CN103025062A - Circuit board wedge angle region forming method - Google Patents
Circuit board wedge angle region forming method Download PDFInfo
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- CN103025062A CN103025062A CN2012104921001A CN201210492100A CN103025062A CN 103025062 A CN103025062 A CN 103025062A CN 2012104921001 A CN2012104921001 A CN 2012104921001A CN 201210492100 A CN201210492100 A CN 201210492100A CN 103025062 A CN103025062 A CN 103025062A
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- wedge angle
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- wiring board
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Abstract
The invention discloses a circuit board wedge angle region forming method. The circuit board wedge angle region forming method comprises the following steps that: step 1, forming a through hole on the top end part of each circuit board wedge angle region to be processed before a CNC (computerized numerical control) is formed, or forming multiple through holes on the top end part of each circuit board wedge angle region to be processed, wherein the multiple through holes are arranged in a linear manner along the ray direction of the top point of the top end; step 2, overlaying and fixing multiple circuit boards to be processed on operation positions of CNC molding equipment; and step 3, when the through hole is arranged on the top end part of each circuit board wedge angle region to be processed, by virtue of adopting a milling cutter with same diameter with the through hole during the forming of CNC and utilizing the centre of the through hole as the lower cutter point of the milling cutter, when the multiple through holes are arranged on the top point of each circuit board wedge angle region to be processed, adopting the milling cutter with same diameter with the through hole which furthest approaches the top point of the top end, and taking the centre of the through hole which furthest approaches the top point of the top end as the lower cutter point of the milling cutter. The circuit board wedge angle region forming method provided by the invention is conductive to improving the moulding efficiency and quality of circuit boards, and the circuit board wedge angle region is prevented from being subjected to a base material convex phenomenon in a manufacturing process.
Description
Technical field
The present invention relates to the printed substrate field shaping technique, be specifically related to a kind of wiring board wedge angle district forming method.
Background technology
The CNC moulding is the critical processes during wiring board is produced, and wiring board production often is obstructed because of the low manufacturing schedule that causes of CNC former mobility, and the restriction production capacity promotes, and affects product and hands over the phase.For enhancing productivity, PCB manufacturing enterprise adopts the mode that increases wiring board stack quantity to be processed when moulding, promotes shaping efficiency.But the increase of wiring board stack quantity will make the integral thickness of wiring board to be processed increase, cause needing to increase synchronously for the edge of milling cutter length of processing and forming, in production practices, improve wiring board stack quantity by increasing edge of milling cutter length, be only applicable to the wiring board with the major diameter milling cutter, also inapplicable for the wiring board with small diameter milling knife, this is because the edge length increase will make the corresponding increase of breaking probability of small diameter milling knife, not only can't raise the efficiency, also increase the breaking risk.When especially the wedge angle district on the wiring board being carried out processing and forming, normal use diameter is 0.6 to 0.8mm small dimension milling cutter, this will more be not suitable for improving by lengthening edge length the stack quantity of the wiring board of processing, and the shaping efficiency that has therefore greatly limited the wiring board that is provided with the wedge angle district promotes.Certainly, for lifting is provided with the shaping efficiency of the wiring board in wedge angle district, once attempted in the industry small diameter milling knife is changed to the major diameter milling cutter, to promote processing and forming lamination quantity.But this mode can't guarantee the moulding quality, and because of wedge angle district long and narrow space structural limitations, adopts the major diameter milling cutter to add anomalies such as being prone to the base material projection man-hour, affects wiring board moulding quality.
Summary of the invention
The objective of the invention is to overcome weak point of the prior art, a kind of wiring board wedge angle district forming method that is conducive to promote wiring board shaping efficiency and quality is provided, utilize the method that wiring board wedge angle district is carried out moulding, can stop the phenomenon of wiring board wedge angle district base material projection in the course of processing.
The objective of the invention is to be achieved through the following technical solutions:
A kind of wiring board wedge angle district forming method, the method comprises the steps:
Step 1, before the CNC moulding, the point in every wiring board wedge angle to be processed district arranges a through hole, or at the point in every wiring board wedge angle to be processed district a plurality of through holes is set, and a plurality of through hole is linear array along the directions of rays on point summit;
Step 2 is got multi-disc wiring board phase to be processed poststack and is fixed on the working position of CNC former;
Step 3, when the point in every wiring board wedge angle to be processed district arranges a through hole, when the CNC moulding, adopt the milling cutter identical with through-hole diameter, and get the through hole center of circle as the lower cutter point of milling cutter, when the point in every wiring board wedge angle to be processed district arranges a plurality of through hole, adopt with near the identical milling cutter of the through-hole diameter on point summit, and get near the center of circle of the through hole on the point summit lower cutter point as milling cutter.
