KR20220093067A - Organic light emitting display device - Google Patents

Abstract

The present specification discloses an organic light emitting display device. The organic light emitting display device includes: an organic light emitting element on an array substrate; an encapsulation structure covering the organic light emitting element to prevent the penetration of moisture or oxygen. The encapsulation structure includes a face seal adhesive containing ferromagnetic substance particles and an encapsulation plate facing the array substrate with the face seal adhesive interposed therebetween.

Description

Organic light emitting display device {ORGANIC LIGHT EMITTING DISPLAY DEVICE}

The present invention relates to an organic light emitting display device and an encapsulation structure.

The image display device that implements various information on the screen is a key technology in the information and communication era, and is developing in the direction of thinner, lighter, portable and high-performance. Accordingly, an organic light emitting display device (OLED) that displays an image by controlling the amount of light emitted from the organic light emitting layer is in the spotlight.

The organic light emitting diode display is a self-luminous device using a thin light emitting layer between electrodes, and has an advantage in that it can be thinned. In addition, the organic light emitting display device is advantageous in terms of power consumption due to low voltage driving, and also has excellent color realization, response speed, viewing angle, and contrast ratio (CR).

A typical organic light emitting display device has a structure in which a pixel driving circuit and an organic light emitting device are formed on a substrate, and an image is displayed while light emitted from the organic light emitting device passes through the substrate or barrier layer. The organic light emitting device is deteriorated due to internal factors such as deterioration of the electrode and the light emitting layer by oxygen and deterioration due to the reaction between the light emitting layer and the interface, and at the same time it is easily deteriorated by external factors such as external moisture, oxygen, ultraviolet rays and the manufacturing conditions of the device. happens In particular, since external oxygen and moisture have a fatal effect on the lifetime of the device, encapsulation of the organic light emitting display device is very important.

As one of the encapsulation methods, there is a method of sealing the upper portion of the organic light emitting diode with a face seal and an encapsulation plate. The cotton encapsulant contains a desiccant to absorb penetrating moisture.

A surface encapsulant is applied to the inner surface of the encapsulation substrate, and is bonded to the pixel array substrate. After the surface encapsulant interposed between the two bonded substrates (the encapsulation substrate and the pixel array substrate) is cured and the pressing force is removed, the organic light emitting diode display has a surface-sealed structure. Glass, plastic, or metal is used as the encapsulation substrate.

An object of the present specification is to provide an organic light emitting diode display and an encapsulation structure used therein. More specifically, an object of the present specification is to provide a cotton encapsulation structure to which various materials can be applied.

According to an embodiment of the present specification, an organic light emitting display device is provided. The organic light emitting display device may include: an organic light emitting device disposed on an array substrate; and an encapsulation structure covering the organic light emitting device to prevent penetration of moisture or oxygen, wherein the encapsulation structure includes a face seal adhesive containing particles of a ferromagnetic substance and the face adhesive member It may include an encapsulation plate facing the array substrate with interposed therebetween.

The surface adhesive member may include a first adhesive layer made of a resin including a moisture absorbent and a second adhesive layer made of a transparent resin, and the ferromagnetic particles may be contained in the first adhesive layer.

The first adhesive layer may be adhered to the encapsulation substrate, and the second adhesive layer may be adhered to a protective layer on the organic light emitting device and an array substrate around the organic light emitting device.

The ferromagnetic particles may have a size of 80% or less of a thickness of the first adhesive layer.

The ferromagnetic particles may be located in a corner region of the first adhesive layer.

The ferromagnetic particles may be included in the first adhesive layer in an amount of 5% to 50% by weight.

The ferromagnetic particles may be made of at least one of iron, nickel, and cobalt.

The encapsulation substrate may be a nonmagnetic substance.

The ferromagnetic particles are provided to fix the encapsulation substrate to a workbench including a magnet in the process performed while the surface adhesive member is attached to the encapsulation substrate.

According to another embodiment of the present specification, there is provided a face seal adhesive film having a multilayer structure that prevents moisture permeation into an organic light emitting diode. The surface-adhesive film may include: a first layer made of a curable resin including a moisture absorbent and ferromagnetic particles; and a second layer made of a transparent curable resin and having one surface in contact with any one surface of the first encapsulation layer.

