WO2020252947A1

WO2020252947A1 - Display panel

Info

Publication number: WO2020252947A1
Application number: PCT/CN2019/105468
Authority: WO
Inventors: 倪晶
Original assignee: 武汉华星光电半导体显示技术有限公司
Priority date: 2019-06-18
Filing date: 2019-09-11
Publication date: 2020-12-24
Also published as: CN110335959A

Abstract

A display panel (1) comprises an organic light-emitting device (2) and a thin film encapsulation layer (3) provided at the organic light-emitting device (2). The organic light-emitting device (2) comprises an anode (4). The display panel (1) comprises a bezel region (5). A rough structure (6) is formed on a portion of a surface of the anode (4) located in the bezel region (5). The thin film encapsulation layer (3) at least partially covers the rough structure (6).

Description

Display panel

Technical field

This application relates to the technical field of display panels, and in particular to a display panel.

Background technique

The statements here only provide background information related to this application, and do not necessarily constitute prior art.

Organic Light-Emitting Diode (OLED) has attracted great attention from academia and industry because of its huge development potential in the direction of solid-state lighting and flat panel displays. OLED panels can be made lighter and thinner, and more and more mobile phone manufacturers choose OLED panels as display screens. Narrow border Border) has become a popular design for mobile phone screens in recent years.

OLED panels need to be stored or lit for a period of time in a high temperature and high humidity environment (such as 85°C/85% humidity) for reliability testing. A conventional OLED panel includes an array layer, a flat layer, an OLED device, and a flexible packaging layer. The anode of the OLED device includes a bottom ITO (Indium-Tin Oxide) layer, a silver metal layer, and a top ITO layer. After the OLED panel has been placed under high temperature and high humidity conditions for a period of time, it is found that the anode of the panel frame is prone to peeling, that is, the two interfaces of the top ITO layer/silver metal layer/bottom ITO layer are split, or the flexible packaging layer and the top The film split between the ITO layers seriously affects the performance and service life of the display panel.

technical problem

The present application provides a display panel. By providing a rough structure on the surface of each film layer of the anode located in the frame area of the display panel, and the thin film encapsulating layer covers at least part of the rough structure, the anode and the thin film encapsulating layer in the frame area of the display panel are solved The problem of film layer separation is likely to occur between the film layers of the anode and the film layers of the anode, which seriously affects the performance and service life of the display panel.

Technical solutions

To solve the above problems, the technical solutions provided by this application are as follows:

The present application provides a display panel, which includes an organic light-emitting device and a thin film encapsulation layer disposed on the organic light-emitting device; the organic light-emitting device includes an anode, and the display panel includes a frame area located at the anode of the frame area. A rough structure is formed on the surface, and the thin film encapsulation layer covers at least part of the rough structure.

In the display panel provided by the embodiment of the present application, the anode includes a first conductive film, a metal layer, and a second conductive film, the metal layer covers the second conductive film, and the first conductive film covers On the metal layer; the rough structure is formed on the surface of the first conductive film located in the frame area, and the thin film encapsulation layer covers at least part of the rough structure.

In the display panel provided by the embodiment of the present application, the rough structure is formed on the surface of the metal layer and the second conductive film located in the frame area.

In the display panel provided by the embodiment of the present application, the thin film encapsulation layer includes a first inorganic layer, an organic layer, and a second inorganic layer sequentially disposed on the organic light-emitting device, and the first inorganic layer covers at least part of the The rough structure.

In the display panel provided by the embodiment of the present application, the display panel further includes a plurality of barrier layers arranged on the rough structure at intervals, and the first inorganic layer further covers the plurality of barrier layers.

In the display panel provided by the embodiment of the present application, the rough structure includes a plurality of protrusions, and a plurality of protrusions on the first conductive film, a plurality of protrusions on the metal layer, and a The multiple protrusions on the second conductive film are arranged correspondingly or staggered.

