CN114784016A - Display panel and display device - Google Patents

Display panel and display device Download PDF

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Publication number
CN114784016A
CN114784016A CN202210315853.9A CN202210315853A CN114784016A CN 114784016 A CN114784016 A CN 114784016A CN 202210315853 A CN202210315853 A CN 202210315853A CN 114784016 A CN114784016 A CN 114784016A
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Prior art keywords
display panel
display area
display
layer
substrate
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CN202210315853.9A
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Chinese (zh)
Inventor
李雪
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Wuhan Tianma Microelectronics Co Ltd
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Wuhan Tianma Microelectronics Co Ltd
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Priority to CN202210315853.9A priority Critical patent/CN114784016A/en
Publication of CN114784016A publication Critical patent/CN114784016A/en
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H01L27/124Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/58Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/60Protection against electrostatic charges or discharges, e.g. Faraday shields
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H01L27/1255Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs integrated with passive devices, e.g. auxiliary capacitors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10OLED displays
    • H10K59/12Active-matrix OLED [AMOLED] displays

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

The invention discloses a display panel and a display device, belonging to the technical field of display, wherein the display panel comprises a display area and a non-display area which is at least partially arranged around the display area, the non-display area at least comprises a first non-display area, the first non-display area comprises a cutting edge and a retaining wall, the display panel comprises a first base, the first base at least comprises a first substrate, a first conducting layer and a second substrate which are arranged in a stacking way, a first insulating layer is positioned on one side of the second substrate, which is deviated from the first substrate, a first metal layer is positioned on one side of the first insulating layer, which is deviated from the first substrate, and in the first non-display area, the first metal layer comprises at least one first part, the direction of the first non-display area is directed to the display area, and the first part is positioned between the cutting edge and the retaining wall. The display device comprises the display panel. The invention can effectively slow down the speed of static electricity entering the screen body, improve the static protection capability and is beneficial to improving the product yield and the display quality.

Description

Display panel and display device
Technical Field
The present invention relates to the field of display technologies, and in particular, to a display panel and a display device.
Background
With the vigorous development of flat panel Display technology, Organic Light Emitting Display (OLED for short) has increasingly wide applications due to its excellent characteristics of self-luminescence, high brightness, wide viewing angle, fast response, etc.
In the prior art, an organic light emitting display panel generally includes an array substrate, a plurality of organic light emitting diodes disposed on the array substrate, and an encapsulation layer disposed on a side of the organic light emitting diodes away from the array substrate and covering the organic light emitting diodes. During the manufacturing process of the structures, such as the cutting process and the testing or using process of the organic light emitting display panel, static electricity is generated, and the static electricity may have adverse effects on the display of the organic light emitting display panel, so that the static electricity may cause damage to the organic light emitting diodes, thereby affecting the normal display of the organic light emitting display panel. For example before the display screen leaves the factory, need carry out electrostatic protection test or bar copper friction experiment to the display screen, produce the negative charge easily among the above-mentioned test procedure, the negative charge gets into the internal portion of screen through display device's apron edge to influence the electrical property of the inside transistor of display screen (for example transistor threshold voltage is just partially very easily), and then the peripheral demonstration of screen appears and shines the phenomenon, influences the display effect. In the testing process, when the display screen is hit by static electricity, the panel can be damaged, so that the packaging is invalid, and the product yield is further influenced.
Therefore, it is an urgent need in the art to provide a display panel and a display device that can improve the electrostatic protection capability, effectively slow down the speed of static electricity entering the panel, and enable the static electricity to be rapidly dispersed, thereby facilitating the improvement of the yield and the display quality of the product.
Disclosure of Invention
In view of this, the present invention provides a display panel and a display device, so as to solve the problems that charges are easily generated during a product test process in the prior art, electrical properties of transistors inside a display screen are affected, and further, display around the screen is bright and a display effect is poor.
The invention discloses a display panel, comprising: the display device comprises a display area and a non-display area at least partially arranged around the display area, wherein the non-display area at least comprises a first non-display area, the first non-display area comprises a cutting edge and a retaining wall, and the cutting edge is positioned on one side of the first non-display area, which is far away from the display area; the display panel includes: the first substrate at least comprises a first substrate, a first conducting layer and a second substrate which are stacked in the direction vertical to the light-emitting surface of the display panel, and the first conducting layer is positioned between the first substrate and the second substrate; the first insulating layer is positioned on one side, away from the first substrate, of the second substrate; the first metal layer is positioned on one side, away from the first substrate, of the first insulating layer; in the first non-display area, the first metal layer comprises at least one first part, and the first part is positioned between the cutting edge and the retaining wall along the direction of the first non-display area pointing to the display area.
Based on the same inventive concept, the invention also discloses a display device, which comprises the display panel.
Compared with the prior art, the display panel and the display device provided by the invention at least realize the following beneficial effects:
the display panel is arranged in a first non-display area, the first metal layer comprises at least one first part, so that in the direction vertical to the light-emitting surface of the display panel, a first storage capacitor is formed by overlapping the first part and a first conductive layer of a first substrate, the first part is one polar plate of the first storage capacitor, and a part of the first conductive layer overlapped with the first part is the other polar plate of the first storage capacitor, when charges enter from the outside, such as from the cutting edge of the display panel in the cutting process or the static test process, the charges can be prevented from entering the display area quickly by utilizing the charge storage capacity of the first storage capacitor formed by overlapping the first part and the first conductive layer of the first substrate, the speed of static electricity entering the screen body of the display panel is effectively slowed down, and the electric performance of a thin film transistor in a driving circuit layer in the range of the display area is prevented from being influenced, thereby being beneficial to reducing the occurrence probability of poor display. In addition, the direction pointing to the display area along the first non-display area is arranged, the first part is positioned between the cutting edge and the retaining wall, namely the first part is positioned on one side of the retaining wall far away from the display area, compared with the prior art that the electrostatic ring with the electrostatic protection function is designed on one side of the retaining wall close to the display area, or compared with the prior art that the electrostatic ring is designed into a structure mutually overlapped with the retaining wall, the invention can prevent the retaining wall and the packaging structure of the display panel from being damaged when the static electricity is too large through the first part of the metal material arranged on one side of the retaining wall far away from the display area, and further can more effectively prevent crack extension through double protection of the first part and the retaining wall, thereby influencing the product yield and the display effect. Therefore, the arrangement of the first part of the retaining wall on the side far away from the display area can not only prevent the electric charge from entering the display area quickly through the first storage capacitor formed by overlapping the first part and the first conducting layer of the first substrate, but also prevent the retaining wall and the packaging structure of the display panel from being damaged by the first part of the metal material arranged on the side far away from the display area when the static electricity is too large, so that the electrostatic protection and the crack extension prevention can be more effectively realized through the double protection of the first part and the retaining wall, and the product yield and the display quality can be further improved.
Of course, it is not necessary for any product in which the present invention is practiced to specifically achieve all of the above-described technical effects simultaneously.
Other features of the present invention and advantages thereof will become apparent from the following detailed description of exemplary embodiments thereof, which proceeds with reference to the accompanying drawings.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description, serve to explain the principles of the invention.
Fig. 1 is a schematic plan view of a display panel according to an embodiment of the present invention;
FIG. 2 is a schematic cross-sectional view A-A' of FIG. 1;
FIG. 3 is a schematic view of another cross-sectional structure taken along line A-A' of FIG. 1;
FIG. 4 is a schematic diagram of another planar structure of a display panel according to an embodiment of the present invention;
FIG. 5 is a schematic diagram of another planar structure of a display panel according to an embodiment of the present invention;
FIG. 6 is a schematic view of another cross-sectional structure taken along line A-A' of FIG. 1;
FIG. 7 is a schematic view of another cross-sectional structure along the line A-A' in FIG. 1;
FIG. 8 is a schematic diagram of another planar structure of a display panel according to an embodiment of the present invention;
FIG. 9 is a schematic cross-sectional view taken along line C-C' of FIG. 8;
FIG. 10 is a schematic diagram of another planar structure of a display panel according to an embodiment of the present invention;
FIG. 11 is a schematic view of another planar structure of a display panel according to an embodiment of the present invention;
FIG. 12 is a schematic diagram of another planar structure of a display panel according to an embodiment of the present invention;
FIG. 13 is an enlarged partial view of the area M in FIG. 12;
FIG. 14 is a schematic diagram of another planar structure of a display panel according to an embodiment of the present invention;
FIG. 15 is a schematic cross-sectional view taken along line D-D' of FIG. 14;
fig. 16 is a partial enlarged view of the region N in fig. 15;
FIG. 17 is another enlarged partial view of the area N in FIG. 15;
FIG. 18 is another enlarged partial view of the area N in FIG. 15;
fig. 19 is a schematic plan view of a display device according to an embodiment of the present invention.
Detailed Description
Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that: the relative arrangement of the components and steps, the numerical expressions and numerical values set forth in these embodiments do not limit the scope of the present invention unless it is specifically stated otherwise.
The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the invention, its application, or uses.
Techniques, methods, and apparatus known to those of ordinary skill in the relevant art may not be discussed in detail but are intended to be part of the specification where appropriate.
In all examples shown and discussed herein, any particular value should be construed as merely illustrative, and not limiting. Thus, other examples of the exemplary embodiments may have different values.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be discussed further in subsequent figures.
Referring to fig. 1 and fig. 2 in combination, fig. 1 is a schematic plan view of a display panel according to an embodiment of the present invention, fig. 2 is a schematic cross-sectional view of a-a' in fig. 1, and the display panel 000 according to the embodiment includes: the display panel comprises a display area AA and a non-display area NA at least partially surrounding the display area AA, wherein the non-display area NA at least comprises a first non-display area NA1, the first non-display area NA1 comprises a cutting edge Q and a retaining wall B, and the cutting edge Q is positioned on one side, away from the display area AA, of the first non-display area NA 1;
the display panel 000 includes:
the first base 10, in a direction Z perpendicular to the light emitting surface of the display panel 000, the first base 10 at least includes a first substrate 101, a first conductive layer 102, and a second substrate 103, which are stacked, and the first conductive layer 102 is located between the first substrate 101 and the second substrate 103;
a first insulating layer 20, the first insulating layer 20 being located on a side of the second substrate 103 facing away from the first substrate 101;
a first metal layer 30, wherein the first metal layer 30 is located on one side of the first insulating layer 20, which faces away from the first substrate 101;
in the first non-display area NA1, the first metal layer 30 includes at least one first portion 301, and the first portion 301 is located between the cutting edge Q and the retaining wall B along a direction in which the first non-display area NA1 points to the display area AA.
