CN106981584A - Flexible organic LED display panel, display device and preparation method thereof - Google Patents
Flexible organic LED display panel, display device and preparation method thereof Download PDFInfo
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- 238000002360 preparation method Methods 0.000 title claims abstract description 20
- 239000010410 layer Substances 0.000 claims abstract description 470
- 230000004888 barrier function Effects 0.000 claims abstract description 331
- 239000000758 substrate Substances 0.000 claims abstract description 103
- 239000012785 packaging film Substances 0.000 claims abstract description 65
- 229920006280 packaging film Polymers 0.000 claims abstract description 65
- 239000012044 organic layer Substances 0.000 claims abstract description 39
- 239000011241 protective layer Substances 0.000 claims description 27
- 238000000034 method Methods 0.000 claims description 19
- 230000015572 biosynthetic process Effects 0.000 claims description 14
- 125000006850 spacer group Chemical group 0.000 claims description 11
- 210000004209 hair Anatomy 0.000 claims description 4
- 230000005611 electricity Effects 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 3
- 239000000084 colloidal system Substances 0.000 claims description 2
- 230000003287 optical effect Effects 0.000 claims description 2
- 238000005452 bending Methods 0.000 abstract description 22
- 239000010408 film Substances 0.000 description 38
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 18
- 229910052760 oxygen Inorganic materials 0.000 description 18
- 239000001301 oxygen Substances 0.000 description 18
- 230000006870 function Effects 0.000 description 11
- 208000037656 Respiratory Sounds Diseases 0.000 description 8
- 230000000694 effects Effects 0.000 description 8
- 230000008569 process Effects 0.000 description 7
- 238000010276 construction Methods 0.000 description 6
- 238000000059 patterning Methods 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 4
- 238000001764 infiltration Methods 0.000 description 4
- 230000008595 infiltration Effects 0.000 description 4
- 230000008859 change Effects 0.000 description 3
- 238000005538 encapsulation Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 239000012466 permeate Substances 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 2
- 230000003139 buffering effect Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000004069 differentiation Effects 0.000 description 2
- 229910010272 inorganic material Inorganic materials 0.000 description 2
- 239000011147 inorganic material Substances 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 239000011368 organic material Substances 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
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- H—ELECTRICITY
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- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
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Abstract
The invention discloses a kind of flexible organic LED display panel, display device and preparation method thereof, including：Substrate, includes viewing area and non-display area；Organic luminescent device, is arranged at the viewing area of substrate；Packaging film, covers organic luminescent device, and packaging film includes an at least organic layer and an at least inorganic layer；At least two barrier wall structures, are arranged between the non-display area of substrate, two neighboring barrier wall structure and are arranged at intervals, wherein, at least part barrier wall structure is packaged film covering；Also include：The organic dielectric layer between at least two neighboring barrier wall structure is arranged at, organic dielectric layer is arranged on substrate, wherein, organic dielectric layer is covered by least one layer of inorganic layer.Due to being filled with inorganic layer and organic dielectric layer between barrier wall structure, organic dielectric layer can effectively absorb the stress that inorganic layer is produced in multiple bending, it is to avoid be cracked between barrier wall structure.
Description
Technical field
The present invention relates to display technology field, more particularly to a kind of flexible organic LED display panel, display dress
Put and preparation method thereof.
Background technology
OLED flexible display apparatus is made on flexible substrates, the flexible display device of changeable type, and it has low
Power consumption, small volume, it is deformable the advantages of, can be applied to wider field.But OLED flexible display apparatus is in bending process
In easily cracked at the edge of panel.
OLED flexible display apparatus includes the viewing area on substrate and the non-display area of non-display area, and viewing area includes shape
Into the organic luminescent device on substrate, in each organic luminescent device, switching thin-film transistor, driving film can be formed brilliant
Body pipe, storage capacitance and the Organic Light Emitting Diode OLED being connected with driving thin film transistor (TFT).
In order to protect Organic Light Emitting Diode not influenceed by the foreign matter of such as moisture or oxygen, it will usually formed on substrate
The packaging film of Organic Light Emitting Diode is at least covered, but packaging film can not stop the side from OLED flexible display apparatus
The foreign matter of face infiltration.In order to prevent moisture or oxygen from being permeated along side, the barricade positioned at non-display area is usually also formed on substrate
Structure.
OLED flexible display apparatus possesses flexible bending function, for example, the bending mode shown in Fig. 1 is repeatedly bent
When, the edge of display device is easily cracked, and causes side barrier wall structure to fail the barrier effect of moisture or oxygen, therefore,
This crackle is undesirable.
The content of the invention
The embodiment of the present invention provides a kind of flexible organic LED display panel, display device and preparation method thereof,
Easily crack, cause to edge bending place when solving that OLED flexible display apparatus is repeatedly bent present in prior art
Technical problem of the barrier wall structure to the barrier effect failure of side moisture or oxygen.
The embodiment of the present invention provides a kind of flexible organic LED display panel, including：
Substrate, includes viewing area and non-display area；
Organic luminescent device, is arranged at the viewing area of the substrate；
Packaging film, covers the organic luminescent device, and the packaging film includes an at least organic layer and at least one
Inorganic layer；
At least two barrier wall structures, between being arranged between the non-display area of the substrate, the two neighboring barrier wall structure
Every setting, wherein, at least partly described barrier wall structure is covered by the packaging film；
Also include：It is arranged at the organic dielectric layer between at least two neighboring barrier wall structure, the organic dielectric layer
Set on the substrate, wherein, the organic dielectric layer is covered by least one layer of inorganic layer.
In above-mentioned flexible organic LED display panel, due to being filled out successively in the interval between adjacent barrier wall structure
At least one layer of inorganic layer of organic dielectric layer and packaging film is filled, at least one layer of inorganic layer covering of packaging film is above-mentioned organic
Interval between dielectric layer and the above-mentioned organic dielectric layer of covering and barrier wall structure.In flexible organic LED display panel
Edge when repeatedly bending, being arranged at the organic dielectric layer between two neighboring barrier wall structure can effectively absorb or buffer inorganic
The stress that layer is produced in multiple bending, it is to avoid cracked between barrier wall structure, and then avoid barrier wall structure to display device
The barrier effect failure of side moisture or oxygen.
The embodiment of the present invention provides a kind of display device, including any flexible organic light emission provided in an embodiment of the present invention
Diode display panel.
The embodiment of the present invention provides also a kind of preparation method of flexible organic LED display panel, including：
A substrate is provided, the substrate includes viewing area and non-display area；
Organic luminescent device is formed in the viewing area of the substrate, wherein, forming the organic luminescent device
In the non-display area at least two spaced barrier wall structures of formation of the substrate in processing procedure, and at least adjacent two
Organic dielectric layer is formed between the individual barrier wall structure；
Packaging film is formed away from the side of the substrate in the organic luminescent device, the packaging film covering is described
Organic luminescent device, wherein, the packaging film includes at least one layer of organic layer and at least one layer of inorganic layer, at least one layer
Inorganic layer covers the organic dielectric layer.
