CN106981584B - Flexible organic LED display panel, display device and preparation method thereof - Google Patents
Flexible organic LED display panel, display device and preparation method thereof Download PDFInfo
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- 238000002360 preparation method Methods 0.000 title abstract 2
- 239000010410 layer Substances 0.000 claims abstract description 427
- 239000000758 substrate Substances 0.000 claims abstract description 106
- 239000012044 organic layer Substances 0.000 claims abstract description 43
- 229920006280 packaging film Polymers 0.000 claims abstract description 30
- 239000012785 packaging film Substances 0.000 claims abstract description 30
- 238000005538 encapsulation Methods 0.000 claims description 42
- 238000000034 method Methods 0.000 claims description 30
- 239000011241 protective layer Substances 0.000 claims description 27
- 238000004519 manufacturing process Methods 0.000 claims description 14
- 125000006850 spacer group Chemical group 0.000 claims description 11
- 230000008569 process Effects 0.000 claims description 10
- 230000000149 penetrating effect Effects 0.000 claims description 7
- 238000005530 etching Methods 0.000 claims 1
- 230000004888 barrier function Effects 0.000 abstract description 83
- 238000005452 bending Methods 0.000 abstract description 9
- 238000005336 cracking Methods 0.000 abstract description 2
- 239000010408 film Substances 0.000 description 61
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 17
- 229910052760 oxygen Inorganic materials 0.000 description 17
- 239000001301 oxygen Substances 0.000 description 17
- 239000000126 substance Substances 0.000 description 7
- 239000010409 thin film Substances 0.000 description 7
- 230000000903 blocking effect Effects 0.000 description 6
- 238000010586 diagram Methods 0.000 description 6
- 229910010272 inorganic material Inorganic materials 0.000 description 5
- 239000011147 inorganic material Substances 0.000 description 5
- 239000012466 permeate Substances 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- 238000005520 cutting process Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000000059 patterning Methods 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000011368 organic material Substances 0.000 description 2
- 238000003892 spreading Methods 0.000 description 2
- 230000007480 spreading Effects 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 230000003252 repetitive effect Effects 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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Abstract
The invention discloses a kind of flexible organic LED display panels, display device and preparation method thereof, comprising: substrate includes viewing area and non-display area；Organic luminescent device is set to the viewing area of substrate；Packaging film covers organic luminescent device, and packaging film includes an at least organic layer and an at least inorganic layer；At least two barrier wall structures are set to the non-display area of substrate, are spaced setting between two neighboring barrier wall structure, wherein at least partly barrier wall structure is packaged film covering；Further include: the organic dielectric layer being set between at least two neighboring barrier wall structure, organic dielectric layer are disposed on the substrate, wherein organic dielectric layer is covered by least one layer of inorganic layer.Due to being filled with inorganic layer and organic dielectric layer between barrier wall structure, organic dielectric layer can effectively absorb the stress that inorganic layer is generated in multiple bending, avoid cracking between barrier wall structure.
Description
Technical Field
The invention relates to the technical field of display, in particular to a flexible organic light emitting diode display panel, a display device and a manufacturing method of the display device.
Background
The OLED flexible display device is manufactured on the flexible substrate, is flexible and has the advantages of low power consumption, small size, flexibility and the like, and can be applied to wider fields. But the OLED flexible display device is easily cracked at the edge of the panel during the bending process.
The OLED flexible display device comprises a display area and a non-display area, wherein the display area is arranged on a substrate and comprises organic light-emitting devices formed on the substrate, and in each organic light-emitting device, a switching thin film transistor, a driving thin film transistor, a storage capacitor and an organic light-emitting diode OLED connected with the driving thin film transistor can be formed.
In order to protect the organic light emitting diode from foreign substances such as moisture or oxygen, an encapsulation film at least covering the organic light emitting diode is generally formed on the substrate, but the encapsulation film does not block the foreign substances penetrating from the side of the OLED flexible display device. In order to prevent moisture or oxygen from penetrating along the side surfaces, a barrier structure is also generally formed on the substrate in the non-display region.
The OLED flexible display device has a flexible function, for example, when the OLED flexible display device is bent several times in the bending manner shown in fig. 1, the edge of the display device is easily cracked, which results in the failure of the moisture or oxygen barrier function of the side wall structure, and thus, such cracking is undesirable.
Disclosure of Invention
The embodiment of the invention provides a flexible organic light-emitting diode display panel, a display device and a manufacturing method thereof, which are used for solving the technical problem that in the prior art, when an OLED flexible display device is bent for multiple times, cracks are easily generated at the edge bending part, so that the blocking effect of a retaining wall structure on lateral moisture or oxygen is ineffective.
An embodiment of the present invention provides a flexible organic light emitting diode display panel, including:
a substrate including a display region and a non-display region;
the organic light-emitting device is arranged in the display area of the substrate;
an encapsulation film covering the organic light emitting device, and the encapsulation film including at least one organic layer and at least one inorganic layer;
at least two retaining wall structures, which are arranged in the non-display area of the substrate, and are arranged at intervals between every two adjacent retaining wall structures, wherein at least part of the retaining wall structures are covered by the packaging film;
further comprising: and the organic medium layer is arranged between at least two adjacent retaining wall structures and is arranged on the substrate, wherein the organic medium layer is covered by the at least one inorganic layer.
In the flexible organic light emitting diode display panel, as the organic medium layer and at least one inorganic layer of the packaging film are sequentially filled in the interval between the adjacent retaining wall structures, the at least one inorganic layer of the packaging film covers the organic medium layer and covers the interval between the organic medium layer and the retaining wall structures. When the edge of the flexible organic light-emitting diode display panel is bent for multiple times, the organic medium layer arranged between the two adjacent retaining wall structures can effectively absorb or buffer the stress generated by the inorganic layer when the inorganic layer is bent for multiple times, so that cracks are prevented from being generated between the retaining wall structures, and further the failure of the retaining effect of the retaining wall structures on moisture or oxygen on the side surface of the display device is avoided.
The embodiment of the invention provides a display device which comprises any one flexible organic light-emitting diode display panel provided by the embodiment of the invention.
The embodiment of the invention provides a manufacturing method of a flexible organic light-emitting diode display panel, which comprises the following steps:
providing a substrate, wherein the substrate comprises a display area and a non-display area;
forming an organic light-emitting device in the display area of the substrate, wherein at least two retaining wall structures arranged at intervals are formed in the non-display area of the substrate in a manufacturing process of forming the organic light-emitting device, and an organic medium layer is formed between at least two adjacent retaining wall structures;
and forming a packaging film on one side of the organic light-emitting device, which is far away from the substrate, wherein the packaging film covers the organic light-emitting device, the packaging film comprises at least one organic layer and at least one inorganic layer, and the at least one inorganic layer covers the organic medium layer.