Specifically, the display panel 000 provided in this embodiment may be an organic light emitting display panel, and the display principle of the organic light emitting display panel is that under the driving of a certain electric field, electrons and holes are injected from the cathode and the anode to the electron and hole transport layers, respectively, and the electrons and the holes migrate to the light emitting layer of the light emitting device through the electron and hole transport layers, respectively, and meet in the light emitting layer to form excitons and excite light emitting molecules, and when power is supplied to a proper voltage, charges of the anode and the cathode are combined in the light emitting layer to generate light, and three primary colors of red, green, and blue are generated according to different formulations to form basic colors, so as to form a display screen. Optionally, the display area AA of the display panel 000 of the embodiment may include a plurality of sub-pixels P (not filled in the figure) with different colors, and a specific structure of each sub-pixel P may be fabricated by film layers, such as the driving circuit layer 001, the planarization layer 002, the anode layer 003, the pixel defining layer 004, the organic light emitting layer 005, the cathode layer 006, and the thin film encapsulation layer 007, which are disposed on the first substrate 10, where fig. 2 is only a simple film layer structure illustrating the display panel 000, and the specific film layer structure within the display area AA of the display panel 000 in the embodiment is not described in detail, and can be understood by referring to a design structure of an organic light emitting display panel in the related art.
The display panel 000 of this embodiment includes a display area AA and a non-display area NA at least partially surrounding the display area AA, optionally, the non-display area NA may be disposed only partially around the display area AA, or the non-display area NA may also be disposed around the entire display area AA, the present embodiment does not specifically limit the disposed shape of the non-display area NA, the non-display area NA may be a shape (not shown in the drawings) disposed around the display area AA in a closed ring shape, that is, the non-display area NA may be disposed all around the display area AA, the non-display area NA may also be a shape disposed around the display area AA in an unsealed arc shape, that is, the non-display area NA may also be disposed around only a portion of the display area AA (as shown in fig. 1), and in specific implementation, the non-display area NA may be designed according to actual requirements.
In this embodiment, the non-display area NA of the display panel 000 at least includes the first non-display area NA1, the first non-display area NA1 includes the cut edge Q, the cut edge Q is located on a side of the first non-display area NA1 away from the display area AA, the first non-display area NA1 can be understood as a part of the outermost non-display area in the non-display area NA of the display panel 000, because in the general process of manufacturing the display panel 000, in order to improve the manufacturing efficiency, the display panel is manufactured by cutting a large display substrate including a plurality of display panels, static electricity is easily generated in the process of cutting the large display substrate along the cutting line, and the static electricity may have a certain influence on the display effect of the cut display panel 000. After the cutting of the large display substrate along the cutting line is completed, an edge of an outermost periphery of each display panel 000 may be understood as a cut edge Q included in the first non-display area NA1 of the display panel 000 in this embodiment. In the present embodiment, at least one retaining wall B is further disposed in the range of the first non-display area NA1 of the display panel 000, and optionally, the retaining wall B may be stacked by using a film structure of the display panel 000 itself, so as to form a retaining wall B with a certain height in the range of the first non-display area NA 1. For example, the bank B may include a plurality of first insulating portions B1, second insulating portions B2, third insulating portions B3, and fourth insulating portions B4 stacked in a stacked manner, wherein the first insulating portions B1 may be disposed in the same layer as a bending protection layer 008 (a bending protection layer BPL refers to an organic layer for filling a bonding bending region, and protects a film structure on a display panel when the bonded flexible circuit board is bent to a backlight side of the display panel by using bending resistance of the filled organic material), the second insulating portions B2 may be disposed in the same layer as a planarization layer 002(PLN) included in the display panel 000, and the third insulating portions B3 may be disposed in a pixel definition layer 004 included in the display panel 000 (a pixel definition layer PDL may be provided with a plurality of openings to define the disposition positions of the organic light emitting material of the respective sub-pixels P, that is, the anode of the respective sub-pixels P and the organic light emitting material portions may be disposed in the openings of the pixel definition layer 004) The material sets up, fourth insulating part B4 can with the isolated support Post (PS) that display panel 000 itself includes with the same layer material setting, and then make the structure of barricade B of first non-display area NA1 pile up the preparation through a plurality of membranous layer structures that display panel 000 itself includes and form, be favorable to improving process efficiency, when reducing the preparation degree of difficulty and cost, can also be through this barricade B structure that has a take the altitude, prevent that the crackle that display panel 000 produced in cutting process from extending, and then influence product yield and display effect. It should be understood that the stacked structure of the retaining walls B in this embodiment is only an example, the material of the stacked structure of the retaining walls B may be various, and the stacked structure of the retaining walls B may also be formed by stacking other materials of different films included in the display panel 000, which is not specifically limited in this embodiment.
Further alternatively, in a direction in which the first non-display area NA1 points to the display area AA, two or more retaining walls B (as shown in fig. 2) may be included in the first non-display area NA1, optionally, in the embodiment, the first non-display area NA1 may include two retaining walls B, the two retaining walls B are arranged in a direction in which the first non-display area NA1 points to the display area AA, wherein, the retaining wall B close to one side of the display area AA can be used as a cut-off limit mark of the organic encapsulation layer in the range of the display area AA, that is, the organic encapsulation layer within the display area AA is stopped at the position of the retaining wall B, and another retaining wall B at a side far from the display area AA can be used to prevent cracks generated during the cutting process from extending toward the display area AA, therefore, the narrow frame design can be facilitated, and the crack extension generated in the cutting process of the display panel 000 can be better prevented.
It should be noted that fig. 2 of the present embodiment only illustrates a cross-sectional structure of the non-display area NA and a portion of the display area AA of the display panel 000, and in a specific implementation, the film structure on the first substrate 10 within the range of the non-display area NA includes, but is not limited to, other film structures such as power signal lines disposed at the periphery of the display area AA, which are not described herein again, for the film structure of the display area AA of the display panel 000, fig. 2 of the present embodiment is merely an example, and can be understood with specific reference to the film structure of the display area of the organic light emitting display panel in the related art, which is not described herein again.
The display panel 000 of the embodiment includes the first base 10, and optionally, the first base 10 may be used as a substrate of the display panel 000, for manufacturing other film structures of the display panel 000 on the first base 10. In a direction Z perpendicular to a light emitting surface of the display panel 000, the first substrate 10 at least includes a first substrate 101, a first conductive layer 102, and a second substrate 103, which are stacked, and the first conductive layer 102 is located between the first substrate 101 and the second substrate 103, wherein the first substrate 101 and the second substrate 103 can be made of at least one organic material such as polyimide, polyethylene terephthalate, or polyurethane, and the first substrate 101 and the second substrate 103 made of the organic material such as polyimide, polyethylene terephthalate, or polyurethane have excellent thermal properties, mechanical properties, electrical properties, and dimensional stability, good film forming properties, high optical transparency, and low moisture absorption rate, and the first substrate 10 thus made can have good planarization properties and adhesion properties. The first conductive layer 102 between the first substrate 101 and the second substrate 103 may play a role in buffering, and in the manufacturing process of the first base 10, the film layer is usually manufactured layer by layer, optionally, the first substrate 101 is manufactured on a hard base plate (which may be manufactured in a coating manner), and then the first conductive layer 102 is manufactured, and the arrangement of the first conductive layer 102 may enable the bonding force between the first substrate 101 and the second substrate 103 to be high, thereby avoiding the problem of film layer peeling, so that the first conductive layer 102 may be used to increase the adhesion force between the first substrate 101 and the second substrate 103, reduce the risk of film layer peeling, enhance the bending resistance of the first base 10, and facilitate the application to the manufacturing of a flexible display device.
Optionally, a driving circuit layer 001 including a plurality of thin film transistors T0 may be further disposed in the range of the display area AA on the first substrate 10, and the first conductive layer 102 in the first substrate 10 is disposed, that is, by disposing the first conductive layer 102 on the side of the second substrate 103 away from the driving circuit layer 001, the first conductive layer 102 may further absorb light generated during laser lift-off, so as to reduce the influence of bottom laser on the channel of the thin film transistor T0 in the driving circuit layer 001 when the first substrate 10 is lifted off from the hard substrate by laser, which is beneficial to improving the electrical uniformity of the thin film transistor T0, and thus improving the display effect of the display panel 000. In addition, in practical use of the display panel 000 provided by this embodiment after the first base 10 is peeled off from the rigid substrate, the first substrate 101 is located at a side away from the driving circuit layer 001, and the first substrate 101 is used as a backlight side to easily absorb charged dirt particles, so that the first conductive layer 102 is disposed in this embodiment, so as to block an influence of such charges on channels of the thin film transistors T0 in the driving circuit layer 001, which is further beneficial to better improving the electrical reliability of the thin film transistors T0, and thus the display quality of the display panel 000 can be further improved.
It can be understood that, in this embodiment, a material for manufacturing the first conductive layer 102 is not specifically limited, and only the first conductive layer 102 needs to be made of a conductive material and have a certain roughness, so as to increase a bonding force between the first substrate 101 and the second substrate 103, and in specific implementation, the material of the first conductive layer 102 may be selected according to actual requirements.
It should be noted that, this embodiment is only an example of a film structure that the first substrate 10 may include, and in specific implementation, the design structure of the first substrate 10 includes, but is not limited to, other film structures, and optionally, as shown in fig. 3, fig. 3 is another schematic cross-sectional structure in the direction of a-a' in fig. 1, an inorganic material layer 104 (not filled in fig. 3) may also be disposed between the first substrate 101 and the first conductive layer 102, and as the inorganic material layer 104 is manufactured on the first substrate 101 made of an organic material, the inorganic material layer 104 manufactured by the method is usually manufactured by using a chemical vapor deposition process, so that a higher bonding force may be provided between the inorganic material layer 104 and the first substrate 101, and further, the bending resistance and the firmness of the first substrate 10 are further improved.
As shown in fig. 1 and fig. 2, in the display panel 000 of the present embodiment, a first insulating layer 20 is further disposed on the first base 10 on a side of the second substrate 103 away from the first substrate 101, and a first metal layer 30 is disposed on a side of the first insulating layer 20 away from the first substrate 101, where the first insulating layer 20 may be configured to insulate the first conductive layer 102 of the first base 10 from the first metal layer 30, or when another metal conductive layer is further disposed between the first base 10 and the first insulating layer 20, the first insulating layer 20 may be configured to insulate the first metal layer 30 from the another metal conductive layer on the first base 10. Optionally, the first metal layer 30 may be a metal film layer in the display panel 000 for manufacturing each thin film transistor T0 in the driving circuit layer 001, that is, the first portion 301 and a certain structure of the thin film transistor T0 may be made of the same material (fig. 2 illustrates only an example where the same material arrangement is used for the first portion 301 and the source and drain of the thin film transistor T0), which is further beneficial to reducing the manufacturing cost, reducing the overall thickness of the display panel 000, and implementing the thin design of the panel.
