KR102355849B1 - Organic light emitting display device and method for manufacturing the same - Google Patents

Abstract

An organic light emitting diode display according to an embodiment of the present invention includes a first substrate, a second substrate positioned on the first substrate, a filler positioned between the first substrate and the second substrate, and a space between the first substrate and the second substrate. An organic light emitting display device comprising: a dam positioned to surround the filler; and an auxiliary dam disposed on at least one of a first substrate and a second substrate to prevent mixing of the filler into the upper or lower portion of the dam. do it with

Description

Organic light emitting display device and manufacturing method thereof

The present invention relates to an organic light emitting display device and a manufacturing method thereof, and more particularly, to an organic light emitting display device capable of improving encapsulation performance by preventing the mixing of unwanted materials at a boundary between a filler and a dam of the organic light emitting display device; It relates to a manufacturing method thereof.

The organic light emitting diode display (OLED) is a self-emission type display device, and unlike a liquid crystal display device (LCD), it does not require a separate light source, so it can be manufactured in a lightweight and thin form. In addition, the organic light emitting diode display is being studied as a next-generation display because it is advantageous in terms of power consumption due to low voltage driving, and has excellent color realization, response speed, viewing angle, and contrast ratio (CR).

An organic light emitting diode display displays an image using light emitted from an organic light emitting diode connected to a thin film transistor in each pixel area.

A device that forms an organic light emitting layer made of an organic material between an anode and a cathode and emits light by applying an electric field. It can be driven at a low voltage, consumes relatively little power, and has a light and flexible upper substrate. It also has a feature that can be manufactured.

The organic light emitting diode display _{is very vulnerable to moisture (H 2} O) or oxygen (O ₂ ), so when moisture or oxygen penetrates into the organic light emitting device including an anode, an organic light emitting layer, and a cathode, oxidation of the metal electrode or the oxidation of the organic light emitting layer Problems such as various defects and reduced life may occur due to deterioration. Therefore, research on various encapsulation methods for protecting the organic light emitting element of the organic light emitting diode display from penetration of moisture or oxygen by sealing the organic light emitting element is being conducted.

The top emission type organic light emitting display device may include a lower substrate on which the organic light emitting element is formed and an upper substrate that is positioned to face the lower substrate and encapsulates the organic light emitting element to protect it from external environments and impacts, and the like. A filler positioned between the lower substrate and the upper substrate and formed to cover the entire surface of the organic light emitting device and an outer portion of the filler, that is, disposed to surround the filler, moisture or oxygen from the side to penetrate into the organic light emitting device It may be configured to include a dam that can minimize the problem.

As described above, the organic light emitting display device should be able to effectively prevent the penetration of external moisture and oxygen through the above-described encapsulation structure to maintain the lifespan of the organic light emitting diode.

However, in the encapsulation structure, a poor bonding state between the upper and lower substrates and the dam may affect the reliability of the organic light emitting diode display.

That is, the line width is determined as the dam is pressed while the upper and lower substrates are in contact with the dam through vacuum bonding. At this time, if the line width of the dam is formed smaller than the target value or a short circuit occurs, the Gas may be introduced, and thus, a defect in which the lifespan of the organic light emitting diode in the organic light emitting diode display may be reduced may be caused.

In addition, in order for the dam to exhibit its original performance, unwanted materials must not flow into the upper or lower portion of the dam before the dam is cured. A defect occurred in that the area passed over or the dam material passed over to the display area including the filler.

As described above, in the organic light emitting diode display, a defect in which unwanted materials are mixed at the boundary between the filler and the dam deteriorates, and the moisture permeation prevention performance at the boundary between the filler and the dam decreases, and the reliability and lifespan of the organic light emitting display decrease. is occurring

SUMMARY OF THE INVENTION An object of the present invention is to provide an organic light emitting display device capable of improving encapsulation performance by preventing mixing of unwanted materials at a boundary between a filler and a dam of the organic light emitting display device, and a method of manufacturing the same.

Another object of the present invention is to provide an organic light emitting diode display capable of improving reliability and lifespan of the organic light emitting display device and a method of manufacturing the same.

The problems to be solved according to the embodiment of the present invention are not limited to the problems mentioned above, and other problems not mentioned will be clearly understood by those skilled in the art from the following description.

According to the organic light emitting diode display and the method for manufacturing the same according to various embodiments of the present disclosure, the encapsulation performance may be improved by preventing the mixing of unwanted materials at the boundary between the filler and the dam of the organic light emitting display device. and a method for preparing the same.

An organic light emitting diode display according to an exemplary embodiment includes a first substrate, a second substrate positioned on the first substrate, a filler positioned between the first substrate and the second substrate, and a space between the first substrate and the second substrate. An organic light emitting display device comprising: a dam positioned to surround the filler; and an auxiliary dam disposed on at least one of a first substrate and a second substrate to prevent mixing of the filler into the upper or lower portion of the dam. do it with

A part of the auxiliary dam is disposed inside the organic light emitting diode display rather than the dam, and the auxiliary dam may prevent the inflow of the filler into the dam through the interface between the first and second substrates and the dam.

