CN114551753A - Display panel and preparation method thereof - Google Patents
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- CN114551753A CN114551753A CN202210116396.0A CN202210116396A CN114551753A CN 114551753 A CN114551753 A CN 114551753A CN 202210116396 A CN202210116396 A CN 202210116396A CN 114551753 A CN114551753 A CN 114551753A
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- 238000002360 preparation method Methods 0.000 title abstract description 6
- 238000004806 packaging method and process Methods 0.000 claims abstract description 67
- 230000002093 peripheral effect Effects 0.000 claims abstract description 51
- 238000005538 encapsulation Methods 0.000 claims description 130
- 239000011368 organic material Substances 0.000 claims description 19
- 239000007788 liquid Substances 0.000 claims description 18
- 239000000758 substrate Substances 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 claims description 5
- 238000000034 method Methods 0.000 claims description 4
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 3
- 239000003822 epoxy resin Substances 0.000 claims description 3
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 3
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 claims description 3
- 229920000647 polyepoxide Polymers 0.000 claims description 3
- 229910052710 silicon Inorganic materials 0.000 claims description 3
- 239000010703 silicon Substances 0.000 claims description 3
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 3
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 3
- 229910001928 zirconium oxide Inorganic materials 0.000 claims description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 2
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 claims 1
- 239000010408 film Substances 0.000 description 9
- 238000010586 diagram Methods 0.000 description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 7
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 description 4
- 230000009545 invasion Effects 0.000 description 4
- 239000001301 oxygen Substances 0.000 description 4
- 229910052760 oxygen Inorganic materials 0.000 description 4
- 239000012535 impurity Substances 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- -1 acryl Chemical group 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
- H10K50/8445—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
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- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
The application discloses a display panel and a preparation method thereof, wherein the display panel is divided into a display area and a peripheral area surrounding the display area; the display area comprises a light-emitting device, the peripheral area comprises a retaining wall, and the display area and the peripheral area further comprise packaging structures covering the retaining wall and the light-emitting device; the packaging structure comprises a first inorganic packaging layer, a first organic packaging layer, a second inorganic packaging layer, a second organic packaging layer and a third inorganic packaging layer which are arranged in a stacked mode; the minimum distance between the first organic packaging layer and the retaining wall is larger than the minimum distance between the second organic packaging layer and the retaining wall. The overflow of the organic packaging layer can be reduced, the thickness of the organic packaging layer at the edge of the display panel can be effectively ensured, and the reliability and yield of the display panel are improved.
Description
Technical Field
The present disclosure relates to display technologies, and in particular, to a display panel and a manufacturing method thereof.
Background
OLED (Organic Light Emitting Diode) displays are increasingly used in the field of high performance displays due to their characteristics of self-luminescence, high response speed, wide viewing angle, and being capable of being fabricated on flexible substrates.
However, OLED devices are sensitive to water/oxygen and require efficient encapsulation to isolate water/oxygen, and Thin Film Encapsulation (TFE) technology is currently used to efficiently encapsulate OLEDs. The film package can effectively prevent the invasion of water/oxygen through the design of an inorganic/organic laminated structure, wherein the inorganic film layer is used for preventing the water/oxygen, and the organic film layer is used for prolonging the channel of water vapor invasion and reducing the defects of the inorganic film layer. The organic film layer is prepared by printing, leveling and curing, and the organic film layer has poor barrier property and is easy to overflow out of the inorganic film layer to form a water vapor invasion channel, so that the problem of packaging failure is caused.
Therefore, improvement is urgently needed to overcome the defects in the prior art.
Disclosure of Invention
The application aims to provide a display panel and a preparation method thereof, and the display panel and the preparation method are used for solving the problem that an organic film layer is easy to overflow to the outside of an inorganic film layer to form a water vapor invasion channel, so that packaging failure is caused.
The embodiment of the application provides a display panel, which is divided into a display area and a peripheral area surrounding the display area; the display area comprises a light-emitting device, the peripheral area comprises a retaining wall, and the display area and the peripheral area further comprise packaging structures covering the retaining wall and the light-emitting device; the packaging structure comprises a first inorganic packaging layer, a first organic packaging layer, a second inorganic packaging layer, a second organic packaging layer and a third inorganic packaging layer which are stacked; the first inorganic encapsulation layer, the second inorganic encapsulation layer and the third inorganic encapsulation layer respectively cover the display area and the peripheral area; the first organic packaging layer and the second organic packaging layer respectively cover the display area and at least part of the peripheral area; wherein the minimum distance between the first organic packaging layer and the retaining wall is greater than the minimum distance between the second organic packaging layer and the retaining wall.