In this embodiment, the first metal layer 30 is disposed in the first non-display area NA1, and the first metal layer 30 includes at least one first portion 301, as shown in fig. 1, 4 and 5, fig. 4 is another schematic plane structure of the display panel provided in this embodiment of the present invention, fig. 5 is another schematic plane structure of the display panel provided in this embodiment of the present invention, and optionally, the first portion 301 may be a long-stripe structure (as shown in fig. 1), a half-loop structure (as shown in fig. 4) or a segmented-interval structure (as shown in fig. 5) disposed partially around the display area AA, or a structure with another shape, which is not particularly limited in this embodiment; further optionally, the first metal layer 30 in the first non-display area NA1 is provided with at least one first portion 301 (as shown in fig. 1), and may also be provided with two or more first portions 301 (not shown in the drawings), which may be specifically arranged according to a space of the non-display area NA, and this embodiment is not limited thereto, and it is only necessary that the first portion 301 is arranged within the range of the first non-display area NA1, so that, in a direction Z perpendicular to the light emitting surface of the display panel 000, the first portion 301 and the first conductive layer 102 of the first substrate 10 are overlapped to form a first storage capacitor Cst1, the first portion 301 is one plate of the first storage capacitor Cst1, a portion of the first conductive layer 102 overlapped with the first portion 301 is the other plate of the first storage capacitor Cst1, when an external charge enters, for example, a cutting process or an electrostatic test process, the charge enters from the cutting edge Q of the display panel 000, the charge storage capacity of the first storage capacitor formed by overlapping the first portion 301 and the first conductive layer 102 of the first substrate 10 can be utilized to prevent the charge from entering the display area AA quickly, effectively slow down the speed of static electricity entering the 000 panels of the display panel, avoid affecting the electrical performance of the thin film transistor T0 in the driving circuit layer 001 within the range of the display area AA, and further facilitate reducing the occurrence probability of poor display. In addition, in the present embodiment, the direction pointing to the display area AA along the first non-display area NA1 is set, the first portion 301 is located between the cutting edge Q and the retaining wall B, that is, the first portion 301 is located on a side of the retaining wall B far away from the display area AA, compared with the related art in which an electrostatic ring with an electrostatic protection function is designed on a side of the retaining wall close to the display area, or compared with the related art in which the electrostatic ring is designed to overlap with the retaining wall, the present embodiment can prevent the retaining wall B and the packaging structure of the display panel from being damaged by an excessive static electricity through the first portion 301 of the metal material disposed on a side of the retaining wall B far away from the display area AA, and further can prevent the crack from extending more effectively through the dual protection of the first portion 301 and the retaining wall B, thereby affecting the yield of the product and the display effect. Therefore, the arrangement of the first portion 301 on the side of the retaining wall B away from the display area AA of the embodiment can not only prevent the charges from entering the display area AA quickly through the first storage capacitor formed by overlapping the first portion 301 with the first conductive layer 102 of the first substrate 10, but also prevent the retaining wall B and the display panel 000 from being damaged by the metal material of the first portion 301 on the side of the retaining wall B away from the display area AA when the static electricity is too large, so as to achieve the dual protection of the first portion 301 and the retaining wall B, thereby more effectively achieving the functions of electrostatic protection and preventing crack extension, and further facilitating the improvement of the product yield and the display quality.
It should be noted that fig. 1 and fig. 2 of this embodiment only exemplarily show the structure of the display panel 000, and in implementation, the structure of the display panel 000 includes, but is not limited to, and may also include other structures capable of achieving a display effect, optionally, the display panel 000 may further include a cover plate, a protective layer, a touch functional layer, and the like, which is not limited to this, and in implementation, the structure of the organic light emitting display panel in the related art may be referred to for understanding.
It should be further noted that, in the drawings of the present embodiment, only the relevant structures of the display panel of the present embodiment are illustrated for clarity, and actual dimensions, thicknesses, and the like are not shown, and in specific implementation, the display panel may be set according to actual design requirements of the display panel.
In some alternative embodiments, with continuing reference to fig. 1 and fig. 2, the display panel 000 in this embodiment further includes a thin film encapsulation layer 007; the thin film encapsulation layer 007 includes a first inorganic encapsulation layer 007A, a second inorganic encapsulation layer 007C, and an organic encapsulation layer 007B located between the first inorganic encapsulation layer 007A and the second inorganic encapsulation layer 007C; the first inorganic encapsulation layer 007A and the second inorganic encapsulation layer 007C cover the retaining wall B, and the first inorganic encapsulation layer 007A and the second inorganic encapsulation layer 007C are in direct contact with each other on a side of the retaining wall B away from the display area AA.
This embodiment explains that the film encapsulation layer 007 in the display panel 000 may include a multi-layer film, for example, a three-layer or five-layer structure which may be inorganic, organic, inorganic. Optionally, the thin film encapsulation layer 007 of the present embodiment may at least include a first inorganic encapsulation layer 007A, a second inorganic encapsulation layer 007C, and an organic encapsulation layer 007B located between the first inorganic encapsulation layer 007A and the second inorganic encapsulation layer 007C, where the thin film encapsulation layer 007 is used to block moisture and oxygen, so as to prevent the organic light emitting device from being failed due to corrosion of the organic light emitting device by the moisture and the oxygen. The display panel 000 in this embodiment may be encapsulated by Thin Film Encapsulation (TFE), so that the dual requirements of the display panel 000 on flexibility and Encapsulation of the organic light emitting device may be satisfied at the same time. The first inorganic encapsulation layer 007A and the second inorganic encapsulation layer 007C are used for blocking water and oxygen, the organic encapsulation layer 007B is used for relieving bending stress, the first inorganic encapsulation layer 007A and the second inorganic encapsulation layer 007C are made of silicon nitride or silicon oxide, and can be formed by a process of coating (such as PECVD), the organic encapsulation layer 007B is made of an organic silicon compound, an aromatic compound, a diphenyl, styrene, and the like, and can be formed by a process of ink-jet printing, it needs to be noted that the material and the thickness of the thin film encapsulation layer 007 are not limited in this embodiment, and the material and the thickness can be set according to actual requirements during specific implementation. The first inorganic encapsulation layer 007A and the second inorganic encapsulation layer 007C of this embodiment cover the retaining wall B, and the first inorganic encapsulation layer 007A and the second inorganic encapsulation layer 007C are in direct contact with one side of the retaining wall B away from the display area AA, so that the organic encapsulation layer 007B is not arranged in the range of the non-display area NA outside the display area AA, which is beneficial to ensuring effective blocking of water oxygen and the like in the range of the non-display area NA, and the first inorganic encapsulation layer 007A and the second inorganic encapsulation layer 007C are in direct contact with one side of the retaining wall B away from the display area AA, so that the inorganic encapsulation layer can further block the crack from extending to the retaining wall B, and further is beneficial to improving the product yield.
In some alternative embodiments, please refer to fig. 1 and fig. 6 in combination, fig. 6 is another cross-sectional structure schematic diagram in a direction of a-a' in fig. 1, in the present embodiment, in the first non-display area NA1, the first insulating layer 20 includes a plurality of first openings 20K, and in a direction Z perpendicular to the light emitting surface of the display panel 000, the first openings 20K penetrate through the first insulating layer 20;
the orthographic projection of the first portion 301 on the light-emitting surface of the display panel 000 is located within the orthographic projection range of the first opening 20K on the light-emitting surface of the display panel 000.
The present embodiment explains that within the range of the first non-display area NA1, the first insulating layer 20 may be provided with a plurality of first openings 20K penetrating through the thickness of the first insulating layer 20, alternatively, as shown in fig. 6, each of the first openings 20K may be a long-stripe structure disposed around a portion of the display area AA, and the plurality of first openings 20K may be sequentially arranged at intervals along a direction in which the first non-display area NA1 points to the display area AA. In the embodiment, the first insulating layer 20 is provided with the plurality of first openings 20K in the first non-display area NA1 on the side of the retaining wall B away from the display area AA, so that the possibility that the crack extends to the display area AA in the panel cutting process can be reduced by using the plurality of first openings 20K, and the crack extension can be prevented. In this embodiment, the orthographic projection of the first portion 301 on the light-emitting surface of the display panel 000 is disposed within the orthographic projection range of the first opening 20K on the light-emitting surface of the display panel 000, that is, the orthographic projection of the first opening 20K on the light-emitting surface of the display panel 000 covers the orthographic projection of the first portion 301 on the light-emitting surface of the display panel 000, optionally, in the direction Z perpendicular to the light-emitting surface of the display panel 000, the first portion 301 and the first opening 20K overlap each other, and when the first opening 20K is of a structure penetrating through the thickness of the first insulating layer 20, the first portion 301 can be just embedded into the first opening 20K, so that the orthographic projection of the light-emitting surface of the display panel 000 through the first portion 301 is disposed within the orthographic projection range of the light-emitting surface of the first opening 20K on the light-emitting surface of the display panel 000, so that the first portion 301 can just be embedded into the first opening 20K, which is favorable for reducing the distance between the first portion 301 and the first conductive layer 102 in the direction Z perpendicular to the light-emitting surface of the display panel 000, since the capacitance of the capacitor mainly depends on the facing area, the inter-plate distance and the medium itself, i.e. according to the capacitance calculation formula C ∈ S/4 π kd (where ∈ is a constant, S is the facing area of the capacitor plate, d is the distance between the capacitor plates, and k is a constant of the electrostatic force), when the distance between the first portion 301 and the first conductive layer 102 decreases in the direction Z perpendicular to the light-emitting surface of the display panel 000, the capacitance of the first storage capacitor Cst1 formed by the first portion 301 and the first conductive layer 102 increases, and thus the capacity of storing charges increases. Therefore, the orthographic projection of the first portion 301 on the light-emitting surface of the display panel 000 is disposed in the orthographic projection range of the first opening 20K on the light-emitting surface of the display panel 000, so that the increase of the NA width of the non-display area to realize a narrow frame can be avoided, and the capacitance of the first storage capacitor Cst1 formed by the first portion 301 and the first conductive layer 102 can be increased, thereby improving the electrostatic protection capability, further slowing down the speed of static electricity entering the display panel 000, and better improving the display quality. Optionally, considering the process factors in the actual manufacturing, the side surface of the first opening 20K may be an inclined surface or other shapes, and the orthographic projection of the first opening 20K on the light-emitting surface of the display panel 000 is matched with the maximum opening area pattern of the first opening 20K.
