CN108962947B - Flexible display panel and display device - Google Patents
Flexible display panel and display device Download PDFInfo
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- CN108962947B CN108962947B CN201810721651.8A CN201810721651A CN108962947B CN 108962947 B CN108962947 B CN 108962947B CN 201810721651 A CN201810721651 A CN 201810721651A CN 108962947 B CN108962947 B CN 108962947B
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/123—Connection of the pixel electrodes to the thin film transistors [TFT]
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Abstract
The invention provides a flexible display panel and a display device, which are used for solving the problem that wiring located in a frame area influences a packaging structure of the display panel in the prior art. The flexible display panel includes: the display device comprises a flexible substrate, a retaining wall structure, a first metal layer, an intermediate conducting layer, a light-emitting element layer and a film packaging layer, wherein the retaining wall structure at least comprises a first retaining wall and a second retaining wall, the first retaining wall is positioned between a display area and the second retaining wall, and an area positioned between the first retaining wall and the second retaining wall is a first area; and in the first region, the first inorganic layer of the film packaging layer is in contact with the metal film layer or the inorganic film layer positioned on one side, far away from the first inorganic layer, of the middle conducting layer through the first through hole on the middle conducting layer.
Description
Technical Field
The present invention relates to the field of display technologies, and in particular, to a flexible display panel and a display device.
Background
Organic Light Emitting Diode (OLED) displays have the advantages of low power consumption, self-luminescence, wide viewing angle, fast response speed, etc., and are gradually becoming a new generation of display technology.
However, the light emitting elements in the OLED display panel are sensitive to water and oxygen, and if external water and oxygen enter the display panel, the display effect of the display panel is affected, and even the light emitting elements fail, so that the OLED display panel has a better packaging performance, which is very important.
In addition, the OLED display panel usually includes a plurality of traces for transmitting signals, and at least a portion of the traces is located in a frame region of the display panel, which may affect an encapsulation structure at an edge of the display panel.
Disclosure of Invention
In view of the above, the present invention provides a flexible display panel and a display device, so as to solve the problem in the prior art that traces located in a frame region affect a package structure of the display panel.
In one aspect, the present invention provides a flexible display panel, including:
a flexible substrate including a display area and a non-display area surrounding the display area;
the retaining wall structure is arranged in the non-display area and at least comprises a first retaining wall and a second retaining wall, the first retaining wall is positioned between the display area and the second retaining wall, and the area between the first retaining wall and the second retaining wall is a first area;
the first metal layer is positioned on the flexible substrate;
the middle conducting layer is positioned on one side, far away from the flexible substrate, of the first metal layer and is electrically connected with the first metal layer, the first metal layer and the middle conducting layer are arranged in a stacked mode in the first area, and the middle conducting layer is provided with at least one first through hole;
the light-emitting element layer is arranged in the display area and is positioned on one side of the flexible substrate close to the first metal layer;
the film packaging layer is positioned on one side, far away from the flexible substrate, of the light-emitting element layer and at least comprises a first inorganic layer, and in the first area, the first inorganic layer covers the first through hole and is in contact with the metal film layer or the inorganic film layer, far away from one side of the first inorganic layer, of the middle conducting layer through the first through hole.
In another aspect, the present invention provides a display device including any one of the display panels provided in the embodiments of the present invention.
Compared with the prior art, the flexible display panel and the display device provided by the invention at least have the following beneficial effects:
in flexible display panel, middle conducting layer has at least one first through-hole in the first district, first inorganic layer in the film packaging layer through the first through-hole of middle conducting layer with be located the metal rete or the inorganic rete contact of middle conducting layer opposite side, under the prerequisite of the transmission signal of telecommunication's that does not influence middle conducting layer, the relatively poor problem of cohesiveness between first inorganic layer and the middle conducting layer has been solved, prevent the fracture between the two, be favorable to improving the marginal encapsulation effect of flexible display panel.
