JP2009289615A - Method of manufacturing organic electroluminescent panel, and organic electroluminescent panel - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing an organic EL panel, along with an organic EL panel, wherein a transparent substrate in which a plurality of organic EL panels are formed can be properly divided. <P>SOLUTION: The manufacturing method includes a step of forming an organic EL element 30 and mounting an IC chip 60 and a flexible printed circuit board 70 on each of circuit patterns 20 for a plurality of organic EL panels formed on a transparent substrate 10, a step in which a resin 80 is applied to each of exposed portions in the circuit patterns 20, and a step of cutting the transparent substrate 10 on which the resin has been applied, along a planned cut region SL positioned between the circuit patterns 20. Here, a step of forming a bank layer 58 along the planned cut region SL on the transparent substrate 10 is inserted before the step of applying the step of applying the resin 80. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a method for manufacturing an organic EL panel and an organic EL panel.

As one of thin displays, for example, flat display panels shown in Patent Documents 1 to 3 are known. Such a flat display panel is formed by forming a display element on a transparent substrate on which a circuit pattern is formed, mounting an IC chip and a flexible printed board, and applying a resin on the circuit pattern. In recent years, organic EL panels have attracted attention as such flat display panels.
JP 2003-241678 A JP 2004-206096 A JP 2004-206097 A

  By the way, in the manufacture of the organic EL panel, from the viewpoint of cost reduction, a large number of organic EL panels are manufactured on a transparent substrate, and then the transparent substrate is cut using cutting scheduled areas called scribe lines as cutting margins. It is preferable to obtain an organic EL panel. And if it is going to manufacture more organic EL panels from one transparent substrate, the space | interval between the organic EL panels on a transparent substrate will become narrow. However, when the interval between the organic EL panels is reduced, the resin applied to cover the circuit pattern may protrude from the region to be cut. If the resin is formed on the area to be cut, the transparent substrate cannot be cut well, the outer shape of the transparent substrate is abnormal, and the yield deteriorates.

  This invention is made | formed in view of the said subject, and it aims at providing the manufacturing method and organic electroluminescent panel of an organic electroluminescent panel which can isolate | separate suitably the transparent substrate in which the several organic electroluminescent panel was formed individually. .

  The method for producing an organic EL panel according to the present invention includes forming an organic EL element and mounting an IC chip or a flexible printed board on each of a plurality of circuit patterns for an organic EL panel formed on a transparent substrate. A step of applying a resin to each exposed portion of each circuit pattern, a step of cutting a transparent substrate coated with a resin along a planned cutting region located between the circuit patterns, Is provided. And before the process of apply | coating resin, the process of forming an embankment layer along a cutting plan area | region on a transparent substrate is further provided.

  According to the present invention, when the resin is applied, the bank can suppress the resin from protruding above the region to be cut.

  Here, the formation of the organic EL element preferably includes a step of forming a resist film on the transparent substrate, and the step of forming the bank layer and the step of forming the resist film are preferably performed simultaneously.

  According to this, the bank can be easily formed without increasing the number of steps.

  Moreover, it is preferable that the dike layer is electrically insulating.

  Thereby, the short circuit etc. resulting from a dike layer can be suppressed.

The organic EL panel according to the present invention includes a transparent substrate, a circuit pattern formed on the transparent substrate, an organic EL element electrically connected to the circuit pattern, and an IC chip mounted on the circuit pattern or A flexible printed circuit board, a resin that covers the circuit pattern, and a levee layer provided on the transparent substrate along the edge of the transparent substrate.
Such an organic EL panel can be obtained by the above manufacturing method and has a high yield.

  ADVANTAGE OF THE INVENTION According to this invention, the manufacturing method of an organic EL panel and an organic EL panel which can isolate | separate suitably the transparent substrate in which the some organic EL panel was formed can be provided.

  Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the description of the drawings, the same or corresponding elements are denoted by the same reference numerals, and redundant description is omitted. In addition, the dimensional ratio in each drawing does not necessarily match the actual dimensional ratio.

  First, the manufacturing method of the organic EL panel according to this embodiment will be described.

  First, as shown in FIG. 1, a transparent substrate 10 is prepared. Although the material of the transparent substrate 10 is not specifically limited, For example, a glass substrate and a resin substrate are mentioned. Although thickness is not specifically limited, For example, a thing about 0.3-1.1 mm can be used.