In flexible organic LED display panel prepared by above-mentioned preparation method, due between adjacent barrier wall structure
Interval in be sequentially filled at least one layer of inorganic layer of organic dielectric layer and packaging film, packaging film it is at least one layer of inorganic
Interval between the above-mentioned organic dielectric layer of layer covering and the above-mentioned organic dielectric layer of covering and barrier wall structure.In flexible organic light emission
When the edge of diode display panel is repeatedly bent, the organic dielectric layer being arranged between two neighboring barrier wall structure can be effective
Absorb or buffer the stress that inorganic layer is produced in multiple bending, it is to avoid cracked between barrier wall structure, and then avoid barricade
Structure fails to the barrier effect of display device side moisture or oxygen.
Brief description of the drawings
Fig. 1 is that the structural representation of crack position easily occurs for a kind of OLED flexible display apparatus of the prior art；
Fig. 2 is a kind of structural representation of OLED flexible display apparatus of the prior art；
Fig. 3 is a kind of structural representation of OLED flexible display apparatus of the prior art；
Fig. 4 to Figure 15 is the structural representation of flexible OLED display panel provided in an embodiment of the present invention；
Structural representation in the processing procedure for the flexible OLED display panel that Figure 16 to Figure 20 provides for inventive embodiments；
Figure 21 to Figure 23 is the knot in the processing procedure of the packaging film of flexible OLED display panel provided in an embodiment of the present invention
Structure schematic diagram.
Embodiment
It is understandable to enable the above objects, features and advantages of the present invention to become apparent, below in conjunction with accompanying drawing and implementation
The present invention will be further described for example.However, example embodiment can be implemented in a variety of forms, and it is not understood as limited to
Embodiment set forth herein；On the contrary, these embodiments are provided so that the present invention more comprehensively and completely, and by example embodiment party
The design of formula comprehensively conveys to those skilled in the art.Identical reference represents same or similar knot in figure
Structure, thus repetition thereof will be omitted.It is described in the present invention expression position and direction word, be using accompanying drawing as
The explanation that example is carried out, but can also make a change as needed, make change and be all contained in the scope of the present invention.The present invention
Accompanying drawing be only used for illustrate relative position relation, the thickness at some positions employs the plotting mode lavished praise on oneself in order to understand, attached
Thickness in figure does not represent the proportionate relationship of actual thickness.
It should be noted that elaborating detail in the following description to fully understand the present invention.But this hair
Bright to be different from other manner described here with a variety of and be implemented, those skilled in the art can be without prejudice in the present invention
Similar popularization is done in the case of culvert.Therefore the present invention is not limited by following public embodiment.Such as in specification and
Some vocabulary have been used to censure specific components among claim.Those skilled in the art are, it is to be appreciated that hardware manufacturer can
Same component can be called with different nouns.This specification and claims are not used as differentiation group with the difference of title
The mode of part, but it is used as the criterion of differentiation with the difference of component functionally.Such as work as in specification in the whole text and claim
Mentioned in "comprising" be an open language, therefore " include but be not limited to " should be construed to.Specification subsequent descriptions are real
The better embodiment of the application is applied, so the description is for the purpose of the rule for illustrating the application, to be not limited to
Scope of the present application.The protection domain of the application is worked as to be defined depending on the appended claims person of defining.
Easily cracked solving edge bending place when OLED flexible display apparatus is repeatedly bent, cause barrier wall structure pair
During the technical problem of the barrier effect failure of side moisture or oxygen, the inventors found that OLED flexible display apparatus
The reason for easily being cracked when edge is repeatedly bent.It is specific as follows：
In order to prevent moisture or oxygen from being permeated along OLED flexible display apparatus side, include on substrate positioned at non-display area
Barrier wall structure, in order to prevent moisture or oxygen from being permeated along OLED flexible display apparatus front, includes packaging film, encapsulation on substrate
Film cover viewing area organic luminescent device, while cover non-display area partial retaining wall structure, packaging film generally by
At least one layer of inorganic layer and at least one layer of organic layer are constituted, therefore the thinner package of inorganic may be filled between barrier wall structure
Film, because the flexibility of inorganic is smaller, just can easily it be cracked when the edge of display device is repeatedly bent.
For example, OLED flexible display apparatus as shown in Figure 2, barrier wall structure at least includes the first barrier wall structure 3 and second
Barrier wall structure 4.Wherein, the second barrier wall structure 4 is located at the periphery of the first barrier wall structure 3, and the first barrier wall structure 3 and the second barricade knot
It is arranged at intervals between structure 4.Packaging film includes the first inorganic layer 61, the inorganic layer 63 of organic layer 62 and second.First inorganic layer 61
Form side on substrate 1 and the organic luminescent device 2 to be formed in viewing area is completely covered, the first inorganic layer 61 is also along first gear
The surface of wall construction 3 is formed, until being formed between the first barrier wall structure 3 and the second barrier wall structure 4, by the second barrier wall structure 4
Stop.Organic layer 62 is formed above the first inoranic membrane, and the organic luminescent device 2 of viewing area, organic layer 62 is completely covered
It is used to increase the flow channel for having permeated foreign matter, even if infiltration has foreign matter, organic layer 62 has enough thickness so that surface
Keep flat.Second inorganic layer 63 is formed so as to which organic layer 62 is completely covered on organic layer 62, also along the first barrier wall structure 3
Surface is formed, until being formed between the first barrier wall structure 3 and the second barrier wall structure 4, is stopped by the second barrier wall structure 4.
As can be seen here, it is inorganic filled with the first inorganic layer 61 and second between the first barrier wall structure 3 and the second barrier wall structure 4
Layer 62.Because the flexibility of inorganic material is smaller, easily cracked when the edge of OLED flexible display apparatus is repeatedly bent, such as
Fig. 3, thus the edge of OLED flexible display apparatus crackle generally occur the first barrier wall structure 3 and the second barrier wall structure 4 it
Between, cause the first barrier wall structure 3 and the second barrier wall structure 4 to fail the moisture of display device side or the barrier effect of oxygen.
Above-mentioned discovery based on inventor, the embodiment of the present invention provide a kind of flexible organic LED display panel and
Its preparation method, organic dielectric layer is set between the first barrier wall structure 3 and the second barrier wall structure 4, reaches the first barricade of buffering
The stress that inorganic material between the barrier wall structure 4 of structure 3 and second is produced in multiple bending, and then prevent the side of display device
Edge is broken.
