CN106981584B - Flexible organic LED display panel, display device and preparation method thereof - Google Patents

Flexible organic LED display panel, display device and preparation method thereof Download PDF

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Publication number
CN106981584B
CN106981584B CN201710167007.6A CN201710167007A CN106981584B CN 106981584 B CN106981584 B CN 106981584B CN 201710167007 A CN201710167007 A CN 201710167007A CN 106981584 B CN106981584 B CN 106981584B
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layer
barrier
organic
substrate
dielectric layer
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CN106981584A (en
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金健
苏聪艺
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Shanghai Tianma AM OLED Co Ltd
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Shanghai Tianma AM OLED Co Ltd
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    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L51/00Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
    • H01L51/50Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof specially adapted for light emission, e.g. organic light emitting diodes [OLED] or polymer light emitting devices [PLED]
    • H01L51/52Details of devices
    • H01L51/5237Passivation; Containers; Encapsulation, e.g. against humidity
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L51/00Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
    • H01L51/50Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof specially adapted for light emission, e.g. organic light emitting diodes [OLED] or polymer light emitting devices [PLED]
    • H01L51/52Details of devices
    • H01L51/5237Passivation; Containers; Encapsulation, e.g. against humidity
    • H01L51/5253Protective coatings
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L51/00Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
    • H01L51/50Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof specially adapted for light emission, e.g. organic light emitting diodes [OLED] or polymer light emitting devices [PLED]
    • H01L51/56Processes or apparatus specially adapted for the manufacture or treatment of such devices or of parts thereof

Abstract

The invention discloses a kind of flexible organic LED display panels, display device and preparation method thereof, comprising: substrate includes viewing area and non-display area;Organic luminescent device is set to the viewing area of substrate;Packaging film covers organic luminescent device, and packaging film includes an at least organic layer and an at least inorganic layer;At least two barrier wall structures are set to the non-display area of substrate, are spaced setting between two neighboring barrier wall structure, wherein at least partly barrier wall structure is packaged film covering;Further include: the organic dielectric layer being set between at least two neighboring barrier wall structure, organic dielectric layer are disposed on the substrate, wherein organic dielectric layer is covered by least one layer of inorganic layer.Due to being filled with inorganic layer and organic dielectric layer between barrier wall structure, organic dielectric layer can effectively absorb the stress that inorganic layer is generated in multiple bending, avoid cracking between barrier wall structure.

Description

Flexible organic LED display panel, display device and preparation method thereof
Technical field
The present invention relates to field of display technology, in particular to a kind of flexible organic LED display panel, display dress Set and preparation method thereof.
Background technique
OLED flexible display apparatus is manufactured on flexible substrates, the flexible display device of changeable type, with low Power consumption, it is small in size, deformable the advantages that, can be applied to wider field.But OLED flexible display apparatus is in bending process In at the edge of panel be easy to produce crackle.
OLED flexible display apparatus includes the non-display area of the viewing area and non-display area on substrate, and viewing area includes shape At the organic luminescent device on substrate, in each organic luminescent device, it is brilliant that switching thin-film transistor, driving film can be formed Body pipe, storage capacitance and the Organic Light Emitting Diode OLED being connect with driving thin film transistor (TFT).
It is influenced to protect Organic Light Emitting Diode not by the foreign matter of such as moisture or oxygen, it will usually be formed on substrate The packaging film of Organic Light Emitting Diode is at least covered, but packaging film can not stop the side from OLED flexible display apparatus The foreign matter of face infiltration.Moisture or oxygen are permeated along side in order to prevent, and the barricade positioned at non-display area is usually also formed on substrate Structure.
OLED flexible display apparatus has flexible bending function, for example, repeatedly bending along bending mode shown in FIG. 1 When, the edge of display device is easy to produce crackle, and cause side barrier wall structure to fail the barrier effect of moisture or oxygen, therefore, This crackle is undesirable.
Summary of the invention
The embodiment of the present invention provides a kind of flexible organic LED display panel, display device and preparation method thereof, It is easy to produce crackle to solve edge bending place when OLED flexible display apparatus existing in the prior art is repeatedly bent, is caused The technical issues of barrier wall structure fails to the barrier effect of side moisture or oxygen.
The embodiment of the present invention provides a kind of flexible organic LED display panel, comprising:
Substrate includes viewing area and non-display area;
Organic luminescent device is set to the viewing area of the substrate;
Packaging film covers the organic luminescent device, and the packaging film includes an at least organic layer and at least one Inorganic layer;
At least two barrier wall structures, are set to the non-display area of the substrate, between the two neighboring barrier wall structure between Every setting, wherein at least partly described barrier wall structure is covered by the packaging film;
Further include: the organic dielectric layer being set between at least two neighboring barrier wall structure, the organic dielectric layer Setting is on the substrate, wherein the organic dielectric layer is covered by least one layer of inorganic layer.
In above-mentioned flexibility organic LED display panel, due to successively being filled out in the interval between adjacent barrier wall structure At least one layer of inorganic layer of organic dielectric layer and packaging film is filled, at least one layer of inorganic layer covering of packaging film is above-mentioned organic Interval between dielectric layer and the above-mentioned organic dielectric layer of covering and barrier wall structure.In flexible organic LED display panel Edge when repeatedly bending, being set to the organic dielectric layer between two neighboring barrier wall structure can effectively absorb or buffer inorganic The stress that layer is generated in multiple bending, avoids cracking between barrier wall structure, and then avoid barrier wall structure to display device The failure of the barrier effect of side moisture or oxygen.
The embodiment of the present invention provides a kind of display device, including any flexible organic light emission provided in an embodiment of the present invention Diode display panel.
The embodiment of the present invention provides also a kind of production method of flexible organic LED display panel, comprising:
A substrate is provided, the substrate includes viewing area and non-display area;
Organic luminescent device is formed in the viewing area of the substrate, wherein is forming the organic luminescent device At least two spaced barrier wall structures are formed in the non-display area of the substrate in processing procedure, and at least adjacent two Organic dielectric layer is formed between a barrier wall structure;
Packaging film is formed away from the side of the substrate in the organic luminescent device, described in packaging film covering Organic luminescent device, wherein the packaging film includes at least one layer of organic layer and at least one layer of inorganic layer, at least one layer Inorganic layer covers the organic dielectric layer.
