CN113937137A - Display panel and display device - Google Patents
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- CN113937137A CN113937137A CN202111116072.9A CN202111116072A CN113937137A CN 113937137 A CN113937137 A CN 113937137A CN 202111116072 A CN202111116072 A CN 202111116072A CN 113937137 A CN113937137 A CN 113937137A
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- 239000012788 optical film Substances 0.000 claims abstract description 37
- 238000004806 packaging method and process Methods 0.000 claims abstract description 24
- 239000010410 layer Substances 0.000 claims description 243
- 238000005538 encapsulation Methods 0.000 claims description 59
- 230000004888 barrier function Effects 0.000 claims description 23
- 239000010408 film Substances 0.000 claims description 20
- 239000012790 adhesive layer Substances 0.000 claims description 4
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- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/122—Pixel-defining structures or layers, e.g. banks
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/40—OLEDs integrated with touch screens
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Electroluminescent Light Sources (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The application discloses display panel and display device, display panel include base plate, barricade structure, packaging layer and optics rete, and the barricade structure sets up in base plate one side and includes that a plurality of intervals locate the barricade portion in non-display area, and barricade portion is including the first surface and the second surface that meet, and the display area setting is kept away from for the first surface to the second surface. The packaging layer covers the retaining wall parts and the part of the substrate exposed at the intervals between the retaining wall parts, and the optical film layer is arranged on one side of the packaging layer, which is far away from the substrate. The display panel further comprises a stress bearing layer, the stress bearing layer is arranged between the packaging layer and the optical film layer, and the orthographic projection of the stress bearing layer on the substrate and the orthographic projection of the second surface of the baffle wall part on the substrate are at least partially overlapped, so that when the optical film layer contracts, the stress bearing layer can provide a reaction force to offset or slow down the influence of the contraction stress on the packaging layer, the packaging layer is prevented from being damaged by stress, and the packaging reliability of the display panel is improved.
Description
Technical Field
The application belongs to the technical field of electronic products, and particularly relates to a display panel and a display device.
Background
With the continuous development of display technology, the application scenarios of the display panel are more and more extensive, and the reliability of the display panel is especially important in some application scenarios with more severe environment.
The high-temperature high-humidity pressurization test is a means for evaluating the working reliability of the display panel, and practical tests find that the polarizer above the display screen body can drive the film connected with the polarizer to shrink due to high-temperature shrinkage, so that peeling occurs between the films in the display panel, water vapor easily enters the display panel, the display panel is abnormal, and the service life of the display panel is affected.
Therefore, a new display panel and a new display device are needed.
Disclosure of Invention
The embodiment of the application provides a display panel and a display device, which avoid the damage of the stress of a packaging layer caused by the thermal contraction of an optical film layer and improve the packaging reliability of the display panel.
An aspect of an embodiment of the present application provides a display panel having a display area and a non-display area at least partially surrounding the display area, the display panel including: a substrate; the retaining wall structure is arranged on one side of the substrate and comprises a plurality of retaining wall parts which are arranged in the non-display area at intervals, the retaining wall parts comprise a first surface and a second surface which are connected, and the second surface is far away from the display area relative to the first surface; the packaging layer covers the retaining wall parts and the part of the substrate exposed by the interval between the retaining wall parts; the stress bearing layer is arranged on one side, away from the substrate, of the packaging layer, and the orthographic projection of the stress bearing layer on the substrate is at least partially overlapped with the orthographic projection of the second surface of the baffle wall part on the substrate; and the optical film layer is arranged on one side of the stress bearing layer, which deviates from the substrate.
According to one aspect of the application, the display panel further comprises a touch layer, the touch layer is located in the display area and is arranged on one side of the substrate, the touch layer comprises a touch electrode layer, an inorganic insulating layer and a bridge layer, the touch electrode layer, the inorganic insulating layer and the bridge layer are arranged in a stacking mode along the film layer stacking direction of the display panel, and the stress bearing layer, the bridge layer and one of the touch electrode layer are arranged on the same layer.
According to an aspect of the application, the optical film further comprises an insulating glue layer, and the insulating glue layer is arranged between the stress bearing layer and the optical film layer and between the packaging layer and the optical film layer which are not covered by the stress bearing layer.
