CN206884314U - A kind of multilayer copper-clad plate - Google Patents
A kind of multilayer copper-clad plate Download PDFInfo
- Publication number
- CN206884314U CN206884314U CN201720769887.XU CN201720769887U CN206884314U CN 206884314 U CN206884314 U CN 206884314U CN 201720769887 U CN201720769887 U CN 201720769887U CN 206884314 U CN206884314 U CN 206884314U
- Authority
- CN
- China
- Prior art keywords
- multilayer
- layer
- aluminium base
- indent
- copper foil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Laminated Bodies (AREA)
Abstract
The utility model discloses a kind of multilayer copper-clad plate, and it includes multilayer plate body, and the center on the surface of the multilayer plate body is provided with chip component, and the corner of multilayer plate body is symmetrical arranged four porose areas to be drilled, and three prebored holes are distributed with each porose area to be drilled；The multilayer plate body includes copper foil layer, insulating barrier and the aluminium base set gradually from top to bottom；The upper and lower surface of insulating barrier is Nian Jie with the aluminium base of the copper foil layer by heat conduction pressure-sensitive adhesive layer respectively；Be provided with the recess for accommodating the chip component on the copper foil layer, the copper foil layer correspond to recess position be provided with depression trough body structure indent, the bottom land of indent is the recess；The cell wall of the indent is V-structure；The bottom land bottom surface of the indent is the aluminium base, is connected between the chip component bottom surface and aluminium base by heat-conducting silicone grease；The upper surface of the indent is higher than the upper surface of the chip component.
Description
Technical field
It the utility model is related to a kind of copper-clad plate, more particularly to a kind of multilayer copper-clad plate.
Background technology
With the rapid development of electronic industry, the update speed of each electronic product is more and more faster, and to product
The requirement such as technical quality also more and more higher.Copper-clad plate is as the main components in a kind of electronic equipment, the specification of its product
Model is also more and more diversified, and all kinds of new materials, new technology are widely used in copper-clad plate process, this
So that traditional copper-clad plate is towards the scope of application is more wide, the more and more obvious direction of product individual difference is developed.
In multilayer copper-clad plate the performance of copper-clad plate is lifted by increasing the functional layers such as anti oxidation layer；But existing structure
In, for the radiator structure also existing defects of multilayer copper-clad plate, some modes for opening up through hole cause the intensity of copper-clad plate significantly
Reduce, the mode of some increase fin considerably increases small product size so that the scope of application of copper-clad plate is limited；Some cover copper
The heat of acp chip element on plate is more not easy to distribute, and can cause premature breakdown；The structure of existing acp chip element makes
Obtain chip and be raised in copper-clad plate surface, cause to easily cause wafer damage when shifting plate body and assembling remaining component；
In addition, with attention of the people for the quality of production, without mark production batch in existing copper-clad plate, cause to occur
It is not easy to trace during problem；Component in some copper-clad plates by plate body perforate assemble, when aperture is excessive, most
When component is assembled after the whole complete copper-clad plate of production, Tapping procedures can cause laminate body to ftracture.
Utility model content
Technical problem to be solved in the utility model is to be directed to above-mentioned deficiency of the prior art, and it is more to disclose one kind
Layer copper-clad plate, its good heat dissipation, is hardly damaged during wide-bore, while can also easily mark production batch so that final production
Quality is more reliable, is advantageous to popularize.
Technical scheme is used by the utility model solves its technical problem：A kind of multilayer copper-clad plate, includes multi-layer sheet
Body, the center on the surface of the multilayer plate body are provided with chip component, the corner of multilayer plate body be symmetrical arranged four it is to be drilled
Porose area, three prebored holes are distributed with each porose area to be drilled, there is gap between any two prebored hole, prebored hole with it is hole to be drilled
There is gap between the excircle in area；
The multilayer plate body includes copper foil layer, insulating barrier and the aluminium base set gradually from top to bottom；Above and below insulating barrier
Surface is Nian Jie with the aluminium base of the copper foil layer by heat conduction pressure-sensitive adhesive layer respectively；It is provided with the copper foil layer for accommodating institute
State the recess of chip component, the copper foil layer correspond to recess position be provided with depression trough body structure indent, the groove of indent
Bottom is the recess；The cell wall of the indent is V-structure；The bottom land bottom surface of the indent is the aluminium base, the chip
Connected between element bottom surface and aluminium base by heat-conducting silicone grease；The upper surface of the indent is higher than the upper table of the chip component
Face；
The lower surface of the aluminium base is arranged with radiating groove in honeycomb fashion, and the section for the groove that radiates is trapezoidal；The aluminium
Graphite film layer is equipped with the lower surface of substrate and the radiating groove；
The upper surface or lower surface of the multilayer plate body are provided with for the attached of the anti-welding code of spray printing close to the position at edge
Add bar.