The ferromagnetic particles may be included in the first layer in an amount of 5% to 50% by weight, and may be disposed in a corner region of the first layer.

The ferromagnetic particles may be made of at least one of iron, nickel, and cobalt.

According to an embodiment of the present specification, an encapsulation substrate of various materials may be applied to an organic light emitting display device. In addition, according to the embodiment of the present specification, the working process of the cotton encapsulation structure may be stabilized. Accordingly, defects appearing in the process of applying the encapsulation substrate and the surface adhesive member may be reduced.

1 is a plan view illustrating an organic light emitting display device according to an embodiment of the present specification.
2 is a cross-sectional view illustrating a portion of a display area of an organic light emitting diode display according to an exemplary embodiment of the present specification.
3 is a diagram illustrating an organic light emitting display device according to an exemplary embodiment of the present specification.
4 is a diagram illustrating an organic light emitting display device to which an encapsulation structure is applied according to an exemplary embodiment of the present specification.
5A and 5B are views illustrating a part of a manufacturing process of an organic light emitting diode display.

In describing the components of the present invention, terms such as first, second, A, B, (a), (b), etc. may be used. These terms are only for distinguishing the elements from other elements, and the essence, order, order, or number of the elements are not limited by the terms. When it is described that a component is “connected”, “coupled” or “connected” to another component, the component may be directly connected or connected to the other component, but other components may be interposed between each component. It should be understood that each component may be “interposed” or “connected”, “coupled” or “connected” through another component. Reference to a device or layer “on” another device or layer includes any intervening layer or other device directly on or in the middle of another device. The size and thickness of each component shown in the drawings are illustrated for convenience of description, and the present invention is not limited to the size and thickness of the illustrated component.

An “organic light emitting display device”, which may also be referred to as a “display device” herein, is used as a general term for an organic light emitting diode panel and a display device employing such an organic light emitting diode panel. In general, the organic light emitting diode display includes a white organic light emitting type and an RGB organic light emitting type. In the white organic light emitting type, each subpixel of a pixel is configured to emit white light, and a set of color filters is used to filter the white light to generate red light, green light and blue light in the corresponding subpixel. Also, the white organic light emitting type may include sub-pixels configured without a color filter to form sub-pixels for generating white light. In the RGB organic light emitting type, the organic light emitting layer in each sub-pixel is configured to emit light of a designated color. For example, one pixel includes a red subpixel having an organic light emitting layer emitting red light, a green subpixel having an organic light emitting layer emitting green light, and a blue subpixel having an organic light emitting layer emitting blue light .

Each feature of the various embodiments of the present invention can be partially or wholly combined or combined with each other, and can be technically variously interlocked and actuated by those skilled in the art, and each of the embodiments can be practiced independently of each other or together in a related relationship. may be carried out. Hereinafter, various embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 is a plan view illustrating an organic light emitting display device according to an embodiment of the present specification.

Referring to FIG. 1 , the organic light emitting display device 100 includes at least one active area (A/A), in which an array of pixels is disposed. One or more inactive areas (I/A) may be disposed around the display area. That is, the non-display area may be adjacent to one or more side surfaces of the display area. In FIG. 1 , the non-display area surrounds a rectangular display area. However, the shape of the display area and the shape/arrangement of the non-display area adjacent to the display area are not limited to the example illustrated in FIG. 1 . The display area and the non-display area may have a shape suitable for designing an electronic device on which the display device 100 is mounted. Exemplary shapes of the display area are pentagonal, hexagonal, circular, oval, and the like.

Each pixel in the display area may be associated with a pixel driving circuit. The pixel driving circuit may include one or more switching transistors and one or more driving transistors. Each pixel driving circuit may be electrically connected to a gate line and a data line to communicate with a gate driver and a data driver located in the non-display area.