A cross-section of one side of the auxiliary dam may have an inverted taper shape.

The auxiliary dam may be made of negative photoresist.

An interior angle between the reverse taper surface of the auxiliary dam and the plane of the substrate may be 90 degrees or more and 135 degrees or less.

The height of the auxiliary dam may be 2um to 5um.

A dam may be arranged to cover a portion of the auxiliary dam.

The auxiliary dam includes a first auxiliary dam disposed on the first substrate and a second auxiliary dam disposed on the second substrate. The first auxiliary dam and the second auxiliary dam may be disposed to be sufficiently spaced apart so as not to be damaged by contacting each other.

In another aspect, in an organic light emitting diode display according to another embodiment of the present invention, the thin film transistor substrate and the color filter substrate facing each other are bonded together and a filler provided to fill the space between the inner surfaces of the thin film transistor substrate and the color filter substrate. It is characterized in that it is an organic light emitting display device including a dam enclosing and sealing the filler along the periphery, and a structure configured to solve the mixing phenomenon of unwanted materials between the filler and the dam.

The structure is positioned at least at the interface between the thin film transistor substrate and the dam, and may be configured to have sufficient properties to prevent mixing of materials.

The properties may be configured to have at least one of a reverse tapered shape, a certain thickness, a certain height, and a special material sufficient to prevent incorporation of materials.

The filler and the dam may be formed of an epoxy material, and the structure may be formed of a negative photoresist.

The structure is additionally positioned at the interface between the color filter substrate and the dam, and may be configured to have sufficient properties to prevent material mixing.

The width of the structure may increase further away from the substrate on which the structure is disposed.

The organic light emitting diode display may be a top emission type.

In addition, the method for manufacturing an organic light emitting display device according to an embodiment of the present invention includes the steps of: forming a first auxiliary dam through exposure and developing processes after applying a photoresist to a first substrate; forming a second auxiliary dam through exposure and development processes after applying a photoresist to the second substrate; and forming a dam on the second substrate to cover a part of the second auxiliary dam; It characterized in that it comprises the step of applying a filler to the inside of the dam of the second substrate and bonding the first substrate and the second substrate.

The forming of the first auxiliary dam may further include forming a first auxiliary dam having an inverted taper shape using a negative photoresist on the first substrate.

The bonding of the first substrate and the second substrate may further include bonding the dam formed on the second substrate to cover a portion of the first auxiliary dam formed on the first substrate.

Before forming the first auxiliary dam, the method may further include forming a thin film transistor and a bank on the first substrate.

After forming the second auxiliary dam, the method may further include forming a color filter on the second substrate.

In the organic light emitting diode display according to an embodiment of the present invention, an auxiliary dam is formed on at least one of the upper and lower substrates to prevent the mixing of unwanted materials at the boundary between the filler and the dam. It is possible to prevent defects due to mixing of the filler into the lower portion and to improve encapsulation performance of the organic light emitting diode display.

In addition, in the organic light emitting diode display according to an embodiment of the present invention, the reliability and lifespan of the organic light emitting display may be improved by minimizing the occurrence of poor mixing of materials between the filler and the dam.

The effects of the present invention are not limited to the above-mentioned effects, and other effects not mentioned will be clearly understood by those skilled in the art from the following description.

Since the content of the invention described in the problems to be solved above, the means for solving the problems, and the effects do not specify the essential characteristics of the claims, the scope of the claims is not limited by the matters described in the content of the invention.

1 is a diagram illustrating a schematic plan structure of an organic light emitting diode display according to an exemplary embodiment.
2 is a diagram illustrating a cross-sectional structure of an organic light emitting diode display according to an exemplary embodiment.
3 is a diagram illustrating a cross-sectional structure of an organic light emitting diode display according to another exemplary embodiment of the present invention.
4 is a diagram illustrating a cross-sectional structure of an organic light emitting diode display according to another exemplary embodiment of the present invention.
5 is a flowchart illustrating a method of manufacturing an organic light emitting diode display according to an exemplary embodiment.
6A to 6H are cross-sectional views illustrating a method of manufacturing an organic light emitting display device according to an exemplary embodiment.

Advantages and features of the present invention and methods of achieving them will become apparent with reference to the embodiments described below in detail in conjunction with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but will be embodied in various different forms, and only these embodiments allow the disclosure of the present invention to be complete, and common knowledge in the technical field to which the present invention pertains It is provided to fully inform those who have the scope of the invention, and the present invention is only defined by the scope of the claims.

The shapes, sizes, proportions, angles, numbers, etc. disclosed in the drawings for explaining the embodiments of the present invention are illustrative and the present invention is not limited to the illustrated matters. Like reference numerals refer to like elements throughout. In addition, in describing the present invention, if it is determined that a detailed description of a related known technology may unnecessarily obscure the gist of the present invention, the detailed description thereof will be omitted. When 'including', 'having', 'consisting', etc. mentioned in this specification are used, other parts may be added unless 'only' is used. When a component is expressed in the singular, cases including the plural are included unless otherwise explicitly stated.

