CN102983279A - Packaging structure of organic light emitting diode - Google Patents
Packaging structure of organic light emitting diode Download PDFInfo
- Publication number
- CN102983279A CN102983279A CN 201210558808 CN201210558808A CN102983279A CN 102983279 A CN102983279 A CN 102983279A CN 201210558808 CN201210558808 CN 201210558808 CN 201210558808 A CN201210558808 A CN 201210558808A CN 102983279 A CN102983279 A CN 102983279A
- Authority
- CN
- China
- Prior art keywords
- oled
- oled device
- barrier film
- plastic base
- encapsulating structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Landscapes
- Electroluminescent Light Sources (AREA)
Abstract
The invention provides a packaging structure of an OLED (organic light emitting diode), which comprises a substrate, an OLED device, an air-barrier film and a metal packaging film, wherein the OLED device is arranged above the substrate; the air-barrier film is positioned above the OLED device; the OLED device is covered with the air-barrier film; the air-barrier film is glued to the substrate by virtue of a seal to form an enclosed space for sealing the OLED device; and the metal packaging film is arranged in a neighbor area where the substrate is glued with the air-barrier film, so that external moisture is prevented from entering the enclosed space. Compared with the prior art, after the air-barrier film is glued with the substrate, the metal packaging film is coated in the seal neighbor area in a sputter or evaporation coating mode at the side edges of the air-barrier film and the seal, the damage of the external moisture to the OLED device is thoroughly isolated by the metal packaging film, the stopping capacity of the packaging structure to the moisture is improved, and moisture absorption layers can be coated on the two sides of the OLED device before the seal is coated, thereby reducing the damage of the moisture in a glue material to the OLED device during coating.
Description
Technical field
The present invention relates to a kind of Organic Light Emitting Diode, relate in particular to this organic light-emitting diode packaging structure.
Background technology
Organic Light Emitting Diode (Organic Light Emitting Diode, OLED) panel be a kind ofly have high brightness, high reaction speed, compact, full color, without subtense angle and do not need the display element of backlight, therefore taken the lead in replacing TN(Twisted Nematic, twisted nematic) market of liquid crystal panel, and will further cause market to threaten to undersized tft liquid crystal display device (Thin Film Transistor Liquid Crystal Display, TFT-LCD).Current, oled panel has been applied to the display screen of the portable digital products such as mobile phone, personal digital assistant or even notebook computer.
Generally speaking, oled panel can be divided into top luminous (top emission), bottom luminous (bottom emission) or double-side (double emission).When it is mainly the design oled panel, the difference on exiting surface is selected.This is because OLED is self luminous material, does not need backlight, so the design of exiting surface is more flexible.Specific to the structure of OLED, it sequentially comprises one first electrode (such as negative electrode), a hole injection layer, an organic layer, an electron injecting layer and one second electrode (such as anode).Provide a voltage by the first electrode and the second electrode, so that hole injection layer and electron injecting layer provide respectively hole and electronics, these holes and electronics are after organic layer is combined, the electric energy that it produces is so that the organic molecule in the organic layer is excited to excitation state, thereby the organic molecule of excitation state is then got back to ground state by producing light to release energy afterwards, and this is the principle of luminosity of OLED.
Yet the organic layer of OLED is very responsive to aqueous vapor and oxygen, and light-emitting zone can produce dim spot, the decremental component life-span.Therefore, no matter be the encapsulating material behind substrate or the OLED evaporation, must possess the quite high sample ability that blocks water, for example water vapour permeability (Water Vapor Transmission Rate, WVTR) need reach 10-6 g/m * days.In the prior art, the OLED assembly of making on the glass substrate is main mainly with glass packaging, for example, above the OLED device, cover a glass, and at its side with radium-shine heating glass frit (frit) mode, to completely cut off aqueous vapor and oxygen the OLED device is destroyed.But, this block water sealing gland dress mode and be not suitable for pliability AMOLED(Active Matrix OLED) assembly because packaged glass (glass cover) or frit all belongs to frangible material.
