CN107877108B - A kind of heat dissipation metal mould group and preparation method thereof - Google Patents
A kind of heat dissipation metal mould group and preparation method thereof Download PDFInfo
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- CN107877108B CN107877108B CN201711267216.4A CN201711267216A CN107877108B CN 107877108 B CN107877108 B CN 107877108B CN 201711267216 A CN201711267216 A CN 201711267216A CN 107877108 B CN107877108 B CN 107877108B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P15/00—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass
- B23P15/26—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass heat exchangers or the like
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/02—Local etching
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
- C23F1/16—Acidic compositions
- C23F1/18—Acidic compositions for etching copper or alloys thereof
Abstract
The present invention provides a kind of heat dissipation metal mould groups and preparation method thereof.This method is that heat dissipation metal mould group is prepared using etching method comprising following steps: carrying out pre-treatment sandblasting to VC copper sheet；Multiple press mold processing is carried out to the VC copper sheet Jing Guo pre-treatment；Pad pasting processing is carried out to the film；The two panels film is bonded into the hinge-type film as needed；VC copper sheet after press mold is subjected to hinge-type contraposition；The fixed contraposition of gummed paper is carried out according to the line pattern target of hinge-type contraposition exposure；Multiple exposure and multidevelopment are carried out to the film, wherein the defect point and impure point of single exposure before the figure of rear single exposure covers；VC copper sheet after development is etched；It carries out moving back film process to through overetched VC copper sheet；Sandblasting post-processing is carried out to the VC copper sheet after film is moved back, obtains heat dissipation metal mould group.The half-etching face for the heat radiation module that can make to be prepared using method of the invention is smooth, and product structure is ultra-thin, stablizes.
Description
Technical field
The present invention relates to a kind of heat dissipation metal mould groups and preparation method thereof, belong to electronic component preparation technical field.
Background technique
The products such as laptop, plate are all made of electronics plastic cement fan currently on the market, so that electronic component works
When generate heat removal, to guarantee that element manipulation is normal.But electronics plastic cement fan has the disadvantage in that volume is big, noise
Greatly, it is unfavorable for electronic product to develop toward frivolous, accurate direction.
Electronics plastic cement fan is traditional fan, volume itself is with regard to bigger, its working principle is that blade is driven by motor,
It drives air circulation to radiate, necessarily has noise, and be easy precipitating dust, it is difficult to clear up, or even generate failure.
Summary of the invention
In order to solve the above technical problems, the purpose of the present invention is to provide a kind of heat dissipation metal mould group and preparation method thereof,
Heat dissipation metal mould group is prepared by using etching method, when can be effectively reduced the volume of heat dissipation metal mould group, and reducing work
Noise.
It in order to achieve the above objectives, is using etching method the present invention provides a kind of preparation method of heat dissipation metal mould group
To prepare heat dissipation metal mould group comprising following steps:
(1) pre-treatment sandblasting pre-treatment: is carried out to VC copper sheet；
(2) multiple press mold processing press mold: is carried out to the VC copper sheet Jing Guo pre-treatment；
(3) pad pasting processing film pad pasting: is carried out to the film；
(4) film makes: the two panels film being bonded into the hinge-type film as needed；
(5) it aligns: the VC copper sheet after press mold is subjected to hinge-type contraposition；According to the line pattern target of hinge-type contraposition exposure
The fixed contraposition of gummed paper is carried out, i.e., the VC copper sheet after press mold is inserted into the hinge-type film, the figure on the film is made to be located at VC copper sheet
Then dry film region is fixed the film and VC copper sheet；The fixed contraposition of gummed paper is carried out according to previous line pattern target；
(6) it exposes, develop: multiple exposure and multidevelopment are carried out to the film, wherein before the figure covering of rear single exposure
The defect point and impure point of single exposure；
(7) it etches: the VC copper sheet after development is etched；
(8) it moves back film: carrying out moving back film process to through overetched VC copper sheet；
(9) it post-processes: carrying out sandblasting post-processing to the VC copper sheet after film is moved back, obtain the heat dissipation metal mould group.