The gate driver and the data driver may be implemented as thin film transistors (TFTs) in the non-display area. Such a driver may be referred to as a gate-in-panel (GIP). In addition, some components, such as data driver IC, are mounted on a separate printed circuit board, and circuit films such as FPCB (flexible printed circuit board), COF (chip-on-film), TCP (tape-carrier-package), etc. Through the connection interface (pad, bump, pin, etc.) disposed in the non-display area may be coupled. The printed circuit (COF, PCB, etc.) may be located behind the display device 100 .

The organic light emitting diode display 100 may include various additional elements for generating various signals or driving pixels in the display area. Additional elements for driving the pixel may include an inverter circuit, a multiplexer, an electrostatic discharge circuit, and the like. The organic light emitting diode display 100 may also include additional elements related to functions other than driving pixels. For example, the organic light emitting display device 100 may include additional elements that provide a touch sensing function, a user authentication function (eg, fingerprint recognition), a multi-level pressure sensing function, a tactile feedback function, etc. have. The above-mentioned additional elements may be located in the non-display area and/or in an external circuit connected to the connection interface.

The organic light emitting display device according to the present specification includes a thin film transistor and an organic light emitting diode on a lower substrate 110 , a face seal on the organic light emitting element, and a barrier film bonded between the substrate and the surface encapsulant. ) and the like. The lower substrate 110 is also referred to as a concept including a device and a functional layer formed thereon, for example, a switching TFT, a driving TFT connected to the switching TFT, an organic light emitting element connected to the driving TFT, a protective film, and the like.

The lower substrate 110 supports various components of the organic light emitting diode display 100 and is formed of an insulating material. The lower substrate 110 may be formed of a transparent insulating material, for example, an insulating material such as glass or plastic.

An organic light emitting diode is disposed on the lower substrate 110 . The organic light emitting device includes an anode, an organic light emitting layer formed on the anode, and a cathode formed on the organic light emitting layer. The organic light emitting layer may have a structure of a single light emitting layer that emits one light, or a structure of a plurality of light emitting layers that emit white light. The organic light emitting diode may be formed in a central portion of the lower substrate 110 to correspond to the display area. When the organic light emitting layer of the organic light emitting device emits white light, a color filter may be formed on the lower substrate 110 .

A passivation layer may cover the organic light emitting diode. The protective layer is formed to protect the organic light emitting diode from external moisture or oxygen.

An encapsulation layer for preventing penetration of a gas such as moisture and/or oxygen may be provided on the devices formed in the display area A/A. A face seal may be used as the encapsulation layer. As an example of the face sealant, a face seal adhesive film may be used. The surface adhesive film seals the organic light emitting device disposed on the lower substrate 110 , and bonds the lower substrate 110 and the upper substrate (encapsulation substrate).

2 is a cross-sectional view illustrating a portion of a display area of an organic light emitting diode display according to an exemplary embodiment of the present specification.

Referring to FIG. 2 , an array of thin film transistors 102 , 104 , 106 , 108 and organic light emitting devices 112 , 114 , 116 and various functional layers are positioned on a lower substrate 110 .

The lower substrate (or array substrate) may be a glass or plastic substrate. In the case of a plastic substrate, a polyimide-based or polycarbonate-based material may be used to have flexibility.

In the thin film transistor, a semiconductor layer 102, a gate insulating film 103, a gate electrode 104, an interlayer insulating film 105, and source and drain electrodes 106 and 108 are sequentially disposed on a lower substrate 110. can

The semiconductor layer 102 may be made of polysilicon (p-Si), and in this case, a predetermined region may be doped with an impurity. In addition, the semiconductor layer 102 may be made of amorphous silicon (a-Si) or various organic semiconductor materials such as pentacene. Furthermore, the semiconductor layer 102 may be made of oxide. When the semiconductor layer 102 is formed of polysilicon, amorphous silicon is formed and crystallized to change to polysilicon. Such crystallization methods include a rapid thermal annealing (LTA) process, a MILC (Methal Induced Lateral Crystallization) or SLS method. Various methods such as (Sequential Lateral Solidification) may be applied.