In addition, bendable AMOLED assembly is owing to tend to cause glass breakage when crooked, and its substrate is mainly take plastic material as main.Meanwhile, the sealing gland assembling structure that blocks water adopts thin-film package (thin film encapsulation) or air blocking thin film to be laminated in the mode of plastic base more.But because the glue material can't stop aqueous vapor, aqueous vapor enters the OLED device from the side of frame glue easily, causes the OLED device impaired.
In view of this, how existing OLED encapsulating structure being improved, to eliminate defects and deficiency, is a problem needing to be resolved hurrily of person skilled in the industry.
Summary of the invention
For the existing defects of OLED encapsulating structure of the prior art, the invention provides a kind of novelty, can stop aqueous vapor the OLED device to be caused the OLED encapsulating structure of damage.
According to one aspect of the present invention, a kind of organic light-emitting diode packaging structure is provided, this encapsulating structure comprises:
One substrate;
One OLED device is arranged at the top of described substrate;
One gas barrier film is positioned at the top of described OLED device, thereby described gas barrier film covers described OLED device and forms an enclosure space by a frame glue laminating to described substrate, to seal described OLED device; And
One metallic packaging film is arranged at the near zone that described substrate and described gas barrier film fit, thereby stops outside aqueous vapor to enter described enclosure space.
Preferably, this substrate is a glass substrate.
Preferably, this substrate is a plastic base, and the surface of the close described OLED device of described plastic base comprises an air-block structure.
Preferably, this metallic packaging film is made with sputter or evaporation mode.
Among the embodiment therein, this OLED encapsulating structure also comprises a moisture absorption layer, is arranged between described OLED device and the described frame glue, and the aqueous vapor when avoiding being coated with described frame glue in the glue material causes damage to described OLED device.Preferably, the material of this moisture absorption layer is calcium oxide.
Among the embodiment therein, this metallic packaging film is a metal frame, and the one end contacts with the outer surface of described gas barrier film, and its other end contacts with the lower surface of described plastic base.Preferably, this OLED encapsulating structure also comprises a moisture absorption layer, is arranged between described OLED device and the described frame glue, and the aqueous vapor when avoiding being coated with described frame glue in the glue material causes damage to described OLED device.
According to another aspect of the present invention, a kind of organic light-emitting diode packaging structure is provided, this encapsulating structure comprises:
One plastic base, the inner surface of described plastic base has an air-block structure;
One OLED device is arranged at the top of described plastic base; And
One gas barrier film holds described plastic base and described OLED device, thereby described OLED device is sealed,
Wherein, described plastic base is cut into a trapezium structure, and described gas barrier film is by the dual-side of a frame glue laminating to described plastic base, and the choke of described gas barrier film is facing to the air-block structure of described plastic base.
Preferably, the side of this plastic base and the angle between the base are less than 60 degree.
Adopt organic light-emitting diode packaging structure of the present invention, the top of one gas barrier film in the OLED device is provided, thereby this gas barrier film covers this OLED device and conforms to substrate by the frame glue material and forms an enclosure space, and then seal this OLED device, meanwhile, one metallic packaging film is provided, this metallic packaging film is arranged at the near zone that substrate and gas barrier film fit, enter the enclosure space at OLED device place to stop outside aqueous vapor.Than prior art, encapsulating structure of the present invention is behind gas barrier film and baseplate-laminating, side in gas barrier film and frame glue plates the metal encapsulating film with sputter or evaporation mode at frame glue near zone, by the destruction of its thoroughly isolated outside aqueous vapor to the OLED device, improved the prevention ability of encapsulating structure for aqueous vapor.In addition, before coating frame glue, also can plate first a moisture absorption layer in the both sides of OLED device, thereby the aqueous vapor in the minimizing coating time-frame glue material is to the damage of OLED device.