In the above preparation method, it is preferable that in step (2), the press mold is wet process press mold；It is highly preferred that described
The temperature of press mold processing is 110 ± 10 DEG C, pressure 3-5kg/cm2, speed 30-35Hz.
In the above preparation method, it is preferable that in step (3), pad pasting processing is carried out to the film using film laminator, it is described
The speed of film laminator is 30-35Hz, pressure 3-5kg/cm2；It is highly preferred that before pasting, using film water to the film
Medicine face is cleaned.
In the above preparation method, it is preferable that the step (4) includes:
It draws film: taking the two panels film, be denoted as L1 and L2, the film of non-direction hole one end is scratched and torn by the white line on the film
It removes；
Patch double-sided adhesive: it takes a piece of in the film L1 and L2, double-sided adhesive is sticked into the one end for having removed protective film, does not cover butterfly
Butterfly knot (is preferably overlapped bowknot)；
Copper-surfaced item: the copper bar cut is pasted onto after intermediate double-sided adhesive region pastes, on copper bar and by bowknot
Stick double-sided adhesive, when sticking two-faced adhesive tape does not cover bowknot；
Fitting: the film L1 and L2 are bonded together, the black bowknot of non-direction hole one end and non-direction hole when bonding
The white bowknot of one end is completely coincident together；
Punch rubberizing: in one end that the non-copper bar of the film is fixed, by the rubberizing home position hole Da Liangge, as rubberizing mouth, patch
The hinge-type film is made in adhesive tape.
In the above preparation method, it is preferable that the step (5) includes: that the VC copper sheet insertion hinge-type after press mold is luxuriant and rich with fragrance
Woods, top to copper bar position, while be completely coincident the butterfly target of the two panels film by adjusting the two panels film and making the figure of the film
Positioned at the dry film region of VC copper sheet, after the overlapping of butterfly target, the hole PIN of the fixed other end, when contraposition, every 3PNL (panel) was carried out
Primary cleaning.
The heat dissipation metal mould group flatness prepared in the prior art is poor, and the application preparation heat dissipation metal mould group than
The heat dissipation metal mould group prepared in the prior art is high.In step (6), half-etching technique, i.e. basis preferably are used to VC copper sheet
Pattern need copper sheet to etch the different region of height (entire VC copper sheet will form the different region of height as needed, but
It is that there can be no uneven situations in the same area), this is very high for the effect requirements of exposure development, i.e., aobvious in exposure
Movie queen, figure cannot have impure point outside, and the effect that otherwise will result in etching is deteriorated, and the planar portions for showing as etching area separate
The case where showing uneven, the poor flatness at the copper sheet back side, even having etching and punching etc under serious conditions appearance.And it causes
There is the subtle fragment etc. on dust impurities or the film in the reason of impure point mainly air in figure after development exposure,
If the other dust free room effect of laboratory level can be reached, the dust impurities in air can only be also avoided, and as manufacturing enterprise, it is real
Now this point is very uneconomic, and still more there are also other impure points sources.Therefore, to solve this problem, of the invention
Multiple exposure and multidevelopment are carried out to the film in preparation method, wherein single exposure before the figure of rear single exposure covers
Defect point and impure point, likewise, the defect point of rear single exposure and impure point can also be covered by the figure of preceding single exposure
Lid, it is different according to the actual situation, it can be using exposure and imaging more than twice.Specific embodiment according to the present invention, it is excellent
Selection of land, in step (6), to the film carry out multiple exposure and multidevelopment (again exposure, in development treatment, Yao Chongfu
Step 3-6), wherein the dimension of picture of second of exposure is less than the dimension of picture (reducing contraposition deviation) of exposure for the first time, so that
The defect point and impure point of the figure covering exposure for the first time of second exposure, such as: the dimension of picture of exposure and for the first time
Secondary difference, it is assumed that line width is designed as 1mm on the film of some route in first time figure, then the line width of second of route
Can be 0.95mm (depending on concrete condition is assumed office), in the case where second of contraposition standard operation, even if can guarantee contraposition effect
There is the error of very little, it also can be within the line width of first time development.It is exposed for the first time in this way, the figure of second of exposure covers
Defect point or impure point, the figure of exposure covers the defect point or impure point of second of exposure for the first time in turn, twice
Development exposes, and defect point and impure point are almost complete absence of product reaches 99.9% or more in the yield of this link.
