CN204859777U - Circuit board exposure counterpoint device - Google Patents

Circuit board exposure counterpoint device Download PDF

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Publication number
CN204859777U
CN204859777U CN201520469846.XU CN201520469846U CN204859777U CN 204859777 U CN204859777 U CN 204859777U CN 201520469846 U CN201520469846 U CN 201520469846U CN 204859777 U CN204859777 U CN 204859777U
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CN
China
Prior art keywords
film
hole
positioning
connecting portion
circuit board
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Application number
CN201520469846.XU
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Chinese (zh)
Inventor
高军成
胡兵
郭立举
吴河雄
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
LEADER-TECH (HUANGSHI) Inc.
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Leader-Tech Electronic (shenzhen) Co Ltd
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Priority to CN201520469846.XU priority Critical patent/CN204859777U/en
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Abstract

The utility model relates to an exposure counterpoint device, include: the first film, including first functional areas and lie in the first counterpoint district of periphery, first counterpoint district including the first connecting portion that lie in one side and with the first counterpoint portion that first connecting portion are connected, be equipped with a positioning hole in the first counterpoint portion, the second film, including second functional areas and the second that lies in the periphery district of counterpointing, the second counterpoint the district including the second connecting portion that lie in one side and with the second counterpoint portion that the second connecting portion are connected, be equipped with the 2nd positioning hole in the second counterpoint portion, the second film and the setting of the range upon range of interval of the first film for the circuit board of exposure is treated to the holding, and the second connecting portion are just right with first connecting portion, and the 2nd positioning hole and a positioning hole are just right, first connecting portion and second connecting portion are connected to the connecting piece, the setting element, wear to locate a positioning hole on, one end and first film fixed connection, the other end can be worn to locate on the 2nd positioning hole. This exposure counterpoint device operating efficiency is higher relatively.