In the flexible organic light emitting diode display panel prepared by the manufacturing method, as the interval between the adjacent retaining wall structures is sequentially filled with the organic medium layer and at least one inorganic layer of the packaging film, the at least one inorganic layer of the packaging film covers the organic medium layer and covers the interval between the organic medium layer and the retaining wall structures. When the edge of the flexible organic light-emitting diode display panel is bent for multiple times, the organic medium layer arranged between the two adjacent retaining wall structures can effectively absorb or buffer the stress generated by the inorganic layer when the inorganic layer is bent for multiple times, so that cracks are prevented from being generated between the retaining wall structures, and further the failure of the retaining effect of the retaining wall structures on moisture or oxygen on the side surface of the display device is avoided.
Drawings
Fig. 1 is a schematic structural diagram of a crack-prone position of an OLED flexible display device in the prior art;
fig. 2 is a schematic structural diagram of an OLED flexible display device in the prior art;
FIG. 3 is a schematic structural diagram of an OLED flexible display device in the prior art;
fig. 4 to fig. 15 are schematic structural diagrams of a flexible OLED display panel according to an embodiment of the present invention;
fig. 16 to fig. 20 are schematic structural diagrams in the manufacturing process of the flexible OLED display panel according to the embodiment of the invention;
fig. 21 to 23 are schematic structural diagrams in the manufacturing process of the packaging film of the flexible OLED display panel according to the embodiment of the invention.
Detailed Description
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, the present invention is further described with reference to the accompanying drawings and examples. Example embodiments may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of example embodiments to those skilled in the art. The same reference numerals in the drawings denote the same or similar structures, and thus their repetitive description will be omitted. The words expressing the position and direction described in the present invention are illustrated in the accompanying drawings, but may be changed as required and still be within the scope of the present invention. The drawings of the present invention are only for illustrating the relative positional relationship, the layer thicknesses of some parts are exaggerated in a drawing manner for easy understanding, and the layer thicknesses in the drawings do not represent the proportional relationship of the actual layer thicknesses.
It should be noted that in the following description, specific details are set forth in order to provide a thorough understanding of the present invention. The invention can be implemented in a number of ways different from those described herein and similar generalizations can be made by those skilled in the art without departing from the spirit of the invention. Therefore, the present invention is not limited to the specific embodiments disclosed below. As used in the specification and in the claims, certain terms are used to refer to particular components. As one skilled in the art will appreciate, manufacturers may refer to a component by different names. This specification and claims do not intend to distinguish between components that differ in name but not function. In the following description and in the claims, the terms "include" and "comprise" are used in an open-ended fashion, and thus should be interpreted to mean "include, but not limited to. The description which follows is a preferred embodiment of the present application, but is made for the purpose of illustrating the general principles of the application and not for the purpose of limiting the scope of the application. The protection scope of the present application shall be subject to the definitions of the appended claims.
The inventor of the invention finds the reason that the edge of the OLED flexible display device is easy to crack when being bent for multiple times when the OLED flexible display device is used for solving the technical problem that the blocking effect of the blocking wall structure on the moisture or oxygen on the side surface is ineffective. The method comprises the following specific steps:
in order to prevent moisture or oxygen from permeating along the side surface of the OLED flexible display device, the substrate includes a retaining wall structure in the non-display region, and in order to prevent moisture or oxygen from permeating along the front surface of the OLED flexible display device, the substrate includes an encapsulation film covering the organic light emitting device in the display region and also covering a part of the retaining wall structure in the non-display region, the encapsulation film is generally composed of at least one inorganic layer and at least one organic layer, so that the retaining wall structures may be filled with an encapsulation film made of an inorganic material, and cracks are easily generated when the edge of the display device is bent for multiple times due to the low flexibility of the inorganic material.
For example, as shown in fig. 2, the retaining wall structure includes at least a first retaining wall structure 3 and a second retaining wall structure 4. Wherein, the second retaining wall structure 4 is located at the periphery of the first retaining wall structure 3, and the first retaining wall structure 3 and the second retaining wall structure 4 are arranged at intervals. The encapsulation film includes a first inorganic layer 61, an organic layer 62, and a second inorganic layer 63. The first inorganic layer 61 is formed over the substrate 1 and completely covers the organic light emitting device 2 formed in the display region, and the first inorganic layer 61 is also formed along the surface of the first bank structure 3 until being formed between the first bank structure 3 and the second bank structure 4, being blocked by the second bank structure 4. The organic layer 62 is formed over the first inorganic film and completely covers the organic light emitting device 2 of the display region, the organic layer 62 is used to increase a flow path through which foreign substances have permeated, and even if the foreign substances permeate, the organic layer 62 has a sufficient thickness to keep the surface flat. The second inorganic layer 63 is formed on the organic layer 62 so as to completely cover the organic layer 62, and is also formed along the surface of the first barrier structure 3 until being formed between the first barrier structure 3 and the second barrier structure 4, being blocked by the second barrier structure 4.
As can be seen, the first inorganic layer 61 and the second inorganic layer 62 are filled between the first retaining wall structure 3 and the second retaining wall structure 4. Since the flexibility of the inorganic material is small, cracks are easily generated when the edge of the OLED flexible display device is bent several times, as shown in fig. 3, and thus the cracks of the edge of the OLED flexible display device generally occur between the first and second barrier wall structures 3 and 4, causing the barrier effect of the first and second barrier wall structures 3 and 4 to moisture or oxygen at the side of the display device to be ineffective.
Based on the above findings of the inventor, the embodiments of the present invention provide a flexible oled display panel and a method for manufacturing the same, in which an organic dielectric layer is disposed between a first retaining wall structure 3 and a second retaining wall structure 4, so as to buffer stress generated when an inorganic material between the first retaining wall structure 3 and the second retaining wall structure 4 is bent for multiple times, thereby preventing an edge of a display device from being broken.
The embodiment of the invention provides a flexible organic light-emitting diode display panel, which mainly comprises: a substrate including a display region and a non-display region; the organic light-emitting device is arranged in the display area of the substrate; an encapsulation film covering the organic light emitting device, and the encapsulation film including at least one organic layer and at least one inorganic layer; at least two retaining wall structures, which are arranged in the non-display area of the substrate, wherein the two adjacent retaining wall structures are arranged at intervals, and at least part of the retaining wall structures are covered by the packaging film; further comprising: and the organic medium layer is arranged between at least two adjacent retaining wall structures and is arranged on the substrate, wherein the organic medium layer is covered by at least one inorganic layer.
