CN110970575B - Packaging cover plate, display panel and display device - Google Patents
Packaging cover plate, display panel and display device Download PDFInfo
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- CN110970575B CN110970575B CN201911317466.3A CN201911317466A CN110970575B CN 110970575 B CN110970575 B CN 110970575B CN 201911317466 A CN201911317466 A CN 201911317466A CN 110970575 B CN110970575 B CN 110970575B
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/40—OLEDs integrated with touch screens
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0412—Digitisers structurally integrated in a display
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
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- Optics & Photonics (AREA)
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- General Physics & Mathematics (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
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Abstract
The invention discloses a packaging cover plate, a display panel and a display device, wherein the packaging cover plate comprises: the touch control device comprises a substrate, a touch control electrode layer and a passivation layer, wherein the passivation layer is positioned on one side of the touch control electrode layer, which is far away from the substrate; the peripheral region of the encapsulation cover plate comprises a plurality of overlapping regions; the touch electrode layer comprises a plurality of touch electrodes and a plurality of touch electrode leads; a lap zone comprising: the lapping electrode is positioned on one side, away from the substrate, of the touch electrode layer, and the padding structure is positioned between the touch electrode layer and the lapping electrode; the lapping electrodes are electrically connected with the touch electrode leads belonging to the same lapping area; the elevated structure comprises at least one inorganic insulating film layer. Through set up the bed hedgehopping structure between touch-control electrode layer and overlap joint electrode, with overlap joint electrode bed hedgehopping, therefore can reduce the thickness of the following rete of contact electrode in the display substrate, improve the planarization on contact electrode surface to increase contact electrode and overlap joint electrode's effective area of contact, reduce contact resistance, improve touch-control signal's transmission efficiency.
Description
Technical Field
The present invention relates to the field of display technologies, and in particular, to a package cover plate, a display panel and a display device.
Background
Organic Light-Emitting Diode (OLED) display products have the advantages of self-luminescence, high contrast, fast response speed, flexible display realization, simple process and the like, so the OLED display products gradually become mainstream in display industry development, and the OLED display products are gradually found in terminal products.
The OLED display product may adopt an embedded (Incell) touch, the touch electrode layer is generally located on the encapsulation cover plate, in order to electrically connect the touch electrode on the encapsulation cover plate with the signal line on the display substrate, the overlap electrode in the encapsulation cover plate needs to be overlapped with the contact electrode at the corresponding position of the display substrate, which requires that the film layer below the contact electrode in the display substrate is made high, which is generally achieved by increasing the height of the flat layer, however, the uniformity of the film layer has close correlation with the thickness of the film layer, the thicker the film layer is, the worse the uniformity is, after the thickness of the flat layer is increased, the surface uniformity of the flat layer may be deteriorated, resulting in poor surface smoothness of the contact electrode, so the effective contact area between the contact electrode and the overlap electrode is reduced, the contact resistance is increased, and the transmission of the touch signal is seriously affected.
Disclosure of Invention
The embodiment of the invention provides a packaging cover plate, a display panel and a display device, which are used for solving the problem that the transmission of a touch signal is influenced due to the fact that the contact resistance of a contact electrode and a lapping electrode is large in the prior art.
In a first aspect, an embodiment of the present invention provides a package cover plate, including: the touch control device comprises a substrate, a touch control electrode layer positioned on the substrate, and a passivation layer positioned on one side of the touch control electrode layer, which is far away from the substrate;
the packaging cover plate is divided into a touch area and a peripheral area, and the peripheral area comprises a plurality of lap joint areas;
the touch electrode layer comprises a plurality of touch electrodes positioned in the touch area and a plurality of touch electrode leads respectively extending from the touch area to the lap area;
the lap zone comprising: the lapping electrode is positioned on one side, away from the substrate, of the touch electrode layer, and the padding structure is positioned between the touch electrode layer and the lapping electrode;
the lapping electrode is electrically connected with the touch electrode lead wire belonging to the same lapping area;
the heightening structure comprises at least one inorganic insulating film layer.
In a possible implementation manner, in the package cover plate provided in an embodiment of the present invention, the heightening structure includes: a passivation structure located between the passivation layer and the landing electrode.
