CN110120463A - Display base plate and preparation method thereof, display device - Google Patents

Display base plate and preparation method thereof, display device Download PDF

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Publication number
CN110120463A
CN110120463A CN201910441280.2A CN201910441280A CN110120463A CN 110120463 A CN110120463 A CN 110120463A CN 201910441280 A CN201910441280 A CN 201910441280A CN 110120463 A CN110120463 A CN 110120463A
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layer
display area
barricade
insulating layer
substrate
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CN201910441280.2A
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CN110120463B (en
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宋丽
蒋志亮
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BOE Technology Group Co Ltd
Chengdu BOE Optoelectronics Technology Co Ltd
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BOE Technology Group Co Ltd
Chengdu BOE Optoelectronics Technology Co Ltd
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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/84Passivation; Containers; Encapsulations
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

The present invention provides a kind of display base plates and preparation method thereof, display device.Display base plate includes display area and non-display area, the non-display area includes the inorganic encapsulated layer of functional layer, the barricade being arranged in the functional layer and the covering functional layer and barricade, between the display area and barricade, the functional layer includes multiple spaced grooves, and the contact surface of the functional layer and inorganic encapsulated layer is made to form concaveconvex structure.Multiple spaced grooves are arranged by the region between display area and barricade in the present invention, the contact surface of functional layer and inorganic encapsulated layer is set to form concaveconvex structure, increase the region membranous layer binding force, eliminate the delamination in region or cracking between display area and barricade, avoid the water oxygen intrusion path because of delamination or cracking formation, the validity and reliability of encapsulation has been effectively ensured, and had many advantages, such as low manufacture cost, be easy to technique realization.

Description

Display base plate and preparation method thereof, display device
Technical field
The present invention relates to field of display technology, and in particular to a kind of display base plate and preparation method thereof, display device.
Background technique
Organic Light Emitting Diode (Organic Light Emitting Diode, OLED) is active light-emitting display device, Have many advantages, such as self-luminous, wide viewing angle, high contrast, compared with low power consumption, reaction speed is fast, bright in luster, slimming is flexible.With The continuous development of display technology, OLED technology more and more apply in various display devices, become the mainstream of existing market.
Since OLED display technology is shone using luminous organic material, luminous organic material is easily reacted with water oxygen, minimal amount Vapor and oxygen can damage luminous organic material, deteriorate the luminescent properties of oled panel, therefore oled panel is to envelope Equipped with very high requirement.Existing packaged type mainly includes cover board packaged type and thin-film package mode, and flexible OLED is usual Using thin-film package (Thin Film Encapsulation, TFE) mode, thin-film package have the characteristics that it is frivolous, pliable, To obstruct the water oxygen etch from luminous organic material upper layer.
Actual use shows there are problems that package failure, and package failure using the oled panel of thin-film packing structure Problem is the problem of thin-film packing structure of all kinds not can effectively solve always.Therefore, existing encapsulation scheme how is solved Existing package failure problem is this field technical problem urgently to be resolved.
Summary of the invention
The embodiment of the present invention is the technical problem to be solved is that, provide a kind of display base plate and preparation method thereof, display dress It sets, to solve the problems, such as package failure existing for existing encapsulation scheme.
In order to solve the above-mentioned technical problem, the embodiment of the invention provides a kind of display base plate, including display area and non- Display area, the non-display area include functional layer, the barricade being arranged in the functional layer and the covering functional layer With the inorganic encapsulated layer of barricade, between the display area and barricade, the functional layer includes multiple spaced grooves, The contact surface of the functional layer and inorganic encapsulated layer is set to form concaveconvex structure.
Optionally, the functional layer includes the insulating layer of substrate and setting on the substrate, and the multiple interval is set The groove set is arranged in the substrate or insulating layer.
Optionally, the substrate includes the first substrate, the buffer layer being arranged in first substrate and is arranged described The second substrate on buffer layer, the multiple spaced groove are arranged in second substrate.
Optionally, the insulating layer include the first insulating layer, setting second insulating layer on the first insulating layer and Third insulating layer on the second insulating layer is set, and the multiple spaced groove setting is in first insulation On layer, second insulating layer or third insulating layer.
Optionally, the barricade includes the first barricade around the display area and second around first barricade Barricade, the multiple spaced groove are arranged between the display area and the first barricade, first barricade and the Two barricades are for preventing the organic material of inkjet printing from overflowing.
Optionally, in the plane perpendicular to display base plate, the cross sectional shape of the groove includes rectangle, semicircle or falls It is trapezoidal.
Optionally, in the plane for being parallel to display base plate, the groove is around the display area.
The embodiment of the invention also provides a kind of display devices, including display base plate above-mentioned.
In order to solve the above-mentioned technical problem, described the embodiment of the invention also provides a kind of preparation method of display base plate Display base plate includes display area and non-display area, and preparation method includes:
Functional layer is formed in the non-display area, the functional layer includes multiple spaced grooves;
Barricade is formed in the non-display area, the multiple spaced groove is made to be located at the display area and gear Between wall;
The inorganic encapsulated layer for covering the functional layer and barricade is formed in the non-display area, makes the functional layer and nothing The contact surface of machine encapsulated layer forms concaveconvex structure.
Optionally, functional layer is formed in the non-display area, the functional layer includes multiple spaced grooves, packet It includes:
Form substrate;
The first insulating layer, second insulating layer and third insulating layer are sequentially formed in substrate, it is the multiple spaced Groove is formed on first insulating layer, second insulating layer or third insulating layer.