In the above preparation method, it is preferable that in step (6), the exposure energy is grading according to exposure guide rule 8 ± 1
Row control, using 21 grades of exposure guide rules；It is highly preferred that the exposure is carried out using astigmatism machine or parallel exposing machine, more preferably 5kW
Astigmatism machine or 5kW parallel exposing machine.
In the above preparation method, it is preferable that in step (6), the composition for the development liquid medicine that the development uses includes:
Soda ash (Na2CO3) 0.8-1.2wt% and water surplus；The developing powder of development is 1400mm/min, and liquid medicine temperature is 30 ± 2 DEG C；
The composition of development liquid medicine preferably includes soda ash 1wt% and water 99wt%.
In the above preparation method, it is preferable that in step (7), the etching is carried out by the way of half-etching, and half loses
The etching speed control at quarter is 0.05-0.5mm/min；Used etching solution can be conventional etching solution, it is highly preferred that institute
It states the etching solution that etching uses and contains NaClO 24.5-26.5 (potential difference), HCl 2.2-2.6N, surplus for water；And the erosion
The specific gravity for carving liquid is 1.288-1.292g/mL；It is highly preferred that the etch temperature control is 48-50 DEG C.
In the above preparation method, it is preferable that in step (8), the temperature for moving back film process is 50 ± 2 DEG C.
In the above preparation method, it is preferable that in step (9), after carrying out sandblasting post-processing, the VC copper sheet is placed
It is impregnated in oxidation resistance liquid, preferably using acid as oxidation resistance liquid.
Specific embodiment according to the present invention, it is preferable that above-mentioned preparation method can be carried out according to step in detail below
(as shown in Figure 1):
Sawing sheet: confirming material type, thickness, length and quantity as needed, cuts out in flakes, checks length, thickness and outer
Sight has zero defect.
Pre-treatment (sandblasting cleaning): the VC copper sheet after fragment is moved into sandblasting line using glue frame, equipment is opened, opens micro-
VC copper sheet is put into sandblasting line after temperature to be achieved in velocity modulation prescribed limit by erosion, carries out pre-treatment sandblasting.
Press mold: confirmed press mold temperature, pressure, speed in wet pressing critical field and pan feeding VC copper sheet non-oxidation, it is water stain,
Then foreign matter residue glue carries out press mold processing；Bubble-free, dry film fold, foreign matter problem on VC copper sheet after press mold；Press mold mode is selected
Wet process press mold.
Film pad pasting: the film after drawing first to light checks, check the confirmation film without scratch, incompleteness etc. it is bad；It connects
Film laminator speed, pressure are adjusted to regulation in the range of, finally clean film medicine face with film water, after film water is dry,
Medicine film carries out pad pasting up.
Film production:
It draws film: drawing film, dyestripping: taking the two panels film L1 and L2, with white line of the writing of indictments, appeals, etc. on the film by non-direction hole one end
Film is scratched and is removed；
Patch double-sided adhesive: appoint and take film L1/L2 that the film for having removed one end of protective film is sticked double-sided adhesive, bowknot can not
Covering；
Copper-surfaced item: the copper bar cut is pasted onto after intermediate double-sided adhesive region pastes, on copper bar and by bowknot
All need to stick double-sided adhesive, when sticking two-faced adhesive tape can not cover bowknot；
Fitting: the good film of L1/L2 surface treatment is bonded together, and the black bowknot of non-direction hole one end needs when bonding
Be completely coincident together with the white bowknot of non-direction hole one end, if be not overlapped need to adjust the face L1/L2 the film until be overlapped,
It needs to check that the item number of confirmation film lower end remarks, date should be positive after film fitting；
It punches rubberizing: in the fixed one end of the non-copper bar of the film, being sticked by the rubberizing home position hole Da Liangge as rubberizing mouth
Adhesive tape obtains the hinge-type film.