In interpreting the components, it is construed as including an error range even if there is no separate explicit description. In the case of a description of the positional relationship, for example, when the positional relationship of two parts is described as 'on', 'on', 'on', 'beside', etc., 'right' Alternatively, one or more other parts may be positioned between two parts unless 'directly' is used.

Also, although the first, second, etc. are used to describe various components, these components are not limited by these terms. These terms are only used to distinguish one component from another. Accordingly, the first component mentioned below may be the second component within the spirit of the present invention.

Each feature of the various embodiments of the present invention can be partially or wholly combined or combined with each other, technically various interlocking and driving are possible, and each of the embodiments may be independently implemented with respect to each other or implemented together in a related relationship. may be

Hereinafter, an organic light emitting display device and a method of manufacturing the same according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings.

1 is a diagram illustrating a schematic plan structure of an organic light emitting diode display according to an exemplary embodiment.

Referring to FIG. 1 , an organic light emitting diode display 100 according to an embodiment of the present invention includes a first substrate 110 , which is a lower substrate, and a display area A/A defined on the first substrate 110 . An organic light emitting device (OLED) including an organic light emitting layer (Emission Layer) positioned between a thin film transistor array and a first electrode (anode) and a second electrode (cathode) and made of a multi-layered organic material. can be configured.

The organic light emitting diode display 100 according to an embodiment of the present invention is defined by a gate line and a data line formed in a matrix form crossing each other on a first substrate 110 . It may be configured to have a plurality of sub-pixels.

In addition, the organic light emitting diode display 100 according to an embodiment of the present invention includes a red sub-pixel emitting red light, a green sub-pixel emitting green light, a blue sub-pixel emitting blue light, and a white light emitting white light. It may be composed of a plurality of pixels including sub-pixels, but is not limited thereto.

The display area A/A of the organic light emitting diode display 100 according to an embodiment of the present invention, which is composed of a plurality of sub-pixels, is configured to include a thin film transistor TFT and an organic light emitting diode OLED. A gate line, a data line, a sensing signal line for supplying power and a signal to the plurality of sub-pixels, a gate line, a data line, a sensing signal line, A plurality of lines including a reference power line (Vref line), a first power line (VDD line), and a second power line (VSS line) may be formed.

In addition, in the organic light emitting diode display 100 according to an embodiment of the present invention, a passivation layer disposed on the organic light emitting device and a filler disposed on the passivation layer and covering the organic light emitting device and the passivation layer are provided. 180), a dam 140 positioned outside the filler 180 and disposed to surround the filler 180, and a second substrate that is an upper substrate positioned on the filler 180 and the dam 140. can be

More specifically, in the organic light emitting diode display 100 according to an exemplary embodiment, the organic light emitting diode (OLED) encapsulation structure is positioned between the first substrate 110 and the second substrate, and the display area A/A The filler 180 formed to cover the entire surface of the organic light-emitting device and the outer portion of the filler 180, that is, the filler 180, is disposed to minimize penetration of moisture or oxygen into the organic light-emitting device from the side. It may be configured to include a possible dam 140 .

The filler 180 is a transparent filler filling between the first substrate 110 and the second substrate, and may transmit light and may be made of a transparent epoxy material, and serves to protect the organic material in the organic light emitting device. .

The dam 140 serves to bond the first substrate 110 and the second substrate and may be made of an epoxy material including a getter component capable of adsorbing moisture, and the first substrate 110 . After bonding the second substrate to the organic light emitting diode display, it is possible to secure and preserve the lifespan of the organic light emitting diode display by preventing the inflow of external moisture or oxygen into the organic light emitting diode display to protect the organic light emitting element in the organic light emitting diode display.

In the case of a conventional organic light emitting diode display, when the first substrate falls from the top of the second substrate in a vacuum atmosphere to the second substrate to which the dam and the filler are applied, and is pressed by a pressure difference, a filler having a low viscosity at the interface between the two materials Material will rise above the dam area or overflow problems. This may cause a weakening of the inherent adhesive component of the dam as well as non-uniform dam line width.

More specifically, in order for the dam to exhibit its original moisture permeability performance, unwanted substances should not flow into the upper or lower portion of the dam before the dam is cured. A defect occurred in that the two materials were mixed with each other by passing into the dam area or mixing the dam material while passing over the display area including the filler.

In this case, external oxygen and moisture can easily permeate through the corresponding portion, and the permeated oxygen and moisture can react with the organic material of the organic light emitting device in the organic light emitting display device to reduce the lifespan of the organic material. At the boundary of the dam, moisture permeation prevention performance deteriorates, and reliability and lifespan of the organic light emitting diode display are deteriorated.

Referring to FIG. 1 , in order to solve the above problems, in the organic light emitting diode display 100 according to an embodiment of the present invention, the filler is placed on the upper or lower portion of the dam 140 disposed to surround the filler 180 . The auxiliary dam 130 disposed on at least one of the first substrate 110 and the second substrate may be included to prevent mixing of 180 .

