CN114171570A - Array substrate and manufacturing method thereof - Google Patents
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- CN114171570A CN114171570A CN202111486546.9A CN202111486546A CN114171570A CN 114171570 A CN114171570 A CN 114171570A CN 202111486546 A CN202111486546 A CN 202111486546A CN 114171570 A CN114171570 A CN 114171570A
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- 239000000758 substrate Substances 0.000 title claims abstract description 150
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 39
- 238000000034 method Methods 0.000 claims description 22
- 239000000463 material Substances 0.000 claims description 11
- 239000012528 membrane Substances 0.000 claims description 10
- DMLAVOWQYNRWNQ-UHFFFAOYSA-N azobenzene Chemical group C1=CC=CC=C1N=NC1=CC=CC=C1 DMLAVOWQYNRWNQ-UHFFFAOYSA-N 0.000 claims description 8
- 229920000642 polymer Polymers 0.000 claims description 5
- 239000000853 adhesive Substances 0.000 abstract description 4
- 230000001070 adhesive effect Effects 0.000 abstract description 4
- 239000010410 layer Substances 0.000 description 135
- 229920002120 photoresistant polymer Polymers 0.000 description 16
- 238000005530 etching Methods 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 238000005286 illumination Methods 0.000 description 4
- 239000010453 quartz Substances 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 238000000576 coating method Methods 0.000 description 3
- -1 polyethylene terephthalate Polymers 0.000 description 3
- 239000002861 polymer material Substances 0.000 description 3
- 239000004695 Polyether sulfone Substances 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 2
- 239000004417 polycarbonate Substances 0.000 description 2
- 229920006393 polyether sulfone Polymers 0.000 description 2
- 239000011112 polyethylene naphthalate Substances 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- MMZYCBHLNZVROM-UHFFFAOYSA-N 1-fluoro-2-methylbenzene Chemical compound CC1=CC=CC=C1F MMZYCBHLNZVROM-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000002346 layers by function Substances 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- 230000010287 polarization Effects 0.000 description 1
- 229920001230 polyarylate Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000001029 thermal curing Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/124—Insulating layers formed between TFT elements and OLED elements
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The embodiment of the application provides an array substrate and a manufacturing method thereof, wherein the array substrate comprises: a substrate; a lock attachment connected to the base plate; the first film layer is arranged on the substrate, and the locking accessory is at least partially embedded into the first film layer so as to enable the locking accessory to fix the first film layer. According to the array substrate provided by the embodiment of the application, the locking accessories are arranged on the substrate, at least part of the locking accessories are embedded into the first film layer, the adhesive force between the locking accessories and the first film layer is further increased, the peeling phenomenon of the film layer of the array substrate can be effectively improved, the production yield is improved, and the production cost is reduced.
Description
Technical Field
The invention relates to the technical field of display, in particular to an array substrate and a manufacturing method of the array substrate.
Background
With the development of display technology, display panels are widely used in various consumer electronics products such as mobile phones, televisions, personal digital assistants, and notebook computers, and become the mainstream of display devices. The display panel has a plurality of film layers, and the plurality of film layers constitute functional layers of the display panel, and the occurrence of a problem in any one layer causes a malfunction of the display panel.
The base layer PI, the light shielding layer BM, the photoresist layer PS, the organic film layer PFA, etc. of the display panel are usually coated on the array substrate by a liquid photoresist, and then patterned by a yellow light process. With the increasing size of the array substrate, the requirements on the thickness and uniformity of the photoresist are higher and higher. In order to ensure that the photoresist has good leveling property when coated on the substrate, the adhesive force between the photoresist and the substrate is reduced, so that the problem that the photoresist is easy to fall off in the subsequent process is caused. In addition, since the different film layers have different film qualities, the adhesion between the different film layers is poor, and peeling of the film layers may also occur.
Disclosure of Invention
The embodiment of the application provides an array substrate and a manufacturing method of the array substrate, and aims to solve the problems that a film layer of an existing array substrate is prone to peeling, so that the reliability of a product is reduced and the production yield is low.
In order to solve the above problem, an embodiment of the present application provides an array substrate, including:
a substrate;
a lock attachment connected to the base plate;
the locking accessory is at least partially embedded into the first film layer, so that the locking accessory can fix the first film layer.
