CN112563432A - Organic light emitting display panel and method of manufacturing the same - Google Patents
Organic light emitting display panel and method of manufacturing the same Download PDFInfo
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- CN112563432A CN112563432A CN202011412083.7A CN202011412083A CN112563432A CN 112563432 A CN112563432 A CN 112563432A CN 202011412083 A CN202011412083 A CN 202011412083A CN 112563432 A CN112563432 A CN 112563432A
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
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- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/846—Passivation; Containers; Encapsulations comprising getter material or desiccants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/1201—Manufacture or treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/124—Insulating layers formed between TFT elements and OLED elements
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- Engineering & Computer Science (AREA)
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- Electroluminescent Light Sources (AREA)
Abstract
The present application provides an organic light emitting display panel, which includes: the array substrate comprises a display area and a frame area positioned at the periphery of the display area; the row driving circuit is arranged in the frame area; the flat layer covers the array substrate and the row driving circuit, wherein a concave-convex structure is formed on the surface far away from the row driving circuit, and the concave-convex structure is arranged corresponding to the row driving circuit; the organic light-emitting device is positioned on the flat layer of the display area and is electrically connected with the array substrate, and the cover plate is positioned on one side of the array substrate, which is provided with the organic light-emitting device, and is arranged opposite to the array substrate; and the packaging layer is filled among the organic light-emitting device, the flat layer and the cover plate, covers the concave-convex structure and extends from the display area to the frame area.
Description
Technical Field
The present disclosure relates to display technologies, and particularly to an organic light emitting display panel and a method for manufacturing the same.
Background
The packaging method of the large-sized Organic Light-Emitting Diode (OLED) display panel mainly includes Face Seal (Face Seal) packaging and Dam (frame glue)/Getter (moisture-absorbing glue)/Fill (filling glue) packaging. The surface-mount package is to package the OLED by using a surface-mount adhesive and a metal cover plate, and the surface-mount adhesive has poor light transmittance and the metal cover plate is opaque, so the method is not suitable for packaging the top-emitting OLED. In Dam (frame glue)/Getter (moisture absorption glue)/Fill (filling glue) packaging, Dam glue is coated on the outermost side to play a role of attaching a cover plate and a panel and is a first defense line for external water vapor invasion, Getter glue is coated on the inner side of Dam glue and is mainly used for absorbing water vapor and becoming a second defense line for water vapor invasion, and Fill glue is coated on a light-emitting area of the panel and mainly plays a role of supporting and increasing the mechanical strength of the panel. The light transmittance of the Dam/Getter/Fill packaging mode can reach more than 90 percent, and the light-emitting OLED panel is suitable for top-emitting OLED panels. However, in the OLED display panel having a Gate Driver on Array (GOA) circuit disposed on the periphery of the light emitting region of the Array substrate, a planarization layer is required to protect the GOA circuit. The flat layer is made of organic materials, large holes are formed in the flat layer, and water and oxygen blocking performance is poor, so that packaging of the OLED display panel with the GOA circuit is difficult.
Disclosure of Invention
In view of the above, the present application aims to provide an OLED display panel with a GOA circuit, which can improve the water and oxygen blocking capability.
The present application provides an organic light emitting display panel, which includes:
the array substrate comprises a display area and a frame area positioned at the periphery of the display area;
the row driving circuit is arranged in the frame area;
the flat layer covers the array substrate and the row driving circuit, wherein a concave-convex structure is formed on the surface far away from the row driving circuit, and the concave-convex structure is arranged corresponding to the row driving circuit;
an organic light emitting device on the planarization layer of the display region and electrically connected to the array substrate,
the cover plate is positioned on one side of the array substrate, which is provided with the organic light-emitting device, and is arranged opposite to the array substrate; and
and the packaging layer is filled among the organic light-emitting device, the flat layer and the cover plate, covers the concave-convex structure and extends from the display area to the frame area.
In one embodiment, the encapsulation layer includes a first encapsulation portion, the first encapsulation portion is filled between the organic light emitting device, the flat layer and the cover plate, covers at least part of the concave-convex structure, and extends from the display area to the frame area, the encapsulation layer further includes a second encapsulation portion, the second encapsulation portion is located in the frame area, is connected between the flat layer and the cover plate around the first encapsulation portion, the material of the first encapsulation portion includes filling glue, and the material of the second encapsulation portion includes frame glue.
In one embodiment, the encapsulation layer further includes a moisture-absorbing glue disposed between the first encapsulation portion and the second encapsulation portion.
In one embodiment, moisture absorbing particles are added to the second encapsulation.
