CN113421909A - Display panel and display device - Google Patents
Display panel and display device Download PDFInfo
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- CN113421909A CN113421909A CN202110706763.8A CN202110706763A CN113421909A CN 113421909 A CN113421909 A CN 113421909A CN 202110706763 A CN202110706763 A CN 202110706763A CN 113421909 A CN113421909 A CN 113421909A
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/40—OLEDs integrated with touch screens
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
Abstract
The invention discloses a display panel and a display device, the display panel comprises a driving device layer, a light emitting device layer, a packaging layer and a touch layer which are arranged in a stacking way, the display panel is provided with a display area and a non-display area, in order to realize the chip binding of the display panel and a circuit board component, the non-display area comprises a touch binding area, the touch binding area is provided with a pin area and a function area which are adjacent along a first direction, the function area comprises an alignment mark area and a blank area, a touch pin is arranged in the pin area, the touch pin and the touch layer are arranged at the same layer, the blank area is provided with a block for elevating, the block for elevating and at least one of the driving device layer, the light emitting device layer and the touch layer are arranged at the same layer, the block for elevating is used for compensating the difference of the film thickness of the blank area and the pin area, thereby the pressure welding surfaces of the pin area and the function area are positioned at the same horizontal plane, and the touch binding area is ensured in the pressure welding process, the stress is uniformly distributed, and the stability of crimping is ensured.
Description
Technical Field
The invention belongs to the technical field of electronic products, and particularly relates to a display panel and a display device.
Background
With the gradual upgrade of user requirements, display devices gradually develop toward large size, high image quality, and the like, and the manufacturing of the display devices generally includes processes of preparation of a display panel, chip binding, cutting, and the like. After the display panel is manufactured, the connecting pins in the binding area are bound and connected with the pins on the circuit board assembly in a pressing mode, the limitation of the structure size is met, and in the process of crimping the display panel and the circuit board assembly, a film layer on the display panel is easily damaged due to nonuniform stress.
Therefore, a new display panel and a new display device are needed.
Disclosure of Invention
The embodiment of the invention provides a display panel and a display device, wherein a part of touch binding areas are provided with a padding block, so that the uniform stress of the display panel in the chip binding process is ensured, and the stability of crimping is ensured.
The display panel comprises a driving device layer, a light emitting device layer, a packaging layer and a touch layer which are arranged in a stacked mode, the display panel is provided with a display area and a non-display area, the non-display area comprises a touch binding area, the touch binding area is provided with a pin area and a function area which are adjacent to each other along a first direction, the function area comprises an alignment mark area and a blank area, touch pins are arranged in the pin area, the touch pins and the touch layer are arranged on the same layer, the blank area is provided with a padding block, the padding block and at least one of the driving device layer, the light emitting device layer and the touch layer are arranged on the same layer, and the padding block is used for compensating the difference of film thicknesses of the blank area and the pin area.
According to an aspect of the present invention, the light emitting device layer includes an anode layer, a light emitting layer, and a cathode layer disposed along the display panel film layer stacking direction, and the elevation block and at least one of the anode layer and the cathode layer are disposed at the same layer.
According to an aspect of the present invention, the touch layer includes a touch electrode layer, an insulating layer, and a bridge metal layer disposed along a film stacking direction of the display panel, and the block for raising a pad and at least one of the touch electrode layer and the bridge metal layer are disposed in the same layer.
According to one aspect of the invention, the heightening block comprises a plurality of metal blocks arranged in an array, and each metal block is at least one of polygonal and circular.
According to one aspect of the invention, each metal block has a predetermined distance therebetween, and the predetermined distance is 5 μm to 20 μm.
According to one aspect of the invention, the raised block is a single metal layer; or the heightening block comprises a first metal layer, a second metal layer and a third metal layer which are arranged in a stacked mode; preferably, the first metal layer is a Ti layer, the second metal layer is an Al layer, and the third metal layer is a Ti layer.