In a possible implementation manner, in the package cover board provided in the embodiment of the present invention, the passivation layer includes a first via located in the lap joint region, and the passivation structure includes a second via;
the orthographic projection of the first via hole on the substrate is located in the range of the orthographic projection of the second via hole on the substrate, and the second via hole is larger than the first via hole.
In a possible implementation manner, in the package cover plate provided in an embodiment of the present invention, the heightening structure further includes: an electrically conductive connection structure between the passivation layer and the passivation structure;
the lapping electrode is electrically connected with the touch electrode lead through the conductive connection structure.
In a possible implementation manner, in the package cover plate provided in the embodiment of the present invention, the passivation layer includes a first via hole located in the overlapping area, and the conductive connection structure is electrically connected to the touch electrode lead through the first via hole;
the passivation structure comprises a second via hole, and the conductive connection structure is electrically connected with the lapping electrode through the second via hole;
the orthographic projection of the first via hole on the substrate and the orthographic projection of the second via hole on the substrate do not overlap.
In a possible implementation manner, in the package cover plate provided in the embodiment of the present invention, the first vias and the second vias are alternately arranged.
In a possible implementation manner, in the package cover plate provided in the embodiment of the present invention, the conductive connection structure and the touch electrode layer are made of the same material; or the conductive connection structure and the lap joint electrode are made of the same material.
In a second aspect, an embodiment of the present invention further provides a display panel, including: a display substrate and the package cover plate;
the display substrate and the packaging cover plate are oppositely arranged;
the display substrate is divided into a display area and a non-display area; the non-display area comprises a plurality of lap joint high platforms which are positioned on a substrate and opposite to the lap joint area, contact electrodes are arranged on the surfaces of the lap joint high platforms, which are far away from one side of the substrate, and the contact electrodes are directly contacted and electrically connected with the corresponding lap joint electrodes in the lap joint area.
In a possible implementation manner, in the display panel provided in the embodiment of the present invention, an orthographic projection of the landing plateau on the substrate base plate and an orthographic projection of the first via and the second via in the package cover plate on the substrate base plate are not overlapped with each other.
In a third aspect, an embodiment of the present invention further provides a display device, including: the display panel is provided.
The invention has the following beneficial effects:
the embodiment of the invention provides a packaging cover plate, a display panel and a display device, wherein the packaging cover plate comprises: the touch control device comprises a substrate, a touch control electrode layer positioned on the substrate, and a passivation layer positioned on one side of the touch control electrode layer, which is far away from the substrate; the packaging cover plate is divided into a touch area and a peripheral area, and the peripheral area comprises a plurality of lap joint areas; the touch electrode layer comprises a plurality of touch electrodes positioned in the touch area and a plurality of touch electrode leads respectively extending from the touch area to the lap area; a lap zone comprising: the lapping electrode is positioned on one side, away from the substrate, of the touch electrode layer, and the padding structure is positioned between the touch electrode layer and the lapping electrode; the lapping electrodes are electrically connected with the touch electrode leads belonging to the same lapping area; the elevated structure comprises at least one inorganic insulating film layer. In the package cover plate provided by the embodiment of the invention, the heightening structure is arranged between the touch electrode layer and the lap electrode, so that the lap electrode is heightened, the thickness of a film layer below the contact electrode in the display substrate can be reduced, the smoothness of the surface of the contact electrode is improved, the effective contact area of the contact electrode and the lap electrode is increased, the contact resistance is reduced, and the transmission efficiency of touch signals is improved.
Drawings
Fig. 1 is a schematic plan view of a package cover according to an embodiment of the present invention;
FIG. 2 is a schematic plan view of a lap joint region according to an embodiment of the present invention;
FIG. 3 is a schematic cross-sectional view taken at dashed line L1 in FIG. 2;
FIG. 4 is a second schematic plan view of the bonding region according to the embodiment of the present invention;
FIG. 5 is a schematic cross-sectional view taken at dashed line L2 in FIG. 4;
FIG. 6 is a schematic plan view illustrating a display substrate according to an embodiment of the present invention;
FIG. 7 is a schematic plan view of the lapping plateau G;
FIG. 8 is a schematic cross-sectional view taken at dashed line L3 in FIG. 7;
fig. 9 is a schematic structural view of the package cover plate and the display substrate after alignment and bonding.