Optionally, functional layer is formed in the non-display area, the functional layer includes multiple spaced grooves, packet It includes:
The first substrate, buffer layer and the second substrate sequentially formed, the multiple spaced groove are formed in described In second substrate;
The first insulating layer, second insulating layer and third insulating layer are sequentially formed in second substrate.
Optionally, when the multiple spaced groove is formed on the third insulating layer, the multiple interval The groove of setting and the via hole of display area with a patterning processes by forming.
Optionally, in the plane perpendicular to display base plate, the cross sectional shape of the groove includes rectangle, semicircle or falls It is trapezoidal.
Optionally, in the plane for being parallel to display base plate, the groove is around the display area.
The embodiment of the invention provides a kind of display base plate and preparation method thereof, display device, by display area with Multiple spaced grooves are arranged in region between barricade, and functional layer and the contact surface of inorganic encapsulated layer is made to form concave-convex knot Structure increases the region membranous layer binding force, eliminates the delamination in region or cracking between display area and barricade, avoids because of delamination Or the water oxygen intrusion path that cracking is formed, the validity and reliability of encapsulation is effectively ensured, and there is low manufacture cost, be easy to The advantages that technique is realized.
Certainly, implement any of the products of the present invention or method it is not absolutely required at the same reach all the above excellent Point.Other features and advantages of the present invention will illustrate in subsequent specification embodiment, also, partly implement from specification It is become apparent in example, or understand through the implementation of the invention.The purpose of the embodiment of the present invention and other advantages can pass through Specifically noted structure is achieved and obtained in the specification, claims and drawings.
Detailed description of the invention
Attached drawing is used to provide to further understand technical solution of the present invention, and constitutes part of specification, with this The embodiment of application technical solution for explaining the present invention together, does not constitute the limitation to technical solution of the present invention.Attached drawing In the shapes and sizes of each component do not reflect actual proportions, purpose is schematically illustrate the content of present invention.
Fig. 1 is the structural schematic diagram of display base plate of the embodiment of the present invention;
Fig. 2 is that the invention shows the structural schematic diagrams of substrate first embodiment;
Fig. 3 is that first embodiment of the invention forms the schematic diagram after base pattern;
Fig. 4 is that first embodiment of the invention forms the schematic diagram after active layer, gate electrode pattern;
Fig. 5 is that first embodiment of the invention forms the schematic diagram after third insulating layer pattern;
Fig. 6 is that first embodiment of the invention forms the schematic diagram after source electrode and drain electrode pattern;
Fig. 7 is that first embodiment of the invention forms the schematic diagram after anode pattern;
Fig. 8 is that first embodiment of the invention forms the schematic diagram after pixel defining layer and barricade pattern;
Fig. 9 is that first embodiment of the invention forms the schematic diagram after organic luminous layer and cathode pattern;
Figure 10 is that first embodiment of the invention forms the schematic diagram after encapsulation layer pattern;
Figure 11 is the schematic diagram at first embodiment of the invention organic layer edge;
Figure 12 is that the invention shows the structural schematic diagrams of substrate second embodiment.
Description of symbols:
1-glass support plate;The first substrate of 10a-;The second substrate of 10b-;
11-buffer layers;12-active layers;13-the first insulating layer;
14-first gate electrodes;15-the second gate electrode;16-second insulating layers;
17-capacitance electrodes;18-third insulating layers;19-source electrodes;
20-drain electrodes;21-the four insulating layer;31-anodes;
32-pixel defining layers;33-organic luminous layers;34-cathodes;
35-the first inorganic layer;36-organic layers;37-the second inorganic layer;
100-display areas;200-non-display areas;300-barricades;
400-reinforcement structures;101-thin film transistor (TFT)s;201-grooves;
202-the first barricade;203-the second barricade.
Specific embodiment
Specific embodiments of the present invention will be described in further detail with reference to the accompanying drawings and examples.Following embodiment For illustrating the present invention, but it is not intended to limit the scope of the invention.It should be noted that in the absence of conflict, the application In embodiment and embodiment in feature can mutual any combination.
Currently, the existing oled panel using thin-film packing structure includes display area and non-display area, display area Be provided with multiple luminescence units, non-display area is provided with barricade, thin-film package include folded the first inorganic layer set, organic layer and Second inorganic layer, the gear of the multiple luminescence units and non-display area of the first inorganic layer and the second inorganic layer covering display area Wall, organic layer are provided only on display area, between the first inorganic layer and the second inorganic layer.It is studied through present inventor It is due to being folded in panel it was found that there is the reason of package failure using the oled panel of above-mentioned thin-film packing structure The non-display area of panel occurs delamination (peeling) in journey, and the crack that delamination is formed provides extraneous water oxygen and intrudes into display The water oxygen intrusion path of the organic luminous layer in region, thus the luminescent properties of oled panel is caused to deteriorate.Through present inventor Further study show that, relative to the thickness of display area inorganic film, the film layer in region is thick between display area and barricade Degree is smaller, while organic layer also ends in the position, so that the film layer in the region only includes multiple inorganic layers, film inter-layer bonding force Weakness, thus the region between display area and barricade occurs for most of delamination.
