CN209994627U

CN209994627U - Novel multilayer does not have FPC board of gluing

Info

Publication number: CN209994627U
Application number: CN201920615142.7U
Authority: CN
Inventors: 廖斌; 唐杰; 罗军; 庞盼; 陈琳
Original assignee: Shenzhen Nanke Supermembrane Material Technology Co Ltd
Current assignee: Shenzhen Nanke Supermembrane Material Technology Co Ltd
Priority date: 2019-04-29
Filing date: 2019-04-29
Publication date: 2020-01-24
Anticipated expiration: 2029-04-29

Abstract

The utility model provides a novel multilayer does not have FPC board of gluing belongs to a flexible printed circuit board, and it includes the polyimide basement, and the equal ion implantation of both sides surface of polyimide basement is formed with the pinning layer to outwards cover in proper order and form first metal transition layer, first metal level, PI resin transition layer, PI resin layer, second metal transition layer and second metal level; the problems that the existing FPC circuit board has high manufacturing cost and long period, and the thickness of a finished product cannot meet the use requirement of an integrated circuit with higher precision are solved.

Description

Novel multilayer does not have FPC board of gluing

Technical Field

The utility model relates to a flexible line way board especially relates to a novel multilayer does not have FPC board of gluing.

Background

With the continuous development of electronic technology, especially the wide and deep application of large-scale and super-large-scale integrated circuits, the multilayer printed circuit is rapidly developing to the direction of high density, high precision and high numeralization to generate the technologies of micro-fine lines, small aperture penetration, blind hole buried hole, high board thickness aperture ratio and the like so as to meet the market demand.

At present, a common FPC board is usually subjected to cutting, drilling, electroplating, and the like to form a circuit board using polyimide as a base material.

However, the existing FPC boards have high cost and long cycle, and the thickness of the finished product cannot meet the requirement of using an integrated circuit with higher precision, so that improvement is needed.

Disclosure of Invention

Therefore, the utility model aims at providing a novel no gluey FPC board of multilayer reduces FPC plate thickness under reduction in production cost's the prerequisite by a wide margin.

The above technical purpose of the present invention can be achieved by the following technical solutions:

the utility model provides a novel no glue FPC board of multilayer, includes the polyimide substrate, the equal ion implantation in both sides surface of polyimide substrate is formed with the pinning layer to outwards cover in proper order and form first metal transition layer, first metal level, PI resin transition layer, PI resin layer, second metal transition layer and second metal level.

Preferably, the first metal transition layer and the second metal transition layer each comprise a release layer and a transition Cu layer.

Preferably, the release layer is formed by depositing the elements Ti or Ni by magnetic filtration.

Preferably, the thickness of the release layer is 0-10 nm.

Preferably, the thickness of the transition Cu layer is 10-50 nm.

Preferably, the first metal layer and the second metal layer are both metal Cu layers.

Preferably, the target material used for forming the pinning layer by ion implantation is Ti or Ni.

Preferably, the ion implantation voltage of the pinning layer is 4-12 kv, the beam intensity is 1-10 mA, and the implantation dose is 1 x 10¹⁵～1×10¹⁷/cm²The implantation depth is 70-120 nm.

Preferably, the first metal layer and the second metal layer are formed on the upper layer structure in an electroplating mode.

Preferably, the PI resin transition layer and the PI resin layer are both formed by coating on the upper layer structure.

The utility model provides a pair of novel multilayer does not have gluey FPC board has following advantage:

1. the whole thickness of the utility model is less than 8 μm;

2. greatly reducing the production cost.

Drawings

Fig. 1 is a schematic structural view of the present invention;

fig. 2 is a production process schematic diagram of the utility model.

The reference numerals in the figures are explained below:

1. a polyimide substrate; 2. a pinning layer; 3. a first metal transition layer; 301. a release layer; 302. A transition Cu layer; 4. a first metal layer; 5. a PI resin layer; 6. a PI resin transition layer; 7. a second metal transition layer; 8. a second metal layer.

Detailed Description

The technical solution of the present invention will be described clearly and completely with reference to the accompanying drawings, and obviously, the described embodiments are some, but not all embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

A novel multilayer non-adhesive FPC board is shown in figure 1 and comprises a polyimide substrate 1, wherein pinning layers 2 are formed on the surfaces of the two sides of the polyimide substrate through ion implantation, and a first metal transition layer 3, a first metal layer 4, a PI resin transition layer 6, a PI resin layer 5, a second metal transition layer 7 and a second metal layer 8 are formed by sequentially covering the surfaces outwards.