In the display panel provided by the embodiment of the present application, the rough structure includes a plurality of grooves, a plurality of grooves on the first conductive film, a plurality of grooves on the metal layer, and a The multiple grooves on the conductive film are arranged correspondingly or staggered.

In the display panel provided by the embodiment of the present application, the rough structure includes a plurality of protrusions or a plurality of grooves.

In the display panel provided by the embodiment of the present application, the protrusion includes an arc-shaped protrusion or a square protrusion; the groove includes an arc-shaped groove or a square groove.

In the display panel provided by the embodiment of the present application, the plurality of protrusions or the plurality of grooves are arranged in an array.

In the display panel provided by the embodiment of the present application, the rough structure is formed through exposure, development and etching processes.

In the display panel provided by the embodiment of the present application, the display panel further includes a thin film transistor array substrate and a flat layer provided on the thin film transistor array substrate, and the anode is provided on the flat layer;

The organic light-emitting device further includes a pixel defining layer, a light-emitting function layer, and a cathode arranged on the pixel defining layer and the light-emitting function layer sequentially arranged on the anode; the thin film encapsulation layer also covers the cathode And the pixel definition layer.

In the display panel provided by the embodiment of the present application, the material of the first conductive film and the second conductive film includes indium tin oxide, and the material of the metal layer includes metallic silver.

In the display panel provided by the embodiment of the present application, the material of the first inorganic layer and the second inorganic layer includes aluminum oxide, titanium dioxide, silicon nitride, silicon carbonitride, silicon dioxide, or zirconium dioxide .

In the display panel provided by the embodiment of the present application, the material of the organic layer includes hexamethyldisiloxane, acrylic, polyacrylate, polycarbonate or polystyrene.

The present application also provides a display panel, including an organic light-emitting device and a thin film encapsulation layer disposed on the organic light-emitting device; the organic light-emitting device includes an anode, and the anode includes a first conductive film, a metal layer, and a second conductive film. A thin film, the metal layer covers the second conductive film, and the first conductive film covers the metal layer;

The display panel includes a frame area, the surfaces of the first conductive film, the metal layer, and the second conductive film located in the frame area are formed with rough structures, and the film encapsulation layer covers at least part of the first conductive film Rough structure.

Beneficial effect

The beneficial effect of the present application is that a rough structure is formed on the surface of the anode located in the frame area of the display panel, and the thin film encapsulation layer covers at least part of the rough structure, which effectively increases the contact area between the anode and the thin film encapsulation layer, Enhances the adhesion of the contact interface between the two, greatly reduces the probability of film split between the anode and the film encapsulation layer, and prevents external water and oxygen from intruding into the display panel from the contact interface of the anode and the film encapsulation layer to damage the organic The light emitting device improves the performance of the display panel and prolongs the service life of the display panel; the surface of the first conductive film, the metal layer and the second conductive film of the anode located in the frame area of the display panel are all formed with rough structures, so that the film The contact area between the packaging layer and the first conductive film is increased, the contact area between the first conductive film and the metal layer is increased, and the contact area between the metal layer and the second conductive film is increased, and the thin film packaging layer is enhanced , The adhesion between any two adjacent layers of the first conductive film, the metal layer and the second conductive film greatly reduces the film encapsulation layer and the first conductive film, the first conductive film and the metal layer, and The probability of film split between the metal layer and the second conductive film can prevent water and oxygen from entering the inside of the display panel, and it can also prevent the anode structure from splitting between the anode film layers, thereby ensuring the inside of the display panel. The normal transmission of signals improves the performance of the display panel and prolongs the service life of the display panel.

Description of the drawings

In order to explain the embodiments or the technical solutions in the prior art more clearly, the following will briefly introduce the drawings that need to be used in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only for application. For some embodiments, those of ordinary skill in the art can obtain other drawings based on these drawings without creative work.