The embodiment of the present invention provides a kind of flexible organic LED display panel, mainly includes：Substrate, includes display
Area and non-display area；Organic luminescent device, is arranged at the viewing area of the substrate；Packaging film, covers the organic luminescent device,
And the packaging film includes an at least organic layer and an at least inorganic layer；At least two barrier wall structures, are arranged at the non-aobvious of substrate
Show and be arranged at intervals between area, two neighboring barrier wall structure, wherein, at least part barrier wall structure is packaged film covering；Also include：
The organic dielectric layer between at least two neighboring barrier wall structure is arranged at, organic dielectric layer is arranged on substrate, wherein, You Jijie
Matter layer is covered by least one layer of inorganic layer.
It should be noted that above-mentioned barrier wall structure includes two or more barrier wall structure, for the sake of simplicity, this hair
Bright embodiment is illustrated using two adjacent barrier wall structures as example.
It should be noted that at least part barrier wall structure is packaged film covering, for example, packaging film can cover all
Barrier wall structure, can also all cover the barrier wall structure close to viewing area, all between covering barrier wall structures, partly cover non-
The barrier wall structure of edge of display area.For simplicity, in the embodiment of the present invention, the gear close to viewing area is covered with packaging film
Illustrated exemplified by between wall construction and covering barrier wall structure.
It should be noted that above-mentioned packaging film at least includes one layer of inorganic layer and one layer of organic layer, the embodiment of the present invention
In illustrated so that packaging film includes one layer of organic layer and two layers of inorganic layer as an example.
It should be noted that at least one layer of inorganic layer covering organic dielectric layer of packaging film, for the sake of simplicity, the present invention is real
Shi Zhong, is illustrated by taking two layers of inorganic layer covering organic dielectric layer that packaging film includes as an example.
Optionally, a kind of flexible organic LED display panel provided in an embodiment of the present invention, as shown in figure 4, main
Including：
Substrate 1, the substrate includes viewing area A and non-display area B, is arranged at the viewing area A of substrate 1 organic luminescent device
2, the packaging film of organic luminescent device 2 is covered, and be arranged at the non-display area B of substrate 1 the first barrier wall structure 3 and second
Barrier wall structure 4, is arranged at intervals between the first adjacent barrier wall structure 3 and the second barrier wall structure 4；Wherein, packaging film includes
Machine layer 62, the first inorganic layer 61, the second inorganic layer 63, the first inorganic layer 61 covering organic luminescent device 2 also covers the first barricade
Interval between structure 3, and the first barrier wall structure 3 and the second barrier wall structure 4, organic layer 62 is formed in the first inorganic layer 61
Upper surface, and the covering organic luminescent device 2 of organic layer 62, the second inorganic layer 63 covering inorganic layer 61 of organic layer 62 and first, also
Cover the interval between the first barrier wall structure 3, and the first barrier wall structure 3 and the second barrier wall structure 4, the first adjacent barricade knot
It is arranged at intervals between the barrier wall structure 4 of structure 3 and second；Above-mentioned flexible organic LED display panel is also adjacent including being arranged at
The first barrier wall structure 3 and the second barrier wall structure 4 between organic dielectric layer 5, organic dielectric layer 5 is arranged at non-on substrate 1
On the B of viewing area, organic dielectric layer is covered by the first inorganic layer 61 and the second inorganic layer 63.
It is inorganic due to being provided with organic dielectric layer 5, first between adjacent the first barrier wall structure 3 and the second barrier wall structure 4
Layer 61 and second inorganic layer 63, and organic dielectric layer covered by least one layer in the first inorganic layer 61 and the second inorganic layer 63
Lid, when repeatedly being bent at the edge of flexible organic LED display panel, organic dielectric layer 5 effectively can absorb or buffer
The stress that first inorganic layer 61 and the second inorganic layer 63 are produced in multiple bending, it is to avoid adjacent the first barrier wall structure 3 and the
Cracked between two barrier wall structures 4, and then avoid the first adjacent barrier wall structure 3,4 pairs of organic hairs of flexibility of the second barrier wall structure
The barrier effect failure of the side moisture or oxygen of optical diode display panel.
In optional embodiment, the film layer of packaging film is not limited to above-mentioned first inorganic layer 61, organic layer 62, second
Inorganic layer 63, the film layer of packaging film can at least include one layer of inorganic layer and one layer of organic layer, and organic layer covering display
Area A organic luminescent device 2, inorganic layer covering viewing area A organic luminescent device 2 and the covering of an at least inorganic layer are arranged at
Non-display area B partial retaining wall structure.
In optional embodiment, barrier wall structure is not limited to the first barrier wall structure 3 and the second barrier wall structure 4, and the non-of substrate shows
Show that area can be comprised at least between 2 barrier wall structures, two neighboring barrier wall structure to be arranged at intervals, wherein, at least part barricade knot
Structure is packaged film covering.
In optional embodiment, the organic dielectric layer on substrate between at least two neighboring barrier wall structure, ability
Field technique personnel can set barricade number according to real needs, and cover the number of plies of the inorganic layer of barricade, and the present invention is to this
It is not construed as limiting.
As shown in figure 5, being arranged at non-display area B the first barrier wall structure 3 and the first barrier wall structure 4 with around viewing area A
Mode set, the periphery of the first barrier wall structure 3 is the second barrier wall structure 4.
In optional embodiment, the first barrier wall structure 3 and the second barrier wall structure 4 can be by the organic of multilayer laminated setting
Film is constituted.
As shown in fig. 6, the first barrier wall structure 3 is by the floor portions 31, middle layer segment 32 and top layer portion 33 that are stacked
Constitute, the second barrier wall structure 4 is made up of the floor portions 41, middle layer segment 42 and top layer portion 43 being stacked.Wherein, first
Floor portions 31, middle layer segment 32 and the top layer portion 33 of barrier wall structure 3 are made up of identical or different organic material；Second
Floor portions 41, middle layer segment 42 and the top layer portion 43 of barrier wall structure 4 are made up of identical or different organic material.
In optional embodiment, the first barrier wall structure 3 and the second barrier wall structure 4 are to prepare viewing area A organic light emission
Made during device 2, organic luminescent device 2 includes Organic Light Emitting Diode and drives organic light-emitting diode
Driving element 20, Organic Light Emitting Diode includes first electrode 21, organic luminous layer 22 and second electrode 23, wherein, the first electricity
Pole 21 is anode, and second electrode 23 is negative electrode.Organic luminescent device 2 is produced on display function layer, and display function layer is flexible
The function film layer of organic LED display panel, display function layer includes setting gradually along the direction close to packaging film
Planarization layer 8, pixel defining layer 9 and spacer layer (not shown).Display function layer covering driving element 20.
In the embodiment of the present invention, the floor portions 31 of the first barrier wall structure 3, the floor portions 41 of the second barrier wall structure 4 with
Planarization layer 8 is made with layer, the middle layer segment 32 of the first barrier wall structure 3, the middle layer segment 42 and picture of the second barrier wall structure 4
Element defines layer 9 and is made with layer, the top layer portion 43 of the barrier wall structure 4 of top layer portion 43 and second of the first barrier wall structure 3 with
Spacer layer is made with layer.