According to an aspect of this application, the non-display area is including binding the district and being located bind the district with barricade district between the display area, barricade structure locates barricade district, barricade structure includes being close to bind the first barricade portion that the district set up, the layer is accepted to stress the orthographic projection on the base plate at least with the second surface of first barricade portion is in orthographic projection at least part coincidence on the base plate.
According to an aspect of the application, the stress bearing layer comprises a main body part and an extension part which are connected, the extension part extends relative to the main body part in a direction away from the retaining wall part, the orthographic projection of the main body part on the base plate is at least partially overlapped with the orthographic projection of the retaining wall part on the base plate, and the orthographic projection of the extension part on the base plate is not overlapped with the orthographic projection of the retaining wall part on the base plate.
According to an aspect of the present application, an extension length of the extension portion in a film layer stacking direction perpendicular to the display panel is less than or equal to 20 μm.
According to one aspect of the application, the encapsulation layer comprises at least one inorganic encapsulation layer, the inorganic encapsulation layer being in contact with the stress-receiving layer.
According to an aspect of the application, the display device further comprises a planarization layer arranged on one side of the substrate, the planarization layer comprises a first flat part arranged in the display area and a second flat part arranged in the non-display area, and the retaining wall part comprises the second flat part.
According to an aspect of the application, the optical film layer comprises a polarizer, and the polarizer is arranged in the display area and the retaining wall area.
Another aspect of the embodiments of the present application provides a display device, which includes a display panel, where the display panel is the display panel in any one of the above embodiments.
Compared with the prior art, the display panel provided by the embodiment of the application comprises a substrate, a retaining wall structure, an encapsulation layer and an optical film layer, wherein the retaining wall structure is arranged on one side of the substrate and comprises a plurality of retaining wall parts arranged at intervals in a non-display area, each retaining wall part comprises a first surface and a second surface which are connected, and the second surface is far away from the display area relative to the first surface. In order to realize the encapsulation of the retaining wall structure, the encapsulation layer covers the retaining wall parts and the partial substrates exposed at the intervals among the retaining wall parts so as to block the water vapor transmission path, and the optical film layer is arranged on one side of the encapsulation layer, which is deviated from the substrates. Because the outer contour of the optical film layer can contract towards the center of the display area when being heated, the packaging layer is caused to receive the acting force from the second surface to the first surface direction, and the damage is caused to the acting force borne by the packaging layer due to overlarge force.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed to be used in the embodiments of the present application will be briefly described below, and it is obvious that the drawings described below are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1 is a top view of a display panel provided in an embodiment of the present application;
FIG. 2 is a cross-sectional view of a display panel of FIG. 1 taken along C-C;
fig. 3 is a cross-sectional view of another display panel along C-C of fig. 1.
In the drawings:
1-a substrate; 2-retaining wall structure; 21-a retaining wall part; 211 — a first retaining wall portion; 3-an encapsulation layer; 31-a first inorganic encapsulation layer; 32-organic encapsulation layer; 33-a second inorganic encapsulation layer; 4-a stress-bearing layer; 41-a body portion; 42-an extension; 5-an optical film layer; 6-a touch layer; 61-a touch electrode layer; 62-an inorganic insulating layer; 63-bridge layer; 7-an insulating glue layer; 8-a planarization layer; 81-a first flat portion; 82-a second flat; 100-a display panel; AA-display area; NA 1-retaining wall zone; NA 2-binding region; p1-first surface; p2-second surface; f1 — first shrinkage stress; f2 — second shrinkage stress; f3-reaction force.
Detailed Description
Features and exemplary embodiments of various aspects of the present application will be described in detail below, and in order to make objects, technical solutions and advantages of the present application more apparent, the present application will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application. It will be apparent to one skilled in the art that the present application may be practiced without some of these specific details. The following description of the embodiments is merely intended to provide a better understanding of the present application by illustrating examples thereof.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
It will be understood that when a layer, region or layer is referred to as being "on" or "over" another layer, region or layer in describing the structure of the component, it can be directly on the other layer, region or layer or intervening layers or regions may also be present. Also, if the component is turned over, one layer or region may be "under" or "beneath" another layer or region.
It will be apparent to those skilled in the art that various modifications and variations can be made in the present application without departing from the spirit or scope of the application. Thus, it is intended that the present application cover the modifications and variations of this application provided they come within the scope of the corresponding claims (the claimed subject matter) and their equivalents. It should be noted that the embodiments provided in the embodiments of the present application can be combined with each other without contradiction.