FIG. 1 is a schematic block diagram of a partial structure of a display panel provided by an embodiment of the application;

2 is a schematic diagram of a partial structure of an anode and a first inorganic layer located in a frame area provided by an embodiment of the application;

FIG. 3 is a partial structural diagram of another anode located in the frame area and the first inorganic layer according to an embodiment of the application;

4 is a schematic diagram of a partial structure of another anode located in the frame area and the first inorganic layer according to an embodiment of the application;

FIG. 5 is a partial structural diagram of another anode located in the frame area and the first inorganic layer according to an embodiment of the application;

FIG. 6 is a partial structural diagram of another anode located in the frame area and the first inorganic layer according to an embodiment of the application.

Embodiments of the invention

The specific structure and functional details disclosed herein are only representative, and are used for the purpose of describing exemplary embodiments of the present application. However, this application can be implemented in many alternative forms, and should not be interpreted as being limited to the embodiments set forth herein.

In the description of this application, it should be understood that the terms "center", "lateral", "upper", "lower", "left", "right", "vertical", "horizontal", "top", The orientation or positional relationship indicated by "bottom", "inner", and "outer" is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the application and simplifying the description, and does not indicate or imply the device referred to Or the element must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation of the present application. In addition, the terms "first" and "second" are only used to describe the purpose, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of these features. In the description of this application, unless otherwise specified, "plurality" means two or more. In addition, the term "including" and any variations thereof is intended to cover non-exclusive inclusion.

In the description of this application, it should be noted that the terms "installation", "connection", and "connection" should be interpreted broadly unless otherwise clearly specified and limited. For example, it can be a fixed connection or a detachable connection. Connected or integrally connected; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the internal communication between two components. For those of ordinary skill in the art, the specific meanings of the above-mentioned terms in this application can be understood under specific circumstances.

The terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments. Unless the context clearly dictates otherwise, the singular forms "a" and "one" used herein are also intended to include the plural. It should also be understood that the terms "including" and/or "comprising" used herein specify the existence of the stated features, integers, steps, operations, units and/or components, and do not exclude the existence or addition of one or more Other features, integers, steps, operations, units, components, and/or combinations thereof.

The application will be further described below in conjunction with the drawings and embodiments.

As shown in FIG. 1, an embodiment of the present application provides a display panel 1, including an organic light emitting device 2 and a thin film encapsulation layer 3 disposed on the organic light emitting device 2. The organic light emitting device 2 includes an anode 4, and the display panel 1 includes a frame In area 5, a rough structure 6 is formed on the surface of the anode 4 located in the frame area 5, and the thin film encapsulation layer 3 covers at least part of the rough structure 6.

Specifically, the display panel 1 further includes a display area, the frame area 5 is arranged around the display area, the organic light-emitting device 2 is arranged corresponding to the display area, and the thin film encapsulation layer 3 protects the organic light-emitting device 2, on the one hand, prevents the organic light-emitting device 2 from being exposed to external forces. The effect causes structural damage. On the other hand, it prevents external water and oxygen from entering the display area of the display panel 1 from the side of the frame area 5 of the display panel 1 and affects the performance of the organic light-emitting material in the organic light-emitting device 2.

In this embodiment, a rough structure 6 is formed on the surface of the anode 4 located in the frame area 5 of the display panel 1, and the thin film encapsulation layer 3 covers at least part of the rough structure 6, which effectively enlarges the anode 4 and the thin film encapsulation layer 3. The contact area between the two enhances the adhesion of the contact interface between the two, greatly reduces the probability of film split between the anode 4 and the thin film encapsulation layer 3, and prevents external water and oxygen from the anode 4 and the thin film encapsulation layer 3. The contact interface invades the inside of the display panel 1 and damages the organic light emitting device 2, which improves the use performance of the display panel 1 and prolongs the service life of the display panel 1.

As shown in FIGS. 1 and 2, an embodiment of the present application also provides a display panel 1. The difference from the above embodiment is that the anode 4 includes a first conductive film 7, a metal layer 8, and a second conductive film 9, and the metal layer 8 is covered on the second conductive film 9, the first conductive film 7 is covered on the metal layer 8; the surface of the first conductive film 7 in the frame area 5 is formed with a rough structure 6, and the film encapsulation layer 3 covers at least part of the roughness Structure 6.

