KR20210058333A - Display device - Google Patents

Abstract

A display device according to an embodiment of the present invention includes: a substrate including a display area in which a plurality of sub-pixels composed of a light-emitting area and a non-emitting area are defined; a plurality of light emitting elements disposed in a plurality of sub-pixels; an encapsulation unit covering the plurality of light emitting elements in the display area; a first inorganic insulating layer disposed on the encapsulation unit; a plurality of connection patterns disposed on the first inorganic insulating layer; a second inorganic insulating layer disposed on the plurality of connection patterns; and a touch line disposed on the first inorganic insulating layer and the second inorganic insulating layer. Some of the touch lines may contact side surfaces of the plurality of connection patterns. The display device is capable of reducing stress generated in a bending area.

Description

Display device {DISPLAY DEVICE}

The present invention relates to a display device, and more particularly, to a display device with improved reliability of a bending area.

Display devices used in computer monitors, TVs, and mobile phones include organic light emitting displays (OLEDs) that emit light by themselves, and liquid crystal displays (LCDs) that require a separate light source. have.

The range of application of display devices to personal portable devices as well as computer monitors and TVs has been diversified, and research on display devices having a reduced volume and weight while having a large display area is being conducted.

Among the display devices, there is an integrated touch screen display device including a touch unit capable of recognizing a user's touch. Since the touch screen integrated display device can directly input information using a finger or a pen, it is widely applied to navigation, portable terminals, and home appliances.

Conventionally, in order to manufacture a touch screen integrated display device, a method of manufacturing a separate touch screen panel and bonding it to the display panel has been used. However, when the touch screen panel is separately manufactured and bonded as described above, various problems exist, such as an increase in the thickness of the touch screen integrated display device and an increase in processing time.

Accordingly, the inventors of the present invention invented a new structure of a touch screen integrated display device for manufacturing a touch screen panel together in a display panel manufacturing process. That is, the inventors of the present invention have invented a manufacturing process of directly forming components constituting a touch screen on an encapsulation portion of a display panel and a touch screen integrated display device having a new structure according thereto. Such a touch screen integrated display device includes a plurality of light emitting devices disposed on a substrate, an encapsulation part disposed on the light-emitting device, and a touch part disposed on the encapsulation part. Here, in order to form the touch part, a first inorganic insulating layer is formed on the encapsulation part, a plurality of connection patterns are formed on the first inorganic insulating layer, and a second inorganic insulating layer is formed on the first inorganic insulating layer and the plurality of connection patterns. A process of forming an insulating layer and forming a touch line and an organic insulating layer on the second inorganic insulating layer is used. In this case, both the first inorganic insulating layer and the second insulating layer used for the touch unit are formed on at least the entire surface of the display area of the display panel.

However, when the touch portion is formed in such a structure, the thickness of the panel increases due to the lamination of the second inorganic sealing layer disposed on the uppermost portion of the sealing portion, the first inorganic insulating layer, and the second inorganic insulating layer of the touch portion. In addition, the second inorganic encapsulation layer, the first inorganic insulating layer, and the second inorganic insulating layer may be made of an inorganic material and have relatively weak ductility. Accordingly, when the touch screen integrated display device includes a bending area, a stress generated in the bending area increases, so that a crack may occur in components disposed in the bending area, in particular, inorganic layers. Panel damage due to moisture permeation may occur in the area where it has occurred.

Accordingly, the inventors of the present invention have invented a display device having a new structure capable of reducing the stress generated in the bending area by reducing the thickness of the entire inorganic insulating layer disposed in the bending area of the display device.

An object to be solved in the present invention is to provide a display device capable of reducing stress generated in a bending area.

Another problem to be solved by the present invention is to provide a display device capable of improving the reliability of a bending area.

The problems of the present invention are not limited to the problems mentioned above, and other problems that are not mentioned will be clearly understood by those skilled in the art from the following description.

A display device according to an exemplary embodiment of the present invention includes a substrate including a display area in which a plurality of sub-pixels consisting of a light emitting area and a non-emitting area are defined, a plurality of light emitting devices disposed in the plurality of sub-pixels, and a plurality of An encapsulation part covering the light emitting element of, a first inorganic insulating layer disposed on the encapsulation part, a plurality of connection patterns disposed on the first inorganic insulating layer, a second inorganic insulating layer disposed on the plurality of connection patterns, the first It includes an inorganic insulating layer and a touch line disposed on the second inorganic insulating layer, and some of the touch lines may contact side surfaces of the plurality of connection patterns.