According to an aspect of the present invention, the blank area includes a first blank area and a second blank area respectively disposed at two sides of the alignment mark area along the second direction, the raised blocks disposed in the first blank area and the second blank area are connected to an edge of the alignment mark area, and the second direction intersects with the first direction.
According to one aspect of the invention, the orthographic projection of the block on the functional area occupies at least one third of the area of the functional area.
According to one aspect of the invention, in the lead area, the display panel includes a substrate, an inorganic film layer group and a planarization layer, which are stacked, and the touch pins are disposed on a surface of the planarization layer, which is away from the substrate.
Another aspect of an embodiment of the present invention provides a display device, including: a display panel as claimed in any one of the above embodiments; and the circuit board assembly is provided with a circuit board pin group which is correspondingly bound and connected with the touch control pin.
Compared with the prior art, the display panel provided by the embodiment of the invention comprises a driving device layer, a light emitting device layer, a packaging layer and a touch layer which are arranged in a stacked mode, the display panel is provided with a display area and a non-display area, in order to realize the chip binding of the display panel and a circuit board assembly, the non-display area comprises a touch binding area, the touch binding area is provided with an adjacent pin area and a function area along a first direction, the function area comprises an alignment mark area and a blank area, the pin area is provided with touch pins, and the touch pins and the touch layer are arranged on the same layer. Because the alignment mark area and the film layer of the pin area have a certain height difference, when the circuit board assembly is in press-connection with the display panel, the stress of the display panel is uneven, the blank area is provided with the heightening block, the heightening block and the driving device layer, the light-emitting device layer and at least one of the touch layers are arranged on the same layer, and the heightening block is used for compensating the thickness difference of the film layer between the blank area and the pin area, so that the press-connection surfaces of the pin area and the function area are on the same horizontal plane, the uniform distribution of stress borne by the touch binding area in the press-connection process is ensured, the problems that the pin is peeled off or the film layer is damaged due to uneven stress of the display panel are prevented, and the press-connection stability and the production yield of the display panel are ensured.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments of the present invention will be briefly described below, and it is obvious that the drawings described below are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1 is a top view of a display panel according to an embodiment of the present invention;
fig. 2 is an enlarged view of a touch binding region of a display panel according to an embodiment of the present invention;
fig. 3 is a cross-sectional view of a display panel in fig. 1 in a direction B-B.
In the drawings:
1-a drive device layer; 11-a gate insulating layer; 12-a first interlayer insulating layer; 13-a second interlayer insulating layer; 2-a light emitting device layer; 21-an anode layer; 22-a light-emitting layer; 23-a cathode layer; 3-an encapsulation layer; 4-a touch layer; 41-a touch electrode layer; 42-an insulating layer; 43-bridge spanning metal layer; 5-touch control pin; 6-raising block; 7-a substrate; 8-a planarization layer; AA-display area; NA-non-display area; p-touch binding area; p1-pin field; p2-functional region; p21-alignment marker region; p22-blank area; t1-pixel drive circuit; x-a first direction; y-second direction.
Detailed Description
Features and exemplary embodiments of various aspects of the present invention will be described in detail below. In the following detailed description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. It will be apparent, however, to one skilled in the art that the present invention may be practiced without some of these specific details. The following description of the embodiments is merely intended to provide a better understanding of the present invention by illustrating examples of the present invention.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
For better understanding of the present invention, the following description is made in detail with reference to fig. 1 to 3 for a display panel and a display device according to an embodiment of the present invention.
Referring to fig. 1 to 3, an embodiment of the invention provides a display panel 100, which includes a driving device layer 1, a light emitting device layer 2, a package layer 3, and a touch layer 4, which are stacked, the display panel 100 has a display area AA and a non-display area NA, the non-display area NA includes a touch binding area P, the touch binding area P has an adjacent pin area P1 and a function area P2 along a first direction X, the function area P2 includes an alignment mark area P21 and a blank area P22, a touch pin 5 is disposed in the pin area P1, the touch pin 5 and the touch layer 4 are disposed on the same layer, the blank area P22 is disposed with a pad block 6, the pad block 6 and at least one of the driving device layer 1, the light emitting device layer 2, and the touch layer 3 are disposed on the same layer, and the pad block 6 is used to compensate for a difference in film thickness between the blank area P22 and the pin area P1.