It is understood that, in order to improve the capability of preventing crack extension, in the direction of the first non-display area NA1 pointing to the display area AA, the first insulating layer 20 may include a plurality of first openings 20K arranged in sequence, when the first metal layer 30 includes one first portion 301, the orthographic projection of one first portion 301 on the light-emitting surface of the display panel 000 is located in the orthographic projection range of one first opening 20K on the light-emitting surface of the display panel 000, when the first metal layer 30 includes a plurality of first portions 301 (not shown in the drawings), the orthographic projection of each first portion 301 on the light-emitting surface of the display panel 000 may be located in the orthographic projection range of one first opening 20K on the light-emitting surface of the display panel 000, that is, one first portion 301 is located in one-to-one correspondence with one first opening 20K, so that the distance between each first portion 301 and the first conductive layer 102 may be reduced, and the plurality of first portions 301 and the first conductive layer 102 respectively form a plurality of first storage capacitors Cst1, the first storage capacitors Cst1 for storing electrostatic charges cooperate with each other, so as to further slow down the speed of static electricity entering the 000 panels of the display panel and improve the anti-static effect of the display panel.
In some alternative embodiments, with continued reference to fig. 1-6, in the present embodiment, the first conductive layer 102 includes one or more of amorphous silicon or a composite metal oxide.
In this embodiment, it is explained that in the first substrate 10, a material for manufacturing the first conductive layer 102 may include one or more of amorphous silicon or a composite metal Oxide, and optionally, the amorphous silicon may be a-Si, and the composite metal Oxide may be Indium Tin Oxide (ITO), Indium Gallium Zinc Oxide (IGZO), or other composite metal Oxides. The amorphous silicon has the acceptor type and donor type local energy bands in the Si-H band gap, and has the double function of compounding positive and negative ions, so that when the first substrate 10 is stripped by laser, the influence of an electric field formed by mobile charges possibly existing in the first substrate 101 on a thin film transistor T0 of the drive circuit layer 001 can be shielded, light of the whole wave band can be absorbed, the light shielding effect on an active layer of the thin film transistor T0 of the drive circuit layer 001 can be realized, the problems of metal reflection, heating and the like do not exist, and the reliability is favorably improved. Indium tin oxide or indium gallium zinc oxide in the composite metal oxide is a transparent metal oxide semiconductor material, has similar effect to amorphous silicon semiconductor material, can block the influence of mobile charges possibly existing in the first substrate 101 on the upper layer, and can block part of external environment light at the bottom or the influence of heat energy in a laser stripping process in a flexible process on a thin film transistor T0 in the driving circuit layer 001.
It can be understood that, in the present embodiment, the first portion 301 of the first metal layer 30 and the first conductive layer 102 form a first storage capacitor Cst1 capable of storing electrostatic charges in the first non-display area NA1, the first conductive layer 102 of the first non-display area NA1 may be in a floating state, that is, the first conductive layer 102 is not connected to any potential, the capacitor formed by the first portion 301 of the first metal layer 30 and the first conductive layer 102 may be understood as a parallel plate capacitor, the overlapping area of the first portion 301 and the first conductive layer 102 is the facing area S of the capacitor plate in the capacitance value calculation formula C ∈ S/4 π kd, and ∈ is the dielectric constant of the medium between the first portion 301 and the first conductive layer 102, so that even if the first conductive layer 102 is in the floating state, the first portion 301 only needs to have the overlapping area with the first conductive layer 102, and both of the first storage capacitor Cst1 can be formed. In this embodiment, the facing area of the first portion 301 and the first conductive layer 102 is not specifically limited, and the facing area of the first portion 301 and the first conductive layer 102 may be designed as large as possible while meeting the requirement of a narrow frame, which is beneficial to better improving the electrostatic protection capability of the display panel 000.
In some alternative embodiments, please refer to fig. 1 and fig. 7-fig. 9 in combination, fig. 7 is a schematic cross-sectional structure diagram along a direction a-a 'in fig. 1, fig. 8 is a schematic plane structure diagram of a display panel provided by an embodiment of the present invention, fig. 9 is a schematic cross-sectional structure diagram along a direction C-C' in fig. 8, in this embodiment, in the first non-display area NA1, a side of the second substrate 103 facing away from the first substrate 101 includes at least one first recess 1031, and in a direction Z perpendicular to a light-emitting surface of the display panel 000, the first recess 1031 does not penetrate through the second substrate 103; the first recess 1031 is a long bar structure disposed around the display area AA;
the orthographic projection of the first portion 301 on the light emitting surface of the display panel 000 is located in the orthographic projection range of the first recess 1031 on the light emitting surface of the display panel 000, and the first portion 301 is in contact with the first recess 1031.
In this embodiment, it is explained that at least one first recess 1031 may be formed in a side of the second substrate 103 of the first base 10 facing the first insulating layer 20, optionally, the number of the first recesses 1031 may be matched with the number of the first portions 301 of the first metal layer 30, as shown in fig. 1 and 7, taking the example that the first metal layer 30 includes one first portion 301, one first recess 1031 is formed in a side of the second substrate 103 facing away from the first substrate 101, or as shown in fig. 8 and 9, if the first metal layer 30 includes a plurality of first portions 301, a plurality of first recesses 1031 are formed in a side of the second substrate 103 facing away from the first substrate 101, and the plurality of first recesses 1031 may be sequentially arranged along a direction in which the first non-display area NA1 points to the display area AA.
In the direction Z perpendicular to the light emitting surface of the display panel 000 in the present embodiment, the first groove 1031 does not penetrate through the thickness of the second substrate 103, and the first groove 1031 is a long strip structure disposed around the display area AA, as shown in fig. 1 and fig. 8, the first groove 1031 is disposed around a portion of the display area AA, such that the orthographic projection of the first portion 301 on the light emitting surface of the display panel 000 is located in the orthographic projection range of the first groove 1031 on the light emitting surface of the display panel 000, the first portion 301 may be embedded in the groove bottom of the first groove 1031, the surface of the first portion 301 facing the first substrate 101 directly contacts the first groove 1031, and further, the distance between the first portion 301 and the first conductive layer 102 in the direction perpendicular to the light emitting surface of the display panel 000 may be further reduced by the first groove 1031 disposed on the second substrate 103, such that the charge storage capability of the first storage capacitor formed by the first portion 301 and the first conductive layer 102 can be further enhanced, the speed of static entering the 000 screen bodies of the display panel is slowed down more effectively, and the anti-static effect of the display panel is improved.
Optionally, the first recess 1031 formed on the side of the second substrate 103 away from the first substrate 101 in this embodiment is a whole long-strip structure, so that the process difficulty of the first recess 1031 can be reduced, and the process of the first recess 1031 is simplified. The orthographic projection of the first portion 301 on the light-emitting surface of the display panel 000, the orthographic projection of the first opening 20K formed in the first insulating layer 20 on the light-emitting surface of the display panel 000, the orthographic projection of the first opening 20K formed in the second substrate 103 on the side away from the first substrate 101 on the light-emitting surface of the display panel 000, and the orthographic projection of the first opening 20K formed in the first insulating layer 20 on the light-emitting surface of the display panel 000, and the orthographic projection of the first recess 1031 formed in the second substrate 103 on the side away from the first substrate 101 on the light-emitting surface of the display panel 000 can both cover the orthographic projection of the first portion 301 on the light-emitting surface of the display panel 000, so that the first portion 301 can be completely embedded in the groove formed by the first opening 20K and the first recess 1031, and the arrangement of the first opening 20K and the first recess 1031 is facilitated, and the distance between the first portion 301 and the first conductive layer 102 is further reduced, to further enhance the charge storage capability of the storage capacitor.
It is understood that the first opening 20K and the first recess 1031 of the present embodiment may be both long-strip structures disposed around a portion of the display area AA, and the first portion 301 of the present embodiment may be a long-strip structure, or may be a segmented structure disposed at the same position of the first recess 1031, and the shape of the first portion 301 is not particularly limited in the present embodiment, and in the specific implementation, the first opening and the first recess 1031 may be selectively disposed according to actual requirements.
In some alternative embodiments, referring to fig. 10, fig. 10 is a schematic plan view illustrating another planar structure of a display panel according to an embodiment of the present invention, in this embodiment, a first portion 301 of the first metal layer 30 disposed in the first non-display area NA1 is a strip structure disposed around the display area AA; the first portion 301 is connected to a fixed potential signal terminal.
This embodiment explains that the first portion 301 and the first conductive layer 102 for reducing the transmission speed of the electrostatic charges to the display area AA form one plate of the first storage capacitor Cst1, that is, the first portion 301 may have a long bar structure, so that the area of the first storage capacitor Cst1 opposite to the first conductive layer 102 may be made as large as possible, which is beneficial to increase the charge storage capacity of the capacitor and reduce the transmission speed of the electrostatic charges. In this embodiment, the first portion 301 of the long strip structure is further configured to connect a fixed potential signal, optionally, the first portion 301 of the long strip structure may extend to a bonding area BA of the display panel 000, the bonding area BA is provided with a plurality of conductive pads 009, and the conductive pads 009 are used for bonding the driving chip or the flexible circuit board to the bonding area BA, so that the driving signal of the driving chip or the flexible circuit board may be transmitted into the display panel 000 through the conductive pads 009 to achieve a driving display effect of the display panel 000. The plurality of conductive pads 009 of the embodiment at least include a first conductive pad 0091 connected to the first portion 301, that is, the first conductive pad 0091 can be understood as a fixed potential signal terminal, and thus a fixed potential signal can be provided to the first portion 301 through a driving chip or a flexible circuit board. In this embodiment, the first portion 301 is connected to the fixed potential signal, so that a problem of static electricity accumulation (a problem of static electricity accumulation easily occurs when the long straight conductive wire floats) in the first portion 301 of the long strip structure can be avoided, and by connecting a fixed potential signal (which may be a positive potential signal or a negative potential signal, but is not limited in this embodiment) to the first portion 301, a capacitor for storing charges can be formed by the first portion 301 and the first conductive layer 102, so as to slow down a transmission speed of static electricity to the display area AA, and meanwhile, in a process of slow transmission of static electricity, the static electricity charges can be gradually conducted to the binding area BA by the first portion 301 of the long strip structure, so that the static electricity charges can be more effectively prevented from entering the display area AA to affect the display quality of the display panel 000.
In some alternative embodiments, referring to fig. 11, fig. 11 is a schematic plan view of another display panel provided in the embodiments of the present invention, in which in the embodiments, the first metal layer 30 includes a plurality of first portions 301, and the plurality of first portions 301 are arranged at intervals along a direction in which the first non-display area NA1 points to the display area AA.
