CN111628112B

CN111628112B - Display panel and display device

Info

Publication number: CN111628112B
Application number: CN202010633659.6A
Authority: CN
Inventors: 张子予; 王涛; 薄赜文
Original assignee: BOE Technology Group Co Ltd
Current assignee: BOE Technology Group Co Ltd
Priority date: 2020-07-02
Filing date: 2020-07-02
Publication date: 2023-04-18
Anticipated expiration: 2040-07-02
Also published as: CN111628112A

Abstract

The embodiment of the application provides a display panel and display equipment. In the display panel provided by the embodiment of the application, the substrate comprises a display area and a peripheral area surrounding the display area, and the base platform layer is arranged on one side of the peripheral area, so that the cofferdam arranged on the base platform layer and the area to be filled with the thin film packaging material surrounded by the cofferdam are raised, and the height difference between the area to be filled with the thin film packaging material and the relevant film layer of the light-emitting device of the display panel is reduced. In the ink-jet printing process, the liquid organic material in the area to be filled with the thin film packaging material surrounded by the cofferdam can be free leveled to form the organic thin film packaging layer with linear thickness variation gradient in the first part of the thin film packaging layer, so that the technical problem that the linearity of the thickness variation gradient of the edge of the organic thin film packaging layer of the packaging thin film is poor is solved.

Description

Display panel and display device

Technical Field

The application relates to the technical field of display equipment, in particular to a display panel and display equipment.

Background

Currently, an Organic Light-Emitting Diode (OLED) display has received wide attention because of its advantages of being Light, thin, wide viewing angle, active Light Emitting, fast in response speed, low in power consumption, low in driving voltage, high in Light Emitting efficiency, flexible in display, and the like. Because the organic light-emitting layer and the electrode of the OLED device in the OLED display panel have extremely poor resistance to water vapor and oxygen, the organic light-emitting layer and the electrode are easy to react with the permeated water vapor and oxygen, and the performance of the OLED device is rapidly deteriorated. Therefore, the OLED device needs to be isolated from the outside by the encapsulation film, so as to prevent external moisture, oxygen, and the like from entering the OLED device.

At present, an encapsulation film is composed of an inorganic film encapsulation layer, an organic film encapsulation layer and an inorganic film encapsulation layer which are stacked, and an OLED device is encapsulated inside the encapsulation film to achieve the purposes of water resistance and oxygen resistance, so that the OLED device is protected. The organic film packaging layer is mostly manufactured by adopting an ink-jet printing technology, and the periphery of the organic film packaging layer is blocked by a preset cofferdam to overflow outwards.

However, in the ink-jet printing process, the liquid organic material is free to flow flatly on the panel, and the actual stop position of the liquid organic material at the edge of the panel can be different, so that the organic thin film packaging layer close to the cofferdam is thinner, the organic thin film packaging layers at other positions are thicker, namely, the thickness variation gradient at the edge of the organic thin film packaging layer has poorer linearity and larger section difference, and the problem of short circuit at the edge of the organic thin film packaging layer caused by conductive routing is easily solved.

Disclosure of Invention

The application aims at the defects of the prior art and provides a display panel and display equipment, which are used for solving the technical problem that the linearity of the thickness variation gradient of the edge of an organic thin film packaging layer of a packaging thin film is poor in the prior art.

In a first aspect, an embodiment of the present application provides a display panel, including:

the display device comprises a substrate, a first electrode and a second electrode, wherein the substrate comprises a display area and a peripheral area surrounding the display area;

the base platform layer is arranged on one side of the peripheral area;

a thin film encapsulation layer comprising a first portion and a second portion; the first part comprises organic film packaging layers clamped between inorganic film packaging layers; the first part sequentially covers one side, far away from the substrate, of the light-emitting device related film layer of the display panel and one side, far away from the substrate, of the inner side part of the substrate layer in the direction from inside to outside; the second part comprises a plurality of inorganic thin film packaging layers;

the cofferdam is arranged on one side of the base platform layer far away from the base plate, and the cofferdam surrounds the periphery of the first part; the second portion of the thin film encapsulation layer covers the dam.