In alternative embodiment, floor portions 31, middle layer segment 32 that above-mentioned organic dielectric layer 5 can be with the first barrier wall structure 3
Set with any portion in top layer portion 33 with layer.For example, in order to simplify preparation technology, can be by organic dielectric layer 5 and
The floor portions 31 of the closest substrate 1 of one barrier wall structure 3 are set with layer.
In alternative embodiment, organic dielectric layer is connected with each other with two adjacent barrier wall structures respectively, as shown in fig. 7, having
Machine dielectric layer 5 is connected with each other with the first barrier wall structure 3, the second barrier wall structure 4.Based on this, packaging film it is at least one layer of inorganic
Layer can directly overlay the upper surface of organic dielectric layer 5, repeatedly curved at the edge of flexible organic LED display panel
During folding, organic dielectric layer 5 can effectively be absorbed or at least one layer of inorganic layer of buffering package film is produced in multiple bending
Stress, it is to avoid cracked between the first barrier wall structure 3 and the second barrier wall structure 4.
In alternative embodiment, the organic dielectric layer between two neighboring barrier wall structure is arranged on, with one of barricade knot
Structure is connected, and is arranged at intervals with another barrier wall structure.
Alternatively, at least one interval setting in the barrier wall structure 3 of organic dielectric layer 5 and first, the second barrier wall structure 4.
Wherein, organic dielectric layer 5 with the first barrier wall structure 3, the second barrier wall structure 4 at least one is spaced good
Place is：
Because the first barrier wall structure 3, the barrier wall structure 4 of organic dielectric layer 5 and second are all organic layers, if organic dielectric layer
5 and first barrier wall structure 3 and the second barrier wall structure 4 be all connected with each other, water that organic dielectric layer 5 will easily in absorption air,
The foreign matters such as oxygen, because the transmission path that foreign matter enters viewing area by barrier wall structure is very short, these foreign matters can penetrate into display quickly
Area, in order to avoid such case, by between at least one in the barrier wall structure 3 of organic dielectric layer 5 and first, the second barrier wall structure 4
Every setting, so, when forming packaging film, at least one layer of inorganic layer of packaging film will fill organic dielectric layer 5 and the
The inorganic layer of filling effectively can stop in air in interval between one barrier wall structure 3 and/or the second barrier wall structure 4, interval
The foreign matter such as water, oxygen towards viewing area infiltration.
Optionally, as shown in figure 8, organic dielectric layer 5 is connected with the first barrier wall structure 3, the barricade of organic dielectric layer 5 and second
Structure 4 is arranged at intervals, wherein, the second barrier wall structure 4 is proximate to the barrier wall structure at the edge of substrate 1.Based on this, packaging film is extremely
Few one layer of inorganic layer can be covered in the upper surface of organic dielectric layer 5, can also cover the barrier wall structure of organic dielectric layer 5 and second
Interval between 4.
As shown in figure 9, organic dielectric layer 5 is connected with the first barrier wall structure 3, between the barrier wall structure 4 of organic dielectric layer 5 and second
When setting, the first inorganic layer 61 and the second inorganic layer 63 of packaging film are not placed only in the upper surface of organic dielectric layer 5, also
The interval between the barrier wall structure 4 of organic dielectric layer 5 and second is covered, because the interval is inorganic close to the edge of substrate 1, first
The inorganic layer 63 of layer 61 and second can be good at stopping foreign matter beyond the second barrier wall structure 4, be covered in the in interval
One inorganic layer 61 and the second inorganic layer 63 have blocked the path that foreign matter permeates towards viewing area.
Optionally, as shown in Figure 10, organic dielectric layer 5 and the first adjacent barrier wall structure 3 and the second barrier wall structure 4 between
Every setting.Based on this, at least one layer of inorganic layer of packaging film can be covered in the upper surface of organic dielectric layer 5, can also cover
The interval of lid organic dielectric layer 5 respectively between the first barrier wall structure 3, the second barrier wall structure 4.
As shown in figure 11, when the barrier wall structure 3 of organic dielectric layer 5 and first, the second barrier wall structure 4 are all arranged at intervals, encapsulation
The first inorganic layer 61 and the second inorganic layer 63 of film are not placed only in the upper surface of organic dielectric layer 5, also covers organic Jie
Interval between matter layer 5 and the first barrier wall structure 3, the second barrier wall structure 4, due to adding the quantity at interval, the first inorganic layer
61 and second inorganic layer 63 can be good at stopping foreign matter beyond the second barrier wall structure 4, be covered in first in interval
The inorganic layer 63 of inorganic layer 61 and second has blocked the path that foreign matter permeates towards viewing area.Due to the quantity increase at interval, covering
The first inorganic layer 61 and the second inorganic layer 63 in interval have strengthened the blocking effect of foreign matter.
In optional embodiment, at least one groove and/or at least one impenetrating thickness side are provided with organic dielectric layer 5
To opening.
Optionally, the shape of the opening on the opening shape of groove, impenetrating thickness direction can be V-type, rectangle, Huo Zheqi
At least one of his shape.
As shown in figure 12, the opening 12 on a groove 11 and an impenetrating thickness direction is provided with organic dielectric layer 5,
Groove 11 is set close to the second barrier wall structure 4, and the opening shape of groove 11 is that the opening 12 on V-arrangement, impenetrating thickness direction is close
First barrier wall structure 3 sets, and opening 12 is shaped as rectangle.Based on this, when forming packaging film, at least the one of packaging film
Layer inorganic layer can cover these grooves 11 and opening 12, and these grooves 11 and opening 12 can increase inorganic in packaging film
The contact area of layer and organic dielectric layer 5, not only allows organic dielectric layer 5 preferably to absorb and buffer inorganic dielectric layer and exists
The stress repeatedly produced during bending, moreover it is possible to strengthen the inorganic layer being covered in these grooves 11 and opening 12 to the second barrier wall structure
The blocking effect of foreign matter beyond 4.
In optional embodiment, any of the above-described flexible organic LED display panel also includes：It is arranged at least phase
The protective layer on packaging film between adjacent two barrier wall structures.Wherein, protective layer can be covered between two barrier wall structures
Packaging film, can also cover in two barrier wall structures close to non-display area edge barrier wall structure, barricade can also be covered
On substrate beyond structure.Optionally, as shown in Figure 13 and Figure 14, protective layer 7 is arranged on the first barrier wall structure 3 and the second barricade
Between structure 4, and directly overlay on the second inorganic layer 63 of packaging film.Because protective layer 7 is arranged on the first barricade
Between the barrier wall structure 4 of structure 3 and second, protective layer 7 is directly contacted with the second inorganic layer 63, organic dielectric layer 5 and first inorganic
Layer 61 is directly contacted, and protective layer 7 can absorb and buffer the stress that the second inorganic layer 63 is produced in multiple bending, organic media
Layer 5 can absorb and buffer the stress that the first inorganic layer 61 is produced in multiple bending, it is to avoid the first inorganic layer 61 and the second nothing
Machine layer 63 is directly contacted, and is easily produced stress concentration and is produced bending crackle.