The embodiment explains that the first metal layer 30 may be provided with a plurality of first portions 301 in the range of the first non-display area NA1, the plurality of first portions 301 are arranged at intervals along the direction in which the first non-display area NA1 points to the display area AA, optionally, the first metal layer 30 may be provided with 2 to 5 first portions 301 in the range of the first non-display area NA1, further optionally, the first portions 301 of the embodiment may be a long-strip structure disposed around a part of the display area AA, so that it is avoided that the excessive number of first portions 301 are not favorable for realizing the narrow frame design of the display panel 000, and at the same time, it is also avoided that the facing area with the first conductive layer 102 is too small due to the too small number of first portions 301, which affects the charge storage capability of the capacitor, and is further not favorable for the transmission speed of static electricity reduction.
It is to be understood that, in fig. 11 of this embodiment, the 5 first portions 301 are exemplified to be arranged at intervals along the direction in which the first non-display area NA1 points to the display area AA, and in specific implementation, the number of the plurality of first portions 301 arranged at intervals along the direction in which the first non-display area NA1 points to the display area AA includes, but is not limited to, this, and other arrangement structures may also be adopted.
In some alternative embodiments, with reference to fig. 11, in the present embodiment, along the direction in which the first non-display area NA1 points to the display area AA, one first portion 301 of the two adjacent first portions 301 is connected to a positive voltage signal terminal, and the other first portion 301 is connected to a negative voltage signal terminal.
The present embodiment explains that the fixed potential signals applied to any two adjacent first portions 301 among the plurality of first portions 301 arranged at intervals in the direction in which the first non-display area NA1 points to the display area AA are different, and optionally, in the direction in which the first non-display area NA1 points to the display area AA, one first portion 301 among the two adjacent first portions 301 is connected to the positive voltage signal terminal, the other first portion 301 is connected to the negative voltage signal terminal, the positive voltage signal terminal and the negative voltage signal terminal can be understood as two different conductive pads 009 in the bonding area BA, taking as an example that five first portions 301 arranged at intervals in the direction in which the first non-display area NA1 points to the display area AA are included in the first non-display area NA1, the five first portions 301 are a, a first portion 301B, a first portion 301C, a first portion 301D, and a first portion 301E, respectively, if the first portion 301A is connected to the positive potential signal terminal, that the positive potential signals are applied through the conductive positive potential pads 009, the first portion 301B is connected to the negative potential signal terminal, the first portion 301C is connected to the positive potential signal terminal, the first portion 301D is connected to the negative potential signal terminal, and the first portion 301E is connected to the positive potential signal terminal; if the first portion 301A is connected to the negative potential signal terminal, that is, the negative potential signal is connected through the conductive pad 009, the first portion 301B is connected to the positive potential signal terminal, the first portion 301C is connected to the negative potential signal terminal, the first portion 301D is connected to the positive potential signal terminal, and the first portion 301E is connected to the negative potential signal terminal, so that the electrostatic charges can be sequentially conducted away through the arrangement of the first portions 301 having the plurality of strip structures, for example, the electrostatic charges are transmitted to the first portion 301A and are not completely conducted away, the first portion 301B continues to conduct the static electricity until the first portion 301E, thereby facilitating to slow down the transmission speed of the static electricity to the display area AA through the capacitance formed by the first portion 301 and the first conductive layer 102, and simultaneously, the static electricity can be gradually conducted away to the bonding area BA through the plurality of first portions 301 connected to different fixed potential signals, so that the conducted static electricity is more sufficient, the electrostatic protection effect of the display panel 000 is further improved.
In some alternative embodiments, please refer to fig. 12 and 13 in combination, fig. 12 is a schematic plan view illustrating a display panel according to an embodiment of the present invention, and fig. 13 is a partial enlarged view of an area M in fig. 12, in this embodiment, the first portion 301 includes a plurality of first sub-portions 3011, and the plurality of first sub-portions 3011 are disposed at intervals along the first direction X; in a direction parallel to the light emitting surface of the display panel 000, the first direction X intersects with a direction in which the first non-display area NA1 points to the display area AA.
The present embodiment explains that the first portion 301 disposed on the first metal layer 30 may also be a segmented structure, and specifically, the first portion 301 includes a plurality of first sub-portions 3011, and the plurality of first sub-portions 3011 are disposed at intervals along a first direction X, where the first direction X can be understood as a direction intersecting a direction in which the first non-display area NA1 points to the display area AA in a direction parallel to the light-emitting surface of the display panel 000, for example, when the first non-display area NA1 is a partial area in a left frame and a right frame of the display area AA illustrated in fig. 12, the first direction X at this time may be the direction illustrated in fig. 12, and when the first non-display area NA1 is a partial area in a frame on the display area AA illustrated in fig. 12, the first direction X at this time may be a transverse direction illustrated in fig. 12 (not illustrated in the drawings). The present embodiment provides a segmented structure in which the first portion 301 includes a plurality of first sub-portions 3011 spaced apart in the first direction X, and can avoid accumulation of electrostatic charges on the first portion 301.
Alternatively, as shown in fig. 12 and fig. 13, the first portion 301 in this embodiment may include a plurality of first portions 301, the plurality of first portions 301 may be sequentially arranged at intervals along a direction in which the first non-display area NA1 points to the display area AA, and each first portion 301 may be a segmented structure including a plurality of first sub-portions 3011 arranged at intervals along the first direction X, so that accumulation of electrostatic charges on the first portion 301 may be avoided, and meanwhile, by arranging the plurality of first portions 301, the charge storage capability of a capacitor formed by the first portion 301 and the first conductive layer 102 may be enhanced, thereby further better enhancing the electrostatic protection effect of the display panel 000.
Alternatively, as shown in fig. 12, in a direction in which the first non-display area NA1 points to the display area AA, two adjacent first portions 301 include an a-th first portion 301 (e.g., 301A in fig. 12) and an a + 1-th first portion 301 (e.g., 301B in fig. 12), where a is a positive integer; along the first direction X, two adjacent first sub-portions 3011 of the same first portion 301 include a spacer F therebetween;
in a direction in which the first non-display area NA1 points toward the display area AA, the spacer F (e.g., the spacer F1 in fig. 12) of the a-th first section 301 (e.g., 301A in fig. 12) does not overlap with the spacer F (e.g., the spacer F2 in fig. 12) of the a + 1-th first section 301 (e.g., 301B in fig. 12).
This embodiment explains that the first section 301 in the range of the first non-display area NA1 may be provided as a segmented structure including a plurality of first sub-sections 3011, accumulation of static electricity may be avoided, and by providing that the first non-display area NA1 points in the direction of the display area AA, the adjacent two first sections 301 include spacer sections F that do not overlap, that is, as shown in fig. 12, the first sub-sections 3011 of the adjacent two first sections 301 are alternately staggered, and one spacer section F1 of the first section 301A overlaps one first sub-section 3011 of the first section 301B and does not overlap with a spacer section F2 between adjacent two first sub-sections 3011 in the first section 301B in the direction in which the first non-display area NA1 points in the display area AA, and that a crack may be prevented from extending in the direction of the display area AA by the staggered arrangement of the first sub-sections 3011, for example, when the crack G illustrated in fig. 13 extends from one spacer section F1 of the first section 301A to the second section 301B, since the spacers F2 and F1 of the second portion 301B do not overlap in the direction in which the first non-display area NA1 points to the display area AA, the crack G is prevented by the first portion 3011 of the first portion 301B when extending from the spacer F1 to the display area AA, thereby being beneficial to ensuring the product yield.
In some alternative embodiments, please refer to fig. 12 and 13 in combination, in this embodiment, along the first direction X, i.e. along the arrangement direction of the plurality of first sub-portions 3011 in the same first portion 301, the length h of the first sub-portion 3011 ranges from 50 um to 100 um.
The present embodiment explains that the first portion 301 in the range of the first non-display area NA1 is configured as a segmented structure including a plurality of first sub-portions 3011, so as to avoid electrostatic accumulation, the length h of each segmented first sub-portion 3011 in the first direction X ranges from 50 to 100um, so as to avoid electrostatic accumulation caused by too long length h of the first sub-portion 3011, which affects display quality, and also avoid increasing process difficulty caused by too short length h of the first sub-portion 3011, and further, in the present embodiment, the length h of the first sub-portion 3011 in the first direction X ranges from 50 to 100um, which is beneficial to ensuring electrostatic protection effect and reducing process difficulty.
It can be understood that, in this embodiment, the lengths h of the plurality of first sub-portions 3011 included in each first portion 301 in the first direction X may be equal or unequal, and only the length h of the first sub-portion 3011 in the first direction X ranges from 50 to 100um, and this embodiment does not specifically limit whether the lengths of the different first sub-portions 3011 are equal, and in specific implementation, the lengths may be selected and set according to actual requirements.
In some alternative embodiments, please continue to refer to fig. 12 and 13 in combination, in the present embodiment, the width n1 of the first portion 301 along the direction in which the first non-display area NA1 points to the display area AA ranges from 3 um to 5 um.
The present embodiment explains that the width n1 of the first portion 301 disposed on the first metal layer 30 in the direction in which the first non-display area NA1 points to the display area AA may be between 3 μm and 5 μm, so that it is possible to avoid that the width n1 of the first portion 301 in the direction in which the first non-display area NA1 points to the display area AA is too wide, which causes too much space to be occupied by the frame area, which is not favorable for implementing a narrow frame design, and it is also possible to avoid that the width n1 of the first portion 301 in the direction in which the first non-display area NA1 points to the display area AA is too narrow, which affects the charge storage capability of the first storage capacitor formed by the first portion 301 and the first conductive layer 102. Therefore, in the embodiment, the first non-display area NA1 is arranged to point to the display area AA, and the width n1 of the first portion 301 is in a range of 3-5 μm, which is not only beneficial to realizing a narrow frame, but also beneficial to enhancing the charge storage capability of the first storage capacitor formed by the first portion 301 and the first conductive layer 102, and beneficial to improving the electrostatic protection effect.