The present invention is before the CNC moulding, point in every wiring board wedge angle to be processed district arranges through hole, therefore need not when the CNC moulding point moulding to the wedge angle district, but by being set, through hole directly substitutes milling cutter processing via regions, do not produce the base material projection, be conducive to improve the moulding quality, simultaneously with the lower cutter point of through hole milling cutter when the wedge angle district is carried out the CNC moulding, contact the resistance of generation when reducing cutter under the milling cutter with wiring board, raising solid capacity and heat dispersion, reduction breaking risk.In addition, when the CNC moulding, use forming method of the present invention first to after the district's moulding of wiring board wedge angle, replaceable major diameter milling cutter carries out moulding to the zone beyond the wedge angle district again, and make the major diameter milling cutter not be subjected to wedge angle district point long and narrow space structural limitations, be convenient to the major diameter milling cutter point is carried out moulding with exterior domain, can increase considerably one-time formed lamination quantity, be conducive to promote shaping efficiency.Simultaneously, moulding wedge angle district before the wedge angle district is carried out the CNC moulding with exterior domain, then wedge angle district board substrate is removed when moulding, under the major diameter milling cutter during cutter point of a knife not pushed by base material, can effectively prevent the generation of base material projection phenomenon in the forming process.
During implementation, above-mentioned through hole can arrange in drilling operating, only increases the processing formula to through hole in the drilling program of PCB drilling operating, need not extra installation location, can be simple, efficient, save manpower finish the through hole setting.
Preferably, described through hole or described near the diameter of the through hole on point summit more than or equal to 0.6mm.More be preferably 0.6mm.This is because the milling cutter diameter minimum of using in the present industry is 0.6mm, when the diameter of through hole during more than or equal to 0.6mm, the base material of cutter point under the milling cutter could be removed, contact the resistance of generation when reducing cutter under the milling cutter with wiring board, raising solid capacity and heat dispersion, reduction breaking risk.Certainly, when need use diameter than the little milling cutter of 0.6mm, also the more through hole of minor diameter can corresponding be set, for example 0.3,0.4mm.Simultaneously, the through-hole diameter setting also need be considered and the point in wedge angle district fully can be dragged for sky, for example, when the point width in wedge angle district is 0.6mm, the through hole that diameter is set is 0.6mm can fully drag for sky with point, and when the point width in wedge angle district is 0.8mm, then can consider to arrange the through hole that diameter is 0.8mm in order to point is fully dragged for sky.
When the wedge angle district at every wiring board to be processed arranged a plurality of through hole, a plurality of through holes intersected, and gradually large along the directions of rays on summit, wedge angle district.More specifically, described a plurality of through holes are preferably three through holes, and the diameter of three through holes is followed successively by 0.6mm, 0.7mm, 0.8mm.
Preferably, when the wedge angle district at every wiring board to be processed arranged a plurality of through hole, a plurality of through holes were linear array along the wedge angle zone centerline.When a plurality of through holes are linear array along the wedge angle zone centerline, be convenient to will be near the center of circle of the through hole on the point summit lower cutter point as milling cutter, and will be away from the center of circle of the through hole on point summit as milling cutter return the cutter point, make milling cutter set track according to CNC processing and forming formula and pull required figure out.
After adopting forming method of the present invention to finish the district's moulding of wiring board wedge angle, be that replaceable major diameter milling cutter continues moulding is carried out in the zone beyond the wedge angle district, because the breaking risk of major diameter milling cutter reduces greatly, can improve by lengthening edge of milling cutter length the stack quantity of the wiring board of processing, thereby promote shaping efficiency.Certainly, when the milling cutter diameter that uses when the moulding of wiring board wedge angle district is larger, also can change milling cutter and continue moulding is carried out in the zone beyond the wedge angle district.
The present invention has the following advantages and beneficial effect compared to existing technology:
The present invention is before the CNC moulding, point in every wiring board wedge angle to be processed district arranges through hole, therefore need not when the CNC moulding point moulding to the wedge angle district, but by being set, through hole directly substitutes milling cutter processing via regions, do not produce the base material projection, be conducive to improve the moulding quality, simultaneously with the lower cutter point of through hole milling cutter when the wedge angle district is carried out the CNC moulding, contact the resistance of generation when reducing cutter under the milling cutter with wiring board, raising solid capacity and heat dispersion, reduction breaking risk.In addition, when the CNC moulding, use forming method of the present invention first to after the district's moulding of wiring board wedge angle, replaceable major diameter milling cutter carries out moulding to the zone beyond the wedge angle district again, and make the major diameter milling cutter not be subjected to wedge angle district point long and narrow space structural limitations, be convenient to the major diameter milling cutter point is carried out moulding with exterior domain, can significantly increase one-time formed lamination quantity, be conducive to promote shaping efficiency.Simultaneously, moulding wedge angle district before the wedge angle district is carried out the CNC moulding with exterior domain, then wedge angle district board substrate is removed when moulding, under the major diameter milling cutter during cutter point of a knife not pushed by base material, can effectively prevent the generation of base material projection phenomenon in the forming process.