In one embodiment, the water oxygen transmittance of the frame sealant is less than or equal to 60 g/(m)2·24h)。
In one embodiment, the encapsulation layer is a surface mount encapsulation layer, the encapsulation layer includes a first encapsulation portion, the first encapsulation portion is filled between the organic light emitting device, the flat layer and the cover plate, covers at least a portion of the concave-convex structure, extends from the display area to the frame area, and is made of a surface mount encapsulation adhesive.
In one embodiment, the encapsulation layer further includes a second encapsulation portion, the second encapsulation portion is located in the frame region and connected between the flat layer and the cover plate around the first encapsulation portion, and the material of the second encapsulation portion is a side sealing adhesive.
In one embodiment, the organic light emitting display panel further includes a thin film encapsulation layer for encapsulating the organic light emitting device, the thin film encapsulation layer being located between the planarization layer and the encapsulation layer and extending from the display region to the bezel region.
The present application also provides a method of manufacturing an organic light emitting display panel, which includes the steps of:
providing an array substrate, wherein the array substrate comprises a display area and a frame area positioned on the periphery of the display area, and a row driving circuit is arranged in the frame area;
forming a flat layer on the array substrate and the row driving circuit, patterning the flat layer to form a concave-convex structure on a surface far away from the row driving circuit, wherein the concave-convex structure is arranged corresponding to the row driving circuit;
forming an organic light emitting device on the flat layer of the display area, and electrically connecting the organic light emitting device and the array substrate;
providing a cover plate, forming an encapsulation material on the cover plate, aligning and pressing the cover plate and the array substrate in a mode that the encapsulation material and the organic light-emitting device are positioned between the cover plate and the array substrate, and curing the encapsulation material to form an encapsulation layer;
the packaging layer is filled among the organic light-emitting device, the flat layer and the cover plate, covers the concave-convex structure and extends from the display area to the frame area.
In one embodiment, the step of providing a cover plate, forming an encapsulation material on the cover plate, aligning and pressing the cover plate and the array substrate with the encapsulation material and the organic light emitting device therebetween, and curing the encapsulation material to form an encapsulation layer includes:
providing a cover plate, forming filling glue and frame glue on the cover plate, wherein the frame glue surrounds the filling glue, aligning and pressing the cover plate and the array substrate in a manner that the filling glue, the frame glue and the organic light-emitting device are positioned between the cover plate and the array substrate, curing the filling glue to form a first packaging part, and curing the frame glue to form a second packaging part;
the first packaging part is filled among the organic light-emitting device, the flat layer and the cover plate, extends from the display area to the frame area, covers at least part of the concave-convex structure, and is positioned in the frame area and connected between the flat layer and the cover plate around the first packaging part. According to the organic light-emitting display panel and the manufacturing method thereof, the flat layer above the GOA circuit is patterned to form the concave-convex structure, the adhesion between the packaging layer and the array substrate can be increased on the premise of protecting the GOA circuit, the water vapor invasion channel is prolonged, the water vapor invasion is delayed, and therefore a good narrow-frame packaging effect is achieved.
Drawings
In order to more clearly illustrate the technical solutions in the present application, the drawings needed to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1 is a schematic top view of an organic light emitting display panel according to the present application.
Fig. 2 is a cross-sectional view of one structure of the organic light emitting display panel of fig. 1 taken along the S-S line.
Fig. 3(a) and 3(b) are cross-sectional views of other structures of the uneven structure of the organic light emitting display panel.
Fig. 4 is a cross-sectional view of another structure of the organic light emitting display panel of fig. 1 taken along the S-S line.
Fig. 5 is a cross-sectional view of still another structure of the organic light emitting display panel of fig. 1 taken along the S-S line.
Fig. 6 is a flowchart of a method of manufacturing an organic light emitting display panel according to the present application.
Detailed Description
The technical solution in the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. It should be apparent that the described embodiments are only some embodiments of the present application, and not all embodiments. All other embodiments, which can be obtained by a person skilled in the art without making any inventive step based on the embodiments in the present application, are within the scope of protection of the present application.
In this application, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise the first and second features being directly adjacent or may comprise the first and second features being not in direct contact but in contact with each other by means of further features between them. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.
Referring to fig. 1, the present application provides an organic light emitting display panel 100. The organic light emitting display panel 100 may be used, for example, to include at least one of a smart phone (smartphone), a tablet personal computer (tablet personal computer), a mobile phone (mobile phone), a video phone, an electronic book reader (e-book reader), a desktop computer (desktop PC), a laptop computer (laptop PC), a netbook computer, a workstation (workstation), a server, a personal digital assistant (personal digital assistant), a portable media player (portable multimedia player), an MP3 player, a mobile medical machine, a camera, a game machine, a digital camera, a car navigation device, an electronic billboard, an automatic teller machine, or a wearable device (wearable device).
