230000002378 acidificating effect Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010147 laser engraving Methods 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
Landscapes
- ing And Chemical Polishing (AREA)
Abstract
The invention discloses an optical communication packaging substrate and a processing method thereof, wherein the processing method comprises the following steps: providing a circuit substrate, wherein the outer surface of the circuit substrate is provided with a plug area provided with a golden finger A, a lead area provided with a lead, a packaging area provided with a golden finger B and a welding prevention area provided with a welding prevention layer; carrying out surface treatment on the area except for the anti-welding area on the outer surface of the circuit substrate; after the lead area and the packaging area are covered and protected by the dry film A, a hard gold layer is plated on the golden finger A exposed out of the dry film A, and then the dry film A is removed; and etching the lead wire to remove, and then performing conventional electrical measurement, quality inspection and packaging to obtain the optical communication packaging substrate. The processing method is simple and reasonable, has shorter production period, does not need to be provided with a wet film manufacturing process, improves the product yield, ensures the product quality and reduces the production cost.
Description
Technical Field
The invention relates to the technical field of circuit boards, in particular to an optical communication packaging substrate and a processing method thereof.
Background
The optical communication packaging substrate is mainly applied to the technical field of photoelectric conversion, and is structurally designed as follows: the device comprises a plug area and a packaging area, wherein the plug area adopts a golden finger structural design and adopts an electroplated hard gold material so as to meet the friction resistance requirement of a product; in addition, when hard gold plating is performed, the gold fingers need to be connected by leads. The packaging process of the packaging area adopts a electroless nickel gold or electroless nickel palladium gold process, and the electroless plating mode does not need an extra lead wire for conducting. Therefore, for the above-mentioned optical communication package substrate, it is required to perform selective surface treatment during the processing.
At present, the processing method flow adopted by the optical communication packaging substrate is as follows: s1, wet film manufacturing (covering an electroplating lead) mainly comprises the processing procedures of pretreatment, T-face wet ink printing, pre-baking, B-face wet ink printing, pre-baking, exposure, development, post-baking and the like; s2, surface treatment, which mainly comprises the processing procedures of pretreatment, electroless nickel gold or electroless nickel palladium gold, post-treatment and the like; s3, manufacturing a dry film (covering an area which does not need to be plated with hard gold), wherein the dry film mainly comprises processing procedures such as film pressing, exposure, development and the like; s4, electroplating hard gold; s5, removing a film to remove a wet film and a dry film; s6, etching back the lead.
From the above, the existing processing method of the optical communication package substrate has the following disadvantages: ① The process flow is longer, and the complexity is higher; ② There is a certain quality risk, such as: development dirty risks that may be introduced during the wet film fabrication stage; nickel corrosion risks that may be introduced during the surface treatment stage; a risk of incomplete stripping that may be introduced during the stripping phase, and so forth. Thereby causing great adverse effect on the quality of the product.
In view of this, the present invention has been made.
Disclosure of Invention
In order to overcome the defects, the invention provides the optical communication packaging substrate and the processing method thereof, and the processing method is simple and reasonable, has shorter production period, does not have a wet film manufacturing process, improves the product yield, ensures the product quality and reduces the production cost.
The technical scheme adopted by the invention for solving the technical problems is as follows: a processing method of an optical communication packaging substrate comprises the following steps:
S1: providing a circuit substrate, wherein a plug area provided with a golden finger A, a lead area provided with a lead, a packaging area provided with a golden finger B and a welding prevention area provided with a welding prevention layer are formed on the outer surface of the circuit substrate;
S2: carrying out surface treatment on the outer surface of the circuit substrate except the anti-welding area;
s3: after the lead area and the packaging area are covered and protected by using a dry film A, a hard gold layer is plated on the golden finger A exposed out of the dry film A; subsequently removing the dry film A;
S4: etching the lead wire; and then carrying out conventional electrical measurement, quality inspection and packaging to obtain the optical communication packaging substrate.
In the step S2, the insertion and extraction area, the lead area and the packaging area on the outer surface of the circuit substrate are subjected to electroless plating treatment to respectively plate metal plating layers on the golden finger a, the lead and the golden finger B.
