CN102014582A - Process for manufacturing whole gold-plated board - Google Patents
Process for manufacturing whole gold-plated board Download PDFInfo
- Publication number
- CN102014582A CN102014582A CN 201010557101 CN201010557101A CN102014582A CN 102014582 A CN102014582 A CN 102014582A CN 201010557101 CN201010557101 CN 201010557101 CN 201010557101 A CN201010557101 A CN 201010557101A CN 102014582 A CN102014582 A CN 102014582A
- Authority
- CN
- China
- Prior art keywords
- gold
- plated
- conductive ink
- auxiliary
- zone
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Landscapes
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
The invention discloses a process for manufacturing a whole gold-plated board. The process comprises the following steps: a. making all the patterns in the board and a conductive auxiliary frame on the circuit board once; b. screen-printing conductive printing ink on auxiliary gold-plated areas; c. covering the conductive printing ink layer with a protective dry film; d. adopting the conductive printing ink as the gold-plated leads to plate gold on gold-plated areas on the circuit board; e. removing the protective dry film; f. removing the conductive printing ink layer; and g. carrying out solder resist on the auxiliary gold-plated areas and the conductive auxiliary frame, wherein the patterns in the board are provided with the gold-plated areas and the auxiliary gold-plated areas; and the conductive printing ink ensures all the gold-plated areas to be electrically connected with each other and with the conductive auxiliary frame. Through the process, the problems of seepage plating, incomplete etching and collapse of the gold-plated surfaces are solved, and the production cycle is short and the efficiency is quite obviously improved as about 10min is only needed to print the conductive printing ink and remove the conductive printing ink.
Description
Technical field
The present invention relates to a kind of manufacture craft of full plate coated plate.
Background technology
The manufacture craft of existing full plate coated plate adopts the preceding craft of gilding of figure, its technological process is as follows: blanking-internal layer processing-lamination-boring-heavy copper-plating-outer graphics (is made glodclad wire with big copper face, with gold-plated zone develop out carry out gold-plated)-full plate is gold-plated-outer alkaline etching (remove all dry films, etch away non-gold-plated zone)-outer inspection-welding resistance-character-surface-coated-profile-electrical measurement-one-tenth inspection-packing.
Yet technology has following defective before the figure:
A. easy gold-plated plating and etching are unclean: with big copper face as glodclad wire, cover non-gold-plated zone because there are certain problem in dry film and copper face adhesion with dry film, when gold-plated, dry film comes off or liquid medicine infiltrates under the dry film easily easily around the gold-plated zone, cause with the big copper face that is connected around the gold-plated zone plating gold to occur, it is unclean because of gold-plated etching to occur gold-plated regional copper face when etching easily;
B. gold plating quality is poor, occurs gold-plated zone easily and subsides: gold-plated peripheral region is because be connected with the copper layer, and when losing in the etched plate figure outside carrying out, the copper layer that occurs easily below the Gold plated Layer is snapped eating away, gilding occurs and subsides.
Summary of the invention
The technical problem that the present invention mainly solves provides a kind of manufacture craft of full plate coated plate, the defective that this technology can overcome that gold-plated plating, etching are clean, gold plating quality difference and gold-plated zone subside.
For solving the problems of the technologies described above, the technical scheme that the present invention adopts is: a kind of manufacture craft of full plate coated plate is provided, may further comprise the steps:
A. on circuit board once property make in all plates with gold-plated zone and gold-plated auxiliary area figure and the auxiliary limit of conduction, the auxiliary limit of described conduction is not connected in this step with the interior figure of described plate, and described gold-plated auxiliary area and described gold-plated zone are electrically connected;
B. silk screen printing electrically conductive ink on gold-plated auxiliary area, described electrically conductive ink covers all gold-plated auxiliary areas, and makes between all gold-plated zones, is electrically connected between gold-plated zone and the auxiliary limit of conduction;
C. covering protection dry film on described conductive ink layer is with the protection electrically conductive ink;
D. utilize electrically conductive ink as glodclad wire, carry out gold-plated the gold-plated zone on the circuit board;
E. remove the protection dry film;
F. remove conductive ink layer;
G. gold-plated auxiliary area and the auxiliary limit of conduction are carried out the welding resistance technological operation, make that the auxiliary limit of gold-plated auxiliary area and conduction is the welding resistance zone.