A part of the auxiliary dam 130 is disposed inside the organic light emitting diode display 100 rather than the dam 140 , and the auxiliary dam 130 forms the interface between the first substrate 110 and the second substrate and the dam 140 . Through the dam 140, the filler 180 may serve to prevent mixing with the dam 140 material.

In addition, the cross section of one side of the auxiliary dam 130 may have a reverse tapered shape, and the reverse tapered shape of the auxiliary dam 130 may be formed by patterning using a negative photo resist.

FIG. 2 is a diagram illustrating a cross-sectional structure of an organic light emitting diode display according to an exemplary embodiment at a position X-X' of FIG. 1 . Among the components of the organic light emitting diode display 200a illustrated in FIG. 2 , a duplicate description will be omitted for substantially the same components as those of the organic light emitting display apparatus 100 illustrated in FIG. 1 .

An organic light emitting diode display according to an exemplary embodiment of the present invention will be described in detail with reference to FIG. 2 .

Referring to FIG. 2 , in the organic light emitting diode display 200a according to the embodiment of the present invention, the first substrate 210 is not only a glass substrate, but also polyethylen terephthalate (PET), polyethylen naphthalate (PEN), and polyether It may be a plastic substrate such as polyimide.

A buffer layer for blocking penetration of impure elements may be provided on the first substrate 210 . The buffer layer may be formed of, for example, a single-layer or multi-layer structure of silicon nitride (SiNx) or silicon oxide (SiOx).

In the organic light emitting diode display 200a according to an embodiment of the present invention, a thin film transistor (TFT) array configured on the first substrate 210 includes a gate electrode, a gate insulating layer, a semiconductor layer, and a source electrode and a drain electrode. may be included. It may also include a passivation layer and a planarization layer disposed on the thin film transistor array.

More specifically, the gate electrode of the thin film transistor array functions to transmit a gate signal to the thin film transistor array, and Al, Pt, Pd, Ag, Mg, Au, Ni, Nd, Ir, Cr, Li, Ca, Mo, At least one metal or alloy of Ti, W, and Cu may be formed as a single layer or a plurality of layers. The gate insulating layer may be made of an inorganic insulating material such as SiOx or SiNx.

In addition, the semiconductor layer may be made of a metal oxide, for example, any one of Indium Galium Zinc Oxide (IGZO), Zinc Tin Oxide (ZTO), and Zinc Indium Oxide (ZIO), but is not limited thereto, and amorphous silicon (Amorphous silicon) ) or polysilicon.

In addition, the source electrode and the drain electrode electrically connected to the semiconductor layer may be formed of a high-melting-point metal such as chromium (Cr) or tantalum (Ta).

The protective layer or planarization layer may be made of an organic or inorganic film having hydrophobic properties, for example, polystyrene, siloxane series resin, acrylic resin SiON, silicon nitride ( SiNx), silicon oxide (SiOx), may be formed of any one of aluminum oxide (AlOx).

Also, referring to FIG. 2 , in the organic light emitting diode display 200a according to an embodiment of the present invention, the organic light emitting device 220 is configured to be connected to a lower thin film transistor array, and includes a first electrode and a second electrode. It may be configured to include an organic light emitting layer disposed between an electrode and a first electrode and a second electrode and made of a multi-layered organic material.

In addition, the organic light emitting device 220 includes a first electrode, a multi-layered organic material layer including an organic light emitting layer positioned on the exposed first electrode, a bank exposing a portion of the first electrode by overlapping the first electrode, and an organic light emitting layer. and a second electrode formed on the entire surface to cover the multi-layered organic material layer and the bank.

More specifically, the first electrode disposed on the protective layer or the planarization layer of the thin film transistor array has a relatively large work function value to serve as an anode (anode), and a transparent conductive material, for example, ITO (Indium Tin Oxide) or It may be formed of any one of a metal oxide such as indium zinc oxide (IZO), a mixture of a metal and oxide such as ZnO:Al or SnO2:Sb, carbon nanotubes, graphene, and silver nanowires.

In addition, when the organic light emitting diode display is a top emission type, a metal material having excellent reflection efficiency, for example, aluminum (Al) or silver (Ag), is formed on the upper or lower portion of the first electrode to improve reflection efficiency. A reflective electrode such as the following may be additionally formed as an auxiliary electrode.

In describing the embodiment of the present invention, the top emission method refers to a method in which light emitted from the organic emission layer is emitted in the direction of the upper substrate 250 , and the bottom emission method refers to a top emission method It refers to a method in which light is emitted in a direction opposite to that of the lower substrate 210 .

The bank defines a light emitting area of the organic light emitting diode display 200a, and includes an organic material having hydrophobicity, for example, polystyrene (Polystylene), polymethyl methacrylate (PMMA), benzocyclobuteneseries resin, It may be made of a siloxane series resin, a silane resin, an acrylic resin, or the like.

The organic material layer may consist of a plurality of multilayers, for example, between the first electrode and the second electrode, a hole injection layer, a hole transport layer, an organic emission layer, an electron It may include a transport layer (Electron Transporting Layer) and an electron injection layer (Electron Injection Layer).