In order to solve the problems, such as package failure existing for existing encapsulation scheme, the embodiment of the invention provides a kind of display bases Plate and preparation method thereof, display device, can be effectively ensured the validity and reliability of encapsulation, and have low manufacture cost, easily In technique realize the advantages that.Display base plate of the embodiment of the present invention includes display area and non-display area, the display area packet Include multiple luminescence units of array distribution, the non-display area include functional layer, the barricade being arranged in the functional layer with And the inorganic encapsulated layer of the covering functional layer and barricade, the region between the display area and barricade is provided with increase film layer The reinforcement structure of binding force, reinforcement structure include the multiple spaced grooves being arranged in the functional layer, make the function The contact surface of the contact surface of ergosphere and inorganic encapsulated layer formation concaveconvex structure, functional layer and inorganic encapsulated layer forms concaveconvex structure can To eliminate the delamination of region film layer or cracking between display area and barricade, avoids the formation of extraneous water oxygen and intrude into display area The water oxygen intrusion path of organic luminous layer.
Fig. 1 is the structural schematic diagram of display base plate of the embodiment of the present invention.As shown in Figure 1, display base plate includes display area 100 and annular be centered around the non-display area 200 of the periphery of display area 100.In the plane for being parallel to display base plate, display Region includes multiple luminescence units of array distribution, and non-display area 200 includes annular barricade 300 and is located at display area Annular reinforcement structure 400 between 100 and barricade 300.Wherein, each luminescence unit of display area 100 is as a sub- picture Element, 3 outgoing different colours light (such as RGB) luminescence units or 4 outgoing different colours light (such as red, green, blue and white) shine Unit forms a pixel unit.In the plane perpendicular to display base plate, display area 100 includes driving structure layer and sets The light emitting structure layer on driving structure layer is set, non-display area 200 includes the barricade of functional layer and setting on a functional 300, and setting reinforcement structure 400 on a functional, functional layer includes substrate and the insulating layer that is arranged in substrate, barricade Organic material is prevented to overflow to non-display area when printing organic material for subsequent i alphakjet, reinforcement structure 400 is located at viewing area Between domain and barricade, to eliminate delamination or the cracking of the region film layer, avoids the formation of extraneous water oxygen and intrude into having for display area The water oxygen intrusion path of machine luminescent layer.Wherein, driving structure layer mainly includes multiple thin film transistor (TFT)s (Thin Film Transistor, TFT), light emitting structure layer mainly includes anode, pixel defining layer, organic luminous layer, cathode and encapsulated layer.
The embodiment of the present application provides a kind of flexible oled display substrate, passes through the region between display area and barricade Multiple spaced grooves are set, so that the contact surface of functional layer and inorganic encapsulated layer is formed concaveconvex structure, increases the region film Layer binding force, eliminates the delamination in region or cracking between display area and barricade, avoids the water because of delamination or cracking formation Oxygen intrusion path, be effectively ensured encapsulation validity and reliability, and have low manufacture cost, be easy to technique realize etc. it is excellent Point solves the problems, such as package failure existing for existing encapsulation scheme.
Below by the specific embodiment technical solution that the present invention will be described in detail.
First embodiment
Fig. 2 is to illustrate the invention shows the structural schematic diagram of substrate first embodiment perpendicular to the flat of display base plate The structure of display area and non-display area on face.As shown in Fig. 2, in the plane perpendicular to display base plate, display area Main structure includes the driving structure layer and light emitting structure layer being arranged in substrate, and driving structure layer includes multiple film crystals It manages, is only illustrated by taking a luminescence unit and a thin film transistor (TFT) as an example in Fig. 2.Specifically, substrate includes the first substrate 10a, the buffer layer 11 being arranged on the first substrate 10a and the second substrate 10b being arranged on buffer layer 11, driving structure layer master It to include the thin film transistor (TFT) 101 being arranged on the second substrate 10b.Light emitting structure layer mainly includes and thin film transistor (TFT) 101 Drain electrode connection anode 31, limit pixel openings region pixel defining layer 32, be arranged in it is organic in pixel openings region Luminescent layer 33, the cathode 34 being arranged on organic luminous layer 33, the first inorganic layer 35 of the entire substrate of covering, setting are in the first nothing Second inorganic layer 37 of organic layer 36 on machine layer 35 and the entire substrate of covering, it is the first inorganic layer 35, organic in display area Layer 36 and the second inorganic layer 37 form encapsulated layer, and in non-display area, the first inorganic layer 35 and the second inorganic layer 37 form inorganic Encapsulated layer.
As shown in Fig. 2, the main structure of non-display area includes being arranged in substrate in the plane perpendicular to display base plate On insulating layer, setting reinforcement structure on the insulating layer and barricade and the inorganic encapsulated layer for covering reinforcement structure and barricade, Substrate and insulating layer are as functional layer.Wherein, substrate include the first substrate 10a, the buffer layer 11 that is arranged on the first substrate 10a With the second substrate 10b being arranged on buffer layer 11, insulating layer include the first insulating layer 13 being formed simultaneously with driving structure layer, Second insulating layer 16 and third insulating layer 18, barricade include the first barricade 202 and the second barricade 203, the first barricade 202 and second Barricade 203 is arranged with 32 same layer of pixel defining layer in display area, material is identical and is formed by same one-time process, inorganic envelope Filling layer includes the first inorganic layer 35 and the second inorganic layer 37.Wherein, reinforcement structure is arranged in third insulating layer 18 far from substrate one On the surface of side, including multiple spaced grooves 201, multiple spaced grooves 201 are located at display area and first Between barricade 202.In the plane perpendicular to display base plate, the cross sectional shape of groove 201 can be rectangle, semicircle, the ladder that falls The cross sectional shape of the shapes such as shape, the first barricade 202 and the second barricade 203 can be the shapes such as rectangle, trapezoidal.It is being parallel to display In the plane of substrate, the first barricade 202 and the second barricade 203 are around the surrounding of display area, and groove 201 is around display area Surrounding and it is parallel to the first barricade 202.