  Subsequently, a circuit pattern 20 for an organic EL panel is formed on the transparent substrate 10. The circuit pattern 20 mainly includes a vertical electrode portion 20a on the anode side and a cathode side extending from the portion 10EL where the organic EL element 30 is to be formed to the portion 10IC where the organic EL element driving IC chip is to be mounted. And a wiring portion 20d extending from the portion 10IC where the organic EL element driving IC chip is to be mounted to the portion 10FPC where the flexible printed circuit board is to be mounted.

  The vertical electrode portion 20a extends in the vertical direction, that is, the Y direction, on the portion 10EL where the organic EL element is to be formed. The horizontal electrode portion 20b extends to the upper portion of the left end portion of the portion 10EL where the organic EL element is to be formed, and the horizontal electrode portion 20c extends to the lower portion of the right end portion of the portion 10EL where the organic EL element is to be formed. It extends.

  Such a circuit pattern 20 can be easily manufactured by a photolithography method or the like using a conductive material such as ITO or a metal film such as Al, Cr, or Mo. The circuit pattern 20 can have a barrier film of tantalum, Ti, etc. on the base metal film. The circuit pattern 20 may have a structure of three or more layers.

  In particular, in the present embodiment, a plurality of circuit patterns 20 are formed on the transparent substrate 10 so as to form a plurality of organic EL panels. Here, a dotted line shown between the circuit patterns 20 is a planned cutting area SL called a scribe line. In the subsequent process, each organic EL panel is separated using the planned cutting area SL as a cutting allowance.

(Formation of organic EL element 30 and dike layer 58)
Subsequently, as shown in FIG. 2A, the organic EL element 30 is formed on the portion 10EL where the organic EL element of the transparent substrate 10 is to be formed, and the embankment layer is formed along the planned cutting area SL. 58, 58 are formed.

  Here, first, the formation of the organic EL element 30 will be described in detail. 3 is a cross-sectional view taken along the line III-III in FIG. 2, and FIG. 4 is a partially broken perspective view of the organic EL element 30.

  The organic EL element 30 mainly includes a vertical electrode film 32, an organic EL layer 34, a horizontal electrode film 36, an insulating film 40, and a separator 42.

  First, in FIG. 2A, a stripe-shaped vertical electrode film 32 extending in the vertical direction is formed. As shown in FIGS. 2A and 3, the vertical electrode film 32 extends in the vertical direction, that is, in the Y direction on the portion 10E on the transparent substrate 10 where the organic EL element is to be formed. As shown in FIG. 2 and FIG. 4, they are in contact with the vertical electrode portions 20 a of the circuit pattern 20. The vertical electrode film 32 is a transparent conductive film, and for example, ITO or the like can be used.

  Subsequently, an interlayer insulating film 40 having a lattice shape is formed on the vertical electrode film 32 as shown in FIG. The portions extending in the Y direction in the interlayer insulating film 40 electrically connect the vertical electrode portion 20a and the vertical electrode film 32 that are in contact with each other, and the vertical electrode portion 20a and the vertical electrode film 32 adjacent thereto, respectively. Insulate. The material of the interlayer insulating film 40 is not particularly limited as long as it is an electrical insulating material, but for example, a resist material can be suitably used. Such an interlayer insulating film 40 can also be suitably manufactured by a photolithography method. Although the height of the interlayer insulation film 40 is not specifically limited, For example, it can be set to 1 micrometer-5 micrometers.

  Subsequently, a separator 42 is stacked on a portion of the interlayer insulating film 40 that extends in the X direction. The material of the separator 42 is not particularly limited, but an electrically insulating material is preferable, and a resist material is particularly preferable. The height of the separator 42 is not particularly limited, but is preferably a height sufficient to separate an organic EL layer 34 and a horizontal electrode film 36, which will be described later, in the Y direction, for example, 5 μm to 10 μm.

  Subsequently, the organic EL layer 34 and the horizontal electrode film 36 are laminated in this order on the vertical electrode film 32 on which the interlayer insulating film 40 and the separator 42 are laminated.

  By setting the separator 42 to a sufficient height, as shown in FIGS. 3 and 4, the organic EL layer 34 and the horizontal electrode film 36 are separated from each other in the Y direction, and each has a stripe shape.

