CN111725424A

CN111725424A - Display panel

Info

Publication number: CN111725424A
Application number: CN202010527983.XA
Authority: CN
Inventors: 倪晶
Original assignee: Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
Current assignee: Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
Priority date: 2020-06-11
Filing date: 2020-06-11
Publication date: 2020-09-29

Abstract

The application provides a display panel, which comprises a display area and a non-display area surrounding the display area; the display panel also sequentially comprises a substrate, a thin film transistor layer, a light-emitting device layer and a packaging layer which are arranged in a stacked mode; wherein the light emitting device layer includes an anode extending from the display region to the non-display region; the part of the anode corresponding to the non-display area comprises a plurality of hollow parts, and the packaging layer is in contact with the thin film transistor layer through the plurality of hollow parts. This application is through carrying out patterning through the positive pole that will be located non-display area, forms a plurality of fretwork portions for inorganic rete in the encapsulation layer passes through fretwork portion direct contact with the inorganic compound rete in the thin film transistor layer, thereby strengthens the adhesion between other retes of encapsulation layer and display panel, reduces the risk that encapsulation layer and positive pole drop.

Description

Display panel

Technical Field

The application relates to the technical field of display, in particular to a display panel.

Background

Organic Light Emitting Diodes (OLEDs) have received great attention from both academic and industrial circles due to their great potential for development in the direction of solid state lighting and flat panel displays. Since OLED displays are very sensitive to water and oxygen, an inorganic/organic/inorganic alternating structure is usually implemented as an encapsulation protective layer.

However, in the reliability test and the bending process of the OLED display screen, stress concentration and falling off of the inorganic film layer and the anode are prone to occur due to poor adhesion between the packaging layer and other film layers of the OLED, so that water vapor and oxygen enter the OLED device, and the service life of the OLED display panel is shortened.

Disclosure of Invention

The application provides a display panel, can strengthen the adhesion of encapsulation layer and other rete of display panel to reduce the risk that encapsulation layer and positive pole drop.

In order to realize the functions, the technical scheme provided by the application is as follows:

a display panel comprising a display area and a non-display area surrounding the display area; a retaining wall area is arranged in the non-display area, and at least one retaining wall is arranged in the retaining wall area;

the display panel further includes:

a substrate;

the thin film transistor layer is arranged on the substrate;

the light-emitting device layer is arranged on the thin film transistor layer and comprises an anode, the anode extends from the display area to the non-display area, and the retaining wall is prepared on the surface of the anode;

an encapsulation layer disposed on the light emitting device layer;

the part of the anode corresponding to the non-display area comprises a plurality of hollow parts, and the packaging layer is in contact with the thin film transistor layer through the plurality of hollow parts.

In the display panel of the application, the encapsulation layer includes the first inorganic layer, organic layer and the second inorganic layer of range upon range of setting, it is a plurality of that first inorganic layer is through fretwork portion with thin-film transistor layer contacts.

In the display panel of this application, fretwork portion is the array and arranges, perhaps fretwork portion is crisscross the arranging.

In the display panel of the present application, the shape of the hollow portion is at least one of a rectangle, a triangle, a square, and an ellipse.

In the display panel of the present application, a projection of the first inorganic layer on the substrate covers a projection of the hollow portion on the substrate.

In the display panel of the present application, the material of the first inorganic layer includes at least one of aluminum oxide, titanium dioxide, silicon nitride carbide, and zirconium dioxide.

In the display panel of the application, the thin film transistor layer is close to one side of the light-emitting device layer comprises an inorganic composite film layer, and the first inorganic layer is a plurality of hollow parts which are in contact with the inorganic composite film layer.

In the display panel of the application, the inorganic composite film layer is located the part in non-display area includes a plurality of blind holes, the blind hole with fretwork portion one-to-one, first inorganic layer passes through fretwork portion and the blind hole with inorganic composite film layer contacts.

In the display panel of the application, the inorganic composite film layer comprises an interlayer insulating layer, and the first inorganic layer passes through the hollow part and the blind hole and the interlayer insulating layer are in contact with each other.

In the display panel, the retaining wall zone at least comprises a first retaining wall and a second retaining wall which are arranged at intervals, and the anode corresponds to the first retaining wall and the part between the second retaining walls is at least provided with a hollow part.