The second electrode may be a cathode (cathode), and is made of a material having a relatively small work function value. For example, when the organic light emitting diode display is a bottom light emitting device, a single layer of an alloy comprising a metal having high reflectance and a first metal, for example, Ag, and a second metal, for example, Mg, etc. in a certain ratio, or these may be made of a plurality of layers of In addition, a capping layer for improving light efficiency may be additionally configured on the second electrode.

In addition, a passivation layer may be positioned on the second electrode of the organic light emitting diode 220 . The protective layer is located on the organic light emitting device 220 and is formed to completely cover the organic light emitting device 220 to protect the organic material layer including the organic light emitting layer and internal devices from _{external moisture (H 2} 0) or oxygen (O _{2 ).} function can be performed.

In addition, the passivation layer may be formed by a physical vapor deposition process such as sputtering or thermal deposition, or a chemical vapor deposition process.

In addition, the organic light emitting diode display 200a according to an embodiment of the present invention is positioned to face the first substrate 210 and is positioned on the organic light emitting diode 220 and the passivation layer to serve as an encapsulation. 250 , and the second substrate 250 is bonded to the first substrate 210 on which the organic light emitting device 220 is disposed through the dam 240 and the filler 280 .

In addition, in the case of a top emission type organic light emitting display device that emits light in an upper direction of the first substrate 210 , a color filter 260 may be formed on the second substrate 250 .

Also, referring to FIG. 2 , the organic light emitting diode display 200a according to an exemplary embodiment is positioned between the first substrate 210 and the second substrate 250 and the front surface of the organic light emitting diode 220 in the display area. It may include a filler 280 formed to cover the.

The filler 280 is a transparent filler filling the space between the first substrate 210 and the second substrate 250 and may transmit light and may be made of a transparent epoxy material, but is not limited thereto. It serves to protect organic materials. The filler 280 may be applied as a liquid to the inside of the dam 240 through, for example, inkjet, slit coating, or screen printing.

Also, referring to FIG. 2 , the organic light emitting diode display 200a according to an embodiment of the present invention is disposed to surround the outer portion of the filler 280 , that is, the filler 280 , so that moisture or oxygen emits organic light from the side surface. It may be configured to include a dam 240 that can minimize penetration into the device.

The dam 240 serves to bond the first substrate 210 and the second substrate 250 and may be made of an epoxy material including a getter component capable of adsorbing moisture, but is not limited thereto. , after bonding the first substrate 210 and the second substrate 250 to the inside of the organic light emitting diode display 200a, preventing the inflow of external moisture or oxygen to protect the organic light emitting element in the organic light emitting display device. It can play a role in securing and preserving the life of the device.

The dam 240 may include a base made of a curable material and a desiccant capable of absorbing moisture in response to moisture, and the desiccant is P ₂ O ₅ , Li ₂ O, Na ₂ O, BaO, CaO, MgO, Li ₂ SO ₄ , Na ₂ SO ₄ , CaSO ₄ , MgSO ₄ , CoSO ₄ , Ga ₂ (SO ₄ ) ₃ , Ti(SO ₄ ) ₂ , NiSO ₄ , CaCl ₂ , MgCl ₂ , SrCl ₂ , YCl ₃ , CuCl _{2 , CsF, TaF 5, NbF 5} , LiBr, CaBr 2, CeBr 3, SeBr 4, VBr 3, MgBr 2, BaI 2, MgI 2, Ba (ClO 4) 2 and Mg (ClO _4), selected from the group consisting of ₂ It may include at least one material.

In the case of a conventional organic light emitting diode display, when the first substrate falls from an upper portion of the second substrate and is bonded to the second substrate to which the dam and the filler are applied in a vacuum atmosphere, a filler having a lower viscosity among the two materials is used at the interface between the two materials in the dam region. It was mixed while rising or overflowing, resulting in a defect in which the two materials were mixed with each other.

Referring to FIG. 2 , the organic light emitting diode display 200a according to an embodiment of the present invention may prevent mixing of the filler 280 into the upper or lower portion of the dam 240 disposed to surround the filler 280 . The structure may include a first auxiliary dam 230 disposed on the first substrate 210 and a second auxiliary dam 270 disposed on the second substrate 250 .

Also, referring to FIG. 2 , a portion of the first auxiliary dam 230 disposed on the first substrate 210 and the second auxiliary dam 270 disposed on the second substrate 250 is more organic than the dam 240 . It is disposed inside the device 200a, and the first auxiliary dam 230 and the second auxiliary dam 270 are connected to the first substrate 210 and the second substrate 250 through the interface between the dam 240 and the dam ( 240) may serve to prevent the mixing of the filler 280 with the dam 240 material.

Also, referring to FIG. 2 , cross-sections of at least one side of the first auxiliary dam 230 and the second auxiliary dam 270 may have a reverse tapered shape, and more specifically, the first auxiliary dam 230 and the second auxiliary dam 270 . The width of the dam 270 may increase as the distance from the substrate on which the first auxiliary dam 230 and the second auxiliary dam 270 is disposed increases. The reverse tapered shape of the first auxiliary dam 230 and the second auxiliary dam 270 may be formed by patterning through an exposure and development process using a negative photo resist.