As a further improvement of the invention, the specific manufacturing method of the S3 is as follows:
S31: sequentially performing film coating pretreatment, resist coating photosensitive film, exposure and development processing on the circuit substrate subjected to surface treatment to manufacture a dry film pattern capable of covering the lead area and the packaging area on the circuit substrate;
S32: plating the hard gold layer on the gold finger A exposed out of the dry film pattern by utilizing an electroplating technology;
S33: and removing the dry film pattern.
As a further improvement of the present invention, the lead is etched away by a combination of laser etching and chemical etching.
As a further improvement of the invention, the specific manufacturing method of the S4 is as follows:
S41: removing the metal coating on the surface of the lead by using laser equipment in a positive defocusing mode so as to expose the copper surface of the lead; wherein, the processing parameters of the laser equipment are as follows: the laser power is 3-5W, the laser frequency is 500-1500 KHz, the marking speed is 1000-2000 mm/s, and the defocusing amount is 0.2-0.8 mm;
s42: firstly, using a dry film B to cover and protect the plugging area and the packaging area, then using acid etching liquid medicine to etch and remove the lead, and then removing the dry film B to obtain a semi-finished product;
s43: and performing conventional electrical measurement, quality inspection and packaging on the obtained semi-finished product to obtain the optical communication packaging substrate.
As a further improvement of the present invention, in S1, the lead is disposed on a long side of the gold finger a.
The invention also provides an optical communication packaging substrate which is manufactured by adopting the processing method of the optical communication packaging substrate.
The beneficial effects of the invention are as follows: compared with the prior art, the ① optical communication packaging substrate processing method provided by the invention has the advantages of simple process flow, shorter production period and low production cost. ② The method for processing the optical communication packaging substrate is not provided with a wet film manufacturing process, so that the processing process is further simplified, risks of unclean development, pollution of a nickel groove, unclean film removal and the like caused by wet ink are avoided, the product yield is improved, the product quality is ensured, and the production cost is further reduced.
Drawings
FIG. 1 is a flow chart of a method for processing an optical communication package substrate according to embodiment 1 of the present invention;
fig. 2 is a schematic cross-sectional view of a circuit board according to embodiment 1 of the present invention.
The following description is made with reference to the accompanying drawings:
1. a circuit substrate; 10. a golden finger A; 11. a lead wire; 12. golden finger B.
Detailed Description
The preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings.
Example 1:
Referring to fig. 1 and 2, embodiment 1 provides a processing method of an optical communication package substrate, which mainly includes the following steps:
s1: referring to fig. 2, a circuit substrate 1 is provided, and an insertion area provided with a golden finger a10, a lead area provided with a lead 11, a packaging area provided with a golden finger B12, and a solder mask area provided with a solder mask layer are formed on the outer surface of the circuit substrate 1.
Specifically, the circuit board 1 described in this embodiment 1 is a board obtained by performing the processing steps of inner layer circuit formation, interlayer conduction, outer layer circuit formation, outer layer solder mask formation, and the like. The processing procedures of inner layer circuit manufacture, interlayer conduction, outer layer circuit manufacture, outer layer solder mask manufacture and the like all belong to common technical means in the technical field of circuit board processing, and therefore are not described in detail herein.
Further, the golden finger A10 adopts a segmented golden finger structure; the lead 11 is provided on the long side of the golden finger a 10.
As is well known, gold fingers are generally rectangular in shape. And in the prior art, the connection relationship between the lead and the golden finger is generally designed as follows: the lead wire is connected between the short sides of two adjacent golden fingers and has the same width with the short sides of the golden fingers. However, based on the connection relationship, after the lead is etched and removed, the copper surface of the gold finger section is exposed more. Thus, the present application is technically innovative in that the lead 11 is provided on the long side of the gold finger a 10. By changing the layout position of the lead 11, the width dimension of the lead 11 is easily thinned, so that the copper surface exposed out of the section of the golden finger is smaller after the lead 11 is etched and removed, and the reliability of the product can be further improved.
In addition, the structural type of the golden finger B12 is not limited, and the golden finger B is determined according to the design requirement of a product.
S2: and carrying out surface treatment on the area except the solder resist area on the outer surface of the circuit substrate 1.
Specifically, the surface treatment method preferably adopted in this embodiment 1 is as follows: and carrying out chemical plating treatment on the plug area, the lead area and the packaging area on the outer surface of the circuit substrate 1 so as to respectively plate metal plating layers on the golden finger A10, the lead 11 and the golden finger B12.