Referring to fig. 2, the organic light emitting display panel 100 includes an array substrate 10 including a display area AA and a frame area BA located at a periphery of the display area AA; a Gate driver On Array (GOA) 20 disposed in the frame area BA; a flat layer 30 covering the array substrate 10 and the row driving circuit 20, wherein a concave-convex structure 31 is formed on a surface far away from the row driving circuit 20, and the concave-convex structure 31 is arranged corresponding to the row driving circuit; an organic light emitting device 40 on the planarization layer 30 of the display area AA and electrically connected to the array substrate 10; a cover plate 50 positioned at a side of the array substrate 10 where the organic light emitting device 40 is disposed, and disposed opposite to the array substrate 10; and an encapsulation layer 60 filled between the organic light emitting device 40, the planarization layer 30 and the cover plate 50, covering the concave-convex structure 31, and extending from the display area AA to the frame area BA.
The array substrate 10 includes a substrate (not shown) and a driving circuit (not shown) disposed on the substrate. The substrate base plate may be transparent glass or transparent plastic. The substrate may include a single flexible organic layer or two or more flexible organic layers. The material of the flexible organic layer is selected from one or more of Polyimide (PI), polyethylene naphthalate (PEN), polyethylene terephthalate (PET), Polyarylate (PAR), Polycarbonate (PC), Polyetherimide (PEI) and Polyethersulfone (PES). The driving circuit is disposed in the display area AA. The driving circuit includes a plurality of Thin Film Transistor (TFT) arrays. The driving circuit may be, for example, a 3T1C, 5T1C, or 7T1C circuit.
The row driving circuit 20, which may also be referred to as a goa (gate driver on array) unit, is formed by directly forming the gate driving circuit around the display panel, and is usually disposed in the non-display area of the row driving circuit 20. The setting method can reduce the manufacturing procedures, reduce the product cost, improve the panel integration level and realize the narrow frame.
The material of the planarization layer 30 may be selected from silicon dioxide, nitrogen dioxide, silicon oxynitride, and a stack thereof, or an organic material, such as an acrylic resin. The present application does not limit the structure of the shape of the concave-convex structure 31, and it may be a concave-convex structure whose cross section is rectangular as shown in fig. 2. Referring to fig. 3(a) and 3(b), the concave-convex structure 31 may have a zigzag shape, a wave shape, or the like, in addition to the shape shown in fig. 2.
A plurality of organic light emitting devices 40 are arranged in the display area AA in an array shape. The organic light emitting device 40 includes an anode 41, a cathode 42, and an organic light emitting portion 43 disposed between the anode 41 and the cathode 42. The organic light emitting device 40 may further include a hole injection layer, a hole transport layer, an electron injection layer, and the like. In addition, the organic light emitting display panel 100 further includes a pixel defining layer 44 for defining a sub-pixel region. The pixel defining layer 44 is disposed between the anode 41 and the cathode 42. The pixel defining layer 44 has a plurality of openings arranged in an array. The organic light emitting section 43 is disposed in the opening of the pixel defining layer 44. The organic light emitting device 40 used in the present application may be a top emission type OLED device or a bottom emission type OLED device.
Depending on the type of light emission of the organic light emitting device 40 and the manner of encapsulation. The cover plate 50 may be a transparent glass, transparent plastic or metal cover plate. The cover plate 50 serves to protect other elements of the organic light emitting display panel 100.
The encapsulation layer 60 is used to attach the array substrate 10 and the cover plate 50, and encapsulate the organic light emitting device 40 to prevent moisture from entering.
In one embodiment, the encapsulation method of the organic light emitting display panel 100 is Dam (frame sealant)/Getter (moisture absorption sealant)/Fill (filling sealant) encapsulation method. The encapsulation layer 60 is Dam/Getter/Fill encapsulation layer. The encapsulation layer 60 includes a first encapsulation portion 61. The first sealing portion 61 is filled between the organic light emitting device 40, the planarization layer 30 and the cover plate 50, and covers at least a portion of the concave-convex structure 31, and extends from the display area AA to the frame area BA. The encapsulation layer 60 may further include a second encapsulation portion 62, and the second encapsulation portion 62 is located in the frame area BA and connected between the planarization layer 30 and the cover plate 50 around the first encapsulation portion 61. The second encapsulant portion 62 may cover a portion of the relief structure 31. In other embodiments of the present application, the second sealing portion 62 may not cover the concave-convex structure 31, and the first sealing portion 61 may completely cover the concave-convex structure 31. The material of the first package portion 61 comprises a filling glue (also called Fill glue). The material of the second package portion 62 includes a frame adhesive (also referred to as Dam adhesive). The encapsulation layer 60 may further include a moisture-absorbing adhesive (also referred to as a Getter adhesive) 63 disposed between the first encapsulation portion 61 and the second encapsulation portion 62. The first encapsulation part 61 serves to encapsulate the organic light emitting device 40 and provide mechanical strength to the organic light emitting display panel. The second encapsulation part 62 serves to bond the array substrate 10 and the cover plate 50 and prevent moisture from intruding. The moisture absorbent 63 absorbs moisture entering the organic light emitting display panel 100 from the outside.