Optionally, in some embodiments of the present application, the first organic encapsulation layer is divided into a first printing region and a first leveling region surrounding the first printing region; the second organic encapsulation layer is divided into a second printing area and a second leveling area surrounding the second printing area; wherein the minimum distance between the first leveling zone and the retaining wall is greater than the minimum distance between the second leveling zone and the retaining wall.
Optionally, in some embodiments of the present application, a minimum distance between the first leveling area and the retaining wall is greater than a minimum distance between the second printing area and the retaining wall.
Optionally, in some embodiments of the present application, a minimum distance between the first printing region and the retaining wall is between 300 μm and 400 μm; the minimum distance between the first leveling area and the retaining wall is between 100 and 200 mu m.
Optionally, in some embodiments of the present application, a minimum distance between the second printing region and the retaining wall is between 100 μm and 200 μm; the minimum distance between the second leveling area and the retaining wall is 0-100 mu m.
Optionally, in some embodiments of the present application, the height of the retaining wall is greater than the thickness of the first organic encapsulation layer and/or the second organic encapsulation layer.
Optionally, in some embodiments of the present application, the peripheral region further includes a front retaining wall, and the front retaining wall is disposed on one side of the retaining wall close to the display region; the height of the front retaining wall is smaller than that of the retaining wall, and the second organic packaging layer covers the front retaining wall.
Optionally, in some embodiments of the present application, the material of the first inorganic encapsulation layer, the second inorganic encapsulation layer, and the third inorganic encapsulation layer includes at least one of silicon oxide, silicon nitride, silicon oxynitride, aluminum oxide, and zirconium oxide; the material of the first organic packaging layer and the second organic packaging layer comprises at least one of epoxy resin and acrylic.
Correspondingly, the application also provides a preparation method of the display panel, which comprises the following steps:
step S1: providing a substrate, and forming a light-emitting device and a retaining wall on the substrate; the display panel is divided into a display area and a peripheral area surrounding the display area, the light-emitting device is located in the display area, and the retaining wall is located in the peripheral area;
step S2: forming a first inorganic encapsulation layer covering the display area and the peripheral area;
step S3: forming a first organic encapsulation layer covering the display area and at least part of the peripheral area on the first inorganic encapsulation layer, wherein the first organic encapsulation layer and the retaining wall have a distance therebetween;
step S4: forming a second inorganic encapsulation layer covering the display area and the peripheral area over the first organic encapsulation layer;
step S5: forming a second organic encapsulation layer covering the display area and at least part of the peripheral area on the second inorganic encapsulation layer, wherein the second organic encapsulation layer has a distance from the retaining wall, and the minimum distance between the first organic encapsulation layer and the retaining wall is greater than the minimum distance between the second organic encapsulation layer and the retaining wall;
step S6: forming a third inorganic encapsulation layer covering the display area and the peripheral area over the second organic encapsulation layer.
Optionally, in some embodiments of the present application, in step S3, a liquid organic material is printed in a predetermined area on the first inorganic encapsulation layer, and after the liquid organic material is leveled, the liquid organic material is cured by ultraviolet irradiation to form the first organic encapsulation layer; in step S5, a liquid organic material is printed in a predetermined area on the second inorganic encapsulation layer, and after the liquid organic material is leveled, the liquid organic material is cured by ultraviolet light irradiation to form the second organic encapsulation layer.
In summary, the embodiment of the present application provides a display panel, where the display panel is divided into a display area and a peripheral area surrounding the display area; the display area comprises a light-emitting device, the peripheral area comprises a retaining wall, and the display area and the peripheral area further comprise packaging structures covering the retaining wall and the light-emitting device; the packaging structure comprises a first inorganic packaging layer, a first organic packaging layer, a second inorganic packaging layer, a second organic packaging layer and a third inorganic packaging layer which are stacked; the minimum distance between the first organic packaging layer and the retaining wall is larger than the minimum distance between the second organic packaging layer and the retaining wall. The overflow of the organic packaging layer can be reduced, the thickness of the organic packaging layer at the edge of the display panel is effectively ensured, and the reliability and yield of the display panel are improved.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
FIG. 1 is a first schematic structural diagram of a display panel according to an embodiment of the present disclosure;
FIG. 2 is a second schematic structural diagram of the display panel in the embodiment of the present application;
FIG. 3 is a schematic view of a process for manufacturing a display panel according to an embodiment of the present disclosure;
FIG. 4 is a first schematic view of a partial structure of the display panel according to the embodiment of the present application;
FIG. 5 is a schematic diagram of a second partial structure of the display panel according to the embodiment of the present application;
FIG. 6 is a schematic diagram of a third partial structure of the display panel in the embodiment of the present application;
FIG. 7 is a schematic diagram of a partial structure of the display panel in the embodiment of the present application;
FIG. 8 is a schematic diagram of a partial structure of the display panel in the embodiment of the present application;
fig. 9 is a schematic diagram six of a partial structure of the display panel in the embodiment of the present application.