Embodiment
The present invention is described in further detail below in conjunction with embodiment, but the execution mode of the invention is not limited to this.
Embodiment 1
Adopting this wiring board wedge angle district forming method is that the wiring board of 0.6mm carries out moulding to the point width in wedge angle district, comprises the steps:
Step 1, in the drilling operating before moulding, it is the 0.6mm through hole that the point in every wiring board wedge angle to be processed district arranges a diameter;
Step 2 is got three wiring board phase poststacks to be processed and is fixed on the working position of CNC former;
Step 3, when the CNC moulding, adopting diameter is the milling cutter of 0.6mm, and gets the through hole center of circle as the lower cutter point of milling cutter.
After finishing the district's moulding of wiring board wedge angle, change the major diameter milling cutter, and the length of lengthening major diameter milling cutter, moulding is carried out in zone beyond the wedge angle district, because the breaking risk of major diameter milling cutter reduces greatly, can improve by lengthening edge of milling cutter length the stack quantity of the wiring board of processing, thereby promote shaping efficiency.
Embodiment 2
Adopting this wiring board wedge angle district forming method is that the wiring board of 0.7mm carries out moulding to the point width in wedge angle district, comprises the steps:
Step 1, in the drilling operating before moulding, point in every wiring board wedge angle to be processed district arranges three through holes, and three through holes are linear array along the directions of rays on point summit, three through holes intersect, and the directions of rays along summit, wedge angle district is gradually large, and the diameter of three through holes is followed successively by 0.6mm, 0.7mm, 0.8mm;
Step 2 is got four wiring board phase poststacks to be processed and is fixed on the working position of CNC former;
Step 3, adopt with near the identical milling cutter of the through-hole diameter on point summit, namely adopting diameter is the milling cutter of 0.6mm, and gets near the center of circle of the through hole on the point summit lower cutter point as milling cutter, gets away from the center of circle of the through hole on point summit returning the cutter point as milling cutter.
After finishing the district's moulding of wiring board wedge angle, change the major diameter milling cutter, and the length of lengthening major diameter milling cutter, moulding is carried out in zone beyond the wedge angle district, because the breaking risk of major diameter milling cutter reduces greatly, can improve by lengthening edge of milling cutter length the stack quantity of the wiring board of processing, thereby promote shaping efficiency.
In the present embodiment, changing diameter is the milling cutter of 1.0mm, and the sword length of milling cutter added grow to 8mm, owing to changed the long milling cutter of major diameter and length, can guarantee that the multi-disc PCB milling cutter processing that superposes simultaneously still has enough length and intensity and is difficult for breaking, therefore improve the stack quantity of the wiring board of processing, thereby promote shaping efficiency.
Embodiment 3
Adopting this wiring board wedge angle district forming method is that the wiring board of 1mm carries out moulding to the point width in wedge angle district, comprises the steps:
Step 1, in the drilling operating before moulding, point in every wiring board wedge angle to be processed district arranges four through holes, and four through holes are linear array along the wedge angle zone centerline, four through holes intersect, and the directions of rays along summit, wedge angle district is gradually large, and the diameter of four through holes is followed successively by 1mm, 1.2mm, 1.4mm, 1.6mm;
Step 2 is got five wiring board phase poststacks to be processed and is fixed on the working position of CNC former;
Step 3, adopt with near the identical milling cutter of the through-hole diameter on point summit, namely adopting diameter is the milling cutter of 1mm, and gets near the center of circle of the through hole on the point summit lower cutter point as milling cutter, gets away from the center of circle of the through hole on point summit returning the cutter point as milling cutter.
After finishing the district's moulding of wiring board wedge angle, do not change milling cutter, continue moulding is carried out in the zone beyond the wedge angle district, because the breaking risk of major diameter milling cutter reduces greatly, can improve by lengthening edge of milling cutter length the stack quantity of the wiring board of processing, thereby promote shaping efficiency.
The above embodiment has only expressed the working of an invention mode, and it describes comparatively concrete and detailed, but can not therefore be interpreted as the restriction to claim of the present invention.Should be pointed out that for the person of ordinary skill of the art without departing from the inventive concept of the premise, can also make some distortion and improvement, these all belong to protection scope of the present invention.Therefore, the protection range of patent of the present invention should be as the criterion with claims.