In this embodiment, the material of the first conductive film 7 and the second conductive film 9 includes indium tin oxide, and the material of the metal layer 8 includes metallic silver. Of course, the materials of the first conductive film 7, the second conductive film 9 and the metal layer 8 The material is not limited to this. A rough structure 6 is formed on the surface of the first conductive film 7 located in the frame area 5 of the display panel 1, and the film encapsulation layer 3 covers at least part of the rough structure 6, which effectively enlarges the first conductive film 7 and the film of the anode 4 The contact area between the encapsulation layer 3 enhances the adhesion between the two contact interfaces, greatly reduces the probability of film split between the anode 4 and the film encapsulation layer 3, and prevents water and oxygen from the outside from the first conductive film 7 The contact interface with the thin film encapsulation layer 3 invades the inside of the display panel 1 and damages the organic light emitting device 2, which improves the usability of the display panel 1 and prolongs the service life of the display panel 1.

In an embodiment, the surface of the metal layer 8 and the second conductive film 9 in the frame area 5 is also formed with a rough structure 6. In this embodiment, the surface of the metal layer 8 of the anode 4 and the second conductive film 9 located in the frame area 5 are also formed with a rough structure 6, so that the first conductive film 7 and the metal layer 8, the metal layer 8 and the second conductive film The contact area between the films 9 is increased, which enhances the adhesion between the first conductive film 7 and the metal layer 8 and the adhesion between the metal layer 8 and the second conductive film 9, and greatly reduces the first conductive film 7 and the metal layer 8. The probability of film splitting between the metal layer 8 and the second conductive film 9 can prevent water and oxygen from entering the display panel 1 from the contact interface of each film layer in the anode 4, and can also avoid the anode The film layers of 4 are split to cause structural damage to the anode 4, which ensures the normal transmission of internal signals of the display panel 1, improves the performance of the display panel 1, and prolongs the service life of the display panel 1.

In an embodiment, the thin film encapsulation layer 3 includes a first inorganic layer 10, an organic layer 11 and a second inorganic layer 12 sequentially disposed on the organic light emitting device 2, and the first inorganic layer 10 covers at least part of the rough structure 6.

Specifically, the first inorganic layer 10 and the second inorganic layer 12 can be made by chemical vapor deposition, pulsed laser deposition or sputtering deposition processes. The materials of the first inorganic layer 10 and the second inorganic layer 12 include but are not limited to trioxide. Aluminum, titanium dioxide, silicon nitride, silicon carbonitride, silicon dioxide, zirconium dioxide and other inorganic functional materials used to increase the water and oxygen barrier function, the thickness of the first inorganic layer 10 and the second inorganic layer 12 is 0.01 micron Up to 1 micron; the organic layer 11 can be made by inkjet printing technology or deposition process. The material of the organic layer 11 includes, but is not limited to, hexamethyldisiloxane, acrylates, polyacrylates, polycarbonates, poly With materials such as styrene, the organic layer 11 serves as a buffer and can protect the organic light-emitting device 2.

In this embodiment, the first inorganic layer 10 of the thin film encapsulation layer 3 covers at least part of the rough structure 6, which effectively increases the contact area between the anode 4 and the first inorganic layer 10, and enhances the contact interface between the two The adhesion force greatly reduces the probability of film split between the anode 4 and the first inorganic layer 10; because the first inorganic layer 10 functions to prevent water and oxygen from outside the display panel 1 from invading the organic light-emitting device 2, the first inorganic layer 10 The enhanced adhesion between the layer 10 and the anode 4 can further prevent the intrusion of water and oxygen, improve the performance of the display panel 1 and extend the service life of the display panel 1.