Has the advantages that: this application is through carrying out patterning through the positive pole that will be located non-display area, forms a plurality of fretwork portions for inorganic rete in the encapsulation layer passes through fretwork portion direct contact with the inorganic compound rete in the thin film transistor layer, thereby strengthens the adhesion between other retes of encapsulation layer and display panel, reduces the risk that encapsulation layer and positive pole drop.

Drawings

The technical solution and other advantages of the present application will become apparent from the detailed description of the embodiments of the present application with reference to the accompanying drawings.

FIG. 1 is a schematic structural diagram of a display panel according to the present application;

fig. 2 is a schematic structural diagram of a first display panel according to an embodiment of the present disclosure;

FIGS. 3A-3D are top views of an anode on a non-display area according to embodiments of the present disclosure;

fig. 4 is a schematic structural diagram of a second display panel according to an embodiment of the present disclosure.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It is to be understood that the embodiments described are only a few embodiments of the present application and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

In the description of the present application, it is to be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the present application and for simplicity in description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed in a particular orientation, and be operated in a particular manner, and are not to be construed as limiting the present application. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", may explicitly or implicitly include one or more of the described features. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.

In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; may be mechanically connected, may be electrically connected or may be in communication with each other; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.

In this application, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact of the first and second features, or may comprise contact of the first and second features not directly but through another feature in between. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.

The following disclosure provides many different embodiments or examples for implementing different features of the application. In order to simplify the disclosure of the present application, specific example components and arrangements are described below. Of course, they are merely examples and are not intended to limit the present application. Moreover, the present application may repeat reference numerals and/or letters in the various examples, such repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed. In addition, examples of various specific processes and materials are provided herein, but one of ordinary skill in the art may recognize applications of other processes and/or use of other materials.

In the prior art, in the process of reliability test and bending of the display panel, stress concentration and falling off of the inorganic film layer and the anode are easy to occur due to poor adhesion between the packaging layer and other film layers of the display panel, so that water vapor and oxygen are invaded into a display panel device, and the service life of the display panel is shortened. Based on this, the application provides a display panel, can solve the defect of complaining.

Please refer to fig. 1, a structural diagram of a display panel according to the present application.

In the present application, the display panel includes a display area 100 and a non-display area 200 surrounding the display area.

A retaining wall area 300 is disposed in the non-display area 200, and the retaining wall area 300 at least includes one retaining wall 50.

The display panel further comprises a substrate 10; a thin film transistor layer 20 disposed on the substrate 10; a light emitting device layer 30 disposed on the thin-film transistor layer 20; an encapsulation layer 40 disposed on the light emitting device layer 30.

The light emitting device layer 30 includes an anode 31, the anode 31 extends from the display region 100 to the non-display region 200, and the retaining wall 50 is formed on a surface of the anode 31 away from the thin film transistor 20.

The portion of the anode 31 corresponding to the non-display area 200 includes a plurality of hollow portions 311, and the encapsulation layer 40 is in contact with the thin film transistor layer 20 through the plurality of hollow portions 311.

According to the application, the anode 31 is subjected to patterning treatment to form the plurality of hollow parts 311 in the non-display area 200, so that the packaging layer 40 is in direct contact with the thin film transistor layer 20 through the hollow parts 311, the adhesion between the packaging layer 40 and other film layers of the display panel is enhanced, and the risk that the packaging layer 40 falls off is reduced.

The technical solution of the present application will now be described with reference to specific embodiments.

Referring to fig. 2, a schematic partial cross-sectional structure of a first display panel provided in the embodiment of the present application is shown.

In the present embodiment, the display panel includes a display area 100 and a non-display area 200 surrounding the display area.

A retaining wall area 300 is arranged in the non-display area 200, and the retaining wall area 300 at least includes a first retaining wall 501 and a second retaining wall 502 arranged at intervals.

The heights of the first retaining wall 501 and the second retaining wall 502 may be equal or different, and this embodiment is not limited thereto.

In the present embodiment, the substrate 10 is a flexible transparent PI substrate, mainly made of polyimide, and the PI material can effectively improve the light transmittance.