In some embodiments, the locking member includes a support portion and a locking portion fixedly connected to the support portion, the support portion is fixedly connected to the substrate, the locking portion extends in a direction away from the substrate, and a contact area between the support portion and the substrate is larger than a contact area between the locking portion and the support portion.
In some embodiments, the locking attachment portion is curved.
In some embodiments, the number of the locking parts is multiple, and the multiple locking parts are arranged at intervals and fixedly connected with the supporting part.
In some embodiments, the array substrate further comprises:
a second membrane layer disposed on the first membrane layer, the locking attachment passing through the first membrane layer and extending into the second membrane layer such that the locking attachment can secure the second membrane layer.
In some embodiments, the number of the locking accessories is multiple, and the locking accessories are arranged on the base plate at intervals.
In some embodiments, the lock attachment is an azobenzene-based polymer-containing material.
The embodiment of the present application further provides a manufacturing method of an array substrate, including:
providing a substrate;
providing a lock attachment on the substrate;
a first film layer is disposed on the substrate, and the locking attachment is at least partially embedded in the first film layer to enable the locking attachment to secure the first film layer.
In some embodiments, before disposing the first film layer on the substrate, the method further includes:
the locking accessory is irradiated with polarized light to form the locking accessory into a curved shape.
In some embodiments, after disposing the first film layer on the substrate, the method further includes:
a second film layer is disposed on the first film layer such that the locking attachment passes through the first film layer and extends into the second film layer to enable the locking attachment to secure the second film layer.
The embodiment of the application provides an array substrate and a manufacturing method of the array substrate, wherein the substrate is provided with the locking accessory, and the locking accessory is at least partially embedded into the first film layer, so that the adhesive force between the locking accessory and the first film layer is increased, the peeling phenomenon of the film layer of the array substrate can be effectively improved, the production yield is improved, and the production cost is reduced.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings used in the description of the embodiments will be briefly introduced below. It is obvious that the drawings in the following description are only some embodiments of the application, and that for a person skilled in the art, other drawings can be derived from them without inventive effort.
For a more complete understanding of the present application and its advantages, reference is now made to the following descriptions taken in conjunction with the accompanying drawings, wherein like reference numerals represent like parts in the following description.
Fig. 1 is a schematic view of a first film layer of an array substrate according to an embodiment of the invention.
Fig. 2 is a schematic view of a first film layer of an array substrate according to another embodiment of the present invention.
Fig. 3 is a schematic view of a first film layer of an array substrate according to a third embodiment of the invention.
Fig. 4 is a schematic view of a second film layer of the array substrate according to the embodiment of the invention.
Fig. 5 is a schematic view of a second film layer of an array substrate according to another embodiment of the invention.
Fig. 6 is a first flowchart illustrating a method for manufacturing an array substrate according to an embodiment of the invention.
Fig. 7 is a second flowchart illustrating a manufacturing method of an array substrate according to an embodiment of the invention.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It is to be understood that the embodiments described are only a few embodiments of the present application and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without inventive step, are within the scope of the present application.
The array substrate aims at the problem that the film layer is easy to fall off from the substrate or the upper film layer and the lower film layer are peeled off in the production process due to large size, complex film layers and multiple manufacturing procedures of the existing array substrate, so that the production yield is low. The film layer is tightly locked with the substrate or different film layers through a micro mechanical locking structure mode, so that the film layer peeling problem of the array substrate is solved.
Based on the above, the invention provides a manufacturing method of an array substrate and the array substrate, wherein the substrate is provided with the locking accessory, and the locking accessory is at least partially embedded into the first film layer, so that the adhesion between the locking accessory and the first film layer is increased, the peeling phenomenon of the film layer of the array substrate can be effectively improved, the production yield is improved, and the production cost is reduced. The following description will be made with reference to the accompanying drawings.
The embodiment of the application provides an array substrate, wherein each film layer, such as a substrate layer PI, a shading layer BM, a photoresist layer PS, an organic film layer PFA, a pixel layer RGB and the like, is arranged on the array substrate, and each film layer is prepared by a liquid photoresist coating method or a vapor deposition method and the like and then is made into a corresponding pattern through a yellow light process. For convenience of description, the film layers on the substrate are respectively defined as a first film layer, a second film layer, and the like in the embodiments of the present disclosure.
