KR100826344B1 - Via hole laser drilling scanning method - Google Patents

Abstract

A method for laser drilling and scanning of a substrate is provided to improve working speed and increase productivity accordingly by performing scanning on portions where the substrate units are substantially formed when forming holes in a panel substrate with a predetermined size on which a plurality of substrate units are dividingly formed. In a scanning method using a scanner for forming through holes on the respective substrate units relative to a panel substrate(p) which is placed on an XY operating table of a laser drilling apparatus, and on which a plurality of substrate units(p') are regularly arranged, a method for laser drilling and scanning of the substrate comprises the steps of: performing scanning on an effective substrate face except a dummy part relative to the panel substrate to acquire information on positions and sizes of the respective substrate units based on substrate design data comprising through-hole position coordinates of the respective substrate units; and dividing scan regions(s) on the target panel substrate correspondingly to the acquired information on positions and sizes of the respective substrate units, and performing scanning on the divided scan regions.

Description

Substrate Laser Drilling Scanning Method

1 is a view schematically showing the configuration of a general substrate laser drilling apparatus,

2 is a view showing a scan interval of a substrate by a substrate laser drilling scanning method according to the prior art,

3 is a view showing a scan interval of the substrate by the substrate laser drilling scanning method according to the present invention.

<Description of the symbols for the main parts of the drawings>

100: drilling device

* 100s: Scanner

110,120: Galvano Mirror

200: XY operation table

p: panel substrate

p ': substrate unit

s: scan area

The present invention relates to a scanning method for processing a hole in a circuit board using a laser beam, and more particularly, to obtain drill data based on the substrate design data, and to scan the effective area of the substrate based on the scanning data. The present invention relates to a substrate laser drilling scanning method capable of increasing process efficiency.

In general, a printed circuit board (PCB) serves to easily connect various electronic devices according to a certain frame, and is widely used in all electronic products such as digital TV and other home appliances to high-tech communication devices. According to the application, it is also classified into general purpose PCB, module PCB, package PCB, and the like.

In other words, the printed circuit board is formed by attaching a thin plate such as copper to one side of a phenolic resin insulating plate or an epoxy resin insulating plate, and then etching it according to the wiring pattern of the circuit (corroding and removing only the circuit on the line) to form a necessary circuit. They are formed by drilling holes for attaching them.They are classified into single-sided boards, double-sided boards, and multi-layered boards according to the number of wiring circuits. With the development of the industry, ultra-thin printed circuit boards (thickness of 0.04mm to 0.2mm) are widely used.

Such a printed circuit board has a cross-section used for a relatively simple electronic device, but recently, a double-sided board having a circuit formed on both sides and interconnected through a through hole, or expanded to a plurality of layers as well as both sides. Multilayer substrates are increasing in use.

A brief description of a commonly known method of manufacturing a substrate is to use a clad plated plate coated with a copper foil having a thickness of μm on an insulator plate, and to pretreat the plated plate, through hole processing step, and electroless chemical copper plating step. After the circuit printing step, the etching step and the post-treatment step.

Here, the pretreatment step is to prepare a full-fledged PCB manufacturing process by cutting the cladding disc, to form a through hole using a drill in the cladding disc cut to a suitable size in the pretreatment step, and then formed in the step by electroless plating A thin film of copper foil is formed on the surface of the through hole to enable later chemical copper plating.

Subsequently, in the circuit printing step, a photosensitive film is coated on the cladding disc, followed by exposure and development to mask the remaining portions except the copper circuit portion and the through hole portion of the predesigned wiring diagram, and then form solder plating or nickel and gold plating thereon. To form a protective film to protect the copper foil of the circuit portion, and then, in the etching step, the photosensitive film masking is peeled off, and the copper foil of the non-circuit portion is etched to leave only the circuit wiring portion, and the solder plating is peeled off when solder plating is applied .

In the post-treatment step, the substrate is manufactured through intermediate inspection, external processing, and final inspection.

The printed circuit board that undergoes the above process is a wet process for performing a etching treatment of a resist used as a mask after etching and etching, or for heat treatment and cleaning of the printed circuit board. In the process, the sheet is continuously conveyed one by one.

Here, the conveying apparatus is a plate-like substrate is moved in one direction by axially coupled to the rotating shaft receiving a driving force from the driving source is a plurality of rollers on the frame integrally.

On the other hand, in the conventional printed circuit board manufactured by the above process, the hole processing is made by a drilling device using a laser beam.

This drilling apparatus is a structure including a processor control part, and this machine control part is provided with the positioning control part for positioning control of the board | substrate mounted on the XY movable table, and the laser control part for controlling the laser beam irradiated to a board | substrate. The laser control unit is connected to a laser oscillator, the laser light is emitted from the laser oscillator under the control signal of the laser control unit.