Furthermore, the metal plating layer may be selected from a nickel-gold layer or a nickel-palladium-gold layer, etc., and is specifically selected according to the technical requirements of the packaging region.
Compared with the prior art, the method has the advantages that the wet film manufacturing process (specifically shown in the background technology) does not exist in the step, the processing process is simplified, the risks of unclean development, pollution to a nickel groove, unclean film removal and the like caused by wet ink are avoided, the product quality is ensured, and the production cost is reduced.
S3: after the lead area and the packaging area are covered and protected by the dry film A, a hard gold layer is plated on the golden finger A10 exposed out of the dry film A; the dry film a is then removed again.
Specifically, the specific manufacturing method preferably adopted in the step S3 is as follows:
S31: after the circuit substrate 1 subjected to surface treatment is subjected to film coating pretreatment, resist coating photosensitive film, exposure and development processing in sequence, a dry film pattern capable of covering the lead area and the packaging area is manufactured on the circuit substrate 1; it will be appreciated that the dry film graphics are made from dry film a described above.
Description: the above-mentioned "pretreatment of coating, coating of resist photosensitive film, exposure and development" processing steps all belong to common technical means in the technical field of circuit board processing, and therefore are not described in detail herein, but only briefly described as follows:
① Film coating pretreatment operation: the circuit substrate 1 is cleaned, heated and dried to facilitate subsequent operations such as coating a resist photosensitive film.
② And (3) coating a corrosion-resistant photosensitive film: a dry film resist and photosensitive film is attached to the circuit board 1.
③ Exposure and development operation: the exposure operation is to expose a part of the area of the photosensitive dry film (specifically, to expose the photosensitive dry film covered on the lead area and the packaging area), and the development operation is to remove the unexposed area of the photosensitive film.
S32: and plating the hard gold layer on the golden finger A10 exposed out of the dry film pattern by utilizing an electroplating technology.
S33: the dry film pattern is removed using a stripping solution (conventionally a strongly basic aqueous solution such as sodium hydroxide solution, etc.).
Compared with the prior art, the wet film removing process does not exist in the step, so that the risk of incomplete film stripping caused by overlong residence time of the wet film is avoided.
S4: etching and removing the lead 11 by adopting a mode of combining laser etching and liquid medicine etching; and then carrying out conventional electrical measurement, quality inspection and packaging to obtain the optical communication packaging substrate.
Specifically, the specific manufacturing method preferably adopted in S4 is as follows:
S41: removing the metal plating layer provided on the surface of the lead 11 using a laser apparatus and employing a positive defocus method (it is understood that the metal plating layer on the surface of the lead 11 is introduced by the above surface treatment operation) to expose the copper surface of the lead 11; wherein, the processing parameters of the laser equipment are as follows: the laser power is 3-5W, the laser frequency is 500-1500 KHz, the marking speed is 1000-2000 mm/s, and the defocusing amount is 0.2-0.8 mm.
The laser equipment (particularly, a laser engraving machine) adopts a positive defocusing mode to gradually remove the metal coating on the surface of the lead 11, so that the lead can be exposed in the forward direction, and the surface of a base material is not damaged.
S42: and firstly covering and protecting the plugging area and the packaging area by using a dry film B, then etching and removing the lead 11 by using acid etching liquid medicine, and then removing the dry film B to obtain a semi-finished product.
The specific operation method of covering and protecting the plugging area and the packaging area by using the dry film B in S42 is the same as the operation method of S31, and thus will not be described herein. In addition, in this step S42, the insertion/extraction area and the packaging area are protected by the dry film B to avoid the corrosion of the golden finger a and the golden finger B by the acidic etchant.
S43: and performing conventional electrical measurement, quality inspection and packaging on the obtained semi-finished product to obtain the optical communication packaging substrate.
Compared with the prior art, the processing method of the optical communication packaging substrate provided by the embodiment has the advantages of simple process flow, shorter production period and no wet film manufacturing flow, thereby improving the product yield, ensuring the product quality and reducing the production cost. In addition, in the processing method provided in the present embodiment, the lead 11 is innovatively disposed on the long side of the golden finger a10, so that the reliability of the product can be further improved.
Example 2:
embodiment 2 provides an optical communication package substrate, which is manufactured by adopting the processing method of the optical communication package substrate described in embodiment 1.