The display panel 100 provided by the embodiment of the invention includes a driving device layer 1, a light emitting device layer 2, a packaging layer 3 and a touch layer 4, which are stacked, the display panel 100 has a display area AA and a non-display area NA, in order to realize chip bonding between the display panel 100 and a circuit board assembly, the non-display area NA includes a touch bonding area P, the touch bonding area P has an adjacent pin area P1 and a function area P2 along a first direction X, the function area P2 includes an alignment mark area P21 and a blank area P22, a pin area P1 is provided with a touch pin 5, and the touch pin 5 and the touch layer 4 are disposed on the same layer. Because the film layers of the alignment mark region P2 and the pin region P1 have a certain height difference, in order to avoid that when the circuit board assembly is crimped on the display panel, the display panel is stressed unevenly, the blank region P22 is provided with the padding block 6, at least one of the padding block 6, the driving device layer 1, the light-emitting device layer 2 and the touch layer 4 is arranged on the same layer, and the padding block 6 is used for compensating the thickness difference of the film layers of the blank region P22 and the pin region P1, so that the crimping surfaces of the pin region P1 and the functional region P2 are on the same horizontal plane, the uniform distribution of stress borne by the touch binding region P in the crimping process is ensured, the problems that the pins are peeled off or the film layers are damaged due to uneven stress of the display panel 100 are prevented, and the stability of crimping and the production yield of the display panel 100 are ensured.
Referring to fig. 2 to 3, the lead area P1 is provided with a touch pad 5, and the touch pad 5 and the touch layer 4 in the display area AA are disposed on the same layer, i.e., the touch pad 5 is formed by extending the touch layer 4 to the lead area P1. After the display panel 100 is manufactured, the touch pins 5 are exposed on the surface of the display panel 100 and are bound and connected with the circuit board assembly in a pressing manner.
It can be understood that the alignment mark region P21 is used to realize alignment of the touch pins 5 on the display panel 100 and the pin groups on the circuit board assembly, in order to ensure accuracy of alignment, a cross-shaped or a straight-shaped alignment pattern is formed on a certain film layer of the alignment mark region P21, and in order to avoid that the touch pins 5 affect accuracy of the obtained position of the alignment pattern in the alignment process, the alignment mark region P21 is not provided with the touch pins 5, so that the film thickness of the alignment mark region P21 is often smaller than that of the pin region P1. At this time, if the functional area P2 is only provided with the alignment mark area P21, when the circuit board assembly is pressed in the touch binding area P, the pressing force acts only on the pin area P1, and the touch binding area P is subjected to uneven stress. If the blank region P22 is further disposed in the functional region P2, and the press contact surface of the blank region P22 and the press contact surface of the lead region P1 are located on the same horizontal plane, when the circuit board assembly is pressed in the touch binding region P, the blank region P22 and the functional region P1 are stressed synchronously, which reduces the press contact force borne by the lead region P1, and ensures uniform distribution of the stress of the touch binding region P, thereby preventing the problems of lead peeling or film damage of the display panel 100 due to uneven stress, and improving the stability of the press contact.
Referring to fig. 3, in the display area AA, the display panel 100 includes a substrate 7, a driving device layer 1, a planarization layer 8, a light emitting device layer 2, an encapsulation layer 3, and a touch layer 4, which are stacked. The driving device layer 1 includes a pixel driving circuit T1, the driving device layer 1 specifically includes a metal layer and an inorganic film layer group which are sequentially stacked in a plane direction perpendicular to the display panel 100, the metal layer includes a source/drain metal layer, a gate metal layer, and the like, and the inorganic film layer group includes a gate insulating layer 11, a first interlayer insulating layer 12, and a second interlayer insulating layer 13. To facilitate the preparation of the touch binding region P of the display panel 100, the substrate 7, the inorganic film layer group and the planarization layer 8 of the display area AA extend to the touch binding region P, so as to simplify the preparation process.