More specifically, when ultraviolet (UV) light is irradiated to the negative photoresist through a mask on the negative photoresist-coated substrate, the area irradiated with ultraviolet light may be developed by a developer due to chemical change. When a curtain remains Since the chemical change caused by UV irradiation as described above is greatest on the surface that has the fastest contact time with UV light, there is a difference in the development time of the negative photoresist during the developing process with the developer, so that the cross section has a reverse tapered shape. can be formed.

The reverse tapered structure of the first auxiliary dam 230 and the second auxiliary dam 270 avoids a phenomenon in which the filler 280 applied as a liquid may overflow into the dam 240 due to the movement characteristics of the fluid. can be effectively prevented.

In addition, referring to FIG. 2 , the first auxiliary dam 230 and the second auxiliary dam 270 may be disposed to be partially covered by the auxiliary dam. As described above, the first auxiliary dam 230 and the second auxiliary dam 270 formed inside the upper and lower portions of the dam 240 block the inflow path of the filler 280 to the dam 240 to the dam 240 . Incorporation of fillers can be prevented.

In addition, an interior angle between the reverse tapered surfaces of the first auxiliary dam 230 and the second auxiliary dam 270 and the planes of the first substrate 210 and the second substrate 250 is formed at a level of 90 degrees or more and 135 degrees or less. can be

In addition, the height of the first auxiliary dam 230 and the second auxiliary dam 270 is 2 μm to 2 μm in consideration of the cell gap when the first substrate 210 and the second substrate 250 of the organic light emitting diode display are bonded. It may be formed at a level of 5 μm, and as shown in FIG. 2 , during the vacuum bonding process and the bubble removal process between the first substrate 210 and the second substrate 250 , the first auxiliary dam 230 and It is preferable that the second auxiliary dams 270 are spaced apart sufficiently so that they do not come into contact with each other and are not damaged.

As described above, in the organic light emitting diode display 200a according to an embodiment of the present invention, the first auxiliary dam 230, which is a structure capable of resolving the mixing phenomenon of unwanted materials between the filler 280 and the dam 240 , is first formed therein. The thin film transistor and the organic light emitting diode are disposed at the interface between the first substrate 210 and the dam 240 , and the second auxiliary dam 270 is formed at the interface between the second substrate 250 on which the color filter is formed and the dam 240 . It can be configured to have sufficient properties to prevent the incorporation of substances by placing them in the . That is, the property may be configured such that the structure has at least one of a reverse tapered shape, a specific thickness, a certain level of separation distance, and a special material.

3 is a diagram illustrating a cross-sectional structure of an organic light emitting diode display according to another exemplary embodiment of the present invention at a position X-X' of FIG. 1 .

FIG. 4 is a diagram illustrating a cross-sectional structure of an organic light emitting diode display according to another exemplary embodiment of the present invention at a position X-X' of FIG. 1 .

In the description of the organic light emitting diode display according to another exemplary embodiment and another exemplary embodiment with reference to FIGS. 3 and 4 , a configuration different from the previous exemplary embodiment is the same as described in the previous exemplary embodiment because the auxiliary dam is disposed. Alternatively, redundant detailed descriptions of corresponding components will be omitted.

First, referring to FIG. 3 , an organic light emitting diode display 200b according to another embodiment of the present invention includes a first substrate 210 , an organic light emitting diode 220 including a thin film transistor, an auxiliary dam 270b , and a dam 240 . ), a filler 280 , a color filter 260 and a second substrate 250 . In the case of the organic light emitting diode display 200b according to another embodiment of the present invention, the auxiliary dam 270b may be formed inside the dam 240 only on the second substrate 250 .

A part of the auxiliary dam 270b disposed on the second substrate 250 as described above may be disposed inside the organic light emitting diode display 200b rather than the dam 240 , and the auxiliary dam 270b may be disposed on the second substrate ( 250) and the dam 240 may serve to prevent the mixing of the filler 280 with the material of the dam 240 by mixing into the dam 240 through the interface.

Also, referring to FIG. 4 , an organic light emitting diode display 200c according to another embodiment of the present invention includes a first substrate 210 , an organic light emitting diode 220 including a thin film transistor, an auxiliary dam 230c, and a dam ( 240 ), a filler 280 , a color filter 260 , and a second substrate 250 . In the case of the organic light emitting diode display 200c according to another embodiment of the present invention, the auxiliary dam 230c may be formed inside the dam 240 only on the first substrate 210 .

A part of the auxiliary dam 230c disposed on the first substrate 250 as described above may be disposed inside the organic light emitting diode display 200c rather than the dam 240 , and the auxiliary dam 230c may be disposed on the first substrate ( 250) and the dam 240 may serve to prevent the mixing of the filler 280 with the material of the dam 240 by mixing into the dam 240 through the interface.