Detailed Description
In a display substrate of an OLED display product, a flat layer is generally made of an organic material, and if the thickness of the flat layer is too large, the organic material may deform due to temperature influence during a process of manufacturing the flat layer, so that uniformity of the thickness of the flat layer is poor, and the greater the thickness of the flat layer is, the worse surface uniformity of the flat layer is, so that the poorer smoothness of a surface of a contact electrode formed on the surface of the flat layer is, which causes a decrease in an effective contact area between the contact electrode and a bonding electrode, increases a contact resistance, and seriously affects transmission of a touch signal.
Based on this, embodiments of the present invention provide a package cover plate, a display panel, and a display device, which are used to solve the problem in the prior art that the transmission of a touch signal is affected due to the large contact resistance between a contact electrode and a landing electrode.
The following describes in detail specific embodiments of a package cover, a display panel, and a display device according to embodiments of the present invention with reference to the accompanying drawings. The thicknesses and shapes of the various film layers in the drawings are not to be considered true proportions, but are merely intended to illustrate the present invention.
In a first aspect, an embodiment of the present invention provides a package cover plate, where fig. 1 is a schematic plan structure diagram of the package cover plate provided in the embodiment of the present invention, fig. 2 is one of schematic plan structure diagrams of a lap joint region in the embodiment of the present invention, and fig. 3 is a schematic cross-sectional diagram of a dotted line L1 in fig. 2, as shown in fig. 1 to fig. 3, including: a substrate 10, a touch electrode layer (such as a film layer where a touch electrode lead 112 is located in fig. 3) located on the substrate 10, and a passivation layer 12 located on a side of the touch electrode layer away from the substrate 10;
the packaging cover plate is divided into a touch area T and a peripheral area P, and the peripheral area P comprises a plurality of lap joint areas D;
a touch electrode layer including a plurality of touch electrodes 111 located in the touch region T and a plurality of touch electrode leads 112 respectively extending from the touch region T to the lap region P;
a lap zone D comprising: a lap electrode 13 located on the side of the touch electrode layer away from the substrate 10, and a raised structure 14 located between the touch electrode layer and the lap electrode 13;
the bonding electrode 13 is electrically connected to the touch electrode lead 112 belonging to the same bonding region D;
the elevated structure 14 includes at least one inorganic insulating film layer.
In the package cover plate provided by the embodiment of the invention, the heightening structure is arranged between the touch electrode layer and the lap electrode, so that the lap electrode is heightened, the thickness of a film layer below the contact electrode in the display substrate can be reduced, the smoothness of the surface of the contact electrode is improved, the effective contact area of the contact electrode and the lap electrode is increased, the contact resistance is reduced, and the transmission efficiency of touch signals is improved.
The encapsulating cover plate provided by the embodiment of the invention can be applied to an OLED display panel, and in order to realize embedded touch, the touch electrode layer can be arranged in the encapsulating cover plate, as shown in fig. 1, the encapsulating cover plate is divided into a touch area T and a peripheral area P, wherein the touch area T corresponds to a display area in a display substrate, and the peripheral area P corresponds to a non-display area in the display substrate. The peripheral region P is provided with a plurality of overlapping regions D, which are illustrated as the case where the overlapping regions D are arranged on the left and right sides of the touch region T, and the overlapping regions D respectively correspond to the overlapping plateaus in the display substrate, and the touch signals are transmitted to the display substrate by directly contacting and electrically connecting the overlapping electrodes in the overlapping regions D with the contact electrodes on the overlapping plateaus.
Specifically, the touch electrode layer includes a plurality of touch electrodes 111 located in the touch area T, and a plurality of touch electrode leads 112 respectively extending from the touch area T to the overlap area P, one end of each touch electrode lead 112 is connected to one of the touch electrodes 111, and the other end is connected to the overlap electrode in the overlap area P, so that the touch signal detected by the touch electrode 111 is led out to the overlap electrode, and then is electrically connected to the contact electrode in the display substrate through the overlap electrode, so as to transmit the touch signal to the display substrate.