Referring to fig. 1 to 3, embodiments of a display panel and a display device are provided, and the following description will be made with reference to the accompanying drawings.
The display panel provided in the embodiment of the present application may be an Organic Light-Emitting Diode (OLED) display panel, a liquid crystal panel, or a Micro flat display panel (Micro-OLED or Micro-LED). The description will be given taking the display panel as an OLED display panel as an example.
Referring to fig. 1 and fig. 2, an embodiment of the present application provides a display panel 100 having a display area AA and a non-display area NA at least partially surrounding the display area AA, the display panel 100 including: a substrate 1; the retaining wall structure 2 is arranged on one side of the substrate 1, the retaining wall structure 2 comprises a plurality of retaining wall parts 21 arranged in the non-display area NA at intervals, each retaining wall part 21 comprises a first surface P1 and a second surface P2 which are connected, and the second surface P2 is arranged far away from the display area AA relative to the first surface P1; a packaging layer 3 covering the barrier portions 21 and the portions of the substrate 1 exposed by the spaces between the barrier portions 21; the stress bearing layer 4 is arranged on one side, away from the substrate 1, of the packaging layer 3, and the orthographic projection of the stress bearing layer 4 on the substrate 1 at least partially coincides with the orthographic projection of the second surface P2 of the baffle wall part 21 on the substrate 1; and the optical film layer 5 is arranged on one side of the stress bearing layer 4, which is deviated from the substrate 1.
An embodiment of the present application provides a display panel 100, including substrate 1, retaining wall structure 2, encapsulating layer 3 and optical film layer 5, retaining wall structure 2 sets up in substrate 1 one side and includes that a plurality of intervals locate the retaining wall portion 21 of non-display area NA, and retaining wall portion 21 is including the first surface P1 and the second surface P2 that meet, and second surface P2 is kept away from display area AA for first surface P1 and sets up. In order to realize the encapsulation of the retaining wall structure 2, the encapsulation layer 3 covers the retaining wall portions 21 and the portions of the substrate 1 exposed at the intervals between the retaining wall portions 21 so as to block the water vapor transmission path, and the optical film layer 5 is disposed on one side of the encapsulation layer departing from the substrate 1. Because the outer contour of the optical film 5 will shrink toward the center of the display area AA when being heated, and the package layer 3 is subjected to an acting force from the second surface P2 toward the first surface P1, in order to avoid the damage of the package layer 3 due to an excessive acting force, the display panel 100 further includes a stress-bearing layer 4, the stress-bearing layer 4 is disposed between the package layer 3 and the optical film 5, and an orthographic projection of the stress-bearing layer 4 on the substrate 1 at least partially coincides with an orthographic projection of the second surface P2 of the barrier wall portion 21 on the substrate 1, so that when the optical film 5 shrinks, the stress-bearing layer 4 covering the second surface P2 of the barrier wall portion 21 can provide a reaction force to counteract or slow down the influence of the shrinking stress on the package layer 3, thereby preventing the package layer 3 from being damaged by force and affecting the package effect thereof, and preventing water vapor from entering the display panel 100, the package reliability of the display panel 100 is improved.
It can be understood that, at the non-display area NA of the display panel 100, the optical film 5 may shrink due to heat, and a direction of the shrinking stress is directed from the second surface P2 to the first surface P1, and the shrinking stress is transmitted to the encapsulation layer 3 through the inner film of the display panel 100, so that the encapsulation layer 3 is stressed, the encapsulation layer 3 is damaged by the stress, and the encapsulation effect is affected, and a water vapor transmission path is formed, so that the encapsulation of the display panel 100 fails, and a display anomaly such as a black spot of the non-display area NA is caused, and the service life of the display panel 100 is affected.
In contrast, in the display panel 100 of the embodiment of the present application, the stress receiving layer 4 is disposed between the optical film layer 5 and the encapsulation layer 3, and at least an orthographic projection of the stress receiving layer 4 on the substrate 1 at least partially coincides with an orthographic projection of the second surface P2 of the barrier wall portion 21 on the substrate 1, so that after the optical film layer 5 shrinks due to heat, the shrinkage stress will first act on the stress receiving layer 4, and the stress receiving portion 4 on the second surface P2 of the barrier wall portion 21 will receive the shrinkage stress and form a reaction force to counteract or reduce the influence of the shrinkage stress on the encapsulation layer 3 disposed on the barrier wall portion 21, thereby preventing the encapsulation layer 3 from peeling off or separating from the organic film layer of the barrier wall portion 21, and improving the encapsulation reliability of the display panel 100.