Description

Circuit board exposure alignment device
Technical field
The utility model relates to circuit board making technical field, particularly relates to a kind of circuit board exposure alignment device.
Background technology
When making flexible PCB, the mode of exposure imaging is usually adopted to form corresponding conducting wire or some parts is exposed.In exposure-processed, flexible PCB needs to carry out contraposition with the upper and lower film.The artificial naked eyes of main employing carry out contraposition at present, and operating efficiency is low, and human cost is high, and product yield is low.
Utility model content
Based on this, be necessary the circuit board exposure alignment device providing a kind of operating efficiency relatively high.
An exposure aligning device for circuit board, comprising:
First film, comprise the first functional areas and be positioned at the first contraposition district of described first periphery, functional areas, described first contraposition district comprises the first connecting portion being positioned at described first film side and the first contraposition part be connected with described first connecting portion, and described first contraposition part is provided with the first positioning through hole;
Second film, comprise the second functional areas and be positioned at the second contraposition district of described second periphery, functional areas, described second contraposition district comprises the second connecting portion being positioned at described second film side and the second contraposition part be connected with described second connecting portion, described second contraposition part is provided with the second positioning through hole, wherein, described second film and the described first stacked interval of the film are arranged, spacing distance between described second film and described first film and circuit board thickness to be exposed adaptation, described second connecting portion and described first connecting portion just right, described second positioning through hole and described first positioning through hole just right,
Connector, connects described first connecting portion and described second connecting portion; And
Keeper, be arranged on described first positioning through hole, one end is fixedly connected with described first film, and the other end can be arranged on described second positioning through hole.
When using exposure aligning device, first providing circuit board, this circuit board having the contraposition through hole corresponding with the first positioning through hole.Then from first film and second film side place (opening part) away from connector, circuit board group is loaded between first film and second film.Then the keeper be fixed in the first positioning through hole passes contraposition through hole and the second positioning through hole successively, namely completes contraposition work, can carry out next step operation (exposure).Relative to artificial naked eyes contraposition, adopt above-mentioned exposure aligning device to carry out contraposition, substantially increase operating efficiency, reduce human cost, the yield of product can better be controlled, the difference that can effectively avoid human factor to cause (as the difference between new employee and old employee, difference etc. between old employee and old employee).
Wherein in an embodiment, described connector is between described first connecting portion and described second connecting portion.
Wherein in an embodiment, described connector is the first glue line.
Wherein in an embodiment, described keeper comprises trunk portion and is located at the cap portion of described trunk portion one end;
Described trunk portion is arranged on described first positioning through hole, and described cap portion is positioned on the surface of described first film away from described second film, is provided with the second glue line between described cap portion and the surface of described first film away from described second film.
Wherein in an embodiment, described keeper is pin.
Wherein in an embodiment, described first film is identical with size with the shape of described second film, and described first film and described second film are just to setting.
Wherein in an embodiment, described first film is square, and comprises the first connected successively side, the second side, the 3rd side and the 4th side, wherein, described first connecting portion, in described first side, described second side and described 4th side is respectively equipped with described first positioning through hole.
Wherein in an embodiment, described second side is provided with 9 described first positioning through hole, 9 described first positioning through hole are arranged in straight line, 9 described first positioning through hole are divided into 3 groups, often organize 3 described first positioning through hole, wherein, the spacing between two adjacent groups is greater than the spacing in each group between adjacent two described first positioning through hole;
Described 4th side is provided with 9 described first positioning through hole, and each first positioning through hole be positioned on described 4th side is corresponding with one first positioning through hole be positioned on described second side.
Wherein in an embodiment, described first contraposition district in the form of a ring.
Accompanying drawing explanation
Fig. 1 is the decomposed figure of the exposure aligning device of the circuit board of an execution mode;
Fig. 2 is the profile of Fig. 1;
Fig. 3 is the structural representation of first film in Fig. 1;
Fig. 4 is the structural representation of second film in Fig. 1.
Embodiment
Be described further below in conjunction with the exposure aligning device of drawings and the specific embodiments to circuit board.
As shown in Figures 1 and 2, the exposure aligning device 10 of the circuit board of an execution mode comprises first film 100, second film 200, connector 300 and keeper 400.
As shown in Figures 1 and 3, first film 100 comprises the first functional areas 110 and is positioned at the first contraposition district 120 of the first periphery, functional areas 110.First contraposition district 120 comprises the first connecting portion 122 being positioned at the first film 100 side and the first contraposition part 124 be connected with the first connecting portion 122.First contraposition part 124 is provided with the first positioning through hole 125.