In the present embodiment, the thin-film transistor layer 20 includes an organic composite film layer 21 and an inorganic composite film layer 22.

The organic composite film layer 21 includes, but is not limited to, a planarization layer and a pixel defining layer.

The portion of the inorganic composite film layer 22 located in the non-display area 200 includes a plurality of blind holes.

In the present embodiment, the light emitting device layer 30 includes an anode 31, an organic light emitting layer 32, and a cathode 33, which are sequentially stacked.

Wherein the anode 31 extends from the display area 100 to the non-display area 200.

The material of the anode 31 includes, but is not limited to, indium tin oxide and silver.

In this embodiment, the anode 31 is patterned to form a plurality of hollow portions 311 corresponding to the non-display region 200.

The plurality of hollow parts 311 are prepared by the same process, so that the production time of the display panel can be shortened, and the production cost of the display panel can be reduced.

In this embodiment, the first retaining wall 501 and the second retaining wall 502 are both formed on the surface of the anode 31 on the side far from the tft 20.

At least one hollow portion 311 is disposed between the anode 31 and the first retaining wall 501 and the second retaining wall 502.

Further, in this embodiment, a hollow portion 311 is disposed between the first retaining wall 501 and the second retaining wall 502, which is not limited in this embodiment.

In this embodiment, the blind holes correspond to the hollow portions 311 one by one, and the shapes and sizes of the blind holes are the same as those of the hollow portions 311.

Referring to fig. 3A-3D, embodiments of the present disclosure provide a top view of an anode on a non-display area.

In this embodiment, the hollow portions 311 are arranged in an array, or the hollow portions 311 are arranged in a staggered manner, and this embodiment does not limit the arrangement manner of the hollow portions 311.

The shape of the hollow 311 includes, but is not limited to, rectangle, triangle, square and ellipse.

Further, the shape of the hollow-out portion 311 is square, and the hollow-out portions 311 are arranged on the anode 31 in an array.

In the present embodiment, the encapsulation layer 40 includes a first inorganic layer 41, an organic layer 42, and a second inorganic layer 43, which are stacked.

In this embodiment, the first inorganic layer 41 is made of an inorganic functional material that can add water-blocking and oxygen-blocking functions.

The material of the first inorganic layer 41 includes, but is not limited to, aluminum oxide, titanium dioxide, silicon nitride carbide, and zirconium dioxide.

The thickness of the first inorganic layer 41 is 0.01um to 1.5 um.

Further, the thickness of the first inorganic layer 41 is 0.5 um.

In the present embodiment, the preparation method of the first inorganic layer 41 includes, but is not limited to, a vapor deposition method and an inkjet deposition process.

In this embodiment, the projection of the first inorganic layer 41 on the substrate 10 covers the projection of the hollow portion 311 on the substrate 10.

The first inorganic layer 41 is in contact with the inorganic composite film layer 22 through the hollow part 311 and the blind hole, so that the adhesion between the encapsulation layer 40 and the thin film transistor layer is improved.

In the present embodiment, the organic layer 42 is prepared over the first inorganic layer 41 by an inkjet printing process.

The material of the organic layer 42 includes, but is not limited to, polyacrylates, polycarbonates, and polystyrene.

The organic layer 42 is made of a transparent material, so that the light transmittance can be effectively improved.

In this embodiment, the second inorganic layer 43 is made of an inorganic functional material that can add water-blocking and oxygen-blocking functions.

The material of the second inorganic layer 43 includes, but is not limited to, aluminum oxide, titanium dioxide, silicon nitride carbide, and zirconium dioxide.

The thickness of the second inorganic layer 43 is 0.01um to 1 um.

Further, the thickness of the second inorganic layer 41 is 0.5 um.

In this embodiment, the first inorganic layer 41 is in contact with the inorganic composite film layer 22 through the hollow portion 311 and the blind hole, so as to increase a contact area between the encapsulation layer 40 and the thin-film transistor layer 20, thereby enhancing adhesion between the encapsulation layer 40 and the thin-film transistor layer 20; meanwhile, the problem of poor adhesion of a contact interface of materials of different materials is further avoided, so that the risk of falling off of the packaging layer 40 is reduced.

Referring to fig. 4, a structural diagram of a second display panel provided in the embodiment of the present application is shown.