Description of the main reference numerals:
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application. Furthermore, it should be understood that the detailed description and specific examples, while indicating exemplary embodiments of the invention, are given by way of illustration and explanation only, and are not intended to limit the scope of the invention. In the present application, unless otherwise stated, the use of directional terms such as "upper", "lower", "left" and "right" may refer to the actual use or operation of the device, may refer to the drawing direction in the drawings, and may refer to two opposite directions; while "inner" and "outer" are with respect to the outline of the device.
Specifically, referring to fig. 1, an embodiment of the present application provides a display panel 10, where the display panel 10 is divided into a display area 11 and a peripheral area 12 surrounding the display area; the display region 11 includes a light emitting device 200, the peripheral region 12 includes a retaining wall 300, and the display region 11 and the peripheral region 12 further include an encapsulation structure covering the retaining wall 300 and the light emitting device 200; the packaging structure comprises a first inorganic packaging layer 410, a first organic packaging layer 420, a second inorganic packaging layer 430, a second organic packaging layer 440 and a third inorganic packaging layer 450 which are stacked; the first inorganic encapsulation layer 410, the second inorganic encapsulation layer 430 and the third inorganic encapsulation layer 450 cover the display area 11 and the peripheral area 12, respectively; the first organic encapsulation layer 420 and the second organic encapsulation layer 440 cover the display area 11 and at least a portion of the peripheral area 12, respectively; wherein the minimum distance between the first organic encapsulation layer 420 and the retaining wall 300 is greater than the minimum distance between the second organic encapsulation layer 440 and the retaining wall 300. That is to say, by performing corresponding retraction on the first organic encapsulation layer 420, the retracted distance is the maximum extension distance of the first organic encapsulation layer 420 during leveling, that is, the maximum distance from the leveling boundary of the first organic encapsulation layer 420 to the printing boundary, so that a sufficient leveling space can be left for the second organic encapsulation layer 440 during printing, and under the condition that it is ensured that the first organic encapsulation layer 420 and the second organic encapsulation layer 440 overflow to the outside of the retaining wall 300, it is ensured that the first organic encapsulation layer 420 and the second organic encapsulation layer 440 have a larger thickness, so as to sufficiently coat the fine impurities in the peripheral region 12, improve the reliability and yield of the display panel 10, and thus improve the encapsulation performance.
Specifically, the first organic encapsulation layer 420 is divided into a first printing region 421 and a first leveling region 422 surrounding the first printing region 421; the second organic encapsulation layer 440 is divided into a second printing region 441 and a second leveling region 442 surrounding the second printing region 441; wherein the minimum distance between the first leveling area 422 and the retaining wall 300 is greater than the minimum distance between the second leveling area 442 and the retaining wall 300. By such an arrangement, a certain space can be reserved for the leveling of the second organic encapsulation layer 440, so that the second organic encapsulation layer 440 does not overflow out of the retaining wall 300. Preferably, the minimum distance between the first leveling area 422 and the retaining wall 300 is greater than the minimum distance between the second printing area 441 and the retaining wall 300. That is, the orthographic projection of the first organic encapsulation layer 420 on the first inorganic encapsulation layer 410 falls entirely inside the orthographic projection of the second printing area 441 of the second organic encapsulation layer 440 on the first inorganic encapsulation layer 410. Preferably, the distance between the second leveling region 442 and the retaining wall 300 is zero, that is, the boundary of the second organic encapsulation layer 440 is adjacent to the retaining wall 300, and the boundary of the second organic encapsulation layer 440 is defined by the retaining wall 300.
