CN110265576B - Display panel packaging method, display panel and display device - Google Patents
Display panel packaging method, display panel and display device Download PDFInfo
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- CN110265576B CN110265576B CN201910569221.3A CN201910569221A CN110265576B CN 110265576 B CN110265576 B CN 110265576B CN 201910569221 A CN201910569221 A CN 201910569221A CN 110265576 B CN110265576 B CN 110265576B
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
Abstract
The application discloses a display panel packaging method, a display panel and a display device, wherein the display panel comprises a substrate, the substrate comprises a display area and a non-display area located on the periphery of the display area, and the packaging method comprises the following steps: forming a first inorganic layer on the substrate, the first inorganic layer covering the display area and at least a portion of the non-display area adjacent to the display area; forming an organic layer on the first inorganic layer; removing at least a portion of the organic layer in the non-display area until at least a portion of the first inorganic layer in the non-display area is exposed from the organic layer; a second inorganic layer is formed on the organic layer, and the second inorganic layer also covers the exposed first inorganic layer. Through the mode, the organic layer on the non-display area can be partially removed, and the packaging reliability is improved.
Description
Technical Field
The present disclosure relates to the field of display technologies, and in particular, to a display panel, a display panel and a display device.
Background
At present, display panels generally adopt an inorganic layer-organic layer-inorganic layer packaging structure, wherein the inorganic layer has a good water and oxygen barrier capability, and the organic layer has a capability of planarization, stress buffering, and particle covering. Since the organic material used for the organic layer is generally in a liquid state and has fluidity, a plurality of banks having a certain width and height are required to be disposed at the edge of the display panel to be fixed in a certain effective area. But the arrangement of many dykes and dams can occupy great space, is unfavorable for realizing display panel's narrow frame effect.
Disclosure of Invention
The technical problem mainly solved by the application is to provide a display panel packaging method, a display panel and a display device, which can remove part of organic layers in a non-display area and improve the packaging reliability.
In order to solve the technical problem, the application adopts a technical scheme that: there is provided a packaging method of a display panel including a substrate including a display region and a non-display region located at a periphery of the display region, the packaging method including: forming a first inorganic layer on the substrate, the first inorganic layer covering the display area and at least a portion of the non-display area adjacent to the display area; forming an organic layer on the first inorganic layer; removing at least a portion of the organic layer in the non-display area until at least a portion of the first inorganic layer in the non-display area is exposed from the overlying organic layer; a second inorganic layer is formed on the organic layer, and the second inorganic layer covers the exposed first inorganic layer.
Wherein a thickness of the organic layer in the display region is greater than a thickness of the organic layer in the non-display region, and the removing at least a portion of the organic layer in the non-display region until at least a portion of the first inorganic layer in the non-display region is exposed from the overlying organic layer comprises: and integrally thinning the organic layers in the display area and the non-display area until at least part of the organic layers in the non-display area are removed.
Wherein, the integral thinning treatment of the organic layer is carried out until at least part of the organic layer in the non-display area is removed, and the method comprises the following steps: and carrying out integral thinning treatment on the organic layer by using a dry etching or laser mode.
Wherein the removing at least a portion of the organic layer in the non-display area until at least a portion of the first inorganic layer in the non-display area is exposed from the covered organic layer comprises: etching the organic layer in the non-display area by using a first mask to remove at least part of the organic layer in the non-display area; preferably, the first mask includes a first opening, and the etching the organic layer located in the non-display region using the first mask includes: etching away all of the organic layer of the non-display region corresponding to the first opening using the first mask; or, the organic layer of the non-display area corresponding to the first opening is subjected to integral thinning treatment by using the first mask plate so as to remove at least part of the organic layer.
Wherein an orthographic projection of the first opening of the first mask on the substrate is located in the non-display area, the first opening comprises a first edge, the first edge is arranged at the edge of the first opening adjacent to the display area, and a horizontal distance between the first edge and the edge of the display area is not less than a first threshold value; preferably, the first threshold is 150 μm.
Wherein at least one bank is disposed on the substrate, the bank is located in the non-display region, and the removing at least a portion of the organic layer located in the non-display region includes: removing at least a portion of the organic layer extending over the dam or to a side of the dam remote from the display area; preferably, the number of the dams is 1.