In the present embodiment, the first contraposition district 120 in the form of a ring (closing structure).Be appreciated that in other embodiments, the first contraposition district 120 also can be hatch frame.
Further, in the present embodiment, first film 100 is square, and comprises the first side 100a, the second side 100b, the 3rd side 100c and the 4th side 100d that are connected successively.Wherein, the first connecting portion 122 is positioned at the first side 100a, and the second side 100b and the 4th side 100d is respectively equipped with the first positioning through hole 125.
Further, in the present embodiment, the second side 100b is provided with 9 the first positioning through hole, 125,9 the first positioning through hole 125 and is arranged in straight line.9 the first positioning through hole 125 are divided into 3 groups, and often organize 3 the first positioning through hole 125, wherein, the spacing between two adjacent groups is greater than the spacing in each group between adjacent two the first positioning through hole 125.4th side 100d is provided with 9 the first positioning through hole 125, and each first positioning through hole 125 be positioned on the 4th side 100d is corresponding with one first positioning through hole 125 be positioned on the second side 100b.
As shown in Fig. 1 and Fig. 4, second film 200 comprises the second functional areas 210 and is positioned at the second contraposition district 220 of the second periphery, functional areas 210.Second contraposition district 220 comprises the second connecting portion 222 being positioned at the second film 200 side and the second contraposition part 224 be connected with the second connecting portion 222.Second contraposition part 224 is provided with the second positioning through hole 225.
Wherein, second film 200 and the first stacked interval of the film 100 are arranged, and spacing distance between second film 200 and first film 100 and circuit board thickness to be exposed adaptive.Second connecting portion 224 and the first connecting portion 124 just right, the second positioning through hole 125 and the first positioning through hole 225 just right.
Second film 200 is identical with size with the shape of first film 100, and second film 200 and first film 100 are just to setting.
As shown in Figures 1 and 2, connector 300 connects the first connecting portion 122 and the second connecting portion 222.The Main Function of connector 300 is to make first film 100 be connected with second film 200, and makes to have the spacing distance determined between first film 100 and second film 200.Because the first connecting portion 122 is positioned at the side of first film 100, second connecting portion 222 is positioned at the side of second film 200, first connecting portion 122 and the second connecting portion 222 just right, the structure that first film 100 and second film 200 present is: one side closed, other side openings.Thus be convenient to from opening part, circuit board group is loaded between first film 100 and second film 200.
In the present embodiment, connector 300 is between the first connecting portion 122 and the second connecting portion 222.Concrete, connector 300 is the first glue line.Be appreciated that, in other embodiments, connector also can be positioned at outside the side of first film 100 and second film 200, and one end of connector is connected with the surface of first film 100 away from second film 200, and the other end is connected with the surface of second film 200 away from first film 100.
Keeper 400 is arranged on the first positioning through hole 125, and one end is fixedly connected with first film 100, and the other end can be arranged on the second positioning through hole 225.
In the present embodiment, keeper 400 comprises trunk portion 410 and is located at the cap portion 420 of trunk portion 410 one end.Trunk portion 410 is arranged on the first positioning through hole 125, and cap portion 420 is positioned on the surface of first film 100 away from second film 200.The second glue line (not shown) is provided with between cap portion 420 and the surface of first film 100 away from second film 200.Concrete, in the present embodiment, keeper 400 is pin.The number of keeper 400 is identical with the number of the first positioning through hole 125.
When using exposure aligning device 10, first providing circuit board, this circuit board having the contraposition through hole corresponding with the first positioning through hole 125.Then from first film 100 and the second film 200 side place (opening part) away from connector 300, circuit board group is loaded between first film 100 and second film 200.Then the keeper 400 be fixed in the first positioning through hole 125 passes contraposition through hole and the second positioning through hole 225 successively, namely completes contraposition work, can carry out next step operation (exposure).Relative to artificial naked eyes contraposition, adopt above-mentioned exposure aligning device 10 to carry out contraposition, substantially increase operating efficiency, reduce human cost, the yield of product can better be controlled, the difference that can effectively avoid human factor to cause (as the difference between new employee and old employee, difference etc. between old employee and old employee).
Each technical characteristic of the above embodiment can combine arbitrarily, for making description succinct, the all possible combination of each technical characteristic in above-described embodiment is not all described, but, as long as the combination of these technical characteristics does not exist contradiction, be all considered to be the scope that this specification is recorded.
The above embodiment only have expressed several execution mode of the present utility model, and it describes comparatively concrete and detailed, but therefore can not be interpreted as the restriction to utility model patent scope.It should be pointed out that for the person of ordinary skill of the art, without departing from the concept of the premise utility, can also make some distortion and improvement, these all belong to protection range of the present utility model.Therefore, the protection range of the utility model patent should be as the criterion with claims.