Optionally, the material of protective layer 7 can be ink or colloid.
In optional embodiment, protective layer can also be provided between the first barrier wall structure 3 and the second barrier wall structure 4 first
On inorganic layer 61, protective layer is set to be located between the first inorganic layer 61 and the second inorganic layer 63, so as to avoid in the first barricade knot
Two layers of inorganic layer is directly contacted between the barrier wall structure 4 of structure 3 and second, is alleviated the stress of inorganic interlayer, is prevented Crack Extension.
In optional embodiment, as shown in figure 15, protective layer 7 is except the first barrier wall structure 3 of covering and the second barrier wall structure 4
Between the surface of the second inorganic layer 63, be also covered in the surface of the second barrier wall structure 4, and be covered in the second barrier wall structure 4 with
On outer substrate 1.So, protective layer 7 be except that can absorb and alleviate the stress that the second inorganic layer 63 is produced in multiple bending,
The stress that the substrate 1 that the periphery of the first barrier wall structure 3 can also be absorbed is produced when being cut, in order to avoid the periphery of the first barrier wall structure 3
Cutting crackle is produced on substrate 1, and prevents cutting crackle from being extended towards viewing area.
Based on identical inventive concept, the embodiment of the present invention provides a kind of display device, including any of the above-described kind of flexibility has
Machine LED display panel so that when the edge of display device is repeatedly bent, the first barrier wall structure 3 and the second barrier wall structure
The folding s tress for the inorganic filled between 4 is absorbed by organic dielectric layer 5, it is to avoid the first barrier wall structure 3 and the second barricade knot
Cracked between structure 4.
Based on identical inventive concept, the embodiment of the present invention provides a kind of system of flexible organic LED display panel
Make method, including：
Step S1 includes viewing area and non-display area there is provided a substrate 1, substrate 1；
Wherein, the substrate that step S1 is provided refers to that viewing area has formed the base of each driving element of display function layer
Gate insulator on plate, such as substrate, and each switching thin-film transistor on gate insulator is formed, driving film is brilliant
Body pipe, and the gate drive signal cabling and source drive signal lead being connected with each driving element etc..
Step S2, organic luminescent device 2 is formed in the viewing area of substrate 1, wherein, forming the system of organic luminescent device 2
Cheng Zhong, in the non-display area at least two spaced barrier wall structures of formation of substrate 1, and at least two neighboring barricade knot
Organic dielectric layer 5 is formed between structure；
Organic luminescent device includes driving element, display function layer and the organic light emission being formed on display function layer
Diode, display function layer includes planarization layer, pixel defining layer and the spacer layer set gradually along the direction away from substrate.
And barrier wall structure includes the floor portions, middle layer segment and the top layer portion that are stacked, the floor portions of barrier wall structure with it is flat
Change layer to be made with layer, middle layer segment and the pixel defining layer of barrier wall structure are made with layer, the top layer portion of barrier wall structure
Divide and be made with spacer layer with layer.In addition, the organic dielectric layer between barrier wall structure can be with barrier wall structure bottom portion
Point, any portion in middle layer segment and top layer portion is made with layer.
Step S3, forms packaging film on substrate 1, and packaging film at least covers organic luminescent device 2 and partial retaining wall
Structure；Wherein, packaging film is formed on substrate 1, including forms at least one layer of organic layer on substrate 1 and at least one layer is inorganic
Layer.So, due to being filled with least one layer of inorganic layer of organic dielectric layer and packaging film in the interval between barrier wall structure, envelope
At least one layer of inorganic layer for filling film covers above-mentioned organic dielectric layer and covered between above-mentioned organic dielectric layer and barrier wall structure
Interval.Therefore, when repeatedly being bent at the edge of flexible organic LED display panel, it is arranged at two neighboring barricade knot
Organic dielectric layer between structure can effectively absorb or buffer the stress that inorganic layer is produced in multiple bending, it is to avoid barrier wall structure
Between crack, and then avoid barrier wall structure from failing the barrier effect of display device side moisture or oxygen.
It should be noted that the barrier wall structure in above method flow includes two or more barrier wall structure,
For the sake of simplicity, the embodiment of the present invention is illustrated using two adjacent barrier wall structures as example.
It should be noted that at least part barrier wall structure in above method flow is packaged film covering, for example, encapsulation
Film can cover all barrier wall structures, can also all cover the barrier wall structure close to viewing area, all covering barricade knot
Between structure, the barrier wall structure at part covering non-display area edge.For simplicity, in the embodiment of the present invention, with packaging film
Illustrated exemplified by between the barrier wall structure and covering barrier wall structure of the close viewing area of covering.
It should be noted that the packaging film in above method flow at least includes one layer of inorganic layer and one layer of organic layer,
Illustrated in the embodiment of the present invention so that packaging film includes one layer of organic layer and two layers of inorganic layer as an example.
It should be noted that at least one layer of inorganic layer covering organic dielectric layer of the packaging film in above method flow,
For the sake of simplicity, during the present invention is implemented, being illustrated by taking two layers of inorganic layer covering organic dielectric layer that packaging film includes as an example.
The embodiment of the present invention is respectively the first barrier wall structure 3 and the second barrier wall structure 4 with two neighboring barrier wall structure below,
And first barrier wall structure 3 surrounded by the second barrier wall structure 4, and packaging film includes one layer of organic layer and two layers of inorganic layer and is
Example, is illustrated to above method flow, wherein, above-mentioned steps S2 is specifically included：
Step S20：The first organic film C is formed on substrate 1, based on the first organic film C, by patterning processes in viewing area
Planarization layer 8 is formed, in the bottom portion of the barrier wall structure 4 of floor portions 31 and second of non-display area the first barrier wall structure 3 of formation
Divide 41.
Optionally, the structure of step S20 formation is referring to Figure 16, including is formed at the planarization layer 8 of the viewing area of substrate 1,
Also include the floor portions for being formed at the barrier wall structure of floor portions 31 and second of the first barrier wall structure of the non-display area of substrate 1
41.Wherein, the driving element 20 of the covering of planarization layer 8 display function layer, planarization layer 8, the floor portions of the first barrier wall structure
31 and second the floor portions 41 of barrier wall structure be made with layer.
Optionally, such as Figure 16, based on the first organic film C, by patterning processes in the first barrier wall structure 3 and the second barricade knot
Organic dielectric layer 5 is formed between structure 4 so that floor portions 31, the second barricade knot of the barrier wall structure 3 of organic dielectric layer 5 and first
The floor portions 41 of structure 4 are made with layer.
Optionally, the thickness of organic dielectric layer 5 can be with the floor portions 31 of the first barrier wall structure, the second barrier wall structure
The thickness of floor portions 41 is identical, can also be different.