Below by the preparation process of the present embodiment display base plate technical solution that the embodiment of the present invention will be further explained.Its In, described " patterning processes " include depositional coating, coating photoresist, mask exposure, development, etching, removing in the present embodiment Photoresist etc. is handled, and described " photoetching process " includes the processing such as coating film layer, mask exposure, development, this reality in the present embodiment Applying vapor deposition, deposition, coating, coating etc. described in example is preparation process mature in the related technology.
Fig. 3~10 are the schematic diagram of the present embodiment display base plate preparation process.The preparation process of display base plate includes:
(1) base pattern is formed.Forming base pattern includes: that one layer of flexible material is first coated in glass support plate 1, solidification Film forming forms the first substrate 10a.Then, one layer of buffer thin film is deposited on the first substrate 10a, is formed and is covered entire first base 11 pattern of buffer layer of bottom 10a.Finally, one layer of coating flexible material on buffer layer 11, film-forming form the second substrate 10b.Wherein, flexible material can use polyimides PI, polyethylene terephthalate PET or surface treated polymer The materials such as mantle form flexible substrates, as shown in Figure 3.Buffer thin film can use silicon nitride SiNx or silicon oxide sio x etc., can To be single layer, it is also possible to nitrogenize the multilayered structure of silicon/oxidative silicon.In the present embodiment, display area and the equal shape of non-display area At having the first substrate 10a, buffer layer 11 and the second substrate 10b.
(2) active layer, gate electrode, capacitor electrode patterns are formed on the substrate.Be formed on the substrate active layer, gate electrode, Capacitor electrode patterns include:
A, on the basis of forming above structure, one layer of active layer film is deposited, by patterning processes to active layer film It is patterned, forms 12 pattern of active layer being arranged on the second substrate 10b in display area;
B, then, it is sequentially depositing the first insulation film and the first metallic film, by patterning processes to the first metallic film It is patterned, the first insulating layer 13 for forming covering active layer 12, the first gate electrode 14 being arranged on the first insulating layer 13, the Two gate electrode 15 and grid line (not shown) pattern.Wherein, first gate electrode 14, the second gate electrode 15 and grid line are made only in display Region, non-display area at this time are formed with the first insulating layer 13.
C, then, it is sequentially depositing the second insulation film and the second metallic film, by patterning processes to the second metallic film It is patterned, forms the second insulating layer 16 of covering first gate electrode 14 and the second gate electrode 15 and is arranged in second insulating layer 17 pattern of capacitance electrode on 16, the position of capacitance electrode 17 is corresponding with the position of the second gate electrode 15, capacitance electrode 17 with Second gate electrode 15 constitutes capacitor, as shown in Figure 4.Wherein, capacitance electrode 17 is made only in display area, non-display area at this time Domain is formed with the first insulating layer 13 and second insulating layer 16.
(3) the third insulating layer pattern for offering via hole and groove is formed.Formation offers via hole and the third of groove is exhausted Edge layer pattern includes: to deposit third insulation film on the basis of forming above structure, is insulated by patterning processes to third thin Film is patterned, and forms 18 pattern of third insulating layer opened up there are two the first via hole in display area, in two the first via holes Third insulating layer 18, second insulating layer 16 and the first insulating layer 13 be etched away, active layer 12 is exposed, in non-display area Multiple spaced grooves 201 are formed, as shown in Figure 5.Wherein, two the first via holes are made only in display area, at this time Non-display area is formed with the first insulating layer 13, second insulating layer 16 and third insulating layer 18, is formed on third insulating layer 18 more A spaced groove 201, multiple spaced grooves 201 are used as reinforcement structure, for increasing the combination between film layer Power avoids the formation of extraneous water oxygen and intrudes into eliminate delamination or the cracking of the multiple inorganic layers in region between display area and barricade The water oxygen intrusion path of the organic luminous layer of display area.In the plane perpendicular to display base plate, the cross sectional shape of groove 201 It can be the shapes such as rectangle, semicircle, inverted trapezoidal, in the plane for being parallel to display base plate, groove 201 is looped around display area Surrounding.In this patterning processes, in order to be formed simultaneously two the first via holes and multiple grooves, halftoning or grey can be used The masking process of tune is etched by first time and forms two the first via holes, forms multiple grooves by second of etching.It is practical real Shi Shi, the parameters such as the width of groove and groove spacing can be according to the distance between display area and the first barricade and technique Level is arranged.The thickness less than third insulating layer can be set into the depth of groove, i.e. groove does not carve third insulating layer It wears;The overall thickness less than second insulating layer and third insulating layer also can be set into the depth of groove, i.e. groove insulate third Layer is cut through, but does not cut through second insulating layer;The depth of groove also can be set into less than the first insulating layer, second insulating layer With the overall thickness of third insulating layer, i.e. groove cuts through second insulating layer and third insulating layer, but does not carve the first insulating layer It wears.When actual implementation, groove can also be formed in the first insulating layer and second insulating layer.Since third insulating layer is needed aobvious Show that region forms via hole, needs a patterning processes, the present embodiment forms groove on third insulating layer can use the secondary structure Figure technique will form via hole and in non-display area formation groove by being formed simultaneously with a patterning processes in display area, It avoids and increases additional process flow, it can be compatible with existing preparation process well.