The filling adhesive includes epoxy resin (epoxy), acrylic resin (acrylic) and other organic materials. The sealant includes an organic material such as epoxy resin (epoxy) and acrylic resin (acrylic). The frame glue can be a resin material with high water resistance. The high water resistance means that the water oxygen transmittance of the frame glue is less than or equal to 60 g/(m)224 h). The filling adhesive has a first viscosity and a frameThe glue has a second viscosity. The first viscosity is less than the second viscosity. For example, the filling adhesive is in a liquid state, and the frame adhesive is in a solid state, which is a paste. The material of the hygroscopic glue 63 may include hygroscopic metal oxides such as calcium oxide (CaO), barium oxide (BaO), magnesium oxide (MgO), and the like.
Referring to fig. 4, in another embodiment, the packaging method of the organic light emitting display panel 200 is a modification of the Dam/Getter/Fill packaging method. The encapsulation layer 260 includes a first encapsulation portion 261. The first encapsulation part 261 is filled between the organic light emitting device 240, the planarization layer 230 and the cover plate 250, covers at least a portion of the concave-convex structure 231, and extends from the display area AA to the frame area BA. The encapsulation layer 260 further includes a second encapsulation portion 262, and the second encapsulation portion 262 is located in the frame area BA and connected between the planarization layer 230 and the cover plate 250 around the first encapsulation portion 261. The second encapsulation part 262 may cover a portion of the concave-convex structure 231. In other embodiments of the present application, the second sealing portion 262 may not cover the concave-convex structure 231, and the first sealing portion 261 may completely cover the concave-convex structure 231. The material of the first encapsulation 261 includes a filling glue (Fill glue). The material of the second sealing portion 262 includes sealant (Dam sealant). The first encapsulation part 261 serves to encapsulate the organic light emitting device 240 and provide mechanical strength to the organic light emitting display panel. The second encapsulation part 262 serves to bond the array substrate and the cover plate 250 and prevent moisture from being introduced. The moisture absorbing particles 264 are added to the second sealing portion 262. The moisture absorbing particles 264 serve to absorb moisture that enters the organic light emitting display panel 100 from the outside.
The filling adhesive includes epoxy resin (epoxy), acrylic resin (acrylic) and other organic materials. The sealant includes an organic material such as epoxy resin (epoxy) and acrylic resin (acrylic). The high water resistance means that the water oxygen transmittance of the frame glue is less than or equal to 60 g/(m)224 h). The filling adhesive has a first viscosity, and the frame adhesive has a second viscosity. The first viscosity is less than the second viscosity. For example, the filling adhesive is in a liquid state, and the frame adhesive is in a solid state, which is a paste. The material of the moisture absorbing particles 264 may include hygroscopic metal oxides such as calcium oxide (CaO), barium oxide (BaO), and magnesium oxide (MgO).
Referring to fig. 4, in another embodiment, a packaging method of the organic light emitting display panel 300 is a surface mount packaging method. The encapsulation layer 360 is a face-on-face (facelift) encapsulation layer. Including a first encapsulant 361. The first encapsulant 361 is filled between the organic light emitting device 340, the planarization layer 330 and the cover plate 350, covers at least a portion of the concave-convex structure 331, and extends from the display area AA to the frame area BA. The material of the first sealing part 361 includes a surface mount sealing adhesive. The surface-mount packaging adhesive comprises a bonding layer which is used for bonding the substrate and absorbing impact to protect the OLED light-emitting layer. The adhesive layer may be a transparent double-sided tape. The surface-mount packaging adhesive can also comprise a water absorption layer, and the water absorption layer contains a metal oxide drying agent. The encapsulation layer 60 may further include a second encapsulation portion 362. The second encapsulant 362 is disposed in the frame area BA, and is connected between the planarization layer 330 and the cover plate 350 around the first encapsulant 360 to further isolate the external moisture. The material of the second package portion 362 is a side sealant. The edge-sealing adhesive may also include one or more of an acrylic resin and an epoxy resin. The second packaging part can be black, and light leakage from the side surface can be prevented when the OLED emits light.
