JP2006235503A - Display device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a display device in which a wiring board can accurately be positioned with simple constitution. <P>SOLUTION: The display device as an embodiment of the present invention has a liquid crystal display panel 10, a plurality of connection pads 31 arranged side by side on the liquid crystal panel 10, a positioning pattern 32 provided outside the plurality of connection pads 31, and an FPC 20 which has a plurality of terminals 26 connected to the plurality of connection pads 31 and is disposed with the positioning pattern 32 and fitted to the display panel; and the positioning pattern 32 has a width larger than the width of the connection pads 31, and the FPC has a substrate positioning portion 42 provided opposite to the positioning pattern 32. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a display device, and more particularly to a display device in which a wiring board is attached to a display panel.

  As an image display device for personal computers and other various monitors, or a display screen of a mobile phone or a display screen of a car navigation system, there has been a remarkable spread of liquid crystal display devices. This liquid crystal display device includes a flexible substrate for inputting signals, power, and the like from an external control substrate. This flexible substrate is attached to a liquid crystal display panel using an anisotropic conductive adhesive (ACF). Thereby, the connection pad provided in the liquid crystal display panel and the terminal of the flexible substrate are electrically connected.

  Therefore, in the liquid crystal display device, alignment when the flexible substrate and the liquid crystal display panel are bonded is important. A method of performing this alignment is disclosed (Patent Document 1). In this liquid crystal display device, alignment holes are provided in both the liquid crystal display panel and the wiring substrate, and the alignment is performed by engaging with the positioning pins.

JP 2001-311959 A

  In recent years, due to the narrow pitch of connection pads of a liquid crystal display panel, higher positional accuracy is required for laminating flexible substrates. Therefore, in the above bonding method, there are cases where the bonding cannot be performed at an accurate position. That is, in the conventional liquid crystal display device, the flexible substrate is attached in a state shifted from the liquid crystal display panel, and the flexible substrate may not be attached to a predetermined position of the liquid crystal display panel. In this case, the positions of the terminals and the connection pads are shifted, which causes a problem that normal signals cannot be input to the liquid crystal display panel. In particular, in the conventional liquid crystal display device, the flexible substrate is displaced in the rotation direction, and the flexible substrate is often attached to be inclined with respect to the liquid crystal display panel.

As described above, the conventional liquid crystal display device has a problem that it is difficult to align the flexible substrate and the liquid crystal display panel.
The present invention has been made in view of such problems, and an object thereof is to provide a display device capable of accurately aligning a wiring board and a display panel.

  A display device according to a first aspect of the present invention is provided on the outer side of a display panel, a plurality of connection pads arranged in parallel on the display panel, and a parallel direction of the plurality of connection pads arranged in parallel. And a wiring board having a plurality of terminals respectively connected to the plurality of connection pads, wherein the positioning pattern has a width equal to or greater than a width of the connection pads, and the wiring board includes the positioning pattern. It has a board | substrate positioning part provided in the position corresponding to. Thereby, alignment can be performed accurately.

  A display device according to a second aspect of the present invention is the display device described above, wherein the substrate positioning portion is formed so as to surround the positioning pattern. Thereby, alignment can be performed more accurately.

  The display device according to a third aspect of the present invention is the above display device, further comprising a drive circuit provided on the display panel, wherein the connection pad is a connection pad for power supply wiring input to the drive circuit. And a connection pad for signal wiring, and the connection pad provided on the positioning pattern side is the connection pad for signal wiring. Thereby, the width | variety of a wiring board can be narrowed.

  In the display device according to the fourth aspect of the present invention, in the above-described display device, an outermost connection pad formed at the other outermost position in the parallel direction has an extended pattern extending outward, A terminal corresponding to the outermost connection pad has a pattern clamping portion extending outward so as to sandwich the extended pattern. Thereby, alignment can be performed more accurately.

  A display device according to a fifth aspect of the present invention is the display device described above, wherein the positioning pattern is formed of a transparent conductive film. Thereby, alignment can be performed more accurately.

  ADVANTAGE OF THE INVENTION According to this invention, the display apparatus which can align a wiring board correctly can be provided.

  Hereinafter, embodiments to which the present invention can be applied will be described. The following description explains the embodiment of the present invention, and the present invention is not limited to the following embodiment.

  A configuration of a liquid crystal display panel used in the liquid crystal display device according to the present invention will be described with reference to FIG. FIG. 1A is a front view showing the configuration of the liquid crystal display panel. FIG. 1B is a cross-sectional view of the liquid crystal display panel shown in FIG.