(4) source electrode and drain electrode pattern is formed.Forming source electrode and drain electrode pattern includes: to form above structure On the basis of, third metallic film is deposited, third metallic film is patterned by patterning processes, forms source electricity in display area Pole 19, drain electrode 20 and data line (not shown) pattern, source electrode 19 and drain electrode 20 pass through two the first via holes and have respectively Active layer 12 connects, as shown in Figure 6.In this patterning processes, the third metallic film of non-display area is etched completely away.
By the above process, the driving structure layer positioned at display area is completed in substrate, positioned at non-display area The preparation of reinforcement structure.Wherein, the driving structure layer positioned at display area includes active layer 12, first gate electrode 14, second gate Electrode 15, capacitance electrode 17, source electrode 19, drain electrode 20, grid line and data line, grid line and data line square crossing limit son Pixel, the thin film transistor (TFT) being made of active layer 12, first gate electrode 14, source electrode 19 and drain electrode 20 are arranged in sub-pixel It is interior.Insulating layer positioned at non-display area includes the first insulating layer 13, second insulating layer 16 and third insulating layer 18, as reinforcement Multiple grooves of structure are arranged on surface of the third insulating layer 18 far from the first side substrate 10a.Wherein, the first insulating layer and Second insulating layer is also referred to as gate insulation layer (GI), and third insulating layer is also referred to as interlayer insulating film (ILD).
(5) anode pattern is formed.Forming anode pattern includes: first to coat the 4th absolutely on the basis of forming above structure Edge film, by mask exposure develop photoetching process display area formed covering source electrode 19 and drain electrode 20 the 4th absolutely 21 pattern of edge layer, the 4th insulating layer 21 offer the second via hole, and the second via hole exposes drain electrode 20.Then deposition electrically conducting transparent Film is patterned transparent conductive film by patterning processes, forms 31 pattern of anode in display area, anode 31 passes through the Two via holes are connect with drain electrode 20, as shown in Figure 7.Wherein, the 4th insulating layer 21 and anode 31 are made only in display area, non-aobvious The 4th insulation film and transparent conductive film for showing region are removed.Wherein, the 4th insulating layer is also referred to as planarization layer (PLN), transparent conductive film can use tin indium oxide ITO or indium zinc oxide IZO.
(6) pixel defining layer and barricade pattern are formed.It forms pixel defining layer and barricade pattern includes: to form earlier figures Pixel definition film is coated in the substrate of case, and pixel defining layer (Pixel Define is formed in display area by photoetching process Layer) 32 pattern forms the first barricade 202 and 203 pattern of the second barricade, i.e. 32 pattern of pixel defining layer in non-display area With the first barricade 202 and 203 pattern of the second barricade by being formed with a photoetching process, the two same layer is arranged and uses identical material Material, pixel defining layer 32 limit the pixel openings region of exposed anode 31, the first barricade 202 and second gear in each sub-pixel Wall 203 is arranged on third insulating layer 18, and the distance between the second barricade 203 and display area are greater than the first barricade 202 and show Show the distance between region, as shown in Figure 8.Wherein, pixel defining layer 32 is formed in display area, the first barricade 202 and second Barricade 203 is formed in non-display area, and non-display area at this time is formed with by the first insulating layer 13, second insulating layer 16 and The insulating layer of three insulating layers 18 composition is formed in existing on third insulating layer 18 as multiple grooves of reinforcement structure and setting The first barricade 202 and the second barricade 203 on third insulating layer 18, multiple grooves be located at the first barricade 202 and display area it Between.Wherein, pixel defining layer can be using polyimides, acrylic or polyethylene terephthalate etc., the first barricade 202 Be with the cross-sectional shape of the second barricade 203 it is trapezoidal, can be set according to actual needs the first barricade 202 and the second barricade 203 Height, the two height may be the same or different.
(7) organic luminous layer and cathode pattern are formed.It forms organic luminous layer and cathode pattern includes: to form earlier figures Luminous organic material and cathodic metal are successively deposited in the substrate of case, forms organic luminous layer 33 and 34 figure of cathode in display area Case, the anode 31 in pixel openings region that organic luminous layer 33 is limited with pixel defining layer 32 are connect, and the setting of cathode 34 exists On organic luminous layer 33, as shown in Figure 9.Wherein, organic luminous layer 33 mainly includes luminescent layer (EML).It is non-aobvious in this technique The luminous organic material and cathodic metal for showing region are etched completely away.When actual implementation, organic luminous layer may include successively Hole injection layer, hole transmission layer, luminescent layer, electron transfer layer and the electron injecting layer of setting improve electrons and holes injection The efficiency of luminescent layer, cathode can use magnesium Mg, silver Ag, aluminium Al, copper Cu, one kind of lithium Li et al. metal material or above-mentioned metal Alloy.
(8) encapsulation layer pattern is formed.Forming encapsulation layer pattern includes: first to deposit the in the substrate for forming aforementioned pattern One inorganic thin film, the first inorganic thin film cover display area and non-display area, form 35 pattern of the first inorganic layer, i.e. the first nothing Machine layer 35 covers pixel defining layer 32, organic luminous layer 33 and cathode 34 in display area, covers multiple in non-display area Corresponding groove type is formed every the groove 201, the first barricade 202 and the second barricade 203 of setting, and in multiple 201 positions of groove Shape.Then, organic layer 36 is formed in display area using inkjet printing mode, organic layer 36 is made only in the first of display area On inorganic layer 35.Finally, the second inorganic thin film of deposition, the second inorganic thin film cover display area and non-display area, the is formed Two inorganic layers, 37 pattern, as shown in Figure 10.In this way, the encapsulated layer including inorganic/organic/inorganic three-decker is completed, it is intermediate Organic layer be made only in display area, upper layer and lower layer inorganic layer covers display area and non-display area, the second inorganic layer 37 Corresponding groove shapes are formed in multiple groove locations.