Wherein, in step a, make gold-plated when zone, Yi Bian gold-plated zone wherein widen 0.2-0.5mm, the zone of described increase constitutes gold-plated auxiliary area.
In step b, comprise that the conductive ink layer that silk-screen is finished carries out drying operation, baking temperature is 120 ℃, the barbecue time is 30 minutes.
Wherein, in step b, described conductive ink layer width is 0.5mm～1mm.
Wherein, in step b, described electrically conductive ink layer thickness is 75 μ m～100 μ m.
Wherein, in step f, it is that soak time is 5～15 minutes in 5～15% the alkaline solution that the conductive ink layer on the pcb board is immersed in concentration.
Wherein, described alkaline solution is a NaOH solution.
The invention has the beneficial effects as follows: the defective that the gold-plated plating, etching that is different from prior art is clean, gold plating quality difference and gold-plated zone subside, the present invention has following advantage:
The first, it is unclean to have solved gold-plated plating and etching: the outer complete gold-plated figure of plate is disposable making, the silk-screen electrically conductive ink is typographic in subsequent step, so there is not big copper layer around the gold-plated zone, so do not need to carry out once more etch process processing, do not have the unclean problem of plating and etching.
The second, solved the problem that gold-plated golden face subsides: because of seal electrically conductive ink technology is to conduct electricity by the silk-screen electrically conductive ink, outer gold-plated figure all etching come out, so around its gold-plated zone and side has all plated the nickel gold when gold-plated, and do not need to carry out etch process, so gilding can not subside.
Three, owing to printing conductive inks, removal electrically conductive ink all only need the time about ten minutes, with short production cycle, efficient improves very obvious; And printing conductive inks, removal electrically conductive ink cost are very low, and reduce flow process, shorten the production cycle and also further reduced the time cost of producing, make the supply of material rapider, scheduling of production is more flexible, according to practical production experience, total cost reduces more than 5%.
Description of drawings
Fig. 1 makes the coated plate schematic diagram behind the figure in the plate of gold-plated zone and gold-plated auxiliary area in the embodiment of the invention;
Fig. 2 is the coated plate schematic diagram behind printing conductive inks on the gold-plated auxiliary area in the embodiment of the invention;
Fig. 3 is to the coated plate schematic diagram behind the conductive ink layer covering protection dry film in the embodiment of the invention;
Fig. 4 utilizes electrically conductive ink to carry out coated plate schematic diagram after gold-plated as glodclad wire in the embodiment of the invention;
Fig. 5 is the coated plate schematic diagram behind the gold-plated back removal protection dry film that finishes in the embodiment of the invention;
Fig. 6 is the coated plate schematic diagram behind the removal electrically conductive ink in the embodiment of the invention;
Fig. 7 carries out coated plate schematic diagram after the welding resistance technological operation to gold-plated auxiliary area and additional conductive limit in the embodiment of the invention.
Wherein, 1, gold-plated zone; 2, gold-plated auxiliary area; 3, the auxiliary limit of conduction; 4, electrically conductive ink; 5, dry film; 6, welding resistance zone.
Embodiment
By describing technology contents of the present invention, structural feature in detail, realized purpose and effect, give explanation below in conjunction with execution mode and conjunction with figs. are detailed.