  In the figure, 10 is a liquid crystal display panel, 11 is a counter substrate, 12 is an array substrate, 20 is a flexible substrate (hereinafter FPC), 24 is an anisotropic conductive film (hereinafter ACF), and 30 is a drive circuit. is there.

  First, the overall configuration of the liquid crystal display panel 10 will be described. In addition, the following description shows the structure of the general liquid crystal display panel 10, and this invention is not limited to the liquid crystal display panel of the following structures. The liquid crystal display panel 10 includes an array substrate 12 on which an array circuit is formed, and a counter substrate 11 disposed to face the array substrate 12. A liquid crystal layer (not shown) is sandwiched between the array substrate 12 and the counter substrate 11. The liquid crystal display panel 10 can use a mode such as TN (Twisted Nematic) or STN (Super Twisted Nematic). The liquid crystal layer is aligned in a predetermined direction by alignment films provided on the array substrate 12 and the counter substrate 11. The pair of substrates can be a rectangular transparent insulating substrate such as a glass substrate. The active matrix type liquid crystal display panel 10 includes a switching element in which each pixel controls input / output of a display signal. A typical switching element is a TFT (Thin Film Transistor). A backlight unit (not shown), which is a planar light source device, is provided on the back side of the array substrate 12. That is, in the configuration shown in FIG. 1B, the right side of the liquid crystal display panel 10, that is, the counter substrate 11 side is the display side. Here, the counter substrate 11 side of the liquid crystal display panel 10 is a front side, and the array substrate 12 side is a back side.

  The counter substrate 11 is provided with a color filter and a BM (black matrix). The counter substrate 11 is further provided with a counter electrode. Each pixel in the display area of the liquid crystal display panel 10 displays, for example, one of R, G, and B colors. The liquid crystal display panel 10 displays an image by controlling the transmitted light from the backlight. In the display area on the array substrate 12, a plurality of source lines and a plurality of gate lines are arranged in a matrix. The source line and the gate line are disposed so as to overlap each other at a substantially right angle, and the TFT is disposed in the vicinity of the intersection.

  The array substrate 12 is provided larger than the counter substrate 11. Therefore, a part of the array substrate 12 is arranged so as to protrude from the counter substrate 11. A drive circuit 30 is disposed in a region where the array substrate 12 protrudes. The drive circuit 30 is a driver IC that serves both as a gate driver and a source driver. This liquid crystal display panel is a COG type liquid crystal display panel, and a drive circuit 30 is connected to the array substrate 12 via an ACF 24. The drive circuit 30 generates a gate signal and a source signal from a control signal and a display signal input from an external control board. A connection pad connected to the drive circuit 30 is provided at the end of the array substrate 12 on the drive circuit 30 side.

  A gate signal is input from the drive circuit 30 to the gate wiring, and the TFT corresponding to the selected gate wiring is turned on. The display voltage input to the source line from the drive circuit 30 is sent to the pixel electrode through the on-state TFT, and the pixel electrode and the counter electrode apply an electric field to the liquid crystal. By changing the display voltage, the voltage applied to the liquid crystal can be changed, and the light transmittance of the liquid crystal is controlled.

  The backlight unit includes a light source such as a fluorescent tube or an LED and a light guide plate that guides light from the light source in a planar shape. The light source is usually provided on the side surface of the light guide plate. The light guide plate is made of, for example, acrylic resin, and emits light incident from the side surface uniformly from the front surface. In addition, reflectors that allow light emitted from the light guide plate to enter the light guide plate again are provided on the back and side surfaces of the light guide plate. Further, the light source is included in the reflector, and the light emitted from the light source is efficiently incident on the light guide plate.

  An FPC 20 is attached to the end of the array substrate 12 in the vicinity of the drive circuit 30. Wiring for supplying a signal to the drive circuit 30 is provided on the surface of the FPC 20 on the array substrate 12 side. The surface of the FPC 20 on the array substrate 12 side is the back surface, and the opposite surface is the front surface. Wiring is provided on the back surface of the FPC 20. A part of the wiring of the FPC 20 is formed so as to be exposed. The exposed portion of the wiring serves as a terminal for electrical connection with the connection pad of the array substrate 12. That is, the connection pads provided on the array substrate 12 and the terminals provided on the FPC 20 are connected via the ACF 24. Thereby, the wiring provided in the FPC 20 and the drive circuit 30 are electrically connected. A control signal, a display signal, and a power supply voltage for driving the drive circuit 30 are input from an external control board. The drive circuit 30 outputs a gate signal and a source signal based on the control signal and the display signal.