The gate insulating layer 103 may be formed of an insulating material such as a silicon oxide layer (SiOx) or a silicon nitride layer (SiNx), and may also be formed of an insulating organic material. The gate electrode 104 may be formed of various conductive materials, for example, magnesium (Mg), aluminum (Al), nickel (Ni), chromium (Cr), molybdenum (Mo), tungsten (W), gold (Au), or an alloy thereof. and the like.

The interlayer insulating layer 105 may be formed of an insulating material such as a silicon oxide layer (SiOx) or a silicon nitride layer (SiNx), and may also be formed of an insulating organic material. By selectively removing the interlayer insulating layer 105 and the gate insulating layer 103 , a contact hole through which the source and drain regions are exposed may be formed.

The source and drain electrodes 106 and 108 are formed in the form of a single layer or a multi-layered material for the gate electrode 104 on the interlayer insulating layer 105 so that the contact hole is filled.

A passivation layer 107 may be positioned on the thin film transistor. The protective film 107 protects and planarizes the thin film transistor. The passivation layer 107 may be configured in various forms, and may be formed of an organic insulating layer such as BCB (Benzocyclobutene) or acrylic (Acryl), or an inorganic insulating layer such as a silicon nitride layer (SiNx) or a silicon oxide layer (SiOx), or a single layer. Various modifications are possible, such as being formed of a single layer or composed of double or multiple layers.

The organic light emitting device may have a form in which the first electrode 112 , the organic light emitting layer 114 , and the second electrode 116 are sequentially disposed. That is, the organic light emitting device includes a first electrode 112 formed on the passivation layer 107 , an organic light emitting layer 114 positioned on the first electrode 112 , and a second electrode 116 positioned on the organic light emitting layer 114 . ) can be composed of

The first electrode 112 is electrically connected to the drain electrode 108 of the driving TFT through a contact hole. When the organic light emitting diode display 100 is a top emission type, the first electrode 112 may be made of an opaque conductive material having high reflectance. For example, the first electrode 112 may be formed of silver (Ag), aluminum (Al), gold (Au), molybdenum (Mo), tungsten (W), chromium (Cr), or an alloy thereof. .

The bank 109 is formed in the remaining area except for the light emitting area. Accordingly, the bank 109 has a bank hole exposing the first electrode 112 corresponding to the emission region. The bank 109 may be made of an inorganic insulating material such as a silicon nitride film (SiNx) or a silicon oxide film (SiOx), or an organic insulating material such as BCB, an acrylic resin, or an imide resin.

An organic light emitting layer 114 is located on the first electrode 112 exposed by the bank 109 . The organic light emitting layer 114 may include an emission layer, an electron injection layer, an electron transport layer, a hole transport layer, a hole injection layer, and the like.

The second electrode 116 is positioned on the organic light emitting layer 114 . When the organic light emitting diode display 100 is a top emission type, the second electrode 116 is a transparent conductive material such as indium tin oxide (ITO) or indium zinc oxide (IZO). By being formed of a material, light generated from the organic light emitting layer 114 is emitted to the upper portion of the second electrode 116 .

A passivation layer 120 is positioned on the second electrode 116 . In this case, the protective layer 120 may be formed of an inorganic film made of glass, metal, aluminum oxide (AlOx), or a silicon (Si)-based material, or may have a structure in which an organic film and an inorganic film are alternately stacked. The protective layer 120 prevents penetration of oxygen and moisture from the outside in order to prevent oxidation of the light emitting material and the electrode material. When the organic light emitting diode is exposed to moisture or oxygen, a pixel shrinkage phenomenon in which the light emitting area is reduced or a dark spot may be generated in the light emitting area.

An encapsulation layer 140 may be disposed on the protective layer 120 . The encapsulation layer 140 encapsulates the organic light emitting diode disposed on the lower substrate 110 . Although various sealing structures may be applied, in the present specification, a case in which a face seal structure is used will be described. An example of the face seal structure is a face seal adhesive film. The surface adhesive film 140 serves to bond the lower substrate 110 and the upper substrate 190 together with a sealing function.