In the flexible organic LED display panel of above-mentioned production method preparation, due between adjacent barrier wall structure Interval in be sequentially filled at least one layer of inorganic layer of organic dielectric layer and packaging film, at least one layer of packaging film is inorganic Layer covers the interval between above-mentioned organic dielectric layer and the above-mentioned organic dielectric layer of covering and barrier wall structure.In flexible organic light emission When the edge of diode display panel is repeatedly bent, the organic dielectric layer being set between two neighboring barrier wall structure can be effective The stress that inorganic layer is generated in multiple bending is absorbed or buffered, avoids cracking between barrier wall structure, and then avoid barricade Structure fails to the barrier effect of display device side moisture or oxygen.
Detailed description of the invention
Fig. 1 is the structural schematic diagram that a kind of OLED flexible display apparatus in the prior art is easy to happen crack position;
Fig. 2 is a kind of structural schematic diagram of OLED flexible display apparatus in the prior art;
Fig. 3 is a kind of structural schematic diagram of OLED flexible display apparatus in the prior art;
Fig. 4 to Figure 15 is the structural schematic diagram of flexible OLED display panel provided in an embodiment of the present invention;
Figure 16 to Figure 20 is the structural schematic diagram in the processing procedure for the flexible OLED display panel that inventive embodiments provide;
Figure 21 to Figure 23 is the knot in the processing procedure of the packaging film of flexible OLED display panel provided in an embodiment of the present invention Structure schematic diagram.
Specific embodiment
To make the above purposes, features and advantages of the invention more obvious and understandable, below in conjunction with attached drawing and implementation The present invention will be further described for example.However, example embodiment can be implemented in a variety of forms, and it is not understood as limited to Embodiment set forth herein;On the contrary, these embodiments are provided so that the present invention more comprehensively and completely, and by example embodiment party The design of formula is comprehensively communicated to those skilled in the art.Identical appended drawing reference indicates same or similar knot in figure Structure, thus repetition thereof will be omitted.The word of expression position and direction described in the present invention, is to be with attached drawing The explanation that example carries out, but can also make a change as needed, done change is all contained in the scope of the present invention.The present invention Attached drawing be only used for signal relative positional relationship, the thickness at certain positions uses the plotting mode lavished praise on oneself in order to understand, attached Thickness in figure does not represent the proportionate relationship of practical thickness.
It should be noted that elaborating detail in the following description to fully understand the present invention.But this hair Bright to be different from other way described herein with a variety of and be implemented, those skilled in the art can be without prejudice in the present invention Similar popularization is done in the case where culvert.Therefore the present invention is not limited by following public specific embodiment.Such as in specification and Some vocabulary has been used in claim to censure specific components.Those skilled in the art should understand that hardware manufacturer can The same component can be called with different nouns.This specification and claims are not with the difference of title as differentiation group The mode of part, but with the difference of component functionally as the criterion of differentiation.Such as in the whole text, specification and claim are worked as Mentioned in "comprising" be an open language, therefore should be construed to " including but not limited to ".Specification subsequent descriptions are real The better embodiment of the application is applied, so the description is being not limited to for the purpose of the rule for illustrating the application Scope of the present application.The protection scope of the application is as defined by the appended claims.
When solving OLED flexible display apparatus and repeatedly bending, edge bending place is easy to produce crackle, leads to barrier wall structure pair When the technical issues of barrier effect of side moisture or oxygen fails, the inventors found that OLED flexible display apparatus The reason of crackle is easy to produce when edge is repeatedly bent.It is specific as follows:
Moisture or oxygen are permeated along OLED flexible display apparatus side in order to prevent, include being located at non-display area on substrate Barrier wall structure, moisture or oxygen are permeated along OLED flexible display apparatus front in order to prevent, include packaging film, encapsulation on substrate Film covers the organic luminescent device of display area, while covering the partial retaining wall structure of non-display area, packaging film usually by At least one layer of inorganic layer and at least one layer of organic layer are constituted, therefore the thinner package of inorganic may be filled between barrier wall structure Film, since the flexibility of inorganic is smaller, Shi Caihui is repeatedly bent at the edge of display device and is easy to produce crackle.
For example, OLED flexible display apparatus as shown in Figure 2, barrier wall structure includes at least the first barrier wall structure 3 and second Barrier wall structure 4.Wherein, the second barrier wall structure 4 is located at 3 periphery of the first barrier wall structure, and the first barrier wall structure 3 and the second barricade knot Setting is spaced between structure 4.Packaging film includes the first inorganic layer 61, organic layer 62 and the second inorganic layer 63.First inorganic layer 61 It is formed in 1 top of substrate and the organic luminescent device 2 for being formed in viewing area is completely covered, the first inorganic layer 61 is also along first gear The surface of wall construction 3 is formed, until being formed between the first barrier wall structure 3 and the second barrier wall structure 4, by the second barrier wall structure 4 Stop.Organic layer 62 is formed in above the first inoranic membrane, and the organic luminescent device 2 of viewing area, organic layer 62 is completely covered It is used to increase the flow channel for having permeated foreign matter, even if infiltration has foreign matter, organic layer 62 has enough thickness so that surface Keep flat.Second inorganic layer 63 is formed on organic layer 62 so that organic layer 62 is completely covered, also along the first barrier wall structure 3 Surface is formed, until being formed between the first barrier wall structure 3 and the second barrier wall structure 4, is stopped by the second barrier wall structure 4.
It can be seen that inorganic filled with the first inorganic layer 61 and second between the first barrier wall structure 3 and the second barrier wall structure 4 Layer 62.Since the flexibility of inorganic material is smaller, crackle is easy to produce when the edge of OLED flexible display apparatus is repeatedly bent, such as Fig. 3, thus the crackle at the edge of OLED flexible display apparatus usually occur the first barrier wall structure 3 and the second barrier wall structure 4 it Between, cause the first barrier wall structure 3 and the second barrier wall structure 4 to fail the moisture of display device side or the barrier effect of oxygen.
Above-mentioned discovery based on inventor, the embodiment of the present invention provide a kind of flexible organic LED display panel and Organic dielectric layer is arranged between the first barrier wall structure 3 and the second barrier wall structure 4 in its production method, reaches the first barricade of buffering The stress that inorganic material between structure 3 and the second barrier wall structure 4 is generated in multiple bending, and then prevent the side of display device Edge is broken.
The embodiment of the present invention provides a kind of flexible organic LED display panel, specifically includes that substrate, includes display Area and non-display area;Organic luminescent device is set to the viewing area of the substrate;Packaging film covers the organic luminescent device, And the packaging film includes an at least organic layer and an at least inorganic layer;At least two barrier wall structures are set to the non-aobvious of substrate Show area, be spaced setting between two neighboring barrier wall structure, wherein at least partly barrier wall structure is packaged film covering;Further include: The organic dielectric layer being set between at least two neighboring barrier wall structure, organic dielectric layer are disposed on the substrate, wherein You Jijie Matter layer is covered by least one layer of inorganic layer.