See also Fig. 1 to Fig. 7, the embodiment as the manufacture craft of the full plate coated plate of the present invention may further comprise the steps:
A. on circuit board once property make have gold-plated regional 1 and all plates of gold-plated auxiliary area 2 in figure and the auxiliary limit 3 of conduction, the auxiliary limit 3 of described conduction is not connected in this step with the interior figure of described plate, described gold-plated auxiliary area 2 is electrically connected with described gold-plated regional 1, as shown in Figure 1;
B. silk screen printing electrically conductive ink 4 on gold-plated auxiliary area 2, described electrically conductive ink 4 covers all gold-plated auxiliary areas 2, and make all between gold-plated regional 1, gold-plated regional 1 assist between the limit 3 with conduction and to be electrically connected, as shown in Figure 2;
C. covering protection dry film 5 on described electrically conductive ink 4 is with protection electrically conductive ink 4, as shown in Figure 3;
D. utilize electrically conductive ink 4 as glodclad wire, gold-plated regional 1 on the circuit board carried out gold-plated, as shown in Figure 4;
E. remove protection dry film 5, as shown in Figure 5;
F. remove conductive ink layer 4, as shown in Figure 6;
G. gold-plated auxiliary area 2 and the auxiliary limit 3 of conduction are carried out the welding resistance technological operation, make the auxiliary limit 3 of gold-plated auxiliary area 2 and conduction be welding resistance zone 6, as shown in Figure 7.
In the present embodiment, in step a, made gold-plated regional 1 o'clock, Yi Bian gold-plated regional 1 wherein widen 0.2-0.5mm, the zone of described increase constitutes gold-plated auxiliary area 2.
Gold-plated auxiliary area of the present invention is owing to being covered by conductive ink layer and protection photopolymer layer in gold-plated process, so gold-plated auxiliary area is to be coated with gold.
The defective that the gold-plated plating, etching that is different from prior art is clean, gold plating quality difference and gold-plated zone subside, the present invention has following advantage:
The first, it is unclean to have solved gold-plated plating and etching: the outer complete gold-plated figure of plate is disposable making, the silk-screen electrically conductive ink is typographic in subsequent step, so there is not big copper layer around the gold-plated zone, so do not need to carry out once more etch process processing, do not have the unclean problem of plating and etching.
The second, solved the problem that gold-plated golden face subsides: because of seal electrically conductive ink technology is to conduct electricity by the silk-screen electrically conductive ink, outer gold-plated figure all etching come out, so around its gold-plated zone and side has all plated the nickel gold when gold-plated, and do not need to carry out etch process, so gilding can not subside.
Three, owing to printing conductive inks, removal electrically conductive ink all only need the time about ten minutes, with short production cycle, efficient improves very obvious; And printing conductive inks, removal electrically conductive ink cost are very low, and reduce flow process, shorten the production cycle and also further reduced the time cost of producing, make the supply of material rapider, scheduling of production is more flexible, according to practical production experience, total cost reduces more than 5%.
In one embodiment, in step b, comprise that the conductive ink layer that silk-screen is finished carries out drying operation, baking temperature is 120 ℃, and the barbecue time is 30 minutes.
In one embodiment, in step b, described conductive ink layer width is 0.5mm～1mm, and described electrically conductive ink layer thickness is 75 μ m～100 μ m.In this thickness and width, can guarantee that conductive ink layer can make the effect that conducts that reaches gold-plated requirement between the gold-plated zone, can avoid too thick too wide waste that causes or poor, the processing technology difference problem of the too thin too narrow conduction that causes again.
In one embodiment, in step f, it is that soak time is 5～15 minutes in 5～15% the alkaline solution that the conductive ink layer on the pcb board is immersed in concentration, and described alkaline solution can be NaOH solution.
The above only is embodiments of the invention; be not so limit claim of the present invention; every equivalent structure or equivalent flow process conversion that utilizes specification of the present invention and accompanying drawing content to be done; or directly or indirectly be used in other relevant technical fields, all in like manner be included in the scope of patent protection of the present invention.
Claims (7)
1. the manufacture craft of a full plate coated plate is characterized in that, may further comprise the steps:
A. on circuit board once property make in all plates with gold-plated zone and gold-plated auxiliary area figure and the auxiliary limit of conduction, the auxiliary limit of described conduction is not connected in this step with the interior figure of described plate, and described gold-plated auxiliary area and described gold-plated zone are electrically connected;
B. silk screen printing electrically conductive ink on gold-plated auxiliary area, described electrically conductive ink covers all gold-plated auxiliary areas, and makes between all gold-plated zones, is electrically connected between gold-plated zone and the auxiliary limit of conduction;
C. covering protection dry film on described conductive ink layer is with the protection electrically conductive ink;
D. utilize electrically conductive ink as glodclad wire, carry out gold-plated the gold-plated zone on the circuit board;
E. remove the protection dry film;
F. remove conductive ink layer;
G. gold-plated auxiliary area and the auxiliary limit of conduction are carried out the welding resistance technological operation, make that the auxiliary limit of gold-plated auxiliary area and conduction is the welding resistance zone.