(9) finally, removing glass support plate 1, the preparation of complete display base plate, as shown in Figure 2.
By the above process, the system of the light emitting structure layer positioned at display area, the barricade positioned at non-display area is completed It is standby.Wherein, the light emitting structure layer positioned at display area include anode 31, pixel defining layer 32, organic luminous layer 33, cathode 34 with And encapsulated layer, the barricade positioned at non-display area includes the first barricade 202 and the second barricade 203, is made multiple spaced recessed Slot 201 is between display area and the first barricade.
It is more due to being formed on the third insulating layer 18 in region between display area and the first barricade 202 in the present embodiment A spaced groove, so that the first inorganic layer 35 and the second inorganic layer 37 of subsequent deposition are similarly formed accordingly in the region Groove shapes, the first inorganic layer 35 and the second inorganic layer 37 are used as inorganic encapsulated layer.In this way, in display area and the first barricade The contact surface of region between 202, third insulating layer 18 and the first inorganic layer 35 includes multiple concaveconvex structures turned back, and first is inorganic The contact surface of layer 35 and the second inorganic layer 37 includes multiple concaveconvex structures turned back, by the way that multiple concaveconvex structures turned back are arranged, On the one hand the contact area between film layer is increased, the bond strength between film layer is enhanced, on the other hand increases the anti-of the region Curved intensity enhances the antistripping ability of film layer, thus effectively prevents delamination or cracking occur in the region, effectively eliminates Because of the crack that delamination or cracking are formed, the water oxygen invasion that extraneous water oxygen intrudes into the organic luminous layer of display area is thoroughly prevented Path ensure that the luminescent properties of oled panel.Further, due between display area and the first barricade 202 region formed The first inorganic layer 35 also have multiple grooves, when using inkjet printing (IJP) mode display area formed organic layer 36 when, These grooves, which can play, prevents the organic material of inkjet printing from overflowing (Overflow) to non-display area, thus has improved The linearity at 36 edge of machine layer.Specifically, when the organic material of inkjet printing flows to non-display area, groove is not only to having The flowing of machine material applies biggish resistance, and part organic material needs first to fill groove and could continue to flow, thus will Organic layer 36 it is edge limited in recess region.
Figure 11 is the schematic diagram at first embodiment of the invention organic layer edge.Wherein solid line indicates the present embodiment organic layer side Edge, dotted line indicate prior art organic layer edge.As shown in figure 11, by this present embodiment in display area 100 and barricade 300 Between region insulating layer on form multiple spaced grooves so that the first inorganic layer of subsequent deposition is same in the region Corresponding groove shapes are formed, these grooves, which not only act as, hinders the organic material of inkjet printing to overflow to non-display area, has Effect shortens the spilling distance of organic organic material, and organic layer edge is made to have preferable linearity, improves encapsulation Energy.In contrast, due between display area 100 in existing structure and the first barricade 202 region be flat surface, cause to spray The organic material of ink printing is overflowed to non-display area, not only overflows distance, but also make organic layer edge irregular.
It can be seen that display base plate provided by the present embodiment by above-mentioned preparation flow, by display area and the Region setting between one barricade includes the reinforcement structure of multiple spaced grooves, and reinforcement structure not only increases between film layer Bond strength, and enhance the antistripping ability of film layer, avoid the multiple nothings in region between display area and the first barricade The delamination of machine layer or cracking eliminate the crack because of delamination or cracking formation, have thoroughly prevented extraneous water oxygen and intruded into viewing area The water oxygen intrusion path of the organic luminous layer in domain has been effectively ensured the validity and reliability of encapsulation, ensure that oled panel Luminescent properties.Further, the present embodiment is mentioned by setting reinforcement structure so that organic layer edge has preferable linearity High encapsulation performance.In addition, the preparation process of the present embodiment can be realized using the Preparation equipment of existing maturation, to prior art Improvement is smaller, can be compatible with existing preparation process well, therefore has low manufacture cost, is easy to technique realization, production effect The advantages that rate height and high yields.The present embodiment efficiently solves the problems, such as package failure existing for existing encapsulation scheme, is improving There is practical application value in oled panel overall package effect, have a good application prospect.
It should be noted that structure and its preparation process shown in the present embodiment are only a kind of exemplary illustration.It is practical real Shi Shi can change according to actual needs corresponding construction and increase or decrease patterning processes.For example, oled display substrate is not only It can be also possible to bottom emitting structure with emission structure at top.For another example, thin film transistor (TFT) not only can be top gate structure, be also possible to Bottom grating structure not only can be double-gate structure, be also possible to single grid structure.For another example, thin film transistor (TFT) can be amorphous silicon (a- Si) thin film transistor (TFT), low temperature polycrystalline silicon (LTPS) thin film transistor (TFT) or oxide (Oxide) thin film transistor (TFT), driving structure layer With other electrodes, lead and layer can also be set in light emitting structure layer.For another example, the first barricade and the second barricade can be with Including dottle pin layer etc., the embodiment of the present invention does not do specific restriction herein.