In this embodiment, the minimum distance between the first printing region 421 and the retaining wall 300 is between 300 μm and 400 μm; the minimum distance between the first leveling area 422 and the retaining wall 300 is between 100 μm and 200 μm. The minimum distance between the second printing region 441 and the retaining wall 300 is between 100 μm and 200 μm; the minimum distance between the second leveling region 442 and the retaining wall 300 is between 0 μm and 100 μm. As long as the distances between the first printing region 421, the first leveling region 422, the second printing region 441, and the second leveling region 442 and the retaining wall respectively satisfy the above ranges, no further description is given in this application. For example: the minimum spacing between the first printing region 421 and the retaining wall 300 is 310 μm, 320 μm, 330 μm, 340 μm, 350 μm, 360 μm, 370 μm, 380 μm or 390 μm; the minimum distance between the first leveling zone 422 and the retaining wall 300 is 110 μm, 120 μm, 130 μm, 140 μm, 150 μm, 160 μm, 170 μm, 180 μm or 190 μm; the minimum distance between the second printing region 441 and the retaining wall 300 is 110 μm, 120 μm, 130 μm, 140 μm, 150 μm, 160 μm, 170 μm, 180 μm, or 190 μm; the minimum distance between the second leveling region 442 and the retaining wall 300 is 10 μm, 20 μm, 30 μm, 40 μm, 50 μm, 60 μm, 70 μm, 80 μm, or 90 μm.
In an embodiment of the present invention, the height of the retaining wall 300 is greater than the thickness of the first organic encapsulation layer 420 and/or the second organic encapsulation layer 440. Preferably, the thicknesses of the first organic encapsulation layer 420 and the second organic encapsulation layer 440 are respectively lower than the height of the retaining wall 300. Further, the thickness of the whole package structure is greater than the height of the retaining wall 300, so that the surface of the display panel 10 can be more flat, and the display effect can be enhanced.
Referring to fig. 2, in an embodiment of the present application, the peripheral region 12 further includes a front retaining wall 310, and the front retaining wall 310 is disposed on a side of the retaining wall 300 close to the display region 11; wherein the height of the front retaining wall 310 is less than that of the retaining wall 300, and the second organic encapsulation layer 440 covers the front retaining wall 310. In other words, the sum of the thicknesses of the first inorganic encapsulation layer 410, the first organic encapsulation layer 420, the second inorganic encapsulation layer 440, and the second organic encapsulation layer 440 is greater than the height of the front wall 310. This arrangement enables the second organic encapsulation layer 440 to cover the front wall 310, so that it can overflow to a position between the front wall 310 and the wall 300. Preferably, the sum of the thicknesses of the first inorganic encapsulation layer 410, the first organic encapsulation layer 420 and the second inorganic encapsulation layer 440 is greater than the height of the front wall 310. It is understood that the front wall 310 only defines the first organic encapsulation layer 420, and thus the bottom of the second inorganic encapsulation layer 440 is configured to be a plane, which can ensure that the second organic encapsulation layer 420 is further leveled and fills the position between the front wall 310 and the wall 300. In this embodiment, the front retaining wall 310 is used to define the boundary of the first organic encapsulation layer 420, and the retaining wall 300 is used to define the boundary of the second organic encapsulation layer 440. The overflow of the first organic encapsulation layer 420 out of the front wall 310 and the overflow of the second organic encapsulation layer 440 out of the wall 300 are prevented. The first organic encapsulation layer 420 and the second organic encapsulation layer 440 are ensured to have larger thicknesses, so that the fine impurities in the peripheral region 12 are fully coated, the reliability and yield of the display panel 10 are improved, and the encapsulation performance is improved.
In the present application, the material of the first inorganic encapsulation layer 410, the second inorganic encapsulation layer 430 and the third inorganic encapsulation layer 450 includes at least one of silicon oxide, silicon nitride, silicon oxynitride, aluminum oxide and zirconium oxide; the material of the first organic encapsulation layer 420 and the second organic encapsulation layer 440 includes at least one of epoxy resin and acryl, and such organic material can ensure that the first organic encapsulation layer 420 and the second organic encapsulation layer 440 have certain fluidity before being cured.
Referring to fig. 1 and fig. 3 to 9, the present application further provides a method for manufacturing the display panel 10, including the following steps:
referring to fig. 3 and 4, step S1: providing a substrate 100, and forming a light emitting device 200 and a retaining wall 300 on the substrate 100; the display panel 10 is divided into a display area 11 and a peripheral area 12 surrounding the display area 11, the light emitting device 200 is located in the display area 11, and the retaining wall 300 is located in the peripheral area 12.
Referring to fig. 3 and 5, step S2: a first inorganic encapsulation layer 410 is formed covering the display area 11 and the peripheral area 12.