In a second aspect, an embodiment of the present application provides a display device, including the display panel provided in the first aspect.

The beneficial technical effects brought by the technical scheme provided by the embodiment of the application comprise:

in the display panel provided by the embodiment of the application, the substrate comprises a display area and a peripheral area surrounding the display area, and the base platform layer is arranged on one side of the peripheral area, so that the cofferdam arranged on the base platform layer and the area to be filled with the thin film packaging material surrounded by the cofferdam are raised, and the height difference between the area to be filled with the thin film packaging material and the relevant film layer of the light-emitting device of the display panel is reduced. In the ink-jet printing process, the liquid organic material in the area to be filled with the thin film packaging material surrounded by the cofferdam can be freely leveled to form the organic thin film packaging layer with linear thickness change gradient in the first part of the thin film packaging layer, and the technical problem that the linearity of the thickness change gradient of the edge of the organic thin film packaging layer of the packaging thin film is poor is solved.

Additional aspects and advantages of the present application will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the present application.

Drawings

The above and/or additional aspects and advantages of the present application will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:

fig. 1 is a schematic structural diagram of a display panel according to an embodiment of the present disclosure;

fig. 2 is a schematic cross-sectional view of a display panel at a position a in the display panel provided in fig. 1 of the present application;

fig. 3 is a schematic cross-sectional view of a display panel shown at B in fig. 1 according to an embodiment of the present disclosure.

The reference numerals are explained as follows:

100-a substrate;

101-a substrate layer;

110 a first portion of a thin film encapsulation layer; 120-a second portion of the thin film encapsulation layer; 111-a first inorganic thin film encapsulation layer; 112-organic thin film encapsulation layer; 113-a second inorganic thin film encapsulation layer;

130-cofferdam; 131-a first cofferdam; 132-a second cofferdam;

140-an inorganic layer; 150-a touch layer;

160-a first conductive layer; 170 — a second conductive layer; 180-a third conductive layer;

190-a fourth conductive layer;

102-source drain layer; 103-a planar layer; 104-an anode layer; 105-a pixel definition layer; 106-support column; 107-OLED light emitting layer; 108-cathode layer.

Detailed Description

The present application is described in detail below and examples of embodiments of the present application are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements with the same or similar functionality throughout. In addition, if a detailed description of the known art is not necessary for illustrating the features of the present application, it is omitted. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present application and are not to be construed as limiting the present application.

It will be understood by those within the art that, unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the prior art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.

As used herein, the singular forms "a", "an", "the" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises" and/or "comprising," when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof. As used herein, the term "and/or" includes all or any element and all combinations of one or more of the associated listed items.

The terms referred to in this application will first be introduced and explained:

the inventor of the application researches and discovers that the existing film packaging structure of the flexible OLED is formed by wrapping two inorganic layers with water resistance by organic layers, the organic layers play roles in flattening interfaces, wrapping defects and stress release, and the boundary of the organic layers in the film packaging structure needs to be wrapped in the inorganic layers. In the existing preparation process of the thin film packaging structure, an ink-jet printing technology is mostly adopted to process an organic layer, and a cofferdam is arranged to prevent the material forming the organic layer from overflowing outwards.

However, in the process of manufacturing the organic layer by the inkjet printing technology, the liquid organic material is free to level on the panel, and is affected by local wettability of the surface of the display panel and fluctuation of liquid surface tension, and a certain gap exists between the position where the liquid organic material is actually stopped and the cofferdam, so that the edge linearity of the organic layer is poor. Therefore, the area which is not filled and covered by the organic material between the cofferdam and the relevant film layer of the luminescent device of the display panel can not be protected, meanwhile, the area, the cofferdam and the organic layer on two sides have larger gradient and section difference, in the subsequent working procedure, the difficulty of the preparation process of the display panel is improved, and the condition of short circuit in the area is easily caused, thereby reducing the production efficiency and increasing the production cost.

The application provides a display panel and display device, aims at solving the above technical problem of the prior art.

The following describes the technical solution of the present application and how to solve the above technical problems in detail by specific embodiments.

