CN109904343B - Display device and preparation method thereof - Google Patents
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- CN109904343B CN109904343B CN201910146727.3A CN201910146727A CN109904343B CN 109904343 B CN109904343 B CN 109904343B CN 201910146727 A CN201910146727 A CN 201910146727A CN 109904343 B CN109904343 B CN 109904343B
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Abstract
The embodiment of the invention provides a display device, which solves the problem of breakdown caused by more exposed metal around the bonding position of a substrate and a driving chip in the packaging process of the display device in the prior art; according to the display device provided by the embodiment of the invention, the metal wire pattern and the blocking layer covering the metal wire pattern are arranged on the non-display module, the blocking layer comprises the hollow pattern, the hollow pattern covers the metal wire pattern, the blocking layer covering the periphery of the packaging position and the metal layer at the packaging position is designed into the patterned structure comprising the plurality of hollow parts and the plurality of blocking parts, the exposed area of the metal layer can be reduced, the breakdown probability in the packaging process is reduced, the damage probability of a display device in the display device is reduced, and the safety of the display device is further improved.
Description
Technical Field
The invention relates to the technical field of display, in particular to a display device and a preparation method thereof.
Background
In the process of packaging the display device, the organic film layer is often printed and prepared, wherein liquid in the organic film layer overflows in the printing process and flows to the bonding position of the substrate and the driving chip, therefore, in order to prevent the liquid overflow, a part of barrier layer film layer in a non-display area needs to be removed, so that internal and external DAMs are formed, and thus, the liquid can be prevented from flowing to the bonding position.
Disclosure of Invention
In view of this, embodiments of the present invention provide a display device, which solves the problem of breakdown caused by more exposed metal around the bonding position of the substrate and the driving chip in the packaging process of the display device in the prior art.
An embodiment of the present invention provides a display device, including:
the display module and the non-display module are arranged on the surface of the same substrate, wherein the non-display module comprises a metal wire pattern arranged on the surface of the substrate; and the number of the first and second groups,
the metal wire pattern is arranged on the substrate, and the metal wire pattern is arranged on the substrate.
Preferably, the hollow pattern comprises at least one hollow pattern unit, the metal line pattern comprises at least one metal line pattern unit, and the at least one hollow pattern unit respectively and correspondingly covers the at least one metal line pattern unit.
Further, wherein the hollow pattern unit comprises a plurality of hollow parts and a plurality of blocking parts, wherein the arrangement modes of the hollow parts comprise one or more of the following arrangement modes: arranged along a preset direction, arrayed and distributed in a cross way.
Preferably, the shape of the plurality of hollow parts includes one or more of a long strip shape, a curved shape, a broken line shape, a circular shape, an elliptical shape and a polygonal shape.
Preferably, the hollow pattern unit comprises a plurality of hollow parts and a plurality of blocking parts, wherein the arrangement modes of the blocking parts comprise one or more of the following arrangement modes: arranged along a preset direction, arrayed and distributed in a cross way.
Preferably, the shape of the plurality of blocking portions includes one or more of a long bar shape, a curved shape, a broken line shape, a circular shape, an elliptical shape, and a polygonal shape.
Further, the display module assembly includes drive circuit layer and the organic light emitting layer of stack setting, wherein, the barrier layer sets up drive circuit layer with between the organic light emitting layer.
Further, the display device further includes an encapsulation layer, and a boundary of the encapsulation layer is disposed on the barrier layer.
As another aspect of the present invention, an embodiment of the present invention further provides a method for manufacturing a display device, including:
providing a substrate, and preparing a display module and a non-display module on the substrate;
preparing a metal wire pattern on the surface of the substrate in the non-display module;
preparing a blocking layer comprising hollow patterns on the metal wire patterns, wherein the hollow patterns cover the metal wire patterns.
Further, the step of preparing a barrier layer including a hollow pattern on the metal line pattern includes:
preparing a barrier layer on the metal wire pattern, wherein the barrier layer covers the metal wire pattern;
and forming a hollow pattern on the barrier layer right above the metal wire pattern in an exposure or development mode.
Furthermore, the preparation method further comprises the step of sequentially superposing and preparing the driving circuit layer, the barrier layer and the organic light-emitting layer on the substrate in the display module.
According to the display device provided by the embodiment of the invention, the metal wire pattern and the blocking layer covering the metal wire pattern are arranged on the non-display module, the blocking layer comprises the hollow pattern, the hollow pattern covers the metal wire pattern, the blocking layer covering the periphery of the packaging position and the metal layer at the packaging position is designed into the patterned structure comprising the plurality of hollow parts and the plurality of blocking parts, the exposed area of the metal layer can be reduced, the breakdown probability in the packaging process is reduced, the damage probability of a display device in the display device is reduced, and the safety of the display device is further improved.
Drawings
Fig. 1 is a schematic structural diagram of a display device according to an embodiment of the present invention.
Fig. 2 is a schematic structural diagram of a display device according to an embodiment of the present invention.
Fig. 3 is a schematic structural diagram of a display device according to an embodiment of the invention.
Fig. 4 is a schematic structural diagram of a hollow pattern in a display device according to an embodiment of the invention.
Fig. 5 is a schematic structural diagram of a hollow pattern unit in a display device according to an embodiment of the invention.
Fig. 6 is a schematic structural diagram of a hollow pattern unit in a display device according to an embodiment of the present invention.
Fig. 7 is a schematic structural diagram of a hollow pattern unit in a display device according to an embodiment of the invention.
Fig. 8 is a schematic structural diagram of a hollow pattern unit in a display device according to an embodiment of the invention.
Fig. 9 is a schematic structural diagram of a hollow pattern unit in a display device according to an embodiment of the invention.
Fig. 10 is a schematic structural diagram of a hollow pattern unit in a display device according to an embodiment of the invention.
Fig. 11 is a schematic structural diagram of a hollow pattern unit in a display device according to an embodiment of the invention.
Fig. 12 is a schematic flow chart illustrating a manufacturing method of a display device according to an embodiment of the invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Fig. 1 and fig. 3 are respectively schematic structural diagrams of a display device according to an embodiment of the present invention, including a display module 3 and a non-display module 4 disposed on a surface of a same substrate 1, and a barrier layer 5 including a hollow pattern 51 disposed on a metal line pattern 41; the non-display module 4 comprises a metal wire pattern 41 arranged on the upper surface of the substrate 1 and used for connecting a driving circuit, namely the bonding position of the substrate 1 and the driving circuit in the display device; wherein the hollow pattern 51 covers the metal line pattern 41, as shown in fig. 2.
In the display device provided by the embodiment of the invention, the blocking layer covering the periphery of the packaging position and the metal layer at the packaging position is designed to comprise the hollow pattern, so that the exposed area of the metal layer can be reduced, the breakdown probability in the packaging process is reduced, and the damage probability of a display device in the display device is reduced.
In order to reduce the exposed area of the metal layer in the non-display module and reduce the breakdown probability in the packaging process, in an embodiment of the present invention, the hollow pattern includes at least one hollow pattern unit 511, as shown in fig. 4, the metal line pattern 41 includes at least one metal line pattern unit 411, as shown in fig. 3, at least one metal line pattern unit 411 is respectively and correspondingly disposed in at least one hollow pattern unit 511, in an embodiment of the present invention, one hollow pattern unit 511 can cover one metal line pattern unit 411, so that only the position on the barrier layer 5 corresponding to the metal line pattern unit 411 is the hollow pattern unit 511, the exposed metal area on the whole non-display module structure is small, the breakdown probability of the display device in the packaging process is further reduced, and the device safety of the display device is protected.
Preferably, in an embodiment of the present invention, during a packaging process, when an organic film layer is prepared during the packaging process, the organic film layer is easy to overflow onto the metal line pattern unit 411, that is, at a position where the metal line pattern unit 411 and a circuit are aligned and bonded in a packaging and binding process, quality of alignment and bonding is reduced, and in order that the organic film layer does not overflow onto the metal line pattern unit 411, in an embodiment of the present invention, an area of the hollow pattern unit 511 is larger than an area of the metal line pattern unit 411.
Preferably, in an embodiment of the present invention, the hollow pattern unit 511 includes a plurality of hollow portions 512 and a plurality of blocking portions 513, where the arrangement of the plurality of hollow portions 512 may be performed according to an actual manufacturing process, for example, may be one of arrangement along a preset direction, array arrangement, and cross arrangement, or may be a combination of two or three of arrangement along the preset direction, array arrangement, and cross arrangement; preferably, the shape of the hollow portion 512 may be selected according to the actual manufacturing process, and may be, for example, one of a long strip, a curved line, a folded line, a circle, an ellipse, and a polygon, or two or more of a long strip, a curved line, a folded line, a circle, an ellipse, and a polygon, which is not limited in the present invention.
In an embodiment of the invention, the hollow parts 512 are a combination of a triangle and a circle, and the hollow parts 512 are arranged in an array, as shown in fig. 5, in another embodiment of the invention, the hollow parts 512 are long strips extending along a first direction, wherein a plurality of the hollow parts 512 are arranged along a second direction, wherein the first direction and the second direction are crossed, as shown in fig. 6. It should be understood that the shape of the cutout 512 may also be curved, as shown in FIG. 7; it may also be a dogleg shape, as shown in FIG. 8; the two modes of curve shape and fold line shape can coexist.
Preferably, in an embodiment of the present invention, the hollow pattern unit 511 includes a plurality of hollow portions 512 and a plurality of blocking portions 513, where the arrangement of the plurality of blocking portions 513 may be performed according to an actual manufacturing process, for example, the arrangement may be one of arrangement along a preset direction, array arrangement, and cross arrangement, or a combination of two or three of arrangement along the preset direction, array arrangement, and cross arrangement; preferably, the shape of the blocking portion 513 may be selected according to the actual manufacturing process, and may be, for example, one of a long strip, a curved line, a folded line, a circle, an ellipse, and a polygon, or two or more of a long strip, a curved line, a folded line, a circle, an ellipse, and a polygon, which is not limited in the present invention.
In another embodiment of the present invention, the blocking section 513 is an elongated shape extending along a third direction, wherein a plurality of blocking sections 513 are arranged along a fourth direction, wherein the third direction and the fourth direction intersect, as shown in fig. 9. It should be understood that the shape of the cutout 512 may also be curved, as shown in FIG. 10; it may also be a dogleg shape, as shown in FIG. 11; the two modes of curve shape and fold line shape can coexist.
In an embodiment of the present invention, the display module 3 in the display device includes a driving circuit layer 6 and an organic light emitting layer 7 stacked on the substrate 1 in the display module 3, wherein the barrier layer 5 is disposed between the driving circuit layer 6 and the organic light emitting layer 7, as shown in fig. 1, the barrier layer 5 is disposed between the driving circuit layer 6 and the organic light emitting layer 7 in the display module 3 in the display device provided by the present invention, so that the flatness of the display device is increased.
Further, in an embodiment of the present invention, the display device further includes a package layer, wherein a boundary of the package layer is disposed on the barrier layer 5, so that an exposed metal area at a non-display region binding package position is small, and a risk of breakdown in a packaging process is reduced.
It should be understood that the encapsulation layer may include at least one inorganic layer and at least one organic layer stacked together, so that during the encapsulation process, external moisture or oxygen is prevented from entering the display area, the water-oxygen corrosion problem of the display film layer is avoided, and the damage of the display device is avoided.
An embodiment of the present invention provides a method for manufacturing a display device, as shown in fig. 12, including:
step 101: providing a substrate, and preparing a display module and a non-display module on the substrate;
step 102: preparing a metal wire pattern on the surface of a substrate in the non-display module;
step 103: preparing a barrier layer comprising hollow patterns on the metal wire patterns, wherein the hollow patterns cover the metal wire patterns;
the correspondence between the hollow patterns and the metal line patterns and the shapes of the hollow patterns are as described above, and are not described herein again.
It should be understood that, in step 102, the preparation manner of preparing the barrier layer including the hollow-out pattern on the metal line pattern may be selected according to an actual process, and preferably, step S102 may further include:
step 1021: preparing a barrier layer on the metal wire pattern;
step 1022: and forming a hollow pattern on the barrier layer right above the metal wire pattern in an exposure or development mode.
According to the preparation method of the display device, the exposed metal area around the barrier layer including the hollow pattern prepared on the packaging metal line pattern in the non-display module in the display device prepared by the method is small, the probability of the breakdown phenomenon in the packaging process of the display device is reduced, the same photoetching mask plate is used for the barrier layer and the hollow pattern, and extra production cost is not increased.
In order to improve the flatness of the display panel in the display device, the method for manufacturing a display device according to an embodiment of the present invention further includes sequentially stacking and manufacturing a driving circuit layer, a blocking layer, and an organic light emitting layer on the substrate in the display module, where the driving circuit layer is used for driving the organic light emitting layer to emit light. According to the preparation method of the display device, the barrier layer is prepared between the driving circuit layer and the organic light emitting layer in the display module, so that the display device is flattened.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents and the like that are within the spirit and principle of the present invention are included in the present invention.
Claims (8)
1. A display device, comprising:
the display module comprises a display module and a non-display module which are arranged on the surface of the same substrate, wherein the non-display module comprises a metal wire pattern arranged on the surface of the substrate, and the display module comprises a driving circuit layer and an organic light-emitting layer which are arranged in a superposition manner; and the number of the first and second groups,
the display module comprises a non-display module and a display module, wherein the non-display module comprises a metal line pattern and a blocking layer arranged in the non-display module, the blocking layer comprises hollow patterns arranged on the metal line pattern, the hollow patterns cover the metal line pattern, the hollow patterns comprise at least one hollow pattern unit, the metal line pattern comprises at least one metal line pattern unit, the at least one hollow pattern unit respectively and correspondingly covers the at least one metal line pattern unit, and only the position, corresponding to the metal line pattern unit, on the blocking layer is the hollow pattern unit; the hollow pattern unit comprises a plurality of hollow parts and a plurality of blocking parts;
the barrier layer in the display module is arranged between the driving circuit layer and the organic light-emitting layer.
2. The display device according to claim 1, wherein the plurality of hollow parts are arranged in one or more of the following ways: arranged along a preset direction, arrayed and distributed in a cross way.
3. The display device according to claim 2, wherein the shapes of the plurality of hollow parts include one or more of a long bar shape, a curved shape, a broken line shape, a circular shape, an elliptical shape, and a polygonal shape.
4. The display device according to claim 1, wherein the arrangement of the plurality of barrier portions includes one or more of the following arrangements: arranged along a preset direction, arrayed and distributed in a cross way.
5. The display device according to claim 4, wherein the shape of the plurality of blocking portions includes one or more of a long bar shape, a curved shape, a broken line shape, a circular shape, an elliptical shape, and a polygonal shape.
6. The display device according to any one of claims 1 to 5, further comprising an encapsulation layer, a boundary of the encapsulation layer being provided on the barrier layer.
7. A method of manufacturing a display device, comprising:
providing a substrate, and preparing a display module and a non-display module on the substrate;
sequentially preparing a driving circuit layer, a barrier layer and an organic light emitting layer on a substrate in the display module in an overlapping manner, wherein the barrier layer in the display module is arranged between the driving circuit layer and the organic light emitting layer;
preparing a metal wire pattern on the surface of the substrate in the non-display module;
preparing a blocking layer comprising a hollow pattern on the metal wire pattern in the non-display module, wherein the hollow pattern covers the metal wire pattern; the hollow pattern comprises at least one hollow pattern unit, the metal wire pattern comprises at least one metal wire pattern unit, the at least one hollow pattern unit respectively and correspondingly covers the at least one metal wire pattern unit, and only the position, corresponding to the metal wire pattern unit, on the blocking layer is the hollow pattern unit; the hollow pattern unit comprises a plurality of hollow parts and a plurality of blocking parts.
8. The method of claim 7, wherein the fabricating a barrier layer including a hollowed-out pattern on the metal line pattern comprises:
preparing a barrier layer on the metal wire pattern, wherein the barrier layer covers the metal wire pattern;
and forming a hollow pattern on the barrier layer right above the metal wire pattern in an exposure or development mode.
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| CN201910146727.3A CN109904343B (en) | 2019-02-27 | 2019-02-27 | Display device and preparation method thereof |
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| CN201910146727.3A CN109904343B (en) | 2019-02-27 | 2019-02-27 | Display device and preparation method thereof |
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| CN109904343B true CN109904343B (en) | 2021-10-26 |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104576685A (en) * | 2013-10-29 | 2015-04-29 | 三星显示有限公司 | Organic light emitting display apparatuses and methods of manufacturing the organic light emitting display apparatuses |
| CN107658386A (en) * | 2016-07-25 | 2018-02-02 | 三星显示有限公司 | Display device with the structure for preventing organic material spilling |
| CN108258146A (en) * | 2018-01-16 | 2018-07-06 | 京东方科技集团股份有限公司 | A kind of encapsulating structure and display device |
| CN108962947A (en) * | 2018-07-04 | 2018-12-07 | 上海天马微电子有限公司 | Flexible display panel and display device |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6562651B2 (en) * | 2015-02-20 | 2019-08-21 | キヤノン株式会社 | Manufacturing method of semiconductor device |
| CN108336109B (en) * | 2018-01-02 | 2021-02-02 | 厦门天马微电子有限公司 | Organic light emitting display panel, display device and organic light emitting display mother board |
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- 2019-02-27 CN CN201910146727.3A patent/CN109904343B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104576685A (en) * | 2013-10-29 | 2015-04-29 | 三星显示有限公司 | Organic light emitting display apparatuses and methods of manufacturing the organic light emitting display apparatuses |
| CN107658386A (en) * | 2016-07-25 | 2018-02-02 | 三星显示有限公司 | Display device with the structure for preventing organic material spilling |
| CN108258146A (en) * | 2018-01-16 | 2018-07-06 | 京东方科技集团股份有限公司 | A kind of encapsulating structure and display device |
| CN108962947A (en) * | 2018-07-04 | 2018-12-07 | 上海天马微电子有限公司 | Flexible display panel and display device |
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