Specifically, in the lead area P1, the display panel 100 includes the substrate 7, the inorganic film layer group, and the planarization layer 8, which are stacked, the touch pins 5 are disposed on the surface of the planarization layer 8 on the side away from the substrate 7, in the functional area P2, the display panel 100 includes the substrate 7, the inorganic film layer group, and the planarization layer 8, which are stacked, and since the touch pins 5 are not disposed in the functional area P2, the surface of the functional area P2 on the side away from the substrate at least partially sinks with respect to the surface of the lead area P1 on the side away from the substrate. Therefore, the blank region P22 is provided with the padding block 6 to compensate the film thickness difference between the blank region P22 and the lead region P1, and the padding block 6 can be arranged on any film surface of the blank region P22, so that the film thickness of the blank region P22 can be the same as the film thickness of the lead region P1.
Optionally, to facilitate the preparation of the padding block 6, the padding block 6 may be disposed on the same layer as at least one of the driving device layer 1, the light emitting device layer 2, and the touch layer 4 in the display area AA, and the preparation process of the display panel 100 is simplified by synchronously preparing the padding block 6 and at least one of the driving device layer 1, the light emitting device layer 2, and the touch layer 4 in the display area AA.
The elevation block 6 may be disposed on the same layer as the light emitting device layer 2, the light emitting device layer 2 includes an anode layer 21, a light emitting layer 22, and a cathode layer 23 disposed along a film stacking direction of the display panel 100, and when a voltage is applied to the anode layer 21 and the cathode layer 23, holes and electrons are injected into the light emitting layer 22 and are recombined in the light emitting layer 22 to emit light. The elevation blocks 6 and at least one of the anode layer 21 and the cathode layer 23 are disposed on the same layer, that is, when the anode layer 21 and the cathode layer 23 are manufactured, the elevation blocks 6 can be patterned in the blank regions P22 by the same manufacturing process, so as to simplify the manufacturing process. Note that the block 6 does not function as the anode layer 21 and the cathode layer 23, and is formed by the same manufacturing process.
Referring to fig. 3, the heightening block 6 may also be disposed on the same layer as the touch layer 4, specifically, the touch layer 4 includes a touch electrode layer 41, an insulating layer 42 and a bridge-spanning metal layer 43 disposed along a film stacking direction of the display panel 100, the touch electrode layer 41 is electrically connected to the bridge-spanning connecting layer 43 through a via hole disposed on the insulating layer 42, and the heightening block 6 is disposed on the same layer as at least one of the touch electrode layer 41 and the bridge-spanning metal layer 43. That is, when the touch electrode layer 41 and the bridge metal layer 43 are prepared, the pad-up block 6 can be patterned in the blank area P22 by the same preparation process, so as to simplify the preparation process. Similarly, the heightening block 6 does not have the functions of either the touch electrode layer 41 or the bridge-crossing metal layer 43, and is prepared in the same layer by using the same preparation process.
In order to ensure the uniform distribution of stress through the padding block 6, the padding block 6 includes a plurality of metal blocks arranged in an array, and each metal block is in at least one of a polygon and a circle. Through setting up a plurality of bed hedgehopping pieces 6 that are the array and distribute, reserve deformation space when being out of shape for each bed hedgehopping piece 6 department atress, avoid each bed hedgehopping piece 6 to extrude each other when warping, and influence blank P22 crimping face's planarization. Wherein, each metal block can be set into various sizes and shapes, for example, the metal block can be at least one of a polygon and a circle, so as to avoid the damage and deformation of each heightening block 6 when mutually pressing.