It should be noted that, in order to more clearly illustrate the planar structure of the package cover, only four rows and four columns of touch electrodes 111 are illustrated in fig. 1, and each touch electrode 111 is connected to one touch electrode lead 112, and each touch electrode lead 112 is connected to one landing area D, which are taken as examples, and the number and arrangement of the touch electrodes 111 are not limited, and the corresponding relationship among the touch electrodes, the touch electrode leads, and the landing areas is not limited.
As shown in fig. 1, the touch electrode 111 may have a grid structure, and in order to avoid affecting the normal display of each pixel in the display substrate, the grid structure of the touch electrode 111 needs to avoid each pixel. The touch electrode layer may be made of a metal material, for example, molybdenum (Mo) may be used to make the touch electrode layer.
In specific implementation, in order to protect the touch electrode layer, the passivation layer may be set to have a whole-layer structure, that is, the passivation layer is disposed in both the touch region T and the peripheral region P, the passivation layer may include each touch electrode 111 in the touch region T, and the passivation layer may also serve to raise the landing electrode 13 in the peripheral region P.
As shown in fig. 2 and 3, in order to transmit the touch signal to the display substrate, the landing electrode 13 is disposed in the landing area D, the landing electrode 13 is electrically connected to the touch electrode lead 112, and the landing electrode 13 corresponds to a position of a contact electrode in the display substrate, and the landing electrode 13 is in contact with the corresponding contact electrode, so that the touch signal is transmitted. Specifically, the bonding electrode 13 may be made of a transparent conductive oxide material, for example, an Indium Tin Oxide (ITO) material, or may be made of other materials, and the material of the bonding electrode 13 is not limited herein.
In addition, by arranging the padding structure 14 between the overlapping electrode 13 and the touch electrode lead 112, the overlapping electrode 13 can be padded, and because the distance between the package cover plate and the display substrate in the display panel is approximately fixed, the overlapping electrode on one side of the package cover plate is padded, the thickness of a film layer below a contact electrode in the display substrate can be reduced, the thickness of a flat layer below the contact electrode is prevented from being too large, or the number of layers of the flat layer below the contact electrode can be reduced, the smoothness of the contact electrode is ensured, the effective contact area between the contact electrode and the overlapping electrode is increased, the contact resistance is reduced, and the transmission efficiency of touch signals is improved.
In addition, in the package cover plate in the embodiment of the invention, the padding structure comprises at least one inorganic insulating film layer, the passivation layer capable of playing a certain padding role is also made of an inorganic material, and the inorganic material cannot deform under the influence of temperature in the manufacturing process, so that the lapping electrode is padded up through the padding structure, and the flatness of the surface of the lapping electrode cannot be influenced. Specifically, the inorganic insulating film layer and the passivation layer in the raised structure may be made of SiNx or SiOx.
In specific implementation, in the package cover plate provided in the embodiment of the present invention, as shown in fig. 3, the padding structure 14 includes: a passivation structure 141 between the passivation layer 12 and the landing electrode 13.
Generally, the passivation structure 141 is made of an inorganic material, and it can also be understood that the inorganic insulating film layer in the step-up structure 14 may be the passivation structure 141, and since the passivation structure is not deformed by the influence of temperature during the manufacturing process, the step-up electrode 13 can be raised on the basis that the surface flatness of the step-up electrode 13 is not affected. In addition, since the thickness of the passivation structure 141 does not affect the flatness of the landing electrode 13, the passivation structure 13 may be made to have the maximum thickness within the process capability range in order to raise the landing electrode 13 to the maximum, and for the same reason, the passivation layer 12 may also be made to have the maximum thickness within the process capability range in order to further raise the landing electrode 13.
Specifically, in the above package cover plate provided by the embodiment of the present invention, as shown in fig. 2 and 3, the passivation layer 12 includes a first via V1 located in the overlap region D, and the passivation structure 141 includes a second via V2;
the orthographic projection of the first via V1 on the substrate 10 is within the range of the orthographic projection of the second via V2 on the substrate 10, and the second via V2 is larger than the first via V1.
The lap electrode 13 is electrically connected with the touch electrode lead 112 through the first via hole V1 and the second via hole V2, the size of the second via hole V2 is set to be larger than that of the first via hole V1, and the orthographic projection position of the first via hole V1 on the substrate 10 is in the orthographic projection range of the second via hole V2 on the substrate 10, so that phenomena such as the lap electrode 13 breaking caused by the too deep via hole can be avoided, the lap electrode 13 is ensured to be in good contact with the touch electrode lead 112, and the touch signal is smoothly transmitted.