As a kind of preferred embodiment of the present utility model：The anti-welding code is production batch code；It is described additional
The thickness of bar is less than 3mm, and the additional strip is removably bonded in the upper surface or lower surface of the multilayer plate body.
As a kind of preferred embodiment of the present utility model：The radiating groove is recessed by being shocked by electricity caused by electric shock
Groove；The thickness of the copper foil layer is 15~45 μm；The thickness of the heat conduction pressure-sensitive adhesive layer is 35~45 μm；The copper foil layer it is upper
Surface also sets up one layer of anti oxidation layer.
As a kind of preferred embodiment of the present utility model：Gap between adjacent two radiatings grooves for 0.2~
0.3mm；The thickness of the aluminium base is 0.8~3mm.
As a kind of preferred embodiment of the present utility model：The insulating barrier include the lamination of two layers prepreg overlapping and
Into the prepreg includes the enhancement layer of dual coating thermoset resin layer, and the enhancement layer and thermoset resin layer pass through
Baking is combined together；The enhancement layer is glass fabric, carbon fiber cloth, Chopped Strand Mat or non-woven fabrics.
As a kind of preferred embodiment of the present utility model：Overlapped and pressed with Teflon film between two layers of prepreg
System.
The utility model has advantages below compared with prior art：
A kind of multilayer copper-clad plate disclosed in the utility model, by the way that chip component insertion is arranged on into chip in recess
Setting height(from bottom) is relatively low；The utility model also by porose area to be drilled set prebored hole come most area's perforate hole to be drilled at last when,
The resistance being subject to is small, avoids the damage to plate body, prevents from ftractureing；The utility model is radiated by aluminium base, increase radiating effect
Fruit, while area of dissipation, graphite film layer increase radiating effect are increased by the radiating groove on aluminium base.
Specifically, multilayer plate body of the present utility model includes copper foil layer, insulating barrier and the aluminium base set gradually from top to bottom
Plate；Aluminium base good heat dissipation effect；The upper and lower surface of insulating barrier passes through heat conduction pressure-sensitive adhesive layer and the aluminium base of the copper foil layer respectively
Bonding；Heat conduction pressure-sensitive adhesive layer being capable of high-efficiency heat conduction, additionally it is possible to reliable bonding；It is provided with the copper foil layer for accommodating the core
The recess of piece element, the copper foil layer correspond to recess position be provided with depression trough body structure indent, the bottom land of indent is
The recess；After chip component installation inside indent, it is not easy to be damaged by external impact；The cell wall of the indent is V-type knot
Structure；V-structure more easy-offtaking in assembling；The cell wall of the indent is V-structure；The bottom land bottom surface of the indent is the aluminium
Substrate, connected between the chip component bottom surface and aluminium base by heat-conducting silicone grease；The upper surface of the indent is higher than the core
The upper surface of piece element；The smooth surface for being placed on aluminium base of chip component, passes through the connection of heat-conducting silicone grease, its conduction process
It is more direct so as to be in more preferable heat dissipation environment and work in chip component.
The upper surface or lower surface of multilayer plate body of the present utility model are provided with anti-welding for spray printing close to the position at edge
The additional strip of code；Anti-welding code is that production batch causes product to trace, and ensures quality.
Brief description of the drawings
Fig. 1 is a kind of partial schematic diagram of the cross-section structure of embodiment of the present utility model；
Fig. 2 is a kind of structural representation of the overlook direction of embodiment of the present utility model；
Fig. 3 is a kind of cross-sectional view of embodiment of insulating barrier of the present utility model.
Description of reference numerals：
1- multilayer plate bodys, 2- additional strips, 3- porose areas to be drilled, 4- prebored holes, 5- chip components, 6- indents, 7- heat conduction are pressure-sensitive
Glue-line, 8- connectors, 9- recesses, 10- aluminium bases, 11- radiating grooves, 12- graphite film layers, 13- thermoset resin layers, 14-
Copper foil layer, 15- enhancement layers, 16- insulating barriers, 17- reinforcers, 18- Teflon films, 19- prepregs.
Embodiment
The utility model is described in detail shown each embodiment below in conjunction with the accompanying drawings, but it should explanation,
These embodiments are not limitation of the utility model, and those of ordinary skill in the art are according to these embodiment institute works
Energy, method or equivalent transformation or replacement in structure, are belonged within the scope of protection of the utility model.