Optionally, the metal blocks have a predetermined distance therebetween, and the predetermined distance is 5 μm to 20 μm, so as to leave a sufficient deformation space. Wherein, the predetermined distance cannot be too large, so that the setting area of the heightening block 6 is too small to affect the pressure welding area of the blank area P1; meanwhile, the predetermined distance cannot be too small, so that mutual extrusion when the positions of the heightening blocks 6 are stressed and deformed is avoided.
Further, the heightening block 6 is a single-layer metal layer; or, the heightening block 6 comprises a first metal layer, a second metal layer and a third metal layer which are stacked; preferably, the first metal layer is a Ti layer, the second metal layer is an Al layer, and the third metal layer is a Ti layer. Wherein, when the elevation block 6 and at least one of the anode layer 21 and the cathode layer 23 are disposed on the same layer, the elevation block 6 may be disposed as a single metal layer of the same material as at least one of the anode layer 21 and the cathode layer 23; similarly, the touch electrode layer 41 and the bridge-spanning metal layer 43 include a Ti layer, an Al layer, and a Ti layer, which are sequentially stacked, and when the padding block 6 and at least one of the touch electrode layer 41 and the bridge-spanning metal layer 42 are disposed on the same layer, the padding block 6 may also be disposed as a first metal layer, a second metal layer, and a third metal layer, which are stacked, so as to simplify the manufacturing process.
Referring to fig. 2, to ensure uniform stress distribution along the second direction Y, the blank region P22 includes a first blank region and a second blank region respectively disposed at two sides of the alignment mark region P21 along the second direction Y, the raised block 6 disposed in the first blank region and the second blank region is connected to the edge of the alignment mark region P21, and the second direction Y intersects with the first direction X. Through all setting up blank area along the both sides of second direction Y at counterpoint mark zone P21, rock along second direction Y when avoiding circuit board assembly and display panel 100 crimping, further guarantee the evenly distributed of touch-control binding region P stress, stability when having guaranteed the crimping.
Wherein, the orthographic projection of the heightening block 6 in the functional area P2 occupies at least one third of the area of the functional area P2. By ensuring the installation area of the block 6, it is ensured that the functional region P2 has a sufficiently large press contact surface to bear the press contact force when the circuit board assembly is press-contacted to the display panel 100, thereby ensuring uniform distribution of stress.
Another embodiment of the present invention provides a display device, including: a display panel and a circuit board assembly, the display panel is the display panel 100 in the above embodiment, and the circuit board assembly has a circuit board pin group corresponding to the touch pins and connected in a binding manner. After the display panel 100 is manufactured, the touch pins 5 of the display panel 100 are bonded to the circuit board pin groups in a press-fit manner, so as to connect the display panel 100 and the circuit board assembly.
The display device provided by the embodiment of the invention has the technical effects of the technical solutions of the display panel in any of the embodiments, and the explanations of the structures and terms identical to or corresponding to those in the embodiments are not repeated herein. The display device provided by the embodiment of the invention can be a mobile phone and can also be any electronic product with a display function, including but not limited to the following categories: the touch screen display system comprises a television, a notebook computer, a desktop display, a tablet computer, a digital camera, an intelligent bracelet, intelligent glasses, a vehicle-mounted display, medical equipment, industrial control equipment, a touch interaction terminal and the like, and the embodiment of the invention is not particularly limited in this respect.
As will be apparent to those skilled in the art, for convenience and brevity of description, the specific working processes of the systems, modules and units described above may refer to the corresponding processes in the foregoing method embodiments, and are not described herein again. It should be understood that the scope of the present invention is not limited thereto, and any person skilled in the art can easily conceive various equivalent modifications or substitutions within the technical scope of the present invention, and these modifications or substitutions should be covered within the scope of the present invention.
It should also be noted that the exemplary embodiments mentioned in this patent describe some methods or systems based on a series of steps or devices. However, the present invention is not limited to the order of the above-described steps, that is, the steps may be performed in the order mentioned in the embodiments, may be performed in an order different from the order in the embodiments, or may be performed simultaneously.