Meanwhile, a lower adhesive layer 160 and a lower encapsulation layer 170 are sequentially formed under the lower substrate 110 . The lower encapsulation layer 170 may include polyethylene naphthalate (PEN), polyethylene terephthalate (PET), polyethylene ether phthalate, polycarbonate, polyarylate, and poly It may be formed of one or more organic materials selected from polyether imide, polyether sulfonate, polyimide, and polyacrylate. The lower encapsulation layer 170 serves to prevent moisture or oxygen from penetrating into the substrate from the outside.

The lower adhesive layer 160 is formed of a heat-curable or natural-curable adhesive, and serves to bond the lower substrate 110 and the lower encapsulation layer 170 to each other. For example, the lower adhesive layer 160 may be formed of a material such as Optical Cleared Adhesive (OCA).

3 is a diagram illustrating an organic light emitting display device according to an exemplary embodiment of the present specification.

The organic light emitting display device 100 may include an array substrate 110 , a pixel driving circuit and an organic light emitting diode (TFT/OLED), a surface adhesive member 140 , and an encapsulation substrate 190 .

The array substrate 110 is formed of an insulating material and supports various components of the organic light emitting diode display 100 .

A pixel driving circuit and an organic light emitting diode (TFT/OLED) are disposed on the array substrate 110 . The organic light emitting device includes an anode, an organic light emitting layer formed on the anode, and a cathode formed on the organic light emitting layer. The organic light emitting layer may have a structure of a single light emitting layer that emits one light, or a structure that emits white light by being composed of a plurality of light emitting layers. The organic light emitting diode may be formed in a central portion of the array substrate 110 to correspond to the display area. A pixel driving circuit for driving the organic light emitting device, that is, various devices such as a thin film transistor and a capacitor, and wirings may be disposed in association with the organic light emitting device. Exemplary structures and functions of the pixel driving circuit and the organic light emitting device are substantially the same as those described in FIG. 2 .

A passivation layer for protecting the pixel driving circuit and the organic light emitting diode (TFT/OLED) may be positioned to cover the organic light emitting diode. The protective film 120 may be formed of an inorganic film or may have a structure in which an organic film and an inorganic film are alternately stacked.

The organic light emitting display device 100 includes an encapsulation structure that covers the organic light emitting element to prevent penetration of moisture or oxygen. The encapsulation structure may be a face seal structure including a face seal adhesive and an encapsulation plate.

The surface adhesive member 140 is a member that seals the organic light emitting diode and bonds the array substrate 110 and the encapsulation substrate 190 . The surface adhesive member 140 may be composed of a curable resin and a moisture absorbent dispersed in the curable resin. The adhesive member 140 may be a surface adhesive member (eg, an adhesive film) including a first layer (a first adhesive layer) and a second layer (a second adhesive layer).

In this case, the first adhesive layer 141 is also referred to as a barrier layer (B-layer), and may be bonded to one surface (a surface facing the array substrate) of the encapsulation substrate 190 . The first adhesive layer 141 may be made of a curable resin 141b including a moisture absorbent 141a. The moisture adsorbent 141a of the first adhesive layer 141 adsorbs or removes moisture or oxygen introduced from the outside through a physical or chemical reaction.

The second adhesive layer 142 is also referred to as a transparent layer (T-layer), and may be bonded to the array substrate 110 and the organic light emitting device. The second adhesive layer 142 may be a thermosetting resin or a photocurable resin.

The encapsulation plate faces the array substrate 110 . A lower surface of the encapsulation substrate 190 is in contact with the surface adhesive member 140 . The encapsulation substrate 190 may be formed of a material such as glass, plastic, or metal, and the constituent material of the encapsulation substrate 190 may be determined according to the emission direction of the organic light emitting diode display 100 .

Referring to FIG. 4 , the surface-adhesive film 140 is positioned between the pixel driving circuit and the organic light emitting diode (TFT/OLED) and the upper encapsulation substrate 190 . In general, after the surface adhesive film 140 is attached to the encapsulation substrate 190 first, the surface adhesive film 140 faces the pixel driving circuit and the organic light emitting diode (TFT/OLED) to face the encapsulation substrate 190 and the lower portion. The substrate is bonded.

4 is a diagram illustrating an organic light emitting display device to which an encapsulation structure is applied according to an exemplary embodiment of the present specification.