Second embodiment
Figure 12 is to illustrate the invention shows the structural schematic diagram of substrate second embodiment perpendicular to the flat of display base plate The structure of display area and non-display area on face.The main structure of the present embodiment display base plate and aforementioned first embodiment are basic Identical, the main structure of display area includes multiple luminescence units in array distribution, and each luminescence unit includes being arranged in base Driving structure layer and light emitting structure layer on bottom, the main structure of non-display area include the insulating layer being arranged in substrate, set It sets barricade on the insulating layer and covers the inorganic encapsulated layer and reinforcement structure of barricade.As shown in figure 12, with aforementioned first Embodiment is different, and the present embodiment reinforcement structure is arranged on surface of the second substrate 10b far from the first side substrate 10a, packet Multiple spaced grooves 201 are included, multiple spaced grooves 201 are located between display area and the first barricade 202.
In the present embodiment, substrate, the insulation of the driving structure layer and light emitting structure layer and non-display area of display area The structures such as layer and barricade are identical as the structure of aforementioned first embodiment, and which is not described herein again.Since the present embodiment is as reinforcement knot Multiple spaced grooves 201 of structure are arranged on the second substrate 10b, and between display area and the first barricade 202 Region, thus the first insulating layer 13, second insulating layer 16, third insulating layer 18, the first inorganic layer 35 and second being subsequently formed Inorganic layer 37 is similarly formed corresponding groove shapes in the region.In this way, the region between display area and the first barricade 202, The contact surface of second substrate 10b and the first insulating layer 13, the contact surface of the first insulating layer 13 and second insulating layer 16, the second insulation Layer 16 and the contact surface of third insulating layer 18, the contact surface and the first inorganic layer 35 of third insulating layer 18 and the first inorganic layer 35 Contact surface with the second inorganic layer 37 includes multiple concaveconvex structures turned back, the concaveconvex structure turned back by these, one side The contact area for increasing film layer, enhances the bond strength of film layer, on the other hand increases the bending strength in the region, enhancing The antistripping ability of film layer, thus effectively prevent delamination or cracking occur in the region.When actual implementation, groove can also be with It is formed on the first substrate or buffer layer.Due to being inorganic layer on the second substrate, formed using depositional mode, therefore After forming groove in two substrates, the film layer being subsequently formed can keep the groove shapes, and contact surface is between guaranteeing subsequent film The improvement effect of concaveconvex structure, membranous layer binding force is obvious.
The technical effect of aforementioned first embodiment not only may be implemented in the present embodiment, including avoids display area and first gear The delamination of the multiple inorganic layers in region or cracking and make organic layer edge that there is preferable linearity etc. between wall, and passes through Increase the quantity for forming the film layer of groove, increases the bending strength in the region, enhance the antistripping ability of film layer, it can be most Region between display area and the first barricade is avoided to limits delamination or cracking occur.
The preparation flow of the present embodiment display base plate and aforementioned first embodiment are essentially identical, the difference is that step (1) It is formed during base pattern, after forming the second substrate, forms multiple intervals by the way of exposure development or coining and set The groove set, less than the thickness of the second substrate, i.e. groove does not cut through the second substrate the depth of groove.Step (1) forms the During three insulating layer patterns, two the first via holes only are formed in display area.Other processes are identical as aforementioned first embodiment, Which is not described herein again.
Although aforementioned be located at display to form groove on third insulating layer and form groove and groove in the second substrate It is illustrated for region between region and the first barricade, but the technical concept based on the embodiment of the present invention, the present invention is implemented The structure of example display base plate can also there are many extensions and deformation.For example, between the first barricade and the first barricade region phase It answers and groove is set in film layer.For another example, multiple spaced grooves are arranged between display area and the first barricade close to the The region of one barricade, to improve based on the binding force between film layer.For another example, multiple spaced grooves are arranged in display area Close to the region of display area between the first barricade, to improve based on the linearity at organic layer edge etc., these extensions and It deforms within the scope of the present invention.
3rd embodiment
Technical concept based on the embodiment of the present invention, the embodiment of the invention also provides a kind of preparation sides of display base plate Method.The display base plate includes display area and non-display area, and the preparation method of the present embodiment display base plate includes:
S1, functional layer is formed in the non-display area, the functional layer includes multiple spaced grooves;
S2, barricade is formed in the non-display area, the multiple spaced groove is made to be located at the display area Between barricade;
S3, the inorganic encapsulated layer for covering the functional layer and barricade is formed in the non-display area, make the functional layer Concaveconvex structure is formed with the contact surface of inorganic encapsulated layer.
In one embodiment, step S1 includes:
Form substrate;
The first insulating layer, second insulating layer and third insulating layer are sequentially formed in substrate, it is the multiple spaced Groove is formed on first insulating layer, second insulating layer or third insulating layer.
In another embodiment, step S1 includes:
The first substrate, buffer layer and the second substrate sequentially formed, the multiple spaced groove are formed in described In second substrate;
The first insulating layer, second insulating layer and third insulating layer are sequentially formed in second substrate.
Wherein, in the plane perpendicular to display base plate, the cross sectional shape of the groove includes rectangle, semicircle or the ladder that falls Shape;In the plane for being parallel to display base plate, the groove is around the display area.
In the present embodiment, structure, material, relevant parameter and its detailed preparation process of each film layer are in previous embodiment Middle detailed description, which is not described herein again.