Claims (10)
1. The display panel is characterized by comprising a driving device layer, a light emitting device layer, a packaging layer and a touch layer which are arranged in a stacking mode, the display panel is provided with a display area and a non-display area, the non-display area comprises a touch binding area, the touch binding area is provided with an adjacent pin area and a function area along a first direction, the function area comprises a contraposition mark area and a blank area, the pin area is provided with touch pins, the touch pins and the touch layer are arranged on the same layer, the blank area is provided with a padding block, the padding block is arranged on the same layer with the driving device layer, the light emitting device layer and at least one of the touch layer, and the padding block is used for compensating the thickness difference between the blank area and a film layer of the pin area.
2. The display panel of claim 1, wherein the light emitting device layer comprises an anode layer, a light emitting layer and a cathode layer disposed along a film stacking direction of the display panel, and the elevation block and at least one of the anode layer and the cathode layer are disposed on a same layer.
3. The display panel of claim 1, wherein the touch layer comprises a touch electrode layer, an insulating layer and a bridge metal layer arranged along a film stacking direction of the display panel, and the block spacer and at least one of the touch electrode layer and the bridge metal layer are arranged on the same layer.
4. The display panel according to claim 1, wherein the block-up block comprises a plurality of metal blocks arranged in an array, and each of the metal blocks has at least one of a polygonal shape and a circular shape.
5. The display panel according to claim 4, wherein the metal blocks have a predetermined distance therebetween, and the predetermined distance is 5 μm to 20 μm.
6. The display panel according to claim 1, wherein the block-up is a single metal layer; or the like, or, alternatively,
the heightening block comprises a first metal layer, a second metal layer and a third metal layer which are arranged in a stacked mode;
preferably, the first metal layer is a Ti layer, the second metal layer is an Al layer, and the third metal layer is a Ti layer.
7. The display panel according to claim 1, wherein the blank area includes a first blank area and a second blank area respectively disposed on two sides of the alignment mark area along the second direction, the raised blocks disposed in the first blank area and the second blank area are connected to edges of the alignment mark area, and the second direction intersects with the first direction.
8. The display panel according to claim 7, wherein an orthographic projection of the block on the functional region occupies at least one third of an area of the functional region.
9. The display panel according to claim 1, wherein in the lead area, the display panel comprises a substrate, an inorganic film layer group, and a planarization layer, which are stacked, and the touch pins are disposed on a surface of the planarization layer facing away from the substrate.
10. A display device, comprising:
a display panel according to any one of claims 1 to 9;
and the circuit board assembly is provided with a circuit board pin group which is correspondingly bound and connected with the touch control pin.
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| CN202110706763.8A CN113421909B (en) | 2021-06-24 | 2021-06-24 | Display panel and display device |
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| CN202110706763.8A CN113421909B (en) | 2021-06-24 | 2021-06-24 | Display panel and display device |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN113937137A (en) * | 2021-09-23 | 2022-01-14 | 昆山国显光电有限公司 | Display panel and display device |
| WO2023142111A1 (en) * | 2022-01-30 | 2023-08-03 | 京东方科技集团股份有限公司 | Display panel and display apparatus |
| WO2023226092A1 (en) * | 2022-05-25 | 2023-11-30 | 武汉华星光电半导体显示技术有限公司 | Display module and mobile terminal |
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| CN111883039A (en) * | 2020-07-31 | 2020-11-03 | 厦门天马微电子有限公司 | Drive chip and display device |
| CN112018159A (en) * | 2020-08-27 | 2020-12-01 | 京东方科技集团股份有限公司 | Touch control display panel |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113937137A (en) * | 2021-09-23 | 2022-01-14 | 昆山国显光电有限公司 | Display panel and display device |
| WO2023142111A1 (en) * | 2022-01-30 | 2023-08-03 | 京东方科技集团股份有限公司 | Display panel and display apparatus |
| WO2023226092A1 (en) * | 2022-05-25 | 2023-11-30 | 武汉华星光电半导体显示技术有限公司 | Display module and mobile terminal |
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