It will be appreciated that the force bearing surfaces of the second surfaces P2 are not the same when the retaining wall portions 21 may be provided in different shapes. For example, when the cross section of the blocking wall portion 21 along the film stacking direction is hemispherical, ellipsoidal, or the like, the second surface P2 is an arc surface, and at this time, the second surfaces P2 are all stress surfaces, so that the stress receiving layer 4 on the second surface P2 can counteract the shrinkage stress; when the cross section of the barrier wall portion 21 along the film stacking direction is trapezoidal, rectangular, etc., the second surface P2 includes a first sub-surface P21 and a second sub-surface P22 connected to each other, the first sub-surface P21 is a plane extending along the direction of the shrinkage stress, the second sub-surface P22 is located on the side of the first sub-surface P21 away from the display area AA, since the extending direction of the first sub-surface P21 is parallel to the shrinkage stress, the first sub-surface P21 is not a stressed surface, and the stress receiving layer 4 located on the first sub-surface P21 does not counteract the shrinkage stress, which is counteracted or reduced by the stress receiving layer 4 located on the second sub-surface P22. As shown in fig. 2, it can be seen from the above analysis that when the cross section of the barrier portion 21 along the film stacking direction is trapezoidal or rectangular, the orthographic projection of the stress-bearing layer 4 on the substrate 1 at least partially coincides with the orthographic projection of the second surface P2 of the barrier portion 21 on the substrate 1, that is, the stress-bearing layer 4 at least partially covers one side surface of the barrier portion 21 subjected to the shrinkage stress, i.e. the orthographic projection of the stress-bearing layer 4 on the substrate 1 should at least partially cover the second sub-surface P22, which may only partially cover the second sub-surface P22, or at least partially cover the first sub-surface P21 and the first surface P1 on the basis of partially covering the second sub-surface P22. It should be noted that, in the drawings of the present specification, only an example is given in which the cross section of the retaining wall portion 21 in the film stacking direction is trapezoidal, and the orthographic projection of the stress receiving layer 4 on the substrate 1 completely covers the first surface P1 and the second surface P2, and the shape of the retaining wall portion 21 and the structure of the stress receiving layer 4 may be adjusted according to the actual structure of the display panel 100, and are not limited specifically herein.
It can be understood that, when the orthographic projection of the stress bearing layer 4 on the substrate 1 at least partially coincides with the orthographic projection of the second surface P2 of the baffle wall portion 21 on the substrate 1, because the baffle wall portion 21 has a certain height, the stress bearing layer 4 will also form a convex structure depending on the fluctuation of the baffle wall portion 21, so that the stress bearing layer 4 has a certain structural strength, so that when the stress bearing layer 4 receives the shrinkage stress, it can provide a certain reaction force to offset or slow down the influence of the shrinkage stress on the encapsulation layer 3 disposed on the baffle wall portion 21, thereby ensuring the encapsulation effect of the encapsulation layer 3 on the baffle wall portion 21 and avoiding the intrusion of water vapor.
Optionally, the material of the stress-receiving layer 4 may be made of a metal material such as molybdenum, titanium, aluminum, copper, silver, and the like, and the scope is not limited.
Referring to fig. 2, in an alternative embodiment, the display panel 100 further includes a touch layer 6, the touch layer 6 is located in the display area AA and is disposed on one side of the substrate 1, the touch layer 6 includes a touch electrode layer 61, an inorganic insulating layer 62 and a bridge layer 63 stacked along a film stacking direction of the display panel 100, and the stress receiving layer 4, the bridge layer 63 and one of the touch electrode layer 61 are disposed on the same layer.
The touch electrode layer 61 and the bridge layer 63 may be electrically connected through a via hole disposed on the inorganic insulating layer 62, and the inorganic insulating layer 62 may be specifically formed by using materials such as silicon oxide, silicon nitride, and silicon oxynitride, which are used to implement partial insulating of the touch electrode layer 61 and the bridge layer 63. The stress receiving layer 4 and one of the touch electrode layer 61 and the bridge layer 63 are disposed on the same layer, which means that the stress receiving layer 4 and one of the touch electrode layer 61 and the bridge layer 63 can be made of the same material, or can be formed by the same process, so as to simplify the process flow and reduce the cost. Note that the stress receiving layer 4 is formed at a different position from the touch layer 6, and the stress receiving layer 4 does not function as the touch electrode layer 61 and the bridge layer 63.
