WO2019127203A1

WO2019127203A1 - Display screen, manufacture method thereof, and display device

Info

Publication number: WO2019127203A1
Application number: PCT/CN2017/119331
Authority: WO
Inventors: 邱昌明; 王雨宁
Original assignee: 深圳市柔宇科技有限公司
Priority date: 2017-12-28
Filing date: 2017-12-28
Publication date: 2019-07-04
Also published as: CN111433915A

Abstract

Provided is a display screen, comprising a substrate (10), a light emitting function layer (14) provided on the substrate (10), and an encapsulation layer (18) for encapsulating the light emitting function layer (14), a retaining wall (19) around the encapsulation layer (18) is provided on an edge region (B) of the substrate (10), a groove (13) is arranged on the edge region (B) of the substrate (10), wherein, the retaining wall (19) covers the groove (13) and the end of the retaining wall (19) connected to the substrate (10) is embedded in the groove (13).

Description

Display screen and its making method, and display device

Technical field

The present invention relates to the field of flexible display technologies, and in particular, to a display screen, a display screen manufacturing method, and a display device.

Background technique

Existing organic light-emitting diodes (OLED) displays are self-illuminating, thin, and can be folded and folded. The thin film package is a packaging method of the OLED device to realize the sealing of the OLED device. In general, the package structure needs to be provided with an auxiliary structure in the edge region to achieve the package precision, and it is difficult to ensure a narrow frame of the frame area of the display screen.

Summary of the invention

Embodiments of the present invention provide a display screen and a display device having a narrow frame.

The display screen of the present invention includes a substrate, a light emitting function layer disposed on the substrate, and an encapsulation layer encapsulating the light emitting function layer.

A retaining wall surrounding the encapsulating layer is disposed on an edge region of the substrate, and a groove is disposed on the edge region of the substrate, wherein the retaining wall covers the trench and the retaining wall is connected to the substrate The ends are embedded in the grooves.

The retaining wall and the groove laminate combination of the embodiment of the invention not only effectively block the ductile crack of the inorganic layer, but also avoid the device failure caused by the water vapor intrusion; and can effectively avoid the overflow of the molten organic material of the encapsulating layer during the film forming process, It is better to make the border as small as possible to achieve a narrow border or no border.

DRAWINGS

In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings to be used in the embodiments will be briefly described below. It is obvious that the drawings in the following description are only some embodiments of the present invention. Those skilled in the art can also obtain other drawings based on these drawings without paying any creative work.

1 is a schematic plan view showing an internal side view of a display screen provided by the present invention.

2 is a schematic cross-sectional view showing the internal structure of the display screen shown in FIG. 1.

3 is a plan view showing an internal side view of another embodiment of the display screen shown in FIG. 1.

4 is a flow chart of a method of manufacturing a display screen of the present invention.

Detailed ways

The technical solutions in the embodiments of the present invention will be clearly and completely described in the following with reference to the accompanying drawings.

An embodiment of the present invention provides a display screen and a display device. The display screen is a flexible screen including an organic light emitting diode. The display device includes the display screen or a display screen and a touch panel, and the display device may be an in-vehicle device. A wearable device or a portable terminal device.

Referring to FIG. 1 , the display screen is specifically an Active Matrix/Organic Light Emitting Diode (AMOLED) display screen, and includes a substrate 10 including a display area A and an edge area. B. The substrate 10 is a flexible substrate or a glass substrate. In this embodiment, the substrate 10 is made of a flexible material, and the display screen is a flexible display screen. The display area A of the substrate 10 corresponds to the display area of the display screen, and the edge area B corresponds to the edge area of the display screen. Organic light-emitting diodes (OLED devices), TFT devices, and the like are disposed in the display area of the display screen, and are all carried by the substrate.

Located in the display area A, the substrate 10 is provided with a light-emitting function layer 14 and an encapsulation layer 18 encapsulating the light-emitting function layer. The encapsulation layer 18 is formed by a thin film encapsulation, which is formed by stacking an inorganic layer, an organic layer and an inorganic layer. Usually, the inorganic layer is a combination of SiOx, SiNx or an inorganic material, and the organic layer is formed by using an IJP (inject printer) technology in the luminescent functional layer. 14 is uniformly coated with a molten insulating material which can block moisture.

Located in the edge region B of the substrate 10, the substrate 10 is provided with a retaining wall 19 disposed around the encapsulating layer 18, and the edge of the substrate 10 is provided with a groove 13 toward the retaining wall 19, wherein A retaining wall 19 is stacked above the groove 13 and covers the groove 13, and an end of the retaining wall 19 connected to the substrate is embedded in the groove 13 to fill the groove 13.