3 and 4, the cross section of at least one side of the auxiliary dams 270b and 230c may have a reverse tapered shape, and more specifically, the width of the auxiliary dams 270b and 230c is the auxiliary dam 270b, 230c) may increase further away from the disposed substrate. The reverse tapered shape of the auxiliary dams 270b and 230c may be formed by patterning through an exposure and development process using a negative photoresist.

The reverse tapered structure of the auxiliary dams 270b and 230c can effectively prevent the filling agent 280 applied as a liquid from overflowing into the dam 240 due to the movement characteristics of the fluid.

Also, referring to FIGS. 3 and 4 , the auxiliary dams 270b and 230c may be disposed to be partially covered by the dam 240 , respectively.

In addition, an interior angle between the reverse tapered surfaces of the auxiliary dams 270b and 230c and the planes of the first and second substrates 210 and 250 may be formed at a level of 90 degrees or more and 135 degrees or less.

5 is a flowchart illustrating a method of manufacturing an organic light emitting display device according to an exemplary embodiment of the present invention. 6A to 6H are cross-sectional views illustrating a method of manufacturing an organic light emitting diode display according to an exemplary embodiment. Among the components of the organic light emitting diode display 600 illustrated in FIGS. 6A to 6H , a redundant description will be omitted for substantially the same components as those of the organic light emitting display apparatus 100 illustrated in FIG. 1 .

Hereinafter, a method of manufacturing an organic light emitting diode display according to an exemplary embodiment of the present invention will be described in detail with reference to FIGS. 5 and 6A to 6H .

First, referring to FIG. 5 , in the method of manufacturing an organic light emitting diode display according to an embodiment of the present invention, a first auxiliary dam is formed through an exposure and development process after a photoresist is applied to a first substrate ( S510 ).

More specifically, referring to FIG. 6A , in the step of forming the first auxiliary dam 630 , the first auxiliary dam 630 having an inverted taper shape is formed by using a negative photoresist 625 on the first substrate 610 . It may further include the step of forming.

After coating the negative photoresist 665 on the first substrate 610 to a level of 2um to 5um, using a mask 690 to irradiate and expose to ultraviolet (UV) light, and then develop the first substrate 610 with a developer. A first auxiliary dam 630, which is a structure having an inverse taper shape, is formed there.

Also, before forming the first auxiliary dam 630 , the method may further include forming a thin film transistor and a bank on the first substrate 610 .

Next, referring to FIG. 5 , an organic light emitting device is formed on the first substrate ( S520 ).

More specifically, referring to FIG. 6B , an organic light emitting device 620 including an organic light emitting layer and a second electrode is formed on a thin film transistor formed on a first substrate 610 and a bank, and the organic light emitting device is formed. A protective layer is formed on the 620 .

Next, referring to FIG. 5 , after a photoresist is applied to the second substrate 650 , a second auxiliary dam is formed through an exposure and development process ( S530 ).

More specifically, referring to FIG. 6C , in the step of forming the second auxiliary dam 670 , the second auxiliary dam 670 having an inverted taper shape is formed by using a negative photoresist 665 on the second substrate 650 . It may further include the step of forming.

After coating the negative photoresist 665 on the second substrate 650 to a level of 2um to 5um, using a mask 690 to irradiate and expose to ultraviolet (UV) light, and then develop the second substrate 650 with a developer. A second auxiliary dam 670, which is a structure having an inverse taper shape, is formed there.

Also, referring to FIG. 6D , after forming the second auxiliary dam 670 , the method may further include forming a color filter 660 on the second substrate 650 .

Next, referring to FIG. 5 , a dam is formed on the second substrate to cover a part of the second auxiliary dam ( S540 ).

More specifically, referring to FIG. 6E , the second auxiliary dam 670 is formed on the second substrate 650 on which the second auxiliary dam 670 and the color filter 660 are formed in an outward direction of the second auxiliary dam 670 . A dam 640 is formed to cover a part.

Next, referring to FIG. 5 , a filler is applied to the inside of the dam of the second substrate (S550).

More specifically, referring to FIG. 6F , a liquid filler is used inside the dam 640 of the second substrate 650 on which the second auxiliary dam 670 and the color filter 660 are formed using a dispenser 695 . (680) is applied.

Next, referring to FIG. 5 , the first and second substrates are bonded together ( S560 ).

More specifically, referring to FIG. 6G , the second substrate 650 on which the second auxiliary dam 670 , the color filter 660 and the dam 640 are formed, the first auxiliary dam 630 , the thin film transistor, and the organic light emitting device The first substrate 610 on which the 620 is formed is moved to the inside of the vacuum bonding machine, aligned, and then bonded.

Also, more specifically, referring to FIG. 6G , in the step of bonding the first substrate 610 and the second substrate 650 , the dam 640 formed on the second substrate 650 is formed on the first substrate 610 . The method may further include bonding to cover a portion of the first auxiliary dam 630 .

Next, referring to FIG. 6H , after curing the dam 640 by first performing an ultraviolet (UV) curing process on the bonded first substrate 610 and the second substrate 650, a second thermal curing process is performed. The organic light emitting display device is completed by curing the liquid filler 680 by proceeding.