  Next, a configuration for connecting the FPC 20 and the array substrate 12 will be described with reference to FIG. FIG. 2A is a front view showing an enlarged configuration of a portion of the array substrate 12 where the FPC 20 is attached. FIG. 2B is a cross-sectional view showing a part of the structure of FIG. A drive circuit 30 is provided near the side end of the array substrate 12. A plurality of wirings 34 connected to the drive circuit 30 are further provided on the array substrate 12. The plurality of wirings 34 are formed from the drive circuit 30 to the vicinity of the edge of the array substrate 12. The plurality of wirings 34 are formed from a transparent conductive film such as ITO, for example. As shown in FIG. 2B, the exposed end of the wiring 34 becomes a connection pad 31 connected to the FPC 20. Note that an insulating film may be formed on a portion of the wiring 34 other than the connection pad 31. As shown in FIG. 2A, a rectangular positioning pattern 32 is formed on the outer side of the wiring 34 in the X direction, that is, on one outer side in the parallel direction where the connection pads 31 of the wiring 34 are arranged in parallel. Yes. The positioning pattern 32 is also formed of the same transparent conductive film as the wiring 34. A substrate positioning portion 42 provided at a position corresponding to the positioning pattern 32 is formed at the side end portion in the + X direction of the FPC 20. That is, the FPC 20 is bonded to the array substrate 12 in a state where the positioning pattern 32 is positioned at a position corresponding to the substrate positioning portion 42. The substrate positioning portion 42 has an opening that is substantially the same as or slightly larger than the positioning pattern 32.

  As shown in FIG. 2B, the FPC 20 includes a base film 51 and a conductor 52 provided on the back side of the base film 51. The conductor 52 is patterned so that a signal wiring for transmitting a signal input to the driving circuit 30 and a power wiring for the driving circuit 30 are formed. Further, a cover film 53 that covers the conductor 52 is provided on the back side of the conductor 52. As shown in FIG. 2B, the cover film 53 is provided so that the end of the conductor 52 is exposed. The exposed portion of the conductor 52 becomes the terminal 26 and is connected to the connection pad 31 via the ACF 24. That is, the terminal 26 and the connection pad 31 are electrically connected by pressing the ACF 24 disposed between the connection pad 31 and the terminal 26. The end of the FPC 20 opposite to the terminal 26 shown in FIG. 2B is connected to an external control board. The conductor 52 is formed of a metal film such as copper.

  Next, the configuration of the connection pads 31 provided on the array substrate 12 and the configuration of the terminals 26 provided on the FPC 20 will be described with reference to FIG. FIG. 3A is a diagram showing the configuration of the connection pads 31 provided on the array substrate 12, and FIG. 3B is a diagram showing the configuration of the terminals 26 provided on the FPC 20.

  As shown in FIG. 3A, a plurality of connection pads 31 are arranged in parallel at the end of the array substrate 12. That is, the plurality of connection pads 31 are arranged in a line along the X direction. The plurality of connection pads 31 are formed with a predetermined pitch and a predetermined width. A rectangular positioning pattern 32 is formed on one outer side of the plurality of connection pads 31. That is, the positioning pattern 32 is formed outside the connection pad 31 provided at the end in the + X direction. The positioning pattern 32 is formed wider than the width of the connection pad 31. That is, the width of the positioning pattern 32 in the X direction is wider than the width of the connection pad 31 in the X direction. In particular, it is preferable to make it twice or more. An extended pattern 33 is provided on the outermost connection pad 31 opposite to the side on which the positioning pattern 32 is provided. That is, the extended pattern 33 is extended to the connection pad 31 provided at the end in the −X direction. The extended pattern 33 is formed outside the connection pad 31. Thus, among the plurality of connection pads 31, the outermost connection pad 31 in the −X direction protrudes outward and has a different shape from the other connection pads 31.