It should be noted that above-mentioned barrier wall structure includes two or more barrier wall structure, for the sake of simplicity, this hair Bright embodiment is illustrated using two adjacent barrier wall structures as example.
It should be noted that at least partly barrier wall structure be packaged film covering, for example, packaging film can cover it is all Barrier wall structure, can also all cover the barrier wall structure close to viewing area, all cover between barrier wall structures, partially cover non- The barrier wall structure of edge of display area.For simplicity, in the embodiment of the present invention, the gear close to viewing area is covered with packaging film It is illustrated between wall construction and covering barrier wall structure.
It should be noted that above-mentioned packaging film includes at least one layer of inorganic layer and one layer of organic layer, the embodiment of the present invention In be illustrated so that packaging film includes one layer of organic layer and two layers of inorganic layer as an example.
It should be noted that at least one layer of inorganic layer of packaging film covers organic dielectric layer, for the sake of simplicity, the present invention is real Shi Zhong is illustrated so that two layers of inorganic layer that packaging film includes covers organic dielectric layer as an example.
Optionally, a kind of flexible organic LED display panel provided in an embodiment of the present invention, as shown in figure 4, main Include:
Substrate 1, the substrate include viewing area A and non-display area B, are set to the organic luminescent device of the viewing area A of substrate 1 2, the packaging film of organic luminescent device 2 is covered, and be set to the first barrier wall structure 3 and second of the non-display area B of substrate 1 Barrier wall structure 4 is spaced setting between adjacent the first barrier wall structure 3 and the second barrier wall structure 4;Wherein, packaging film includes Machine layer 62, the first inorganic layer 61, the second inorganic layer 63, the first inorganic layer 61 cover organic luminescent device 2, also cover the first barricade Interval between structure 3 and the first barrier wall structure 3 and the second barrier wall structure 4, organic layer 62 are formed in the first inorganic layer 61 Upper surface, and organic layer 62 covers organic luminescent device 2, the second inorganic layer 63 covers organic layer 62 and the first inorganic layer 61, also Cover the interval between the first barrier wall structure 3 and the first barrier wall structure 3 and the second barrier wall structure 4, the first adjacent barricade knot Setting is spaced between structure 3 and the second barrier wall structure 4;It is above-mentioned flexibility organic LED display panel further include be set to it is adjacent The first barrier wall structure 3 and the second barrier wall structure 4 between organic dielectric layer 5, organic dielectric layer 5 is set to non-on substrate 1 On the B of viewing area, organic dielectric layer is covered by the first inorganic layer 61 and the second inorganic layer 63.
It is inorganic due to being provided with organic dielectric layer 5, first between adjacent the first barrier wall structure 3 and the second barrier wall structure 4 Layer 61 and the second inorganic layer 63, and organic dielectric layer is covered by at least one layer in the first inorganic layer 61 and the second inorganic layer 63 Lid, when the edge of flexible organic LED display panel is repeatedly bent, organic dielectric layer 5 effectively can be absorbed or be buffered The stress that first inorganic layer 61 and the second inorganic layer 63 are generated in multiple bending avoids adjacent the first barrier wall structure 3 and the It is cracked between two barrier wall structures 4, and then avoids 4 pairs of the first adjacent barrier wall structure 3, the second barrier wall structure organic hairs of flexibility The barrier effect failure of the side moisture or oxygen of optical diode display panel.
In optional embodiment, the film layer of packaging film is not limited to above-mentioned first inorganic layer 61, organic layer 62, second Inorganic layer 63, the film layer of packaging film can include at least one layer of inorganic layer and one layer of organic layer, and organic layer covering display The organic luminescent device 2 of area A, the organic luminescent device 2 of inorganic layer covering viewing area A and the covering of an at least inorganic layer are set to The partial retaining wall structure of non-display area B.
In optional embodiment, barrier wall structure is not limited to the first barrier wall structure 3 and the second barrier wall structure 4, and the non-of substrate shows Show that area can include at least 2 barrier wall structures, is spaced setting between two neighboring barrier wall structure, wherein at least partly barricade knot Structure is packaged film covering.
In optional embodiment, organic dielectric layer on substrate between at least two neighboring barrier wall structure, ability Barricade number can be arranged in field technique personnel according to specific requirements, and covers the number of plies of the inorganic layer of barricade, and the present invention is to this It is not construed as limiting.
As shown in figure 5, being set to the first barrier wall structure 3 and the first barrier wall structure 4 of non-display area B around viewing area A Mode be arranged, the periphery of the first barrier wall structure 3 is the second barrier wall structure 4.
In optional embodiment, the first barrier wall structure 3 and the second barrier wall structure 4 can be by the organic of multilayer laminated setting Film is constituted.
As shown in fig. 6, the first barrier wall structure 3 is by the floor portions 31, middle layer part 32 and the top layer portion 33 that are stacked It constitutes, the second barrier wall structure 4 is made of floor portions 41, middle layer part 42 and the top layer portion 43 being stacked.Wherein, first Floor portions 31, middle layer part 32 and the top layer portion 33 of barrier wall structure 3 are made of identical or different organic material;Second Floor portions 41, middle layer part 42 and the top layer portion 43 of barrier wall structure 4 are made of identical or different organic material.
In optional embodiment, the first barrier wall structure 3 and the second barrier wall structure 4 are in the organic light emission for preparing viewing area A It is made during device 2, organic luminescent device 2 includes Organic Light Emitting Diode and driving organic light-emitting diode Driving element 20, Organic Light Emitting Diode include first electrode 21, organic luminous layer 22 and second electrode 23, wherein the first electricity Pole 21 is anode, and second electrode 23 is cathode.Organic luminescent device 2 is produced on display function layer, and display function layer is flexible The function film layer of organic LED display panel, display function layer include setting gradually along the direction close to packaging film Planarization layer 8, pixel defining layer 9 and spacer layer (not shown).Display function layer covers driving element 20.
In the embodiment of the present invention, the floor portions 31 of the first barrier wall structure 3, the floor portions 41 of the second barrier wall structure 4 with 8 same layer of planarization layer is made, the middle layer part 32 of the first barrier wall structure 3, the middle layer part 42 of the second barrier wall structure 4 and picture Element defines 9 same layer of layer and is made, the top layer portion 43 of the top layer portion 43 of the first barrier wall structure 3 and the second barrier wall structure 4 with Spacer layer same layer is made.
In alternative embodiment, above-mentioned organic dielectric layer 5 can floor portions 31 with the first barrier wall structure 3, middle layer part 32 With any portion same layer setting in top layer portion 33.For example, in order to simplify preparation process, it can be by organic dielectric layer 5 and 31 same layer of floor portions of the closest substrate 1 of one barrier wall structure 3 is arranged.