Contraposition: opening the film, and the VC copper sheet after press mold is inserted into the hinge-type film, is pushed up to copper bar position, while by adjusting
The upper and lower film be completely coincident the butterfly target of the upper and lower film and check the confirmation film figure need in the dry film region of VC copper sheet,
Needing after the overlapping of butterfly target, which tightly fixes by the adhesive tape in the film rubberizing region film and VC copper sheet, does not shift, and when contraposition is every
3PNL is once cleaned.
Exposure: being exposed using 5KW astigmatism machine or 5kw parallel exposing machine, and exposure energy is according to doing 8 ± 1 grades of exposure guide rule
It manages (21 grades of exposure guide rules), every 3-5 frame need to clean glass and wheat is drawn.
Development: can develop after the static 15min of product after exposure, tear the protective film on two sides off, by normal development speed,
Liquid medicine temperature concentration is developed, and is packed up plate after development, is checked, is repaired to the region that may cause etching and punching
It mends, it is dotted bad in this way, it the coating of film pen, if defective region is larger, can be used be etched after compressing using red adhesive tape gluing.
Etching: the product after development maintenance can be etched, the etching that etching parameter loses depth 0.05-0.35mm by half
Speed is controlled, and specific etching speed and number are adjusted by practical measured depth.
It moves back film: VC copper sheet being carried out to move back film, first confirms that and moves back film temperature, move back each nozzle of film section without blocking, each washing
Section sprays normally, need to wear protective gloves when receiving plate, handle with care, do not allow to stack placement, prevent VC copper sheet from weighing wounded, often fold
PP rubber mat need to be used to separate.
Post-processing: carrying out sandblasting to the VC copper sheet after film is moved back, and covers sandblasting Duan Houxu and puts VC copper sheet to having prepared antioxygen
It in the material box for changing liquid, impregnates, needs to carry out drying and processing by polish-brush line drying section after immersion, gloves need to be worn when receiving plate,
It handles with care, does not allow to stack placement, prevent VC copper sheet from weighing wounded, often folding need to use PP rubber mat to separate.
Visual examination: the product after sandblasting is checked.
Vacuum packaging: VC copper sheet is placed in vacuum bag and is put into 2 dry packets, then checks confirmation each parameter of air exhauster
In range, air-breathing stick is protruded into vacuum bag after inspection, presses vacuum suction switch, machine carries out air-breathing sealing, finally
By the unified storage of packaged VC copper sheet.
Traditional stamp craft precision requires to control under optimal cases in 0.1mm series, and uses etching of the invention
Method, can be by precision controlling in 0.01mm series, and the heat dissipation metal mould group later period deformation being prepared is small, appearance essence after sandblasting
Beauty.
It the present invention also provides a kind of heat dissipation metal mould group, is prepared by above-mentioned preparation method.
The half-etching face for the heat radiation module that can make to be prepared using method provided by the present invention is smooth, and product
Structure is ultra-thin, stablizes, the good heat dissipation effect that this process characteristic can make product final, because being fine copper, and again very flat
Whole and ultra-thin, thermally conductive naturally all right, because product design production just divides two panels up and down, the structure after welding is simple naturally
It is firm.In addition, the shape of product be it is controllable, flat shape of the invention can be adjusted according to the inner space of electronic product.
Detailed description of the invention
Fig. 1 is the detail flowchart of the preparation method of heat dissipation metal mould group of the invention.
Specific embodiment
In order to which technical characteristic of the invention, purpose and beneficial effect are more clearly understood, now to skill of the invention
Art scheme carries out described further below, but should not be understood as that limiting the scope of the invention.