Wherein the removing at least a portion of the organic layer that extends over the bank or to a side of the bank away from the display area comprises: removing all organic layers on the surface of the dam; preferably, after the organic layer on the surface of the dam is completely removed, the encapsulation method further includes: removing all of the dam and the first inorganic layer covered by the dam surface; or, the first inorganic layer covering the dam surface is processed to form an uneven structure or a through hole on the surface of the first inorganic layer; or removing at least part of the first inorganic layer covered by the dam surface, and treating the exposed dam surface to form a concave-convex structure or a through hole on the dam surface.
In order to solve the above technical problem, another technical solution adopted by the present application is: provided is a display panel including: a substrate including a display region and a non-display region located at a periphery of the display region; the first inorganic layer covers the display area and at least part of the non-display area adjacent to the display area; the organic layer covers the first inorganic layer, and after at least part of the organic layer in the non-display area is removed, the first inorganic layer is exposed from the organic layer; the second inorganic layer is arranged on one side, away from the substrate, of the organic layer and is in contact with the first inorganic layer exposed from the organic layer; preferably, the organic layer located in the non-display region includes at least two regions disposed at intervals.
Wherein the display panel further comprises: a dam disposed on the non-display region of the substrate; the first inorganic layer also covers the surface of the dam and a non-display area on one side of the dam away from the display area; the organic layer extends from the display area to the non-display area and is cut off at one side of the dam adjacent to the display area; or the organic layer extends from the display region to the non-display region onto the non-display region on a side of the bank facing away from the display region, and the first inorganic layer on the top surface of the bank is exposed from the organic layer; preferably, the number of the dikes is one.
In order to solve the above technical problem, the present application adopts another technical solution: there is provided a display device comprising the display panel of any of the above embodiments.
The beneficial effect of this application is: different from the prior art, the packaging method of the display panel provided by the application comprises the following steps: forming a first inorganic layer on a display area and a non-display area adjacent to the display area of a substrate; then forming an organic layer on the first inorganic layer; removing at least part of the organic layer in the non-display area until at least part of the first inorganic layer in the non-display area is exposed from the organic layer; finally, forming a second inorganic layer on the organic layer, wherein the second inorganic layer also covers the exposed first inorganic layer; on one hand, the redundant organic layer positioned in the non-display area can be removed before the second inorganic layer is formed, compared with the prior art, when the distance between the dam and the display area is shortened, the organic layer spreading to the side of the dam far away from the display area can be removed before the second inorganic layer is formed, so that the purpose of reducing the distance between the dam and the display area can be realized, the number of the dams can be reduced, even no dam is provided, and the narrow frame can be realized; on the other hand, water and oxygen are generally invaded through the organic layer, and the first inorganic layer and the second inorganic layer which are positioned in the non-display area are in direct contact, so that the invasion path of the water and oxygen can be effectively cut off, and the reliability of the package is improved.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts. Wherein:
FIG. 1 is a schematic flow chart illustrating an embodiment of a method for packaging a display panel according to the present application;
FIG. 2 is a schematic structural diagram of an embodiment corresponding to steps S101-S104 in FIG. 1;
FIG. 3 is a schematic structural diagram of another embodiment corresponding to step S103 in FIG. 1;
FIG. 4 is a schematic structural diagram of another embodiment corresponding to step S103 in FIG. 1;
FIG. 5 is a schematic structural diagram of another embodiment corresponding to step S103 in FIG. 1;
FIG. 6 is a schematic structural diagram of another embodiment corresponding to step S103 in FIG. 1;
FIG. 7 is a schematic structural diagram of a display panel according to an embodiment of the present disclosure;
FIG. 8 is a schematic structural diagram of another embodiment of a display panel according to the present application;
FIG. 9 is a schematic structural diagram of another embodiment of a display panel according to the present application;
FIG. 10 is a schematic structural diagram of another embodiment of a display panel according to the present application;
FIG. 11 is a schematic structural diagram of another embodiment of a display panel according to the present application;
FIG. 12 is a schematic structural diagram of another embodiment of a display panel according to the present application;
FIG. 13 is a schematic structural diagram of another embodiment of a display panel according to the present application;
fig. 14 is a schematic structural diagram of another embodiment of a display device according to the present application.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
Referring to fig. 1-2, fig. 1 is a schematic flow chart illustrating an embodiment of a packaging method for a display panel of the present application, and fig. 2 is a schematic structural diagram illustrating an embodiment corresponding to steps S101-S104 in fig. 1.