In alternative embodiment, organic dielectric layer is connected with each other with two adjacent barrier wall structures respectively, as shown in fig. 7, having Machine dielectric layer 5 and the first barrier wall structure 3, the second barrier wall structure 4 are connected with each other.Based on this, at least one layer of packaging film is inorganic Layer can directly overlay the upper surface of organic dielectric layer 5, repeatedly curved at the edge of flexible organic LED display panel When folding, organic dielectric layer 5 can effectively absorb or at least one layer of inorganic layer of buffering package film generates in multiple bending Stress avoids cracking between the first barrier wall structure 3 and the second barrier wall structure 4.
In alternative embodiment, the organic dielectric layer between two neighboring barrier wall structure is set, with one of barricade knot Structure connection, is arranged with another barrier wall structure interval.
Optionally, at least one of organic dielectric layer 5 and the first barrier wall structure 3, the second barrier wall structure 4 interval setting.
Wherein, organic dielectric layer 5 and at least one of the first barrier wall structure 3, the second barrier wall structure 4 are spaced good Place is:
Since the first barrier wall structure 3, organic dielectric layer 5 and the second barrier wall structure 4 are all organic layers, if organic dielectric layer 5 and first barrier wall structure 3 and the second barrier wall structure 4 be all connected with each other, organic dielectric layer 5 will be easy to absorb water in air, The foreign matters such as oxygen, since the transmission path that foreign matter enters viewing area by barrier wall structure is very short, these foreign matters can penetrate into display quickly It area will be between at least one of organic dielectric layer 5 and the first barrier wall structure 3, the second barrier wall structure 4 in order to avoid such case Every setting, in this way, at least one layer of inorganic layer of packaging film will fill organic dielectric layer 5 and when forming packaging film Interval between one barrier wall structure 3 and/or the second barrier wall structure 4, being spaced the interior inorganic layer filled can effectively stop in air The foreign matters such as water, oxygen towards viewing area infiltration.
Optionally, as shown in figure 8, organic dielectric layer 5 is connect with the first barrier wall structure 3, organic dielectric layer 5 and the second barricade The interval of structure 4 setting, wherein the second barrier wall structure 4 is proximate to the barrier wall structure at 1 edge of substrate.Based on this, packaging film is extremely Few one layer of inorganic layer can be covered on the upper surface of organic dielectric layer 5, can also cover organic dielectric layer 5 and the second barrier wall structure Interval between 4.
As shown in figure 9, organic dielectric layer 5 is connect with the first barrier wall structure 3, between organic dielectric layer 5 and the second barrier wall structure 4 When setting, the first inorganic layer 61 and the second inorganic layer 63 of packaging film are not placed only in the upper surface of organic dielectric layer 5, also The interval between organic dielectric layer 5 and the second barrier wall structure 4 is covered, since the interval is inorganic close to the edge of substrate 1, first Layer 61 and the second inorganic layer 63 can be good at stopping the foreign matter other than the second barrier wall structure 4, the be covered in interval The path that foreign matter is permeated towards viewing area has been truncated in one inorganic layer 61 and the second inorganic layer 63.
Optionally, as shown in Figure 10, between organic dielectric layer 5 and the first adjacent barrier wall structure 3 and the second barrier wall structure 4 are equal Every setting.Based on this, at least one layer of inorganic layer of packaging film can be covered on the upper surface of organic dielectric layer 5, can also cover The interval between the first barrier wall structure 3, the second barrier wall structure 4 respectively of lid organic dielectric layer 5.
As shown in figure 11, when organic dielectric layer 5 and the first barrier wall structure 3, the second barrier wall structure 4 are all spaced setting, encapsulation The first inorganic layer 61 and the second inorganic layer 63 of film are not placed only in the upper surface of organic dielectric layer 5, also cover organic Jie Interval between matter layer 5 and the first barrier wall structure 3, the second barrier wall structure 4, due to increasing the quantity at interval, the first inorganic layer 61 and second inorganic layer 63 can be good at stopping the foreign matter other than the second barrier wall structure 4, be covered on interval in first The path that foreign matter is permeated towards viewing area has been truncated in inorganic layer 61 and the second inorganic layer 63.Since the quantity at interval increases, covering The first inorganic layer 61 and the second inorganic layer 63 in interval enhance the blocking effect of foreign matter.
In optional embodiment, at least one groove and/or at least one impenetrating thickness side are provided on organic dielectric layer 5 To opening.
Optionally, the shape of the opening shape of groove, the opening on impenetrating thickness direction can be V-type, rectangle, Huo Zheqi At least one of his shape.
As shown in figure 12, the opening 12 being provided on organic dielectric layer 5 on a groove 11 and an impenetrating thickness direction, Groove 11 is arranged close to the second barrier wall structure 4, and the opening shape of groove 11 is V-arrangement, and the opening 12 on impenetrating thickness direction is close First barrier wall structure 3 setting, be open 12 shape be rectangle.Based on this, when forming packaging film, at least the one of packaging film Layer inorganic layer can cover these grooves 11 and opening 12, these grooves 11 and opening 12 can increase inorganic in packaging film The contact area of layer and organic dielectric layer 5, not only allows organic dielectric layer 5 preferably to absorb and buffer inorganic dielectric layer and exists The stress repeatedly generated when bending, moreover it is possible to which enhancing is covered on the inorganic layer in these grooves 11 and opening 12 to the second barrier wall structure The blocking effect of foreign matter other than 4.
In optional embodiment, any of the above-described flexibility organic LED display panel further include: be set at least phase The protective layer on packaging film between adjacent two barrier wall structures.Wherein, protective layer can cover between two barrier wall structures Packaging film, can also cover in two barrier wall structures close to non-display area edge barrier wall structure, barricade can also be covered On substrate other than structure.Optionally, as shown in Figure 13 and Figure 14, protective layer 7 is arranged in the first barrier wall structure 3 and the second barricade Between structure 4, and directly overlay on the second inorganic layer 63 of packaging film.Since protective layer 7 is arranged in the first barricade Between structure 3 and the second barrier wall structure 4, protective layer 7 is directly contacted with the second inorganic layer 63, organic dielectric layer 5 and first inorganic Layer 61 directly contacts, and protective layer 7 can be absorbed and buffer the stress that the second inorganic layer 63 is generated in multiple bending, organic media Layer 5 can be absorbed and buffer the stress that the first inorganic layer 61 is generated in multiple bending, avoid the first inorganic layer 61 and the second nothing Machine layer 63 directly contacts, and is easy to produce stress and concentrates and generate bending crackle.