Embodiment 1
The preparation method for present embodiments providing a kind of heat dissipation metal mould group is to prepare heat dissipation metal using etching method
Mould group comprising following steps:
(1) pre-treatment sandblasting pre-treatment: is carried out to VC copper sheet；
(2) press mold: carrying out press mold processing to the VC copper sheet Jing Guo pre-treatment, using wet process press mold, the temperature of press mold processing
It is 110 DEG C, pressure 4kg/cm2, speed 35Hz；
(3) film pad pasting: pad pasting processing is carried out to the film using film laminator, the speed of film laminator is 2000mm/min, pressure
Power is 4kg/cm2Before pasting, cleaned using medicine face of the film water to the film；
(4) film makes: drawing film: taking the two panels film, be denoted as L1 and L2, the white line on the film is by non-direction hole one end
Film is scratched and is removed；Patch double-sided adhesive: it takes a piece of in the film L1 and L2, double-sided adhesive is sticked into the one end for having removed protective film, no
Cover bowknot；Copper-surfaced item: the copper bar cut is pasted onto after intermediate double-sided adhesive region pastes, on copper bar and bowknot
Double-sided adhesive is sticked on side, and when sticking two-faced adhesive tape does not cover bowknot；Fitting: the film L1 and L2 are bonded together, and when bonding is non-
The black bowknot of direction hole one end and the white bowknot of non-direction hole one end are completely coincident together；Punch rubberizing: in phenanthrene
The fixed one end of the non-copper bar of woods, sticks adhesive tape as rubberizing mouth by the rubberizing home position hole Da Liangge, the hinge-type film is made；
(5) it aligns: the VC copper sheet after press mold being inserted into the hinge-type film, is pushed up to copper bar position, while by adjusting two panels phenanthrene
Woods is completely coincident the butterfly target of the two panels film and the figure of the film is made to be located at the dry film region of VC copper sheet, the overlapping of butterfly target
Tightly so that the fixation of the film and VC copper sheet is not shifted by the adhesive tape in film rubberizing region afterwards, when contraposition every 3PNL carry out it is primary clear
It is clean；(6) it exposes, develop: multiple exposure and multidevelopment are carried out to the film, wherein is primary before the figure covering of rear single exposure
The defect point and impure point of exposure；The soda ash aqueous solution that the development liquid medicine used that develops is 1wt% for concentration；The development speed of development
Degree is 1400mm/min, and liquid medicine temperature is 30 ± 2 DEG C；
(7) it etches: the VC copper sheet after development being etched, is carried out by the way of half-etching, the etching speed of half-etching
Degree control is 1000 ± 500mm/min；
(8) it moves back film: carrying out moving back film process to through overetched VC copper sheet, the temperature for moving back film process is 50 ± 2 DEG C；
(9) it post-processes: carrying out sandblasting post-processing to the VC copper sheet after film is moved back, be subsequently placed in oxidation resistance liquid and impregnated,
It impregnates and passes through drying after completing, obtain the heat dissipation metal mould group.
The design parameter of heat dissipation metal mould group are as follows: etching external form marginal dimension 170 × 205, plate thickness 0.4 are etched to 0.3；
The production technology etched using common single exposure, result are 169.98 × 205.03, and location of etch height is 0.31, but is sent out
Certain raw raised points, height 0.32；The product obtained using the technique etched again after redevelopment exposure of the present embodiment
It is 169.96 × 204.99, location of etch height is 0.306, no raised points, and etching face is smooth.
Embodiment 2
The preparation method for present embodiments providing a kind of heat dissipation metal mould group is to prepare heat dissipation metal using etching method
Mould group comprising following steps:
(1) pre-treatment sandblasting pre-treatment: is carried out to VC copper sheet；
(2) press mold: carrying out press mold processing to the VC copper sheet Jing Guo pre-treatment, using wet process press mold, the temperature of press mold processing
It is 110 ± 10 DEG C, pressure 3-5kg/cm2, speed 30-35Hz；
(3) film pad pasting: pad pasting processing is carried out to the film using film laminator, the speed of film laminator is 2000mm/min, pressure
Power is 3-5kg/cm2；Before pasting, cleaned using medicine face of the film water to the film；
(4) film makes: drawing film: taking the two panels film, be denoted as L1 and L2, the white line on the film is by non-direction hole one end