Finally, the "a", "B" and the like (e.g., golden finger a, golden finger B, etc.) of the suffix of the names of the components in the specification of the present invention are for convenience of description only and are not intended to limit the scope of the invention that the patent of the invention may be practiced.
In summary, the processing method of the optical communication packaging substrate is simple and reasonable, has a shorter production period, does not have a wet film manufacturing process, improves the product yield, ensures the product quality, and reduces the production cost.
In the above description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. The foregoing description is only of a preferred embodiment of the invention, which can be practiced in many other ways than as described herein, so that the invention is not limited to the specific implementations disclosed above. While the foregoing disclosure has been described with reference to certain embodiments, it will be understood by those skilled in the art that various changes and modifications may be made and equivalents may be substituted for elements thereof without departing from the scope of the invention. Any simple modification, equivalent variation and modification of the above embodiments according to the technical substance of the present invention without departing from the technical solution of the present invention still falls within the scope of the technical solution of the present invention.
Claims (7)
1. A processing method of an optical communication packaging substrate is characterized in that: the method comprises the following steps:
s1: providing a circuit substrate (1), wherein a plug area provided with a golden finger A (10), a lead area provided with a lead (11), a packaging area provided with a golden finger B (12) and a welding prevention area provided with a welding prevention layer are formed on the outer surface of the circuit substrate (1);
S2: surface treatment is carried out on the outer surface of the circuit substrate (1) except for the anti-welding area;
S3: after the lead area and the packaging area are covered and protected by the dry film A, a hard gold layer is plated on the golden finger A (10) exposed out of the dry film A; subsequently removing the dry film A;
S4: etching the lead (11) away; and then carrying out conventional electrical measurement, quality inspection and packaging to obtain the optical communication packaging substrate.
2. The method for processing an optical communication package substrate according to claim 1, wherein: in the step S2, the insertion/extraction area, the lead area and the packaging area on the outer surface of the circuit substrate (1) are subjected to electroless plating treatment, so that metal plating layers are respectively plated on the golden finger a (10), the lead (11) and the golden finger B (12).
3. The method for processing an optical communication package substrate according to claim 1, wherein: the specific manufacturing method of the S3 is as follows:
s31: sequentially performing film coating pretreatment, resist coating photosensitive film, exposure and development processing on the circuit substrate (1) subjected to surface treatment to manufacture a dry film pattern capable of covering the lead area and the packaging area on the circuit substrate (1);
s32: plating the hard gold layer on the golden finger A (10) exposed out of the dry film pattern by utilizing an electroplating technology;
S33: and removing the dry film pattern.
4. The method for processing an optical communication package substrate according to claim 2, wherein: the lead (11) is etched away by a combination of laser etching and chemical etching.
5. The method for manufacturing an optical communication package substrate according to claim 4, wherein: the specific manufacturing method of the S4 is as follows:
S41: removing the metal coating on the surface of the lead (11) by using laser equipment in a positive defocusing mode so as to expose the copper surface of the lead (11); wherein, the processing parameters of the laser equipment are as follows: the laser power is 3-5W, the laser frequency is 500-1500 KHz, the marking speed is 1000-2000 mm/s, and the defocusing amount is 0.2-0.8 mm;
S42: firstly, covering and protecting the plugging area and the packaging area by using a dry film B, then etching and removing the lead (11) by using acid etching liquid medicine, and then removing the dry film B to obtain a semi-finished product;
s43: and performing conventional electrical measurement, quality inspection and packaging on the obtained semi-finished product to obtain the optical communication packaging substrate.
6. The method for processing an optical communication package substrate according to claim 1, wherein: in the above S1, the lead (11) is provided on the long side of the gold finger A (10).
7. An optical communication package substrate, characterized in that: manufactured by the processing method of the optical communication packaging substrate according to any one of claims 1 to 6.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410225402.5A CN118102608A (en) | 2024-02-29 | 2024-02-29 | Optical communication packaging substrate and processing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410225402.5A CN118102608A (en) | 2024-02-29 | 2024-02-29 | Optical communication packaging substrate and processing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN118102608A true CN118102608A (en) | 2024-05-28 |
Family
ID=91145193
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202410225402.5A Pending CN118102608A (en) | 2024-02-29 | 2024-02-29 | Optical communication packaging substrate and processing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN118102608A (en) |
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2024
- 2024-02-29 CN CN202410225402.5A patent/CN118102608A/en active Pending
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