Drawings
Fig. 1 is a top view of a flexible display panel according to an embodiment of the present invention;
FIG. 2 is a cross-sectional view taken along line AA' of FIG. 1;
FIG. 3 is an enlarged view of region 122 of FIG. 1;
FIG. 4 is an enlarged schematic view of region 122 of FIG. 1;
FIG. 5 is an enlarged view of region 122 of FIG. 1;
FIG. 6 is an enlarged view of region 122 of FIG. 1;
FIG. 7 is a schematic cross-sectional view taken along line BB' of FIG. 1;
FIG. 8 is a partial cross-sectional view of a display area;
FIG. 9 is a schematic cross-sectional view taken along line BB' of FIG. 1;
FIG. 10 is a schematic cross-sectional view taken along line BB' of FIG. 1;
FIG. 11 is a top view of a first organic layer according to an embodiment of the present invention;
fig. 12 is a top view of a flexible display panel according to an embodiment of the present invention;
fig. 13 is a schematic diagram of a display device according to an embodiment of the invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Fig. 1 is a top view of a flexible display panel according to an embodiment of the present invention, and fig. 2 is a cross-sectional view taken along line AA' in fig. 1.
As shown in fig. 1 and fig. 2, the flexible display panel provided in the embodiment of the present invention includes a flexible substrate 1, a retaining wall structure 2, a first metal layer 3, an intermediate conductive layer 4, a light emitting element layer 5, and a thin film encapsulation layer 6, wherein the flexible substrate 1 includes a display area 11 and a non-display area 12 surrounding the display area 11; the retaining wall structure 2 is disposed in the non-display region 12, the retaining wall structure 2 at least includes a first retaining wall 21 and a second retaining wall 22, the first retaining wall 21 is located between the display region 11 and the second retaining wall 22, and a region located between the first retaining wall 21 and the second retaining wall 22 is a first region 121; the first metal layer 3 is positioned on the flexible substrate 1; the middle conductive layer 4 is located on one side of the first metal layer 3 away from the flexible substrate 1, the middle conductive layer 4 is electrically connected with the first metal layer 3, the first metal layer 3 and the middle conductive layer 4 are stacked in the first region 121, and the middle conductive layer 4 is provided with a first through hole 41; the light-emitting element layer 5 is arranged in the display area 11, and the light-emitting element layer 5 is positioned on one side of the flexible substrate 1 close to the first metal layer 3; the film encapsulation layer 6 is located on the side of the light emitting element layer 5 away from the flexible substrate 1, and the film encapsulation layer 6 at least includes a first inorganic layer 61, and in the first region 121, the first inorganic layer 61 covers the first through hole 41 and contacts the metal film layer or the inorganic film layer located on the side of the middle conductive layer 4 away from the first inorganic layer 61 through the first through hole 41.
The flexible display panel generally includes a flexible substrate 1, a thin film transistor array layer 7 on the flexible substrate 1, a light emitting element layer 5 on the thin film transistor array layer 7, and a thin film encapsulation layer 6 on the light emitting element layer 5.
The flexible substrate 1 provides a supporting and protecting function for the flexible display panel, and the flexible display panel can implement various deformation modes, such as bending, folding, curling and the like, compared with a display panel using a material such as glass as a substrate, for example, the material of the flexible substrate 1 may include polyimide and the like, and the material of the flexible substrate 1 is not limited in the present invention. In addition, the flexible substrate 1 includes a display area 11 and a non-display area 12 surrounding the display area 11, a plurality of pixels are disposed in the display area 11 for displaying a picture, and a package structure, signal traces, a driving circuit, and the like are disposed in the non-display area 12.
The thin film transistor array layer 7 includes a plurality of thin film transistors 71, and the thin film transistors 71 constitute a pixel circuit for controlling the light emitting elements 51 in the light emitting element layer 5 to emit light. Specifically, the thin film transistor 71 may include a source electrode 711, a drain electrode 712, a gate electrode 713, and an active layer 714, and the connection between the thin film transistor 71 and the light emitting element 51 is merely illustrative, and in another embodiment, the source electrode 711 of the thin film transistor 71 may be connected to the light emitting element 51.
The light emitting element layer 5 is located in the display region 11 and includes a plurality of light emitting elements 51, the light emitting elements 51 may be organic light emitting elements, the light emitting elements 51 may include an anode 511, a cathode 512 and an organic light emitting layer 513 located between the anode 511 and the cathode 512, and the organic light emitting layer 513 emits light when a voltage is applied to the anode 511 and the cathode 512, respectively. The light emitting element 51 may include a red light emitting element, a green light emitting element, and a blue light emitting element as pixels of the display region 11, thereby implementing a color display, and the color of the light emitting element 51 is not limited in the present invention.