Optionally, the material of protective layer 7 can be ink or colloid.
In optional embodiment, protective layer can also be provided at first between the first barrier wall structure 3 and the second barrier wall structure 4 On inorganic layer 61, make protective layer between the first inorganic layer 61 and the second inorganic layer 63, to avoid in the first barricade knot Two layers of inorganic layer directly contacts between structure 3 and the second barrier wall structure 4, alleviates the stress of inorganic interlayer, prevents crack propagation.
In optional embodiment, as shown in figure 15, protective layer 7 is in addition to the first barrier wall structure 3 of covering and the second barrier wall structure 4 Between 63 surface of the second inorganic layer, be also covered on the surface of the second barrier wall structure 4, and be covered on the second barrier wall structure 4 with On outer substrate 1.In this way, the stress that protective layer 7 is generated in addition to that can absorb and alleviate the second inorganic layer 63 in multiple bending, The stress generated when the peripheral substrate 1 of the first barrier wall structure 3 is cut can also be absorbed, in order to avoid 3 periphery of the first barrier wall structure Cutting crackle is generated on substrate 1, and prevents cutting crackle from extending towards viewing area.
Based on identical inventive concept, the embodiment of the present invention provides a kind of display device, including any of the above-described kind of flexibility has Machine LED display panel, when so that the edge of display device repeatedly being bent, the first barrier wall structure 3 and the second barrier wall structure The folding s tress for the inorganic filled between 4 is absorbed by organic dielectric layer 5, avoids the first barrier wall structure 3 and the second barricade knot It is cracked between structure 4.
Based on identical inventive concept, the embodiment of the present invention provides a kind of system of flexible organic LED display panel Make method, comprising:
Step S1, provides a substrate 1, and substrate 1 includes viewing area and non-display area;
Wherein, the substrate that step S1 is provided refers to that viewing area has formed the base of each driving element of display function layer Plate drives film brilliant such as the gate insulating layer on substrate, and each switching thin-film transistor being formed on gate insulating layer Body pipe, and the gate drive signal cabling being connect with each driving element and source drive signal lead etc..
Step S2 forms organic luminescent device 2 in the viewing area of substrate 1, wherein in the system for forming organic luminescent device 2 Cheng Zhong forms at least two spaced barrier wall structures in the non-display area of substrate 1, and at least two neighboring barricade knot Organic dielectric layer 5 is formed between structure;
Organic luminescent device includes driving element, display function layer and the organic light emission being formed on display function layer Diode, display function layer include planarization layer, pixel defining layer and the spacer layer set gradually along the direction away from substrate. And barrier wall structure includes the floor portions being stacked, middle layer part and top layer portion, the floor portions of barrier wall structure with it is flat Change layer same layer to be made, middle layer part and the pixel defining layer same layer of barrier wall structure are made, the top layer portion of barrier wall structure Divide and is made with spacer layer same layer.In addition, the organic dielectric layer between barrier wall structure can be with the bottom portion of barrier wall structure Divide, any portion same layer in middle layer part and top layer portion is made.
Step S3, forms packaging film on substrate 1, and packaging film at least covers organic luminescent device 2 and partial retaining wall Structure;Wherein, packaging film is formed on substrate 1, including forms at least one layer of organic layer on substrate 1 and at least one layer is inorganic Layer.In this way, being sealed in interval between barrier wall structure due to being filled at least one layer of inorganic layer of organic dielectric layer and packaging film At least one layer of inorganic layer for filling film covers between above-mentioned organic dielectric layer and the above-mentioned organic dielectric layer of covering and barrier wall structure Interval.Therefore, when the edge of flexible organic LED display panel is repeatedly bent, it is set to two neighboring barricade knot Organic dielectric layer between structure can effectively absorb or buffer the stress that inorganic layer is generated in multiple bending, avoid barrier wall structure Between crack, and then barrier wall structure is avoided to fail the barrier effect of display device side moisture or oxygen.
It should be noted that the barrier wall structure in above method process includes two or more barrier wall structure, For the sake of simplicity, the embodiment of the present invention is illustrated using two adjacent barrier wall structures as example.
It should be noted that at least partly barrier wall structure in above method process is packaged film covering, for example, encapsulation Film can cover all barrier wall structures, can also all cover the barrier wall structure close to viewing area, all cover barricade knot Between structure, part covers the barrier wall structure at non-display area edge.For simplicity, in the embodiment of the present invention, with packaging film It is illustrated for covering between the barrier wall structure and covering barrier wall structure of viewing area.
It should be noted that the packaging film in above method process includes at least one layer of inorganic layer and one layer of organic layer, It is illustrated so that packaging film includes one layer of organic layer and two layers of inorganic layer as an example in the embodiment of the present invention.
It should be noted that at least one layer of inorganic layer of the packaging film in above method process covers organic dielectric layer, For the sake of simplicity, being illustrated so that two layers of inorganic layer that packaging film includes covers organic dielectric layer as an example in present invention implementation.
The embodiment of the present invention is respectively the first barrier wall structure 3 and the second barrier wall structure 4 with two neighboring barrier wall structure below, And first barrier wall structure 3 surrounded by the second barrier wall structure 4 and packaging film includes that one layer of organic layer and two layers of inorganic layer are Example, is illustrated above method process, wherein above-mentioned steps S2 is specifically included:
Step S20: forming the first organic film C on substrate 1, the first organic film C is based on, by patterning processes in viewing area Planarization layer 8 is formed, forms the floor portions 31 of the first barrier wall structure 3 and the bottom portion of the second barrier wall structure 4 in non-display area Divide 41.
Optionally, the structure that step S20 is formed is referring to Figure 16, the planarization layer 8 of the viewing area including being formed in substrate 1, It further include the floor portions for being formed in the floor portions 31 and the second barrier wall structure of the first barrier wall structure of non-display area of substrate 1 41.Wherein, planarization layer 8 covers the driving element 20 of display function layer, the floor portions of planarization layer 8, the first barrier wall structure 31 and second 41 same layer of floor portions of barrier wall structure be made.
Optionally, such as Figure 16, it is based on the first organic film C, by patterning processes in the first barrier wall structure 3 and the second barricade knot Organic dielectric layer 5 is formed between structure 4, so that the floor portions 31 of organic dielectric layer 5 and the first barrier wall structure 3, the second barricade knot 41 same layer of floor portions of structure 4 is made.
Optionally, the thickness of organic dielectric layer 5 can be with the floor portions 31 of the first barrier wall structure, the second barrier wall structure The thickness of floor portions 41 is identical, can also be different.