In an embodiment, the display panel 1 further includes a plurality of barrier layers 13 arranged on the rough structure 6 at intervals, and the first inorganic layer 10 also covers the plurality of barrier layers 13.

Specifically, a plurality of barrier layers 13 are arranged around the organic light emitting device 2 to prevent water and oxygen from outside from entering the interior of the display panel 1 and affecting the performance of the display panel 1; and the organic layer 11 of the thin film encapsulation layer 3 is also blocked by a plurality of The first inorganic layer 10 covers the multiple barrier layers 13, and the second inorganic layer 12 covers the organic layer 11 and the first inorganic layer 10, preventing the organic layer 11 from overflowing the first inorganic layer 10 and the second inorganic layer. The edges of the inorganic layer 12 ensure the packaging effect of the thin film packaging layer 3.

In this embodiment, the barrier layer 13 is provided on the rough structure 6, which effectively increases the contact area between the barrier layer 13 and the anode 4, enhances the adhesion between the two contact interfaces, and greatly reduces the anode 4 and the barrier layer. The probability of film splitting between 13 strengthens the function of the barrier layer 13 to block water and oxygen from outside.

In an embodiment, as shown in FIGS. 2 to 4, the rough structure 6 includes a plurality of protrusions 14, and a plurality of protrusions 14 on the first conductive film 7 and a plurality of protrusions on the metal layer 8. 14 and the plurality of protrusions 14 on the second conductive film 9 are arranged correspondingly or staggered; or, as shown in FIGS. 5 and 6, the rough structure 6 includes a plurality of grooves 15 and is located on the first conductive film The multiple grooves 15 on the 7, the multiple grooves 15 on the metal layer 8 and the multiple grooves 15 on the second conductive film 9 are arranged correspondingly or staggered.

In this embodiment, the surface of the anode 4 (including the first conductive film 7, the metal layer 8 and the second conductive film 9) may be formed with a plurality of protrusions 14 to form a rough structure 6, or a plurality of grooves 15 to form a rough structure 6. Specifically, the protrusions 14 or the grooves 15 between the layers of the anode 4 can be arranged correspondingly or staggered, which is not limited here. Both the protrusion 14 or the groove 15 can increase the contact area between two adjacent film layers, increase the adhesion of the contact surface, and prevent the two adjacent film layers from splitting.

In one embodiment, as shown in FIGS. 2 to 4, the protrusion 14 includes an arc-shaped protrusion 14 or a square protrusion 14; as shown in FIGS. 5 and 6, the groove 15 includes an arc-shaped groove 15 or a square Groove 15. In this embodiment, the specific shapes of the protrusion 14 and the groove 15 are not limited to the shapes listed in this embodiment.

In one embodiment, the plurality of protrusions 14 or the plurality of grooves 15 are arranged in an array. In this embodiment, the plurality of protrusions 14 are arranged in an array, or the plurality of grooves 15 are arranged in an array, which reduces the manufacturing process difficulty of the rough structure 6 on the basis of increasing the contact area of adjacent film layers. Specifically, the rough structure 6 can be formed through exposure, development and etching processes.

In an embodiment, the display panel 1 further includes a thin film transistor array substrate 16 and a flat layer 17 provided on the thin film transistor (Thin Film Transistor, TFT) array substrate 16. The anode 4 is provided on the flat layer 17; an organic light emitting device 2 It also includes a pixel defining layer 18, a light emitting function layer 19, and a cathode 20 arranged on the pixel defining layer 18 and the light emitting function layer 19 in sequence on the anode 4; the thin film encapsulation layer 3 also covers the cathode 20 and the pixel defining layer 18 on.

In this embodiment, the light-emitting functional layer 19 includes a hole injection layer, a hole transport layer, a light-emitting layer, an electron transport layer, and an electron injection layer, which are sequentially arranged on the anode 4; the light-emitting layer and the cathode 20 are both made by an evaporation process , The thickness of the cathode 20 is within 30 nanometers. The materials of the flat layer 17 and the pixel definition layer 18 are both organic materials. The barrier layer 13 and the pixel definition layer 18 are made of the same material and formed in the same manufacturing process.