2. the manufacture craft of full plate coated plate according to claim 1 is characterized in that: in step a, make gold-plated when zone, Yi Bian gold-plated zone wherein widen 0.2-0.5mm, the zone of described increase constitutes gold-plated auxiliary area.
3. the manufacture craft of full plate coated plate according to claim 2 is characterized in that: in step b, comprise that the conductive ink layer that silk-screen is finished carries out drying operation, baking temperature is 120 ℃, and the barbecue time is 30 minutes.
4. the manufacture craft of full plate coated plate according to claim 3 is characterized in that: in step b, described conductive ink layer width is 0.5mm～1mm.
5. the manufacture craft of full plate coated plate according to claim 4 is characterized in that: in step b, described electrically conductive ink layer thickness is 75 μ m～100 μ m.
6. the manufacture craft of full plate coated plate according to claim 5 is characterized in that: in step f, it is that soak time is 5～15 minutes in 5～15% the alkaline solution that the conductive ink layer on the pcb board is immersed in concentration.
7. the manufacture craft of full plate coated plate according to claim 6 is characterized in that: described alkaline solution is a NaOH solution.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010105571010A CN102014582B (en) | 2010-11-24 | 2010-11-24 | Process for manufacturing whole gold-plated board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010105571010A CN102014582B (en) | 2010-11-24 | 2010-11-24 | Process for manufacturing whole gold-plated board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102014582A true CN102014582A (en) | 2011-04-13 |
| CN102014582B CN102014582B (en) | 2012-05-09 |
Family
ID=43844516
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010105571010A Expired - Fee Related CN102014582B (en) | 2010-11-24 | 2010-11-24 | Process for manufacturing whole gold-plated board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102014582B (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102522342A (en) * | 2011-12-27 | 2012-06-27 | 日月光半导体制造股份有限公司 | Semiconductor structure and method for manufacturing same |
| CN103298267A (en) * | 2013-03-05 | 2013-09-11 | 深圳市迅捷兴电路技术有限公司 | Manufacturing method for circuit board with surface to be partially processed in thick plate electroplating mode |
| CN110109321A (en) * | 2019-05-31 | 2019-08-09 | 高德（无锡）电子有限公司 | Limp outer lead is segmented the design method of the golden finger segmentation location segment egative film film |
| WO2023178851A1 (en) * | 2022-03-25 | 2023-09-28 | 生益电子股份有限公司 | Preparation method for pcb, and pcb |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006100300A (en) * | 2004-09-28 | 2006-04-13 | Shindo Denshi Kogyo Kk | Printed wiring board and manufacturing method therefor |
| CN101267713A (en) * | 2008-04-30 | 2008-09-17 | 陈国富 | Making method of electric nickel and golden circuit board for saving nickel and gold dosage |
| CN101604558A (en) * | 2009-07-23 | 2009-12-16 | 山东天诺光电材料有限公司 | A kind of conductive pattern and preparation method and purposes |
| CN101626664A (en) * | 2008-07-11 | 2010-01-13 | 惠阳科惠工业科技有限公司 | Process flow for electroplating Ni/Au and selectively electroplating thick gold without lead wire |
-
2010
- 2010-11-24 CN CN2010105571010A patent/CN102014582B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006100300A (en) * | 2004-09-28 | 2006-04-13 | Shindo Denshi Kogyo Kk | Printed wiring board and manufacturing method therefor |
| CN101267713A (en) * | 2008-04-30 | 2008-09-17 | 陈国富 | Making method of electric nickel and golden circuit board for saving nickel and gold dosage |
| CN101626664A (en) * | 2008-07-11 | 2010-01-13 | 惠阳科惠工业科技有限公司 | Process flow for electroplating Ni/Au and selectively electroplating thick gold without lead wire |