Description of drawings
The reader will become apparent various aspects of the present invention after the reference accompanying drawing has been read the specific embodiment of the present invention.Wherein,
Fig. 1 illustrates the composition schematic diagram of a kind of organic light-emitting diode packaging structure of the prior art;
Fig. 2 illustrates the composition schematic diagram of another kind of organic light-emitting diode packaging structure of the prior art;
Fig. 3 illustrates the structural representation according to the first embodiment of organic light-emitting diode packaging structure of the present invention;
Fig. 4 illustrates the structural representation according to the second embodiment of organic light-emitting diode packaging structure of the present invention;
Fig. 5 illustrates the structural representation according to the 3rd embodiment of organic light-emitting diode packaging structure of the present invention;
Fig. 6 illustrates the structural representation according to the 4th embodiment of organic light-emitting diode packaging structure of the present invention;
Fig. 7 illustrates the structural representation according to the 5th embodiment of organic light-emitting diode packaging structure of the present invention;
Fig. 8 (a) illustrates the structural representation of the 6th embodiment of organic light-emitting diode packaging structure of the present invention; And
Fig. 8 (b) illustrates the enlarged diagram of dotted line frame of the organic light-emitting diode packaging structure of Fig. 8 (a).
Embodiment
For technology contents that the application is disclosed is more detailed and complete, can be with reference to accompanying drawing and following various specific embodiments of the present invention, identical mark represents same or analogous assembly in the accompanying drawing.Yet those of ordinary skill in the art should be appreciated that the embodiment that hereinafter provides limits the scope that the present invention is contained.In addition, accompanying drawing only is used for schematically being illustrated, and does not draw according to its life size.
With reference to the accompanying drawings, the embodiment of various aspects of the present invention is described in further detail.
Fig. 1 illustrates the composition schematic diagram of a kind of organic light-emitting diode packaging structure of the prior art.
With reference to Fig. 1, this organic light-emitting diode packaging structure comprises a glass substrate 102, an organic illuminating element 104 and a glass cover-plate 100.Wherein, glass cover-plate 100 is oppositely arranged with glass substrate 102, and organic illuminating element 104 is between glass cover-plate 100 and glass substrate 102.In order to seal organic illuminating element 104, in the both sides of glass cover-plate 100 and glass substrate 102 glass frit (frit) 106 is set respectively.When adopting radium-shine mode that glass frit is heated, glass cover-plate 100 is fitted with glass substrate 102 sealings, thereby the organic illuminating element 104 of inside is isolated with outside aqueous vapor and oxygen.
Yet because glass frit 106 all belongs to frangible material with glass cover-plate 100, when using this encapsulating structure in pliability AMOLED assembly, glass frit 106 or glass cover-plate 100 tend to fracture, and aqueous vapor and oxygen easily cause organic illuminating element 104 damaged.
Fig. 2 illustrates the composition schematic diagram of another kind of organic light-emitting diode packaging structure of the prior art.
With reference to Fig. 2, this organic light-emitting diode packaging structure comprises that a plastic base 200, an organic illuminating element 204(are such as the OLED device) and an air blocking thin film (gas barrier film) 202, wherein, organic illuminating element 204 is positioned at the top of plastic base 200, air blocking thin film 202 covers the upper surface of organic illuminating element 204, and conforms to plastic base 200 by frame glue 206.In addition, in order to prevent from being coated with frame glue, the moisture in the glue material causes damage to the OLED device, in the both sides of this OLED device 204 moisture absorption layer (getter) 208 is set respectively also.
But the frame glue material 206 of be used for fitting plastic base 200 and air blocking thin film 202 can't stop aqueous vapor and oxygen, thereby aqueous vapor and oxygen are easy to enter OLED device 204 from side (shown in Fig. 2 direction of arrow) via frame glue 206, cause device impaired.Although the aqueous vapor that moisture absorption layer 208 can absorption to a certain extent enters from the outside, the performance of OLED device 204 still can be affected.
In order effectively to solve defects pointed in the prior art, the present invention proposes a kind of organic light-emitting diode packaging structure of novelty, below a plurality of embodiment of the present invention are explained one by one.Fig. 3 illustrates the structural representation according to the first embodiment of organic light-emitting diode packaging structure of the present invention.
With reference to Fig. 3, in this embodiment, the OLED encapsulating structure comprises a glass substrate 300, a gas barrier film 302 and an OLED device 304.Wherein, OLED device 304 is arranged at the top of this glass substrate 300.Gas barrier film 302 is positioned at the top of OLED device 304, and this gas barrier film 302 covers this OLED device 304, and conforms to glass substrate 300 by a frame glue 306.Thus, the frame glue 306 of glass substrate 300, the left and right sides and gas barrier film 302 common formation one enclosure spaces, thereby with 304 sealings of OLED device in the inner.