It should be noted that the retaining wall structure includes two or more retaining wall structures, and for simplicity, the embodiment of the present invention is described by taking two adjacent retaining wall structures as an example.
It should be noted that at least a part of the retaining wall structures is covered by the encapsulation film, for example, the encapsulation film may cover all the retaining wall structures, or may cover all the retaining wall structures close to the display area, and cover all the retaining wall structures between the retaining wall structures, and partially cover the retaining wall structures at the edge of the non-display area. For simplicity, the embodiment of the invention will be described by taking the case where the packaging film covers the retaining wall structures near the display region and covers the retaining wall structures.
In addition, the encapsulation film at least includes an inorganic layer and an organic layer, and in the embodiment of the present invention, the encapsulation film includes an organic layer and two inorganic layers.
It should be noted that at least one inorganic layer of the encapsulation film covers the organic dielectric layer, and for simplicity, the implementation of the present invention will be described by taking an example in which two inorganic layers included in the encapsulation film cover the organic dielectric layer.
Optionally, as shown in fig. 4, the flexible organic light emitting diode display panel provided in the embodiment of the present invention mainly includes:
the display device comprises a substrate 1, a light emitting diode (OLED) and a light emitting diode (OLED), wherein the substrate comprises a display area A and a non-display area B, an OLED 2 arranged in the display area A of the substrate 1, a packaging film covering the OLED 2, and a first retaining wall structure 3 and a second retaining wall structure 4 arranged in the non-display area B of the substrate 1, and the adjacent first retaining wall structures 3 and the second retaining wall structures 4 are arranged at intervals; the packaging film comprises an organic layer 62, a first inorganic layer 61, a second inorganic layer 63, wherein the first inorganic layer 61 covers the organic light-emitting device 2, and also covers the first retaining wall structure 3, and the space between the first retaining wall structure 3 and the second retaining wall structure 4, the organic layer 62 is formed on the upper surface of the first inorganic layer 61, the organic layer 62 covers the organic light-emitting device 2, the second inorganic layer 63 covers the organic layer 62 and the first inorganic layer 61, and also covers the first retaining wall structure 3, and the space between the first retaining wall structure 3 and the second retaining wall structure 4, and the adjacent first retaining wall structure 3 and the second retaining wall structure 4 are arranged at intervals; the flexible organic light emitting diode display panel further comprises an organic medium layer 5 arranged between the adjacent first retaining wall structures 3 and the adjacent second retaining wall structures 4, wherein the organic medium layer 5 is arranged on the non-display area B on the substrate 1, and the organic medium layer is covered by the first inorganic layer 61 and the second inorganic layer 63.
Because the organic medium layer 5, the first inorganic layer 61 and the second inorganic layer 63 are arranged between the adjacent first retaining wall structure 3 and the second retaining wall structure 4, and the organic medium layer is covered by at least one of the first inorganic layer 61 and the second inorganic layer 63, when the edge of the flexible organic light-emitting diode display panel is bent for multiple times, the organic medium layer 5 can effectively absorb or buffer the stress generated when the first inorganic layer 61 and the second inorganic layer 63 are bent for multiple times, so that cracks between the adjacent first retaining wall structure 3 and the second retaining wall structure 4 are avoided, and further, the failure of the blocking effect of the side moisture or oxygen of the flexible organic light-emitting diode display panel by the adjacent first retaining wall structure 3 and the second retaining wall structure 4 is avoided.
In an alternative embodiment, the layers of the encapsulation film are not limited to the first inorganic layer 61, the organic layer 62, and the second inorganic layer 63, and the layers of the encapsulation film may include at least one inorganic layer and one organic layer, where the organic layer covers the organic light emitting device 2 in the display area a, the inorganic layer covers the organic light emitting device 2 in the display area a, and the at least one inorganic layer covers a portion of the retaining wall structure disposed in the non-display area B.
In an alternative embodiment, the retaining wall structures are not limited to the first retaining wall structure 3 and the second retaining wall structure 4, and the non-display area of the substrate may include at least 2 retaining wall structures, and two adjacent retaining wall structures are spaced apart from each other, wherein at least a portion of the retaining wall structures are covered by the encapsulation film.
In an alternative embodiment, in the organic dielectric layer between at least two adjacent retaining wall structures on the substrate, a person skilled in the art may set the number of the retaining walls and the number of the inorganic layers covering the retaining walls according to specific requirements, which is not limited in the present invention.
As shown in fig. 5, the first retaining wall structures 3 and the first retaining wall structures 4 disposed in the non-display area B are disposed in a manner of surrounding the display area a, and the second retaining wall structures 4 are disposed on the periphery of the first retaining wall structures 3.
In an alternative embodiment, the first retaining wall structure 3 and the second retaining wall structure 4 may each be formed of a plurality of layers of organic films that are stacked.
As shown in fig. 6, the first wall structure 3 is composed of a bottom layer portion 31, a middle layer portion 32 and a top layer portion 33 which are stacked, and the second wall structure 4 is composed of a bottom layer portion 41, a middle layer portion 42 and a top layer portion 43 which are stacked. Wherein, the bottom portion 31, the middle portion 32 and the top portion 33 of the first retaining wall structure 3 are made of the same or different organic materials; the bottom portion 41, the middle portion 42 and the top portion 43 of the second barrier structure 4 are made of the same or different organic materials.
In an alternative embodiment, the first retaining wall structures 3 and the second retaining wall structures 4 are fabricated during the process of fabricating the organic light emitting device 2 in the display area a, the organic light emitting device 2 includes an organic light emitting diode and a driving element 20 for driving the organic light emitting diode to emit light, the organic light emitting diode includes a first electrode 21, an organic light emitting layer 22 and a second electrode 23, wherein the first electrode 21 is an anode and the second electrode 23 is a cathode. The organic light emitting device 2 is fabricated on a display function layer, which is a function thin film layer of a flexible organic light emitting diode display panel, and the display function layer includes a planarization layer 8, a pixel defining layer 9, and a spacer layer (not shown) sequentially arranged in a direction close to the encapsulation thin film. The display function layer covers the drive elements 20.
In the embodiment of the present invention, the bottom portion 31 of the first retaining wall structure 3, the bottom portion 41 of the second retaining wall structure 4 and the planarization layer 8 are fabricated in the same layer, the middle portion 32 of the first retaining wall structure 3, the middle portion 42 of the second retaining wall structure 4 and the pixel defining layer 9 are fabricated in the same layer, and the top portion 43 of the first retaining wall structure 3 and the top portion 43 of the second retaining wall structure 4 and the spacer layer are fabricated in the same layer.