  As shown in FIG. 3B, a plurality of terminals 26 are arranged in parallel at the end of the FPC 20. Yes. That is, the plurality of terminals 26 are arranged in a line along the X direction. Each of the plurality of terminals 26 is provided at a position corresponding to each of the plurality of connection pads 31. The connection pad 31 and the terminal 26 have the same width and the same interval. That is, when the FPC 20 is overlapped with the array substrate 12 at a predetermined position, each terminal 26 and each connection pad 31 are connected. Further, in the FPC 20, a rectangular substrate positioning portion 42 is formed outside the plurality of terminals 26. The substrate positioning portion 42 is formed at a position corresponding to the positioning pattern 32 of the array substrate 12. An opening pattern 45 is formed in the substrate positioning portion 42 so as to surround the substrate position pattern 32. That is, the board positioning part 42 is connected to the terminal 26 at the right end, and the opening pattern 45 is formed in a square shape. Further, a pattern clamping portion is formed on the terminal 26 provided on the outermost side opposite to the substrate positioning portion 42. The pattern clamping portion is composed of two clamping patterns 43 formed outside the terminal 26. The two clamping patterns 43 are provided at a predetermined interval in the Y direction. In this manner, among the plurality of terminals 26, the sandwiching pattern 43 or the opening pattern 45 is extended from the two outer terminals 26, and has a shape different from that of the central terminal 26. The pattern clamping portion 43 is provided at the end opposite to the terminal 26 provided with the opening pattern 45.

  The configuration of the connection pads 31 and the terminals 26 in a state where the array substrate 12 and the FPC 20 shown in FIG. 3 are aligned will be described with reference to FIG. In FIG. 4, reference numeral 44 denotes a connection portion in which the terminal 26 and the connection pad 31 overlap each other. A plurality of connection portions 44 where the terminals 26 and the connection pads 31 are connected are provided corresponding to the number of the terminals 26 or the connection pads 31. The connecting portion 44 is arranged in parallel in the X direction. On the outside of the connection portion 44, a positioning pattern 32 and a substrate positioning portion 42 provided at a position corresponding to the positioning pattern 32 are arranged. An opening pattern 45 is provided in the substrate positioning portion 42. That is, the positioning pattern 32 is disposed in the opening portion of the opening pattern 45.

  An extension pattern 33 of the connection pad 31 and two sandwiching patterns 43 of the terminals 26 are disposed outside the connection portion 44 provided on the outermost side opposite to the positioning pattern 32. In the Y direction, the extended pattern 33 is disposed between the two sandwich patterns 43. In the X direction, the extended pattern 33 and the two sandwich patterns 43 are formed with substantially the same width. That is, the extended pattern 33 is positioned so as to be disposed between the two sandwich patterns 43.

  The positioning by the positioning pattern 32 is performed while magnifying and observing the vicinity of the positioning pattern 32, for example. Specifically, a CCD camera, an illumination light source, and the like are installed on the back side of the liquid crystal display panel 10 shown in FIG. And in order to perform alignment, the vicinity of the positioning pattern 32 is illuminated with an illumination light source. An image in the vicinity of the positioning pattern 32 captured by the CCD camera is displayed on a monitor or the like. Alignment is performed while looking at this monitor, and the FPC 20 and the array substrate 12 are bonded together in an aligned state. Here, the positioning pattern 32 is formed of a transparent conductive film such as ITO. Furthermore, the array substrate 12 is a transparent glass substrate. Therefore, the FPC 20 can be optically observed from the array substrate 12 side of the liquid crystal display panel, that is, from the opposite side of the FPC 20.

  In general, a transparent conductive film such as ITO is not completely transparent, but is transparent with a slight color such as white. Therefore, the position of the positioning pattern 32 can be visually recognized by observing the vicinity of the positioning pattern 32 with the CCD camera from the array substrate 12 side. Further, since the conductor 52 provided in the FPC 20 is formed of a metal film, its position can be visually recognized by observing with a CCD camera. When the positioning pattern 32 and the conductor 52 of the FPC 20 overlap, the position of the positioning pattern 32 formed by the transparent conductive film is difficult to see. That is, the brightness of the reflected light reflected by the conductor 52, which is a metal film, increases, making it difficult to visually recognize the position of the positioning pattern 32. In the present invention, the substrate positioning portion 42 having the opening pattern 45 is provided at a position corresponding to the positioning pattern 32. Therefore, when the alignment is performed, the positioning pattern 32 is arranged in the opening pattern 45. If the FPC 20 is arranged so that there is no transparent area without the positioning pattern 32 in the opening pattern 45, alignment can be performed easily. That is, substantially the entire substrate positioning portion 42 overlaps the positioning pattern 32. At this time, the image of the CCD camera is such that the positioning pattern 32 is included in the substrate positioning portion 42. Therefore, the entire opening of the opening pattern 45 is white. Thereby, it can be visually recognized easily whether it is positioned, and alignment can be performed correctly. As described above, the positioning pattern 32 can be easily positioned in the substrate positioning portion 42 by the configuration described above.