It needs to be noted that than prior art, this OLED encapsulating structure comprises that also a metallic packaging film 308(is shown in the oblique line of Fig. 3).This metallic packaging film 308 is arranged at the near zone that glass substrate 300 and gas barrier film 302 fit, thereby stops outside aqueous vapor to enter enclosure space.Particularly, metallic packaging film 308 is coated on the outside of gas barrier film 302 and frame glue 306, enters enclosure space because frame glue 306 can't stop aqueous vapor and oxygen, so can effectively realize stoping the function of aqueous vapor by means of this metallic packaging film 308.
In one embodiment, metallic packaging film 308 is made with sputter or evaporation mode, so that outside aqueous vapor can't be infiltrated from side.For example, the position of metallic packaging film 308 and size can define with light shield (mask) in film-plating process.
Fig. 4 illustrates the structural representation according to the second embodiment of organic light-emitting diode packaging structure of the present invention.
The main distinction of Fig. 4 and Fig. 3 is to be, the employed substrate 300 of this OLED encapsulating structure is plastic base, and the surface of plastic base 300 close OLED devices 304 comprises an air-block structure B1.Hence one can see that, and OLED encapsulating structure of the present invention not only can adopt the base plate for packaging of glass material, also can adopt the base plate for packaging of plastic material.
Fig. 5 illustrates the structural representation according to the 3rd embodiment of organic light-emitting diode packaging structure of the present invention.
With reference to Fig. 5, this OLED encapsulating structure comprises a plastic base 400, a gas barrier film 402, an OLED device 404 and a metallic packaging film 408.Wherein, metallic packaging film 408 be positioned at plastic base 400 air-block structure B2 the top and near gas barrier film 402.OLED device 404 is arranged at the top of the air-block structure B2 of this plastic base 400.Gas barrier film 402 is positioned at the top of OLED device 404.Gas barrier film 402 covers the part of the air-block structure B2 of this OLED device 404 and plastic base 400.Utilize the frame glue 406 of gas barrier film 402 inboards that it is conformed to plastic base 400.In addition, plastic base 400 and gas barrier film 402 consist of an enclosure space, thereby with 404 sealings of OLED device in the inner.
In one embodiment, this OLED encapsulating structure also comprises a moisture absorption layer 410.Moisture absorption layer 410 is arranged between OLED device 404 and the frame glue 406, and when avoiding being coated with frame glue 406, the aqueous vapor in the glue material causes damage to this OLED device 404.For example, the material of this moisture absorption layer 410 is calcium oxide (CaO).
Fig. 6 illustrates the structural representation according to the 4th embodiment of organic light-emitting diode packaging structure of the present invention.
With reference to Fig. 6, similarly, this OLED encapsulating structure comprises a plastic base 500, a gas barrier film 502, an OLED device 504 and a metallic packaging film 508.Gas barrier film 502 conforms to the air-block structure B3 of plastic base 500 by the frame glue 506 of its below.Wherein, this metallic packaging film 508 is a metal frame, and the one end contacts with the outer surface of gas barrier film 502, and its other end contacts with the lower surface of plastic base 500.In other words, metal frame 508 is sticked in the outer surface of gas barrier film 502 and the lower surface of plastic base 500, and the height of its metal frame equals the thickness of plastic base 500, the thickness of frame glue 506 and the thickness sum of gas barrier film 502.
Fig. 7 illustrates the structural representation according to the 5th embodiment of organic light-emitting diode packaging structure of the present invention.
The main distinction of Fig. 7 and Fig. 6 is to be, during for fear of coating frame glue 506, aqueous vapor in the glue material causes damage to this OLED device 504, also comprises a moisture absorption layer 510 between OLED device 504 and frame glue 506, absorbs aqueous vapor in the glue material by this moisture absorption layer 510.
Fig. 8 (a) illustrates the structural representation of the 6th embodiment of organic light-emitting diode packaging structure of the present invention, and Fig. 8 (b) illustrates the enlarged diagram of dotted line frame of the organic light-emitting diode packaging structure of Fig. 8 (a).