Referring to fig. 1 again, the organic light emitting display panel 100 further includes a Thin Film Encapsulation (TFE) layer 70 encapsulating the organic light emitting device 40. The thin film encapsulation layer 70 extends from the display area AA to the frame area BA and is located between the planarization layer 30 and the encapsulation layer 60. Specifically, an orthographic projection of the thin film encapsulation layer 70 on the cathode 42 covers the cathode 42, and the area of the thin film encapsulation layer 70 is larger than the area of the cathode 42. The thin film encapsulation layer 70 includes at least one inorganic layer and at least one organic layer alternately stacked. The material of the inorganic layer may be selected from alumina, silicon oxide, silicon nitride, silicon oxynitride, silicon carbide, titanium oxide, zirconium oxide, zinc oxide, and the like. The material of the organic layer may be selected from epoxy, Polyimide (PI), polyethylene terephthalate (PET), Polycarbonate (PC), Polyethylene (PE), polyacrylate, and the like.
Referring to fig. 2 and fig. 6 together, the present application further provides a method for manufacturing an organic light emitting display panel, which includes the following steps:
s1: an array substrate 10 is provided, which includes a display area AA and a frame area BA located at the periphery of the display area AA, and a row driving circuit 20 is disposed in the frame area BA.
The step of providing the array substrate 10 includes providing a substrate (not shown) on which a driving circuit (not shown) is disposed. The substrate base plate may be transparent glass or transparent plastic. The substrate may include a single flexible organic layer or two or more flexible organic layers. The material of the flexible organic layer is selected from one or more of Polyimide (PI), polyethylene naphthalate (PEN), polyethylene terephthalate (PET), Polyarylate (PAR), Polycarbonate (PC), Polyetherimide (PEI) and Polyethersulfone (PES). The driving circuit is disposed in the display area AA. The driving circuit includes a plurality of Thin Film Transistor (TFT) arrays. The driving circuit may be, for example, a 3T1C, 5T1C, or 7T1C circuit.
The row driving circuit 20, which may also be referred to as a goa (gate driver on array) unit, is formed by directly forming the gate driving circuit around the display panel, and is usually disposed in the non-display area of the row driving circuit 20. The setting method can reduce the manufacturing procedures, reduce the product cost, improve the panel integration level and realize the narrow frame.
S2: a planarization layer 30 is formed on the array substrate 10 and the row driving circuit 20, the planarization layer 30 is patterned to form a concave-convex structure 31 on a surface away from the row driving circuit 20, the concave-convex structure 31 corresponding to the row driving circuit arrangement 20. The method of patterning the planarization layer 30 may be photolithography, which includes the steps of exposing, developing, and etching.
The material of the planarization layer 30 may be selected from silicon dioxide, nitrogen dioxide, silicon oxynitride, and a stack thereof, or an organic material, such as an acrylic resin. The present application does not limit the structure of the shape of the concave-convex structure 31, and it may be a concave-convex structure whose cross section is rectangular as shown in fig. 2. Referring to fig. 3(a) and 3(b), the concave-convex structure 31 may have a zigzag shape, a wave shape, or the like, in addition to the shape shown in fig. 2. S3: an organic light emitting device 40 is formed on the planarization layer 30 of the display area AA, and the organic light emitting device 40 is electrically connected to the array substrate 10.
Specifically, step S3 may include: an anode 41 is fabricated on the planarization layer 30. The organic light emitting device 40 used in the present application may be a top emission type OLED device or a bottom emission type OLED device. In one embodiment, the organic light emitting device 40 may be a top emission type OLED. The anode 41 is a reflective anode. The material of the reflective anode may be aluminum (Al), silver (Ag), or a stack of a reflective metal such as aluminum (Al), silver (Ag), and a transparent oxide such as Indium Zinc Oxide (IZO) and Indium Tin Oxide (ITO). A pixel defining layer 44 is formed on the anode 41 to define a light emitting region. The pixel defining layer 44 also functions as a stopper. An organic light emitting section 43 is formed on the anode 41 by ink jet printing. The cathode 42 is formed on the organic light emitting portion 43. The cathode 42 is a transparent cathode. The size of the transparent cathode is larger than the size of the organic light emitting section 43 layer. The transparent cathode may be one or more of metals or metal oxides such as magnesium (Mg), aluminum (Al), silver (Ag), Indium Zinc Oxide (IZO), Indium Tin Oxide (ITO), and the like. Thereby, the plurality of organic light emitting devices 40 are arranged in the display area AA in an array shape. The organic light emitting device 40 may further include a hole injection layer, a hole transport layer, an electron injection layer, and the like.