In an alternative embodiment, the organic dielectric layer 5 may be disposed on the same layer as any one of the bottom portion 31, the middle portion 32 and the top portion 33 of the first retaining wall structure 3. For example, in order to simplify the manufacturing process, the organic dielectric layer 5 and the bottom portion 31 of the first retaining wall structure 3 closest to the substrate 1 may be disposed in the same layer.
In an alternative embodiment, the organic dielectric layer is respectively connected to two adjacent retaining wall structures, as shown in fig. 7, the organic dielectric layer 5 is connected to the first retaining wall structure 3 and the second retaining wall structure 4. Based on this, at least one inorganic layer of the encapsulation film can directly cover the upper surface of the organic medium layer 5, and when the edge of the flexible organic light emitting diode display panel is bent for multiple times, the organic medium layer 5 can effectively absorb or buffer the stress generated by the at least one inorganic layer of the encapsulation film during multiple bending, so as to avoid cracks between the first retaining wall structure 3 and the second retaining wall structure 4.
In an alternative embodiment, the organic dielectric layer disposed between two adjacent retaining wall structures is connected to one of the retaining wall structures and disposed at an interval with the other retaining wall structure.
Optionally, the organic dielectric layer 5 is disposed at an interval with at least one of the first retaining wall structure 3 and the second retaining wall structure 4.
Wherein, the organic medium layer 5 and the first retaining wall structure 3, the second retaining wall structure 4 in at least one interval set up the benefit be:
because the first retaining wall structure 3, the organic medium layer 5 and the second retaining wall structure 4 are all organic layers, if the organic medium layer 5 is connected with the first retaining wall structure 3 and the second retaining wall structure 4, the organic medium layer 5 can easily absorb foreign matters such as water, oxygen and the like in the air, and because the transmission path of the foreign matters entering the display area from the retaining wall structure is short, the foreign matters can quickly permeate the display area.
Optionally, as shown in fig. 8, the organic dielectric layer 5 is connected to the first retaining wall structure 3, and the organic dielectric layer 5 and the second retaining wall structure 4 are disposed at an interval, where the second retaining wall structure 4 is a retaining wall structure close to the edge of the substrate 1. Based on this, at least one inorganic layer of the encapsulation film may cover the upper surface of the organic medium layer 5, and may also cover the space between the organic medium layer 5 and the second barrier structure 4.
As shown in fig. 9, the organic medium layer 5 is connected to the first retaining wall structure 3, when the organic medium layer 5 and the second retaining wall structure 4 are disposed at an interval, the first inorganic layer 61 and the second inorganic layer 63 of the encapsulation film not only cover the upper surface of the organic medium layer 5, but also cover the interval between the organic medium layer 5 and the second retaining wall structure 4, because the interval is close to the edge of the substrate 1, the first inorganic layer 61 and the second inorganic layer 63 can well block foreign matters from outside the second retaining wall structure 4, and the first inorganic layer 61 and the second inorganic layer 63 covered in the interval block a path through which the foreign matters permeate toward the display area.
Alternatively, as shown in fig. 10, the organic dielectric layer 5 is disposed at an interval with the adjacent first barrier structures 3 and second barrier structures 4. Based on this, at least one inorganic layer of the encapsulation film may cover the upper surface of the organic dielectric layer 5, and may also cover the space between the organic dielectric layer 5 and the first and second retaining wall structures 3 and 4, respectively.
As shown in fig. 11, when the organic dielectric layer 5, the first retaining wall structure 3, and the second retaining wall structure 4 are disposed at an interval, the first inorganic layer 61 and the second inorganic layer 63 of the encapsulation film not only cover the upper surface of the organic dielectric layer 5, but also cover the interval between the organic dielectric layer 5 and the first retaining wall structure 3, and the interval between the organic dielectric layer 5 and the second retaining wall structure 4, because the number of the intervals is increased, the first inorganic layer 61 and the second inorganic layer 63 can well block foreign matters from outside the second retaining wall structure 4, and the first inorganic layer 61 and the second inorganic layer 63 covered in the intervals block a path through which the foreign matters permeate toward the display area. Since the number of spaces is increased, the blocking effect of the foreign substances by the first inorganic layer 61 and the second inorganic layer 63 covering the spaces is enhanced.
In an alternative embodiment, the organic dielectric layer 5 is provided with at least one groove and/or at least one through-thickness opening.
Alternatively, the shape of the opening of the groove, the shape of the opening in the through thickness direction, may be at least one of a V-shape, a rectangular shape, or other shapes.
As shown in fig. 12, a groove 11 and an opening 12 penetrating through the organic medium layer 5 in the thickness direction are formed, the groove 11 is disposed near the second barrier structure 4, the opening of the groove 11 is V-shaped, the opening 12 penetrating through the thickness direction is disposed near the first barrier structure 3, and the opening 12 is rectangular. Based on this, when the packaging film is formed, at least one inorganic layer of the packaging film can cover the grooves 11 and the openings 12, and the grooves 11 and the openings 12 can increase the contact area between the inorganic layer in the packaging film and the organic medium layer 5, so that the organic medium layer 5 can better absorb and buffer the stress generated by the inorganic medium layer during multiple bending, and the blocking effect of the inorganic layer covering the grooves 11 and the openings 12 on foreign matters outside the second barrier wall structure 4 can be enhanced.
In an optional embodiment, any one of the flexible oled display panels further includes: and the protective layer is arranged on the packaging film between at least two adjacent retaining wall structures. The protective layer can cover the packaging film between the two retaining wall structures, can also cover the retaining wall structure close to the edge of the non-display area in the two retaining wall structures, and can also cover the substrate outside the retaining wall structures. Alternatively, as shown in fig. 13 and 14, the protective layer 7 is disposed between the first and second barrier structures 3 and 4 and directly covers the second inorganic layer 63 of the encapsulation film. Because the protective layer 7 is arranged between the first retaining wall structure 3 and the second retaining wall structure 4, the protective layer 7 is in direct contact with the second inorganic layer 63, the organic medium layer 5 is in direct contact with the first inorganic layer 61, the protective layer 7 can absorb and buffer the stress generated when the second inorganic layer 63 is bent for multiple times, the organic medium layer 5 can absorb and buffer the stress generated when the first inorganic layer 61 is bent for multiple times, the direct contact between the first inorganic layer 61 and the second inorganic layer 63 is avoided, and the stress concentration is easily generated to generate bending cracks.