The retaining wall 19 is used to block the phenomenon that the molten insulating material overflows due to material flow characteristics when the encapsulating layer 18 is packaged, and the groove 13 is used to prevent stretching or compression of the flexible screen to cause ductility of the inorganic layer. In the case of cracks, the ductile cracks will stop at the groove 13 and prevent moisture from entering, causing damage to the OLED device and the TFT device. The retaining wall 19 of the embodiment of the present invention is laminated with the groove 13 and partially embedded with each other, which not only effectively blocks the ductile crack of the inorganic layer, but also avoids the device failure caused by water vapor intrusion; and can effectively prevent the encapsulating layer 18 from being formed during the film forming process. Overflow of medium melted organic material. The most important thing is to make the border as small as possible, to achieve a narrow border or no border.

As shown in FIG. 2, in the embodiment, the retaining wall 19 includes a first retaining wall body 191 and a second retaining wall body 192 laminated on the first retaining wall body 191 away from the surface of the substrate. 14 includes a thin film transistor layer 15, a flat layer 155 covering the thin film transistor layer 15, and a pixel defining layer 16 and a light emitting layer 17 which are sequentially stacked on the flat layer 155. In this embodiment, the first retaining wall body 191 is formed in the same layer and in the same process as the flat layer 155, and the second retaining wall body 192 is located on the same layer as the pixel defining layer 16 and is manufactured in the same process. In the manufacturing process, there is no need to newly add processes and steps, and it is only necessary to define the pattern positions of the first retaining wall body 191 and the second retaining wall body 192 when defining the pattern in the flat layer.

In this embodiment, the luminescent layer 17 includes an anode layer 170, a cathode layer 172, and a illuminating source 171 embedded in the pixel defining layer 16. The anode layer 170 is disposed on the flat layer 16 away from the thin film transistor layer 15. The surface is electrically connected to a thin film transistor layer that covers the pixel defining layer 16. The light source 171 is embedded on a surface of the pixel defining layer 16 away from the surface of the flat layer and exposing the pixel defining layer 16.

In this embodiment, the trenches 13 are provided in plurality and are arranged side by side, and the thin film transistor layer 15 includes a gate insulating layer 151 laminated on the substrate 10, and a plurality of the trenches 13 are disposed on the gate electrode. The insulating layer 151 is passed through the gate insulating layer 151. An end portion of the first barrier wall 191 connected to the substrate 10 encloses the trench 13 , and the remaining portion is connected to the surface of the gate insulating layer 151 , and the retaining wall 19 is connected to the trench 13 to increase the connection. The area, in turn, ensures stability in combination with the substrate 10. Further, the first retaining wall 191 is removed from the portion connected to the trench 13 , and the remaining portion is curved with the gate insulating layer 151 to increase the first retaining wall 191 and the gate insulating layer 151 . Binding force.

The thin film transistor layer 15 includes a plurality of thin film transistors including the gate insulating layer, a gate covered by the gate insulating layer 151 on a surface of the substrate 10, and a gate insulating layer. An active layer corresponding to the gate of the surface of the 151, a source and a drain disposed opposite to each other, and the source and the drain are respectively connected to opposite sides of the active layer. The insulating layer covers a plurality of the thin film transistors. The flat layer 155 is laminated on the surface of the insulating layer.

As shown in FIG. 3, further, the surface of the pixel defining layer 16 is provided with a supporting pillar (not shown), and the second retaining wall body 192 is supported away from the surface of the first retaining wall body 191. The body 193 is formed by the same process as the support column 161. The support body 193 can better prevent the molten insulating material from overflowing due to material flow characteristics when the package layer 18 is packaged.

Referring to FIG. 4, an embodiment of the present invention provides a method for manufacturing a display screen, including

In step S1, a thin film transistor layer 15 is formed on the substrate 10. The thin film transistor layer 15 includes a gate insulating layer 151, and a trench 13 is formed on the gate insulating layer 151 of the edge region B of the substrate 10.

In this step, a gate electrode is formed on the surface of the substrate 10 by a patterning process, and after the gate insulating layer is coated, an active layer, a source and a drain are formed by a patterning process, thereby forming a plurality of thin film transistors. The insulating material is coated to form an insulating layer covering the thin film transistor. The patterning process includes coating, reticle, exposure, etching, development, and the like.

Step S2, coating a flat material layer on the thin film transistor layer 15 and the edge of the gate insulating layer 151, and patterning the flat material layer to form a flat layer 155 and a first block located at an edge region of the substrate 10. The wall 191; wherein the first retaining wall 191 encloses the groove 13 toward the end of the substrate. In this step, patterning the flat material layer to form the first barrier wall 191 may be performed by etching.