S101: a first inorganic layer 12 is formed on the substrate 10, and the first inorganic layer 12 covers the display area AA and at least a portion of the non-display area CC adjacent to the display area AA.
Specifically, referring to fig. 2a, in the present embodiment, only a structure of an edge portion region of a certain side of the display panel is schematically shown, the display panel includes a substrate 10, and the substrate 10 includes a display area AA and a non-display area CC located at a periphery of the display area AA. The substrate 10 may be a flexible substrate, a material of which may be polyimide, polyethylene terephthalate, polyethylene naphthalate, or the like, and a display panel formed over the flexible substrate may be referred to as a flexible display panel. Of course, in other embodiments, other materials may be included between the substrate 10 and the first inorganic layer 12 of the display panel, for example, a thin film transistor layer and a light emitting layer are stacked in sequence, and the light emitting layer is close to the first inorganic layer 12.
The method for forming the first inorganic layer 12 may be a chemical vapor deposition method, and the material of the first inorganic layer 12 may be a non-metal oxide or a metal oxide, and the non-metal oxide includes at least one of silicon nitride, silicon oxide, and silicon oxynitride; the metal oxide includes at least one of alumina, zirconia, and titania. The first inorganic layer 12 is spaced apart from the outermost edge of the non-display region CC by a distance d1, which is to prevent the heat radiation generated by the cutting from affecting the packaging effect of the packaging layer when the edge of the display panel is cut; the encapsulation layer referred to herein refers to the first inorganic layer 12, the organic layer 14, and the second inorganic layer 18 that are currently formed.
S102: an organic layer 14 is formed on the first inorganic layer 12.
Specifically, referring to fig. 2b, in the present embodiment, the organic layer 14 may be made of an acrylic (e.g., polymethyl methacrylate, etc.), a silicone (e.g., polymethyl monophenyl vinyl siloxane, etc.), an epoxy (e.g., epoxy resin, etc.) organic material, etc., which may be formed on the first inorganic layer 12 by coating, inkjet printing, etc., and may be cured by uv irradiation, etc. Since the material forming the organic layer 14 is generally liquid, after leveling from the display area AA to the non-display area CC, the thickness of the portion of the organic layer 14 near the edge of the non-display area CC is thinner than the thickness of the portion corresponding to the display area AA.
S103: at least a portion of the organic layer 14 positioned at the non-display area CC is removed until at least a portion of the first inorganic layer 12 positioned at the non-display area CC is exposed from the covered organic layer 14.
Specifically, referring to fig. 2c, the implementation manner of step S103 may be: the organic layer 14 located in the non-display region CC is etched using the first mask 16 to remove at least a portion of the organic layer 14 located in the non-display region CC. The above-mentioned mode of utilizing first mask 16 to carry out the etching is comparatively simple convenient, and the processing position is more accurate.
In addition, in this embodiment, the first mask 16 includes a first opening 160, and the etching of the organic layer 14 in the non-display region CC by using the first mask 16 specifically includes: the organic layer 14 of the non-display region CC corresponding to the first opening 160 is entirely etched away using the first mask 16. Alternatively, the organic layer 14 of the non-display region CC corresponding to the first opening 160 is thinned by using the first mask 16 to remove at least a portion of the organic layer 14. When the thinning process is performed, when the organic layer 14 is removed at the minimum thickness position of the non-display region CC corresponding to the first opening 160, the thinning process may be stopped, and of course, the thinning process may be continued to remove more organic layers 14.
In addition, in the embodiment, the orthographic projection of the first opening 160 of the first mask 16 on the substrate 10 is located in the non-display area CC, the first opening 160 includes a first edge 1600, the first edge 1600 is disposed adjacent to an edge (not labeled) of the display area AA, and a horizontal distance d2 between the first edge 1600 and the edge of the display area AA is not less than a first threshold. The first threshold may be 150um, 100um, etc., and the design method may prevent the display area AA from being irradiated by the laser, etc. used in etching, which may affect the display performance of the display panel.