On the other hand, the laser light emitted from the laser oscillator is incident on the polarizing beam splitter via a mask located below the polarizing beam splitter, which is arranged at a predetermined angle with respect to the optical path of the laser light to change the direction of the laser light. The laser light converted from the advancing direction is guided to the scanner, and a f? Lens is disposed below the scanner, and a wave plate is disposed between the f? Lens and the substrate. The scanner processes the hole by controlling the angle of the laser light incident on the f? Lens and irradiating the laser light to a predetermined position on the substrate via the wave plate.

1 is a view schematically showing a main configuration of a drilling device using a conventional laser beam.

As shown therein, the drilling apparatus is configured to include a scanner (100s) for recognizing a panel substrate to be processed, such a scanner (100s) is a structure having one or more galvano mirrors (110, 120).

Here, the galvano mirror 110 on one side is configured to be able to swing around a horizontal axis to direct the laser light l in the X-axis direction on the workpiece region of the panel substrate p seated on the XY movable table 200. Inject. In addition, the galvano mirror 120 disposed on the other side is configured to be able to swing around the vertical axis so that the laser light l is directed in the Y-axis direction on the processing region of the panel substrate p mounted on the XY movable table 200. Inject

The two galvano mirrors 110 and 120 are orthogonally arranged, and each rotation angle is controlled by a positioning controller (not shown). The laser beam scanned by the galvano mirrors 110 and 120 passes through the f? Here, the fθ lens 130 is composed of a plurality of lenses, and the antireflection film is coated on both surfaces of each lens.

When the machining in the processing area using the scanner 100s is completed in this manner, the XY movable table 200 moves by a predetermined distance on the X-axis or the Y-axis, and the galvan constitutes the scanner 100s at the moved position. The furnace mirrors 110 and 120 scan and position the corresponding scan area, that is, the next workpiece scan area.

However, conventionally, the drilling apparatus 100 is present in the area where the hole does not need to be processed in scanning the target panel substrate p mounted on the XY movable table 200, that is, at the edge of the panel substrate. By collectively scanning the unnecessary areas such as the dummy part, the workability of the hole machining process is greatly reduced, and the working time is long, resulting in a significant decrease in productivity.

That is, as shown in Figure 2 is a conventional panel board (p) is provided as a work board (work board) is made of a panel made of approximately 600mm × 600mm in size of the horizontal and vertical, and the work board having such a predetermined size The panel substrate p is divided into a plurality of substrate units p ', wherein the substrate unit p' is substantially a substrate having a size and shape for mounting on an electronic product.

The panel substrate p divided into the substrate unit p 'having a predetermined size is mounted on the upper surface of the XY movable table 200 constituting the drilling apparatus 100 in FIG. 1, and the panel substrate p After recognizing the initial position, the drill data is provided, and the scan area divided into a matrix is scanned as shown in FIG. 2.

However, the conventional scanning method divides the scan area s without considering the size or design of the panel substrate p to be processed, and then reads the drill data corresponding to the divided scan area s and drills the holes. As a result of the processing, as a result of scanning from the substrate p to a portion where unnecessary dummy portions or holes are not formed, there is a closed end in which work efficiency is greatly reduced.

That is, since the XY movable table 200 needs to be moved by receiving a driving force from a driving source such as a motor or an actuator, it takes a lot of time when moving between scan regions, whereas hole processing by changing the angle of laser light in the scan region is relatively performed. As a result of the high speed, when the scanning is performed from the panel substrate p to an unnecessary part as described above, the working speed is greatly reduced, resulting in a problem of low productivity.

The present invention has been made to solve the problems of the prior art as described above, and an object of the present invention is to substantially eliminate the perforation of a panel substrate having a predetermined size in which a plurality of substrate units are divided. It is to provide a substrate laser drilling scanning method that can be performed in the portion to be formed to increase the productivity according to the improvement of the working speed.

In order to achieve the above object, the substrate laser drilling scanning method according to the present invention is mounted on the XY movable table of the laser drilling apparatus, and a through hole is formed on each substrate unit with respect to a panel substrate on which a plurality of substrate units are regularly arranged. In the scanning method using a scanner for forming,

Acquiring the position and size information of each substrate unit based on substrate design design data including through hole position coordinates of each substrate unit by scanning the effective substrate surface except the dummy portion of the panel substrate; ; And partitioning a scan area on the target panel substrate so as to correspond to each of the obtained substrate units, and performing scanning.

As a preferred feature of the present invention, each scan area is partitioned into a matrix, and the scan is performed further on the outer side except the dummy portion of the panel substrate is sequentially performed.

The features and advantages of the present invention will become more apparent from the following detailed description based on the accompanying drawings.

Prior to this, the terms or words used in this specification and claims are not to be interpreted in a conventional and dictionary sense, and the inventors may appropriately define the concept of terms in order to best explain their invention in the best way possible. It should be interpreted as meaning and concept corresponding to the technical idea of the present invention based on the principle that the present invention.

Hereinafter, a preferred embodiment of a substrate laser drilling scanning method according to the present invention will be described in detail with reference to the accompanying drawings.

3 is a view showing a scan interval of the substrate by the substrate laser drilling scanning method according to the present invention.