  Further, the positioning pattern 32 is formed wider than the connection pad 31 in the X direction. Thereby, it can position correctly. In particular, even when the FPC 20 rotates with respect to the array substrate 12 and a positional deviation in the θ direction occurs, the positional deviation in the θ direction can be prevented because the positioning pattern 32 is provided long in the X direction. That is, by forming the wide positioning pattern 32 in the X direction, when the FPC 20 is rotated with respect to the array substrate 12, the positional deviation amount between the opening pattern 45 and the positioning pattern 32 becomes large. Accordingly, since the positioning pattern 32 is not included in the opening portion of the opening pattern 45, a part of the opening portion is no longer a white portion due to the transparent conductive film. Therefore, it can be easily recognized that the alignment is not accurately performed. Therefore, it is possible to prevent the connection pad 31 and the terminal 26 from being obliquely connected, and to reliably prevent the erroneous terminal 26 and the connection pad 31 from being conducted.

  Further, the positioning may be performed while observing not only the vicinity of the positioning pattern 32 but also the vicinity of the pinching pattern 43 with a CCD camera. In this case, the vicinity of the sandwiching pattern 43 can be enlarged and observed by the same method as described above. Then, positioning is performed so that the extended pattern 33 is disposed between the sandwiching patterns 43. At this time, the pinching pattern 43 of the terminal 26 is composed of a conductor 52 made of a metal film, and the extending pattern 33 of the connection pad 31 is composed of the same transparent conductive film as the connection pad 31. Therefore, the extended pattern 33 of the connection pad 31 can be easily positioned between the clamping patterns 43 of the terminals 26. That is, the slightly white extended pattern 33 is disposed between the sandwiching patterns 43 made of metal, and positioning is performed so that there is no transparent region. As a result, the positioning can be reliably performed as in the case where the vicinity of the positioning pattern 32 is observed. Thus, alignment can be performed more accurately by performing alignment while observing two places. In particular, the rotational deviation of the FPC 20 can be suppressed.

  Positioning is performed in this way, and the FPC 20 is attached to the ACF 24 provided on the array substrate 12. Then, the ACF 24 is pressure-bonded, and the FPC 20 is attached onto the array substrate 12. As a result, the array substrate 12 and the FPC 20 can be bonded together in a state where they are accurately aligned. Therefore, it is possible to prevent the wrong terminal 26 and the connection pad 31 from being connected.

  An example of specific dimensions of the above configuration will be described below. The terminals 26 and connection pads 31 are each formed with a pitch of 0.4 mm. The terminals 26 and the connection pads 31 are formed with a width of 0.1 to 0.2 mm. Therefore, the interval between the adjacent terminals 26 and the interval between the adjacent connection pads 31 are 0.2 to 0.3 mm. The positioning pattern 32 is longer than the width of the terminal 26 and the connection pad 31. It is preferable that the width of the positioning pattern 32 is at least twice the width of the connection pad 32. In other words, the width of the positioning pattern 32 is preferably 0.4 mm or more here. Thereby, positioning can be performed more accurately. Furthermore, the width of the portion of the substrate positioning portion 42 provided outside the positioning pattern 32 is preferably 0.2 mm. Of course, the configuration of the positioning pattern 32 and the terminal 26 is not limited to the above dimensions. Further, the positioning pattern 32 and the substrate positioning portion 42 are not limited to a rectangle, and may be a triangle, a square, a circle, or the like.

  The wiring 34 to the drive circuit 30 provided on the array substrate has a plurality of power supply wirings for supplying driving power and a plurality of signal wirings for supplying display signals or control signals. In some cases, the signal wiring and the power supply wiring are separately provided. That is, in the configuration shown in FIG. 2A, among the plurality of wirings 34 connected to the drive circuit 30, a plurality of signal wirings are arranged from one end in the direction in which the wirings 34 are arranged in parallel, and a plurality of power sources are connected from the other end Wiring may be provided. For example, it is assumed that signal wiring is disposed from the right end of the plurality of wirings 34 illustrated in FIG. 2A and power supply wiring is disposed from the left end. That is, among the plurality of wirings 34, the predetermined wiring 34 in the center portion from the rightmost wiring 34 becomes a signal wiring, and the leftmost wiring 34 from the wiring adjacent to the left of the predetermined signal wiring becomes a power wiring. In general, the power supply wiring has a higher current flowing than the signal wiring, and thus needs to have a low resistance. Therefore, the wiring 34 of the power supply system of the drive circuit 30 needs to be wider than the wiring 34 of the signal system.