In the above embodiment, the first mask 16 has a first opening 160 corresponding to the non-display region CC. In other embodiments, as shown in fig. 3, fig. 3 is a schematic structural diagram of another embodiment corresponding to step S103 in fig. 1. The first mask 16a has a plurality of first openings 160a spaced apart from each other in a portion corresponding to the non-display region CC1, so that the organic layer 14a formed in step S103 forms at least two regions M1 and M2 spaced apart from each other in the non-display region CC. Compared with the design mode shown in fig. 2c, the design mode of the organic layer 14a can improve the buffer stress of the packaging layer, increase the contact area with the inorganic layers on the two sides, increase the binding force, further improve the packaging effect and the bending resistance of the display panel, and is more suitable for the flexible display panel.
In addition, in other embodiments, when the thickness of the organic layer 14 located in the display area AA is greater than that of the organic layer 14 located in the non-display area CC, the implementation manner of the step S103 may also be: and performing integral thinning treatment on the organic layers 14 positioned in the display area AA and the non-display area CC, wherein the thickness value of the integral thinning treatment on the organic layers 14 is greater than or equal to the minimum thickness value of the organic layers 14 positioned in the non-display area CC before the integral thinning treatment, so that at least part of the organic layers 14 positioned in the non-display area CC is removed. This implementation is relatively simple and it is possible to remove at least part of the organic layer 14 in part of the non-display area CC without the aid of a mask. In addition, in order to ensure the display effect of the display panel, when the thickness of the organic layer 14 in the display area AA is much greater than the thickness of the organic layer 14 in the edge area of the non-display area CC, the integral thinning manner is more suitable. For example, the thickness of the organic layer 14 positioned at the display area AA is 10 times, 20 times, etc. the thickness of the organic layer 14 positioned at the edge area of the non-display area CC.
In the case of performing the entire thinning process on the organic layer 14, the entire thinning process may be performed on the organic layer 14 by dry etching or laser. The treatment method can increase the roughness of the surface of the organic layer 14, so that the bonding force between the organic layer 14 and a subsequently formed film layer is better.
S104: a second inorganic layer 18 is formed on the organic layer 14, and the second inorganic layer 18 covers the exposed first inorganic layer 12.
Specifically, referring to fig. 2d, in the present embodiment, a method for forming the second inorganic layer 18 may be a chemical vapor deposition method, etc., and a material of the second inorganic layer 18 may be a non-metal oxide or a metal oxide, where the non-metal oxide includes at least one of silicon nitride, silicon oxide, and silicon oxynitride; the metal oxide includes at least one of alumina, zirconia, and titania. The second inorganic layer 18 may cover all or part of the exposed first inorganic layer 12.
On one hand, the organic layer 14 in the non-display area CC can be removed before the second inorganic layer 18 is formed, and compared with the prior art, when the distance between the dam and the display area AA is shortened, the organic layer 14 extending to the side of the dam away from the display area AA can be removed before the second inorganic layer 18 is formed, so that the purpose of reducing the distance between the dam and the display area AA can be achieved, the number of dams can be reduced, even no dam is provided, and a narrow frame can be achieved; on the other hand, since water and oxygen are generally introduced through the organic layer 14, and in the present application, a portion of the first inorganic layer 12 and the second inorganic layer 18 located in the non-display region CC are in direct contact with each other, a path through which water and oxygen are introduced may be effectively cut off, thereby improving reliability of the package.
In one embodiment, please refer to fig. 4, wherein fig. 4 is a schematic structural diagram of another embodiment corresponding to step S103 in fig. 1. At least one bank 11b is disposed on the substrate 10b, the number of the banks 11b may be one, two, three, etc., the banks 11b are located in the non-display region CC2, and the arrangement of the banks 11b may better define the position of the organic layer 14 b. The removing of the portion of the organic layer 14b positioned in the non-display area CC 2in the above step S103 includes: the organic layer 14b extending over the bank 11b or extending to the side of the bank 11b away from the display area AA2 is entirely removed; in this embodiment, the removal may be performed by the above-described integral thinning method or the above-described first mask removing method. At this time, the organic layer 14b may extend from the display area AA2 to the non-display area CC2, end at a side of the bank 11b adjacent to the display area AA2, and not cover the top surface of the bank 11 b.