Referring to fig. 2, further, the display panel 100 further includes an insulating adhesive layer 7, where the insulating adhesive layer 7 is disposed between the stress-bearing layer 4 and the optical film layer 5, and the encapsulation layer 3 and the optical film layer 5 that are not covered by the stress-bearing layer 4. Namely, the insulating glue layer 7 covers the surface of one side of the stress bearing layer 4 and the packaging layer 3 which is not covered by the stress bearing layer 4 and deviates from the substrate 1, so that the consistency of the flatness of the insulating glue layer 7 arranged on one side of the stress bearing layer 4 and the packaging layer 3 deviating from the substrate 1 is ensured, and the optical film layer 5 is convenient to arrange on the insulating glue layer. Because the insulating glue layer 7 is arranged between the optical film layer 5 and the stress bearing layer 4, when the optical film layer 5 is heated and shrunk, the shrinkage stress can be transmitted to the stress bearing layer 4 through the insulating glue layer 7, and the stress bearing layer 4 covering the packaging layer 3 can generate a reaction force to offset or slow down the influence of the shrinkage stress on the packaging layer 3, so that the packaging layer 3 is prevented from being damaged by stress. Optionally, the insulating glue layer 7 may be set to OC (organic insulating glue), and the OC glue has the characteristics of high hardness, high flatness, high temperature resistance and the like, and is easy to set the optical film layer 5.
Referring to fig. 2, in some alternative embodiments, the encapsulation layer 3 includes at least one inorganic encapsulation layer, and the inorganic encapsulation layer is in contact with the stress-receiving layer 4. Alternatively, the encapsulation layer 3 may include a first inorganic encapsulation layer 31, an organic encapsulation layer 32, and a second inorganic encapsulation layer 33 that are stacked in a film stacking direction of the display panel 100. The organic encapsulation layer 32 is provided with a first inorganic encapsulation layer 31 and a second encapsulation inorganic layer 33 on both side surfaces in the film stacking direction, respectively, to have a good barrier effect against water vapor and oxygen. At this time, the stress-receiving layer 4 contacts the second inorganic encapsulation layer 33, and the shrinkage stress transmitted to the second inorganic encapsulation layer 33 is offset by the stress-receiving layer 4, so that the package layer 3 is prevented from being damaged by stress, and the package reliability of the display panel 100 is improved.
By providing the blocking wall portion 21, on one hand, the organic film layer of the display area AA during manufacturing, for example, the organic encapsulation layer 32, can be blocked from flowing to the blocking wall area NA1, so that the organic film layer is limited in the area enclosed by the blocking wall portion; on the other hand, when steam invaded from the edge of non-display area NA, steam need pass through retaining wall portion 21 could enter into display panel 100 inside to play good effect of blockking water oxygen, further avoid steam to invade inside display panel 100, influence display panel 100's life.
The display panel 100 further includes a planarization layer 8 disposed on one side of the substrate 1, the planarization layer 8 includes a first flat portion 81 disposed in the display area AA and a second flat portion 82 disposed in the non-display area NA, and the barrier portion 21 includes the second flat portion 82. That is, the second flat portion 82 of the blocking wall portion 21 and the first flat portion 81 of the display area AA may be made of the same material, the second flat portion 82 and the first flat portion 81 may also be formed by the same process, and the second flat portion 82 and the first flat portion 81 are only formed at different positions, thereby avoiding secondary processing, saving process flow, saving time, and reducing cost. It should be noted that the second flat portion 82 is an organic film layer in contact with the encapsulation layer 3 in the above embodiment, and since the second flat portion 82 is made of an organic material and deforms greatly when being stressed, when the encapsulation layer 3 contracts due to a contraction stress, the contraction degree between the second flat portion 82 and the encapsulation layer 3 is different, so that the encapsulation layer 3 is easily peeled off from the second flat portion 82, the encapsulation layer 3 is damaged by a force, and the encapsulation effect of the encapsulation layer 3 is affected.