A capping layer can also be made on the transparent cathode as required. The capping layer has the effect of improving light extraction and improving optical performance.
S4: a step of forming a thin film encapsulation layer 60 on the organic light emitting device 40. The film encapsulation layer 60 extends from the display area AA to the frame area BA and is located between the planarization layer 30 and the filling adhesive 60 and the frame adhesive 70. The thin film encapsulation Layer 60 is fabricated by using a Plasma Enhanced Chemical Vapor Deposition (PECVD) process, an Atomic Layer Vapor Deposition (ALD) process, and an inkjet printing method.
An orthographic projection of the thin film encapsulation layer 70 on the cathode 42 covers the cathode 42 and has an area larger than that of the cathode 42. The thin film encapsulation layer 70 includes at least one inorganic layer and at least one organic layer alternately stacked. The material of the inorganic layer may be selected from alumina, silicon oxide, silicon nitride, silicon oxynitride, silicon carbide, titanium oxide, zirconium oxide, zinc oxide, and the like. The material of the organic layer may be selected from epoxy, Polyimide (PI), polyethylene terephthalate (PET), Polycarbonate (PC), Polyethylene (PE), polyacrylate, and the like.
S5: providing a cover plate 50, forming an encapsulation material on the cover plate 50, aligning and pressing the cover plate 50 and the array substrate in a manner that the encapsulation material and the organic light emitting device 40 are located between the cover plate 50 and the array substrate, and curing the encapsulation material to form an encapsulation layer 60.
Depending on the type of light emission of the organic light emitting device 40 and the manner of encapsulation. The cover plate 50 may be a transparent glass, transparent plastic or metal cover plate. The cover plate 50 serves to protect other elements of the organic light emitting display panel 100. The encapsulation layer 60 extends from the display area to the frame area BA, and fills the space between the organic light emitting device 40, the planarization layer 30 and the cover plate 50, and covers the concave-convex structure 31.
Referring to fig. 2, in an embodiment, a packaging method of the organic light emitting display panel 100 is Dam/Getter/Fill packaging method. Step S5 may include: providing a cover plate 50, forming filling glue, moisture absorption glue and frame glue on the cover plate 50, arranging the frame glue around the filling glue, positioning and pressing the cover plate 50 and the array substrate 10 in a manner that the filling glue, the frame glue, the moisture absorption glue and the organic light-emitting device 40 are positioned between the cover plate 50 and the array substrate 10, curing the filling glue to form a first packaging part 61, and curing the frame glue to form a second packaging part 62.
The filling adhesive includes epoxy resin (epoxy), acrylic resin (acrylic) and other organic materials. The sealant includes an organic material such as epoxy resin (epoxy) and acrylic resin (acrylic). The frame glue can be a resin material with high water resistance. The high water resistance means that the water oxygen transmittance of the frame glue is less than or equal to 60 g/(m)224 h). The filling adhesive has a first viscosity, and the frame adhesive has a second viscosity. The first viscosity is less than the second viscosity. For example, the filling adhesive is in a liquid state, and the frame adhesive is in a solid state, which is a paste. The material of the hygroscopic glue 63 may include hygroscopic metal oxides such as calcium oxide (CaO), barium oxide (BaO), magnesium oxide (MgO), and the like.
The filling glue, the frame glue and the moisture absorption glue can be coated by a dispenser. The cover plate 50 and the array substrate 10 are pressed together in an inert gas or under vacuum. The curing mode of the filling adhesive and the frame adhesive can be ultraviolet irradiation or thermal curing.
The first encapsulating portion 61 is filled between the organic light emitting device 40, the planarization layer 30 and the cover plate 50, covers at least a portion of the concave-convex structure 31, and extends from the display area to the frame area BA. The two sealing parts 62 are located in the frame area BA and connected between the planarization layer 30 and the cover plate 50 around the first sealing part 61. The second encapsulant portion 62 may cover a portion of the relief structure 31. In other embodiments of the present application, the second sealing portion 62 may not cover the concave-convex structure 31, and the first sealing portion 61 may completely cover the concave-convex structure 31. The moisture absorbent glue 63 is located between the first and second packing portions 61 and 62. The first encapsulation part 61 serves to encapsulate the organic light emitting device 40 and provide mechanical strength to the organic light emitting display panel. The second encapsulation part 62 serves to bond the array substrate 10 and the cover plate 50 and prevent moisture from intruding. The moisture absorbent 63 absorbs moisture entering the organic light emitting display panel 100 from the outside.