Of course, in other embodiments, as shown in fig. 5, fig. 5 is a schematic structural diagram of another embodiment corresponding to step S103 in fig. 1. The step S103 may also include: the organic layer 14c extending over the bank 11c or extending to the side of the bank 11c away from the display area AA3 is partially removed; in this embodiment, the removal may be performed by the above-described integral thinning method or the above-described first mask removing method. At this time, the organic layer 14c may extend from the display area AA3 to the non-display area CC3 to a side of the bank 11c facing away from the display area AA3, and other areas may be covered except for the top surface of the bank 11 c. Of course, in other embodiments, the organic layer 14c may cover the top surface of the bank 11 c; alternatively, the organic layer 14c may include at least two spaced apart regions on the side of the dam 11c facing away from the display area AA 3. When the number of the banks 11d is at least two, the organic layer 14d may at least partially cover the region between the adjacent banks 11d, as shown in fig. 6.
In another embodiment, after the above-mentioned removing all of the organic layer 14b on the surface of the dam 11b, the encapsulation method provided by the present application further includes: the bank 11b and the first inorganic layer 12b covering the surface of the bank 11b are all removed. In this embodiment, the surface of the dam 11b includes the top surface and the side surface thereof, and the first inorganic layer 12b and the dam 11b can be removed by dry etching or the like, which is advantageous for realizing a narrow bezel.
In another embodiment, after the above-mentioned removing all of the organic layer 14b on the surface of the dam 11b, the encapsulation method provided by the present application further includes: the first inorganic layer 12c covering the surface of the bank 11b is treated so that the surface of the first inorganic layer 12c forms a concave-convex structure or a through hole. For example, a via hole may be formed in the first inorganic layer 12c by dry etching or the like; for example, the concave-convex structure may be formed on the surface of the first inorganic layer 12c by plasma or the like. This design can make the second inorganic layer formed later more adhesive with the first inorganic layer 12c on the surface of the bank 11 b.
In another embodiment, after the above-mentioned removing all of the organic layer 14b on the surface of the dam 11b, the encapsulation method provided by the present application further includes: at least a part of the first inorganic layer 12b covered on the surface of the bank 11b is removed, and the exposed surface of the bank 11b is treated so that a concave-convex structure or a through hole is formed on the surface of the bank 11 b. This design makes it possible to make the bonding force between the subsequently formed second inorganic layer and the surface of the bank 11b high while extending the path of water oxygen barrier from the side or the path of crack extension at the time of laser cutting.
In still another embodiment, before the first inorganic layer 12b is formed, the surface of the bank 11b may be treated so that the surface of the bank 11b forms a concave-convex structure or a through hole, and the design may be such that the bonding force between the first inorganic layer 12b formed later and the surface of the bank 11b is high.
Referring to fig. 7, fig. 7 is a schematic structural diagram of a display panel according to an embodiment of the present disclosure. The display panel may be formed by the above-described encapsulation method, and includes a substrate 20, a first inorganic layer 22, an organic layer 24, and a second inorganic layer 26.
Wherein, the substrate 20 includes a display area BB and a non-display area DD located at the periphery of the display area BB; in this embodiment, the substrate 20 may be a flexible substrate or a rigid substrate. The first inorganic layer 22 covers the display area BB and at least a portion of the non-display area DD adjacent to the display area BB of the substrate 20. The organic layer 24 covers the first inorganic layer 22, and after at least part of the organic layer 24 in the non-display area DD is removed, the first inorganic layer 22 is exposed from the organic layer 24; the second inorganic layer 26 is disposed on a side of the organic layer 24 remote from the substrate 20 and is in contact with the first inorganic layer 22 exposed from the organic layer 24.