Optionally, the material of the protective layer 7 may be ink or colloid.
In an alternative embodiment, the protective layer may be further disposed on the first inorganic layer 61 between the first retaining wall structure 3 and the second retaining wall structure 4, so that the protective layer is located between the first inorganic layer 61 and the second inorganic layer 63, thereby preventing the two inorganic layers from directly contacting between the first retaining wall structure 3 and the second retaining wall structure 4, relieving stress between the inorganic layers, and preventing crack propagation.
In an alternative embodiment, as shown in fig. 15, the protective layer 7 covers the surface of the second inorganic layer 63 between the first retaining wall structure 3 and the second retaining wall structure 4, the surface of the second retaining wall structure 4, and the substrate 1 except for the second retaining wall structure 4. In this way, the protective layer 7 can absorb and relieve the stress generated when the second inorganic layer 63 is bent for multiple times, and can also absorb the stress generated when the substrate 1 at the periphery of the first retaining wall structure 3 is cut, so as to prevent the substrate 1 at the periphery of the first retaining wall structure 3 from generating cutting cracks, and prevent the cutting cracks from spreading toward the display region.
Based on the same inventive concept, an embodiment of the present invention provides a display device, including any one of the flexible oled display panels described above, such that when the edge of the display device is bent for multiple times, the bending stress of the inorganic material filled between the first retaining wall structure 3 and the second retaining wall structure 4 is absorbed by the organic medium layer 5, thereby preventing cracks from being generated between the first retaining wall structure 3 and the second retaining wall structure 4.
Based on the same inventive concept, an embodiment of the present invention provides a method for manufacturing a flexible organic light emitting diode display panel, including:
step S1, providing a substrate 1, wherein the substrate 1 comprises a display area and a non-display area;
the substrate provided in step S1 refers to a substrate on which each driving element of the display function layer has been formed in the display area, such as a gate insulating layer on the substrate, and each of the switching thin film transistors, the driving thin film transistors, and the gate driving signal traces and the source driving signal traces connected to each driving element, which are formed on the gate insulating layer.
Step S2, forming an organic light emitting device 2 in the display area of the substrate 1, wherein in the process of forming the organic light emitting device 2, at least two barrier structures are formed in the non-display area of the substrate 1 at intervals, and an organic dielectric layer 5 is formed between at least two adjacent barrier structures;
the organic light-emitting device comprises a driving element, a display function layer and an organic light-emitting diode formed on the display function layer, wherein the display function layer comprises a planarization layer, a pixel definition layer and a spacer layer which are sequentially arranged along the direction departing from the substrate. The retaining wall structure comprises a bottom layer part, a middle layer part and a top layer part which are arranged in a stacked mode, the bottom layer part and the planarization layer of the retaining wall structure are manufactured in the same layer, the middle layer part and the pixel defining layer of the retaining wall structure are manufactured in the same layer, and the top layer part and the spacer layer of the retaining wall structure are manufactured in the same layer. In addition, the organic dielectric layer between the retaining wall structures can be manufactured with any one of the bottom layer part, the middle layer part and the top layer part of the retaining wall structures in the same layer.
Step S3, forming an encapsulation film on the substrate 1, the encapsulation film at least covering the organic light emitting device 2 and part of the retaining wall structure; wherein forming an encapsulation film on the substrate 1 includes forming at least one organic layer and at least one inorganic layer on the substrate 1. Thus, the organic medium layer and at least one inorganic layer of the packaging film are filled in the interval between the retaining wall structures, and the at least one inorganic layer of the packaging film covers the organic medium layer and covers the interval between the organic medium layer and the retaining wall structures. Therefore, when the edge of the flexible organic light-emitting diode display panel is bent for multiple times, the organic medium layer arranged between the two adjacent retaining wall structures can effectively absorb or buffer the stress generated by the inorganic layer when the inorganic layer is bent for multiple times, so that cracks are prevented from being generated between the retaining wall structures, and further the failure of the retaining effect of the retaining wall structures on moisture or oxygen on the side surface of the display device is avoided.
It should be noted that the retaining wall structure in the above method flow includes two or more retaining wall structures, and for simplicity, the embodiment of the present invention is described by taking two adjacent retaining wall structures as an example.
It should be noted that, in the above method flow, at least a part of the retaining wall structures are covered by the encapsulation film, for example, the encapsulation film may cover all the retaining wall structures, or may cover all the retaining wall structures close to the display region, and cover all the retaining wall structures between the retaining wall structures, and partially cover the retaining wall structures at the edge of the non-display region. For simplicity, the embodiment of the invention will be described by taking the case where the packaging film covers the retaining wall structures near the display region and covers the retaining wall structures.
It should be noted that the encapsulation film in the above method flow at least includes one inorganic layer and one organic layer, and in the embodiment of the present invention, the encapsulation film includes one organic layer and two inorganic layers as an example.
It should be noted that, in the above method flow, at least one inorganic layer of the encapsulation film covers the organic dielectric layer, for simplicity, in the implementation of the present invention, the description is given by taking an example that two inorganic layers included in the encapsulation film cover the organic dielectric layer.
In the following embodiment of the present invention, the method flow is described by taking two adjacent retaining wall structures as the first retaining wall structure 3 and the second retaining wall structure 4, respectively, the first retaining wall structure 3 is surrounded by the second retaining wall structure 4, and the encapsulation film includes one organic layer and two inorganic layers, where the step S2 specifically includes:
step S20: a first organic film C is formed on the substrate 1, and a planarization layer 8 is formed in the display region by a patterning process based on the first organic film C, and the underlying portions 31 of the first barrier structures 3 and the underlying portions 41 of the second barrier structures 4 are formed in the non-display region.
Alternatively, the structure formed in step S20 is shown in fig. 16, and includes the planarization layer 8 formed in the display region of the substrate 1, and further includes the bottom layer portion 31 of the first retaining wall structure and the bottom layer portion 41 of the second retaining wall structure formed in the non-display region of the substrate 1. The planarization layer 8 covers the driving element 20 of the display function layer, and the planarization layer 8, the bottom layer portion 31 of the first barrier structure, and the bottom layer portion 41 of the second barrier structure are fabricated in the same layer.
Optionally, as shown in fig. 16, based on the first organic film C, an organic dielectric layer 5 is formed between the first retaining wall structure 3 and the second retaining wall structure 4 through a patterning process, so that the organic dielectric layer 5 is fabricated on the same layer as the bottom layer portion 31 of the first retaining wall structure 3 and the bottom layer portion 41 of the second retaining wall structure 4.