A display device according to another exemplary embodiment of the present invention includes a substrate including a display area and a non-display area, a plurality of sub-pixels disposed in the display area, an encapsulation part disposed on a light emitting element, and a first weapon disposed on the encapsulation part. An insulating layer, a plurality of connection patterns disposed on a portion of the first inorganic insulating layer of the display area, a second inorganic insulating layer disposed on the plurality of connection patterns, and a plurality of first touch lines and a plurality of lines extending in different directions from each other A touch line including a second touch line of may be included.

Details of other embodiments are included in the detailed description and drawings.

The present invention can reduce the thickness of the inorganic material layer disposed on the light emitting device, thereby reducing the stress generated in the bending region.

According to the present invention, cracks due to stress generated in the bending area may be reduced, and reliability of the bending area may be improved.

The effects according to the present invention are not limited by the contents exemplified above, and more various effects are included in the present invention.

1 is a perspective view of a light emitting display device according to an exemplary embodiment of the present invention.
2 is a cross-sectional view of the display device according to II-II' of FIG. 1.
3 is an enlarged plan view of area X of FIG. 1.
4 is an enlarged plan view of area A of FIG. 3.
5 is a cross-sectional view of the display device along V-V' of FIG. 4.

Advantages and features of the present invention, and a method of achieving them will become apparent with reference to the embodiments described below in detail together with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but will be implemented in a variety of different shapes, only these embodiments are intended to complete the disclosure of the present invention, and common knowledge in the technical field to which the present invention pertains. It is provided to completely inform the scope of the invention to those who have, and the invention is only defined by the scope of the claims.

The shapes, areas, ratios, angles, numbers, etc. disclosed in the drawings for explaining the embodiments of the present invention are exemplary, and thus the present invention is not limited to the illustrated matters. The same reference numerals refer to the same elements throughout the specification. In addition, in describing the present invention, when it is determined that a detailed description of a related known technology may unnecessarily obscure the subject matter of the present invention, the detailed description thereof will be omitted. When'include','have','consists of' and the like mentioned in the present invention are used, other parts may be added unless'only' is used. In the case of expressing the constituent elements in the singular, it includes the case of including the plural unless specifically stated otherwise.

In interpreting the constituent elements, it is interpreted as including an error range even if there is no explicit description.

In the case of a description of the positional relationship, for example, if the positional relationship of two parts is described as'upper','upper of','lower of','next to','right' Or, unless'direct' is used, one or more other parts may be located between the two parts.

When an element or layer is referred to as “on” another element or layer, it includes all cases in which another layer or another element is interposed directly on or in the middle of another element.

Also, the first, second, etc. are used to describe various components, but these components are not limited by these terms. These terms are only used to distinguish one component from another component. Accordingly, the first constituent element mentioned below may be a second constituent element within the technical idea of the present invention.

The same reference numerals refer to the same elements throughout the specification.

The area and thickness of each component shown in the drawings are illustrated for convenience of description, and the present invention is not necessarily limited to the area and thickness of the illustrated component.

Each of the features of the various embodiments of the present invention can be partially or entirely combined or combined with each other, technically various interlocking and driving are possible, and each of the embodiments may be independently implemented with respect to each other or can be implemented together in an association relationship. May be.

Hereinafter, various embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 is a perspective view of a display device according to an exemplary embodiment of the present invention. In FIG. 1, only a substrate 110 and a plurality of sub-pixels SP among various components of the display device 100 are illustrated for convenience of description.

The substrate 110 is a support member for supporting other components of the display device 100 and may be made of an insulating material. For example, the substrate 110 may be made of glass or resin. In addition, the substrate 110 may be made of a plastic such as a polymer or polyimide (PI), or may be made of a material having flexibility.

The substrate 110 includes a first area A1 and a second area A2. The first area A1 is a planar area, and the second area A2 is a curved area. The first area A1 may be a flat area, and the second area A2 may be a curved area. The first area A1 may be a flat portion, and the second area A2 may be a curved portion or a bent portion. For example, the second area A2 may be a curved area whose slope increases as the distance from the first area A1 increases. For example, the second region A2 is disposed on both sides of the first region A1, and the slope may increase as the distance from the first region A1 increases. However, the present invention is not limited thereto, and each of the second regions A2 disposed on both sides of the first region A1 may be disposed with a different curvature. Also, the second area A2 may be disposed on only one side of the first area A1 or may be disposed on all sides of the first area A1. For example, when the first area A1 has four sides, the second area A2 may be disposed on one or more of the four sides, or may be disposed on all sides of the four sides.

The substrate 110 includes a display area AA and a non-display area NA. The display area AA and the non-display area NA may be disposed in the first area A1 and the second area A2 of the substrate 110, respectively.