In this embodiment, the display panel has a similar/identical structure to the first display panel provided in the above embodiments, and please refer to the description of the display panel in the above embodiments, which is not repeated herein, and the difference between the two is only:

in the present embodiment, the inorganic composite film 22 includes an interlayer insulating layer 221 and a gate insulating layer.

The portion of the interlayer insulating layer 221 located in the non-display area 200 includes a plurality of blind holes, the blind holes correspond to the hollow portions 311 one to one, and the shapes and sizes of the blind holes and the hollow portions 311 are the same.

In this embodiment, the first inorganic layer 21 is in contact with the interlayer insulating layer 221 through the hollow portion 311 and the blind hole.

The application provides a display panel, which comprises a display area and a non-display area surrounding the display area; the display panel further comprises a substrate, a thin film transistor layer, a light-emitting device layer and a packaging layer which are arranged in a stacked mode in sequence; wherein the light emitting device layer includes an anode extending from the display region to the non-display region; the part of the anode corresponding to the non-display area comprises a plurality of hollow parts; the packaging layer is in contact with the thin film transistor layer through the plurality of hollow parts.

The method comprises the steps that patterning processing is carried out on an anode located in a non-display area to form a plurality of hollow parts, so that an inorganic film layer in a packaging layer is directly contacted with an inorganic composite film layer in a thin film transistor layer through the hollow parts, and accordingly adhesion between the packaging layer and other film layers of a display panel is enhanced; meanwhile, the problem of poor adhesion of contact interfaces of materials made of different materials is further solved, so that the risk of falling of the packaging layer and the anode is reduced.

In the foregoing embodiments, the descriptions of the respective embodiments have respective emphasis, and for parts that are not described in detail in a certain embodiment, reference may be made to related descriptions of other embodiments.

The display panel provided by the embodiment of the present application is described in detail above, and a specific example is applied to illustrate the principle and the implementation manner of the present application, and the description of the embodiment is only used to help understanding the technical solution and the core idea of the present application; those of ordinary skill in the art will understand that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications or substitutions do not depart from the spirit and scope of the present disclosure as defined by the appended claims.

Claims

1. A display panel comprising a display area and a non-display area surrounding the display area; a retaining wall area is arranged in the non-display area, and at least one retaining wall is arranged in the retaining wall area;

the display panel further includes:

a substrate;

the thin film transistor layer is arranged on the substrate;

an encapsulation layer disposed on the light emitting device layer;

2. The display panel of claim 1, wherein the encapsulation layer comprises a first inorganic layer, an organic layer, and a second inorganic layer stacked on one another, and the first inorganic layer is in contact with the thin film transistor layer through the plurality of cutouts.

3. The display panel of claim 2, wherein the hollowed-out portions are arranged in an array, or the hollowed-out portions are arranged in a staggered manner.

4. The display panel of claim 3, wherein the shape of the hollowed-out portion is at least one of a rectangle, a triangle, a square and an ellipse.

5. The display panel of claim 2, wherein a projection of the first inorganic layer on the substrate covers a projection of the hollowed-out portion on the substrate.

6. The display panel according to claim 5, wherein a material of the first inorganic layer comprises at least one of alumina, titania, silicon carbide nitride, and zirconia.

7. The display panel of claim 2, wherein a side of the thin-film transistor layer adjacent to the light emitting device layer comprises an inorganic composite film layer, and the first inorganic layer is in contact with the inorganic composite film layer through a plurality of the hollowed-out portions.

8. The display panel of claim 7, wherein the portion of the inorganic composite film layer in the non-display area includes a plurality of blind holes, the blind holes correspond to the hollow portions one to one, and the first inorganic layer contacts the inorganic composite film layer through the hollow portions and the blind holes.

9. The display panel according to claim 8, wherein the inorganic composite film layer includes an interlayer insulating layer, and the first inorganic layer is in contact with the interlayer insulating layer through the hollow portion and the blind hole.

10. The display panel of claim 2, wherein the retaining wall region at least comprises a first retaining wall and a second retaining wall which are arranged at intervals, and the anode is provided with at least one hollow part corresponding to a part between the first retaining wall and the second retaining wall.