The organic light emitting display device 100 may include an array substrate 110 , a pixel driving circuit and an organic light emitting diode (TFT/OLED), a passivation layer 120 , a surface adhesive member 140 , an encapsulation substrate 190 , and the like. .

Detailed descriptions of the array substrate 110 , the pixel driving circuit, the organic light emitting diode (TFT/OLED), and the passivation layer 120 are substantially the same as those described with reference to FIGS. 1 to 3 .

The organic light emitting display device 100 includes an encapsulation structure that covers the organic light emitting element to prevent penetration of moisture or oxygen. The encapsulation structure may be a face seal structure including a face seal adhesive and an encapsulation plate.

The surface adhesive member 140 is a member that seals the organic light emitting diode and bonds the array substrate 110 and the encapsulation substrate 190 . The surface adhesive member 140 may be formed of a mixture of a curable resin and a functional additive. For example, the surface adhesive member 140 may include a curable resin and a getter and/or a filler dispersed in the curable resin. The curable resin may be made of a polymer material such as an epoxy or an olefin, but is not limited thereto.

The surface-adhesive member 140 may be a surface-adhesive film having a multi-layer structure in which a plurality of layers are stacked vertically (vertically). For example, the adhesive member 140 may be a surface adhesive film including a first layer (a first adhesive layer) and a second layer (a second adhesive layer).

The first layer 141 is also referred to as a barrier layer (B-layer), and may be bonded to one surface (a surface facing the array substrate) of the encapsulation substrate 190 . The first layer 141 may be made of a curable resin 141b including a moisture absorbent 141a. The moisture adsorbent 141a of the first layer 141 adsorbs or removes moisture or oxygen introduced from the outside through a physical or chemical reaction. For example, as the moisture adsorbent 141-1a, a reactive adsorbent such as a metal powder such as alumina, metal oxide, metal salt, phosphorus pentoxide (P2O5), or a mixture of two or more types may be used. Another example As the moisture adsorbent 141-1a, a physical adsorbent such as silica, zeolite, titania, zirconia, montmorillonite, etc. may be used.

The metal oxide may be lithium oxide (Li ₂ O), sodium oxide (Na ₂ O), barium oxide (BaO), calcium oxide (CaO), or magnesium oxide (MgO). In addition, the metal salt is lithium sulfate (Li ₂ SO ₄ ), sodium sulfate (Na ₂ SO ₄ ), calcium sulfate (CaSO ₄ ), magnesium sulfate (MgSO ₄ ), cobalt sulfate (CoSO ₄ ), gallium sulfate (Ga ₂ ( SO ₄ ) ₃ ), titanium sulfate (Ti(SO ₄ ) ₂ ), or a sulfate such as nickel sulfate (NiSO ₄ ). In addition, the metal salt is calcium chloride (CaCl ₂ ), magnesium chloride (MgCl ₂ ), strontium chloride (SrCl ₂ ), yttrium chloride (YCl ₃ ), copper chloride (CuCl ₂ ), cesium fluoride (CsF), tantalum fluoride ( TaF ₅ ), niobium fluoride (NbF ₅ ), lithium bromide (LiBr), calcium bromide (CaBr ₂ ), cesium bromide (CeBr ₃ ), selenium bromide (SeBr ₄ ), vanadium bromide (VBr ₃ ), magnesium bromide (MgBr ₂ ) ), a metal halide such as barium iodide (BaI ₂ ) or magnesium iodide (MgI ₂ ), or a metal chlorate such as barium perchlorate (Ba(ClO ₄ ) ₂ ), magnesium perchlorate (Mg(ClO ₄ ) ₂ ), and the like. However, the moisture adsorbent is not limited to the above-described exemplary material.

The second layer 142 is also referred to as a transparent layer (T-layer). The second layer 142 is made based on a transparent curable resin. The second adhesive layer 142 may be a thermosetting resin or a photocurable resin. The curable resin of the second layer 142 may be a curable resin made of the same material as the curable resin 141b constituting the first layer 141 or a curable resin made of a different material. For example, the curable resin may include one thermosetting functional group such as a glycidyl group, an isocyanate group, a hydroxyl group, a carboxyl group, or an amide group. It may be a thermosetting resin including the above.