Referring to fig. 4, in one embodiment, the packaging method of the organic light emitting display panel 200 is a modification of the Dam/Getter/Fill packaging method. Step S5 may include:
adding moisture absorbing particles 264 to the frame glue; and
providing a cover plate 250, forming a filling adhesive and a frame adhesive on the cover plate 250, arranging the frame adhesive around the filling adhesive, aligning and laminating the cover plate 250 and the array substrate in a manner that the filling adhesive, the frame adhesive and the organic light emitting device 240 are positioned between the cover plate 250 and the array substrate, curing the filling adhesive to form a first packaging part 261, and curing the frame adhesive to form a second packaging part 262.
The filling adhesive includes epoxy resin (epoxy), acrylic resin (acrylic) and other organic materials. The sealant includes an organic material such as epoxy resin (epoxy) and acrylic resin (acrylic). The high water resistance means that the water oxygen transmittance of the frame glue is less than or equal to 60 g/(m)224 h). The filling adhesive has a first viscosity, and the frame adhesive has a second viscosity. The first viscosity is less than the second viscosity. For example, the filling adhesive is in a liquid state, and the frame adhesive is in a solid state, which is a paste. The material of the moisture absorbing particles 264 may include hygroscopic metal oxides such as calcium oxide (CaO), barium oxide (BaO), and magnesium oxide (MgO).
The filling glue, the frame glue and the moisture absorption glue can be coated by a dispenser. The cover plate 50 and the array substrate 10 are pressed together in an inert gas or under vacuum. The curing mode of the filling adhesive and the frame adhesive can be ultraviolet irradiation or thermal curing.
The encapsulation layer 260 includes a first encapsulation portion 261. The first encapsulation part 261 is filled between the organic light emitting device 240, the planarization layer 230 and the cover plate 250, covers at least a portion of the concave-convex structure 231, and extends from the display area AA to the frame area BA. The encapsulation layer 260 further includes a second encapsulation portion 262, and the second encapsulation portion 262 is located in the frame area BA and connected between the planarization layer 230 and the cover plate 250 around the first encapsulation portion 261. The second encapsulation part 262 may cover a portion of the concave-convex structure 231. In other embodiments of the present application, the second sealing portion 262 may not cover the concave-convex structure 231, and the first sealing portion 261 may completely cover the concave-convex structure 231. The material of the first encapsulation 261 includes a filling glue (Fill glue). The material of the second sealing portion 262 includes sealant (Dam sealant). The first encapsulation part 261 serves to encapsulate the organic light emitting device 240 and provide mechanical strength to the organic light emitting display panel. The second encapsulation part 262 serves to bond the array substrate and the cover plate 250 and prevent moisture from being introduced. The moisture absorbing particles 264 are added to the second sealing portion 262. The moisture absorbing particles 264 serve to absorb moisture that enters the organic light emitting display panel 100 from the outside.
Referring to fig. 5, in another embodiment, a packaging method of the organic light emitting display panel 300 is a surface mount packaging method. Step S5 may include:
providing a cover plate 350, forming a surface mount package adhesive on the cover plate 350, aligning and pressing the cover plate 350 and the array substrate in a manner that the surface mount package adhesive and the organic light emitting device 340 are located between the cover plate 350 and the array substrate, and curing the surface mount package adhesive to form a first package portion 361.
The surface-mount packaging adhesive comprises a bonding layer which is bonded to a substrate and absorbs impact to protect an OLED light-emitting layer. The adhesive layer may be a transparent double-sided tape. The surface-mount packaging adhesive can also comprise a water absorption layer, and the water absorption layer contains a metal oxide drying agent.
Step S5: after the steps of providing a cover plate 350, forming a surface mount package adhesive on the cover plate 350, aligning and pressing the cover plate 350 and the array substrate in a manner that the surface mount package adhesive and the organic light emitting device 340 are located between the cover plate 350 and the array substrate, and curing the surface mount package adhesive to form the first package portion 361, the steps may further include: an edge sealing adhesive is formed between the cover plate 350 and the array substrate 310 and cured to form a second encapsulation part 362. The second encapsulant 362 is located in the frame area BA, and is connected between the planarization layer 330 and the cover plate 350 around the first encapsulant 361, so as to further isolate the external moisture. The material of the side seal may also include one or more of an acrylic resin and an epoxy resin. The second encapsulation part 362 may be black, which may prevent light leakage from the side when the OLED emits light.
According to the organic light-emitting display panel and the manufacturing method thereof, the flat layer above the GOA circuit is patterned to form the concave-convex structure, the adhesion between the packaging layer and the array substrate can be increased on the premise of protecting the GOA circuit, the water vapor invasion channel is prolonged, the water vapor invasion is delayed, and therefore a good narrow-frame packaging effect is achieved.