The thin film encapsulation layer 6 covers the light emitting device layer 5 to isolate external water and oxygen, so as to ensure that the light emitting device 51 is protected from water and oxygen and works normally. Specifically, the thin film encapsulation layer 6 at least includes the first inorganic layer 61, and compared with an organic film layer, the inorganic layer has a more dense structure and can achieve an excellent encapsulation effect.
Optionally, the thin film encapsulation layer 6 further includes a second organic layer 62 and a third inorganic layer 63, the organic layer and the inorganic layer are alternately stacked, and the organic layer is used for relieving stress in the inorganic layer, reducing cracks in the inorganic layer, and playing a better encapsulation role. The number of the film layers stacked in the film encapsulation layer 6 is not particularly limited in the present invention.
The flexible display panel further comprises a retaining wall structure 2, the retaining wall structure 2 is arranged in the non-display area 12, and the retaining wall structure 2 can be an annular structure surrounding the display area 11 and can be integrated with the thin film packaging layer 6 to jointly play a packaging role. Specifically, the retaining wall structure 2 at least includes a first retaining wall 21 and a second retaining wall 22, the first retaining wall 21 is located between the second retaining wall 22 and the display region 11, and when the second organic layer 62 in the thin film encapsulation layer 6 is manufactured, the first retaining wall 21 can act as a barrier to the second organic layer 62 which is still fluid before curing, so as to define the boundary of the second organic layer 62.
The flexible display panel further comprises a first metal layer 3 and an intermediate conductive layer 4, wherein the first metal layer 3 is located on the flexible substrate 1, and the intermediate conductive layer 4 is located on one side of the first metal layer 3 away from the flexible substrate 1. The intermediate conductive layer 4 and the first metal layer 3 are stacked, and the intermediate conductive layer 4 and the first metal layer 3 are electrically connected to each other, for example, the intermediate conductive layer 4 and the first metal layer 3 have portions electrically connected to each other between the first retaining wall 21 and the display region 11, or the intermediate conductive layer 4 and the first metal layer 3 have portions electrically connected to each other between the first retaining wall 21 and the display region 11 and in the first region 121. The first metal layer 3 and the middle conductive layer 4 are jointly used as signal wiring, so that the resistance in the signal wiring is reduced, and the problem of overlarge voltage drop in the signal wiring is favorably solved.
In the embodiment of the present invention, the area between the first retaining wall 21 and the second retaining wall 22 is the first area 121, in the first area 121, the intermediate conductive layer 4 and the first metal layer 3 are stacked, and the first inorganic layer 61 in the thin film encapsulation layer 6 covers the intermediate conductive layer 4 and is in direct contact with the intermediate conductive layer 4. In the first region 121, the intermediate conductive layer 4 has a first through hole 41, and the first inorganic layer 61 covers the first through hole 41 and contacts the metal film layer or the inorganic film layer on the side of the intermediate conductive layer 4 away from the first inorganic layer 61 through the first through hole 41.
The middle conductive layer 4 and the first metal layer 3 which are electrically connected with each other extend to the first area 121, the line width of the middle conductive layer 4 and the first metal layer 3 serving as signal wiring can be widened to the greatest extent in the non-display area 12 with the limited size, and therefore the resistance of the middle conductive layer 4 and the first metal layer 3 is reduced, however, the bonding force between the first inorganic layer 61 and the middle conductive layer 4 is small, the problem of cracking between the first inorganic layer 61 and the middle conductive layer 4 is prone to occurring on the premise of receiving external acting force, and risks are brought to the packaging performance of the flexible display panel. In the embodiment of the present invention, the first through hole 41 is disposed on the middle conductive layer 4, and the first inorganic layer 61 contacts the metal film layer or the inorganic film layer on the other side of the middle conductive layer through the first through hole 41, so that by disposing the first through hole 41, on the premise of not affecting the function of the middle conductive layer 4 for transmitting electrical signals, the problem of poor adhesion between the first inorganic layer 61 and the middle conductive layer 4 is solved, cracking between the first inorganic layer 61 and the middle conductive layer 4 is prevented, and the improvement of the edge packaging effect of the flexible display panel is facilitated.