Claims (6)
1. wiring board wedge angle district forming method, the method comprises the steps:
Step 1, before the CNC moulding, the point in every wiring board wedge angle to be processed district arranges a through hole, or at the point in every wiring board wedge angle to be processed district a plurality of through holes is set, and a plurality of through hole is linear array along the directions of rays on point summit;
Step 2 is got multi-disc wiring board phase to be processed poststack and is fixed on the working position of CNC former;
Step 3, when the point in every wiring board wedge angle to be processed district arranges a through hole, when the CNC moulding, adopt the milling cutter identical with through-hole diameter, and get the through hole center of circle as the lower cutter point of milling cutter, when the point in every wiring board wedge angle to be processed district arranges a plurality of through hole, adopt with near the identical milling cutter of the through-hole diameter on point summit, and get near the center of circle of the through hole on the point summit lower cutter point as milling cutter.
2. wiring board wedge angle according to claim 1 district forming method is characterized in that: described through hole or described near the diameter of the through hole on point summit more than or equal to 0.6mm.
3. wiring board wedge angle according to claim 2 district forming method is characterized in that: described through hole or described be 0.6mm near the diameter of the through hole on point summit.
4. wiring board wedge angle according to claim 1 district forming method, it is characterized in that: when the wedge angle district at every wiring board to be processed arranged a plurality of through hole, a plurality of through holes intersected, and gradually large along the directions of rays on summit, wedge angle district.
5. wiring board wedge angle according to claim 4 district forming method is characterized in that:, described a plurality of through holes are preferably three through holes, and the diameter of three through holes is followed successively by 0.6mm, 0.7mm, 0.8mm.
6. wiring board wedge angle according to claim 1 district forming method, it is characterized in that: when the wedge angle district at every wiring board to be processed arranged a plurality of through hole, a plurality of through holes were linear array along the wedge angle zone centerline.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210492100.1A CN103025062B (en) | 2012-11-28 | 2012-11-28 | A kind of circuit board wedge angle region forming method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210492100.1A CN103025062B (en) | 2012-11-28 | 2012-11-28 | A kind of circuit board wedge angle region forming method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103025062A true CN103025062A (en) | 2013-04-03 |
| CN103025062B CN103025062B (en) | 2016-04-20 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210492100.1A Active CN103025062B (en) | 2012-11-28 | 2012-11-28 | A kind of circuit board wedge angle region forming method |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104427769A (en) * | 2013-08-30 | 2015-03-18 | 北大方正集团有限公司 | CNC (Computer Numerical Control) panel cutting method for circuit board without locating hole |
| CN113110289A (en) * | 2021-04-25 | 2021-07-13 | 南通大学 | Optimization method for tool return pre-judgment point in continuous cutting of circular cutter |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0471286A (en) * | 1990-07-12 | 1992-03-05 | Konica Corp | Board aggregate |
| JPH05327141A (en) * | 1992-05-25 | 1993-12-10 | Murata Mfg Co Ltd | Dielectric board and its manufacture |
| JPH0832185A (en) * | 1994-07-19 | 1996-02-02 | Matsushita Electric Works Ltd | Board for push back |
| JP2008159968A (en) * | 2006-12-26 | 2008-07-10 | Fuji Electric Fa Components & Systems Co Ltd | Multiple printed board |
| JP2009152331A (en) * | 2007-12-20 | 2009-07-09 | Panasonic Corp | Processing method for wiring board, and semiconductor device |
| CN101945532A (en) * | 2010-08-30 | 2011-01-12 | 昆山元茂电子科技有限公司 | Contour machining hole for printed circuit board |
-
2012
- 2012-11-28 CN CN201210492100.1A patent/CN103025062B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0471286A (en) * | 1990-07-12 | 1992-03-05 | Konica Corp | Board aggregate |
| JPH05327141A (en) * | 1992-05-25 | 1993-12-10 | Murata Mfg Co Ltd | Dielectric board and its manufacture |
| JPH0832185A (en) * | 1994-07-19 | 1996-02-02 | Matsushita Electric Works Ltd | Board for push back |
| JP2008159968A (en) * | 2006-12-26 | 2008-07-10 | Fuji Electric Fa Components & Systems Co Ltd | Multiple printed board |
| JP2009152331A (en) * | 2007-12-20 | 2009-07-09 | Panasonic Corp | Processing method for wiring board, and semiconductor device |
| CN101945532A (en) * | 2010-08-30 | 2011-01-12 | 昆山元茂电子科技有限公司 | Contour machining hole for printed circuit board |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104427769A (en) * | 2013-08-30 | 2015-03-18 | 北大方正集团有限公司 | CNC (Computer Numerical Control) panel cutting method for circuit board without locating hole |
| CN113110289A (en) * | 2021-04-25 | 2021-07-13 | 南通大学 | Optimization method for tool return pre-judgment point in continuous cutting of circular cutter |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103025062B (en) | 2016-04-20 |
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