| CN101604558A (en) * | 2009-07-23 | 2009-12-16 | 山东天诺光电材料有限公司 | A kind of conductive pattern and preparation method and purposes |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102522342A (en) * | 2011-12-27 | 2012-06-27 | 日月光半导体制造股份有限公司 | Semiconductor structure and method for manufacturing same |
| CN103298267A (en) * | 2013-03-05 | 2013-09-11 | 深圳市迅捷兴电路技术有限公司 | Manufacturing method for circuit board with surface to be partially processed in thick plate electroplating mode |
| CN103298267B (en) * | 2013-03-05 | 2015-09-16 | 深圳市迅捷兴电路技术有限公司 | The method for manufacturing circuit board of the thick gold surface process of parcel plating |
| CN110109321A (en) * | 2019-05-31 | 2019-08-09 | 高德（无锡）电子有限公司 | Limp outer lead is segmented the design method of the golden finger segmentation location segment egative film film |
| WO2023178851A1 (en) * | 2022-03-25 | 2023-09-28 | 生益电子股份有限公司 | Preparation method for pcb, and pcb |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102014582B (en) | 2012-05-09 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102014577B (en) | Process for manufacturing local gold-plated board | |
| CN107041077A (en) | A kind of circuit board producing method of turmeric and the golden compound base amount method of electricity | |
| CN102638945B (en) | Method for producing goldfinger via twice electroplating | |
| CN101835346B (en) | Nickel-gold electroplating process of PCB | |
| CN102821553B (en) | Method for manufacturing key position partial electro-gold-plated PCB (printed circuit board) | |
| CN102014582B (en) | Process for manufacturing whole gold-plated board | |
| CN205028884U (en) | Electronic packing piece and package substrate | |
| CN103257746A (en) | Manufacturing method of OGS touch screen | |
| CN104717826A (en) | Method for manufacturing gold-plated circuit board and gold-plated circuit board | |
| CN103025137A (en) | Electronic component module and manufacture method thereof | |
| CN104427738A (en) | Printed circuit board and manufacturing method thereof | |
| CN102026491B (en) | Manufacturing process of whole gold-plated panel | |
| CN102014580B (en) | Manufacturing technology of whole-plate gold-plated plate | |
| TWI609612B (en) | Stencil printing method for manufacturing printed circuit board | |
| CN110678004A (en) | Manufacturing method of PCB for charging pile | |
| CN102014579B (en) | Gold-plating method of long and short golden fingers | |
| CN102076175A (en) | Full gold-plated board manufacturing technology | |
| CN104703401A (en) | Circuit board electroplating method | |
| CN201234401Y (en) | Nickel partial electroplating printed circuit board | |
| CN102523694A (en) | Method for avoiding substrate exposure during pattern transfer of step circuit boards | |
| CN102156602A (en) | Process for producing conducting circuit of capacitive touch screen | |
| CN103889159A (en) | Landfill type conductive line preparation process | |
| CN102045961B (en) | Method for plating gold on equilong connecting fingers | |
| CN211063866U (en) | Circuit board with circuit made by etching aluminum foil | |
| CN104919908A (en) | Method for forming two-sided printed circuit board formed by printing circuit pattern and communication line inside through-hole |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee |
Owner name: SHENNAN CIRCUIT CO., LTD. Free format text: FORMER NAME: SHENZHEN SHENNAN CIRCUITS CO., LTD. |
|
| CP01 | Change in the name or title of a patent holder |
Address after: 518053 Nanshan District, Guangdong, overseas Chinese town, No. East Road, No. 99 Patentee after: SHENZHEN SHENNAN CIRCUIT CO., LTD. Address before: 518053 Nanshan District, Guangdong, overseas Chinese town, No. East Road, No. 99 Patentee before: Shenzhen Shennan Circuits Co., Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120509 Termination date: 20151124 |
|
| EXPY | Termination of patent right or utility model |