As described above, in the organic light emitting diode display according to various embodiments of the present disclosure, an auxiliary dam is a structure capable of preventing the mixing of unwanted materials at the boundary between the filler and the dam on at least one of the upper and lower substrates. By forming the dam, defects caused by mixing of the filler into the upper or lower portion of the dam can be prevented and the encapsulation performance of the organic light emitting diode display can be improved.

In addition, in the organic light emitting diode display according to various embodiments of the present disclosure, the reliability and lifespan of the organic light emitting display may be improved by minimizing the occurrence of poor mixing of materials between the filler and the dam.

Although the embodiments of the present invention have been described in more detail with reference to the accompanying drawings, the present invention is not necessarily limited to these embodiments, and various modifications may be made within the scope without departing from the technical spirit of the present invention. . Therefore, the embodiments disclosed in the present invention are not intended to limit the technical spirit of the present invention, but to explain, and the scope of the technical spirit of the present invention is not limited by these embodiments. Therefore, it should be understood that the embodiments described above are illustrative in all respects and not restrictive. The protection scope of the present invention should be construed by the following claims, and all technical ideas within the scope equivalent thereto should be construed as being included in the scope of the present invention.

200a: organic light emitting display device
210: first substrate
220: organic light emitting device
230: first auxiliary dam
240: dam
250: second substrate
260: color filter
270: second auxiliary dam
280: filler

Claims (20)

a first substrate;
a second substrate positioned on the first substrate;
a filler positioned between the first substrate and the second substrate;
a dam positioned between the first substrate and the second substrate and disposed to surround the filler; and
an auxiliary dam disposed on at least one of the first substrate and the second substrate to prevent mixing of the filler into an upper portion or a lower portion of the dam;
A cross section of one side of the auxiliary dam has an inverted taper shape.
The method of claim 1,
a portion of the auxiliary dam is disposed inside the organic light emitting diode display rather than the dam;
The auxiliary dam prevents the filler from flowing into the dam through an interface between the first and second substrates and the dam.
delete The method of claim 1,
The auxiliary dam is formed of a negative photoresist in an organic light emitting diode display.
5. The method of claim 4,
An interior angle between the reverse tapered surface of the auxiliary dam and the plane of the substrate is greater than or equal to 90 degrees and less than or equal to 135 degrees.
5. The method of claim 4,
The auxiliary dam has a height of 2 μm to 5 μm.
The method of claim 1,
The organic light emitting diode display is disposed such that the dam covers a part of the auxiliary dam.
3. The method of claim 2,
The auxiliary dam includes a first auxiliary dam disposed on the first substrate and a second auxiliary dam disposed on the second substrate,
The first auxiliary dam and the second auxiliary dam are disposed to be sufficiently spaced apart from each other so that the first auxiliary dam and the second auxiliary dam do not come into contact with each other and be damaged during the bonding process of the first substrate and the second substrate. display device.
a filler provided so that the opposing thin film transistor substrate and the color filter substrate are bonded together and filled therebetween;
a dam enclosing and sealing the filler along the outer surfaces of the thin film transistor substrate and the color filter substrate; and
a structure configured to address undesirable entrainment of substances between the filler and the dam;
The width of the structure increases as the distance from the substrate on which the structure is disposed increases.
10. The method of claim 9,
The structure is positioned at least at an interface between the thin film transistor substrate and the dam, and is configured to have sufficient properties to prevent mixing of the material.
11. The method of claim 10,
The organic light emitting diode display is configured to have at least one of a reverse taper shape, a specific thickness, a predetermined height, and a special material sufficient to prevent mixing of the material.
12. The method of claim 11,
The organic light emitting display device includes the filler and the dam including an epoxy material, and the structure includes a negative photoresist.
12. The method of claim 11,
The structure is additionally positioned at an interface between the color filter substrate and the dam, and is configured to have sufficient properties to prevent mixing of the material.
delete 10. The method of claim 9,
The organic light emitting display device is a top emission type organic light emitting display device.
forming a first auxiliary dam through exposure and development processes after applying a photoresist to the first substrate;
forming an organic light emitting device on the first substrate;
forming a second auxiliary dam through exposure and development processes after applying a photoresist to the second substrate;
forming a dam on the second substrate to cover a portion of the second auxiliary dam;
applying a filler to the inside of the dam of the second substrate; and
and bonding the first substrate and the second substrate together.
17. The method of claim 16,
Forming the first auxiliary dam comprises:
and forming the first auxiliary dam having an inverted taper shape on the first substrate using a negative photoresist.
17. The method of claim 16,
bonding the first substrate and the second substrate,
and bonding the dam formed on the second substrate to partially cover the first auxiliary dam formed on the first substrate.
17. The method of claim 16,
The method of claim 1 , further comprising forming a thin film transistor and a bank on the first substrate before forming the first auxiliary dam.
17. The method of claim 16,
After forming the second auxiliary dam, the method of manufacturing an organic light emitting display device further comprising: forming a color filter on the second substrate.

Images