In summary, although the application has been disclosed as above in preferred embodiments, the above-mentioned preferred embodiments are not intended to limit the application, and those of ordinary skill in the art can make various decisions without departing from the spirit and scope of the application. Such changes and modifications, so the protection scope of this application is subject to the scope defined by the claims.

Claims

A display panel includes an organic light emitting device and a thin film encapsulation layer disposed on the organic light emitting device; the organic light emitting device includes an anode, the display panel includes a frame area, and the surface of the anode located in the frame area is formed with A rough structure, and the thin film encapsulation layer covers at least a part of the rough structure.
The display panel of claim 1, wherein the anode comprises a first conductive film, a metal layer, and a second conductive film, the metal layer covers the second conductive film, and the first conductive film covers On the metal layer; the surface of the first conductive film located in the frame area is formed with the rough structure, and the film encapsulation layer covers at least part of the rough structure.
3. The display panel of claim 2, wherein the rough structure is formed on the surface of the metal layer and the second conductive film located in the frame area.
The display panel of claim 1, wherein the thin film encapsulation layer comprises a first inorganic layer, an organic layer, and a second inorganic layer sequentially disposed on the organic light-emitting device, and the first inorganic layer covers at least Part of the rough structure.
8. The display panel of claim 4, wherein the display panel further comprises a plurality of barrier layers arranged on the rough structure at intervals, and the first inorganic layer further covers the plurality of barrier layers.
8. The display panel of claim 3, wherein the rough structure comprises a plurality of protrusions, and the plurality of protrusions on the first conductive film, the plurality of protrusions on the metal layer, and the The protrusions on the second conductive film are arranged correspondingly or staggered.
3. The display panel of claim 3, wherein the rough structure comprises a plurality of grooves, and a plurality of grooves on the first conductive film, a plurality of grooves on the metal layer and The multiple grooves on the second conductive film are arranged correspondingly or staggered.
The display panel of claim 1, wherein the rough structure includes a plurality of protrusions or a plurality of grooves.
8. The display panel of claim 8, wherein the protrusion includes an arc-shaped protrusion or a square protrusion; the groove includes an arc-shaped groove or a square groove.
8. The display panel of claim 8, wherein the plurality of protrusions or the plurality of grooves are arranged in an array.
8. The display panel of claim 1, wherein the rough structure is formed by exposure, development and etching processes.
3. The display panel of claim 1, wherein the display panel further comprises a thin film transistor array substrate and a flat layer provided on the thin film transistor array substrate, and the anode is provided on the flat layer;

The organic light-emitting device further includes a pixel defining layer, a light-emitting function layer, and a cathode arranged on the pixel defining layer and the light-emitting function layer sequentially arranged on the anode; the thin film encapsulation layer also covers the cathode And the pixel definition layer.
3. The display panel of claim 2, wherein the material of the first conductive film and the second conductive film includes indium tin oxide, and the material of the metal layer includes metallic silver.
The display panel of claim 4, wherein the materials of the first inorganic layer and the second inorganic layer include aluminum oxide, titanium dioxide, silicon nitride, silicon carbonitride, silicon dioxide, or silicon dioxide. zirconium.
The display panel of claim 4, wherein the material of the organic layer includes hexamethyldisiloxane, acrylic, polyacrylate, polycarbonate, or polystyrene.
A display panel includes an organic light emitting device and a thin film encapsulation layer arranged on the organic light emitting device; the organic light emitting device includes an anode, and the anode includes a first conductive film, a metal layer, and a second conductive film. A metal layer covers the second conductive film, and the first conductive film covers the metal layer;

The display panel includes a frame area, the surfaces of the first conductive film, the metal layer, and the second conductive film located in the frame area are formed with rough structures, and the film encapsulation layer covers at least part of the first conductive film Rough structure.