As shown in fig. 2, in order to leave an area in contact with the touch electrode in the display panel, i.e., an area where the dotted line frame Q is located, the first via hole V1 (or the second via hole V2) may be disposed around the area Q.
Further, in the above-mentioned package cover board provided by the embodiment of the present invention, fig. 4 is a second schematic plan view of the lap joint region in the embodiment of the present invention, fig. 5 is a schematic cross-sectional view of a broken line L2 in fig. 4, and as shown in fig. 4 and fig. 5, the heightening structure 14 may further include: an electrically conductive connection structure 142 between the passivation layer 12 and the passivation structure 141;
the bonding electrode 13 is electrically connected to the touch electrode lead 112 through the conductive connection structure 142.
By providing the conductive connection structure 142 between the passivation layer 12 and the passivation structure 141, the overlap electrode 13 can be further raised, and thus, the height of the contact electrode in the display substrate can be further reduced, so that the thickness of the film layer below the contact electrode can be further reduced, and the contact resistance between the overlap electrode and the contact electrode can be further reduced.
Specifically, in the package cover plate provided by the embodiment of the present invention, referring to fig. 4 and 5 as well, the passivation layer 12 includes a first via V1 located in the lap joint region D, and the conductive connection structure 142 is electrically connected to the touch electrode lead 112 through the first via V1;
the passivation structure 141 includes a second via V2, and the conductive connection structure 142 is electrically connected to the landing electrode 13 through the second via V2;
the orthographic projection of the first via hole V1 on the substrate 10 and the orthographic projection of the second via hole V2 on the substrate 10 do not overlap.
By providing the first via hole V1 in the passivation layer 12 and the second via hole V2 in the passivation structure 14, electrical connection between the landing electrode 13 and the touch electrode lead 112 can be achieved to ensure transmission of touch signals. In addition, the orthographic projection of the first via hole V1 on the substrate 10 is set to be not overlapped with the orthographic projection of the second via hole V2 on the substrate 10, so that a large gradient angle generated by overlapping via holes can be avoided, and the conduction performance between the lap electrode 13 and the touch electrode lead 112 is not affected.
In specific implementation, in the package cover plate provided in the embodiment of the present invention, as shown in fig. 4, the first vias V1 and the second vias V2 are alternately arranged, so that the first vias V1 can avoid the second vias V2, and in addition, in order to leave an area in contact with the touch electrodes in the display panel, that is, an area where a dotted line frame Q is located in the figure, the first vias V1 and the second vias V2 may be disposed around the area Q.
In practical applications, in the package cover plate provided in the embodiment of the present invention, the conductive connection structure may be made of the same material as the touch electrode layer, that is, the conductive connection structure may be made of a metal material, for example, molybdenum (Mo); alternatively, the conductive connection structure and the bonding electrode are made of the same material, that is, the conductive connection structure may also be made of a transparent conductive material, for example, an indium tin oxide material. The conductive connection structure is made of the same material as the touch electrode layer or the lap electrode, and process equipment and process parameters do not need to be frequently replaced in the manufacturing process of the packaging cover plate, so that the conductive connection structure is convenient to manufacture.
In the embodiment of the present invention, the step-up structure includes the passivation structure, or the step-up structure includes the passivation structure and the conductive connection structure as an example for description, in a specific implementation, the step-up structure may also include other film layers, which are not limited herein, and the number of layers of the passivation structure and the conductive connection structure may be set according to an actually required height, which is not limited herein.
In addition, the thickness increase of the touch electrode layer, the passivation layer and the padding structure in the packaging cover plate does not affect the surface smoothness of the lap electrode, and in practical application, the thickness of the touch electrode layer, the passivation layer and the padding structure can be set to be the maximum value which can be realized by the process, so that the lap electrode is padded up to the maximum extent.
In a second aspect, based on the same inventive concept, embodiments of the present invention further provide a display panel, and since the principle of the display panel to solve the problem is similar to that of the package cover plate, the implementation of the display panel may refer to the implementation of the package cover plate, and repeated details are not repeated.