Optionally, a width n2 of the first opening 20K of the first insulation layer 20 in the direction from the first non-display region NA1 to the display region AA may be less than or equal to 7 μm, and n2 is greater than or equal to n1, a width n3 of the first groove 1031 opened on the surface of the second substrate 103 on the side away from the first substrate 101 in the direction from the first non-display region NA1 to the display region AA may also be less than or equal to 7 μm, and n3 is greater than or equal to n1, so that a forward projection of the first portion 301 on the light-emitting surface of the display panel 000 may be located in a forward projection range of the first opening 20K or the first groove 1031 on the light-emitting surface of the display panel 000, and the first portion 301 may just fall into the first opening 20K and the first groove 1031, so that a surface of the first portion 301 on the side facing the first substrate 101 may directly contact with the first groove 1031, which is favorable for avoiding the influence of the width n2 of the groove bottom 1031 of the first opening 20K and the narrow border design of the groove 3, thereby achieving the narrow border design Meanwhile, the distance between the first portion 301 and the first conductive layer 102 can be reduced, and the charge storage capacity of the first storage capacitor formed by the first portion 301 and the first conductive layer 102 can be further improved.
In some alternative embodiments, with continuing reference to fig. 1 and fig. 2, in this embodiment, the display panel 000 of the display area AA further includes a plurality of thin film transistors T0, the thin film transistor T0 at least includes a gate T0G, a source T0S and a drain T0D; the source T0S and the drain T0D are located in the first metal layer 30.
This embodiment explains that the first portion 301 in the range of the first non-display area NA1 can be made of the same material as the source T0S and the drain T0D of the thin film transistor T0, and optionally, the thin film transistor T0 can be any one of the transistors disposed in the driving circuit layer 001 of the display panel 000, since the metal film layer where the source T0S and the drain T0D of the thin film transistor T0 are disposed is generally made of a triple layer formed by Ti/Al/Ti (titanium/aluminum/titanium), and the metal film layer where the gate T0G of the thin film transistor T0 is disposed is generally made of a Mo (molybdenum) layer, the metal film layer where the source T0S and the drain T0D of the thin film transistor T0 are disposed is more flexible than the metal film layer where the gate T0G of the thin film transistor T0 is disposed, and therefore, the first portion 301 is disposed on the same layer as the source T0S and the drain T0D of the thin film transistor T0, which is favorable for releasing stress, thereby preventing the crack from extending effectively. In addition, in the embodiment, the first portion 301 is disposed on the same layer as the source T0S and the drain T0D of the tft T0, and it can be avoided that when the first portion 301 is disposed on another metal film layer on the side of the metal film layer where the source T0S and the drain T0D of the tft T0 are located away from the first substrate 10, the first portion 301 and the first conductive layer 102 are too far apart in the direction Z perpendicular to the light emitting surface of the display panel, which may affect the charge storage capability of the first storage capacitor formed by the first portion 301 and the first conductive layer 102. Therefore, in the embodiment, the first portion 301 in the range of the first non-display area NA1 is made of the same material and by the same process as the source T0S and the drain T0D of the thin film transistor T0, which is beneficial to improving the crack extension resistance of the first portion 301, and simultaneously, the charge storage capacity of the first storage capacitor formed by the first portion 301 and the first conductive layer 102 can be ensured, so as to improve the product yield and the display quality of the display panel 000.
In some alternative embodiments, please refer to fig. 14, fig. 15 and fig. 16 in combination, fig. 14 is another schematic plane structure diagram of a display panel provided by an embodiment of the present invention, fig. 15 is a schematic cross-sectional view along direction D-D' in fig. 14, fig. 16 is a partially enlarged view of an area N in fig. 15, in a display panel 000 provided by this embodiment, in a first non-display area NA1, a side of a second substrate 103 facing away from a first substrate 101 includes a plurality of second grooves 1032, and the plurality of second grooves 1032 are arranged at intervals along a direction that the first non-display area NA1 points to a display area AA; the second groove 1032 does not penetrate the second substrate 103 in a direction perpendicular to the light emitting surface of the display panel 000; a plurality of second recesses 1032 are located between the first part 301 and the retaining wall B in a direction in which the first non-display area NA1 points to the display area AA;
the second groove 1032 includes at least a first cavity 1032A and a second cavity 1032B, and in the direction Z perpendicular to the light emitting surface of the display panel 000, the first cavity 1032A is located on a side of the second cavity 1032B facing the first substrate 101;
the inner diameter D1 of the first cavity 1032A is larger than the inner diameter D2 of the second cavity 1032B along the direction parallel to the light emitting surface of the display panel 000;
the display panel 000 further includes a thin film encapsulation layer 007 and a first inorganic layer 0010, the thin film encapsulation layer 007 is located on a side of the second substrate 103 away from the first substrate 101, and the first inorganic layer 0010 is located on a side of the thin film encapsulation layer 007 away from the first substrate 101;
the thin film encapsulation layer 007 and the first inorganic layer 0010 are in contact with at least the sidewalls 10320 of the second recess 1032.
This embodiment explains that on the first base 10 of the display panel 000, within the range of the first non-display area NA1, the side of the second substrate 103 facing away from the first substrate 101 may further include a plurality of second grooves 1032, and along the direction from the first non-display area NA1 to the display area AA, the plurality of second grooves 1032 are located between the first portion 301 and the retaining wall B, that is, the plurality of second grooves 1032 are located on the side of the retaining wall B away from the display area AA, and the plurality of second grooves 1032 are located on the side of the first portion 301 close to the display area AA. The plurality of second grooves 1032 are arranged at intervals along a direction in which the first non-display area NA1 points to the display area AA, and the second grooves 1032 do not penetrate through the thickness of the second substrate 103 in a direction perpendicular to the light emitting surface of the display panel 000. Optionally, in a direction in which the first non-display area NA1 points to the display area AA, the number of the second recesses 1032 located between the first part 301 and the retaining wall B may also be one, and the specific number of the second recesses 1032 is not limited in this embodiment. Alternatively, as shown in fig. 14, each second groove 1032 may be a long-bar structure disposed around a portion of the display area AA, so as to facilitate a process for manufacturing the second groove 1032 on a side surface of the second substrate 103 facing away from the first substrate 101.
The second groove 1032 in this embodiment at least includes a first cavity 1032A and a second cavity 1032B, wherein in the direction Z perpendicular to the light emitting surface of the display panel 000, the first cavity 1032A is located on a side of the second cavity 1032B facing the first substrate 101, and along a direction parallel to the light emitting surface of the display panel 000, an inner diameter D1 of the first cavity 1032A is larger than an inner diameter D2 of the second cavity 1032B, that is, a cross section (as illustrated in fig. 15 and 16) of the second groove 1032 opened on a side of the second substrate 103 facing away from the first substrate 101 in this embodiment is a structure with a narrow top and a wide bottom, since the organic light emitting material is manufactured by an evaporation process in the manufacturing process of the organic light emitting layer 005 of the display panel 000, while the width of the non-display region NA is smaller to implement a narrow frame design, the retaining wall B is often closer to the display region AA, so that when the organic light emitting layer 005 is manufactured, the organic light emitting material is easily evaporated to the region of the side of the retaining wall B away from the display area AA, that is, the organic light emitting material is easily evaporated to the region of the second groove 1032, thereby affecting the narrow frame design. Therefore, in the present embodiment, the second groove 1032 that is narrow at the top and wide at the bottom is disposed on the side of the retaining wall B away from the display area AA, even if the width of the non-display area NA is small, the retaining wall B is closer to the display area AA, the over-etching design of the inner diameter D1 of the first cavity 1032A of the second groove 1032 is also able to be used, so that the area where the second groove 1032 is located in the design cannot be subjected to evaporation plating of the organic light emitting material, and thus the evaporation plating layer of the organic light emitting material can be effectively isolated in the area, thereby avoiding the organic light emitting material from being evaporated in the area where the second groove 1032 is located, which is beneficial to better realizing the narrow frame effect, and can also ensure the production yield of the display panel.
The display panel 000 of the embodiment further includes a thin film encapsulation layer 007 and a first inorganic layer 0010, the thin film encapsulation layer 007 is located on a side of the second substrate 103 away from the first substrate 101, the first inorganic layer 0010 is located on a side of the thin film encapsulation layer 007 away from the first substrate 101, wherein the thin film encapsulation layer 007 may include a first inorganic encapsulation layer 007A, a second inorganic encapsulation layer 007C, and an organic encapsulation layer 007B located between the first inorganic encapsulation layer 007A and the second inorganic encapsulation layer 007C, the first inorganic encapsulation layer 007A and the second inorganic encapsulation layer 007C cover the dam B, and the first inorganic encapsulation layer 007A and the second inorganic encapsulation layer 007C directly contact each other on a side of the dam B away from the display area AA. The thin film encapsulation layer 007 is used for blocking moisture and oxygen, and prevents the organic light emitting device from being corroded by the moisture and the oxygen to cause failure of the organic light emitting device. The film encapsulation layer 007 and the first inorganic layer 0010 of the present embodiment may be formed on one side of the first substrate 101 by a CVD (Chemical Vapor Deposition) process at the bottom of the second groove 1032, and due to the design of the larger inner diameter D1 of the first cavity 1032A of the second groove 1032, the film encapsulation layer 007 and the first inorganic layer 0010 formed by the CVD process may be at least in contact with the sidewall 10320 of the second groove 1032, that is, the multiple inorganic intrusion structures of the first inorganic encapsulation layer 007A, the second inorganic encapsulation layer 007C, and the first inorganic layer 0010 of the film encapsulation layer 007 are formed on the sidewall 10320 of the second groove 1032, which is beneficial to better blocking water Vapor and improving the manufacturing yield of the display panel.
It can be understood that fig. 14-fig. 16 of this embodiment are only exemplary diagrams illustrating a film structure that the side of the partition wall B away from the display area AA in the first non-display area NA1 may include, but are not limited to, the film structure of the display panel 000 within the range of the first non-display area NA1, and may also include other film structures such as manufacturing a positive power signal line, a negative power signal line, a shift register circuit, and the like.
In some alternative embodiments, referring to fig. 14, fig. 15 and fig. 17 in combination, fig. 17 is another partial enlarged view of the region N in fig. 15, in which the display panel 000 further includes a second metal layer 40, and in a direction Z perpendicular to the light emitting surface of the display panel 000, the second metal layer 40 is located between the film encapsulation layer 007 and the first inorganic layer 0010;
the display panel 000 of the display area AA includes a first touch electrode TP1, the first touch electrode TP1 is located on the second metal layer 40;
in the first non-display area NA1, the second metal layer 40 includes a plurality of second portions 401 (the second metal layer 40 includes two second portions 401 in the figure of the present embodiment as an example), and the plurality of second portions 401 are arranged at intervals along the direction of the first non-display area NA1 pointing to the display area AA;
the orthographic projection of the second portion 401 on the light-emitting surface of the display panel 000 is located within the orthographic projection range of the second groove 1032 on the light-emitting surface of the display panel 000.