The first through hole is arranged at the first region as follows:
in an implementation manner, fig. 3 is an enlarged schematic view of the region 122 in fig. 1, as shown in fig. 3, in the first region 121, the intermediate conductive layer 4 surrounds the first through hole 41, that is, the interval D1 between the first through hole 41 and the first retaining wall 21 and the interval D2 between the first through hole 41 and the second retaining wall 22 are both greater than zero, and the first through hole 41 does not penetrate through the intermediate conductive layer 4 along the extending direction X of the first retaining wall 21 and the second retaining wall 22, so that the intermediate conductive layer 4 in the first region 121 can be used as an electrical whole, and the adhesion between the first inorganic layer 61 and the film layer located therebelow is ensured, and at the same time, the portion of the intermediate conductive layer 4 in the first region 121 is maximally utilized to reduce the resistance of the intermediate conductive layer 4, which is beneficial for reducing the influence of the voltage drop in the signal routing. It should be noted that, a rectangular first through hole 41 is illustrated in fig. 3, the shape of the first through hole 41 may also be circular, triangular, hexagonal, arc-shaped, zigzag, S-shaped, etc., and the shape of the first through hole 41 located in the first region 121 may be the same shape, or the first through hole 41 located in the first region 121 may have a plurality of shapes, which is not limited in the present invention.
In another alternative embodiment, fig. 4 is an enlarged schematic view of the region 122 in fig. 1, and as shown in fig. 4, a plurality of first through holes 41 are alternately arranged along the extending direction X of the first retaining wall 21.
In another alternative embodiment, fig. 5 is an enlarged schematic view of the region 122 in fig. 1, and as shown in fig. 5, in the first region 121, the middle conductive layer 4 has a plurality of first through holes 41; a plurality of first through holes 41 are arranged along the extending direction X of the first retaining wall 21; and in the direction Y directed from the first retaining wall 21 to the second retaining wall 22, two adjacent first through holes 41 have an overlapping portion 411. On the basis of ensuring that the intermediate conductive layer 4 is still an electrical whole, along the extending direction X of the first retaining wall 21, the first inorganic layer 61 can achieve continuous and good adhesion with the metal film layer or the inorganic film layer located on the side of the intermediate conductive layer 4 away from the first inorganic layer 61, thereby further improving the encapsulation effect of the thin film encapsulation layer 6.
In another embodiment, fig. 6 is an enlarged schematic view of the region 122 in fig. 1, and one of the differences between fig. 6 and fig. 5 is that the first through holes 41 are S-shaped, so that, on the basis of ensuring that the intermediate conductive layer 4 is still an electrical whole, two adjacent first through holes 41 have an overlapping portion 411, which not only extends along the extending direction X of the first retaining wall 21, but also extends in the direction Y from the first retaining wall 21 to the second retaining wall 22, so as to achieve a continuous and good adhesion between the first inorganic layer 61 and the metal film or the inorganic film on the side of the intermediate conductive layer 4 away from the first inorganic layer 61, and further improve the encapsulation effect of the thin film encapsulation layer 6.
The film layer that can be connected to the first inorganic layer 61 through the first via hole 41 is specifically described as follows.
The first inorganic layer 61 may be connected to the metal film layer located away from the first inorganic layer 61 on the intermediate conductive layer 4 through the first via hole 41.
Specifically, in an implementation manner, as shown in fig. 2, in the first region 121, the first metal layer 3 is located on the side of the intermediate conductive layer 4 away from the first inorganic layer 61, the intermediate conductive layer 4 may be directly formed on the first metal layer 3 and directly contact with the first metal layer 3, the first inorganic layer 61 contacts with the first metal layer 3 through the first through hole 41, the adhesion between the first inorganic layer 61 and the first metal layer 3 is relatively large, the problem of cracking between the first inorganic layer 61 and the intermediate conductive layer 4 under an external force can be avoided, and the encapsulation effect of the edge of the film encapsulation layer 6 (i.e., the portion of the film encapsulation layer 6 located in the non-display region 12) is improved.