In conjunction with Fig. 8 (a) and 8(b), be different from the previous embodiment of Fig. 3 ~ Fig. 7, in this embodiment, the OLED encapsulating structure is not to stop aqueous vapor to enter the OLED device by the metallic packaging film, but realizes by the shape that changes plastic base.
In more detail, this OLED encapsulating structure comprises a plastic base 600, a gas barrier film 602 and an OLED device 604.Wherein, the inner surface of this plastic base 600 has an air-block structure B4.OLED device 604 is arranged at the top of the air-block structure of plastic base 600.Gas barrier film 602 holds plastic base 600 and OLED device 604, thereby this OLED device 604 is sealed.Need to prove that this plastic base 600 is cut into a trapezium structure, this gas barrier film 602 conforms to the dual-side of plastic base 600 by a frame glue 606.The choke face B5 of gas barrier film 602 is towards the air-block structure B4 of this plastic base 600, shown in Fig. 8 (b).
In one embodiment, the side of plastic base 600 and the angle between the base are less than 60 degree.
Adopt organic light-emitting diode packaging structure of the present invention, the top of one gas barrier film in the OLED device is provided, thereby this gas barrier film covers this OLED device and conforms to substrate by the frame glue material and forms an enclosure space, and then seal this OLED device, meanwhile, one metallic packaging film is provided, this metallic packaging film is arranged at the near zone that substrate and gas barrier film fit, enter the enclosure space at OLED device place to stop outside aqueous vapor.Than prior art, encapsulating structure of the present invention is behind gas barrier film and baseplate-laminating, side in gas barrier film and frame glue plates the metal encapsulating film with sputter or evaporation mode at frame glue near zone, by the destruction of its thoroughly isolated outside aqueous vapor to the OLED device, improved the prevention ability of encapsulating structure for aqueous vapor.In addition, before coating frame glue, also can plate first a moisture absorption layer in the both sides of OLED device, thereby the aqueous vapor in the minimizing coating time-frame glue material is to the damage of OLED device.
Above, describe the specific embodiment of the present invention with reference to the accompanying drawings.But those skilled in the art can understand, and in situation without departing from the spirit and scope of the present invention, can also do various changes and replacement to the specific embodiment of the present invention.These changes and replacement all drop in claims limited range of the present invention.
Claims (10)
1. an Organic Light Emitting Diode (Organic Light Emitting Diode, OLED) encapsulating structure is characterized in that described OLED encapsulating structure comprises:
One substrate;
One OLED device is arranged at the top of described substrate;
One gas barrier film is positioned at the top of described OLED device, thereby described gas barrier film covers described OLED device and forms an enclosure space by a frame glue laminating to described substrate, to seal described OLED device; And
One metallic packaging film is arranged at the near zone that described substrate and described gas barrier film fit, thereby stops outside aqueous vapor to enter described enclosure space.
2. OLED encapsulating structure according to claim 1 is characterized in that, described substrate is a glass substrate.
3. OLED encapsulating structure according to claim 1 is characterized in that, described substrate is a plastic base, and the surface of the close described OLED device of described plastic base comprises an air-block structure.
4. OLED encapsulating structure according to claim 1 is characterized in that, described metallic packaging film is made with sputter or evaporation mode.
5. OLED encapsulating structure according to claim 3, it is characterized in that, described OLED encapsulating structure also comprises a moisture absorption layer, is arranged between described OLED device and the described frame glue, and the aqueous vapor when avoiding being coated with described frame glue in the glue material causes damage to described OLED device.
6. OLED encapsulating structure according to claim 5 is characterized in that, the material of described moisture absorption layer is calcium oxide.
7. OLED encapsulating structure according to claim 3 is characterized in that, described metallic packaging film is a metal frame, and the one end contacts with the outer surface of described gas barrier film, and its other end contacts with the lower surface of described plastic base.
8. OLED encapsulating structure according to claim 7, it is characterized in that, described OLED encapsulating structure also comprises a moisture absorption layer, is arranged between described OLED device and the described frame glue, and the aqueous vapor when avoiding being coated with described frame glue in the glue material causes damage to described OLED device.