The embodiment explains that the display panel 000 may further include a touch functional layer, optionally, the touch functional layer may be disposed on a side of the film encapsulation layer 007 away from the first substrate 10, within a display area AA of the display panel 000, the touch functional layer may include a first touch electrode TP1, and the first touch electrode TP1 may be used to achieve a touch effect of the display panel. In this embodiment, no specific details are given to the working principle of the first touch electrode TP1, a touch driving signal may be provided through a driving chip or a flexible circuit board bound to the display panel 000, and the first touch electrode TP1 of the display panel 000 may implement a capacitive touch mode, which can be understood with reference to the structure of the capacitive touch technology in the related art. The touch functional layer of the embodiment may include a second metal layer 40, in a direction Z perpendicular to the light emitting surface of the display panel 000, the second metal layer 40 is located between the film encapsulation layer 007 and the first inorganic layer 0010, and the first touch electrode TP1 in the touch functional layer is disposed on the second metal layer 40, that is, the second metal layer 40 may be used as the touch functional layer.
In this embodiment, in the first non-display area NA1, the plurality of second portions 401 are disposed in the second metal layer 40, and optionally, in the drawing of this embodiment, the second metal layer 40 includes two second portions 401 as an example for illustration, in a specific implementation, the number of the second portions 401 may be other, and the plurality of second portions 401 are arranged at intervals along the direction in which the first non-display area NA1 points to the display area AA. In the embodiment, the second portion 401 in the first non-display area NA1 can be manufactured by the same process as the first touch electrode TP1 in the display area AA by the same material in the same layer, which is favorable for reducing the manufacturing steps and improving the manufacturing efficiency.
In this embodiment, the orthographic projection of the second portion 401 on the light-emitting surface of the display panel 000 is located in the orthographic projection range of the second groove 1032 on the light-emitting surface of the display panel 000, that is, the orthographic projection of the second groove 1032 on the light-emitting surface of the display panel 000 may cover the orthographic projection of the second portion 401 on the light-emitting surface of the display panel 000, so that the second portion 401 may be just embedded in the second groove 1032, the second portion 401 made of a conductive material may form the second storage capacitor Cst2 with the second conductive layer 102, optionally, the second portion 401 may be a long-strip structure or a half-loop structure or a segmented interval structure or a structure with other shapes, which is not specifically limited in this embodiment. The second portion 401 overlaps with the first conductive layer 102 of the first substrate 10 to form a second storage capacitor Cst2, the second portion 401 is a plate of the second storage capacitor Cst2, and a portion of the first conductive layer 102 overlapping with the second portion 401 is another plate of the second storage capacitor Cst2, when charges enter from the outside, if the first storage capacitor Cst1 formed by the first portion 301 and the first conductive layer 102 is not enough to slow down the transmission speed of static electricity, the second portion 401 in the same layer as the first touch electrode TP1 between the first portion 301 and the barrier wall B further slows down the speed of static electricity entering the display panel 000 screen by using the overlapping between the second portion 401 and the first conductive layer 102 of the first substrate 10 to form the second storage capacitor Cst2, so as to more effectively reduce the occurrence probability of display defects.
It can be understood that, when the second groove 1032 is disposed in the first non-display area NA1 of the display panel 000, in the process of fabricating the touch function layer on the side of the film encapsulation layer 007 away from the first substrate 10, such as fabricating the first touch electrode TP1 of the second metal layer 40, the metal of the second metal layer 40 may easily remain in the second groove 1032, which is determined by the structure of the second groove 1032 with a narrow top and a wide bottom. Therefore, the second portion 401 in this embodiment can be directly formed by using the residual metal of the second metal layer 40 in the second groove 1032, that is, the second portion 401 is manufactured without additional manufacturing process, and only in the process of completing the manufacturing process of the first touch electrode TP1, the second portion 401 can be manufactured by using the residual metal of the second metal layer 40 in the second groove 1032, which not only can avoid increasing the process steps, but also can further slow down the transmission speed of static electricity to the display area AA through the second portion 401, thereby improving the static electricity protection effect.
In some alternative embodiments, please refer to fig. 14, fig. 15 and fig. 18 in combination, fig. 18 is another partial enlarged view of the region N in fig. 15, in which the display panel 000 further includes a third metal layer 50, and in a direction Z perpendicular to the light emitting surface of the display panel 000, the third metal layer 50 is located on a side of the first inorganic layer 0010 away from the second metal layer 40;
the display panel 000 of the display area AA includes a second touch electrode TP2, the second touch electrode TP2 is located on the third metal layer 50;
in the first non-display area NA1, the third metal layer 50 includes a plurality of third portions 501, and the plurality of third portions 501 are arranged at intervals along a direction in which the first non-display area NA1 points to the display area AA;
the orthographic projection of the third part 501 on the light-emitting surface of the display panel 000 is positioned in the orthographic projection range of the second groove 1032 on the light-emitting surface of the display panel 000;
the second portion 401 and the third portion 501 at least partially overlap in a direction Z perpendicular to the light emitting surface of the display panel 000.
The embodiment explains that the touch function layer disposed on the side of the film encapsulation layer 007 away from the first substrate 10 in the display panel 000 may include the first touch electrode TP1 and the second touch electrode TP2, and the first touch electrode TP1 and the second touch electrode TP2 may be used to achieve the touch effect of the display panel. In this embodiment, no detailed description is given to the working principle of the first touch electrode TP1 and the second touch electrode TP2, a touch driving signal can be provided by a driving chip or a flexible circuit board bound to the display panel 000, and the first touch electrode TP1 and the second touch electrode TP2 of the display panel 000 can implement a mutual capacitance touch mode, which can be understood by referring to the structure of a capacitance touch technology in the related art. Fig. 14 of the present embodiment illustrates only the film layer position relationship between the first touch electrode TP1 and the second touch electrode TP2, and in practical implementation, the first touch electrode TP1 and the second touch electrode TP2 may overlap in a direction Z perpendicular to the light exit surface of the display panel 000, or may not overlap, which is not limited in the present embodiment. The touch functional layer of this embodiment may further include a third metal layer 50, and in a direction Z perpendicular to the light emitting surface of the display panel 000, the third metal layer 50 is located on a side of the first inorganic layer 0010 away from the second metal layer 40, that is, the first inorganic layer 0010 has an inorganic encapsulation effect, and may also be used as an insulating layer between the third metal layer 50 and the second metal layer 40. The first touch electrode TP1 and the second touch electrode TP2 in the touch function layer are disposed on the second metal layer 40 and the third metal layer 50, respectively, i.e., both the second metal layer 40 and the third metal layer 50 can be used as touch function layers.
In the present embodiment, in the first non-display area NA1, the plurality of third portions 501 are disposed in the third metal layer 50, optionally, in the drawing of the present embodiment, the third metal layer 50 includes two third portions 501 as an example for illustration, and in specific implementation, the number of the third portions 501 may also be other, and the plurality of third portions 501 are arranged at intervals along a direction in which the first non-display area NA1 points to the display area AA. In the embodiment, the third portion 501 in the first non-display area NA1 and the second touch electrode TP2 in the display area AA can be manufactured by the same process and the same material in the same layer, which is favorable for reducing the manufacturing steps and improving the manufacturing efficiency.
In this embodiment, the orthographic projection of the third portion 501 on the light-emitting surface of the display panel 000 is located in the orthographic projection range of the second groove 1032 on the light-emitting surface of the display panel 000, in the direction Z perpendicular to the light-emitting surface of the display panel 000, the second portion 401 and the third portion 501 are at least partially overlapped, that is, the orthographic projection of the second groove 1032 on the light-emitting surface of the display panel 000 can cover the orthographic projection of the second portion 401 on the light-emitting surface of the display panel 000, the orthographic projection of the second groove 1032 on the light-emitting surface of the display panel 000 can also cover the orthographic projection of the third portion 501 on the light-emitting surface of the display panel 000, so that both the second portion 401 and the third portion 501 can be just embedded into the second groove 1032, the second portion 401 made of a conductive material and the second conductive layer 102 can form a second storage capacitor Cst2, and the second portion 401 made of a conductive material can further form a third storage capacitor Cst3 with the third portion 501; alternatively, the third portion 501 may be a long-bar structure, a semi-circular structure or a segmented and spaced structure partially surrounding the display area AA, or other shapes, which is not particularly limited in this embodiment. The second portion 401 overlaps with the first conductive layer 102 of the first substrate 10 to form a second storage capacitor Cst2, the second portion 401 is one plate of the second storage capacitor Cst2, a portion of the first conductive layer 102 overlapping with the second portion 401 is the other plate of the second storage capacitor Cst2, the third portion 501 overlaps with the second portion 401 to form a third storage capacitor Cst3, the second portion 401 is one plate of the third storage capacitor Cst3, and the third portion 501 is the other plate of the third storage capacitor Cst3, when there is an external charge, if the first storage capacitor Cst1 formed by the first portion 301 and the first conductive layer 102 is not enough to slow down the transmission speed of static electricity, the present embodiment can also form the second storage capacitor Cst2 by further overlapping the second portion 401 between the first portion 301 and the barrier wall B, which is in the same layer as the first touch electrode 1, and the third portion 82501 in the same layer as the second touch electrode 2, using the second portion 401 overlapping with the first conductive layer TP 102 of the first substrate 10 and the second portion 301 to form the second storage capacitor Cst2, the third storage capacitor Cst3 can be formed by overlapping the second portion 401 and the third portion 501, so as to further slow down the static electricity entering the 000 screen of the display panel, thereby more effectively reducing the probability of poor display.
It can be understood that, when the second groove 1032 is disposed in the first non-display area NA1 of the display panel 000, in the process of manufacturing the touch function layer on the side of the film encapsulation layer 007 away from the first substrate 10, for example, when the first touch electrode TP1 of the second metal layer 40 and the second touch electrode TP2 of the third metal layer 50 are manufactured, the metal of the second metal layer 40 and the metal of the third metal layer 50 may easily remain in the second groove 1032, which is determined by the structure of the second groove 1032 with a narrow top and a wide bottom. Therefore, in the embodiment, the second portion 401 can be directly formed by using the residual metal of the second metal layer 40 in the second groove 1032, and the third portion 501 can be directly formed by using the residual metal of the third metal layer 50 in the second groove 1032, that is, no additional manufacturing process is required for manufacturing the second portion 401 and the third portion 501, and only in the process of completing the manufacturing processes of the first touch electrode TP1 and the second touch electrode TP2, the manufacturing of the second portion 401 can be realized by using the residual metal of the second metal layer 40 remaining in the second groove 1032, and the manufacturing of the third portion 501 can be realized by using the residual metal of the third metal layer 50 remaining in the second groove 1032, which not only can avoid increasing the process steps, but also can further slow down the transmission speed of static electricity to the display area AA through the second portion 401 and the third portion 501, thereby improving the electrostatic protection effect.