On the other hand, one surface of the second layer 142 is bonded to the array substrate 110 and the organic light emitting device (or an insulating film thereon), and is applied when the array substrate 110 and the encapsulation substrate 190 are bonded. It can act as a buffer for pressure. The other surface of the second layer 142 is in contact with one surface of the first layer.

The surface adhesive member 140 may contain particles of a ferromagnetic substance. In an embodiment, the ferromagnetic particles 143 may be contained in the first layer 141 . The ferromagnetic particles 143 are provided to fix the encapsulation substrate 190 to a workbench including a magnet in the process performed while the surface adhesive member 140 is attached to the encapsulation substrate 190 . The role of these ferromagnetic particles will be described in detail with reference to FIG. 5 .

The ferromagnetic particles 143 may be iron (Fe), nickel (Ni), cobalt (Co), or a mixture thereof. Meanwhile, the ferromagnetic particles 143 have a size of 80% or less of the thickness of the first layer 141 . This is because the organic light emitting diode or the insulating layer 120 may be damaged due to the ferromagnetic particles 143 . If damage occurs to the insulating film 120 or the like, the moisture permeation prevention performance is deteriorated. In consideration of such damage, the ferromagnetic particles 143 may be included in the first layer 141 in a weight ratio of 5% to 50%.

The ferromagnetic particles 143 may be evenly injected into the entire first layer 141, or may be disposed only at a specific position in consideration of a magnetic force suitable for fixing the encapsulation substrate 190 to a work surface including a magnet. have. For example, the ferromagnetic particles 143 may be located only in a corner region of the first layer 141 . That is, when the surface adhesive member 140 has a rectangular shape, the ferromagnetic particles 143 may be located within 10 cm*10 cm of the four vertices as a starting point.

An encapsulation plate faces the array substrate 110 with the surface adhesive member 140 interposed therebetween. A lower surface of the encapsulation substrate 190 is in contact with the surface adhesive member 140 . The encapsulation substrate 190 may be formed of a material such as glass, plastic, or metal, and the constituent material of the encapsulation substrate 190 may be determined according to the emission direction of the organic light emitting diode display 100 .

In recent years, metal has been studied as a material of the encapsulation substrate. Metal encapsulation using a metal substrate can be manufactured thinner and lighter than encapsulation using a glass substrate. In addition, since the metal is resistant to bending stress, the metal encapsulation substrate is more suitable for a curved display device. However, due to difficulties in the process to be described with reference to FIG. 5 , various metal materials have not been tested as an encapsulation substrate. However, when the surface adhesive member 140 including the ferromagnetic particles 143 is used, the encapsulation substrate 190 is firmly fixed to the workbench including the magnet even if it is a nonmagnetic substance (eg, metal). can be

5A and 5B are views illustrating a part of a manufacturing process of an organic light emitting diode display.

As shown in FIGS. 5A and 5B , there is a process performed while the surface adhesive member 140 is attached to the encapsulation substrate 190 . At this time, the encapsulation substrate 190 is placed on the work table 300 and the process is performed in a moving or stationary state. The workbench includes a magnet 310 .

If the encapsulation substrate 190 is a metallic material attached to the magnet, it may be fixed well to the workbench 190, but otherwise, that is, if the encapsulation substrate 190 is a non-magnetic material, the portion that is not fixed as shown in FIG. 5A ( Area A) may occur or the encapsulation substrate may slide on the work surface during processing. In such a case, there is a possibility that a manufacturing defect may occur. Therefore, the use of a non-magnetic material as an encapsulation substrate in a manufacturing process using a conventional workbench is subject to significant restrictions.

On the other hand, when the ferromagnetic material 143 is included in the surface adhesive member 140 as in the embodiment of the present specification, even a non-magnetic encapsulation substrate may be easily fixed to the workbench 300 including a magnet. This can be a solution that can overcome the limitations of the above-described encapsulation substrate material. Accordingly, non-magnetic materials, particularly thinner and cheaper materials such as aluminum (A), copper (Cu), polyethylene (PET), etc. can be tested/massaged as an encapsulation substrate material.