Step S21: the first electrode of each Organic Light Emitting Diode is formed on the surface that planarization layer 8 deviates from substrate 1 21。
Wherein, first electrode 21 is the anode (or cathode) of Organic Light Emitting Diode, also makes and connects on planarization layer 8 Contact hole so that the first electrode 21 of each Organic Light Emitting Diode by contact hole and the electrode of corresponding driving element 20 (such as Drain electrode) connection.
Optionally, the structure that step S21 is formed is referring to Figure 17, in addition to including the planarization for being formed in the viewing area of substrate 1 Layer 8, is formed in the floor portions 31 of the first barrier wall structure of the non-display area of substrate 1 and the floor portions of the second barrier wall structure 41 and organic dielectric layer 5 except, further include the first electrode 21 being formed on planarization layer 8.
Step S22: forming the second organic film D on substrate 1, is being shown based on the second organic film D by patterning processes Area forms pixel defining layer 9, in the middle layer part 32 and the second barrier wall structure 4 that non-display area forms the first barrier wall structure 3 Layer part 42.
Wherein, pixel defining layer 9 is used to define each pixel, and pixel defining layer 9 covers each organic light emission second level The first electrode 21 of pipe.
Optionally, the structure that step S22 is formed is referring to Figure 18, in addition to including the planarization for being formed in the viewing area of substrate 1 Layer 8 and first electrode 21, are formed in the floor portions 31 and the second barrier wall structure of the first barrier wall structure of the non-display area of substrate 1 Floor portions 41, further include being formed in the pixel defining layer 9 of the viewing area of substrate 1, and formed except organic dielectric layer 5 In the middle layer part 32 of the first barrier wall structure of the non-display area of substrate 1 and the middle layer part 42 of the second barrier wall structure.
Optionally, the first barrier wall structure 3 and the second barrier wall structure are also formed according to patterning processes based on the second organic film D Organic dielectric layer 5 between 4, so that the middle layer part 32 of organic dielectric layer 5 and the first barrier wall structure 3, second barrier wall structure 4 42 same layer of middle layer part is made.Wherein, planarization layer 8, the floor portions 31 of the first barrier wall structure, the second barrier wall structure Film layer where floor portions 41 is all the first organic film C, the middle layer part 32, second of pixel defining layer, the first barrier wall structure Film layer where the middle layer part 42 of barrier wall structure is all the second organic film D.Optionally, the thickness of organic dielectric layer 5 can be with The middle layer part 32 of first barrier wall structure 3, the second barrier wall structure 4 middle layer part 42 thickness it is identical, can also be different.
Step S23: forming third organic film E on substrate 1, is being shown based on third organic film E by patterning processes Area forms spacer layer (not shown) and organic luminous layer 22, forms the top layer portion 33 of the first barrier wall structure 3 in non-display area With the top layer portion 43 of the second barrier wall structure 4.
Wherein, spacer layer is formed in pixel defining layer 9 away from 1 side of substrate, and spacer layer is located at second electrode and the Between one electrode.Wherein, organic luminous layer 22 is formed between adjacent pixel defining layer 9.
Optionally, the structure that step S23 is formed is referring to Figure 19, in addition to including the planarization for being formed in the viewing area of substrate 1 Layer 8, first electrode 21, pixel defining layer 9, organic luminous layer 22, are formed in the first barrier wall structure of the non-display area of substrate 1 Floor portions 31, the floor portions 41 of the second barrier wall structure, the middle layer part 32 of the first barrier wall structure, in the second barrier wall structure Except layer part 42, organic dielectric layer 5, further includes: be formed in spacer layer of the pixel defining layer 9 away from 1 side of substrate and (do not show Out) and organic luminous layer 22, and the top layer portion 33 and second gear of the first barrier wall structure of the non-display area of substrate 1 are formed in The top layer portion 43 of wall construction.
Optionally, the first barrier wall structure 3 and the second barrier wall structure are also formed according to patterning processes based on third organic film E Organic dielectric layer 5 between 4, so that the top layer portion same layer of organic dielectric layer 5 and the first barrier wall structure 3, the second barrier wall structure 4 It is made.Wherein, where the floor portions 41 of planarization layer 8, the floor portions 31 of the first barrier wall structure, the second barrier wall structure Film layer be all the first organic film C, pixel defining layer 9, the middle layer part 32 of the first barrier wall structure, the second barrier wall structure middle layer Film layer where part 42 is all the second organic film D, organic dielectric layer 5, spacer layer, the first barrier wall structure top layer portion 33, the film layer where the top layer portion 43 of the second barrier wall structure is all third organic film E.Optionally, the first organic film C, second Organic film D, third organic film material can be the same or different, to this present invention without limitation.
Optionally, the thickness of organic dielectric layer 5 can be with the top layer portion 33 of the first barrier wall structure, the second barrier wall structure The thickness of top layer portion 43 is identical, can also be different.
Step S24: the second electricity of each Organic Light Emitting Diode is formed on the surface that pixel defining layer 9 deviates from substrate 1 Pole 23.
Wherein, second electrode 23 covers the organic luminous layer 22 of Organic Light Emitting Diode, and second electrode 23 is organic light emission The cathode (or anode) of diode.
Optionally, the structure referring to fig. 20 that step S23 is formed, in addition to including the planarization for being formed in the viewing area of substrate 1 Layer 8, first electrode 21, pixel defining layer 9, organic luminous layer 22 are formed in the first barrier wall structure of the non-display area of substrate 1 Floor portions 31, the floor portions 41 of the second barrier wall structure, the middle layer part 32 of the first barrier wall structure, in the second barrier wall structure It further include the second electrode 23 for being formed in pixel defining layer 9 and deviating from 1 side of substrate except layer part 42, organic dielectric layer 5.
Optionally, after step S24 further include:
After the formation of second electrode 23, also coating can be formed away from the surface of substrate 1 in second electrode 23 and (do not shown Out), coating is for protecting second electrode, prevents before forming packaging film second electrode 23 by water, the oxygen etc. in air Foreign matter damage.
Optionally, step S3 is specifically included:
Step S31: the first inorganic layer 61 is formed away from the side of substrate 1 in organic luminescent device 2, the first inorganic layer 61 covers The organic luminescent device 2 of lid viewing area, the first barrier wall structure 3 and organic dielectric layer 5.
Such as Figure 21, organic luminescent device 2, the first barrier wall structure 3, the second barrier wall structure are formd on the substrate 1 of offer 4, and the organic dielectric layer 5 between the first barrier wall structure 3 and the second barrier wall structure 4, organic dielectric layer 5 is and first gear Wall construction 3, the connection of the second barrier wall structure 4 form the first inorganic layer 61 on this basis, make the covering display of the first inorganic layer 61 The organic luminescent device 2 in area, having between the first barrier wall structure 3, and the first barrier wall structure 3 of covering and the second barrier wall structure 4 Machine dielectric layer 5.