The embodiment of the present application provides a display panel, and a schematic structural diagram of the display panel is shown in fig. 1 and fig. 2, and includes: a substrate 100, the substrate 100 including a display area and a peripheral area surrounding the display area; a base layer 101 disposed on one side of the peripheral region; a thin film encapsulation layer comprising a first portion 110 and a second portion 120; the first portion 110 includes an organic thin film encapsulation layer 112 sandwiched between inorganic thin film encapsulation layers; the first portion 110 sequentially covers, in an inside-out direction, a side of the light-emitting device-related film layer of the display panel away from the substrate 100 and a side of the inner portion of the base layer 101 away from the substrate 100; the second portion 120 includes several inorganic thin film encapsulation layers; a dam 130 disposed on a side of the substrate layer 101 away from the substrate 100, wherein the dam 130 surrounds the first portion 110; a second portion 120 of the thin film encapsulation layer covers the dam 130.

Specifically, the cross-sectional structure at a shown in fig. 2 is a structural schematic diagram of a non-Pad area of a display panel, in the display panel provided in the embodiment of the present application, the substrate 100 includes a display area and a peripheral area surrounding the display area, and the peripheral area is used for setting an encapsulation structure of the display panel; a base layer 101 is disposed on one side of the peripheral region of the substrate 100, and a dam 130 is disposed on one side of the base layer 101 away from the substrate 100. The substrate 100, the base layer 101 and the cofferdam 130 are covered by a thin film encapsulation layer, and a first part 110 of the thin film encapsulation layer sequentially covers one side of the luminescent device related film layer of the display panel far away from the substrate 100 and one side of the inner part of the base layer 101 far away from the substrate 100 in the inside-out direction; the second portion 120 of the thin-film encapsulation layer covers the dam 130 and a first area of the substrate layer 101, which here refers to the area of the side of the substrate layer 101 remote from the substrate 100 that is not covered by the first portion 110 of the thin-film encapsulation layer.

In the display panel provided in the embodiment of the present application, the first portion 110 of the film encapsulation layer includes an organic film encapsulation layer 112 sandwiched between inorganic film encapsulation layers, and the second portion 120 of the film encapsulation layer includes a plurality of inorganic film encapsulation layers. By arranging the base layer 101 in the peripheral area of the substrate 100 and arranging the cofferdam 130 on the base layer 101, the height difference between the area inside the cofferdam 130 and the relevant film layers of the light-emitting device arranged in the display area is obviously reduced, so that in the process of ink-jet printing the organic film packaging layer 112, the liquid organic material in the area inside the cofferdam 130 can be free to level and free from the influence of the local wettability of the panel surface and the fluctuation of the liquid surface tension, and the technical problem of poor edge linearity of the organic material layer of the packaging film is solved. The inner region of the bank 130 referred to herein means a region between the bank 130 and a layer related to the light emitting device.

Optionally, in the display panel provided in this embodiment of the present application, the base layer 101 is made by using a photolithography process, the manufacturing material is an organic material, and overflow of the liquid organic material is better prevented by providing the base layer 101 and the bank 130.

In the embodiment of the present application, the position of the display area in the display panel is defined as inner, and the other areas of the display panel are defined as outer.

In one embodiment of the present application, the display panel further includes: an inorganic layer 140, wherein in the direction from the outside to the inside of the display panel, the inorganic layer 140 sequentially covers the outer edge region in the peripheral region of the substrate 100 and the outer end face of the outer portion of the base layer 101, and the innermost end of the inorganic layer 140 is sandwiched between the outer portion of the base layer 101 and the second portion 120 of the thin film encapsulation layer; the inorganic thin film encapsulation layer of the second portion 120 of the thin film encapsulation layer is disposed between the inorganic layer 140 and the bank 130.