The first inorganic layer 61 may be connected to the inorganic film layer located away from the first inorganic layer 61 on the intermediate conductive layer 4 through the first via hole 41.
Specifically, in an embodiment, fig. 7 is a schematic cross-sectional view along the line BB' in fig. 1, and as shown in fig. 7, the flexible display panel further includes a second inorganic layer 8, where the second inorganic layer 8 is located between the intermediate conductive layer 4 and the flexible substrate 1; in the first region 121, the first inorganic layer 61 is in contact with the second inorganic layer 8 through the first via hole 41. The first inorganic layer 61 and the second inorganic layer 8 are both formed of an inorganic material so that they have good adhesion characteristics therebetween.
The position of the film layer of the second inorganic layer 8 in the flexible display panel is explained as follows.
In an implementation manner, fig. 8 is a partial cross-sectional view of a display area, and with reference to fig. 7 and 8, the flexible display panel further includes a thin film transistor array layer 7, the thin film transistor array layer 7 is located between the flexible substrate 1 and the light emitting element layer 5, the thin film transistor array layer 7 includes a source drain layer 72 and a passivation layer 73, the passivation layer 73 is located on a side of the source drain layer 72 away from the flexible substrate 1, and the passivation layer 73 is in contact with the source drain layer 72; the material of the second inorganic layer 8 is the same as that of the passivation layer 73, and is disposed in the same layer. In this embodiment, in the first region 121, the second inorganic layer 8 is located between the intermediate conductive layer 4 and the first metal layer 3, and the second inorganic layer 8 can be in direct contact with both the intermediate conductive layer 4 and the first metal layer 3, and the first inorganic layer 61 can be in contact with the second inorganic layer 8 only through the first through hole 41 disposed at the intermediate conductive layer 4, that is, there are few interlayer layers between the first inorganic layer 61 and the second inorganic layer 8, and the contact between the first inorganic layer 61 and the second inorganic layer 8 is easily achieved. In addition, the second inorganic layer 8 and the passivation layer 73 can be formed in the same process, so that the process is simplified, and the production cost is reduced. In one embodiment, the second inorganic layer 8 may be formed by extending the passivation layer 73 from the display region 11 to the non-display region 12, i.e. the second inorganic layer 8 and the passivation layer 73 are the same film layer. It should be noted that, in the present design, the portion of the intermediate conductive layer 4 on the side of the first retaining wall 21 close to the display region 11 can be electrically connected to the first metal layer 3 through the through hole 81 on the second inorganic layer 8.
In one embodiment, as shown in fig. 9, fig. 9 is a schematic cross-sectional view taken along line BB' of fig. 1, the first metal layer 3 has a second via 31, the second via 31 has an overlapping portion with the first via 41, and the first inorganic layer 61 is in contact with the second inorganic layer 8 through the first via 41 and the second via 31; the flexible display panel further includes a thin film transistor array layer 7 (refer to fig. 2), the thin film transistor array layer 7 includes a source drain layer 72 and an interlayer insulating layer 74, the interlayer insulating layer 74 is located between the source drain layer 72 and the flexible substrate 1, and the interlayer insulating layer 74 is in contact with the source drain layer 72; the material of the second inorganic layer 8 is the same as that of the interlayer insulating layer 74, and is provided in the same layer. The interlayer insulating layer 74 serves to insulate the source-drain layer 72 and the gate layer 75 from each other. The second inorganic layer 8 may be formed in the same process as the interlayer insulating layer 74, thereby simplifying the process and reducing the manufacturing cost. In one embodiment, the second inorganic layer 8 may be formed by extending the interlayer insulating layer 74 from the display region 11 to the non-display region 12, i.e., the second inorganic layer 8 and the interlayer insulating layer 74 are the same film layer.