The preparation method for present embodiments providing a kind of display base plate passes through the region shape between display area and barricade At reinforcement structure, reinforcement structure eliminates the de- of region between display area and barricade for increasing the region membranous layer binding force Layer or cracking avoid the water oxygen intrusion path because of delamination or cracking formation, the validity and reliability of encapsulation have been effectively ensured. The preparation method of the present embodiment can be realized using the Preparation equipment of existing maturation, smaller to prior art improvement, can be fine Ground is compatible with existing preparation process, thus have low manufacture cost, be easy to technique realize, high production efficiency and yields height etc. it is excellent Point.The present embodiment efficiently solves the problems, such as package failure existing for existing encapsulation scheme, is improving oled panel overall package effect There is practical application value in fruit, have a good application prospect.
Fourth embodiment
Technical concept based on the embodiment of the present invention, the embodiment of the invention also provides a kind of display device, including it is aforementioned The display base plate of embodiment.Display device can be with are as follows: mobile phone, tablet computer, television set, display, laptop, digital phase Any products or components having a display function such as frame, navigator.
In the description of the embodiment of the present invention, it is to be understood that term " middle part ", "upper", "lower", "front", "rear", The orientation or positional relationship of the instructions such as "vertical", "horizontal", "top", "bottom" "inner", "outside" be orientation based on the figure or Positional relationship is merely for convenience of description of the present invention and simplification of the description, rather than the device or element of indication or suggestion meaning must There must be specific orientation, be constructed and operated in a specific orientation, therefore be not considered as limiting the invention.
In the description of the embodiment of the present invention, it should be noted that unless otherwise clearly defined and limited, term " peace Dress ", " connected ", " connection " shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or integrally Connection;It can be mechanical connection, be also possible to be electrically connected;Can be directly connected, can also indirectly connected through an intermediary, It can be the connection inside two elements.For the ordinary skill in the art, above-mentioned art can be understood with concrete condition The concrete meaning of language in the present invention.
Although disclosed herein embodiment it is as above, the content only for ease of understanding the present invention and use Embodiment is not intended to limit the invention.Technical staff in any fields of the present invention is taken off not departing from the present invention Under the premise of the spirit and scope of dew, any modification and variation, but the present invention can be carried out in the form and details of implementation Scope of patent protection, still should be subject to the scope of the claims as defined in the appended claims.

Claims (14)

1. a kind of display base plate, which is characterized in that including display area and non-display area, the non-display area includes function The inorganic encapsulated layer of layer, the barricade being arranged in the functional layer and the covering functional layer and barricade, in the viewing area Between domain and barricade, the functional layer includes multiple spaced grooves, makes the contact of the functional layer with inorganic encapsulated layer Face forms concaveconvex structure.
2. display base plate according to claim 1, which is characterized in that the functional layer includes substrate and is arranged described Insulating layer in substrate, the multiple spaced groove are arranged in the substrate or insulating layer.
3. display base plate according to claim 2, which is characterized in that the substrate includes the first substrate, is arranged described Buffer layer in first substrate and the second substrate being arranged on the buffer layer, the multiple spaced groove, which is arranged, to exist In second substrate.
4. display base plate according to claim 2, which is characterized in that the insulating layer exists including the first insulating layer, setting The third insulating layer of second insulating layer and setting on the second insulating layer on first insulating layer, the multiple interval The groove of setting is arranged on first insulating layer, second insulating layer or third insulating layer.
5. display base plate according to claim 1, which is characterized in that the barricade includes around the of the display area One barricade and the second barricade around first barricade, the multiple spaced groove setting the display area with Between first barricade, first barricade and the second barricade are for preventing the organic material of inkjet printing from overflowing.
6. according to any display base plate of claim 2~5, which is characterized in that in the plane perpendicular to display base plate, The cross sectional shape of the groove includes rectangle, semicircle or inverted trapezoidal.
7. according to any display base plate of claim 2~5, which is characterized in that in the plane for being parallel to display base plate, The groove is around the display area.
8. a kind of display device, which is characterized in that including any display base plate of claim 1~7.
9. a kind of preparation method of display base plate, which is characterized in that the display base plate includes display area and non-display area, Preparation method includes:
Functional layer is formed in the non-display area, the functional layer includes multiple spaced grooves;
Form barricade in the non-display area, make the multiple spaced groove be located at the display area and barricade it Between;
The inorganic encapsulated layer for covering the functional layer and barricade is formed in the non-display area, makes the functional layer and inorganic envelope The contact surface for filling layer forms concaveconvex structure.
10. preparation method according to claim 9, which is characterized in that functional layer is formed in the non-display area, it is described Functional layer includes multiple spaced grooves, comprising:
Form substrate;
The first insulating layer, second insulating layer and third insulating layer, the multiple spaced groove are sequentially formed in substrate It is formed on first insulating layer, second insulating layer or third insulating layer.
11. preparation method according to claim 9, which is characterized in that functional layer is formed in the non-display area, it is described Functional layer includes multiple spaced grooves, comprising:
The first substrate, buffer layer and the second substrate sequentially formed, the multiple spaced groove are formed in described second In substrate;
The first insulating layer, second insulating layer and third insulating layer are sequentially formed in second substrate.
12. preparation method according to claim 10, which is characterized in that when the multiple spaced groove is formed in When on the third insulating layer, the via hole of the multiple spaced groove and display area passes through with a patterning processes shape At.
13. according to any preparation method of claim 9~12, which is characterized in that in the plane perpendicular to display base plate On, the cross sectional shape of the groove includes rectangle, semicircle or inverted trapezoidal.
14. according to any preparation method of claim 9~12, which is characterized in that in the plane for being parallel to display base plate On, the groove is around the display area.
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