9. an Organic Light Emitting Diode (Organic Light Emitting Diode, OLED) encapsulating structure is characterized in that described OLED encapsulating structure comprises:
One plastic base, the inner surface of described plastic base has an air-block structure;
One OLED device is arranged at the top of described plastic base; And
One gas barrier film holds described plastic base and described OLED device, thereby described OLED device is sealed,
Wherein, described plastic base is cut into a trapezium structure, and described gas barrier film is by the dual-side of a frame glue laminating to described plastic base, and the choke of described gas barrier film is facing to the air-block structure of described plastic base.
10. OLED encapsulating structure according to claim 9 is characterized in that, the side of described plastic base and the angle between the base are less than 60 degree.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201210558808 CN102983279A (en) | 2012-12-20 | 2012-12-20 | Packaging structure of organic light emitting diode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201210558808 CN102983279A (en) | 2012-12-20 | 2012-12-20 | Packaging structure of organic light emitting diode |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102983279A true CN102983279A (en) | 2013-03-20 |
Family
ID=47857124
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201210558808 Pending CN102983279A (en) | 2012-12-20 | 2012-12-20 | Packaging structure of organic light emitting diode |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102983279A (en) |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104465704A (en) * | 2014-12-03 | 2015-03-25 | 京东方科技集团股份有限公司 | Display panel, packaging method of display panel and display device |
| CN104766876A (en) * | 2015-04-10 | 2015-07-08 | 京东方科技集团股份有限公司 | Organic light emitting diode substrate |
| WO2016115806A1 (en) * | 2015-01-23 | 2016-07-28 | 京东方科技集团股份有限公司 | Display panel and manufacturing method therefor, and display apparatus |
| WO2016124640A1 (en) * | 2015-02-05 | 2016-08-11 | Osram Oled Gmbh | Component and method for producing a component |
| CN106062120A (en) * | 2014-03-27 | 2016-10-26 | 琳得科株式会社 | Sealing sheet, and sealing structure and device |
| CN106450008A (en) * | 2015-08-11 | 2017-02-22 | 三星显示有限公司 | Display apparatus and method of manufacturing the display apparatus |
| CN108281566A (en) * | 2018-01-03 | 2018-07-13 | 深圳市华星光电半导体显示技术有限公司 | O L ED panel and manufacturing method thereof |
| WO2018129965A1 (en) * | 2017-01-10 | 2018-07-19 | Guangdong Oppo Mobile Telecommunications Corp., Ltd. | Substrate, oled encapsulation structure, and manufacturing method of oled encapsulation structure |
| WO2018133146A1 (en) * | 2017-01-18 | 2018-07-26 | 深圳市华星光电技术有限公司 | Oled packaging method, and oled packaging structure |
| CN108336215A (en) * | 2017-01-20 | 2018-07-27 | 联京光电股份有限公司 | Photoelectric packaging body and manufacturing method thereof |
| CN109326740A (en) * | 2018-11-27 | 2019-02-12 | 云谷（固安）科技有限公司 | Display panel and preparation method thereof, display device |
-
2012
- 2012-12-20 CN CN 201210558808 patent/CN102983279A/en active Pending
Cited By (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3124568A4 (en) * | 2014-03-27 | 2017-11-22 | LINTEC Corporation | Sealing sheet, and sealing structure and device |
| CN106062120A (en) * | 2014-03-27 | 2016-10-26 | 琳得科株式会社 | Sealing sheet, and sealing structure and device |
| US10892439B2 (en) | 2014-12-03 | 2021-01-12 | Boe Technology Group Co., Ltd. | Display panel having filler layer and heat dissipation layer and packaging method thereof, and display apparatus |
| WO2016086650A1 (en) * | 2014-12-03 | 2016-06-09 | Boe Technology Group Co., Ltd. | Display panel and packaging method thereof, and display apparatus |
| CN104465704A (en) * | 2014-12-03 | 2015-03-25 | 京东方科技集团股份有限公司 | Display panel, packaging method of display panel and display device |