Film is scratched and is removed；Patch double-sided adhesive: it takes a piece of in the film L1 and L2, double-sided adhesive is sticked into the one end for having removed protective film, no
Cover bowknot；Copper-surfaced item: the copper bar cut is pasted onto after intermediate double-sided adhesive region pastes, on copper bar and bowknot
Double-sided adhesive is sticked on side, and when sticking two-faced adhesive tape does not cover bowknot；Fitting: the film L1 and L2 are bonded together, and when bonding is non-
The black bowknot of direction hole one end and the white bowknot of non-direction hole one end are completely coincident together；Punch rubberizing: in phenanthrene
The fixed one end of the non-copper bar of woods, sticks adhesive tape as rubberizing mouth by the rubberizing home position hole Da Liangge, the hinge-type film is made；
(5) it aligns: the VC copper sheet after press mold being inserted into the hinge-type film, is pushed up to copper bar position, while by adjusting two panels phenanthrene
Woods is completely coincident the butterfly target of the two panels film and the figure of the film is made to be located at the dry film region of VC copper sheet, the overlapping of butterfly target
Tightly so that the fixation of the film and VC copper sheet is not shifted by the adhesive tape in film rubberizing region afterwards, when contraposition every 3PNL carry out it is primary clear
It is clean；
(6) it exposes, develop: multiple exposure and multidevelopment are carried out to the film, wherein before the figure covering of rear single exposure
The defect point and impure point of single exposure；The development liquid medicine used develop for the soda ash aqueous solution of concentration 1wt%；The development of development
Speed is 1400mm/min, and liquid medicine temperature is 30 ± 2 DEG C；
(7) it etches: the VC copper sheet after development being etched, is carried out by the way of half-etching, the etching speed of half-etching
Degree control is 800-1500mm/min；
(8) it moves back film: carrying out moving back film process to through overetched VC copper sheet, the temperature for moving back film process is 50 ± 2 DEG C；
(9) it post-processes: carrying out sandblasting post-processing to the VC copper sheet after film is moved back, be subsequently placed in oxidation resistance liquid and impregnated,
It impregnates and passes through drying after completing, obtain heat dissipation metal mould group.
Test case:
1, flatness detection: heat dissipation metal mould group is laid on marble countertop, detects its warpage situation, product standard
It is required that warpage≤0.1mm.Heat dissipation metal mould group prepared by embodiment 1,2 is able to satisfy the requirement of product standard.
2, contour tolerance detects:
Contour tolerance detection is carried out to heat dissipation metal mould group using 2.5 dimension full-automatic optical image coordinate measuring instruments, is produced
Product standard requirements tolerance is no more than ± 0.1mm.Heat dissipation metal mould group prepared by embodiment 1,2 is able to satisfy wanting for product standard
It asks.
3, etch tolerance detects:
Using high metric to heat dissipation metal mould group be etched tolerance detection, product standard require tolerance be no more than ±
0.01mm.Heat dissipation metal mould group prepared by embodiment 1,2 is able to satisfy the requirement of product standard.
Before using method provided by the present invention, above-mentioned production is not achieved in the flatness of prepared heat dissipation metal mould group
The requirement of product standard, it may appear that there is an imperfect position of etching in inside, protrusion 0.02mm relatively or even more, has used of the invention
Repeatedly (twice) after the method for exposure, then the incomplete point of etching will not occur again in this position, because twice or more
Secondary exposure, it is impossible to same position occur twice same dust etc impurity (exposure room is dust free room, be equipped with dirt
Angstrom tester, almost without dust in air), with regard to smooth, which mostlys come from the present invention and is mentioned such etch effect
The method of the multiple exposure of confession.
Multiple exposure is accurate in order to ensure figure contraposition, and size is slightly less than the image of first time when exposure for the second time
, such as: a square group is etched, size is 30mm × 40mm, then image when exposing for second on film is exactly
29.98mm × 39.98mm, film are signed on egative film using optical plotter by software, and precision can reach very high standard, reach
The rank of one thousandth millimeter.