Referring to fig. 1 and 2, fig. 1 is a schematic view of a first film layer of an array substrate according to an embodiment of the invention, and fig. 2 is a schematic view of a first film layer of an array substrate according to another embodiment of the invention.
The array substrate includes a substrate 10, a locking member 11 connected to the substrate 10, and a first film 12 disposed on the substrate 10. Wherein the locking attachment 11 is at least partially embedded in the first film 12 so that the locking attachment 11 can fix the first film 12.
The substrate 10 may be made of an insulating material such as glass or quartz, that is, a glass substrate 10 or a quartz substrate 10, as an important component of the display panel. In some embodiments, the base plate 10 may be replaced with a flexible substrate, and when the base plate 10 is a flexible substrate, the material thereof may be at least one of PI (polyimide), PET (polyethylene terephthalate), PEN (polyethylene naphthalate), PC (polycarbonate), PES (polyethersulfone), PAR (aromatic fluorotoluene containing polyarylate), or PCO (polycyclic olefin).
In the embodiment of the present application, the locking member 11 is disposed on the substrate 10, and the locking member 11 includes a supporting portion 111 and a locking portion 112 fixedly connected to the supporting portion 111. The supporting portion 111 is fixedly connected to the substrate 10, the locking portion 112 extends in a direction away from the substrate 10, and a contact area between the supporting portion 111 and the substrate 10 is larger than a contact area between the locking portion 112 and the supporting portion 111. The locking part 112 and the supporting part 111 are integrally formed. The locking portion 112 is perpendicular to the support portion 111, and may be an inclined surface having a certain gradient with respect to the support portion 111.
For example, the locking part 112 may be a column, and it is also understood that the locking part 112 is a protrusion formed on the supporting part 111, and the protrusion extends in a direction away from the substrate 10.
In some embodiments, a plurality of locking portions 112 may be disposed on the supporting portion 111, the locking portions 112 are disposed at intervals and fixedly connected to the supporting portion 111, and a groove is formed between the two locking portions 112. The first film 12 covers the locking attachment 11 and fills the recess formed between the two locking attachments 112. The plurality of locking parts 112 of the locking piece 11 can increase the longitudinal contact area with the first film 12, thereby improving the adhesion between the first film 12 and the locking piece 11 to prevent the first film 12 from peeling off the substrate 10.
In the embodiment of the present application, the first film 12 covers the locking part 11, and since the locking part 11 has the locking part 112 protruding in the direction away from the substrate 10, after the locking part 11 is covered by the first film 12, the locking part 11 can be embedded into the first film 12, so as to increase the adhesion between the locking part 11 and the first film 12, and effectively improve the peeling phenomenon of the array substrate film, thereby improving the production yield and reducing the production cost.
The height of the locking attachment 11 depends on the thickness of the first film 12, and preferably, the locking attachment 112 does not extend beyond the upper surface of the first film 12. In some embodiments, the first film layer 12 has a maximum thickness of 2 microns and the locking attachment 11 has a height of up to 1.5 microns.
It should be noted that, according to the image requirement of the first film layer 12, a plurality of locking components 11 may be disposed on the array substrate, and a plurality of locking components 11 are disposed on the substrate 10 in a spaced array. In some embodiments, the plurality of locking elements 11 are arrayed on the entire substrate 10, the first layer 12 is disposed on the entire surface of the substrate 10, and the first layer 12 may be formed by a coating or Chemical Vapor Deposition (CVD) process, or other processes such as evaporation. The locking accessory 11 is embedded into the first film 12 to form a micro-mechanical locking structure with the first film 12, and the adhesion between the first film 12 and the locking accessory 11 and the substrate 10 is increased, thereby effectively improving the problem that the first film 12 falls off from the substrate 10 in the production process.
Referring to fig. 2, in order to further increase the fastening force between the locking device 11 and the first film 12, another embodiment of the present invention provides the locking device 11 with a curved shape, and the curved shape of the locking device 11 is more beneficial to fix the first film 12. Illustratively, the locking attachment portion 112 is bent uniformly to one side or bent in different directions so that the locking attachment 11 locks the first film 12.
In the embodiment of the present application, the locking accessory 11 is a material containing azobenzene polymer, and the polymer material can deform and bend under the irradiation of the modulated polarized light due to the introduction of the azobenzene group. When the lock attachment 11 is irradiated with the polarized light of a specific polarization, the lock attachment portion 112 can be uniformly bent and deformed.