| WO2016115806A1 (en) * | 2015-01-23 | 2016-07-28 | 京东方科技集团股份有限公司 | Display panel and manufacturing method therefor, and display apparatus |
| US10141537B2 (en) | 2015-01-23 | 2018-11-27 | Boe Technology Group Co., Ltd. | Display panel and manufacturing method therefor, and display apparatus |
| WO2016124640A1 (en) * | 2015-02-05 | 2016-08-11 | Osram Oled Gmbh | Component and method for producing a component |
| US10199604B2 (en) | 2015-04-10 | 2019-02-05 | Boe Technology Group Co., Ltd. | Organic light emitting diode substrate |
| CN104766876A (en) * | 2015-04-10 | 2015-07-08 | 京东方科技集团股份有限公司 | Organic light emitting diode substrate |
| CN106450008A (en) * | 2015-08-11 | 2017-02-22 | 三星显示有限公司 | Display apparatus and method of manufacturing the display apparatus |
| US10553823B2 (en) | 2015-08-11 | 2020-02-04 | Samsung Display Co., Ltd. | Display apparatus and method of manufacturing the display apparatus |
| US11101446B2 (en) | 2015-08-11 | 2021-08-24 | Samsung Display Co., Ltd. | Display apparatus and method of manufacturing the display apparatus |
| WO2018129965A1 (en) * | 2017-01-10 | 2018-07-19 | Guangdong Oppo Mobile Telecommunications Corp., Ltd. | Substrate, oled encapsulation structure, and manufacturing method of oled encapsulation structure |
| WO2018133146A1 (en) * | 2017-01-18 | 2018-07-26 | 深圳市华星光电技术有限公司 | Oled packaging method, and oled packaging structure |
| CN108336215A (en) * | 2017-01-20 | 2018-07-27 | 联京光电股份有限公司 | Photoelectric packaging body and manufacturing method thereof |
| CN108281566A (en) * | 2018-01-03 | 2018-07-13 | 深圳市华星光电半导体显示技术有限公司 | O L ED panel and manufacturing method thereof |
| CN108281566B (en) * | 2018-01-03 | 2020-04-10 | 深圳市华星光电半导体显示技术有限公司 | OLED panel and manufacturing method thereof |
| CN109326740A (en) * | 2018-11-27 | 2019-02-12 | 云谷（固安）科技有限公司 | Display panel and preparation method thereof, display device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102983279A (en) | Packaging structure of organic light emitting diode | |
| KR100544121B1 (en) | Organic electro luminescence display device | |
| CN104600204B (en) | OLED encapsulating structures and method for packing | |
| CN107068907B (en) | Display panel and display device | |
| JP4185006B2 (en) | Organic electroluminescent display device and manufacturing method thereof | |
| KR101932361B1 (en) | Electroluminescent device | |
| JP2000173766A (en) | Display device | |
| KR20010050684A (en) | Sealing structure of electro luminescence device | |
| JP2006146221A (en) | Sealant for flat panel display device and flat panel display device including same | |
| US10096793B2 (en) | Package for device to be packaged, manufacturing method thereof, and OLED apparatus comprising the package | |
| CN107565050A (en) | Organic light-emitting diode packaging structure, electronic installation and method for packing | |
| KR102055281B1 (en) | Display apparatus | |
| CN108321180A (en) | Display base plate and preparation method thereof, display device | |
| TW201818581A (en) | Pattern package of flexible OLED | |
| US8487532B2 (en) | Sealing for panels of an organic electroluminescence display and lighting apparatus | |
| JP2007200627A (en) | Organic el light emitting device | |
| JP2007027142A (en) | Manufacturing method of display device | |
| JP6226312B2 (en) | Organic EL device and manufacturing method thereof | |
| JP5412634B2 (en) | Organic EL display device and organic EL lighting device | |
| US20190334124A1 (en) | Oled packaging structure and oled display panel | |
| KR20110039776A (en) | Dual panel type organic electro-luminescent device | |
| CN113193137B (en) | Display panel and manufacturing method of packaging structure of display panel | |
| KR100736578B1 (en) | Electro-Luminescence Panel and Method of Fabricating the same | |
| KR100619626B1 (en) | Flat panel display device | |
| CN105762300A (en) | Organic Light-Emitting Diode (OLED) device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20130320 |