In the display panel provided in the embodiment of the present application, the inorganic layer 140 sequentially covers the outer edge region in the peripheral region of the substrate 100 and the outer end surface of the outer portion of the base layer 101. It should be noted that, the outer edge area in the peripheral area described herein refers to an area between the outer side of the substrate layer 101 and the substrate 100, and the area that covers the second portion 120 of the substrate layer 101 that is not encapsulated by the thin film is realized by the inorganic layer 140, so that the complete encapsulation of the substrate layer 101 is realized; meanwhile, the innermost end of the inorganic layer 140 is clamped between the outer side part of the base layer 101 and the second part 120 of the film packaging layer, and the inorganic layer 140 is partially overlapped with the second part 120 of the film packaging layer, so that the inorganic layer 140 and the second part 120 of the film packaging layer can completely cover the base layer 101 and the cofferdam 130 arranged on the base layer 101, the packaging effect of the display panel is guaranteed, and the phenomenon that external water vapor, oxygen and the like enter the display panel to influence the service life of the display panel is avoided.

Optionally, in an embodiment of the present application, the inorganic layer 140 is sandwiched between the outer portion of the base layer 101 and the second portion 120 of the thin film encapsulation layer in an outside-in direction by a length greater than 50 micrometers. By setting the length of the overlapped part of the inorganic layer 140 and the second part 120 of the film packaging layer to be more than 50 μm (micrometer), the inorganic layer 140 and the second part 120 of the film packaging layer can be further ensured to completely cover the base layer 101 and the cofferdam 130 arranged on the base layer 101, the packaging effect of the display panel is further ensured, and external water vapor, oxygen and the like are prevented from entering the display panel, so that the service life of the display panel is prolonged.

In one embodiment of the present application, the thickness of the submount layer 101 matches the total thickness of the light emitting device related film layers disposed on the side of the display area.

By defining the thickness of the substrate layer 101 to be matched with the total thickness of the relevant film layers of the light-emitting device, the height difference between the area inside the cofferdam 130 and the relevant film layers of the light-emitting device can be further ensured to be reduced as much as possible, so that in the process of printing the organic thin film packaging layer 112 by ink jet, the liquid organic material in the area inside the cofferdam 130 can be free to level, the influence of the local wettability of the surface of the panel and the fluctuation of the liquid surface tension is avoided, and the problem of poor edge linearity of the organic material layer of the packaging thin film is solved. In the embodiment of the present application, the thickness of the base layer 101 refers to a distance from one side close to the substrate 100 to the other side far from the substrate 100 of the base layer 101.

Optionally, in one embodiment of the present application, the thickness of the substrate layer 101 is 3-8 microns. The thickness of the base layer 101 is definitely defined to provide specific quantitative values for the production of the display panel, so that the production efficiency of the display panel is improved. In the embodiment of the present application, the thickness of the substrate layer 101 includes the end values of 3 μm and 8 μm.

In one embodiment of the present application, the first portion 110 of the thin film encapsulation layer includes a first inorganic thin film encapsulation layer 111, an organic thin film encapsulation layer 112, and a second inorganic thin film encapsulation layer 113, which are stacked; the second portion 120 of the thin film encapsulation layer includes a first inorganic thin film encapsulation layer 111 and a second inorganic thin film encapsulation layer 113 that are stacked; the first inorganic encapsulation layer 111 covers the light-emitting device related film layer, the base layer 101, the dam 130 and at least a part of the inorganic layer 140, the organic thin film encapsulation layer 112 is located in the enclosure region formed by the dam 130, and the second inorganic encapsulation layer 113 covers the organic thin film encapsulation layer 112 and the first inorganic encapsulation layer 111.

It is understood by those skilled in the art that, in the embodiment of the present application, only for convenience of describing the structure of the display panel, the film encapsulation layer is divided into the first portion 110 and the second portion 120, and in the actual production process, the first inorganic film encapsulation layer 111, the organic film encapsulation layer 112, and the second inorganic film encapsulation layer 113 are sequentially prepared to form the film encapsulation layer, and the organic film encapsulation layer 112 is ensured to be sandwiched between the first inorganic film encapsulation layer 111 and the organic film encapsulation layer 112, so as to ensure that the organic film encapsulation layer 112 does not contact with external gases such as water, oxygen, and the like. Alternatively, the first inorganic thin film encapsulation layer 111 and the organic thin film encapsulation layer 112 may be formed by a vapor Deposition process such as CVD (Chemical vapor Deposition), ALD (atomic layer Deposition), and the like, and the organic thin film encapsulation layer 112 may be formed by a liquid curing process such as inkjet printing, screen printing, and the like.