In some alternative embodiments, the non-display area NA includes a binding area NA2 and a retaining wall area NA1 located between the binding area NA1 and the display area AA, the retaining wall structure 2 is disposed on the retaining wall area NA1, the retaining wall structure 2 includes a first retaining wall portion 211 disposed near the binding area NA2, and an orthogonal projection of the stress bearing layer 4 on the substrate 1 at least partially coincides with an orthogonal projection of the second surface of the first retaining wall portion 211 on the substrate 1.
Further, the optical film layer 5 includes a polarizer, and the polarizer is disposed in the display area AA and the bank area NA 1.
Referring to fig. 2, the retaining wall structure 2 includes a plurality of retaining wall portions 21 disposed at intervals in the retaining wall area NA1, the retaining wall portion 21 disposed near the binding area NA2 is defined as a first retaining wall portion 211, and since the optical film 5 covers the display area AA and the retaining wall area NA1, it can be understood that when the optical film 5 is heated, the boundary of the optical film 5 located in the retaining wall area NA1 will contract to generate a first shrinkage stress F1, the first shrinkage stress F1 is directed from the binding area NA2 toward the retaining wall area NA1, the insulating adhesive layer 7 connected to the optical film 5 will be stressed and contracted by the first shrinkage stress F1 to generate a second shrinkage stress F2, and the second shrinkage stress F2 is also directed from the binding area NA2 toward the retaining wall area NA 1. Therefore, the first barrier wall portion 211 disposed close to the bonding area NA2 will be subjected to the maximum second shrinkage stress F2, so that the stress-receiving layer 4 forms a reaction force F3 by disposing the stress-receiving layer 4 at least on a part of the surface of the encapsulation layer of the second surface of the first barrier wall portion 211, and the reaction force F3 is opposite to the second shrinkage stress F2, so as to reduce the influence of the second shrinkage stress F2 on the encapsulation layer 3, thereby preventing the second flat portion 82 of the first barrier wall portion 211 subjected to the maximum stress from peeling off from the encapsulation layer 3, and improving the encapsulation reliability of the display panel 100.
Referring to fig. 3, in some alternative embodiments, the stress bearing layer 4 includes a main body portion 41 and an extending portion 42 connected to each other, the extending portion 42 extends in a direction away from the wall portion 21 relative to the main body portion 41, an orthographic projection of the main body portion 41 on the substrate 1 and an orthographic projection of the wall portion 21 on the substrate 1 at least partially coincide, and an orthographic projection of the extending portion 42 on the substrate 1 and an orthographic projection of the wall portion 21 on the substrate 1 do not coincide. That is, the orthographic projection of the stress bearing layer 4 on the substrate 1 can cover at least part of the orthographic projection of the barrier wall portion 21 on the substrate 1, and can also extend for a certain distance along the film stacking direction perpendicular to the display panel 100 to form an extending portion 42, by providing the extending portion 42, the bearing area of the stress bearing layer 4 can be increased, and the reaction force F3 formed by the stress bearing portion 4 can be increased, thereby further reducing the shrinkage stress transmitted to the encapsulation layer 3. Similarly, the orthographic projection of the stress bearing layer 4 on the substrate 1 can be at least partially overlapped with the orthographic projection of the plurality of barrier wall parts 21 on the substrate 1, and the stress bearing part 4 covers the plurality of barrier wall parts 21, so that the bearing effect of the stress bearing part 4 is further enhanced, and the influence of the shrinkage stress on the packaging layer 3 is reduced.
Optionally, the extension portion 42 has an extension length in a direction perpendicular to the film layer stacking direction of the display panel 100 less than or equal to 20 μm. It will be appreciated that although increasing the length of extension 42 may have the effect of increasing reaction force F3, when extension 42 is set too long, reaction force F3 formed by the portion of extension 42 will be transmitted to encapsulation layer 3 to which it is connected, destroying the encapsulation effect of encapsulation layer 3. Therefore, the extension length of the extension portion 42 can be adjusted according to the actual situation, and is not limited in detail.