Referring to fig. 3, fig. 3 is a schematic view of a first film layer of an array substrate according to a third embodiment of the invention. In order to increase the contact area between the locking attachment 11 and the first film 12, the shape of the locking attachment 112 is not limited to a cylindrical structure, and the locking attachment 112 may be provided in other shapes. As shown in fig. 3, the locking part 112 may include a main body 1122 and a protrusion 1121 extending from the periphery of the main body 1122, the contact area between the locking part 112 and the first film layer 12 is increased by the protrusion 1121 extending from the periphery, and the protrusion 1121 may intersect to form a mesh-like structure. The first film 12 covers the locking component 11 and fills the meshes formed by the protrusions 1121, so as to form a micro-mechanical locking structure, thereby improving the adhesion between the first film 12 and the locking component 11 and the substrate 10 and preventing the first film 12 from peeling off from the substrate 10.
Referring to fig. 4 and 5, fig. 4 is a schematic view of a second film layer of the array substrate according to the embodiment of the invention. Fig. 5 is a schematic view of a second film layer of an array substrate according to another embodiment of the invention.
In some embodiments, the array substrate includes a substrate 10, a locking member 11 connected to the substrate 10, a first film 12 disposed on the substrate 10, and a second film 13 disposed on the first film 12, wherein the locking member 11 passes through the first film 12 and extends into the second film 13, so that the locking member 11 can fix the second film 13. Meanwhile, the locking accessory 11 can also increase the adhesion between the second film layer 13 and the first film layer 12, and firmly fix the first film layer 12 and the second film layer 13, so as to prevent the second film layer 13 from falling off from the first film layer 12.
According to the pattern requirement of the second film layer 13, a plurality of locking elements 11 may be disposed on the array substrate, and the plurality of locking elements 11 are disposed on the substrate 10 in a spaced array.
Wherein the height of the locking attachment member 11 depends on the thickness of the first film layer 12 and the second film layer 13, and preferably, the locking attachment portion 112 does not exceed the upper surface of the second film layer 13. In some embodiments, the first film layer 12 has a maximum thickness of 2 microns, the second film layer 13 has a maximum thickness of 5 microns, and the height of the locking attachment 11 is 6 microns at the maximum. Preferably, the thickness of the supporting portion 111 is smaller than that of the first film layer 12, and the locking portion 112 penetrates through the first film layer 12 and extends into the second film layer 13, that is, the locking element 11 is embedded inside the first film layer 12 and the second film layer 13 and forms a micro-mechanical structure with the first film layer 12 and the second film layer 13, so as to further improve the adhesion between the first film layer 12 and the second film layer 13, prevent the second film layer 13 from falling off the first film layer 12, and prevent the first film layer 12 from falling off the substrate 10.
When the lock attachment 11 is irradiated with polarized light, the lock attachment portion 112 of the lock attachment 11 is deformed and bent. The curved shape of the locking attachment 11 further facilitates the fixation of the first film 12 and the second film 13. Illustratively, the locking attachment portion 112 is bent uniformly to one side or bent in different directions so that the locking attachment 11 locks the second film layer 13.
Referring to fig. 5, in order to increase the contact area between the locking element 11 and the second film 13, the shape of the locking portion 112 is not limited to a cylindrical structure, and the locking portion 112 may be configured in other shapes. The locking part 112 may include a main body 1122 and a protrusion 1121 extending from the periphery of the main body 1122, the contact area between the locking part 112 and the second film layer 13 is increased by the protrusion 1121 extending from the periphery, and the protrusions 1121 may intersect to form a mesh-like structure. The second film layer 13 covers the locking accessory 11 and fills the meshes formed by the intersection of the protrusions 1121, so as to form a micro-mechanical locking structure, thereby improving the adhesion between the second film layer 13 and the locking accessory 11 as well as the first film layer 12, and effectively preventing the second film layer 13 from peeling off from the first film layer 12.
The embodiment of the application provides an array substrate, through set up lock annex 11 on base plate 10, lock annex 11 is at least partly embedded in first rete 12 to increase the adhesion of lock annex 11 and first rete 12, can improve the array substrate rete effectively and take off the phenomenon, thereby improve the production yield, reduction in production cost.
It should be noted that the structure and shape of the lock attachment 11 are not limited to those shown in the embodiments of the present application, and may be a mesh structure or other similar structures forming a material micromechanical lock.