In addition, the skilled person understands that the number of the inorganic thin film encapsulation layers is not limited to two layers in the embodiment of the present application, and the skilled person can determine the number of the inorganic thin film encapsulation layers according to the actual requirement and the actual production process.

In one embodiment of the present application, the side of the second inorganic thin film encapsulation layer 113 away from the substrate 100 is provided with a touch layer 150.

In the embodiment of the application, the touch layer 150 realizes the touch function of the display panel by arranging the touch layer 150, and meanwhile, the base platform layer 101 plays a role of better preventing the overflow of the liquid organic material, so that the height difference between the area inside the cofferdam 130 and the relevant film layer of the light-emitting device arranged in the display area is obviously reduced, and the problem of exposure over depth of field caused by the overlarge height difference of the area is prevented in the subsequent On Cell process. The On Cell process is a process for embedding a touch panel between a color filter substrate and a polarizer of a display panel. In the direction from inside to outside, the touch layer 150 extends to the outer edge of the side of the base layer 101 away from the substrate 100, and by arranging the base layer 101, the touch layer 150 is extended to the outer edge of the base layer 101, so that the length of the touch layer 150 is extended, and thus, higher-density touch layer 150 routing can be arranged on the display panel or the purpose of reducing impedance can be achieved. Optionally, in this embodiment of the application, the length of the touch layer 150 may be up to 300-500um, and it is understood that the length of the touch layer 150 may include 300um and 500um.

In one embodiment of the present application, a side of the base layer 101 away from the substrate 100 is provided with a first conductive layer 160, and an outer end portion of the first conductive layer 160 is within the range of the dam 130; a second conductive layer 170 is arranged on one side, away from the substrate layer 101, of the first conductive layer 160; the second conductive layer 170 is provided with a third conductive layer 180 on a side away from the base layer 101. In the embodiment of the present application, the first conductive layer 160 plays a role of providing a power supply for a source of a CMOS (Complementary Metal Oxide Semiconductor) device, and the first conductive layer 160 may be manufactured by a photolithography process.

Optionally, the outer end of first conductive layer 160 and the outer end of second conductive layer 170 are separated by a dam 130; the third conductive layer 180 at least partially covers a side of the second conductive layer 170 away from the substrate 100.

In one embodiment of the present application, the display panel further includes: as shown in fig. 2, the fourth conductive layer 190 sequentially covers the outer edge region of the inorganic layer 140 and the outer end surface of the inorganic layer 140 in the outward-inward direction, the innermost end of the fourth conductive layer 190 is sandwiched between the inorganic layer 140 and the touch layer 150, and the fourth conductive layer 190 is connected to the touch layer 150.

It should be noted that the cross-sectional structure at B shown in fig. 3 is a structural schematic diagram of a Pad region of the display panel, where the Pad region refers to a routing layout region of the display panel, and a Flexible Printed Circuit (FPC), a display driver (Drive IC), and the like are required to be connected with the routing of the Pad region in the subsequent binding process.

As shown in fig. 3, the Pad region and the non-Pad region of the display panel are different mainly in the film structures disposed on the side of the substrate layer 101 away from the substrate 100. Specifically, in the embodiment of the present application, a bank 130 is disposed on a side of the base layer 101 away from the substrate 100. The substrate 100, the base layer 101 and the cofferdam 130 are covered by a thin film encapsulation layer, and a first part 110 of the thin film encapsulation layer sequentially covers one side of the luminescent device related film layer of the display panel far away from the substrate 100 and one side of the inner part of the base layer 101 far away from the substrate 100 in the inside-out direction; the second portion 120 of the thin-film encapsulation layer covers the dam 130 and a first area of the substrate layer 101, where the first area refers to an area of the side of the substrate layer 101 remote from the substrate 100 that is not covered by the first portion 110 of the thin-film encapsulation layer.