The embodiment of the application also provides a display device which comprises the display panel. The display device provided in the embodiments of the present application has the technical effects of the technical solutions of the display panel in any of the embodiments, and the explanations of the structures and terms that are the same as or corresponding to those in the embodiments are not repeated herein. The display device provided by the embodiment of the application can be a mobile phone, and can also be any electronic product with a display function, including but not limited to the following categories: the mobile terminal comprises a television, a notebook computer, a desktop display, a tablet computer, a digital camera, an intelligent bracelet, intelligent glasses, a vehicle-mounted display, medical equipment, industrial control equipment, a touch interaction terminal and the like, and the embodiment of the application is not particularly limited in this respect.
As will be apparent to those skilled in the art, for convenience and brevity of description, the specific working processes of the systems, modules and units described above may refer to corresponding processes in the foregoing method embodiments, and are not described herein again. It should be understood that the scope of the present application is not limited thereto, and any person skilled in the art can easily conceive various equivalent modifications or substitutions within the technical scope of the present application, and these modifications or substitutions should be covered within the scope of the present application.
It should also be noted that the exemplary embodiments mentioned in this application describe some methods or systems based on a series of steps or devices. However, the present application is not limited to the order of the above-described steps, that is, the steps may be performed in the order mentioned in the embodiments, may be performed in an order different from the order in the embodiments, or may be performed simultaneously.
Claims (10)
1. A display panel having a display area and a non-display area disposed at least partially around the display area, the display panel comprising:
a substrate;
the retaining wall structure is arranged on one side of the substrate and comprises a plurality of retaining wall parts which are arranged in the non-display area at intervals, the retaining wall parts comprise a first surface and a second surface which are connected, and the second surface is far away from the display area relative to the first surface;
the packaging layer covers the retaining wall parts and the part of the substrate exposed by the interval between the retaining wall parts;
the stress bearing layer is arranged on one side, away from the substrate, of the packaging layer, and the orthographic projection of the stress bearing layer on the substrate is at least partially overlapped with the orthographic projection of the second surface of the baffle wall part on the substrate;
and the optical film layer is arranged on one side of the stress bearing layer, which deviates from the substrate.
2. The display panel of claim 1, further comprising a touch layer disposed on the display region and on one side of the substrate, wherein the touch layer comprises a touch electrode layer, an inorganic insulating layer, and a bridge layer stacked along a film stacking direction of the display panel, and the stress receiving layer is disposed on the same layer as one of the bridge layer and the touch electrode layer.
3. The display panel according to claim 1, further comprising an insulating adhesive layer disposed between the stress-receiving layer and the optical film layer, and the encapsulation layer and the optical film layer not covered by the stress-receiving layer.
4. The display panel according to claim 1, wherein the non-display region includes a bonding region and a retaining wall region located between the bonding region and the display region, the retaining wall structure is disposed in the retaining wall region, the retaining wall structure includes a first retaining wall portion disposed near the bonding region, and an orthographic projection of the stress bearing layer on the substrate at least partially coincides with an orthographic projection of a second surface of the first retaining wall portion on the substrate.
5. The display panel according to claim 1, wherein the stress receiving layer comprises a main body portion and an extension portion connected to each other, the extension portion extends relative to the main body portion in a direction away from the barrier wall portion, an orthogonal projection of the main body portion on the substrate and an orthogonal projection of the barrier wall portion on the substrate at least partially coincide, and an orthogonal projection of the extension portion on the substrate and an orthogonal projection of the barrier wall portion on the substrate do not coincide.
6. The display panel according to claim 5, wherein the extension portion has an extension length in a direction perpendicular to a film layer stacking direction of the display panel of less than or equal to 20 μm.
7. The display panel of claim 1, wherein the encapsulation layer comprises at least one inorganic encapsulation layer, and wherein the inorganic encapsulation layer is in contact with the stress-receiving layer.
8. The display panel according to claim 1, further comprising a planarization layer disposed on one side of the substrate, wherein the planarization layer includes a first flat portion disposed in the display region and a second flat portion disposed in the non-display region, and wherein the dam portion includes the second flat portion.
9. The display panel of claim 4, wherein the optical film layer comprises a polarizer, and the polarizer is disposed in the display region and the retaining wall region.
10. A display device, comprising:
a display panel according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111116072.9A CN113937137B (en) | 2021-09-23 | Display panel and display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111116072.9A CN113937137B (en) | 2021-09-23 | Display panel and display device |
Publications (2)
| Publication Number | Publication Date |
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| CN113937137A true CN113937137A (en) | 2022-01-14 |
| CN113937137B CN113937137B (en) | 2024-07-09 |
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