Claims (6)
1. a kind of preparation method of heat dissipation metal mould group is to prepare heat dissipation metal mould group using etching method comprising following
Step:
(1) pre-treatment sandblasting pre-treatment: is carried out to VC copper sheet；
(2) multiple press mold processing press mold: is carried out to the VC copper sheet Jing Guo pre-treatment；The press mold is wet process press mold；The press mold
The temperature of processing is 110 ± 10 DEG C, pressure 3-5kg/cm2, speed 30-35Hz；
(3) pad pasting processing film pad pasting: is carried out to the film；Pad pasting processing is carried out to the film using film laminator, the film laminator
Speed is 30-35Hz, pressure 3-5kg/cm2；
(4) film makes: the two panels film being bonded into the hinge-type film as needed；
It draws film: taking the two panels film, be denoted as L1 and L2, the film of non-direction hole one end is scratched and removed by the white line on the film；
Patch double-sided adhesive: it takes a piece of in the film L1 and L2, double-sided adhesive is sticked into the one end for having removed protective film；
Copper-surfaced item: the copper bar cut is pasted onto after intermediate double-sided adhesive region pastes, is pasted on copper bar and by bowknot
Upper double-sided adhesive, when sticking two-faced adhesive tape, do not cover bowknot；
Fitting: the film L1 and L2 are bonded together, the black bowknot of non-direction hole one end and non-direction hole one end when bonding
White bowknot be completely coincident together, the hinge-type film is made；
(5) it aligns: the VC copper sheet after press mold is subjected to hinge-type contraposition；It is carried out according to the line pattern target of hinge-type contraposition exposure
The fixed contraposition of gummed paper；VC copper sheet after press mold is inserted into the hinge-type film, top to copper bar position, while being made by adjusting the two panels film
The dry film region that the butterfly target of the two panels film is completely coincident and the figure of the film is made to be located at VC copper sheet, after the overlapping of butterfly target,
The hole PIN of the fixed other end, when contraposition, every 3PNL was once cleaned；
(6) it exposes, develop: multiple exposure and multidevelopment are carried out to the film, wherein is primary before the figure covering of rear single exposure
The defect point and impure point of exposure；Double exposure is carried out to the film and is developed twice, wherein the dimension of picture of second of exposure omits
The small dimension of picture in first time exposure, reduces contraposition deviation；The figure covering exposure for the first time of second of exposure simultaneously
Defect point and impure point；Again exposure, in development treatment, Yao Chongfu step (3)-(6)；The exposure energy is according to exposure
8 ± 1 grades of ruler are managed, and used exposure guide rule is 21 grades；The composition for the development liquid medicine that the development uses includes: pure
Alkali 0.8-1.2wt% and water surplus；Developing powder is 1400mm/min, and liquid medicine temperature is 30 ± 2 DEG C；
(7) it etches: the VC copper sheet after development is etched；The etching is carried out by the way of half-etching, the erosion of half-etching
Quarter speed control is 0.05-0.5mm/min；The etching solution that the etching uses contains NaClO 24.5-26.5N, HCl 2.2-
2.6N, surplus are water；And the specific gravity of the etching solution is 1.288-1.292g/mL；The etch temperature control is 48-50 DEG C；
(8) it moves back film: carrying out moving back film process to through overetched VC copper sheet；The temperature for moving back film process is 50 ± 2 DEG C；
(9) it post-processes: carrying out sandblasting post-processing to the VC copper sheet after film is moved back, after carrying out sandblasting post-processing, the VC copper sheet is put
It is placed in oxidation resistance liquid and is impregnated, using acid as oxidation resistance liquid, obtain the heat dissipation metal mould group.
2. preparation method according to claim 1, wherein in step (3), before pasting, using film water to phenanthrene
The medicine face of woods is cleaned.
3. preparation method according to claim 1, wherein in step (6), the exposure is using astigmatism machine or parallel exposure
Ray machine carries out.
4. preparation method according to claim 3, wherein the exposure uses 5kW astigmatism machine or 5kW parallel exposing machine.
5. preparation method according to claim 1, wherein in step (6), development liquid medicine composition be soda ash 1wt% and
Water 99wt%.
6. a kind of heat dissipation metal mould group is prepared by the described in any item preparation methods of claim 1-5.
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| CN111172540A (en) * | 2019-12-30 | 2020-05-19 | 东莞赛诺高德蚀刻科技有限公司 | Preparation method of stainless steel radiating fin integrated capillary module |
| CN111465273B (en) * | 2020-04-21 | 2022-08-30 | 昆山弗莱吉电子科技有限公司 | Production process of mobile phone heat dissipation plate |
| CN116121752B (en) * | 2022-12-26 | 2023-10-13 | 东莞赛诺高德蚀刻科技有限公司 | Metal radiating fin etching method with side wall protection and metal radiating fin |
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