Referring to fig. 3 and 6, step S3: a first organic encapsulation layer 420 covering the display region 11 and at least a portion of the peripheral region 12 is formed on the first inorganic encapsulation layer 410, wherein a space is formed between the first organic encapsulation layer 420 and the retaining wall 300. A liquid organic material is printed in a preset area on the first inorganic encapsulation layer 410, and after the liquid organic material is leveled, the liquid organic material is cured by ultraviolet irradiation to form the first organic encapsulation layer 420.
Referring to fig. 3 and fig. 7, step S4: a second inorganic encapsulation layer 430 covering the display region 11 and the peripheral region 12 is formed over the first organic encapsulation layer 420.
Referring to fig. 3 and 8, step S5: a second organic encapsulation layer 440 covering the display region 11 and at least a portion of the peripheral region 12 is formed on the second inorganic encapsulation layer 430, wherein a distance is provided between the second organic encapsulation layer 440 and the retaining wall 300, and a minimum distance between the first organic encapsulation layer 420 and the retaining wall 300 is greater than a minimum distance between the second organic encapsulation layer 440 and the retaining wall 300. A liquid organic material is printed in a preset area on the second inorganic encapsulation layer 430, and after the liquid organic material is leveled, the liquid organic material is cured by ultraviolet irradiation to form the second organic encapsulation layer 440.
Referring to fig. 3 and 9, step S6: a third inorganic encapsulation layer 450 covering the display region 11 and the peripheral region 12 is formed over the second organic encapsulation layer 440.
In summary, the embodiment of the present application provides a display panel, in which the display panel 10 is divided into a display area 11 and a peripheral area 12 surrounding the display area; the display region 11 includes a light emitting device 200, the peripheral region 12 includes a retaining wall 300, and the display region 11 and the peripheral region 12 further include an encapsulation structure covering the retaining wall 300 and the light emitting device 200; the packaging structure comprises a first inorganic packaging layer 410, a first organic packaging layer 420, a second inorganic packaging layer 430, a second organic packaging layer 440 and a third inorganic packaging layer 450 which are stacked; the minimum distance between the first organic encapsulation layer 420 and the retaining wall 300 is greater than the minimum distance between the second organic encapsulation layer 440 and the retaining wall 300. Under the condition that the first organic encapsulating layer 420 and the second organic encapsulating layer 440 do not overflow out of the retaining wall 300, the thickness of the organic encapsulating layer is ensured to be larger, so that the fine impurities in the peripheral region 12 are fully coated, the reliability and the yield of the display panel 10 are improved, and the encapsulating performance is improved.
In the foregoing embodiments, the descriptions of the respective embodiments have respective emphasis, and for parts that are not described in detail in a certain embodiment, reference may be made to related descriptions of other embodiments.
The technical solutions provided by the embodiments of the present application are introduced in detail, and specific examples are applied in the description to explain the principles and embodiments of the present application, and the descriptions of the embodiments are only used to help understanding the method and the core ideas of the present application; meanwhile, for those skilled in the art, according to the idea of the present application, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present application.
Claims (10)
1. The display panel is characterized in that the display panel is divided into a display area and a peripheral area surrounding the display area;
the display area comprises a light-emitting device, the peripheral area comprises a retaining wall, and the display area and the peripheral area further comprise packaging structures covering the retaining wall and the light-emitting device;
the packaging structure comprises a first inorganic packaging layer, a first organic packaging layer, a second inorganic packaging layer, a second organic packaging layer and a third inorganic packaging layer which are stacked; the first inorganic encapsulation layer, the second inorganic encapsulation layer and the third inorganic encapsulation layer respectively cover the display area and the peripheral area; the first organic packaging layer and the second organic packaging layer respectively cover the display area and at least part of the peripheral area; wherein
The minimum distance between the first organic packaging layer and the retaining wall is larger than the minimum distance between the second organic packaging layer and the retaining wall.
2. The display panel of claim 1, wherein the first organic encapsulation layer is divided into a first printing area and a first leveling area surrounding the first printing area; the second organic encapsulation layer is divided into a second printing area and a second leveling area surrounding the second printing area; wherein
The minimum distance between the first leveling area and the retaining wall is larger than the minimum distance between the second leveling area and the retaining wall.
3. The display panel according to claim 2, wherein a minimum distance between the first leveling area and the retaining wall is greater than a minimum distance between the second printing area and the retaining wall.
4. The display panel according to claim 2, wherein a minimum distance between the first printing region and the bank is between 300 μm and 400 μm; the minimum distance between the first leveling area and the retaining wall is between 100 and 200 mu m.