Step S21：The first electrode of each Organic Light Emitting Diode is formed on the surface of substrate 1 in planarization layer 8
21。
Wherein, first electrode 21 is the anode (or negative electrode) of Organic Light Emitting Diode, also makes and connects on planarization layer 8
Contact hole so that the first electrode 21 of each Organic Light Emitting Diode by the electrode of contact hole and corresponding driving element 20 (such as
Drain electrode) connection.
Optionally, the structure of step S21 formation is referring to Figure 17, except the planarization of the viewing area including being formed at substrate 1
Layer 8, is formed at the floor portions of the barrier wall structure of floor portions 31 and second of the first barrier wall structure of the non-display area of substrate 1
Outside 41, and organic dielectric layer 5, in addition to the first electrode 21 being formed on planarization layer 8.
Step S22：The second organic film D is formed on substrate 1, based on the second organic film D, by patterning processes, in display
Area forms pixel defining layer 9, in the barrier wall structure 4 of middle layer segment 32 and second of non-display area the first barrier wall structure 3 of formation
Layer segment 42.
Wherein, pixel defining layer 9 is used for defining each pixel, and two grades of each organic light emission of covering of pixel defining layer 9
The first electrode 21 of pipe.
Optionally, the structure of step S22 formation is referring to Figure 18, except the planarization of the viewing area including being formed at substrate 1
Layer 8 and first electrode 21, are formed at the barrier wall structure of floor portions 31 and second of the first barrier wall structure of the non-display area of substrate 1
Floor portions 41, outside organic dielectric layer 5, in addition to be formed at the pixel defining layer 9 of the viewing area of substrate 1, and formed
In the middle layer segment 42 of the barrier wall structure of middle layer segment 32 and second of the first barrier wall structure of the non-display area of substrate 1.
Optionally, based on the second organic film D, according to patterning processes, the first barrier wall structure 3 and the second barrier wall structure are also formed
Organic dielectric layer 5 between 4 so that the middle layer segment 32 of the barrier wall structure 3 of organic dielectric layer 5 and first, the second barrier wall structure 4
Middle layer segment 42 is made with layer.Wherein, planarization layer 8, the floor portions 31 of the first barrier wall structure, the second barrier wall structure
Film layer where floor portions 41 is all the first organic film C, pixel defining layer, the middle layer segment 32, second of the first barrier wall structure
Film layer where the middle layer segment 42 of barrier wall structure is all the second organic film D.Optionally, the thickness of organic dielectric layer 5 can be with
The middle layer segment 32 of first barrier wall structure 3, the middle layer segment 42 of the second barrier wall structure 4 thickness it is identical, can also be different.
Step S23：The 3rd organic film E is formed on substrate 1, based on the 3rd organic film E, by patterning processes, in display
Area forms spacer layer (not shown) and organic luminous layer 22, in the top layer portion 33 of non-display area the first barrier wall structure 3 of formation
With the top layer portion 43 of the second barrier wall structure 4.
Wherein, spacer layer formation deviates from the side of substrate 1 in pixel defining layer 9, and spacer layer is located at second electrode and the
Between one electrode.Wherein, organic luminous layer 22 is formed between adjacent pixel defining layer 9.
Optionally, the structure of step S23 formation is referring to Figure 19, except the planarization of the viewing area including being formed at substrate 1
Layer 8, first electrode 21, pixel defining layer 9, organic luminous layer 22, are formed at the first barrier wall structure of the non-display area of substrate 1
In floor portions 31, the floor portions 41 of the second barrier wall structure, the middle layer segment 32 of the first barrier wall structure, the second barrier wall structure
Outside layer segment 42, organic dielectric layer 5, in addition to：Spacer layer of the pixel defining layer 9 away from the side of substrate 1 is formed at (not show
Go out) and organic luminous layer 22, and it is formed at the top layer portion 33 and second gear of the first barrier wall structure of the non-display area of substrate 1
The top layer portion 43 of wall construction.
Optionally, based on the 3rd organic film E, according to patterning processes, the first barrier wall structure 3 and the second barrier wall structure are also formed
Organic dielectric layer 5 between 4 so that the barrier wall structure 3 of organic dielectric layer 5 and first, the same layer of top layer portion of the second barrier wall structure 4
It is made.Wherein, where the floor portions 41 of planarization layer 8, the floor portions 31 of the first barrier wall structure, the second barrier wall structure
Film layer be all the first organic film C, pixel defining layer 9, the middle layer segment 32 of the first barrier wall structure, the middle level of the second barrier wall structure
Film layer where part 42 is all the second organic film D, organic dielectric layer 5, spacer layer, the top layer portion of the first barrier wall structure
33rd, the film layer where the top layer portion 43 of the second barrier wall structure is all the 3rd organic film E.Optionally, the first organic film C, second
Organic film D, the material of the 3rd organic film be can be the same or different, and this present invention is not limited.
Optionally, the thickness of organic dielectric layer 5 can be with the top layer portion 33 of the first barrier wall structure, the second barrier wall structure
The thickness of top layer portion 43 is identical, can also be different.
Step S24：The second electricity of each Organic Light Emitting Diode is formed on the surface of substrate 1 in pixel defining layer 9
Pole 23.
Wherein, second electrode 23 covers the organic luminous layer 22 of Organic Light Emitting Diode, and second electrode 23 is organic light emission
The negative electrode (or anode) of diode.
Optionally, the structure of step S23 formation is referring to Figure 20, except the planarization of the viewing area including being formed at substrate 1
Layer 8, first electrode 21, pixel defining layer 9, organic luminous layer 22 are formed at the first barrier wall structure of the non-display area of substrate 1
In floor portions 31, the floor portions 41 of the second barrier wall structure, the middle layer segment 32 of the first barrier wall structure, the second barrier wall structure
Outside layer segment 42, organic dielectric layer 5, in addition to it is formed at the second electrode 23 that pixel defining layer 9 deviates from the side of substrate 1.
Optionally, also include after step S24：
After the formation of second electrode 23, it can also form coating away from the surface of substrate 1 in second electrode 23 and (not show
Go out), coating is used to protect second electrode, prevents that second electrode 23 is by the water in air, oxygen etc. before packaging film is formed
Foreign matter is damaged.
Optionally, step S3 is specifically included：
Step S31：The first inorganic layer 61 is formed away from the side of substrate 1 in organic luminescent device 2, the first inorganic layer 61 covers
The organic luminescent device 2 of lid viewing area, the first barrier wall structure 3 and organic dielectric layer 5.