Step S3, coating an organic material layer on the surface of the flat layer 155 and the surface of the first retaining wall body 191 away from the substrate, patterning the organic material layer to form the pixel defining layer 16 and laminating on the first retaining wall body 191 The second retaining wall 192. When the flat layer and the pixel defining layer 16 are formed by the step S2 and the step S3, the retaining wall 19 is formed, and the external process is not required, and the manufacturing cost is not increased, and the quality of the display screen is ensured. In this step, it is necessary to form the anode layer of the light-emitting layer 17 in the flat layer before coating the pixel defining layer. The anode layer is disposed on the surface of the flat layer away from the thin film transistor layer and electrically connected to the thin film transistor layer.

In step S4, a light-emitting layer 17 is formed on the flat layer 155 and the pixel defining layer 16. The light emitting layer 17 includes the anode layer, the cathode layer, and a light emitting source embedded in the pixel defining layer 16, and the cathode layer covers the pixel defining layer 16.

In step S5, an encapsulation layer 18 encapsulating the pixel defining layer 16 and the luminescent layer 17 is formed. In this step, the encapsulation layer 18 is formed by a thin film encapsulation technique.

Before forming the encapsulation layer 18 encapsulating the pixel defining layer 16 and the luminescent layer 17, further comprising forming a plurality of spaced apart support pillars on the pixel defining layer 16, the support pillars being formed by a patterning process, A second support wall 192 is formed with a support body away from the surface of the first retaining wall body 191, and the support body and the support post are formed of the same material in the same layer by the same process step.

The method for manufacturing the display screen according to the embodiment of the present invention forms a retaining wall without increasing the number of process steps to prevent the encapsulation layer from overflowing during the manufacturing process, and does not increase the width of the border portion of the display screen, thereby achieving a narrow bezel effect.

The above is a preferred embodiment of the present invention, and it should be noted that those skilled in the art can also make several improvements and retouchings without departing from the principles of the present invention. It is the scope of protection of the present invention.

Claims

A display screen, comprising: a substrate, a light emitting function layer disposed on the substrate, and an encapsulation layer encapsulating the light emitting function layer,

a retaining wall surrounding the encapsulating layer is disposed on an edge region of the substrate, and a groove is further disposed on the edge region of the substrate, wherein the retaining wall covers the trench and the retaining wall and the substrate The ends of the connections are embedded in the grooves.
The display screen according to claim 1, wherein the retaining wall comprises a first retaining wall body and a second retaining wall body laminated on the first retaining wall body away from the surface of the substrate, wherein the illuminating functional layer comprises a film a transistor layer, a planar layer covering the thin film transistor layer, and a pixel defining layer and a light emitting layer sequentially stacked on the flat layer;

The first retaining wall body is formed in the same layer and in the same process as the flat layer, and the second retaining wall body is formed in the same layer and in the same process as the pixel defining layer.
The display screen according to claim 1 or 2, wherein the second retaining wall body is formed with a support body away from the surface of the first retaining wall body.
The display screen according to claim 3, wherein the pixel defining layer is provided with a supporting column, and the supporting body is formed in the same process as the supporting column.
The display screen according to claim 2, wherein said plurality of trenches are disposed side by side, said thin film transistor layer comprises a gate insulating layer laminated on said substrate, and said plurality of said trenches are disposed in said display The gate insulating layer is formed on the gate insulating layer.
The display screen according to claim 2, wherein an end portion of the first retaining wall body connected to the substrate encloses the groove, and another portion is curvedly connected to the gate insulating layer.
The display screen according to claim 2, wherein the light emitting layer comprises an anode layer, a cathode layer and a light emitting source embedded in the pixel defining layer, wherein the anode layer is disposed on the flat layer away from the thin film transistor layer The surface is electrically connected to a thin film transistor layer that covers the pixel defining layer.
The display screen according to any one of claims 1 to 7, wherein the substrate is a flexible substrate or a glass substrate.
A method for manufacturing a display screen, comprising: forming a thin film transistor layer on a substrate; the thin film transistor layer comprises a gate insulating layer, and a trench is formed on the gate insulating layer of the edge region of the substrate;

Coating a flat material layer on the thin film transistor layer and the edge of the gate insulating layer, patterning the flat material layer to form a flat layer and a first retaining wall body located at an edge region of the substrate; wherein, the first a retaining wall covering the groove;

Coating a pixel material layer on the surface of the flat layer and the surface of the first retaining wall away from the substrate, and patterning the pixel material layer to form a pixel defining layer and a second retaining wall layer stacked on the first retaining wall;

Forming a light-emitting layer on the flat layer and on the pixel defining layer;

Forming an encapsulation layer encapsulating the pixel defining layer and the light emitting layer.
A display device comprising the display screen of any of claims 1-8.