The foregoing provides a detailed description of embodiments of the present application, and the principles and embodiments of the present application have been described herein using specific examples, which are presented solely to aid in the understanding of the present application. Meanwhile, for those skilled in the art, according to the idea of the present application, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present application.
Claims (10)
1. An organic light emitting display panel, comprising:
the array substrate comprises a display area and a frame area positioned at the periphery of the display area;
the row driving circuit is arranged in the frame area;
the flat layer covers the array substrate and the row driving circuit, wherein a concave-convex structure is formed on the surface far away from the row driving circuit, and the concave-convex structure is arranged corresponding to the row driving circuit;
an organic light emitting device on the planarization layer of the display region and electrically connected to the array substrate,
the cover plate is positioned on one side of the array substrate, which is provided with the organic light-emitting device, and is arranged opposite to the array substrate; and
and the packaging layer is filled among the organic light-emitting device, the flat layer and the cover plate, covers the concave-convex structure and extends from the display area to the frame area.
2. The organic light emitting display panel according to claim 1, wherein the encapsulation layer includes a first encapsulation portion, the first encapsulation portion is filled between the organic light emitting device, the planarization layer, and the cover plate, covers at least a portion of the concave-convex structure, and extends from the display region to the frame region, the encapsulation layer further includes a second encapsulation portion, the second encapsulation portion is located in the frame region and connected between the planarization layer and the cover plate around the first encapsulation portion, the first encapsulation portion is made of a filling adhesive, and the second encapsulation portion is made of a frame adhesive.
3. The organic light emitting display panel according to claim 2, wherein the encapsulation layer further comprises a moisture absorbent disposed between the first encapsulation portion and the second encapsulation portion.
4. The organic light-emitting display panel according to claim 2, wherein moisture-absorbing particles are added in the second sealing portion.
5. The organic light-emitting display panel according to claim 2, wherein the water oxygen transmittance of the sealant is less than or equal to 60 g/(m)2·24h)。
6. The organic light emitting display panel according to claim 2, wherein the encapsulation layer is a surface mount encapsulation layer, the encapsulation layer includes a first encapsulation portion, the first encapsulation portion is filled between the organic light emitting device, the planarization layer and the cover plate, covers at least a portion of the concave-convex structure, extends from the display area to the bezel area, and the first encapsulation portion is made of a surface mount encapsulation adhesive.
7. The organic light emitting display panel according to claim 6, wherein the encapsulation layer further comprises a second encapsulation portion, the second encapsulation portion is located in the frame region and connected between the planarization layer and the cover plate around the first encapsulation portion, and the material of the second encapsulation portion is a side sealant.
8. The organic light emitting display panel of claim 1, further comprising a thin film encapsulation layer for encapsulating the organic light emitting device, the thin film encapsulation layer being located between the planarization layer and the encapsulation layer and extending from the display region to the bezel region.
9. A method of manufacturing an organic light emitting display panel, comprising the steps of:
providing an array substrate, wherein the array substrate comprises a display area and a frame area positioned on the periphery of the display area, and a row driving circuit is arranged in the frame area;
forming a flat layer on the array substrate and the row driving circuit, patterning the flat layer to form a concave-convex structure on a surface far away from the row driving circuit, wherein the concave-convex structure is arranged corresponding to the row driving circuit;
forming an organic light emitting device on the flat layer of the display area, and electrically connecting the organic light emitting device and the array substrate;
providing a cover plate, forming an encapsulation material on the cover plate, aligning and pressing the cover plate and the array substrate in a mode that the encapsulation material and the organic light-emitting device are positioned between the cover plate and the array substrate, and curing the encapsulation material to form an encapsulation layer;
the packaging layer is filled among the organic light-emitting device, the flat layer and the cover plate, covers the concave-convex structure and extends from the display area to the frame area.
10. The method of claim 9, wherein the providing a cover plate, forming an encapsulation material on the cover plate, aligning and pressing the cover plate and the array substrate in such a manner that the encapsulation material and the organic light emitting device are positioned between the cover plate and the array substrate, and curing the encapsulation material to form an encapsulation layer comprises:
providing a cover plate, forming filling glue and frame glue on the cover plate, wherein the frame glue surrounds the filling glue, aligning and pressing the cover plate and the array substrate in a manner that the filling glue, the frame glue and the organic light-emitting device are positioned between the cover plate and the array substrate, curing the filling glue to form a first packaging part, and curing the frame glue to form a second packaging part;
the first packaging part is filled among the organic light-emitting device, the flat layer and the cover plate, extends from the display area to the frame area, covers at least part of the concave-convex structure, and is positioned in the frame area and connected between the flat layer and the cover plate around the first packaging part.
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