Such as Figure 21, organic luminescent device 2, the first barrier wall structure 3, the second barrier wall structure are formd on the substrate 1 of offer
4, and the organic dielectric layer 5 between the first barrier wall structure 3 and the second barrier wall structure 4, organic dielectric layer 5 is and first gear
Wall construction 3, the second barrier wall structure 4 are connected, on this basis, form the first inorganic layer 61, make the covering display of the first inorganic layer 61
The organic luminescent device 2 in area, having between the first barrier wall structure 3, and the first barrier wall structure 3 of covering and the second barrier wall structure 4
Machine dielectric layer 5.
Step S32：Organic layer 62 is formed away from the side of substrate 1 in the first inorganic layer 61, organic layer 62 only covers display
The organic luminescent device 2 in area, the first barrier wall structure 3 of non-display area is not covered, so that organic layer 62 is by the first barricade knot
Structure 3 stops that organic layer 62 be used to increase the flow channel for having permeated foreign matter, even if infiltration has foreign matter, organic layer 62 has foot
Enough thickness is so that the surface of the first inorganic layer 61 keeps flat.
Such as Figure 22, organic layer 62 is formed away from the side of substrate 1 in the first inorganic layer 61, organic layer 62 is covered viewing area
Organic luminescent device 2, and organic layer 62 stopped by the first barrier wall structure 3 of non-display area.
Step S33：The second inorganic layer 63 is formed away from the side of substrate 1 in organic layer 62, the second inorganic layer 63 is formed
Organic layer 62 is on the side of substrate 1, so as to which organic inorganic layer 61 of layer 62 and first, the second inorganic layer 63 also edge is completely covered
The surface of first inorganic layer 61 on the surface of the first barrier wall structure 3 is formed, until being filled in the first barrier wall structure 3 and the second barrier wall structure
Between 4, and stopped by the second barrier wall structure 4.
Such as Figure 23, the second inorganic layer 63 is formed away from the side of substrate 1 in organic layer 62 so that the second inorganic layer 63 is covered
First inorganic layer 61 and organic layer 62.Because the first inorganic layer 61 covers the organic luminescent device 2 of viewing area, the first barrier wall structure
Organic dielectric layer 5 between 3, and the first barrier wall structure 3 and the second barrier wall structure 4, therefore, the second inorganic layer 63 also cover aobvious
Show the organic luminescent device 2 in area, it is organic between the first barrier wall structure 3, and the first barrier wall structure 3 and the second barrier wall structure 4
Dielectric layer 5.
So, organic dielectric layer 5, have been sequentially filled in the interval between the first barrier wall structure 3 and the second barrier wall structure 4
One inorganic layer 61 and the second inorganic layer 63, when repeatedly being bent at the edge of flexible organic LED display panel, the first nothing
The stress that machine layer 61 and the second inorganic layer 63 are produced is absorbed by organic dielectric layer 5, and then prevents flexible organic light-emitting diodes
The edge of pipe display panel is cracked when repeatedly bending.Optionally, any organic dielectric layer for being formed in above-mentioned steps
5, the position relationship of itself and the first barrier wall structure 3, the second barrier wall structure 4 can have following several：
The first：Organic dielectric layer 5 is connected with each other with the first barrier wall structure 3 and the second barrier wall structure 4 respectively.
Second：Organic dielectric layer 5 is connected with the first barrier wall structure 3, is arranged at intervals with the second barrier wall structure 4.
The third：Organic dielectric layer 5 is connected with the second barrier wall structure 4, is arranged at intervals with the first barrier wall structure 3.
4th kind：It is arranged at intervals between organic dielectric layer 5 and the first adjacent barrier wall structure 3 and the second barrier wall structure 4.
The particular content of above-mentioned several position relationships is not repeated herein referring to above-described embodiment.
When the barrier wall structure 3 of organic dielectric layer 5 and first, the second barrier wall structure 4 position relationship for it is above-mentioned the first when, the
One barrier wall structure 3, the barrier wall structure 4 of organic dielectric layer 5 and second are all the foreign matters such as water, oxygen in organic layer, easy absorption air,
And be easy to these foreign matters penetrating into viewing area as passage.
Optionally, organic dielectric layer 5 is made to be set with least one interval in the first barrier wall structure 3, the second barrier wall structure 4
Put, i.e., the barrier wall structure 3 of organic dielectric layer 5 and first, the second barrier wall structure 4 position relationship for more than second, the third
Or at the 4th kind, make the first inorganic layer 61 and the second inorganic layer 63 be filled in the barrier wall structure 3 of organic dielectric layer 5 and first and/or
In interval between second barrier wall structure 4, the first inorganic layer 61 and the second inorganic layer 63 being filled in interval can effectively hinder
The foreign matters such as water, the oxygen kept off in air permeate towards viewing area.
Optionally, for above-mentioned steps S20, step S22 for step S24, after organic dielectric layer 5 is formed, is also wrapped
Include：At least one groove is etched on organic dielectric layer 5, or at least one impenetrating thickness side is etched on organic dielectric layer 5
To opening, or also etch the opening in impenetrating thickness direction while etching on organic dielectric layer 5 groove.Make first
The inorganic layer 63 of inorganic layer 61 and second is filled in the opening of organic dielectric layer 5 or groove, fill organic dielectric layer 5 opening or
The first inorganic layer 61 and the second inorganic layer 63 in groove can effectively stop that the foreign matters such as water, the oxygen in air ooze towards viewing area
Thoroughly.
Wherein, the particular content of etched recesses or opening, referring to above-described embodiment, no longer tires out herein on organic dielectric layer 5
State.
After step S33, in addition to：
Step S4：Protective layer 7 is formed on packaging film, protective layer 7, which is at least covered, is formed at the first adjacent barricade knot
The upper surface of packaging film between the barrier wall structure 4 of structure 3 and second.
Optionally, protective layer 7 covers second be formed between the first adjacent barrier wall structure 3 and the second barrier wall structure 4
The upper surface of inorganic layer 63.Because protective layer 7 is arranged between the first barrier wall structure 3 and the second barrier wall structure 4, protective layer 7 with
Second inorganic layer 63 is directly contacted, and organic dielectric layer 5 is directly contacted with the first inorganic layer 61, aobvious in flexible Organic Light Emitting Diode
When showing that the edge of panel is repeatedly bent, protective layer 7 can absorb and buffer what the second inorganic layer 63 was produced in multiple bending
Stress, organic dielectric layer 5 can absorb and buffer the stress that the first inorganic layer 61 is produced in multiple bending, it is to avoid first is inorganic
The inorganic layer 63 of layer 61 and second is directly contacted, and is easily produced stress concentration and is produced bending crackle.
Optionally, protective layer 7 also covers the barrier wall structure near the edge of substrate 1.Protective layer 7 is not placed only in first gear
The upper surface of the second inorganic layer 63 between the barrier wall structure 4 of wall construction 3 and second, also cover the surface of the second barrier wall structure 4 and
The surface of substrate 1 of the periphery of second barrier wall structure 4.Protective layer 7 is repeatedly being bent except that can absorb and alleviate the second inorganic layer 63
When the stress that produces, the stress that the substrate 1 that can also absorb the periphery of the first barrier wall structure 3 is produced when being cut, in order to avoid first gear
Cutting crackle is produced on the substrate 1 of the periphery of wall construction 3, and prevents cutting crackle from being extended towards viewing area.