On the one hand, in the present application, part of the organic layer 24 in the non-display area DD is removed before the second inorganic layer 26 is formed, and compared with the prior art, when the distance between the dam and the display area AA is shortened, the organic layer 44 extending to the side of the dam away from the display area BB can be removed before the second inorganic layer 26 is formed, so that the purpose of reducing the distance between the dam and the display area BB can be achieved, the number of dams can be further reduced, even no dam is present, and thus a narrow frame can be advantageously achieved; on the other hand, since the water and oxygen ingress generally occurs through the organic layer 24, and in the present application, the first inorganic layer 22 and the second inorganic layer 26 are in direct contact with each other in the non-display area BB, the path of water and oxygen ingress can be effectively cut off, and the reliability of the package can be improved.
In one embodiment, please refer to fig. 8, wherein fig. 8 is a schematic structural diagram of another embodiment of a display panel according to the present application. The organic layer 24a positioned in the non-display area DD1 includes at least two regions P1, P2 spaced apart from each other. The design mode can cut off the water and oxygen invasion path and simultaneously reduce the possibility of the breakage of the packaging layer when the non-display area DD1 is bent.
In another embodiment, please refer to fig. 9, wherein fig. 9 is a schematic structural diagram of another embodiment of a display panel according to the present application. The display panel may further include: at least one dam 28b, e.g., one, two, three, etc., the dam 28b being disposed on the non-display area DD2 of the substrate 20b, the distance between the dam 28b and the display area BB2 can be shortened to less than 150 um; the first inorganic layer 22b also covers the surface of the dam 28b and the non-display area DD2 on the side of the dam 28b far away from the display area BB 2; the organic layer 24b extends from the display area BB2 to the non-display area DD2, and ends at the side of the bank 28b adjacent to the display area BB 2. The inclusion of the dam 28b in this design may better define the location of the organic layer 24 b.
Of course, in other embodiments, as shown in fig. 10, the organic layer 24c may also extend from the display region BB3 to the non-display region DD3 to the non-display region DD3 on the side of the bank 28c away from the display region BB3, and the first inorganic layer 22c on the top surface of the bank 28c is exposed from the organic layer 24 c. This mode can increase the bending resistance of the display panel on the side of the bank 28c away from the display area BB3 by the organic layer 24c, as compared with the mode in fig. 9.
In the above embodiments, the number of the dikes 28b and 28c is one, and the design mode can reduce the number of the dikes 28b and 28c, which is beneficial to realizing a narrow frame; in other embodiments, as shown in fig. 11, the number of the banks 28d may be at least two, and the organic layer 24d may also at least partially cover the area between adjacent banks 28 d. This design may reduce the probability of the encapsulant layer between adjacent dikes 28d breaking when bent.
In addition, in the present embodiment, the surfaces of the first inorganic layers 22b and 22c on the top surfaces of the banks 28b and 28c have a concave-convex structure or through holes, so that the bonding force between the second inorganic layers 26b and 26c and the first inorganic layers 22b and 22c is improved.
In another embodiment, please refer to fig. 12, wherein fig. 12 is a schematic structural diagram of another embodiment of a display panel according to the present application. In the present embodiment, at least a part of the surface of the bank 28e is not provided with the first inorganic layer 22e, for example, as shown in fig. 12, the top surface of the bank 28e is not provided with the first inorganic layer 22 e. The surface of the dam 28e exposed from the first inorganic layer 22e has a concavo-convex structure or a through hole so that the bonding force between the second inorganic layer 26e and the surface of the dam 28e is good.
In another embodiment, please refer to fig. 13, fig. 13 is a schematic structural diagram of another embodiment of a display panel according to the present application. In the present embodiment, the first inorganic layer 22f has a second opening (not labeled), and the second opening is correspondingly disposed in the non-display area DD5 of the substrate 20 f. The organic layer 24f extends from the display area BB5 to the non-display area DD5 and ends at the second opening. The second inorganic layer 26f is disposed on a side of the organic layer 24f away from the substrate 20f, and is in contact with the substrate 20f corresponding to the second opening and the first inorganic layer 22f exposed from the organic layer 24 f. This design may enable a narrow bezel.