The inorganic layer 140 covers the outer edge region in the peripheral region of the substrate 100, and the outer end face of the outer portion of the submount layer 101 in this order. It should be noted that, the outer edge area in the peripheral area described herein refers to an area between the outer side of the substrate layer 101 and the substrate 100, and the area that covers the second portion 120 of the substrate layer 101 that is not encapsulated by the thin film is realized by the inorganic layer 140, so that the complete encapsulation of the substrate layer 101 is realized; meanwhile, the innermost end of the inorganic layer 140 is clamped between the outer side part of the base layer 101 and the second part 120 of the film packaging layer, and the inorganic layer 140 is partially overlapped with the second part 120 of the film packaging layer, so that the inorganic layer 140 and the second part 120 of the film packaging layer can completely cover the base layer 101 and the cofferdam 130 arranged on the base layer 101, the packaging effect of the display panel is guaranteed, and the phenomenon that external water vapor, oxygen and the like enter the display panel to influence the service life of the display panel is avoided.

Optionally, in an embodiment of the present application, the inorganic layer 140 is sandwiched between the outer portion of the base layer 101 and the second portion 120 of the thin film encapsulation layer in an outside-in direction by a length greater than 50 micrometers. By setting the length of the overlapped part of the inorganic layer 140 and the second part 120 of the film packaging layer to be more than 50 μm, the inorganic layer 140 and the second part 120 of the film packaging layer can be further ensured to completely cover the base layer 101 and the cofferdam 130 arranged on the base layer 101, the packaging effect of the display panel is further ensured, and external water vapor, oxygen and the like are prevented from entering the display panel, so that the service life of the display panel is prolonged. Meanwhile, the inner end portion of the inorganic layer 140 is close to the dam 130 but does not contact the dam 130, so that sufficient space is left for the submount layer 101 to discharge moisture in time during baking in production.

In the Pad region of the display panel provided in the embodiment of the present application, the first conductive layer 160, the second conductive layer 170, and the third conductive layer 180 are not disposed on the base layer 101 away from the substrate 100, but a fourth conductive layer 190 is disposed on the inorganic layer 140, as shown in fig. 3, in the direction from the outside to the inside, the fourth conductive layer 190 sequentially covers the outer edge region of the inorganic layer 140 and the outer end surface of the inorganic layer 140, and the innermost end of the fourth conductive layer 190 is sandwiched between the inorganic layer 140 and the touch layer 150; moreover, the fourth conductive layer 190 is connected to the touch layer 150 to output a touch signal of the touch layer 150. Meanwhile, in order to prevent the over-etching problem from occurring in the subsequent production process of the display panel, the end portion of the innermost end of the fourth conductive layer 190 is covered with a blocking layer, and the blocking layer also plays a role in limiting the overlapping area of the fourth conductive layer 190 and the touch layer 150 and stabilizing the contact resistance.

In the embodiment of the application, the height difference between the inner side area of the cofferdam 130 and the film layer related to the light-emitting device is obviously reduced by arranging the base platform layer 101, so that multiple exposures are not required in the subsequent On Cell process, the exposure operation flow in the manufacturing process is simplified, the problem of exposure super-depth of field caused by the overlarge height difference of the area is prevented, and the reliability of the panel production process is improved. The touch layer 150 extends to the outer edge of the side of the base layer 101 away from the substrate 100, the touch layer 150 can be extended to the outer edge of the base layer 101 by arranging the base layer 101, the length of the touch layer 150 is extended, and therefore higher-density touch layer 150 routing can be arranged on the display panel or the purpose of reducing impedance can be achieved.

In one embodiment of the present application, cofferdam 130 includes a first cofferdam 131 and a second cofferdam 132; a first dam 131 surrounds and is attached to the periphery of the first portion 110 of the film encapsulation layer, and a second dam 132 is disposed around the first dam 131. In the embodiment of the present application, by providing the first cofferdam 131 and the second cofferdam 132, the purpose of better preventing the overflow of the liquid organic material can be achieved, so as to improve the production efficiency.

The substrate 100 in the embodiment of the present invention includes a flexible substrate 100 or a rigid substrate 100, and an active layer, a gate electrode layer, a gate insulating layer, an interlayer dielectric layer, and the like are disposed on the substrate 100. As shown in fig. 1 and 2, the substrate 100 further includes a light-emitting device related film layer disposed on an inner side of the base layer 101, and specifically includes: the organic light emitting diode display device includes a source drain layer 102, a planarization layer 103, an anode layer 104, a pixel definition layer 105, a support pillar 106, an OLED light emitting layer 107, and a cathode layer 108, which are sequentially disposed from bottom to top on one side of a substrate 100.