Step S32: organic layer 62 is formed away from the side of substrate 1 in the first inorganic layer 61, organic layer 62 only covers display The organic luminescent device 2 in area, there is no the first barrier wall structures 3 for covering non-display area, so that organic layer 62 is by the first barricade knot Structure 3 stops, and organic layer 62 be used to increase the flow channel for having permeated foreign matter, even if infiltration has foreign matter, organic layer 62 has foot Enough thickness is so that 61 surface of the first inorganic layer keeps flat.
Such as Figure 22, organic layer 62 is formed away from the side of substrate 1 in the first inorganic layer 61, organic layer 62 is made to cover viewing area Organic luminescent device 2, and organic layer 62 is stopped by the first barrier wall structure 3 of non-display area.
Step S33: the second inorganic layer 63 is formed away from the side of substrate 1 in organic layer 62, the second inorganic layer 63 is formed in Organic layer 62 is on the side of substrate 1, so that organic layer 62 and the first inorganic layer 61, the second inorganic layer 63 also edge is completely covered First inorganic layer, 61 surface on 3 surface of the first barrier wall structure is formed, until being filled in the first barrier wall structure 3 and the second barrier wall structure Between 4, and stopped by the second barrier wall structure 4.
Such as Figure 23, the second inorganic layer 63 is formed away from the side of substrate 1 in organic layer 62, so that the second inorganic layer 63 covers First inorganic layer 61 and organic layer 62.Due to the organic luminescent device 2 of the first inorganic layer 61 covering viewing area, the first barrier wall structure 3 and the first organic dielectric layer 5 between barrier wall structure 3 and the second barrier wall structure 4, therefore, the second inorganic layer 63 also covers aobvious Show the organic luminescent device 2 in area, it is organic between the first barrier wall structure 3 and the first barrier wall structure 3 and the second barrier wall structure 4 Dielectric layer 5.
In this way, being sequentially filled organic dielectric layer 5, in interval between the first barrier wall structure 3 and the second barrier wall structure 4 One inorganic layer 61 and the second inorganic layer 63, when the edge of flexible organic LED display panel is repeatedly bent, the first nothing The stress that machine layer 61 and the second inorganic layer 63 generate is absorbed by organic dielectric layer 5, and then prevents flexible organic light-emitting diodes The edge of pipe display panel cracks when repeatedly bending.Optionally, any organic dielectric layer for being formed in above-mentioned steps 5, can have with the positional relationship of the first barrier wall structure 3, the second barrier wall structure 4 following several:
The first: organic dielectric layer 5 is connected with each other with the first barrier wall structure 3 and the second barrier wall structure 4 respectively.
Second: organic dielectric layer 5 is connect with the first barrier wall structure 3, is spaced and is arranged with the second barrier wall structure 4.
The third: organic dielectric layer 5 is connect with the second barrier wall structure 4, is spaced and is arranged with the first barrier wall structure 3.
4th kind: interval setting between organic dielectric layer 5 and adjacent the first barrier wall structure 3 and the second barrier wall structure 4.
The particular content of above-mentioned several positional relationships is not repeated herein referring to above-described embodiment.
When the positional relationship of organic dielectric layer 5 and the first barrier wall structure 3, the second barrier wall structure 4 be it is above-mentioned the first when, the One barrier wall structure 3, organic dielectric layer 5 and the second barrier wall structure 4 are all organic layers, are easy to absorb the foreign matters such as water, the oxygen in air, And it is easy to these foreign matters penetrating into viewing area as channel.
Optionally, it enables organic dielectric layer 5 be spaced at least one of the first barrier wall structure 3, the second barrier wall structure 4 to set Set, i.e., organic dielectric layer 5 and the first barrier wall structure 3, the second barrier wall structure 4 positional relationship be above second, the third Or at the 4th kind, make the first inorganic layer 61 and the second inorganic layer 63 be filled in organic dielectric layer 5 and the first barrier wall structure 3 and/or In interval between second barrier wall structure 4, the first inorganic layer 61 and the second inorganic layer 63 being filled in interval can effectively hinder The foreign matters such as water, the oxygen in air are kept off to permeate towards viewing area.
Optionally, it for above-mentioned steps S20, for step S22, step S24, after forming organic dielectric layer 5, also wraps It includes: etching at least one groove on organic dielectric layer 5, or etch at least one impenetrating thickness side on organic dielectric layer 5 To opening, or on organic dielectric layer 5 etch a groove while also etch impenetrating thickness direction opening.Make first Inorganic layer 61 and the second inorganic layer 63 are filled in opening or the groove of organic dielectric layer 5, fill organic dielectric layer 5 opening or The first inorganic layer 61 and the second inorganic layer 63 in groove can effectively stop the foreign matters such as water, oxygen in air to seep towards viewing area Thoroughly.
Wherein, the particular content of etched recesses or opening is no longer tired herein referring to above-described embodiment on organic dielectric layer 5 It states.
After step S33, further includes:
Step S4: protective layer 7 is formed on packaging film, protective layer 7, which at least covers, is formed in the first adjacent barricade knot The upper surface of packaging film between structure 3 and the second barrier wall structure 4.
Optionally, protective layer 7 covers second be formed between adjacent the first barrier wall structure 3 and the second barrier wall structure 4 The upper surface of inorganic layer 63.Due to protective layer 7 be arranged between the first barrier wall structure 3 and the second barrier wall structure 4, protective layer 7 with Second inorganic layer 63 directly contacts, and organic dielectric layer 5 is directly contacted with the first inorganic layer 61, aobvious in flexible Organic Light Emitting Diode When showing that the edge of panel is repeatedly bent, protective layer 7 can be absorbed and buffer what the second inorganic layer 63 was generated in multiple bending Stress, organic dielectric layer 5 can be absorbed and buffer the stress that the first inorganic layer 61 is generated in multiple bending, avoid first inorganic Layer 61 and the second inorganic layer 63 directly contact, and are easy to produce stress and concentrate and generate bending crackle.
Optionally, protective layer 7 also covers the barrier wall structure near 1 edge of substrate.Protective layer 7 is not placed only in first gear The upper surface of the second inorganic layer 63 between wall construction 3 and the second barrier wall structure 4, also cover 4 surface of the second barrier wall structure and 1 surface of substrate of second barrier wall structure, 4 periphery.Protective layer 7 is repeatedly being bent in addition to that can absorb and alleviate the second inorganic layer 63 When the stress that generates, the stress generated when the substrate 1 of 3 periphery of the first barrier wall structure is cut can also be absorbed, in order to avoid first gear Cutting crackle is generated on the substrate 1 of 3 periphery of wall construction, and prevents cutting crackle from extending towards viewing area.