In an application scenario, when the size of the display panel is smaller than 8inch, the width of a frame (i.e., a non-display area) of the display panel provided by the application can be smaller than 1mm, and at this time, the display panel can be applied to a mobile phone, a watch, a tablet and the like; when the size of the display panel is between 8inch and 32inch, the width of the frame of the display panel provided by the application can be smaller than 2mm, and the display panel can be applied to flat panels, vehicle-mounted display and the like; when the size of the display panel exceeds 32inch, the width of the frame of the display panel provided by the application can be smaller than 4mm, and the display panel can be applied to televisions or other large display screens.
Referring to fig. 14, fig. 14 is a schematic structural diagram of an embodiment of a display device according to the present application. The display device includes the display panel 30 in any of the above embodiments. Of course, in other embodiments, the display device may further include other structures, such as a housing 32, and the housing 32 may be disposed at the periphery of the display panel 30 for protecting the display panel 30.
The above description is only for the purpose of illustrating embodiments of the present application and is not intended to limit the scope of the present application, and all modifications of equivalent structures and equivalent processes, which are made by the contents of the specification and the drawings of the present application or are directly or indirectly applied to other related technical fields, are also included in the scope of the present application.
Claims (10)
1. A packaging method of a display panel, wherein the display panel comprises a substrate, the substrate comprises a display area and a non-display area located at the periphery of the display area, the packaging method comprises:
forming a first inorganic layer on the substrate, the first inorganic layer covering the display area and at least a portion of the non-display area adjacent to the display area;
forming an organic layer on the first inorganic layer;
removing at least a portion of the organic layer in the non-display area until at least a portion of the first inorganic layer in the non-display area is exposed from the overlying organic layer;
forming a second inorganic layer on the organic layer, and the second inorganic layer covers the exposed first inorganic layer;
wherein at least one bank is disposed on the substrate, the bank is located in the non-display region, and the removing at least a portion of the organic layer located in the non-display region includes: removing at least a portion of the organic layer extending over the bank or to a side of the bank remote from the display area, such that the organic layer comprises at least two spaced apart regions on the side of the bank remote from the display area.
2. The encapsulation method according to claim 1, wherein the organic layer in the display region has a thickness greater than a thickness of the organic layer in the non-display region, and the removing at least a portion of the organic layer in the non-display region until at least a portion of the first inorganic layer in the non-display region is exposed from the overlying organic layer comprises:
and integrally thinning the organic layers in the display area and the non-display area until at least part of the organic layers in the non-display area are removed.
3. The encapsulation method according to claim 2, wherein the step of performing the integral thinning process on the organic layer until at least a portion of the organic layer in the non-display area is removed comprises:
and carrying out integral thinning treatment on the organic layer by using a dry etching or laser mode.
4. The method of claim 1, wherein the removing at least a portion of the organic layer in the non-display area until at least a portion of the first inorganic layer in the non-display area is exposed from the covered organic layer comprises:
etching the organic layer in the non-display area by using a first mask to remove at least part of the organic layer in the non-display area;
preferably, the first mask includes a first opening, and the etching the organic layer located in the non-display region using the first mask includes: etching away all of the organic layer of the non-display region corresponding to the first opening using the first mask; or, the organic layer of the non-display area corresponding to the first opening is subjected to integral thinning treatment by using the first mask plate so as to remove at least part of the organic layer.
5. The packaging method according to claim 4,
an orthographic projection of the first opening of the first mask on the substrate is located in the non-display area, the first opening comprises a first edge, the first edge is arranged at the edge of the first opening adjacent to the display area, and the horizontal distance between the first edge and the edge of the display area is not smaller than a first threshold value;
preferably, the first threshold is 150 μm.
6. The encapsulation method according to any one of claims 1 to 5, wherein the number of the dam is 1.
7. The method of claim 1, wherein the removing at least a portion of the organic layer that extends over the dam or on a side of the dam away from the display area comprises:
removing all organic layers on the surface of the dam;
preferably, after the organic layer on the surface of the dam is completely removed, the encapsulation method further includes:
removing all of the dam and the first inorganic layer covered by the dam surface; or, the first inorganic layer covering the dam surface is processed to form an uneven structure or a through hole on the surface of the first inorganic layer; or removing at least part of the first inorganic layer covered by the dam surface, and treating the exposed dam surface to form a concave-convex structure or a through hole on the dam surface.