In an embodiment of the invention, as shown in fig. 10 and fig. 11, fig. 10 is a schematic cross-sectional view taken along a line BB' in fig. 1, fig. 11 is a top view of a first organic layer provided in the embodiment of the invention, in the first region 121, the flexible display panel further includes a first organic layer 9, the first organic layer 9 is located between the first inorganic layer 61 and the intermediate conductive layer 4, and the first organic layer 9 is in a ring shape and covers at least an inner wall of the first via 41. The middle conductive layer 4 may be made of a stacked structure of ito/ag/ito, and in a process of a flexible display panel, if a film formed by ag is exposed to air for too long, the film is easily affected, so that after the first through hole 41 is formed on the middle conductive layer 4, the ag film is exposed on an inner wall of the first through hole 41, the first organic layer 9 may be formed at the first through hole 41, the first organic layer 9 at least covers the inner wall of the first through hole 41, and the first organic layer 9 is annular, so that the inner wall of the first through hole 41 may be completely covered, and the first inorganic layer 61 may not be affected to contact with other films through the first through hole 41.
Further, referring to fig. 2, the light emitting element layer 5 includes a pixel defining layer 52 and a plurality of light emitting elements 51, the pixel defining layer 52 has a plurality of openings, and the light emitting elements 51 are located in the openings; the material of the first organic layer 9 is the same as that of the pixel defining layer 52, and the first organic layer 9 is disposed in the same layer as the pixel defining layer 52. The first organic layer 9 and the pixel defining layer 52 can be formed in the same process, thereby simplifying the manufacturing process and reducing the production cost.
In an embodiment of the invention, as shown in fig. 2, in the first region 121, the first inorganic layer 61 is in contact with the metal layer or the inorganic layer located on the side of the intermediate conductive layer 4 away from the first inorganic layer 61 through the first via 41, the first metal layer 3 further includes a portion extending from the first region 121 to the side of the first retaining wall 21 away from the second retaining wall 22, and the intermediate conductive layer 4 further includes a portion extending from the first region 121 to the side of the first retaining wall 21 away from the second retaining wall 22; the light emitting element layer 5 includes a cathode layer 512, between the first retaining wall 21 and the display area 11, the first metal layer 3, the middle conductive layer 4 and the cathode layer 512 have an overlapping portion, and the cathode layer 512 is electrically connected to the middle conductive layer 4, as shown in fig. 12, fig. 12 is a top view of the flexible display panel according to the embodiment of the present invention, and the overlapping portion 123 of the first metal layer 3, the middle conductive layer 4 and the cathode layer 512 is disposed around the display area 11, which is beneficial to the electric potential at each position of the cathode layer 512 to be consistent. The first metal layer 3 and the middle conductive layer 4 are both connected in parallel with the cathode layer 512, and when the signal wires are used as the cathode layer 512 to transmit signals, the resistance of the signal wires is reduced, and the influence of voltage drop in the signal wires is reduced.
Further, as shown in fig. 2, the light emitting element layer 5 further includes an anode layer 53, and the material of the intermediate conductive layer 4 is the same as that of the anode layer 53 and is disposed in the same layer; the flexible display panel further comprises a thin film transistor array layer 7, the thin film transistor array layer 7 comprises a source drain layer 72, and the material of the first metal layer 3 is the same as that of the source drain layer 72 and is arranged on the same layer. The anode layer 53 includes a plurality of anodes 511, the middle conductive layer 4 and the anode layer 53 can be formed in the same process, and the first metal layer 3 and the source drain layer 72 are formed in the same process, so as to simplify the manufacturing process and reduce the production cost.
In the embodiment of the present invention, the material of the first inorganic layer may include at least one of silicon nitride and silicon oxide, or a composite film layer formed of silicon nitride, silicon oxide, and other materials.
Note that fig. 2 and 8 only illustrate a top-gate thin film transistor, and the thin film transistor may include a bottom-gate thin film transistor.
In addition, as can be understood by those skilled in the art, the region 122 in fig. 1 and the region 123 in fig. 12 only illustrate a local region, and the corresponding arrangement manner is not limited to the positions illustrated in the region 122 and the region 123.
The embodiment of the invention also provides a display device which comprises the flexible display panel provided by any one of the embodiments. Fig. 13 is a schematic diagram of a display device according to an embodiment of the invention. The display device may include a mobile phone as shown in fig. 13, and may also include a tablet computer, a television, a smart wearable device, a vehicle-mounted display device, and the like. The display device has the beneficial technical effects of the flexible display panel in any of the above embodiments, and the beneficial technical effects of the display device are not described herein again.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.