Obviously, those skilled in the art can carry out various modification and variations without departing from this Shen to the embodiment of the present invention Spirit and scope please.In this way, if these modifications and variations of the embodiment of the present invention belong to the claim of this application and its wait Within the scope of technology, then the application is also intended to include these modifications and variations.

Claims (19)

1. a kind of flexibility organic LED display panel characterized by comprising
Substrate includes viewing area and non-display area;
Organic luminescent device is set to the viewing area of the substrate;
Packaging film covers the organic luminescent device, and the packaging film includes that an at least organic layer and at least one are inorganic Layer;Wherein, the inorganic layer includes: the first inorganic layer, the second inorganic layer;
At least two barrier wall structures, are set to the non-display area of the substrate, between the two neighboring barrier wall structure between Every setting, wherein at least partly described barrier wall structure is covered by the packaging film;At least one layer organic layer is in the base The orthographic projection of plate is located at the inside of the barrier wall structure of the close viewing area at least two barrier wall structure;
Further include: the organic dielectric layer being set between at least two neighboring barrier wall structure, the organic dielectric layer setting On the substrate, wherein the organic dielectric layer is covered by first inorganic layer and second inorganic layer, also, is covered First inorganic layer and second inorganic layer for covering the organic dielectric layer directly contact;
Each barrier wall structure is made of the organic film of multilayer laminated setting;The organic dielectric layer has with described at least one layer The setting of machine film same layer;
The organic dielectric layer between the two neighboring barrier wall structure is set, is connected with barrier wall structure described in one of them It connects, is arranged with barrier wall structure interval described in another;Alternatively, being arranged in described organic between the two neighboring barrier wall structure Interval setting between dielectric layer and the two neighboring barrier wall structure.
2. flexibility organic LED display panel as described in claim 1, which is characterized in that the organic dielectric layer with Adjacent is spaced setting between the barrier wall structure of the substrate edges.
3. flexibility organic LED display panel as described in claim 1, which is characterized in that the organic dielectric layer with The organic film same layer of the closest substrate is arranged.
4. flexibility organic LED display panel as described in any one of claims 1-3, which is characterized in that described organic Dielectric layer has at least one groove and/or the opening at least one impenetrating thickness direction.
5. flexibility organic LED display panel as claimed in claim 4, which is characterized in that further include protective layer;Institute It states protective layer and at least covers the inorganic layer between the two neighboring barrier wall structure.
6. flexibility organic LED display panel as claimed in claim 5, which is characterized in that the protective layer also covers Near the barrier wall structure of the substrate edges.
7. flexibility organic LED display panel as claimed in claim 5, which is characterized in that the material of the protective layer For ink or colloid.
8. flexibility organic LED display panel as claimed in claim 5, which is characterized in that the institute of the packaging film It states at least one layer of inorganic layer and covers the opening and/or groove.
9. a kind of display device characterized by comprising such as the described in any item flexible organic light-emitting diodes of claim 1-8 Pipe display panel.
10. a kind of production method of flexibility organic LED display panel characterized by comprising
A substrate is provided, the substrate includes viewing area and non-display area;
Organic luminescent device is formed in the viewing area of the substrate, wherein in the processing procedure for forming the organic luminescent device In in the non-display area of the substrate form at least two spaced barrier wall structures, and at least two neighboring institute It states and forms organic dielectric layer between barrier wall structure;
Packaging film is formed away from the side of the substrate in the organic luminescent device, the packaging film covering is described organic Luminescent device, wherein the packaging film includes at least one layer of organic layer and at least one layer of inorganic layer, and at least one layer is inorganic Layer covers the organic dielectric layer;At least one layer organic layer is located at least two barricade in the orthographic projection of the substrate The inside of the barrier wall structure of the close viewing area in structure;
Wherein, between at least two neighboring barrier wall structure formed organic dielectric layer when, the organic dielectric layer at least The positional relationship of the two neighboring barrier wall structure are as follows:
The organic dielectric layer is connect with barrier wall structure described in one of them, is arranged with barrier wall structure interval described in another;Or Person,
Interval setting between the organic dielectric layer and the two neighboring barrier wall structure.
11. production method as claimed in claim 10, which is characterized in that form organic hair in the viewing area of the substrate Optical device, comprising:
The viewing area on the substrate forms planarization layer;
The first electrode of the organic luminescent device is formed on surface of the planarization layer away from the substrate;
The viewing area on the substrate forms pixel defining layer, wherein pixel defining layer covering first electricity Pole;
Spacer layer is formed away from the side of the substrate in the pixel defining layer and prepares the organic luminescent device Organic luminous layer;
The second electrode of the organic luminescent device is formed on surface of the pixel defining layer away from the substrate.
12. production method as claimed in claim 11, which is characterized in that in the processing procedure for forming the organic luminescent device The non-display area of the substrate forms at least two spaced barrier wall structures, comprising:
When forming the planarization layer, the floor portions of each barrier wall structure are formed;
When forming the pixel defining layer, the middle layer part of each barrier wall structure is formed;
When forming the spacer layer, the top layer portion of each barrier wall structure is formed.
13. production method as claimed in claim 12, which is characterized in that the shape between at least two neighboring barrier wall structure At organic dielectric layer, comprising:
At least one in the floor portions of each barrier wall structure of formation, the middle layer part, the top layer portion When layer, the organic dielectric layer is formed.
14. production method as claimed in claim 13, which is characterized in that in the bottom for forming each barrier wall structure When part, the organic dielectric layer is formed.
15. production method as claimed in claim 10, which is characterized in that the organic dielectric layer and one of them described barricade When spacing structure is arranged, the organic dielectric layer and adjacent being spaced between the barrier wall structure of the substrate edges are arranged.
16. the production method as described in any one of claim 10 to 15, which is characterized in that forming the organic dielectric layer Later, further includes:
A groove and/or the opening at least one impenetrating thickness direction are etched on the organic dielectric layer.
17. production method as claimed in claim 16, which is characterized in that after forming the packaging film, further includes:
Form protective layer on the packaging film, the protective layer at least cover be formed in the two neighboring barrier wall structure it Between at least one inorganic layer upper surface.
18. production method as claimed in claim 17, which is characterized in that the protective layer is also covered near the substrate side The barrier wall structure of edge.
19. production method as claimed in claim 16, which is characterized in that at least one layer inorganic layer covers the opening And/or groove.
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