Optionally, the thickness of the organic dielectric layer 5 may be the same as or different from the thicknesses of the bottom portion 31 of the first retaining wall structure and the bottom portion 41 of the second retaining wall structure.
Step S21: the first electrodes 21 of the respective organic light-emitting diodes are formed on the surface of the planarization layer 8 facing away from the substrate 1.
The first electrode 21 is an anode (or a cathode) of the organic light emitting diode, and contact holes are further formed in the planarization layer 8, so that the first electrode 21 of each organic light emitting diode is connected to an electrode (e.g., a drain electrode) of the corresponding driving element 20 through the contact hole.
Alternatively, referring to fig. 17, the structure formed in step S21 includes, in addition to the planarization layer 8 formed in the display region of the substrate 1, the bottom portion 31 of the first barrier wall structure and the bottom portion 41 of the second barrier wall structure formed in the non-display region of the substrate 1, and the organic dielectric layer 5, the first electrode 21 formed on the planarization layer 8.
Step S22: a second organic film D is formed on the substrate 1, and the pixel defining layer 9 is formed in the display region and the middle portion 32 of the first barrier structure 3 and the middle portion 42 of the second barrier structure 4 are formed in the non-display region through a patterning process based on the second organic film D.
Wherein the pixel defining layer 9 is used to define each pixel, and the pixel defining layer 9 covers the first electrode 21 of each organic light emitting diode.
Alternatively, the structure formed in step S22, referring to fig. 18, includes a pixel defining layer 9 formed in the display area of the substrate 1, and an intermediate layer portion 32 of the first bank structure and an intermediate layer portion 42 of the second bank structure formed in the non-display area of the substrate 1, in addition to the planarization layer 8 and the first electrode 21 formed in the display area of the substrate 1, the bottom layer portion 31 of the first bank structure and the bottom layer portion 41 of the second bank structure formed in the non-display area of the substrate 1, and the organic dielectric layer 5.
Optionally, based on the second organic film D, the organic medium layer 5 between the first retaining wall structure 3 and the second retaining wall structure 4 is further formed according to the composition process, so that the organic medium layer 5 is manufactured in the same layer as the middle layer portion 32 of the first retaining wall structure 3 and the middle layer portion 42 of the second retaining wall structure 4. The film layers in which the planarization layer 8, the bottom layer portion 31 of the first barrier structure, and the bottom layer portion 41 of the second barrier structure are located are all the first organic film C, and the film layers in which the pixel defining layer, the middle layer portion 32 of the first barrier structure, and the middle layer portion 42 of the second barrier structure are all the second organic film D. Alternatively, the thickness of the organic dielectric layer 5 may be the same as or different from the thickness of the middle layer portion 32 of the first retaining wall structure 3 and the thickness of the middle layer portion 42 of the second retaining wall structure 4.
Step S23: a third organic film E is formed on the substrate 1, a spacer layer (not shown) and an organic light emitting layer 22 are formed in a display region through a patterning process based on the third organic film E, and a top portion 33 of the first bank structure 3 and a top portion 43 of the second bank structure 4 are formed in a non-display region.
Wherein, the spacer layer is formed on the side of the pixel defining layer 9 away from the substrate 1, and the spacer layer is located between the second electrode and the first electrode. Wherein the organic light emitting layer 22 is formed between the adjacent pixel defining layers 9.
Alternatively, referring to fig. 19, the structure formed in step S23 includes, in addition to the planarization layer 8, the first electrode 21, the pixel defining layer 9, and the organic light emitting layer 22 formed in the display area of the substrate 1, the bottom portion 31 of the first barrier structure, the bottom portion 41 of the second barrier structure, the middle portion 32 of the first barrier structure, the middle portion 42 of the second barrier structure, and the organic dielectric layer 5 formed in the non-display area of the substrate 1, further including: a spacer layer (not shown) and an organic light emitting layer 22 formed on a side of the pixel defining layer 9 facing away from the substrate 1, and a top portion 33 of the first bank structure and a top portion 43 of the second bank structure formed on the non-display region of the substrate 1.
Optionally, based on the third organic film E, according to the composition process, the organic medium layer 5 between the first retaining wall structure 3 and the second retaining wall structure 4 is further formed, so that the organic medium layer 5, the first retaining wall structure 3, and the top layer portion of the second retaining wall structure 4 are manufactured in the same layer. The films where the planarization layer 8, the bottom portion 31 of the first barrier structure, and the bottom portion 41 of the second barrier structure are located are all the first organic films C, the films where the pixel defining layer 9, the middle portion 32 of the first barrier structure, and the middle portion 42 of the second barrier structure are all the second organic films D, and the films where the organic dielectric layer 5, the spacer layer, the top portion 33 of the first barrier structure, and the top portion 43 of the second barrier structure are all the third organic films E. Optionally, the materials of the first organic film C, the second organic film D, and the third organic film may be the same or different, and the invention is not limited thereto.
Alternatively, the thickness of the organic dielectric layer 5 may be the same as or different from the thickness of the top layer portion 33 of the first barrier structure and the top layer portion 43 of the second barrier structure.
Step S24: the second electrode 23 of each organic light emitting diode is formed on the surface of the pixel defining layer 9 facing away from the substrate 1.
The second electrode 23 covers the organic light emitting layer 22 of the organic light emitting diode, and the second electrode 23 is a cathode (or an anode) of the organic light emitting diode.
Optionally, referring to fig. 20, the structure formed in step S23 includes a second electrode 23 formed on a side of the pixel defining layer 9 away from the substrate 1, in addition to the planarization layer 8 formed in the display area of the substrate 1, the first electrode 21, the pixel defining layer 9, the organic light emitting layer 22, the bottom portion 31 of the first barrier wall structure, the bottom portion 41 of the second barrier wall structure, the middle portion 32 of the first barrier wall structure, the middle portion 42 of the second barrier wall structure, and the organic dielectric layer 5 formed in the non-display area of the substrate 1.
Optionally, step S24 is followed by:
after the second electrode 23 is formed, a covering layer (not shown) may be further formed on the surface of the second electrode 23 facing away from the substrate 1, and the covering layer is used to protect the second electrode and prevent the second electrode 23 from being damaged by foreign matters such as water, oxygen and the like in the air before the encapsulation film is formed.
Optionally, step S3 specifically includes:
step S31: a first inorganic layer 61 is formed on a side of the organic light emitting device 2 facing away from the substrate 1, and the first inorganic layer 61 covers the organic light emitting device 2, the first barrier structures 3 and the organic medium layer 5 of the display region.