Claims (12)
1. A flexible display panel, comprising:
a flexible substrate including a display area and a non-display area surrounding the display area;
the retaining wall structure is arranged in the non-display area and at least comprises a first retaining wall and a second retaining wall, the first retaining wall is positioned between the display area and the second retaining wall, and an area between the first retaining wall and the second retaining wall is a first area;
a first metal layer on the flexible substrate;
the middle conducting layer is positioned on one side, far away from the flexible substrate, of the first metal layer and is electrically connected with the first metal layer, the first metal layer and the middle conducting layer are arranged in a laminated mode in the first area, and the middle conducting layer is provided with at least one first through hole;
the light-emitting element layer is arranged in the display area and is positioned on one side, close to the first metal layer, of the flexible substrate;
the film packaging layer is located on one side, far away from the flexible substrate, of the light-emitting element layer and at least comprises a first inorganic layer, and in the first area, the first inorganic layer covers the first through hole and is in contact with a metal film layer or an inorganic film layer, far away from one side of the first inorganic layer, of the middle conducting layer through the first through hole.
2. The flexible display panel of claim 1,
in the first region, the intermediate conductive layer surrounds the first via.
3. The flexible display panel of claim 2,
within the first region, the intermediate conductive layer has a plurality of the first vias;
the plurality of first through holes are arranged along the extending direction of the first retaining wall;
and in the direction from the first retaining wall to the second retaining wall, two adjacent first through holes have an overlapping part.
4. The flexible display panel of claim 1, wherein the first inorganic layer is in contact with the first metal layer through the first via.
5. The flexible display panel of claim 1,
the flexible display panel further comprises a second inorganic layer located between the intermediate conductive layer and the flexible substrate;
in the first region, the first inorganic layer is in contact with the second inorganic layer through the first via hole.
6. The flexible display panel of claim 5,
the flexible display panel further comprises a thin film transistor array layer, the thin film transistor array layer is located between the flexible substrate and the light-emitting element layer, the thin film transistor array layer comprises a source drain layer and a passivation layer, the passivation layer is located on one side, far away from the flexible substrate, of the source drain layer, and the passivation layer is in contact with the source drain layer;
the material of the second inorganic layer is the same as that of the passivation layer, and the second inorganic layer and the passivation layer are arranged in the same layer.
7. The flexible display panel of claim 5,
the first metal layer has a second via having an overlapping portion with the first via, the first inorganic layer is in contact with the second inorganic layer through the first via and the second via;
the flexible display panel further comprises a thin film transistor array layer, the thin film transistor array layer comprises a source drain layer and an interlayer insulating layer, the interlayer insulating layer is located between the source drain layer and the flexible substrate, and the interlayer insulating layer is in contact with the source drain layer;
the material of the second inorganic layer is the same as that of the interlayer insulating layer, and the second inorganic layer and the interlayer insulating layer are arranged on the same layer.
8. The flexible display panel of claim 1,
the flexible display panel further comprises a first organic layer, the first organic layer is located between the first inorganic layer and the middle conducting layer, and the first organic layer is annular and at least covers the inner wall of the first through hole.
9. The flexible display panel of claim 8,
the light emitting element layer includes a pixel defining layer having a plurality of openings and a plurality of light emitting elements located within the openings;
the material of the first organic layer is the same as that of the pixel defining layer, and the first organic layer and the pixel defining layer are arranged in the same layer.
10. The flexible display panel of claim 1,
the first metal layer further comprises a part extending from the first region to one side of the first retaining wall far away from the second retaining wall, and the middle conducting layer further comprises a part extending from the first region to one side of the first retaining wall far away from the second retaining wall;
the light emitting element layer includes a cathode layer, the first metal layer, the intermediate conductive layer and the cathode layer have overlapping portions between the first barrier wall and the display region, and the cathode layer is electrically connected to the intermediate conductive layer.
11. The flexible display panel of claim 10,
the light-emitting element layer further comprises an anode layer, and the middle conducting layer is made of the same material as the anode layer and arranged on the same layer;
the flexible display panel further comprises a thin film transistor array layer, the thin film transistor array layer comprises a source drain electrode layer, and the material of the first metal layer is the same as that of the source drain electrode layer and is arranged on the same layer.
12. A display device comprising the flexible display panel according to any one of claims 1 to 11.
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