Preferably, the first metal transition layer 3 and the second metal transition layer 7 both include a release layer 301 and a transition Cu layer 302, and the bonding force between the metal transition layer and the previous layer structure is improved by the bonding of the release layer 301 and the transition Cu layer 302.

Preferably, the release layer 301 is formed by depositing the elements Ti or Ni by magnetic filtration.

Preferably, the thickness of the release layer 301 is 0 to 10 nm.

Preferably, the thickness of the transition Cu layer 302 is 10-50 nm.

Preferably, the first metal layer 4 and the second metal layer 8 are both metal Cu layers.

Preferably, the target material used for forming the pinning layer 2 by ion implantation is Ti or Ni.

Preferably, the ion implantation voltage of the pinning layer 2 is 4-12 kv, the beam intensity is 1-10 mA, the implantation dose is 1 x 1015-1 x 1017/cm2, and the implantation depth is 70-120 nm.

Preferably, the first metal layer 4 and the second metal layer 8 are formed on the upper layer structure by electroplating.

Preferably, the PI resin transition layer 6 and the PI resin layer 5 are both coated and formed on the previous layer structure.

As shown in fig. 1 and fig. 2, the principle of the production process of the present invention is as follows.

S10, performing ion implantation treatment on the surface of the polyimide substrate 1 by a metal vacuum steam particle beam technology to form a pinning layer 2;

s20, depositing a release layer 301 on the pinning layer 2 through a magnetic filtration plasma deposition coating technology;

s30, depositing a transition Cu layer 302 again on the release layer 301;

s40, forming a first metal layer 4 on the first metal transition layer 3 (the release layer 301 and the transition Cu layer 302) by electroplating;

s50, coating a viscous PI resin transition layer 6 on the first metal layer 4;

s60, after the PI resin transition layer 6 is dried, coating a PI resin layer 5 with high dimensional stability;

s70, depositing to form a second metal transition layer 7;

and S80, electroplating to form a second metal layer 8.

Wherein,

in the S10 process, the ion implantation voltage adopted by the pinning layer 2 is 4-12 kv, the beam intensity is 1-10 mA, the implantation dose is 1 x 1015-1 x 1017/cm2, and the implantation depth is 70-120 nm.

In the process of S20, the element of the release layer 301 is Ti or Ni, and the thickness is 0-10 nm.

In the S30 process, the thickness of the transition Cu layer 302 is 10-50 nm.

In the S40 process, the first metal layer 4 is a metal Cu layer prepared by an electroplating method, the electrolyte is CuSO4 and H2SO4, and the voltage parameter is 10-100V.

It should be understood that the above examples are only for clarity of illustration and are not intended to limit the embodiments. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. And obvious variations or modifications can be made without departing from the scope of the invention.

Claims

1. The utility model provides a novel no glue FPC board of multilayer, includes polyimide substrate (1), its characterized in that, the equal ion implantation in both sides surface of polyimide substrate is formed with pinning layer (2) to outwards cover in proper order and form first metal transition layer (3), first metal level (4), PI resin transition layer (6), PI resin layer (5), second metal transition layer (7) and second metal level (8).

2. A novel multilayer non-adhesive FPC board as claimed in claim 1, characterized in that the first metal transition layer (3) and the second metal transition layer (7) each comprise a release layer (301) and a transition Cu layer (302).

3. A novel multilayer adhesive-free FPC board as claimed in claim 2, characterized in that the release layer (301) is formed by depositing the element Ti or Ni by magnetic filtration.

4. The novel multilayer non-adhesive FPC board of claim 2, wherein the thickness of said release layer (301) is 0-10 nm.

5. The novel multilayer non-adhesive FPC board of claim 2, characterized in that the thickness of the transition Cu layer (302) is 10-50 nm.

6. A novel multi-layer non-adhesive FPC board according to any of claims 1-5 characterized in that said first metal layer (4) and second metal layer (8) are both metallic Cu layers.

7. The novel multilayer adhesive-free FPC board according to any one of claims 1 to 5, wherein the target material used for forming the pinning layer (2) by ion implantation is Ti or Ni.

8. The novel multilayer non-adhesive FPC board according to any one of claims 1 to 5, wherein the ion implantation voltage of the pinning layer (2) is 4-12 kv, the beam intensity is 1-10 mA, the implantation dose is 1 x 1015-1 x 1017/cm2, and the implantation depth is 70-120 nm.

9. A novel multi-layer non-adhesive FPC board according to any of claims 1-5 characterized in that said first metal layer (4) and said second metal layer (8) are formed by electroplating on the upper layer structure.

10. A novel multilayer non-adhesive FPC board according to any one of claims 1-5, characterized in that said PI resin transition layer (6) and PI resin layer (5) are coated on the above layer structure.