As shown therein, the substrate laser drilling scanning method according to the present invention uses the configuration of the conventional laser drilling apparatus.

That is, referring to FIG. 1, the drilling apparatus scans a panel substrate p regularly arranged with the substrate units p ', and then forms a through hole, and recognizes the panel substrate p. It is a configuration including a scanner (100s) for.

Here, the scanner 100s has a structure having one or more galvano mirrors 110 and 120, and any one of the galvano mirrors 110 and 120 of the pair of galvano mirrors 110 and 120 is configured to swing around a horizontal axis. It is configured to scan the laser light l in the X-axis direction on the workpiece region of the panel substrate p seated on the XY movable table 200, and the remaining one galvano mirror 120 can swing around the vertical axis. The laser beam 1 is configured to scan the laser beam 1 in the Y-axis direction on the processing region of the panel substrate p mounted on the XY movable table 200.

The pair of galvano mirrors 110 and 120 configured as described above are arranged to be orthogonal to each other, and each rotation angle is controlled by a positioning controller (not shown).

In addition, the laser beams scanned by the galvano mirrors 110 and 120 pass through the f? Here, the fθ lens 130 is composed of a plurality of lenses, and the antireflection film is coated on both surfaces of each lens. When the machining in the processing area using the scanner 100s is completed in this manner, the XY movable table 200 moves by a predetermined distance on the X-axis or the Y-axis, and the galvan constitutes the scanner 100s at the moved position. The furnace mirrors 110 and 120 scan and position the corresponding scan area, that is, the next workpiece scan area.

Since the drilling apparatus of such a structure is substantially the same as the conventional structure, detailed description is abbreviate | omitted.

However, the present invention has a major technical feature in order to improve productivity yield by improving the workability degradation due to the movement between scan areas by minimizing the scan area in the scanning method for processing the through-hole using the drilling device.

That is, the present invention numerically includes information related to the size or shape of the substrate units p 'constituting the panel substrate p and requires CAM (computer aided manufacturing) design data, that is, substrate design design data. In this case, the substrate design design data refers to data generated by using a computer for information processing and control required for product regulation, production process, equipment, and management.

Since the substrate design design data is generated during the substrate design work, detailed description thereof will be omitted.

Meanwhile, the present invention extracts and acquires position and size information of the substrate units p 'based on the substrate design design data. The information thus obtained includes not only the size and position coordinates of each substrate unit p ', but also drill data such as diameters and position coordinates of through holes formed in each substrate unit p'.

Subsequently, the scanning area s is virtually partitioned on the target panel substrate p corresponding to each of the obtained substrate units p ', and scanning is sequentially performed on the divided scan area s. The present invention is achieved.

Here, the scan area s is partitioned into a lattice arrangement structure, that is, a matrix, and each scan area s is matched to correspond to each substrate unit p '.

Meanwhile, when the scan area s is partitioned and scanned as described above, the dummy part of the panel substrate p and the part where the through-hole is not formed are excluded. In this case, sequentially from the outer side of the effective substrate surface It will be desirable for scanning to be performed.

Summarizing the above-described substrate laser drilling scanning method, the drill data related to the position and size of each substrate unit p 'and the through-holes are based on the substrate design design data generated during the design of the panel substrate p. Based on the acquired data, each board unit p 'and the scan area s are matched using a computer program to virtually divide the scan area s with respect to the target panel substrate p.

That is, since the scanning area s of the panel substrate p is virtually partitioned and scanned based on the drilled data, unnecessary portions such as a dummy portion of the panel substrate p or a portion where a through hole is not formed as a result. Since it does not involve a scan for, the time required for the movement of the XY movable table 200 for the movement between the scan areas s can be significantly shortened, thereby improving the production yield.

On the other hand, the present invention is not limited to the described embodiments, it is obvious to those skilled in the art that various modifications and variations can be made without departing from the spirit and scope of the present invention. Therefore, such modifications or variations will have to belong to the claims of the present invention.

The substrate laser drilling scanning method according to the present invention constructed and operated as described above comprises cam design data including position coordinates and size information of the substrate units formed on the panel substrate, that is, the target panel substrate based on the substrate design design data. The scanning area is partitioned and the scanning is performed. As a result, the panel substrate can be accurately scanned on the effective substrate surface except for unnecessary parts such as a dummy part, thereby improving industrial yield. Provide effect.

Claims (2)

A scanning method using a scanner for forming through holes on each substrate unit for a panel substrate on which a plurality of substrate units are regularly arranged by being seated on an XY movable table of a laser drilling apparatus. Acquiring the position and size information of each substrate unit based on substrate design design data including through hole position coordinates of each substrate unit by scanning the effective substrate surface except the dummy portion of the panel substrate; ; Partitioning a scan area on the target panel substrate so as to correspond to each of the obtained substrate units, and performing scanning; Substrate laser drilling scanning method characterized in that it comprises a. The method of claim 1, wherein each of the scan areas is partitioned into a matrix, and the scan is sequentially performed on the outer side of the panel substrate except for the dummy part.

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