As shown in fig. 21, an organic light emitting device 2, a first barrier structure 3, a second barrier structure 4, and an organic medium layer 5 between the first barrier structure 3 and the second barrier structure 4 are formed on a substrate 1, and the organic medium layer 5 is connected to the first barrier structure 3 and the second barrier structure 4, on the basis of which a first inorganic layer 61 is formed, such that the first inorganic layer 61 covers the organic light emitting device 2, the first barrier structure 3, and the organic medium layer 5 between the first barrier structure 3 and the second barrier structure 4 in the display region.
Step S32: the organic layer 62 is formed on the side of the first inorganic layer 61 facing away from the substrate 1, the organic layer 62 covers only the organic light emitting device 2 of the display region and does not cover the first barrier structures 3 of the non-display region, so that the organic layer 62 is blocked by the first barrier structures 3, the organic layer 62 is used to increase the flow path of the penetrated foreign matters, and even if the penetrated foreign matters exist, the organic layer 62 has a sufficient thickness to keep the surface of the first inorganic layer 61 flat.
As shown in fig. 22, an organic layer 62 is formed on a side of the first inorganic layer 61 facing away from the substrate 1, such that the organic layer 62 covers the organic light emitting device 2 of the display region, and the organic layer 62 is blocked by the first bank structure 3 of the non-display region.
Step S33: a second inorganic layer 63 is formed on the side of the organic layer 62 facing away from the substrate 1, the second inorganic layer 63 is formed on the side of the organic layer 62 facing away from the substrate 1 so as to completely cover the organic layer 62 and the first inorganic layer 61, and the second inorganic layer 63 is also formed along the surface of the first inorganic layer 61 on the surface of the first barrier structure 3 until it is filled between the first barrier structure 3 and the second barrier structure 4 and is blocked by the second barrier structure 4.
As in fig. 23, a second inorganic layer 63 is formed on the side of the organic layer 62 facing away from the substrate 1, such that the second inorganic layer 63 covers the first inorganic layer 61 and the organic layer 62. Since the first inorganic layer 61 covers the organic light emitting device 2, the first barrier structure 3, and the organic medium layer 5 between the first barrier structure 3 and the second barrier structure 4 in the display region, the second inorganic layer 63 also covers the organic light emitting device 2, the first barrier structure 3, and the organic medium layer 5 between the first barrier structure 3 and the second barrier structure 4 in the display region.
Thus, the organic medium layer 5, the first inorganic layer 61 and the second inorganic layer 63 are sequentially filled in the space between the first retaining wall structure 3 and the second retaining wall structure 4, when the edge of the flexible organic light emitting diode display panel is bent for multiple times, the stress generated by the first inorganic layer 61 and the second inorganic layer 63 is absorbed by the organic medium layer 5, and further, cracks are prevented from being generated when the edge of the flexible organic light emitting diode display panel is bent for multiple times. Optionally, for any organic dielectric layer 5 formed in the above steps, the positional relationship between the organic dielectric layer and the first and second retaining wall structures 3 and 4 may be as follows:
the first method comprises the following steps: the organic medium layer 5 is connected to the first and second barrier structures 3 and 4, respectively.
And the second method comprises the following steps: the organic medium layer 5 is connected with the first retaining wall structure 3 and is arranged at an interval with the second retaining wall structure 4.
And the third is that: the organic medium layer 5 is connected with the second retaining wall structure 4 and is arranged at an interval with the first retaining wall structure 3.
And fourthly: the organic medium layer 5 and the adjacent first retaining wall structures 3 and second retaining wall structures 4 are arranged at intervals.
The details of the above positional relationships are referred to the above embodiments, and will not be described in detail here.
When the positional relationship between the organic medium layer 5 and the first and second barrier structures 3 and 4 is the first type, the first barrier structure 3, the organic medium layer 5, and the second barrier structure 4 are all organic layers, which easily absorb foreign substances such as water and oxygen in the air and can easily permeate the foreign substances into the display region as a passage.
Optionally, the organic medium layer 5 and at least one of the first retaining wall structure 3 and the second retaining wall structure 4 are arranged at an interval, that is, when the position relationship between the organic medium layer 5 and the first retaining wall structure 3 and the second retaining wall structure 4 is the second, third or fourth type, the first inorganic layer 61 and the second inorganic layer 63 are filled in the interval between the organic medium layer 5 and the first retaining wall structure 3 and/or the second retaining wall structure 4, and the first inorganic layer 61 and the second inorganic layer 63 filled in the interval can effectively prevent the penetration of foreign matters such as water, oxygen and the like in the air toward the display area.
Optionally, for the step S20, the step S22, and the step S24, after the forming the organic dielectric layer 5, the method further includes: at least one groove is etched on the organic medium layer 5, or at least one opening penetrating through the thickness direction is etched on the organic medium layer 5, or the opening penetrating through the thickness direction is also etched while one groove is etched on the organic medium layer 5. The first inorganic layer 61 and the second inorganic layer 63 are filled in the opening or the groove of the organic medium layer 5, and the first inorganic layer 61 and the second inorganic layer 63 filled in the opening or the groove of the organic medium layer 5 can effectively prevent foreign matters such as water, oxygen and the like in the air from permeating towards the display area.
The specific contents of the grooves or the openings etched in the organic dielectric layer 5 are as described in the above embodiments, and will not be described herein again.
After step S33, the method further includes:
step S4: and forming a protective layer 7 on the packaging film, wherein the protective layer 7 at least covers the upper surface of the packaging film formed between the adjacent first retaining wall structures 3 and the adjacent second retaining wall structures 4.
Alternatively, the protective layer 7 covers the upper surface of the second inorganic layer 63 formed between the adjacent first and second retaining wall structures 3 and 4. Because the protective layer 7 is arranged between the first retaining wall structure 3 and the second retaining wall structure 4, the protective layer 7 is in direct contact with the second inorganic layer 63, the organic medium layer 5 is in direct contact with the first inorganic layer 61, when the edge of the flexible organic light emitting diode display panel is bent for multiple times, the protective layer 7 can absorb and buffer the stress generated when the second inorganic layer 63 is bent for multiple times, the organic medium layer 5 can absorb and buffer the stress generated when the first inorganic layer 61 is bent for multiple times, the direct contact between the first inorganic layer 61 and the second inorganic layer 63 is avoided, and the stress concentration and the bending crack are easily generated.