The display area AA is an area displaying an image. A plurality of sub-pixels SP for displaying an image and a circuit part for driving the plurality of sub-pixels SP may be disposed in the display area AA. The circuit unit may include various thin film transistors, capacitors, and wirings for driving the sub-pixel SP. For example, the circuit unit may include various components such as a driving thin film transistor, a switching thin film transistor, a storage capacitor, a gate wiring, and a data wiring, but is not limited thereto.

The non-display area NA is an area in which an image is not displayed, and is an area in which various wirings and driver ICs for driving the sub-pixels SP disposed in the display area AA are disposed. For example, various driving ICs such as a gate driver IC and a data driver IC may be disposed in the non-display area NA.

In FIG. 1, the non-display area NA is shown to surround the display area AA, but the non-display area NA may be an area extending from one side of the display area AA, but is not limited thereto.

A plurality of sub-pixels SP are disposed in the display area AA of the substrate 110. Each of the plurality of sub-pixels SP is an individual unit that emits light, and a light-emitting element and a driving circuit are formed in each of the plurality of sub-pixels SP. For example, the plurality of sub-pixels SP may include a red sub-pixel, a green sub-pixel, and a blue sub-pixel, but the present invention is not limited thereto, and the plurality of sub-pixels SP may further include a white sub-pixel. .

Hereinafter, referring to FIG. 2 together for a more detailed description of the plurality of sub-pixels SP.

FIG. 2 is a cross-sectional view taken along line II-II' of FIG. 1. Referring to FIG. 2, a display device 100 according to an exemplary embodiment includes a substrate 110, a transistor (TFT), a planarization layer 111, a light emitting device 120, a bank 112, and a pad portion ( 140), a dam 130, an encapsulation unit 150, and a touch unit 160.

A transistor TFT is disposed on the substrate 110. The transistor TFT transfers the data voltage to the plurality of sub-pixels SP.

The transistor TFT includes a gate electrode, an active layer, a source electrode, and a drain electrode.

An active layer may be disposed on the substrate 110. The active layer may include an oxide semiconductor, amorphous silicon, or polysilicon.

Depending on the structure of the transistor TFT, a gate electrode may be disposed above or below the active layer. The gate electrode may be made of a conductive material such as copper (Cu), aluminum (Al), molybdenum (Mo), titanium (Ti), or an alloy thereof, but is not limited thereto.

A gate insulating layer may be disposed between the active layer and the gate electrode. The gate insulating layer is a layer for insulating the gate electrode and the active layer, and may be made of an insulating material. For example, the gate insulating layer may be formed of a single layer or a multiple layer of silicon oxide (SiOx) or silicon nitride (SiNx), but is not limited thereto.

A source electrode and a drain electrode electrically connected to the active layer and spaced apart from each other may be disposed. The source electrode and the drain electrode may be made of a conductive material, for example, copper (Cu), aluminum (Al), molybdenum (Mo), titanium (Ti), or an alloy thereof, but is not limited thereto.

Depending on the structure of the transistor TFT, an interlayer insulating layer or the like may be further disposed between the gate electrode, the source electrode, and the drain electrode to insulate the gate electrode, the source electrode, and the drain electrode, but is not limited thereto.

The planarization layer 111 is disposed on the transistor TFT. The planarization layer 111 flattens an upper portion of a partial region of the substrate 110. For example, the planarization layer 111 may be disposed in the display area AA, and the planarization layer 111 may not be disposed in all or part of the non-display area NA.

The planarization layer 111 may be formed of a single layer or a multiple layer, and may be formed of an organic material. For example, the planarization layer 111 may be made of an acrylic organic material, but is not limited thereto. The planarization layer 111 includes a contact hole CH for electrically connecting the transistor TFT and the light emitting device 120.

The light emitting device 120 is disposed on the planarization layer 111. The light-emitting device 120 is a self-luminous device that emits light, and may be driven by receiving a voltage from a transistor TFT or the like. The light emitting device 120 includes an anode 121, a light emitting layer 122 and a cathode 123.

The anode 121 is disposed separately for each sub-pixel SP on the planarization layer 111. The anode 121 is electrically connected to the transistor TFT through a contact hole CH formed in the planarization layer 111. The anode 121 is made of a conductive material capable of supplying holes to the emission layer 122. For example, the anode 121 may include Tin Oxide (TO), Indium Tin Oxide (ITO), Indium Zinc Oxide (IZO), Indium Zinc Tin Oxide; ITZO) and the like, and a reflective layer made of a material having excellent reflectivity such as silver (Ag) or silver alloy, but is not limited thereto.