5. The display panel according to claim 4, wherein a minimum distance between the second printing region and the dam is between 100 μm and 200 μm; the minimum distance between the second leveling area and the retaining wall is 0-100 mu m.
6. The display panel according to claim 1, wherein the height of the dam is greater than the thickness of the first organic encapsulation layer and/or the second organic encapsulation layer.
7. The display panel according to claim 1, wherein the peripheral region further includes a front-located dam disposed on a side of the dam adjacent to the display region; wherein
The height of the front retaining wall is smaller than that of the retaining wall, and the second organic packaging layer covers the front retaining wall.
8. The display panel of claim 1, wherein a material of the first inorganic encapsulation layer, the second inorganic encapsulation layer, and the third inorganic encapsulation layer comprises at least one of silicon oxide, silicon nitride, silicon oxynitride, aluminum oxide, and zirconium oxide; the material of the first organic packaging layer and the second organic packaging layer comprises at least one of epoxy resin and acrylic.
9. A method for manufacturing a display panel according to claim 1, comprising the steps of:
step S1: providing a substrate, and forming a light-emitting device and a retaining wall on the substrate; the display panel is divided into a display area and a peripheral area surrounding the display area, the light-emitting device is located in the display area, and the retaining wall is located in the peripheral area;
step S2: forming a first inorganic encapsulation layer covering the display area and the peripheral area;
step S3: forming a first organic packaging layer covering the display area and at least part of the peripheral area on the first inorganic packaging layer, wherein the first organic packaging layer and the retaining wall have a distance therebetween;
step S4: forming a second inorganic encapsulation layer covering the display area and the peripheral area over the first organic encapsulation layer;
step S5: forming a second organic encapsulation layer covering the display area and at least part of the peripheral area on the second inorganic encapsulation layer, wherein the second organic encapsulation layer has a distance from the retaining wall, and the minimum distance between the first organic encapsulation layer and the retaining wall is greater than the minimum distance between the second organic encapsulation layer and the retaining wall;
step S6: forming a third inorganic encapsulation layer covering the display area and the peripheral area over the second organic encapsulation layer.
10. The method of manufacturing a display panel according to claim 9, wherein in step S3, a liquid organic material is printed on a predetermined area of the first inorganic encapsulation layer, and after the liquid organic material is leveled, the liquid organic material is cured by uv irradiation to form the first organic encapsulation layer; in step S5, a liquid organic material is printed in a predetermined area on the second inorganic encapsulation layer, and after the liquid organic material is leveled, the liquid organic material is cured by ultraviolet light irradiation to form the second organic encapsulation layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN202210116396.0A CN114551753A (en) | 2022-02-07 | 2022-02-07 | Display panel and preparation method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202210116396.0A CN114551753A (en) | 2022-02-07 | 2022-02-07 | Display panel and preparation method thereof |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109671867A (en) * | 2019-01-23 | 2019-04-23 | 京东方科技集团股份有限公司 | A kind of packaging method of display base plate, encapsulating structure |
| CN110663120A (en) * | 2018-04-28 | 2020-01-07 | 京东方科技集团股份有限公司 | Display substrate, display apparatus, and method of manufacturing display substrate |
| CN111146266A (en) * | 2020-02-18 | 2020-05-12 | 武汉华星光电半导体显示技术有限公司 | Flexible display panel and preparation method thereof |
| CN111628112A (en) * | 2020-07-02 | 2020-09-04 | 京东方科技集团股份有限公司 | Display panel and display device |
| US20210066655A1 (en) * | 2019-08-29 | 2021-03-04 | Chengdu Boe Optoelectronics Technology Co., Ltd. | Display panel, preparation method thereof, and display device |
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| CN110663120A (en) * | 2018-04-28 | 2020-01-07 | 京东方科技集团股份有限公司 | Display substrate, display apparatus, and method of manufacturing display substrate |
| CN109671867A (en) * | 2019-01-23 | 2019-04-23 | 京东方科技集团股份有限公司 | A kind of packaging method of display base plate, encapsulating structure |
| US20210066655A1 (en) * | 2019-08-29 | 2021-03-04 | Chengdu Boe Optoelectronics Technology Co., Ltd. | Display panel, preparation method thereof, and display device |
| CN111146266A (en) * | 2020-02-18 | 2020-05-12 | 武汉华星光电半导体显示技术有限公司 | Flexible display panel and preparation method thereof |
| CN111628112A (en) * | 2020-07-02 | 2020-09-04 | 京东方科技集团股份有限公司 | Display panel and display device |
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