That is, the embodiments of the present specification may contribute to weight reduction, lightness, and/or cost reduction of the organic light emitting display device, and may further increase the flexibility of the display device.

The above description and the accompanying drawings are merely illustrative of the technical spirit of the present invention, and those of ordinary skill in the art to which the present invention pertains can combine configurations within a range that does not depart from the essential characteristics of the present invention. , various modifications and variations such as separation, substitution and alteration will be possible. Accordingly, the embodiments disclosed in the present invention are not intended to limit the technical spirit of the present invention, but to explain, and the scope of the technical spirit of the present invention is not limited by these embodiments. The protection scope of the present invention should be construed by the following claims, and all technical ideas within the scope equivalent thereto should be construed as being included in the scope of the present invention.

100: organic light emitting display device
110: TFT array substrate
120: shield
140: surface adhesive member
143: ferromagnetic material
190: encapsulation substrate

Claims (23)

a flexible substrate;
a thin film transistor disposed on the flexible substrate;
a light emitting device disposed on the thin film transistor and including a plurality of light emitting layers;
a face seal adhesive disposed on the light emitting element; and
and a color filter formed on the flexible substrate. According to claim 1,
The display device includes a plurality of sub-pixels,
The light emitting element corresponding to each of the sub-pixels is configured to emit light by stacking the plurality of light emitting layers. The method of claim 2 .
and the light is configured to emit white light. 3. The method of claim 2,
The plurality of sub-pixels includes a red sub-pixel, a green sub-pixel, and a blue sub-pixel. 3. The method of claim 2,
The color filter is configured to filter the light to generate light of a color corresponding to each of the plurality of sub-pixels. 5. The method of claim 4,
further comprising a white sub-pixel;
The color filter is not provided in an area corresponding to the white sub-pixel. According to claim 1,
The light emitting device includes a first electrode disposed on the thin film transistor, the light emitting layer disposed on the first electrode, and a second electrode disposed on the light emitting layer. 8. The method of claim 7,
The surface adhesive member is disposed on the second electrode. 8. The method of claim 7,
The display device of claim 1, wherein the surface adhesive member includes a first adhesive layer disposed to face the second electrode and a second adhesive layer disposed between the second electrode and the first adhesive layer. 10. The method of claim 9,
The display device of claim 1, wherein the first adhesive layer is made of a curable resin in which a moisture absorbent is dispersed, and the second adhesive layer is made of a transparent curable resin. 11. The method of claim 10,
The curable resin of the first adhesive layer is the same material as the transparent curable resin of the second adhesive layer. 11. The method of claim 10,
The display device of claim 1, wherein the first adhesive layer further includes particles of a ferromagnetic substance. 13. The method of claim 12,
The ferromagnetic particles are located in a corner region of the first adhesive layer. 13. The method of claim 12,
The ferromagnetic particles have a size of 80% or less of a thickness of the first adhesive layer. 13. The method of claim 12,
The ferromagnetic particles are included in the first adhesive layer in an amount of 5% to 50% by weight. 13. The method of claim 12,
The ferromagnetic particles are made of at least one of iron, nickel, and cobalt. According to claim 1,
and a first passivation layer disposed on the thin film transistor. 18. The method of claim 17,
and the first passivation layer planarizes an upper portion of the thin film transistor. 18. The method of claim 17,
The first protective film is formed of an organic insulating film or an inorganic insulating film,
The organic insulating film includes at least one selected from benzocyclobutene and acryl,
The inorganic insulating layer includes at least one selected from a silicon nitride layer (SiNx) and a silicon oxide layer (SiOx). 18. The method of claim 17,
The light emitting element is disposed on the first passivation layer. According to claim 1,
and a second passivation layer disposed on the light emitting element. 22. The method of claim 21,
The second passivation layer has a structure in which an inorganic layer and an organic layer are alternately stacked. 22. The method of claim 21,
The second passivation layer is disposed between the light emitting element and the surface adhesive member.

Images