The bank 112 is disposed on the anode 121 and the planarization layer 111. The bank 112 is an insulating layer for separating the sub-pixels SP adjacent to each other. The bank 112 may be disposed to open a part of the anode 121, and the bank 112 may be an organic insulating material disposed to cover the edge of the anode 121.

The light emitting layer 122 is disposed on the anode 121. The light-emitting layer 122 may be formed of one light-emitting layer 122 or may have a structure in which a plurality of light-emitting layers 122 emitting light of different colors are stacked. The emission layer 122 may further include a hole injection layer, a hole transport layer, an electron transport layer, and an electron injection layer. Referring to FIG. 2, the emission layer 122 disposed on each sub-pixel SP is illustrated as being separated and disposed for each sub-pixel SP, but is not limited thereto. For example, all or part of the emission layer 122 may be formed as a single layer over a plurality of sub-pixels SP. In addition, the emission layer 122 may be an organic emission layer made of an organic material, but is not limited thereto. For example, the light emitting layer 122 may be a quantum dot light emitting layer or a micro LED.

The cathode 123 is disposed on the emission layer 122. The cathode 123 is made of a conductive material capable of supplying electrons to the emission layer 122. For example, the cathode 123 is Indium Tin Oxide (ITO), Indium Zin Oxide (IZO), Indium Tin Zinc Oxide (ITZO), Zinc Oxide (ITZO), ZnO) and tin oxide (Tin Oxide, TO) may be formed of a transparent conductive oxide or ytterbium (Yb) alloy, but is not limited thereto. Referring to FIG. 2, the cathodes 123 disposed in each of the sub-pixels SP are shown to be connected to each other, but may be disposed separately for each sub-pixel SP, such as the anode 121, but is not limited thereto. Does not.

The display area AA may be a plurality of emission areas EA and a non-emission area NEA between the plurality of emission areas EA.

An area in which each of the plurality of light emitting devices 120 is disposed may be a plurality of light emitting areas EA. Each of the plurality of emission areas EA may independently emit light of one color, and may correspond to the plurality of sub-pixels SP, and may be an area in which the bank 112 is not disposed. . For example, the plurality of emission areas EA may include a red emission area, a green emission area, and a blue emission area, but is not limited thereto. The plurality of light emitting areas EA may be disposed to be spaced apart from each other, and may be disposed in a lattice shape arranged in a row direction and a column direction, for example, but is not limited thereto.

An area in which the plurality of light emitting devices 120 are not disposed may be a non-emission area NEA. The non-emission area NEA is an area disposed between the plurality of light-emitting areas EA, and may be an area in which the bank 112 is disposed. Since the non-emission area NEA is disposed to surround the plurality of emission areas EA, it may be formed in a mesh shape.

The dam 130 is disposed in the non-display area NA. For example, the dam 130 is disposed on the substrate 110 in the non-display area NA. The dam 130 is disposed to control the spread of the organic encapsulation layer 152 among the encapsulation parts 150 disposed to cover the display area AA. For example, the dam 130 may suppress overflow of the organic encapsulation layer 152 of the encapsulation unit 150. One or more dams 130 may be configured, and the number of dams to be disposed is not limited thereto.

The pad part 140 is disposed in the non-display area NA. The pad part 140 may be disposed outside the dam 130. A signal may be input to a circuit unit formed on the substrate 110 or a driving IC through the pad unit 140. For example, the pad unit 140 may supply a signal supplied from the outside to a circuit unit of the substrate 110, a driving IC, or the like. For example, the pad unit 140 may supply a signal for driving the touch unit 160 to the touch line 164 and the touch electrode 165 of the touch unit 160.

The encapsulation part 150 is disposed on the light emitting device 120. The encapsulation unit 150 is a sealing member that protects the light emitting device 120 from external moisture, oxygen, impact, and the like. The encapsulation unit 150 may be disposed to cover the entire display area AA in which the light emitting device 120 is disposed, and the encapsulation unit 150 is a part of the non-display area NA extending from the display area AA. It can be arranged to cover up to. The encapsulation unit 150 is disposed on the first inorganic encapsulation layer 151 and the first inorganic encapsulation layer 151 made of an inorganic material, and is disposed on the organic encapsulation layer 152 and the organic encapsulation layer 152 made of an organic material. A second inorganic encapsulation layer 153 may be included.

The first inorganic encapsulation layer 151 seals the display area AA to protect the light emitting element 120 from oxygen and moisture penetrating into the display area AA. The first inorganic encapsulation layer 151 may be disposed not only in the display area AA, but also in the non-display area NA extending from the display area AA, and the dam 130 of the non-display area NA. It can be arranged to cover. The first inorganic encapsulation layer 151 is made of an inorganic material, and may be made of, for example, an inorganic material such as silicon nitride (SiNx) or silicon oxynitride (SiON), but is not limited thereto.