Referring to fig. 6, fig. 6 is a first flowchart illustrating a method for manufacturing an array substrate according to an embodiment of the invention.
The embodiment of the application further provides a manufacturing method of the array substrate, which comprises the following steps:
s1: providing a substrate 10;
the substrate 10 in the embodiment of the present application may be a glass substrate 10, a quartz substrate 10, a flexible substrate, or the like.
S2: a lock attachment 11 is provided on the base plate 10;
the locking part 11 can be formed by pattern transfer, specifically, a resin containing azobenzene polymer is correspondingly coated on the substrate 10 on one side of the substrate 10, and then the locking part 11 is formed at a position required by the subsequent first film layer 12 by a yellow light technique.
S3: a first film 12 is provided on the substrate 10 such that the locking attachment 11 is at least partially embedded in the first film 12 to enable the locking attachment 11 to secure the first film 12.
The first film layer 12 is coated on the substrate 10, the first film layer 12 may be a photoresist material, the first film layer 12 is exposed, developed and etched through a yellow light process, and after the etching is completed, the remaining photoresist is stripped off, and a pattern required by the first film layer 12 is obtained.
In this step, since the locking element 11 is embedded in the first film layer 12 and forms a micro-mechanical structure with the first film layer 12, the adhesion between the first film layer 12 and the locking element 11 and the substrate 10 is further increased, thereby preventing the first film layer 12 from peeling off from the substrate 10 in the subsequent process.
After the latch 11 is disposed on the substrate 10 and before the first film layer 12 is coated, polarized light may be irradiated to the latch 11 to form the latch 112 into a curved shape.
Since the material of the locking piece 11 is an azobenzene-containing polymer material, bending deformation can occur after the locking piece is irradiated by specific polarized light. Preferably, the wavelength of the polarized light is adjusted to 532 nm, the illumination energy is 14.4 mw/cm, and the locking portion 112 is uniformly bent under the illumination of the polarized light, so as to enhance the adhesion between the locking portion 112 and the first film layer 12.
Referring to fig. 7, fig. 7 is a second flowchart illustrating a method for manufacturing an array substrate according to an embodiment of the invention. Another embodiment of the present application provides an array substrate including:
s1: providing a substrate 10;
the substrate 10 in the embodiment of the present application may be a glass substrate 10, a quartz substrate 10, a flexible substrate, or the like.
S2: a lock attachment 11 is provided on the base plate 10;
the locking part 11 can be formed by pattern transfer, specifically, a resin containing azobenzene polymer is correspondingly coated on the substrate 10 on one side of the substrate 10, and then the locking part 11 is formed at a position required by the subsequent first film layer 12 by a yellow light technique.
S3: a first film 12 is provided on the substrate 10 such that the locking attachment 11 is at least partially embedded in the first film 12 to enable the locking attachment 11 to secure the first film 12.
The first film layer 12 is coated on the substrate 10, the first film layer 12 may be a photoresist material, the first film layer 12 is exposed, developed and etched through a yellow light process, and after the etching is completed, the remaining photoresist is stripped off, and a pattern required by the first film layer 12 is obtained.
S4: the second film layer 13 is disposed on the first film layer 12 such that the locking attachment 11 extends through the first film layer 12 and into the second film layer 13 to enable the locking attachment 11 to secure the second film layer 13.
Coating a second film layer 13 on the first film layer 12, wherein the second film layer 13 can be a photoresist material, exposing, developing and etching the second film layer 13 by a yellow light process, and stripping the residual photoresist after the etching is completed to obtain a pattern required by the second film layer 13.
After the first film layer 12 is disposed on the substrate 10 and before the second film layer 13 is applied, polarized light irradiation may be performed on the locking part 11 to form the curved shape of the locking part 112.
In other embodiments, after the locking elements 11 are disposed on the substrate 10 and before the first film layer 12 is coated, polarized light is irradiated on the locking elements 11 to form the curved shape of the locking portions 112.
Since the material of the locking piece 11 is an azobenzene-containing polymer material, bending deformation can occur after the locking piece is irradiated by specific polarized light. Preferably, the wavelength of the polarized light is adjusted to 532 nm, the illumination energy is 14.4 mw/cm, and the locking portion 112 is uniformly bent under the illumination of the polarized light, so as to enhance the adhesion between the locking portion 112 and the second film layer 13.