It should be noted that, in the process of manufacturing the display panel, the first conductive layer 160 and the source drain layer 102 may be manufactured at the same time, and are made of a metal conductive material; the second conductive layer 170 and the anode layer 104 can be prepared simultaneously, and are made of metal materials or semiconductor materials such as ITO (indium tin oxide); the third conductive layer 180 and the cathode layer 108 may be prepared simultaneously; the flat layer 103, the pixel definition layer 105 and the support pillars 106 are all made of organic materials by a photolithography process, the bank 130 and the flat layer 103, the pixel definition layer 105 or the support pillars 106 can be prepared simultaneously, and the first bank 131 and the second bank 132 of the bank 130 are prepared by any one or more of the flat layer 103, the pixel definition layer 105 and the support pillars 106; the material for forming the substrate layer 101 may be the same as the material for forming the planarization layer 103, the pixel defining layer 105, or the support posts 106.

Meanwhile, in the process of manufacturing the display panel shown in fig. 2, the fourth conductive layer 190 and the source/drain layer 102 may be manufactured at the same time, and both are made of a metal conductive material; the barrier layer and the flat layer 103 can be prepared simultaneously and are prepared by the same organic material, so that the preparation of the barrier layer is completed while the flat layer 103 is prepared, and the manufacturing process is simplified.

Based on the same inventive concept, embodiments of the present application provide a display device including the display panel provided in the above embodiments.

By applying the embodiment of the application, at least the following beneficial effects can be realized:

1. in the display panel provided by the embodiment of the application, the substrate comprises the display area and the peripheral area surrounding the display area, and the base platform layer is arranged on one side of the peripheral area, so that the cofferdam arranged on the base platform layer and the area to be filled with the thin film packaging material surrounded by the cofferdam are raised, and the height difference between the area to be filled with the thin film packaging material and the relevant film layer of the light-emitting device of the display panel is reduced. In the ink-jet printing process, the liquid organic material in the area to be filled with the thin film packaging material surrounded by the cofferdam can be free leveled to form the organic thin film packaging layer with linear thickness variation gradient in the first part of the thin film packaging layer, so that the technical problem that the linearity of the thickness variation gradient of the edge of the organic thin film packaging layer of the packaging thin film is poor is solved.

2. In the display panel provided by the embodiment of the application, the height difference between the area inside the cofferdam 130 and the relevant film layer of the light-emitting device arranged in the display area is obviously reduced by arranging the base layer 101, so that the problem of exposure over depth of field caused by the overlarge height difference of the area is prevented in the subsequent On Cell process.

3. In the display panel provided by the embodiment of the application, in the direction from inside to outside, the touch layer 150 extends to the outer edge of the side, away from the substrate 100, of the base layer 101, and by providing the base layer 101, the touch layer 150 is extended to the outer edge of the base layer 101, so that the length of the touch layer 150 is extended, and thus, the touch layer 150 with higher density can be arranged on the display panel for routing or achieving the purpose of reducing impedance.

Those of skill in the art will appreciate that the various operations, methods, steps in the processes, acts, or solutions discussed in this application can be interchanged, modified, combined, or eliminated. Further, other steps, measures, or schemes in various operations, methods, or flows that have been discussed in this application can be alternated, altered, rearranged, broken down, combined, or deleted. Further, the steps, measures, and schemes in the various operations, methods, and flows disclosed in the present application in the prior art can also be alternated, modified, rearranged, decomposed, combined, or deleted.

In the description of the present application, it is to be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience in describing the present application and simplifying the description, but do not indicate or imply that the referred device or element must have a particular orientation, be constructed in a particular orientation, and be operated, and thus should not be construed as limiting the present application.

The terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or to implicitly indicate the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present application, "a plurality" means two or more unless otherwise specified.

In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood in a specific case by those of ordinary skill in the art.