Obviously, those skilled in the art can carry out various changes and modification without departing from this Shen to the embodiment of the present invention
Spirit and scope please.So, if these modifications and variations of the embodiment of the present invention belong to the application claim and its waited
Within the scope of technology, then the application is also intended to comprising including these changes and modification.
Claims (24)
1. a kind of flexible organic LED display panel, it is characterised in that including：
Substrate, includes viewing area and non-display area；
Organic luminescent device, is arranged at the viewing area of the substrate；
Packaging film, covers the organic luminescent device, and the packaging film is inorganic comprising an at least organic layer and at least one
Layer；
At least two barrier wall structures, between being arranged between the non-display area of the substrate, the two neighboring barrier wall structure
Every setting, wherein, at least partly described barrier wall structure is covered by the packaging film；
Also include：The organic dielectric layer between at least two neighboring barrier wall structure is arranged at, the organic dielectric layer is set
On the substrate, wherein, the organic dielectric layer is covered by least one layer of inorganic layer.
2. flexibility organic LED display panel as claimed in claim 1, it is characterised in that the organic dielectric layer point
It is not connected with each other with two adjacent barrier wall structures.
3. flexibility organic LED display panel as claimed in claim 1, it is characterised in that be arranged on two neighboring institute
The organic dielectric layer between barrier wall structure is stated, is connected with barrier wall structure one of them described, with barricade knot another described
Structure is arranged at intervals.
4. flexibility organic LED display panel as claimed in claim 3, it is characterised in that the organic dielectric layer with
It is arranged at intervals between the barrier wall structure of the adjacent close substrate edges.
5. flexibility organic LED display panel as claimed in claim 1, it is characterised in that be arranged on two neighboring institute
State and be arranged at intervals between the organic dielectric layer between barrier wall structure and the two neighboring barrier wall structure.
6. the flexible organic LED display panel as described in claim any one of 1-5, it is characterised in that described in each
Barrier wall structure is made up of the organic film of multilayer laminated setting；The organic dielectric layer is set with least one layer of organic film with layer
Put.
7. flexibility organic LED display panel as claimed in claim 6, it is characterised in that the organic dielectric layer with
The organic film of the closest substrate is set with layer.
8. the flexible organic LED display panel as described in claim any one of 1-5, it is characterised in that described organic
Dielectric layer has at least one groove and/or the opening at least one impenetrating thickness direction.
9. flexibility organic LED display panel as claimed in claim 8, it is characterised in that also including protective layer；Institute
State protective layer and at least cover the inorganic layer between the two neighboring barrier wall structure.
10. flexibility organic LED display panel as claimed in claim 9, it is characterised in that the protective layer also covers
Cover the barrier wall structure near the substrate edges.
11. flexibility organic LED display panel as claimed in claim 9, it is characterised in that the material of the protective layer
Matter is ink or colloid.
12. flexibility organic LED display panel as claimed in claim 9, it is characterised in that the packaging film
At least one layer of inorganic layer covers the opening and/or groove.
13. a kind of display device, it is characterised in that including：Flexible organic light emission two as described in claim any one of 1-12
Pole pipe display panel.
14. a kind of preparation method of flexible organic LED display panel, it is characterised in that including：
A substrate is provided, the substrate includes viewing area and non-display area；
Organic luminescent device is formed in the viewing area of the substrate, wherein, forming the processing procedure of the organic luminescent device
In the substrate the non-display area at least two spaced barrier wall structures of formation, and at least two neighboring institute
State and form organic dielectric layer between barrier wall structure；
Packaging film is formed away from the side of the substrate in the organic luminescent device, the packaging film covering is described organic
Luminescent device, wherein, the packaging film includes at least one layer of organic layer and at least one layer of inorganic layer, and at least one layer is inorganic
The layer covering organic dielectric layer.
15. preparation method as claimed in claim 14, it is characterised in that form organic hair in the viewing area of the substrate
Optical device, including：
The viewing area on the substrate forms planarization layer；
The first electrode of the organic luminescent device is formed on the surface of the substrate in the planarization layer；
The viewing area on the substrate forms pixel defining layer, wherein, pixel defining layer covering first electricity
Pole；
Spacer layer is formed away from the side of the substrate and prepare the organic luminescent device in the pixel defining layer
Organic luminous layer；
The second electrode of the organic luminescent device is formed on the surface of the substrate in the pixel defining layer.
16. preparation method as claimed in claim 15, it is characterised in that in the processing procedure for forming the organic luminescent device
The non-display area at least two spaced barrier wall structures of formation of the substrate, including：
When forming the planarization layer, the floor portions of each barrier wall structure are formed；
When forming the pixel defining layer, the middle layer segment of each barrier wall structure is formed；
When forming the spacer layer, the top layer portion of each barrier wall structure is formed.
17. preparation method as claimed in claim 16, it is characterised in that the shape between at least two neighboring barrier wall structure
Into organic dielectric layer, including：
At least one in the floor portions, the middle layer segment, the top layer portion of each barrier wall structure are formed
During layer, the organic dielectric layer is formed.
18. preparation method as claimed in claim 17, it is characterised in that forming the bottom of each barrier wall structure
During part, the organic dielectric layer is formed.
19. preparation method as claimed in claim 17, it is characterised in that the shape between at least two neighboring barrier wall structure
During into organic dielectric layer, the position relationship of the organic dielectric layer and at least two neighboring barrier wall structure is：
The organic dielectric layer is connected with each other with two adjacent barrier wall structures respectively；Or,
The organic dielectric layer is connected with barrier wall structure one of them described, is arranged at intervals with barrier wall structure another described；Or
Person,
It is arranged at intervals between the organic dielectric layer and the two neighboring barrier wall structure.
20. preparation method as claimed in claim 19, it is characterised in that the organic dielectric layer and one of them described barricade
When spacing structure is set, it is arranged at intervals between the barrier wall structure of the organic dielectric layer and the adjacent close substrate edges.
21. the preparation method as any one of claim 14 to 20, it is characterised in that forming the organic dielectric layer
Afterwards, in addition to：
A groove and/or the opening at least one impenetrating thickness direction are etched on the organic dielectric layer.
22. preparation method as claimed in claim 21, it is characterised in that after the packaging film is formed, in addition to：
Form protective layer on the packaging film, the protective layer at least cover be formed at the two neighboring barrier wall structure it
Between the inorganic layer at least described in one upper surface.
23. preparation method as claimed in claim 22, it is characterised in that the protective layer is also covered near the substrate side
The barrier wall structure of edge.
24. preparation method as claimed in claim 21, it is characterised in that at least one layer of inorganic layer covers the opening
And/or groove.
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