Claims (9)

1. an exposure aligning device for circuit board, is characterized in that, comprising:
First film, comprise the first functional areas and be positioned at the first contraposition district of described first periphery, functional areas, described first contraposition district comprises the first connecting portion being positioned at described first film side and the first contraposition part be connected with described first connecting portion, and described first contraposition part is provided with the first positioning through hole;
Second film, comprise the second functional areas and be positioned at the second contraposition district of described second periphery, functional areas, described second contraposition district comprises the second connecting portion being positioned at described second film side and the second contraposition part be connected with described second connecting portion, described second contraposition part is provided with the second positioning through hole, wherein, described second film and the described first stacked interval of the film are arranged, spacing distance between described second film and described first film and circuit board thickness to be exposed adaptation, described second connecting portion and described first connecting portion just right, described second positioning through hole and described first positioning through hole just right,
Connector, connects described first connecting portion and described second connecting portion; And
Keeper, be arranged on described first positioning through hole, one end is fixedly connected with described first film, and the other end can be arranged on described second positioning through hole.
2. the exposure aligning device of circuit board according to claim 1, is characterized in that, described connector is between described first connecting portion and described second connecting portion.
3. the exposure aligning device of circuit board according to claim 2, is characterized in that, described connector is the first glue line.
4. the exposure aligning device of circuit board according to claim 1, is characterized in that, described keeper comprises trunk portion and is located at the cap portion of described trunk portion one end;
Described trunk portion is arranged on described first positioning through hole, and described cap portion is positioned on the surface of described first film away from described second film, is provided with the second glue line between described cap portion and the surface of described first film away from described second film.
5. the exposure aligning device of circuit board according to claim 4, is characterized in that, described keeper is pin.
6. the exposure aligning device of circuit board according to claim 1, is characterized in that, described first film is identical with size with the shape of described second film, and described first film and described second film are just to setting.
7. the exposure aligning device of circuit board according to claim 6, it is characterized in that, described first film is square, comprise the first connected successively side, the second side, the 3rd side and the 4th side, wherein, described first connecting portion, in described first side, described second side and described 4th side is respectively equipped with described first positioning through hole.
8. the exposure aligning device of circuit board according to claim 7, it is characterized in that, described second side is provided with 9 described first positioning through hole, 9 described first positioning through hole are arranged in straight line, 9 described first positioning through hole are divided into 3 groups, often organize 3 described first positioning through hole, wherein, the spacing between two adjacent groups is greater than the spacing in each group between adjacent two described first positioning through hole;
Described 4th side is provided with 9 described first positioning through hole, and each first positioning through hole be positioned on described 4th side is corresponding with one first positioning through hole be positioned on described second side.
9. the exposure aligning device of circuit board according to claim 1, is characterized in that, described first contraposition district in the form of a ring.
CN201520469846.XU 2015-07-02 2015-07-02 Circuit board exposure counterpoint device Active CN204859777U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201520469846.XU CN204859777U (en) 2015-07-02 2015-07-02 Circuit board exposure counterpoint device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201520469846.XU CN204859777U (en) 2015-07-02 2015-07-02 Circuit board exposure counterpoint device

Publications (1)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107877108A (en) * 2017-12-05 2018-04-06 扬州华盟电子有限公司 A kind of heat dissipation metal module and preparation method thereof

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107877108A (en) * 2017-12-05 2018-04-06 扬州华盟电子有限公司 A kind of heat dissipation metal module and preparation method thereof
CN107877108B (en) * 2017-12-05 2019-09-03 扬州华盟电子有限公司 A kind of heat dissipation metal mould group and preparation method thereof

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C56 Change in the name or address of the patentee
CP01 Change in the name or title of a patent holder

Address after: 518000, Guangdong, Baoan District, Shenzhen manhole street, Whampoa community, South Ring Road, Whampoa embellish and Industrial Park, A building, 1-4 floor, D building, 2-3 floor

Patentee after: Shangda electronic (Shenzhen) Limited by Share Ltd

Address before: 518000, Guangdong, Baoan District, Shenzhen manhole street, Whampoa community, South Ring Road, Whampoa embellish and Industrial Park, A building, 1-4 floor, D building, 2-3 floor

Patentee before: Leader-Tech Electronic (Shenzhen) Co., Ltd.

TR01 Transfer of patent right

Effective date of registration: 20220113

Address after: 435003 No. 91, Sike Avenue East, Jinshan street, Huangshi economic and Technological Development Zone, Huangshi City, Hubei Province

Patentee after: LEADER-TECH (HUANGSHI) Inc.

Address before: 518000 floors 1-4, 2-3, building a, Huangpu Runhe Industrial Park, South Ring Road, Huangpu Community, Shajing street, Bao'an District, Shenzhen City, Guangdong Province

Patentee before: LEADER-TECH ELECTRONICS (SHENZHEN) Inc.

TR01 Transfer of patent right