An organic encapsulation layer 152 is disposed on the first inorganic encapsulation layer 151. The organic encapsulation layer 152 is a layer for planarizing the top of the first inorganic encapsulation layer 151, and fills the cracks that may occur in the first inorganic encapsulation layer 151, and on the first inorganic encapsulation layer 151 When the foreign material is disposed, the upper part of the foreign material can be flattened. The organic encapsulation layer 152 may be disposed up to a portion of the display area AA and the non-display area NA extending from the display area AA, and may be disposed inside the dam 130. The organic encapsulation layer 152 may be an epoxy-based or acrylic-based polymer, but is not limited thereto.

A second inorganic encapsulation layer 153 is disposed on the organic encapsulation layer 152. The second inorganic encapsulation layer 153 may seal the organic encapsulation layer 152 together with the first inorganic encapsulation layer 151 in a manner that contacts the first inorganic encapsulation layer 151 at the outer periphery of the display device 100. have. The second inorganic encapsulation layer 153 may be disposed up to a part of the non-display area NA extending from the display area AA, and the second inorganic encapsulation layer 153 is a first layer disposed in the non-display area NA. It may be disposed to be in contact with the inorganic encapsulation layer 151. The second inorganic encapsulation layer 153 is made of an inorganic material, and may be made of, for example, an inorganic material such as silicon nitride (SiNx) or silicon oxynitride (SiON), but is not limited thereto.

In FIG. 2, although the encapsulation part 150 is shown to include the first inorganic encapsulation layer 151, the organic encapsulation layer 152 and the second inorganic encapsulation layer 153, the inorganic encapsulation included in the encapsulation part 150 The number of layers and the number of organic encapsulation layers 152 are not limited thereto.

The touch unit 160 is disposed on the encapsulation unit 150. The touch unit 160 is disposed in the display area AA including the light emitting element 120 to sense a touch input. The touch unit 160 may detect external touch information using a user's finger or a touch pen. The touch unit 160 includes a first inorganic insulating layer 161, a second inorganic insulating layer 162, an organic insulating layer 163, a plurality of connection patterns 164, and a touch line 165.

A first inorganic insulating layer 161 is disposed on the encapsulation part 150. The first inorganic insulating layer 161 is in contact with the second inorganic encapsulating layer 153 of the encapsulating part 150. The first inorganic insulating layer 161 may be made of an inorganic material. For example, it may be made of an inorganic material such as silicon nitride (SiNx) and silicon oxynitride (SiON), but is not limited thereto.

A plurality of connection patterns 164 are disposed on the first inorganic insulating layer 161 in the non-emission area NEA. The plurality of connection patterns 164 are disposed on the first inorganic insulating layer 161 and in the non-emission area NEA. Each of the plurality of connection patterns 164 may be spaced apart from each other and disposed in a row direction or a column direction. The plurality of connection patterns 164 supply touch driving signals for driving the touch unit 160. In addition, the plurality of connection patterns 164 may transmit touch information sensed by the touch unit 160 to the driving IC.

The second inorganic insulating layer 162 is disposed on the plurality of connection patterns 164 in the non-emission area NEA. Specifically, each of the plurality of connection patterns 164 may be disposed to be spaced apart from each other, and the second inorganic insulating layer 162 may be disposed on each of the plurality of connection patterns 164. The second inorganic insulating layer 162 may prevent a short circuit between a plurality of adjacent connection patterns 164. The second inorganic insulating layer 162 may be made of an inorganic material. For example, it may be made of an inorganic material such as silicon nitride (SiNx) and silicon oxynitride (SiON), but is not limited thereto.

The width of the second inorganic insulating layer 162 may be equal to or smaller than the width of each of the plurality of connection patterns 164. For example, when the width of the second inorganic insulating layer 162 is greater than the width of each of the plurality of connection patterns 164, it may be difficult for the plurality of connection patterns 164 to contact the touch line 162 from the side. . Accordingly, the width of the second inorganic insulating layer 162 may be equal to or smaller than the width of each of the plurality of connection patterns 164.

A touch line 165 is disposed on the plurality of connection patterns 164 and the second inorganic insulating layer 162. The touch line 165 is disposed on the second inorganic insulating layer 162 in the non-display area NA, and is disposed on the plurality of connection patterns 164 in the non-emissive area NEA of the display area AA. I can. However, the present invention is not limited thereto, and the touch line 165 may not be disposed on the second inorganic insulating layer 162 in the light emitting area EA.

The touch line 165 includes a plurality of first touch lines 165a and a plurality of second touch lines 165b, and includes a plurality of first touch lines 165a and a plurality of second touch lines 165b. It may be disposed on (110) with a mesh-shaped structure. The structure of the touch line 165 will be described later in detail with reference to FIGS. 3 to 5.

The touch line 165 disposed at the outermost part of the display area AA may extend to the pad part 140 of the non-display area NA, and may be electrically connected to the pad part 140. The touch line 165 may sense a touch position on the display area AA, and the touch line 165 may transmit touch information including the touch position to the pad unit 140.

An organic insulating layer 163 is disposed on the touch line 165 and the second inorganic insulating layer 162. The organic insulating layer 163 may planarize the upper portion of the touch line 165 and may protect components under the organic insulating layer 163. The organic insulating layer 163 may be an epoxy-based or acrylic-based polymer, but is not limited thereto.

Meanwhile, although not shown in FIG. 2, a polarizing plate may be further disposed on the touch unit 160. The polarizing plate is disposed on the touch unit 160 to reduce reflection of external light incident on the display device 100. In addition, various optical films or protective films may be disposed on the touch unit 160.

Hereinafter, for a more detailed description of the touch line 165, reference will be made to FIGS. 3 to 5 together.

3 is an enlarged plan view of area X of FIG. 1. 4 is an enlarged plan view of area A of FIG. 3. 5 is a cross-sectional view of the display device along V-V' of FIG. 4. In FIGS. 3 and 4, only the touch line 165 and the connection pattern 164 are illustrated among various components of the display device 100 for convenience of description. In addition, in FIG. 5, illustration of the encapsulation unit 150 disposed under the touch unit 160 is omitted for convenience of description.

3 and 4, the touch line 165 includes a plurality of first touch lines 165a and a plurality of second touch lines 165b. The plurality of first touch lines 165a and the plurality of second touch lines 165b may extend in different directions. For example, the plurality of first touch lines 165a may be disposed in the X-axis direction, which is a first direction, and the plurality of second touch lines 165b may be disposed in the Y-axis direction, which is the second direction.

3 and 4, some of the plurality of first touch lines 165a may cross the plurality of connection patterns 164 on the plurality of connection patterns 164 and the second inorganic insulating layer 162. . The plurality of first touch lines 165a may extend in a first direction to connect the sub-pixels SP disposed adjacent to each other in a first direction, which is the X-axis direction, and the plurality of connection patterns 164 are Y-axis. It may extend in a second direction to connect the plurality of second touch lines 165b of the sub-pixel SP disposed adjacent to each other in a second direction, which is a second direction. Accordingly, since the plurality of first touch lines 165a extend in different directions from the plurality of connection patterns 164 on the plurality of connection patterns 164 and the second inorganic insulating layer 162, the plurality of first touch lines ( Some of 165a) may cross the plurality of connection patterns 164 on the second inorganic insulating layer 162.

Referring to FIG. 5, at least a portion of the touch line 165 is disposed to contact side surfaces of the plurality of connection patterns 164. For example, a plurality of first touch lines 165a are disposed on the second inorganic insulating layer 162, and the plurality of second touch lines 165b are It may be arranged to be in contact with the side surfaces of the plurality of connection patterns 164. Accordingly, the plurality of second touch lines 165b may be electrically connected to the second touch lines 165b of adjacent sub-pixels by the plurality of connection patterns 164.

Meanwhile, although the structure of the above-described touch unit 160 has been described as being disposed in the second area A2 of the substrate 110, the touch unit 160 is also applied to the first area A1, which is a planar portion of the substrate 110. Can be applied. For example, when the structure of the touch unit 160 disposed in each of the first area A1 and the second area A2 of the substrate 110 is different, the second inorganic insulation disposed in the first area A1 Since the layer 162 and the second inorganic insulating layer 162 disposed in the second region A2 have different thicknesses, a step may occur in the touch line 165 disposed on the second inorganic insulating layer 162. . By disposing the touch unit 160 having the same structure in the first region A1 and the second region A2, it is possible to reduce the occurrence of a step difference in the touch line 165.

A second inorganic insulating layer is disposed on the encapsulation part, the first inorganic insulating layer, and a plurality of connection patterns, and a touch line and an organic insulating layer are disposed on the second inorganic insulating layer. It can be formed in a structure that is. Accordingly, the touch line may be connected to a plurality of connection patterns through a contact hole formed in the second inorganic insulating layer, and may be connected to a touch line of an adjacent sub-pixel. However, when the touch portion is formed in such a structure, the thickness of the panel increases due to the stacking of the second inorganic sealing layer, the first inorganic insulating layer, and the second inorganic insulating layer disposed on the top of the sealing portion, and thus, the bending area The stress that occurs in can increase. In addition, since the inorganic material constituting the second inorganic encapsulation layer, the first inorganic insulating layer, and the second inorganic insulating layer has relatively weak ductility, when the display device is bent, a crack may occur in the bending area. Damage to the panel due to moisture permeation may occur in the cracked area.

Accordingly, in the display device 100 according to the exemplary embodiment, the second inorganic insulating layer 162 is disposed only on the plurality of connection patterns 164, so that the second inorganic insulating layer 162 is disposed on the plurality of connection patterns 164. The stress generated in the region A2 can be reduced. For example, the second inorganic insulating layer 162 is not disposed in a region in which the plurality of connection patterns 164 is not disposed, and is formed on the plurality of connection patterns 164 in the region where the plurality of connection patterns 164 are disposed. Can be placed on Accordingly, the second inorganic insulating layer 162 can be removed in the region where the plurality of connection patterns 164 are not disposed, and the thickness of the entire inorganic insulating layer is reduced in the region where the plurality of connection patterns 164 are not disposed. I can make it. Accordingly, by disposing the second inorganic insulating layer 162 only on the plurality of connection patterns 164, it is possible to reduce stress generated in the second region A2 of the substrate 110. In addition, by reducing the occurrence of cracks due to the stress generated in the second region A2 of the substrate 110, it is possible to reduce the moisture permeation phenomenon in the second region A2 of the substrate 110, and thus, display The reliability of the device 100 can be improved.

In some embodiments, when the display device 100 is formed of a flexible display device, the above-described structure of the touch unit 160 may be applied to the entire area of the substrate 110. The flexible display device 100 is a display device 100 that can be bent or folded freely, and all areas of the substrate 110 may be bent areas. Accordingly, by applying the structure of the touch unit 160 of the present invention to the entire area of the substrate 110, stress generated in the bending area can be reduced and reliability of the bending area can be improved.

In addition, in some embodiments, when the display device 100 is formed of a foldable display device, the structure of the touch unit 160 described above may be applied to the folding area. The foldable display device 100 is a foldable display device 100, and a folding area in which the display device 100 is folded may be a bending area. Accordingly, by applying the structure of the touch unit 160 of the present invention to the folding region of the substrate 110, it is possible to reduce stress generated in the folding region.

A display device according to example embodiments may be described as follows.

A display device according to an exemplary embodiment of the present invention includes a substrate including a display area in which a plurality of sub-pixels consisting of a light-emitting area and a non-emission area are defined, a plurality of light-emitting elements disposed in the plurality of sub-pixels, and a plurality of An encapsulation part covering the light emitting element of, a first inorganic insulating layer disposed on the encapsulation part, a plurality of connection patterns disposed on the first inorganic insulating layer, a second inorganic insulating layer disposed on the plurality of connection patterns, the first It includes an inorganic insulating layer and a touch line disposed on the second inorganic insulating layer, and some of the touch lines may contact side surfaces of the plurality of connection patterns.

According to another feature of the present invention, the touch line includes a plurality of first touch lines extending in a first direction and a plurality of second touch lines extending in a second direction different from the first direction and connected by a plurality of connection patterns. It may include.

According to another feature of the present invention, some of the plurality of second touch lines may contact side surfaces of the plurality of connection patterns, side surfaces and upper surfaces of the second inorganic insulating layer.

According to another feature of the present invention, some of the plurality of first touch lines may cross the plurality of connection patterns and the plurality of connection patterns on the second inorganic insulating layer.

According to another feature of the present invention, the width of the second inorganic insulating layer may be equal to or smaller than the width of the plurality of connection patterns.

According to another feature of the present invention, the substrate may include a curved portion, and the plurality of connection patterns and the second inorganic insulating layer may be disposed on the curved portion.

According to another feature of the present invention, the display device may further include an organic insulating layer disposed on the touch line and the second inorganic insulating layer.

A display device according to another exemplary embodiment of the present invention includes a substrate including a display area and a non-display area, a plurality of sub-pixels disposed in the display area, an encapsulation unit disposed on a light emitting element, and a first weapon disposed on the encapsulation unit. An insulating layer, a plurality of connection patterns disposed on a portion of the first inorganic insulating layer in the display area, a second inorganic insulating layer disposed on the plurality of connection patterns, and a plurality of first touch lines and a plurality of lines extending in different directions It may include a touch line including the second touch line of.

According to another feature of the present invention, the plurality of second touch lines may be disposed to contact side surfaces of the plurality of connection patterns.

According to another feature of the present invention, the plurality of second touch lines may be connected to the second touch lines disposed in adjacent sub-pixels among the plurality of sub-pixels by a plurality of connection patterns.

According to another feature of the present invention, the touch line may be disposed to contact the upper surface of the first inorganic insulating layer in the non-display area.

According to another feature of the present invention, the touch line may be arranged in a mesh shape.

According to another feature of the present invention, the substrate includes one or more curved portions, and the plurality of connection patterns and the second inorganic insulating layer may be disposed on each of the one or more curved portions.

According to another feature of the present invention, the display device may further include an organic insulating layer disposed on the touch line and the second inorganic insulating layer.

Although the embodiments of the present invention have been described in more detail with reference to the accompanying drawings, the present invention is not necessarily limited to these embodiments, and various modifications may be made without departing from the spirit of the present invention. . Accordingly, the embodiments disclosed in the present invention are not intended to limit the technical idea of the present invention, but to explain the technical idea, and the scope of the technical idea of the present invention is not limited by these embodiments. Therefore, it should be understood that the embodiments described above are illustrative in all respects and are not restrictive. The scope of protection of the present invention should be construed by the following claims, and all technical ideas within the scope equivalent thereto should be construed as being included in the scope of the present invention.

100: display device
110: substrate
111: planarization layer
112: bank
120: light-emitting element
121: anode
122: light-emitting layer
123: cathode
130: dam
140: pad portion
150: bag
151: first inorganic encapsulation layer
152: organic encapsulation layer
153: second inorganic encapsulation layer
160: touch unit
161: first inorganic insulating layer
162: second inorganic insulating layer
163: organic insulating layer
164: multiple connection patterns
165: touch line
165a: first touch line
165b: second touch line
SP: sub pixel
AA: display area
NA: Non-display area
EA: light-emitting area
NEA: non-luminous area
TFT: transistor
CH: Contact Hall

Claims (14)

A substrate including a display area in which a plurality of sub-pixels including an emission area and a non-emission area are defined;
A plurality of light-emitting elements disposed on the plurality of sub-pixels;
An encapsulation part covering the plurality of light emitting devices in the display area;
A first inorganic insulating layer disposed on the encapsulation portion;
A plurality of connection patterns disposed on the first inorganic insulating layer;
A second inorganic insulating layer disposed on the plurality of connection patterns;
A touch line disposed on the first inorganic insulating layer and the second inorganic insulating layer,
Some of the touch lines are in contact with side surfaces of the plurality of connection patterns. The method of claim 1,
The touch line is a display comprising a plurality of first touch lines extending in a first direction and a plurality of second touch lines extending in a second direction different from the first direction and connected by the plurality of connection patterns Device. The method of claim 2,
A display device, wherein some of the plurality of second touch lines are in contact with side surfaces of the plurality of connection patterns and side surfaces and upper surfaces of the second inorganic insulating layer. The method of claim 2,
A display device, wherein a portion of the plurality of first touch lines crosses the plurality of connection patterns on the plurality of connection patterns and the second inorganic insulating layer. The method of claim 2,
The display device, wherein the width of the second inorganic insulating layer is equal to or less than the width of the plurality of connection patterns. The method of claim 1,
The substrate includes a curved portion,
The plurality of connection patterns and the second inorganic insulating layer are disposed on the curved surface. The method of claim 1,
The display device further comprising an organic insulating layer disposed on the touch line and the second inorganic insulating layer. A substrate including a display area and a non-display area;
A plurality of sub-pixels disposed in the display area;
An encapsulation part disposed on the light-emitting element;
A first inorganic insulating layer disposed on the encapsulation portion;
A plurality of connection patterns disposed on a portion of the first inorganic insulating layer in the display area;
A second inorganic insulating layer disposed on the plurality of connection patterns; And
A display device comprising a touch line including a plurality of first touch lines and a plurality of second touch lines extending in different directions. The method of claim 8,
The plurality of second touch lines are disposed to contact side surfaces of the plurality of connection patterns. The method of claim 8,
The plurality of second touch lines are connected to a second touch line disposed in an adjacent sub-pixel among the plurality of sub-pixels by the plurality of connection patterns. The method of claim 8,
The touch line is disposed to contact an upper surface of the first inorganic insulating layer in the non-display area. The method of claim 8,
The display device, wherein the touch line is arranged in a mesh shape. The method of claim 8,
The substrate includes one or more curved portions,
The plurality of connection patterns and the second inorganic insulating layer are disposed on each of the one or more curved portions. The method of claim 8,
The display device further comprising an organic insulating layer disposed on the touch line and the second inorganic insulating layer.

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