8. A display panel, comprising:
a substrate including a display region and a non-display region located at a periphery of the display region;
the first inorganic layer covers the display area and at least part of the non-display area adjacent to the display area;
the organic layer covers the first inorganic layer, and after at least part of the organic layer in the non-display area is removed, the first inorganic layer is exposed from the organic layer;
the second inorganic layer is arranged on one side, away from the substrate, of the organic layer and is in contact with the first inorganic layer exposed from the organic layer;
at least one dam is arranged on the non-display area of the substrate, the organic layer extends from the display area to the non-display area on the side of the dam, which is far away from the display area, and the organic layer comprises at least two areas arranged at intervals on the side of the dam, which is far away from the display area.
9. The display panel according to claim 8, wherein the first inorganic layer further covers a surface of the bank and a non-display region on a side of the bank away from the display region.
10. A display device characterized by comprising the display panel according to claim 8 or 9.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
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| CN201910569221.3A CN110265576B (en) | 2019-06-27 | 2019-06-27 | Display panel packaging method, display panel and display device |
| PCT/CN2020/071818 WO2020258852A1 (en) | 2019-06-27 | 2020-01-13 | Display panel packaging method, display panel, and display device |
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| CN201910569221.3A CN110265576B (en) | 2019-06-27 | 2019-06-27 | Display panel packaging method, display panel and display device |
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| CN110265576B (en) * | 2019-06-27 | 2020-12-04 | 昆山工研院新型平板显示技术中心有限公司 | Display panel packaging method, display panel and display device |
| CN111710703A (en) * | 2020-06-29 | 2020-09-25 | 京东方科技集团股份有限公司 | OLED display panel and display device |
| US20230157079A1 (en) * | 2020-07-27 | 2023-05-18 | Chengdu Boe Optoelectronics Technology Co., Ltd. | Display panel and display apparatus |
| CN112420948B (en) * | 2020-11-16 | 2022-09-06 | 合肥维信诺科技有限公司 | Display panel and display device |
| CN113285043B (en) * | 2021-05-18 | 2022-11-18 | 合肥维信诺科技有限公司 | Display panel, manufacturing method of display panel and display device |
| CN113421903B (en) * | 2021-06-18 | 2023-11-10 | 合肥京东方卓印科技有限公司 | Display substrate, preparation method thereof, display panel and display device |
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| AU2003260959A1 (en) * | 2002-09-11 | 2004-04-30 | Semiconductor Energy Laboratory Co., Ltd. | Light-emitting apparatus and fabrication method of the same |
| KR102085961B1 (en) * | 2013-12-24 | 2020-03-06 | 엘지디스플레이 주식회사 | Flexible organic light emitting display and method of manufacturing the same |
| KR102404577B1 (en) * | 2015-03-27 | 2022-06-03 | 삼성디스플레이 주식회사 | Organic light emitting display device |
| CN104779200B (en) * | 2015-04-13 | 2016-09-07 | 京东方科技集团股份有限公司 | The preparation method of display base plate, display base plate semi-finished product and display device |
| CN106981584B (en) * | 2017-03-20 | 2019-11-26 | 上海天马有机发光显示技术有限公司 | Flexible organic LED display panel, display device and preparation method thereof |
| CN107170777B (en) * | 2017-04-27 | 2019-11-22 | 上海天马有机发光显示技术有限公司 | Organic light emitting display panel and display device |
| CN107689424B (en) * | 2017-08-21 | 2019-12-31 | 京东方科技集团股份有限公司 | Mask plate, packaging method and structure of OLED display substrate and display device |
| CN107403883A (en) * | 2017-09-13 | 2017-11-28 | 武汉华星光电半导体显示技术有限公司 | The method for packing of OLED display panel |
| CN109860411A (en) * | 2017-11-30 | 2019-06-07 | 京东方科技集团股份有限公司 | A kind of OLED display panel and preparation method thereof, OLED display |
| CN109904212B (en) * | 2019-03-28 | 2021-07-20 | 昆山国显光电有限公司 | Organic light-emitting display panel and manufacturing method thereof |
| CN110265576B (en) * | 2019-06-27 | 2020-12-04 | 昆山工研院新型平板显示技术中心有限公司 | Display panel packaging method, display panel and display device |
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