In some optional embodiments, please refer to fig. 19, where fig. 19 is a schematic plane structure diagram of a display device according to an embodiment of the present invention, a display device 111 provided in this embodiment includes the display panel 000 provided in the above embodiment of the present invention, and optionally, the display device 111 may be a flexible display device. The embodiment of fig. 19 only uses a mobile phone as an example to describe the display device 111, and it should be understood that the display device 111 provided in the embodiment of the present invention may be other display devices 111 having a display function, such as a computer, a television, and a vehicle-mounted display device, and the present invention is not limited thereto. The display device 111 provided in the embodiment of the present invention has the beneficial effects of the display panel 000 provided in the embodiment of the present invention, and specific reference may be made to the specific description of the display panel 000 in the above embodiments, which is not described herein again.
According to the embodiment, the display panel and the display device provided by the invention at least realize the following beneficial effects:
the display panel is arranged in a first non-display area, the first metal layer comprises at least one first part, so that in the direction vertical to the light-emitting surface of the display panel, a first storage capacitor is formed by overlapping the first part and a first conductive layer of a first substrate, the first part is one polar plate of the first storage capacitor, and a part of the first conductive layer overlapped with the first part is the other polar plate of the first storage capacitor, when charges enter from the outside, such as from the cutting edge of the display panel in the cutting process or the static test process, the charges can be prevented from entering the display area quickly by utilizing the charge storage capacity of the first storage capacitor formed by overlapping the first part and the first conductive layer of the first substrate, the speed of static electricity entering the screen body of the display panel is effectively slowed down, and the electric performance of a thin film transistor in a driving circuit layer in the range of the display area is prevented from being influenced, thereby being beneficial to reducing the occurrence probability of poor display. In addition, the direction pointing to the display area along the first non-display area is arranged, the first part is positioned between the cutting edge and the retaining wall, namely the first part is positioned on one side of the retaining wall far away from the display area, compared with the prior art that the electrostatic ring with the electrostatic protection function is designed on one side of the retaining wall close to the display area, or compared with the prior art that the electrostatic ring is designed into a structure mutually overlapped with the retaining wall, the invention can prevent the retaining wall and the packaging structure of the display panel from being damaged when the static electricity is too large through the first part of the metal material arranged on one side of the retaining wall far away from the display area, and further can more effectively prevent crack extension through double protection of the first part and the retaining wall, thereby influencing the product yield and the display effect. Therefore, the arrangement of the first part of the retaining wall on the side far away from the display area can not only prevent the electric charge from entering the display area quickly through the first storage capacitor formed by overlapping the first part and the first conducting layer of the first substrate, but also prevent the retaining wall and the packaging structure of the display panel from being damaged by the first part of the metal material arranged on the side far away from the display area when the static electricity is too large, so that the electrostatic protection and the crack extension prevention can be more effectively realized through the double protection of the first part and the retaining wall, and the product yield and the display quality can be further improved.
Although some specific embodiments of the present invention have been described in detail by way of example, it should be understood by those skilled in the art that the above examples are for illustration only and are not intended to limit the scope of the invention. It will be appreciated by those skilled in the art that modifications can be made to the above embodiments without departing from the scope and spirit of the invention. The scope of the invention is defined by the appended claims.

Claims (17)

1. A display panel, comprising: the display device comprises a display area and a non-display area which is at least partially arranged around the display area, wherein the non-display area at least comprises a first non-display area, the first non-display area comprises a cutting edge and a retaining wall, and the cutting edge is positioned on one side of the first non-display area, which is far away from the display area;
the display panel includes:
the first substrate at least comprises a first substrate, a first conducting layer and a second substrate which are stacked in the direction perpendicular to the light-emitting surface of the display panel, and the first conducting layer is positioned between the first substrate and the second substrate;
a first insulating layer located on a side of the second substrate facing away from the first substrate;
the first metal layer is positioned on one side, away from the first substrate, of the first insulating layer;
in the first non-display area, the first metal layer includes at least one first portion, and the first portion is located between the cutting edge and the retaining wall along a direction in which the first non-display area points to the display area.
2. The display panel according to claim 1,
in the first non-display area, the first insulating layer comprises a plurality of first openings, and the first openings penetrate through the first insulating layer in a direction perpendicular to a light emitting surface of the display panel;
the orthographic projection of the first part on the light-emitting surface of the display panel is positioned in the orthographic projection range of the first opening on the light-emitting surface of the display panel.
3. The display panel according to claim 1,
the display panel further comprises a thin film encapsulation layer; the thin film packaging layer comprises a first inorganic packaging layer, a second inorganic packaging layer and an organic packaging layer positioned between the first inorganic packaging layer and the second inorganic packaging layer; the first inorganic packaging layer and the second inorganic packaging layer cover the retaining wall, and the first inorganic packaging layer and the second inorganic packaging layer are located on the retaining wall and far away from one side of the display area in direct contact.
4. The display panel according to claim 1, wherein the first conductive layer comprises one or more of amorphous silicon or a composite metal oxide.
5. The display panel according to claim 1, wherein a side of the second substrate facing away from the first substrate in the first non-display area comprises at least one first groove, and the first groove does not penetrate through the second substrate in a direction perpendicular to a light emitting surface of the display panel; the first groove is of a long strip structure arranged around the display area;
the orthographic projection of the first part on the light-emitting surface of the display panel is positioned in the orthographic projection range of the first groove on the light-emitting surface of the display panel, and the first part is in contact with the first groove.
6. The display panel according to claim 1, wherein the first portion is a long stripe structure provided around the display region; the first part is connected with a fixed potential signal end.
7. The display panel according to claim 1, wherein the first metal layer comprises a plurality of first portions, and the first portions are arranged at intervals along a direction in which the first non-display region points to the display region.
8. The display panel according to claim 7, wherein in a direction in which the first non-display region is directed toward the display region, one of the first portions is connected to a positive voltage signal terminal, and the other first portion is connected to a negative voltage signal terminal.
9. The display panel according to claim 1, wherein the first portion includes a plurality of first sub-portions, the plurality of first sub-portions being arranged at intervals in a first direction; the first direction intersects with the direction in which the first non-display area points to the display area in the direction parallel to the light-emitting surface of the display panel.
10. The display panel according to claim 9, wherein two adjacent first portions include an a-th first portion and an a + 1-th first portion in a direction in which the first non-display region is directed to the display region, where a is a positive integer;
along the first direction, a spacer area is included between two adjacent first sub-portions of the same first portion;
the spacers of the A-th one of the first portions do not overlap with the spacers of the A + 1-th one of the first portions in a direction in which the first non-display area points to the display area.
11. The display panel of claim 9, wherein the first sub-section has a length in a range of 50-100um along the first direction.
12. The display panel according to claim 1, wherein a width of the first portion is in a range of 3-5um in a direction in which the first non-display area points to the display area.
13. The display panel according to claim 1, wherein the display panel of the display region further comprises a plurality of thin film transistors including at least a gate electrode, a source electrode, and a drain electrode;
the source and the drain are located in the first metal layer.
14. The display panel according to claim 1, wherein in the first non-display area, a side of the second substrate facing away from the first substrate comprises a plurality of second grooves, and the plurality of second grooves are arranged at intervals along a direction in which the first non-display area points to the display area; in the direction perpendicular to the light-emitting surface of the display panel, the second groove does not penetrate through the second substrate; the second grooves are positioned between the first part and the retaining wall along the direction in which the first non-display area points to the display area;
the second groove at least comprises a first cavity and a second cavity, and the first cavity is positioned on one side of the second cavity facing the first substrate in the direction perpendicular to the light-emitting surface of the display panel;
the inner diameter of the first cavity is larger than that of the second cavity along the direction parallel to the light-emitting surface of the display panel;
the display panel further comprises a thin film packaging layer and a first inorganic layer, the thin film packaging layer is positioned on one side, away from the first substrate, of the second substrate, and the first inorganic layer is positioned on one side, away from the first substrate, of the thin film packaging layer;
the thin film encapsulation layer and the first inorganic layer are in contact with at least the sidewalls of the second recess.
15. The display panel according to claim 14, wherein the display panel further comprises a second metal layer, the second metal layer being located between the thin film encapsulation layer and the first inorganic layer in a direction perpendicular to a light emitting surface of the display panel;
the display panel of the display area comprises a first touch electrode, and the first touch electrode is positioned on the second metal layer;
in the first non-display area, the second metal layer comprises a plurality of second parts which are arranged at intervals along the direction of the first non-display area pointing to the display area;
the orthographic projection of the second part on the light-emitting surface of the display panel is positioned in the orthographic projection range of the second groove on the light-emitting surface of the display panel.
16. The display panel according to claim 15, wherein the display panel further comprises a third metal layer on a side of the first inorganic layer away from the second metal layer in a direction perpendicular to a light emitting surface of the display panel;
the display panel of the display area comprises a second touch electrode, and the second touch electrode is positioned on the third metal layer;
in the first non-display area, the third metal layer comprises a plurality of third parts which are arranged at intervals along the direction of the first non-display area pointing to the display area;
the orthographic projection of the third part on the light-emitting surface of the display panel is positioned in the orthographic projection range of the second groove on the light-emitting surface of the display panel;
in a direction perpendicular to the light-emitting surface of the display panel, the second portion and the third portion are at least partially overlapped.
17. A display device characterized by comprising the display panel according to any one of claims 1 to 16.
CN202210315853.9A 2022-03-28 2022-03-28 Display panel and display device Pending CN114784016A (en)

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115241267A (en) * 2022-08-25 2022-10-25 厦门天马显示科技有限公司 Display panel and display device
CN115497994A (en) * 2022-08-30 2022-12-20 厦门天马显示科技有限公司 Display panel and display device
CN116387434A (en) * 2023-06-02 2023-07-04 江西兆驰半导体有限公司 Preparation method of antistatic LED chip wafer and wafer
WO2024103260A1 (en) * 2022-11-15 2024-05-23 京东方科技集团股份有限公司 Display panel and driving substrate

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115241267A (en) * 2022-08-25 2022-10-25 厦门天马显示科技有限公司 Display panel and display device
CN115497994A (en) * 2022-08-30 2022-12-20 厦门天马显示科技有限公司 Display panel and display device
WO2024103260A1 (en) * 2022-11-15 2024-05-23 京东方科技集团股份有限公司 Display panel and driving substrate
CN116387434A (en) * 2023-06-02 2023-07-04 江西兆驰半导体有限公司 Preparation method of antistatic LED chip wafer and wafer

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