In the description herein, particular features, structures, materials, or characteristics may be combined in any suitable manner in any one or more embodiments or examples.

It should be understood that, although the steps in the flowcharts of the figures are shown in order as indicated by the arrows, the steps are not necessarily performed in order as indicated by the arrows. The steps are not performed in the exact order shown and may be performed in other orders unless explicitly stated herein. Moreover, at least a portion of the steps in the flow chart of the figure may include multiple sub-steps or multiple stages, which are not necessarily performed at the same time, but may be performed at different times, which are not necessarily performed in sequence, but may be performed alternately or alternately with other steps or at least a portion of the sub-steps or stages of other steps.

The foregoing is only a partial embodiment of the present application, and it should be noted that, for those skilled in the art, several modifications and decorations can be made without departing from the principle of the present application, and these modifications and decorations should also be regarded as the protection scope of the present application.

Claims

1. A display panel, comprising:

a substrate including a display area and a peripheral area surrounding the display area;

the base platform layer is arranged on one side of the peripheral area;

a thin film encapsulation layer comprising a first portion and a second portion connected; the first part covers one side, far away from the substrate, of a light-emitting device related film layer of the display panel and one side, far away from the substrate, of an inner side part of the substrate layer in sequence in the inward and outward direction; the first part comprises a first inorganic thin film packaging layer, an organic thin film packaging layer and a second inorganic thin film packaging layer which are arranged in a stacked mode; the second portion comprises the first and second inorganic thin film encapsulation layers stacked;

the cofferdam is arranged on one side of the base platform layer, which is far away from the base plate, and the cofferdam surrounds the periphery of the first part; said second portion of said thin film encapsulation layer covering said dam;

an inorganic layer, which sequentially covers an outer edge area in the peripheral area of the substrate and an outer end face of an outer portion of the mesa layer in an outside-in direction, wherein an innermost end of the inorganic layer is sandwiched between the outer portion of the mesa layer and the second portion of the thin film encapsulation layer, and a gap is formed between the innermost end of the inorganic layer and the dam; the second part of inorganic thin film packaging layer is arranged between the inorganic layer and the cofferdam; the first inorganic thin film packaging layer covers the relevant film layer of the light-emitting device, the base layer, the cofferdam and at least part of the inorganic layer, the organic thin film packaging layer is positioned in a blocking area formed by the cofferdam, and the second inorganic thin film packaging layer covers the organic thin film packaging layer and the first inorganic thin film packaging layer.

2. The display panel according to claim 1, wherein the inorganic layer is sandwiched between the outer portion of the substrate layer and the second portion over a length of more than 50 μm in an outside-in direction.

3. The display panel of claim 1, wherein the thickness of the substrate layer matches the total thickness of the light emitting device related film layers disposed on one side of the display area.

4. The display panel of claim 3, wherein the thickness of the substrate layer is 3-8 microns.

5. The display panel according to claim 1, wherein a touch layer is disposed on a side of the second inorganic thin film encapsulation layer facing away from the substrate.

6. The display panel according to claim 1, wherein a first conductive layer is disposed on a side of the substrate layer away from the substrate, and an outer end portion of the first conductive layer is within the range of the dam;

a second conducting layer is arranged on one side, away from the base layer, of the first conducting layer;

and a third conducting layer is arranged on one side, far away from the base platform layer, of the second conducting layer.

7. The display panel of claim 6, comprising at least one of:

the outer end part of the first conducting layer and the outer end part of the second conducting layer are separated by the cofferdam;

the third conducting layer at least partially covers one side of the second conducting layer far away from the substrate.

8. The display panel according to claim 1, characterized by further comprising:

a fourth conductive layer which covers an outer edge region of the inorganic layer and an outer end surface of the inorganic layer in this order in an outside-in direction, and an innermost end of the fourth conductive layer is sandwiched between the inorganic layer and the touch layer;

the fourth conductive layer is connected with the touch layer.

9. The display panel of claim 1, wherein the bank comprises a first bank and a second bank;

the first cofferdam surrounds and is connected to the periphery of the first part, and the second cofferdam surrounds the first cofferdam.

10. A display device characterized by comprising the display panel according to any one of claims 1 to 9.