As shown in Figures 1 to 3, it illustrates specific embodiment of the utility model；As illustrated, disclosed in the utility model
A kind of multilayer copper-clad plate, comprising multilayer plate body, the center on the surface of the multilayer plate body is provided with chip component, multi-layer sheet
The corner of body is symmetrical arranged four porose areas to be drilled, is distributed with three prebored holes in each porose area to be drilled, any two prebored hole it
Between there is gap, there is gap between prebored hole and the excircle of porose area to be drilled；
The multilayer plate body includes copper foil layer, insulating barrier and the aluminium base set gradually from top to bottom；Above and below insulating barrier
Surface is Nian Jie with the aluminium base of the copper foil layer by heat conduction pressure-sensitive adhesive layer respectively；It is provided with the copper foil layer for accommodating institute
State the recess of chip component, the copper foil layer correspond to recess position be provided with depression trough body structure indent, the groove of indent
Bottom is the recess；The cell wall of the indent is V-structure；The bottom land bottom surface of the indent is the aluminium base, the chip
Connected between element bottom surface and aluminium base by heat-conducting silicone grease；The upper surface of the indent is higher than the upper table of the chip component
Face；
The lower surface of the aluminium base is arranged with radiating groove in honeycomb fashion, and the section for the groove that radiates is trapezoidal；The aluminium
Graphite film layer is equipped with the lower surface of substrate and the radiating groove；
The upper surface or lower surface of the multilayer plate body are provided with for the attached of the anti-welding code of spray printing close to the position at edge
Add bar.
Preferably, as shown in Figure 2：The anti-welding code is production batch code；The thickness of the additional strip is less than 3mm,
The additional strip is removably bonded in the upper surface or lower surface of the multilayer plate body.The dismountable structure of additional strip to add
Work polyvinyl chloride is convenient.
Preferably, as shown in Figure 1：The radiating groove is to pass through the groove that shocked by electricity caused by electric shock；The thickness of the copper foil layer
Spend for 15~45 μm；The thickness of the heat conduction pressure-sensitive adhesive layer is 35~45 μm；The upper surface of the copper foil layer also sets up one layer and resisted
Oxide layer.Anti oxidation layer enables to copper foil layer anti-oxidation.
Preferably, as shown in Figure 1：Gap between two adjacent radiating grooves is 0.2~0.3mm；The aluminium base
Thickness be 0.8~3mm.
Preferably, as shown in Figure 3：The insulating barrier includes two layers of prepreg overlapping lamination and formed, the prepreg
Include the enhancement layer of dual coating thermoset resin layer, the enhancement layer and thermoset resin layer are combined together through overbaking；
The enhancement layer is glass fabric, carbon fiber cloth, Chopped Strand Mat or non-woven fabrics.The structure of the present embodiment make it that the intensity of insulating barrier is big
Big increase, therefore add the intensity of whole copper-clad plate so that whole product is more durable, reliably.
Preferably, as shown in Figure 3：Overlapped and suppressed with Teflon film between two layers of prepreg.Teflon film is high-ductility
Property film, lifted toughness of products.
The a series of tool described in detail only for feasibility embodiment of the present utility model of those listed above
Body illustrates that they are simultaneously not used to limit the scope of protection of the utility model, all to be made without departing from the utility model skill spirit
Equivalent implementations or change should be included within the scope of protection of the utility model.
Moreover, it will be appreciated that although the present specification is described in terms of embodiments, not each embodiment is only wrapped
Containing an independent technical scheme, this narrating mode of specification is only that those skilled in the art should for clarity
Using specification as an entirety, the technical solutions in the various embodiments may also be suitably combined, forms those skilled in the art
It is appreciated that other embodiment.
Claims (6)
- A kind of 1. multilayer copper-clad plate, it is characterised in that：Comprising multilayer plate body, the center on the surface of the multilayer plate body is set There is chip component, the corner of multilayer plate body is symmetrical arranged four porose areas to be drilled, and three prebored holes are distributed with each porose area to be drilled, There is gap between any two prebored hole, there is gap between prebored hole and the excircle of porose area to be drilled；The multilayer plate body includes copper foil layer, insulating barrier and the aluminium base set gradually from top to bottom；The upper and lower surface of insulating barrier It is Nian Jie with the aluminium base of the copper foil layer by heat conduction pressure-sensitive adhesive layer respectively；It is provided with the copper foil layer for accommodating the core The recess of piece element, the copper foil layer correspond to recess position be provided with depression trough body structure indent, the bottom land of indent is The recess；The cell wall of the indent is V-structure；The bottom land bottom surface of the indent is the aluminium base, the chip component Connected between bottom surface and aluminium base by heat-conducting silicone grease；The upper surface of the indent is higher than the upper surface of the chip component；The lower surface of the aluminium base is arranged with radiating groove in honeycomb fashion, and the section for the groove that radiates is trapezoidal；The aluminium base Lower surface and it is described radiating groove in be equipped with graphite film layer；The upper surface or lower surface of the multilayer plate body are provided with the additional strip for the anti-welding code of spray printing close to the position at edge.