Fig. 6 is a schematic plan view illustrating a display substrate according to an embodiment of the present invention, where as shown in fig. 6, the display substrate is divided into a display area a and a non-display area B, the non-display area includes a plurality of overlapping steps G, fig. 7 is a schematic plan view illustrating the overlapping steps G, and fig. 8 is a schematic cross-sectional view of a dotted line L3 in fig. 7. As shown in fig. 7 and 8, the display substrate in the embodiment of the present invention includes: a substrate 20, a contact electrode 201 on the substrate 20, and a first planarization layer 202 and a second planarization layer 203 between the substrate 20 and the contact electrode 201.
Fig. 9 is a schematic structural view of the package cover plate and the display substrate after being aligned and bonded, wherein the package cover plate 1 in fig. 9 is a schematic cross-sectional view of a dotted line L4 in fig. 4.
As shown in fig. 6 to 9, the display panel provided in the embodiment of the present invention includes: a display substrate 2 and the package cover plate 1;
the display substrate 2 is arranged opposite to the packaging cover plate 1;
the display substrate 2 is divided into a display area a and a non-display area B; the non-display area B includes a plurality of bonding pads G located on the substrate 10 and opposite to the bonding areas D, the bonding pads G are provided with contact electrodes 201 on the surface of the side away from the substrate 20, and the contact electrodes 201 are in direct contact with and electrically connected to the bonding electrodes in the corresponding bonding areas D.
As shown in fig. 1 and 6, a display area a in the display substrate corresponds to a touch area T in the package cover, a non-display area B in the display substrate corresponds to a peripheral area P in the package cover, a landing plateau G in the non-display area B corresponds to a landing area D in the package cover, and a contact electrode in the landing plateau G directly contacts a landing electrode in the landing area D to realize landing, so as to transmit a touch signal.
In the display panel provided by the embodiment of the invention, because the lapping electrode in the packaging cover plate is lifted by the pad, the height of a lapping plateau in the display substrate can be reduced, so that a film layer below the contact electrode does not need to be too thick, specifically, the thicknesses of the first flat layer and the second flat layer can be reduced, and the lapping plateau can only comprise one flat layer under the condition that the lifted degree of the lapping electrode is large enough, so that the surface smoothness of the contact electrode can be ensured to be good, and the contact between the contact electrode and the lapping electrode is good.
In practical application, the contact electrode can be made of the same material as the anode layer in the display substrate, so that the contact electrode and the anode can be made by the same composition process in the manufacturing process, the process steps are saved, and the manufacturing cost is reduced.
The display panel provided by the embodiment of the invention can solve the problem of poor lap joint of the contact electrode and the lap joint electrode under lower process difficulty, and improves the reliability and the continuity of signal lap joint.
Further, in the display panel provided by the implementation of the present invention, as shown in fig. 9, an orthographic projection of the landing plateau on the substrate base plate 20 and an orthographic projection of the first via V1 and the second via V2 in the package cover plate 1 on the substrate base plate 20 do not overlap each other.
That is to say, set up the overlap joint plateau as avoiding the via hole in the encapsulation apron, can avoid the via hole in the encapsulation apron to influence the overlap joint effect between overlap joint electrode and the contact electrode, in addition, consider that the signal line in the display substrate is more, the space in the display substrate is more nervous, and, guarantee the area of contact between overlap joint electrode and the contact electrode, can keep the size of overlap joint plateau in the display substrate unchangeable, increase the size of overlap joint region in the encapsulation apron, so that the via hole in the encapsulation apron is avoided to the overlap joint plateau.
Since the package cover 1 in fig. 9 is a schematic cross-sectional view at a dashed line L4 in fig. 4, fig. 9 only shows that the second via V2 does not overlap with the landing plateau, because the first via is not in the cross-section shown in fig. 9, and in practice, the first via V1 does not overlap with the landing plateau.
In a third aspect, based on the same inventive concept, an embodiment of the present invention further provides a display device, including the display panel, where the display device may be applied to any product or component with a display function, such as a mobile phone, a tablet computer, a television, a display, a notebook computer, a digital photo frame, and a navigator. Since the principle of the display device to solve the problem is similar to that of the display panel, the display device can be implemented by the display panel, and repeated descriptions are omitted.