Optionally, the protective layer 7 also covers the retaining wall structures closest to the edge of the substrate 1. The protective layer 7 covers not only the upper surface of the second inorganic layer 63 between the first barrier structure 3 and the second barrier structure 4, but also the surface of the second barrier structure 4 and the surface of the substrate 1 at the periphery of the second barrier structure 4. The protective layer 7 can absorb and relieve the stress generated when the second inorganic layer 63 is bent for multiple times, and can also absorb the stress generated when the substrate 1 at the periphery of the first retaining wall structure 3 is cut, so as to prevent the substrate 1 at the periphery of the first retaining wall structure 3 from generating cutting cracks, and prevent the cutting cracks from spreading towards the display region.
It will be apparent to those skilled in the art that various modifications and variations can be made in the embodiments of the present invention without departing from the spirit and scope of the application. Thus, if such modifications and variations of the embodiments of the present invention fall within the scope of the claims of the present application and their equivalents, the present application is also intended to encompass such modifications and variations.
Claims (19)
1. A flexible organic light emitting diode display panel, comprising:
a substrate including a display region and a non-display region;
the organic light-emitting device is arranged in the display area of the substrate;
an encapsulation film covering the organic light emitting device, and the encapsulation film including at least one organic layer and at least one inorganic layer; wherein the inorganic layer comprises: a first inorganic layer, a second inorganic layer;
at least two retaining wall structures, which are arranged in the non-display area of the substrate, wherein the two adjacent retaining wall structures are arranged at intervals, and at least part of the retaining wall structures are covered by the packaging film; the orthographic projection of the at least one organic layer on the substrate is positioned on the inner side of the retaining wall structure which is close to the display area in the at least two retaining wall structures;
further comprising: an organic dielectric layer disposed between at least two adjacent retaining wall structures, the organic dielectric layer being disposed on the substrate, wherein the organic dielectric layer is covered by the first inorganic layer and the second inorganic layer, and the first inorganic layer and the second inorganic layer covering the organic dielectric layer are in direct contact;
each retaining wall structure consists of a plurality of layers of organic films which are arranged in a stacked mode; the organic medium layer and at least one layer of the organic film are arranged on the same layer;
the organic medium layer arranged between two adjacent retaining wall structures is connected with one of the retaining wall structures and arranged at intervals with the other retaining wall structure; or the organic medium layer and the adjacent two retaining wall structures are arranged between the two adjacent retaining wall structures at intervals.
2. The flexible oled display panel of claim 1 wherein the organic dielectric layer is spaced apart from adjacent dam structures adjacent to the edge of the substrate.
3. The flexible oled display panel of claim 1, wherein the organic dielectric layer is disposed in a same layer as an organic film that is closest to the substrate.
4. The flexible oled display panel of any one of claims 1-3, wherein the organic dielectric layer has at least one recess and/or at least one through-thickness opening.
5. The flexible organic light emitting diode display panel of claim 4, further comprising a protective layer; the protective layer at least covers the inorganic layer between two adjacent retaining wall structures.
6. The flexible oled display panel of claim 5 wherein the protective layer further covers the dam structures closest to the edge of the substrate.
7. The flexible oled display panel as claimed in claim 5, wherein the protective layer is made of ink or gel.
8. The flexible organic light emitting diode display panel of claim 5, wherein the at least one inorganic layer of the encapsulation film covers the opening and/or the groove.
9. A display device, comprising: the flexible organic light emitting diode display panel of any one of claims 1 to 8.
10. A manufacturing method of a flexible organic light emitting diode display panel is characterized by comprising the following steps:
providing a substrate, wherein the substrate comprises a display area and a non-display area;
forming an organic light-emitting device in the display area of the substrate, wherein at least two retaining wall structures arranged at intervals are formed in the non-display area of the substrate in a manufacturing process of forming the organic light-emitting device, and an organic medium layer is formed between at least two adjacent retaining wall structures;
forming a packaging film on one side of the organic light-emitting device, which is far away from the substrate, wherein the packaging film covers the organic light-emitting device, the packaging film comprises at least one organic layer and at least one inorganic layer, and the at least one inorganic layer covers the organic medium layer; the orthographic projection of the at least one organic layer on the substrate is positioned on the inner side of the retaining wall structure which is close to the display area in the at least two retaining wall structures;
wherein, when forming the organic dielectric layer between at least two adjacent retaining wall structures, the position relation of the organic dielectric layer and at least two adjacent retaining wall structures is as follows:
the organic medium layer is connected with one of the retaining wall structures and is arranged at intervals with the other retaining wall structure; or,
the organic medium layer and the two adjacent retaining wall structures are arranged at intervals.
11. The method of claim 10, wherein forming an organic light emitting device in the display region of the substrate comprises:
forming a planarization layer on the display region on the substrate;
forming a first electrode of the organic light-emitting device on a surface of the planarization layer facing away from the substrate;
forming a pixel defining layer on the display region on the substrate, wherein the pixel defining layer covers the first electrode;
forming a spacer layer on one side of the pixel defining layer, which is far away from the substrate, and preparing an organic light emitting layer of the organic light emitting device;
forming a second electrode of the organic light emitting device on a surface of the pixel defining layer facing away from the substrate.
12. The method according to claim 11, wherein forming at least two spaced apart dam structures in the non-display region of the substrate during the process of forming the organic light emitting device comprises:
forming a bottom layer part of each retaining wall structure when the planarization layer is formed;
forming a middle layer part of each of the bank structures when the pixel defining layer is formed;
and forming the top layer part of each retaining wall structure when the spacer layer is formed.
13. The method according to claim 12, wherein forming an organic dielectric layer between at least two adjacent retaining wall structures comprises:
and forming the organic dielectric layer when at least one of the bottom layer part, the middle layer part and the top layer part of each retaining wall structure is formed.
14. The method according to claim 13, wherein the organic dielectric layer is formed during the step of forming the bottom layer portion of each of the retaining wall structures.
15. The method according to claim 10, wherein when the organic dielectric layer is spaced apart from one of the retaining wall structures, the organic dielectric layer is spaced apart from an adjacent retaining wall structure near the edge of the substrate.
16. The method of any of claims 10 to 15, further comprising, after forming the organic dielectric layer:
and etching a groove and/or at least one opening penetrating through the thickness direction on the organic medium layer.
17. The method of manufacturing of claim 16, further comprising, after forming the encapsulation film:
and forming a protective layer on the packaging film, wherein the protective layer at least covers the upper surface of the at least one inorganic layer formed between two adjacent retaining wall structures.
18. The method of claim 17, wherein the protective layer further covers the retaining wall structure closest to the edge of the substrate.
19. The method of claim 16, wherein the at least one inorganic layer covers the opening and/or the recess.
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