  As described above, among the wirings 34 provided on the array substrate 12 or the wirings provided in the FPC 20, the power supply wiring and the signal wiring may be divided and formed with different widths. At this time, the wiring width can be reduced on the side where the signal wiring is provided, and the wiring width needs to be increased on the side where the power supply wiring is provided. That is, in the above configuration, the signal wiring arranged on the right side (+ X side) of the array substrate 12 is narrower than the power supply wiring provided on the left side (−X side) of the array substrate 12.

  By the way, the width of the FPC 20 in the X direction may be limited due to design restrictions and storage space restrictions. That is, the space for providing the FPC 20 on the array substrate 12 may be limited. In other words, due to design restrictions and the like, it is necessary to provide a space where the FPC 20 is not provided on the array substrate 12 to some extent, and the width of the FPC 20 is limited. Therefore, the width that the FPC 20 protrudes from the drive circuit 30 in the X direction is limited. In this case, the positioning pattern 32 is preferably formed on the signal wiring side. In other words, the signal wiring can be made narrower than the wiring power supply. Therefore, even when the width of the FPC 20 is limited, a space for forming the positioning pattern 32 between the outermost connection pad 31 and the end of the FPC 20 can be widened. That is, the space where the terminal 26 is not provided at the end of the FPC 20 can be widened. Thereby, the positioning pattern 32 and the board | substrate positioning part 42 can be formed more widely, and the shift | offset | difference of (theta) direction can further be suppressed. In this way, by making the FPC 20 an asymmetric pattern shape, alignment can be performed accurately even when the width of the FPC 20 is limited. That is, even when the substrate positioning part 42 and the opening pattern 45 are provided only on one side, the positioning pattern 32 is formed to have a width in the X direction wider than the width of the connection pad 31, thereby accurately aligning. Can do.

  In the above description, the configuration in which the FPC 20 is attached to the liquid crystal display panel 10 has been described. However, the present invention is not limited to this. For example, instead of the liquid crystal display panel 10, other display panels such as an organic EL display panel and an inorganic EL display panel can be used. Furthermore, the display device may be other types such as a passive matrix type without being limited to the active matrix type. Further, the present invention is not limited to the COG type display device, and can be used, for example, when a wiring board such as TCP is attached to the display panel.

It is a figure which shows the structure of the liquid crystal display panel used for the liquid crystal display device concerning this invention. It is a figure which shows the structure of the edge part vicinity of the liquid crystal display panel used for the liquid crystal display device concerning this invention. It is a figure which shows the structure of the flexible substrate and array substrate which are used for the liquid crystal display device concerning this invention. It is a figure which shows the state by which the flexible substrate and array substrate which are used for the liquid crystal display device concerning this invention were aligned.

Explanation of symbols

10 Liquid crystal display panel 11 Array substrate 12 Counter substrate 20 FPC
26 Terminal 30 Drive circuit 31 Connection pad 32 Positioning pattern 33 Extension pattern 34 Wiring 42 Substrate positioning part 43 Holding pattern 45 Opening pattern 51 Base film 52 Conductor 53 Cover film

Claims (5)

A display panel;
A plurality of connection pads arranged in parallel on the display panel;
A positioning pattern provided on one outer side in the parallel direction of the plurality of connection pads arranged in parallel;
A wiring board having a plurality of terminals each connected to the plurality of connection pads,
The positioning pattern has a width equal to or greater than the width of the connection pad;
A display device in which the wiring substrate has a substrate positioning portion provided at a position corresponding to the positioning pattern.   The display device according to claim 1, wherein the substrate positioning portion is formed so as to surround the positioning pattern. A drive circuit provided on the display panel;
The connection pad has a connection pad for power supply wiring and a connection pad for signal wiring input to the drive circuit,
The display device according to claim 1, wherein a connection pad provided on the positioning pattern side is a connection pad for the signal wiring. The outermost connection pad formed at the other outermost position in the parallel direction has an extended pattern extending outward,
4. The display device according to claim 1, wherein a terminal corresponding to the outermost connection pad has a pattern holding portion extended outward so as to hold the extended pattern.   The display device according to claim 1, wherein the positioning pattern is formed of a transparent conductive film.

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