According to the packaging cover plate, the display panel and the display device provided by the embodiment of the invention, the heightening structure is arranged between the touch electrode layer and the lapping electrode, so that the thickness of a film layer below the contact electrode in the display substrate can be reduced, the smoothness of the surface of the contact electrode is improved, the effective contact area between the contact electrode and the lapping electrode is increased, the contact resistance is reduced, the lapping effect is improved, and the transmission efficiency of a touch signal is improved.
It will be apparent to those skilled in the art that various changes and modifications may be made in the present invention without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include such modifications and variations.
Claims (6)
1. A package cover, comprising: the touch control device comprises a substrate, a touch control electrode layer positioned on the substrate, and a passivation layer positioned on one side of the touch control electrode layer, which is far away from the substrate;
the packaging cover plate is divided into a touch area and a peripheral area, and the peripheral area comprises a plurality of lap joint areas;
the touch electrode layer comprises a plurality of touch electrodes positioned in the touch area and a plurality of touch electrode leads respectively extending from the touch area to the lap area;
the lap zone comprising: the lapping electrode is positioned on one side, away from the substrate, of the touch electrode layer, and the padding structure is positioned between the touch electrode layer and the lapping electrode;
the lapping electrode is electrically connected with the touch electrode lead wire belonging to the same lapping area;
the heightening structure comprises at least one inorganic insulating film layer;
the passivation layer is made of inorganic materials;
the heightening structure comprises: a passivation structure located between the passivation layer and the landing electrode; the passivation layer comprises a first via located in the overlap region, and the passivation structure comprises a second via; the orthographic projection of the first via hole on the substrate is positioned in the range of the orthographic projection of the second via hole on the substrate, and the second via hole is larger than the first via hole;
alternatively, the heightening structure comprises: a passivation structure between the passivation layer and the landing electrode, and an electrically conductive connection structure between the passivation layer and the passivation structure; the lapping electrode is electrically connected with the touch electrode lead through the conductive connection structure; the passivation layer comprises a first via hole positioned in the lap joint area, and the conductive connection structure is electrically connected with the touch electrode lead through the first via hole; the passivation structure comprises a second via hole, and the conductive connection structure is electrically connected with the lapping electrode through the second via hole; the orthographic projection of the first via hole on the substrate and the orthographic projection of the second via hole on the substrate do not overlap.
2. The package cover plate of claim 1, wherein an orthographic projection of the first via on the substrate and an orthographic projection of the second via on the substrate do not overlap; the first via holes and the second via holes are alternately arranged.
3. The package cover plate of claim 1, wherein the conductive connection structure and the touch electrode layer are made of the same material; or the conductive connection structure and the lap joint electrode are made of the same material.
4. A display panel, comprising: a display substrate and the package cover plate according to any one of claims 1 to 3;
the display substrate and the packaging cover plate are oppositely arranged;
the display substrate is divided into a display area and a non-display area; the non-display area comprises a plurality of lap joint high platforms which are positioned on a substrate and opposite to the lap joint area, contact electrodes are arranged on the surfaces of the lap joint high platforms, which are far away from one side of the substrate, and the contact electrodes are directly contacted and electrically connected with the corresponding lap joint electrodes in the lap joint area.
5. The display panel of claim 4, wherein an orthographic projection of the landing plateau on the substrate base plate and an orthographic projection of the first via and the second via in the package cover plate on the substrate base plate do not overlap.
6. A display device, comprising: a display panel as claimed in claim 4 or 5.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
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| CN105655378A (en) * | 2016-01-04 | 2016-06-08 | 京东方科技集团股份有限公司 | Array substrate, OLED display panel, manufacturing method and display device |
| CN108459771A (en) * | 2018-01-08 | 2018-08-28 | 友达光电股份有限公司 | Touch control display panel |
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| CN105655378A (en) * | 2016-01-04 | 2016-06-08 | 京东方科技集团股份有限公司 | Array substrate, OLED display panel, manufacturing method and display device |
| CN108459771A (en) * | 2018-01-08 | 2018-08-28 | 友达光电股份有限公司 | Touch control display panel |
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