In the manufacturing method of the array substrate provided by the embodiment of the application, the locking accessory 11 is arranged on the substrate 10, and the locking accessory 11 is embedded into the first film layer 12, so that the adhesion force between the locking accessory 11 and the first film layer 12 is further increased, the peeling phenomenon of the film layer of the array substrate can be effectively improved, the production yield is improved, and the production cost is reduced.
Furthermore, in the manufacturing method of the array substrate, a micro mechanical locking structure is formed by the locking accessory and the film layer, so that the adhesive force of the film layer is enhanced, and the film layer is not easy to fall off in the later process. In the manufacturing method, the required film pattern can be well locked due to the existence of the locking accessory. Therefore, the photoresist material can be replaced by the common thermal-curing photoresist, so that the exposure process is saved, the energy and cost of a factory are saved, and the product performance and the production efficiency are improved.
The array substrate manufactured by the manufacturing method of the array substrate can also be used as an array substrate of an organic light emitting diode panel. When the display panel is an organic light emitting diode display panel, the display panel further includes a light emitting function layer disposed on the array substrate, and the structure of the light emitting function layer belongs to the prior art and is not described herein again.
In the foregoing embodiments, the descriptions of the respective embodiments have respective emphasis, and for parts that are not described in detail in a certain embodiment, reference may be made to related descriptions of other embodiments. In the description of the present application, the terms "first", "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implying any number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more features.
The array substrate and the manufacturing method of the array substrate provided by the embodiment of the present application are described in detail above, and a specific example is applied in the description to explain the principle and the embodiment of the present application, and the description of the above embodiment is only used to help understand the method and the core idea of the present application; meanwhile, for those skilled in the art, according to the idea of the present application, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present application.
Claims (10)
1. An array substrate, comprising:
a substrate;
a lock attachment connected to the base plate;
the locking accessory is at least partially embedded into the first film layer, so that the locking accessory can fix the first film layer.
2. The array substrate of claim 1, wherein the locking member comprises a support portion and a locking portion fixedly connected to the support portion, the support portion is fixedly connected to the substrate, the locking portion extends in a direction away from the substrate, and a contact area between the support portion and the substrate is larger than a contact area between the locking portion and the support portion.
3. The array substrate of claim 2, wherein the locking portion is curved.
4. The array substrate of claim 2, wherein the number of the locking parts is multiple, and the multiple locking parts are arranged at intervals and fixedly connected with the supporting part.
5. The array substrate of any one of claims 1 to 4, further comprising:
a second membrane layer disposed on the first membrane layer, the locking attachment passing through the first membrane layer and extending into the second membrane layer such that the locking attachment can secure the second membrane layer.
6. The array substrate of any one of claims 1 to 4, wherein the number of the locking accessories is plural, and the plural locking accessories are arranged on the substrate at intervals.
7. The array substrate of any of claims 1 to 4, wherein the locking member is an azobenzene-based polymer-containing material.
8. A manufacturing method of an array substrate is characterized by comprising the following steps:
providing a substrate;
providing a lock attachment on the substrate;
a first film layer is disposed on the substrate, and the locking attachment is at least partially embedded in the first film layer to enable the locking attachment to secure the first film layer.
9. The method for manufacturing the array substrate according to claim 8, further comprising, before the disposing the first film layer on the substrate:
the locking accessory is irradiated with polarized light to form the locking accessory into a curved shape.
10. The method for manufacturing the array substrate according to claim 8, further comprising, after the disposing the first film layer on the substrate:
a second film layer is disposed on the first film layer such that the locking attachment passes through the first film layer and extends into the second film layer to enable the locking attachment to secure the second film layer.
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| CN202111486546.9A CN114171570A (en) | 2021-12-07 | 2021-12-07 | Array substrate and manufacturing method thereof |
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| CN202111486546.9A CN114171570A (en) | 2021-12-07 | 2021-12-07 | Array substrate and manufacturing method thereof |
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| CN109935615A (en) * | 2017-12-15 | 2019-06-25 | 京东方科技集团股份有限公司 | Substrate and preparation method thereof, display panel |
| CN110718511A (en) * | 2018-07-11 | 2020-01-21 | 上海和辉光电有限公司 | Flexible substrate and preparation method thereof |
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