- A kind of 2. multilayer copper-clad plate as claimed in claim 1, it is characterised in that：The anti-welding code is production batch code； The thickness of the additional strip is less than 3mm, and the additional strip is removably bonded in the upper surface or lower surface of the multilayer plate body.
- A kind of 3. multilayer copper-clad plate as claimed in claim 1, it is characterised in that：The radiating groove is by caused by electric shock Shock by electricity groove；The thickness of the copper foil layer is 15~45 μm；The thickness of the heat conduction pressure-sensitive adhesive layer is 35~45 μm；The copper foil The upper surface of layer also sets up one layer of anti oxidation layer.
- A kind of 4. multilayer copper-clad plate as claimed in claim 1, it is characterised in that：Gap between two adjacent radiating grooves For 0.2~0.3mm；The thickness of the aluminium base is 0.8~3mm.
- A kind of 5. multilayer copper-clad plate as claimed in claim 1, it is characterised in that：The insulating barrier is folded including two layers of prepreg Close lamination to form, the prepreg includes the enhancement layer of dual coating thermoset resin layer, enhancement layer and the thermosetting tree Lipid layer is combined together through overbaking；The enhancement layer is glass fabric, carbon fiber cloth, Chopped Strand Mat or non-woven fabrics.
- A kind of 6. multilayer copper-clad plate as claimed in claim 5, it is characterised in that：Folded between two layers of prepreg with Teflon film Merge compacting.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720769887.XU CN206884314U (en) | 2017-06-29 | 2017-06-29 | A kind of multilayer copper-clad plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720769887.XU CN206884314U (en) | 2017-06-29 | 2017-06-29 | A kind of multilayer copper-clad plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206884314U true CN206884314U (en) | 2018-01-16 |
Family
ID=61297884
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720769887.XU Expired - Fee Related CN206884314U (en) | 2017-06-29 | 2017-06-29 | A kind of multilayer copper-clad plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206884314U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108649040A (en) * | 2018-03-12 | 2018-10-12 | 宁波舜宇光电信息有限公司 | A kind of chip attachment process and camera module of camera module |
-
2017
- 2017-06-29 CN CN201720769887.XU patent/CN206884314U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108649040A (en) * | 2018-03-12 | 2018-10-12 | 宁波舜宇光电信息有限公司 | A kind of chip attachment process and camera module of camera module |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN107408544B (en) | The system and method that can be transmitted with electric energy for combined hot | |
| US9942976B2 (en) | Preparation method of a boss-type metal-based sandwich rigid-flex circuit board | |
| JP2014503997A5 (en) | ||
| JP2014175425A5 (en) | ||
| CN109429441A (en) | Rigid Flex and preparation method thereof | |
| CN106455369A (en) | Systems and methods of manufacturing printed circuit boards using blind and internal micro vias to couple subassemblies | |
| CN103906344B (en) | Heat-conducting type double-sided PCB | |
| CN206884314U (en) | A kind of multilayer copper-clad plate | |
| CN205005345U (en) | Circuit board that epoxy and metal base combine | |
| CN202503862U (en) | Heat conduction aluminum film | |
| CN207589267U (en) | Bury metal derby PCB | |
| CN105916291B (en) | A kind of production method of high-density interconnected printed circuit board | |
| CN206542629U (en) | A kind of two-sided PCB | |
| CN201216042Y (en) | Second order hole overlapping construction constructed by reverse suspension type blind hole | |
| CN107645828A (en) | A kind of composite circuit board for the high heat conduction that insulate and preparation method thereof | |
| CN203282784U (en) | Universal high temperature release cover film of PCB circuit board and FPC circuit board | |
| CN203884069U (en) | Multifunctional flexible printed circuit (FPC) | |
| CN104703383B (en) | The method and printed circuit board (PCB) of processing printed circuit board | |
| CN216565724U (en) | PCB heat radiation structure embedded with high heat radiation metal block and PCB | |
| CN201976339U (en) | High-density laminated printed circuit board and explosion-proof structure thereof | |
| CN205946365U (en) | Battery protection PCB circuit board | |
| CN205364691U (en) | Good copper -clad plate of heat dissipation function | |
| CN105128454B (en) | A kind of double-side aluminum copper-clad plate of LED lamp | |
| CN204968230U (en) | Inclined to one side structure of lamination in advance in layer is prevented to circuit board | |
| JP2014515176A5 (en) |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180116 Termination date: 20180629 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |