CN112531131A - Organic light emitting display panel and method of manufacturing the same - Google Patents
Organic light emitting display panel and method of manufacturing the same Download PDFInfo
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- CN112531131A CN112531131A CN202011394343.2A CN202011394343A CN112531131A CN 112531131 A CN112531131 A CN 112531131A CN 202011394343 A CN202011394343 A CN 202011394343A CN 112531131 A CN112531131 A CN 112531131A
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
Abstract
The application provides an organic light emitting display panel and a method of manufacturing the same. The organic light emitting display panel includes: the light emitting device comprises a light emitting substrate, a light emitting layer and a light emitting layer, wherein the light emitting substrate comprises an array substrate and an organic light emitting device arranged on the array substrate; the cover plate is arranged opposite to the light-emitting substrate and is positioned on one side, away from the array substrate, of the organic light-emitting device; a pressure sensitive adhesive layer connected between the light emitting substrate and the cover plate, encapsulating the organic light emitting device; and the side sealing adhesive is connected between the array substrate and the cover plate and covers the outer surface of the pressure-sensitive adhesive layer.
Description
Technical Field
The present disclosure relates to display technologies, and particularly to an organic light emitting display panel and a method for manufacturing the same.
Background
A conventional packaging method for a large-sized Organic Light-Emitting Diode (OLED) display panel is Dam (frame sealant)/Getter (moisture absorbent)/Fill (filling sealant). Dam glues and coats in the outside, mainly plays the effect of laminating apron and panel, is the first line defense line of outside steam invasion, and Getter glues coats in Dam glues the inboard, mainly used absorbs steam, becomes the second line defense line of steam invasion, and Fill glue covers on the panel light-emitting area, mainly plays the supporting role, increases panel mechanical strength. The light transmittance of the Dam/Getter/Fill packaging mode can reach more than 90%, and the light-transmitting film has certain adhesive force and is suitable for top-emitting OLED panels. However, Dam/Getter/Fill packaging requires separate Dam and Getter paste application using a dispenser, and also requires liquid Fill paste application using a drop-Fill injection (ODF) or inkjet Printing (IJP), which takes a long time. In addition, the glue punching defect may occur in the process of laminating the upper and lower substrates, and after the lamination is completed, the glue material needs to be cured by means of UV or heating, so that the process is difficult to control, the manufacturing process is complicated, and the working time is long. Moreover, the Dam/Getter/Fill packaging method cannot achieve the narrow frame effect. Therefore, it is difficult to package the top-emitting OLED panel with high efficiency, low cost and narrow frame.
Disclosure of Invention
In view of the above, the present disclosure provides an organic light emitting display panel and a method for manufacturing the same, which can narrow a bezel, simplify a process, and improve yield.
The present application provides an organic light emitting display panel, which includes:
the light emitting device comprises a light emitting substrate, a light emitting layer and a light emitting layer, wherein the light emitting substrate comprises an array substrate and an organic light emitting device arranged on the array substrate;
the cover plate is arranged opposite to the light-emitting substrate and is positioned on one side, away from the array substrate, of the organic light-emitting device;
a pressure sensitive adhesive layer connected between the light emitting substrate and the cover plate, encapsulating the organic light emitting device; and
and the side sealing glue is connected between the array substrate and the cover plate and covers the outer surface of the pressure-sensitive adhesive layer.
In one embodiment, the thickness of the side seal is less than or equal to 1 mm.
In one embodiment, the side seal has a water-oxygen transmission rate of less than or equal to 60 g/(m)2·24h)。
In one embodiment, the light transmittance of the pressure-sensitive adhesive layer is greater than or equal to 90%, the organic light-emitting display panel further includes a thin film encapsulation layer encapsulating the organic light-emitting device, the pressure-sensitive adhesive layer covers the thin film encapsulation layer, and a capping layer for improving light extraction efficiency is disposed between the organic light-emitting device and the thin film encapsulation layer.
In one embodiment, the array substrate comprises a substrate and a driving circuit layer arranged on the substrate, the driving circuit layer is arranged on one side, facing the cover plate, of the substrate, the pressure-sensitive adhesive layer covers the driving circuit layer, the side sealing adhesive is connected between the substrate and the cover plate, and the thickness of one or both of the substrate and the cover plate is less than or equal to 0.5 mm.
In one embodiment, the substrate has a thickness less than or equal to 0.5mm, the cover plate includes a transparent organic layer and a water-oxygen barrier layer disposed on the transparent organic layer, the water-oxygen barrier layer is located on the transparent organic layer facing the array substrate, and the water-oxygen barrier layer is made of transparent metal or transparent oxide.
The application provides a manufacturing method of an organic light-emitting display panel, which comprises the following steps:
providing an array substrate, and forming an organic light-emitting device on the array substrate to form a light-emitting substrate;
providing a cover plate, arranging a pressure-sensitive adhesive on the light-emitting substrate or the cover plate, aligning the light-emitting substrate and the cover plate, enabling the organic light-emitting device to face the cover plate, pressing the light-emitting substrate and the cover plate in inert gas or vacuum to enable the pressure-sensitive adhesive to be cured to form a pressure-sensitive adhesive layer, and attaching the light-emitting substrate and the cover plate, wherein the pressure-sensitive adhesive layer encapsulates the organic light-emitting device; and
and arranging an encapsulation adhesive material between the array substrate and the cover plate and solidifying the encapsulation adhesive material to form side sealing adhesive, wherein the side sealing adhesive covers the outer surface of the pressure-sensitive adhesive layer.
In one embodiment, the step of disposing an encapsulant between the array substrate and the cover plate and curing the encapsulant to form a side-sealing encapsulant includes: and spraying a packaging adhesive material between the array substrate and the cover plate and solidifying the packaging adhesive material to form side sealing adhesive, wherein the thickness of the side sealing adhesive is less than or equal to 1 mm.
In one embodiment, the step of providing an array substrate on which the organic light emitting device is formed to form a light emitting substrate includes:
providing a substrate, forming a driving circuit layer on the substrate, and forming an organic light-emitting device on the driving circuit layer;
after the step of spraying and coating the packaging adhesive material between the array substrate and the cover plate and curing the packaging adhesive material to form the side sealing adhesive, the method further comprises the following steps:
and thinning one or two of the substrate base plate and the cover plate.
In one embodiment, the step of providing an array substrate on which the organic light emitting device is formed to form a light emitting substrate includes:
providing a substrate, forming a driving circuit layer on the substrate, and forming an organic light-emitting device on the driving circuit layer;
the step of providing a cover plate comprises:
providing a transparent organic layer and forming a water-oxygen barrier layer on the transparent organic layer;
the step of pressing the pressure-sensitive adhesive on the light-emitting substrate or the cover plate comprises:
pressing a pressure sensitive adhesive onto the water and oxygen barrier layer;
after the step of disposing a packaging adhesive material between the array substrate and the cover plate and curing the packaging adhesive material to form a side sealing adhesive, the method further comprises:
and thinning the substrate base plate.
According to the organic light-emitting display panel, the pressure-sensitive adhesive layer, the side sealing adhesive and the cover plate are used for packaging the organic light-emitting device, the working hours of the manufacturing process can be shortened, the yield is improved, and a good packaging effect is achieved. Compared with a Dam/Getter/Fill packaging method, the packaging structure can also be narrowed to realize narrow frames.
According to the manufacturing method of the organic light-emitting display panel, the pressure-sensitive adhesive used in packaging can be cured by applying pressure, UV illumination or heating is not needed, the processing working hours are shortened, and the yield is improved.
Drawings
In order to more clearly illustrate the technical solutions in the present application, the drawings needed to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1 is a schematic cross-sectional view of an organic light emitting display panel according to a first embodiment of the present application.
Fig. 2 is a schematic cross-sectional view of an organic light emitting display panel according to a second embodiment of the present application.
Fig. 3 is a schematic cross-sectional view of an organic light emitting display panel according to a third embodiment of the present application.
Fig. 4 is a flowchart of a method for manufacturing an organic light emitting display panel according to a fourth embodiment of the present application.
Fig. 5 is a flowchart of a method for manufacturing an organic light emitting display panel according to a fifth embodiment of the present application.
Detailed Description
The technical solution in the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. It should be apparent that the described embodiments are only some embodiments of the present application, and not all embodiments. All other embodiments, which can be obtained by a person skilled in the art without making any inventive step based on the embodiments in the present application, are within the scope of protection of the present application.
Referring to fig. 1, the present application provides an organic light emitting display panel 100. The organic light emitting display panel 100 may be used, for example, to include at least one of a smart phone (smartphone), a tablet personal computer (tablet personal computer), a mobile phone (mobile phone), a video phone, an electronic book reader (e-book reader), a desktop computer (desktop PC), a laptop computer (laptop PC), a netbook computer, a workstation (workstation), a server, a personal digital assistant (personal digital assistant), a portable media player (portable multimedia player), an MP3 player, a mobile medical machine, a camera, a game machine, a digital camera, a car navigation device, an electronic billboard, an automatic teller machine, or a wearable device (wearable device).
The organic light emitting display panel 100 includes: a light emitting substrate 100a including an array substrate 10 and a plurality of organic light emitting devices 21 disposed on the array substrate 10; a cover plate 30 disposed opposite to the light emitting substrate 100a and located on a side of the organic light emitting device 21 away from the array substrate 10; a pressure-sensitive adhesive layer 40 attached between the light emitting substrate 100a and the cover plate 30 and encapsulating the organic light emitting device 21; a side sealing adhesive (side sealing) 50 connected between the array substrate 10 and the cover plate 30, covering the outer surface of the pressure sensitive adhesive layer 40.
The array substrate 10 includes a substrate 11 and a driving circuit layer 12 disposed on the substrate 11. The substrate base plate 11 may be transparent glass or transparent plastic. The driver circuit layer 12 is provided on the substrate base 11 on the side facing the lid plate 30. The organic light emitting display panel 100 may be divided into a display area AA and an encapsulation area SA disposed around the display area AA. The driving circuit layer 12 is disposed in the display area AA. The driving circuit layer 12 includes a thin film transistor. The driving circuit layer 12 may be, for example, a 3T1C, 5T1C or 7T1C circuit. A plurality of organic light emitting devices 21 are arranged in the display area AA in an array. The pressure-sensitive adhesive layer 40 is located in the display area AA. The package area SA is used to set the side seal 50. The pressure-sensitive adhesive layer 40 covers the driving circuit layer 12. The side molding compound 50 is connected between the substrate 11 and the cover plate 30.
The organic light emitting device 21 includes an anode 211, a cathode 212, and an organic light emitting layer 213 disposed between the anode 211 and the cathode 212. The organic light emitting device 21 may further include a hole injection layer, a hole transport layer, an electron injection layer, and the like.
The organic light emitting display panel 100 further includes a Thin Film Encapsulation (TFE) layer 22 encapsulating the organic light emitting device 21. A pressure sensitive adhesive layer 40 covers the thin film encapsulation layer 22. In addition, the organic light emitting display panel 100 further includes a pixel defining layer 60 for defining a sub-pixel region. The pixel defining layer 60 is disposed between the anode 211 and the cathode 212. The pixel defining layer 60 has a plurality of openings arranged in an array. The organic light emitting layer 213 is disposed in the opening of the pixel defining layer 60.
A capping layer (capping layer)70 for improving light extraction efficiency is disposed between the organic light emitting device 21 and the thin film encapsulation layer 22. The thin film encapsulation layer 22 includes at least one inorganic layer and at least one organic layer alternately stacked. The material of the inorganic layer may be selected from alumina, silicon oxide, silicon nitride, silicon oxynitride, silicon carbide, titanium oxide, zirconium oxide, zinc oxide, and the like. The material of the organic layer may be selected from epoxy, Polyimide (PI), polyethylene terephthalate (PET), Polycarbonate (PC), Polyethylene (PE), polyacrylate, and the like.
The cover plate 30 may be transparent glass or plastic. The cover plate 30 serves to protect the organic light emitting display panel 100. The cover plate 30 and the light emitting substrate 100a are attached to each other and sealed. The organic light emitting display panel 100 may implement color display in a red, green, and blue pixel independent light emitting manner; it is also possible to implement color display by using the organic light emitting device 21 to emit white light and then combining with a color filter, in which case the color filter may be disposed on the cover 30. The organic light emitting display panel 100 may also use the organic light emitting device 21 of blue light, and then excite a color conversion material, such as a phosphor or a quantum dot material, with the blue light to obtain red light and green light, thereby implementing color display. It is to be understood that the light emitting manner of the OLED display panel of the embodiments of the present disclosure is not limited to the above-listed ones.
The material of the pressure-sensitive adhesive layer 40 includes a pressure-sensitive type surface-mount packaging adhesive (facestock), hereinafter simply referred to as a pressure-sensitive adhesive. The pressure-sensitive adhesive can achieve the purpose of bonding under the action of pressure. The pressure sensitive adhesive layer 40 is filled between the array substrate 10, the organic light emitting device 21 and the cover plate 30 to bond the light emitting substrate 100a and the cover plate 30, thereby achieving the purpose of encapsulation. The pressure sensitive adhesive layer 40 can also function to support the cover plate 30. In addition, the pressure-sensitive adhesive layer 40 can lock water vapor in the adhesive layer after the water vapor invades, so that the damage of the water vapor to the OLED is reduced, and the service life of the panel is prolonged.
The pressure-sensitive adhesive can be a transparent double-sided adhesive, and the light transmittance of the pressure-sensitive adhesive is greater than or equal to 90%. Specifically, the material of the pressure-sensitive adhesive layer 40 may include one or a combination of more of an acrylic resin and an epoxy resin. The high light-transmitting pressure-sensitive adhesive layer 40 can improve the light transmittance of the organic light-emitting display panel 100 in cooperation with the capping layer 70.
The side sealant 50 is disposed in the sealing area SA of the organic light emitting display panel 100. The side seal 50 is used to prevent moisture ingress. The side sealing compound 50 is formed between the array substrate 10 and the cover plate 30 by spraying, and covers the outer surface of the pressure sensitive adhesive layer 40. The side sealing compound 50 may also cover the connection of the pressure sensitive adhesive layer 40 with the array substrate 10 and the cover plate 30 to prevent moisture intrusion. The material of the side seal 50 may also include one or a combination of acrylic and epoxy. In one embodiment, the pressure sensitive adhesive has a first viscosity. The side seal 50 has a second viscosity. The first viscosity is less than the second viscosity. The side encapsulant 50 can be black to prevent light leakage from the side when the OLED is emitting light.
In one embodiment, the thickness T of the side sealing adhesive 50 may be less than or equal to 1 mm to achieve a narrow bezel. The side molding compound 50 may also have flexibility. In one embodiment, the material of the side sealing glue 50 is a high-resistance water sealing glue. The water oxygen transmission rate is less than or equal to 60 g/(m)224 h). In another embodiment, the material of the side sealing compound 50 includes a surface hydrophobic type encapsulation adhesive, or the surface hydrophobic function is achieved by heating or the like. Specifically, the material surface of the side seal 50 has a group that forms a hydrophobic group by polymerization initiated by heating.
Since the encapsulation structure of the organic light emitting display panel 100 of the present application can ensure high light transmittance, the type of the organic light emitting device is not limited, and a top emission type OLED device or a bottom emission type OLED device may be used. In addition, the packaging structure can also be used in transparent display.
Referring to fig. 2, fig. 2 is a schematic cross-sectional view of an organic light emitting display panel 200 according to a second embodiment of the present disclosure. The organic light emitting display panel 200 of the present embodiment has substantially the same structure as the organic light emitting display panel 100 of the first embodiment, and is distinguished only by: one or both of the substrate base plate 11a and the cover plate 30a are thinned. Specifically, the thicknesses of the thinned substrate base plate 11a and the cover plate 30a are both less than or equal to 0.5 mm. The substrate base plate 11a and the cover plate 30a may be thinned by a predetermined thickness according to a minimum curl radius of the organic light emitting display panel 200. For example, a substrate of a known organic light emitting display panel has a thickness of 0.5mm, and cannot be curled. To achieve a curl with a minimum curl radius of 50mm, the substrate base plate 11 may be thinned to 120 um.
In the present embodiment, the thickness of each of the substrate base plate 11a and the cover plate 30a is less than or equal to 0.5 mm. In another embodiment, the cover plate 30a has a thickness of 0.5mm or less, and the substrate base plate 11a uses a flexible organic base plate, such as a polyimide base plate. In yet another embodiment, the substrate base plates 11a each have a thickness of 0.5mm or less, and the cover plate 30a uses a flexible organic base plate, such as a polyimide base plate.
Referring to fig. 3, fig. 3 is a schematic cross-sectional view of an organic light emitting display panel 300 according to a third embodiment of the present application. The organic light emitting display panel 300 of the present embodiment has substantially the same structure as the organic light emitting display panel 100 of the first embodiment, and is distinguished only by: the substrate 11b has a thickness less than or equal to 0.5mm, and the cover plate 30b includes a transparent organic layer 31 and a water-oxygen barrier layer 32 disposed on the transparent organic layer 31. The water oxygen barrier layer 32 is located on the side of the transparent organic layer 31 facing the base substrate 11 b. The material of the transparent organic layer 31 is selected from organic materials such as epoxy resin, Polyimide (PI), polyethylene terephthalate (PET), Polycarbonate (PC), Polyethylene (PE), and polyacrylate. The material of the water oxygen barrier layer 32 includes a transparent metal or a transparent oxide. Such as a transparent metal oxide film layer of silicon oxide, silicon nitride, silicon oxynitride, or aluminum oxide. The transparent organic layer 31 and the water oxygen barrier layer 32 together constitute a barrier film having a low water oxygen transmission rate. The barrier film has high bending strength, and is beneficial to realizing the flexibility of the display panel.
Referring to fig. 1 and 4 together, the present application further provides a method for manufacturing an organic light emitting display panel, which includes the following steps:
s1: an array substrate 10 is provided, and an organic light emitting device 21 is formed on the array substrate 10 to form a light emitting substrate 100 a.
Specifically, the manufacturing steps of the light emitting substrate 100a include:
a substrate 11 is provided, and a driving circuit layer 12 is formed on the substrate 11 to obtain the array substrate 10.
An anode 211 is fabricated on the array substrate 10. In this embodiment mode, the organic light emitting device of the organic light emitting display panel is a top emission type OLED. The anode 211 is a reflective anode. The material of the reflective anode may be one or a combination of aluminum (Al), silver (Ag), Indium Zinc Oxide (IZO), Indium Tin Oxide (ITO), and the like. A pixel defining layer 60 is formed on the anode 211 to define a light emitting region. The pixel defining layer 60 also functions as a dam. The organic light-emitting layer 213 is formed on the anode 211 by ink jet printing. The cathode 212 is formed on the organic light emitting layer 213. Cathode 212 is a transparent cathode. The size of the transparent cathode is larger than that of the organic light emitting layer 213 layer. The transparent cathode may be magnesium (Mg), aluminum (Al), silver (Ag), Indium Zinc Oxide (IZO), Indium Tin Oxide (ITO), or a combination of one or more of the metal oxides. A capping layer 70 may be formed on the transparent cathode as desired. The capping layer 70 has the effect of improving light extraction and improving optical performance. A single-Layer or stacked thin film encapsulation Layer 22 is formed on the capping Layer 70 by using a Plasma Enhanced Chemical Vapor Deposition (PECVD), an Atomic Layer Vapor Deposition (ALD), and inkjet printing to protect the OLED from water and oxygen. The size of the thin film encapsulation layer 22 is larger than the size of the cathode 212.
S2: providing a cover plate 30, arranging a pressure sensitive adhesive on the light-emitting substrate 100a or the cover plate 30, aligning the light-emitting substrate 100a with the cover plate 30 to enable the organic light-emitting device 21 to face the cover plate 30, pressing the light-emitting substrate 100a with the cover plate 30 in inert gas or vacuum to enable the pressure sensitive adhesive to be cured to form a pressure sensitive adhesive layer 40, and attaching the light-emitting substrate 100a with the cover plate 30, wherein the pressure sensitive adhesive layer 40 encapsulates the organic light-emitting device 21.
The method of disposing the pressure sensitive adhesive on the light emitting substrate or the cover plate 30 may be lamination (laminate). The material of the pressure-sensitive adhesive includes a pressure-sensitive type surface mount packaging adhesive (facestock), hereinafter referred to as a pressure-sensitive adhesive method. The pressure-sensitive adhesive can be cured under the action of pressure without irradiating ultraviolet light, so that the processing time can be reduced, and the cost is saved. Since UV irradiation deteriorates the electrical characteristics of a thin film transistor (IGZO TFT) using indium gallium zinc oxide, the use of a pressure sensitive adhesive can prevent the electrical characteristics from deteriorating the IGZO TFT. In addition, the pressure-sensitive adhesive layer 40 can lock water vapor in the adhesive layer after the water vapor invades, so that the damage of the water vapor to the OLED is reduced, and the service life of the panel is prolonged.
The pressure-sensitive adhesive can be a transparent double-sided adhesive, and the light transmittance of the pressure-sensitive adhesive is greater than or equal to 90%. Specifically, the material of the pressure-sensitive adhesive layer 40 may include one or more of an acryl resin and an epoxy resin. The lamination is carried out in inert gas or vacuum, so that water vapor and oxygen can be prevented from being mixed in the pressure-sensitive adhesive lamination process. The inert gas may be nitrogen, and the organic light-emitting display panel obtained by bonding needs to be subjected to polarity vacuum defoaming subsequently when being pressed in a nitrogen environment. And no air bubble can be ensured to be generated under vacuum pressing. In addition, the pressure-sensitive adhesive used in the application can be cured by applying pressure, and UV (ultraviolet) illumination or heating is not needed, so that the processing difficulty is reduced.
In one embodiment, a pressure-sensitive adhesive is press-fitted onto the cover plate 30, the light-emitting substrate 100a is aligned with the cover plate 30, the press-fitting is performed in an inert gas or under vacuum to cure the pressure-sensitive adhesive to form the pressure-sensitive adhesive layer 40, and the light-emitting substrate and the cover plate 30 are attached. This is because the manufacturing process of the array substrate 10 is complicated and time-consuming, and the lamination of the pressure sensitive adhesive and the cover plate 30 and the manufacturing of the array substrate 10 or the light emitting substrate are performed simultaneously, and then the lamination with the cover plate 30 and the light emitting substrate can reduce the manufacturing time.
S3: an encapsulant material is disposed between the array substrate 10 and the cover plate 30 and cured to form a side encapsulant 50 to encapsulate the organic light emitting display panel 100. Wherein the side sealing tape 50 covers the outer surface of the pressure sensitive adhesive layer 40.
The step of arranging the packaging adhesive material between the array substrate 10 and the cover plate 30 and curing the packaging adhesive material to form the side sealing adhesive 50 includes spraying the packaging adhesive material between the array substrate 10 and the cover plate 30 and curing the packaging adhesive material to form the side sealing adhesive 50, spraying the packaging adhesive material to a gap between the array substrate 10 and the cover plate 30 by using a side spraying method and rapidly curing the packaging adhesive material by UV illumination, so that edge packaging is realized, and external water vapor is prevented from invading from the gap between the upper substrate and the lower substrate.
The method of spraying the encapsulation material can set the thickness of the side sealing compound 50 to be less than or equal to 1 mm to realize a narrow frame. The side molding compound 50 has flexibility. In one embodiment, the material of the side sealing glue 50 is a high-resistance water sealing glue. The water oxygen transmission rate is less than or equal to 60 g/(m)224 h). In another embodiment, the material of the side sealing compound 50 includes a surface hydrophobic type encapsulation adhesive, or the surface hydrophobic function is achieved by heating or the like. Specifically, the material surface of the side seal 50 has a group that forms a hydrophobic group by polymerization initiated by heating.
The cured edge-sealing adhesive 50 is positioned between the array substrate 10 and the cover plate 30 and covers the outer surface of the pressure-sensitive adhesive layer 40. The side sealing compound 50 may also cover the connection of the pressure sensitive adhesive layer 40 with the array substrate 10 and the cover plate 30 to prevent moisture intrusion.
Referring to fig. 5, in a fifth embodiment of the present application, after step S3, the method for manufacturing an organic light emitting display panel further includes the following steps:
s4: a step of thinning one or both of the substrate base 11 and the cover 30.
Wherein the thinning may be achieved by HF etching. Specifically, the thickness of the thinned substrate base plate 11a and the cover plate 30a is less than or equal to 0.5 mm. The substrate base plate 11 and the cover plate 30 may be thinned by a predetermined thickness according to a minimum curl radius of the organic light emitting display panel 200. And will not be described in detail herein.
Referring to fig. 2, in one embodiment, step S4 includes a step of thinning the substrate base 11a and the cover 30 a. In another embodiment, step S4 is a step of thinning the cover plate 30 a. And a flexible organic substrate such as a polyimide substrate is used for the base substrate 11 a. In yet another embodiment, step S4 includes the step of thinning the substrate base 11 a. The cover plate 30a uses a flexible organic substrate, such as a polyimide substrate. The thinning may be by mechanical thinning or by chemical etching, for example etching using hydrofluoric acid.
Referring to fig. 3, in another embodiment, in step S2, the step of providing a cover plate 30 includes providing a transparent organic layer 31 and forming a water oxygen barrier layer 32 on the transparent organic layer 31; the step of disposing a pressure sensitive adhesive on one of the light emitting substrate 100a and the cover plate 30 includes disposing a pressure sensitive adhesive on the water oxygen barrier layer 32. Step S4 includes a step of thinning the substrate base 11 b.
According to the organic light-emitting display panel, the pressure-sensitive adhesive layer, the side sealing adhesive and the cover plate are used for packaging the organic light-emitting device, the working hours of the manufacturing process can be shortened, the yield is improved, and a good packaging effect is achieved. In the existing Dam/Getter/Fill packaging method, Dam and Getter are both frame glue, and in order to ensure the packaging effect, Dam and Getter need to reach a certain width. Compared with the Dam/Getter/Fill packaging method, the side sealing adhesive has a good packaging effect when the thickness of the side sealing adhesive is smaller than or equal to 1 mm, so that the frame can be reduced, and the narrow frame can be realized. In addition, the flexible substrate, the cover plate and the side sealing glue are adopted in the application to form the rollable top-emitting organic light-emitting display panel.
According to the manufacturing method of the organic light-emitting display panel, the pressure-sensitive adhesive used in packaging can be cured by applying pressure, UV illumination or heating is not needed, the processing working hours are shortened, and the yield is improved. In the prior art, Fill glue is a liquid material, a dispenser is used for coating, mura is easily generated in the pressing process, Dam glue has high viscosity, the glue must be coated by the dispenser, and the glue punching defect is easily caused by the difference of internal and external air pressure when the light-emitting substrate and the cover plate are attached. The pressure-sensitive adhesive forms a pressure-sensitive adhesive layer through pressure curing, and the light-emitting substrate and the cover plate are attached, so that mura is not generated; the side sealing adhesive is formed and cured by adopting a spraying mode after the light-emitting substrate and the cover plate are attached, and the problem of adhesive punching is avoided. In addition, the substrate base plate and/or the cover plate are thinned after packaging, the process is simple, and the resolution is not limited by a glass thinning process. The foregoing provides a detailed description of embodiments of the present application, and the principles and embodiments of the present application have been described herein using specific examples, which are presented solely to aid in the understanding of the present application. Meanwhile, for those skilled in the art, according to the idea of the present application, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present application.
Claims (10)
1. An organic light emitting display panel, comprising:
the light emitting device comprises a light emitting substrate, a light emitting layer and a light emitting layer, wherein the light emitting substrate comprises an array substrate and an organic light emitting device arranged on the array substrate;
the cover plate is arranged opposite to the light-emitting substrate and is positioned on one side, away from the array substrate, of the organic light-emitting device;
a pressure sensitive adhesive layer connected between the light emitting substrate and the cover plate, encapsulating the organic light emitting device; and
and the side sealing glue is connected between the array substrate and the cover plate and covers the outer surface of the pressure-sensitive adhesive layer.
2. The organic light-emitting display panel of claim 1, wherein the thickness of the side seal is less than or equal to 1 mm.
3. The organic light-emitting display panel of claim 1, wherein the side seal has a water-oxygen transmission rate of 60 g/(m) or less2·24h)。
4. The organic light emitting display panel according to claim 1, wherein the pressure sensitive adhesive layer has a light transmittance of 90% or more, the organic light emitting display panel further comprises a thin film encapsulation layer encapsulating the organic light emitting device, the pressure sensitive adhesive layer covers the thin film encapsulation layer, and a capping layer for improving light extraction efficiency is disposed between the organic light emitting device and the thin film encapsulation layer.
5. The organic light emitting display panel according to claim 1, wherein the array substrate comprises a substrate base plate and a driving circuit layer disposed on the substrate base plate, the driving circuit layer is disposed on a side of the substrate base plate facing the cover plate, the pressure sensitive adhesive layer covers the driving circuit layer, the side sealing adhesive is connected between the substrate base plate and the cover plate, and a thickness of one or both of the substrate base plate and the cover plate is less than or equal to 0.5 mm.
6. The organic light emitting display panel of claim 5, wherein the substrate has a thickness of 0.5mm or less, the cover plate comprises a transparent organic layer and a water and oxygen barrier layer disposed on the transparent organic layer, the water and oxygen barrier layer is disposed on a side of the transparent organic layer facing the array substrate, and a material of the water and oxygen barrier layer comprises a transparent metal or a transparent oxide.
7. A method of manufacturing an organic light emitting display panel, comprising the steps of:
providing an array substrate, and forming an organic light-emitting device on the array substrate to form a light-emitting substrate;
providing a cover plate, arranging a pressure-sensitive adhesive on the light-emitting substrate or the cover plate, aligning the light-emitting substrate and the cover plate, enabling the organic light-emitting device to face the cover plate, pressing the light-emitting substrate and the cover plate in inert gas or vacuum to enable the pressure-sensitive adhesive to be cured to form a pressure-sensitive adhesive layer, and attaching the light-emitting substrate and the cover plate, wherein the pressure-sensitive adhesive layer encapsulates the organic light-emitting device; and
and arranging an encapsulation adhesive material between the array substrate and the cover plate and solidifying the encapsulation adhesive material to form side sealing adhesive, wherein the side sealing adhesive covers the outer surface of the pressure-sensitive adhesive layer.
8. The method of claim 7, wherein the step of disposing an encapsulant between the array substrate and the cover plate and curing the encapsulant to form a side encapsulant comprises: and spraying a packaging adhesive material between the array substrate and the cover plate and solidifying the packaging adhesive material to form side sealing adhesive, wherein the thickness of the side sealing adhesive is less than or equal to 1 mm.
9. The method of claim 7, wherein the providing an array substrate and forming the organic light emitting device on the array substrate to form a light emitting substrate comprises:
providing a substrate, forming a driving circuit layer on the substrate, and forming an organic light-emitting device on the driving circuit layer;
after the step of spraying and coating the packaging adhesive material between the array substrate and the cover plate and curing the packaging adhesive material to form the side sealing adhesive, the method further comprises the following steps:
and thinning one or two of the substrate base plate and the cover plate.
10. The method of claim 7, wherein the providing an array substrate and forming the organic light emitting device on the array substrate to form a light emitting substrate comprises:
providing a substrate, forming a driving circuit layer on the substrate, and forming an organic light-emitting device on the driving circuit layer;
the step of providing a cover plate comprises:
providing a transparent organic layer and forming a water-oxygen barrier layer on the transparent organic layer;
the step of pressing the pressure-sensitive adhesive on the light-emitting substrate or the cover plate comprises:
pressing a pressure sensitive adhesive onto the water and oxygen barrier layer;
after the step of arranging the packaging adhesive material between the array substrate and the cover plate and curing the packaging adhesive material to form the side sealing adhesive, the method further comprises the following steps:
and thinning the substrate base plate.
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