  That is, the organic EL layer 34 and the horizontal electrode film 36 are disposed on the vertical electrode film 32 on the transparent substrate 10 so as to extend in the vertical direction (X direction) so as to intersect the vertical electrode film 32. As shown in FIG. 2, the end portion of the horizontal electrode film 36 is in contact with the horizontal electrode portion 20b or the horizontal electrode portion 20c, as shown in FIG.

  The material of the horizontal electrode film 36 is not particularly limited, and Al or the like can be used. The horizontal electrode film 36 can be easily formed by a sputtering method or the like.

  The material of the organic EL layer 34 is not specifically limited, For example, the well-known thing comprised from a positive hole transport layer, a light emitting layer, and an electron carrying layer can be utilized. The organic EL layer 34 can also be manufactured by a known method.

  As a result, as shown in FIG. 4, pixels G are formed in the respective portions of the organic EL layer 34 sandwiched between the vertical electrode film 32 and the horizontal electrode layer 34.

  Further, as shown in FIG. 3, the portion where the organic EL layer 34 is formed is sealed with a sealing can 44 in which a desiccant 45 is provided. Specifically, the end portion of the sealing can 44 may be bonded to the transparent substrate 10 using the adhesive 46.

  On the other hand, as shown in FIGS. 2A and 2B, the dike layer 58 is cut along each scheduled cutting area SL that becomes a cutting allowance for cutting the transparent substrate 10 in a cutting process described later. Provided on both sides of the planned area SL. The material of the levee layer 58 is not particularly limited, but is preferably an electrically insulating material, and particularly preferably made of a resin material such as a resist. In particular, a positive resist such as a novolac resin is preferable in consideration of acid resistance, resistance to alkali, heat resistance, and the like.

  As shown in FIG. 2B, the distance WG between the planned cutting region SL and the levee layer 58 is not particularly limited, but is preferably 50 μm or less from the viewpoint of effective use of the transparent substrate area, and is 10 μm or less. It is more preferable to do. Note that the width WS of the planned cutting area SL is determined by the cutting means and is not particularly limited, but may be, for example, 0.1 to 1 mm.

  Further, the height WH of the levee layer 58 is not particularly limited as long as a resin to be described later can be damped, but may be 1 to 10 μm, for example. Furthermore, the width WB of the levee layer 58 is not particularly limited, but may be 1 to 100 μm, for example.

  Further, the length in the Y direction along the planned cutting area SL of the dyke layer 58 in FIG. 2A is preferably the same as the length of the planned cutting area SL, that is, the cutting length of the glass.

  Here, the formation method of such a dyke layer 58 is not specifically limited, For example, it can manufacture suitably using the photolithographic method. In particular, the embankment layer 58 is formed simultaneously with the formation of the interlayer insulating film 40 or the separator 42 of the organic EL element 30 using a resist material. For example, the pattern of the embankment layer 58 is also used as a mask for forming the interlayer insulating film 40 and the separator 42. By adding, the bank layer 58 can be formed without increasing the number of steps.

(Mounting of IC chip 60 and FPC 70)
Subsequently, as shown in FIG. 2, the organic EL driving IC 60 is mounted on the portion 10 IC where the IC chip is to be formed, and the organic EL driving IC chip 60, the vertical electrode portion 20 a of the circuit pattern 20, and the horizontal electrode are mounted. The parts 20b and 20c and the wiring part 20d are electrically connected. The organic EL driving IC 60 and its mounting method are not particularly limited, and known ones can be used.

  Furthermore, the flexible printed circuit board 70 is mounted on the portion 10FPC on which the flexible printed circuit board is to be mounted, and the flexible printed circuit board 70 and the wiring portion 20d of the circuit pattern 20 are electrically connected.

  Here, for mounting the organic EL driving IC chip 60 and the flexible printed circuit board 70, it is preferable to use, for example, a so-called anisotropic conductive film in which conductive particles are mixed in resin or paste.

  Specifically, for example, the anisotropic conductive film 62 and the like are stacked on the IC 10 where the IC chip is to be formed, and then the organic EL driving IC chip 60 is positioned and mounted on the anisotropic conductive film 62. Mounting is possible by pressing the organic EL driving IC chip against the transparent substrate 10. Similarly, the flexible printed circuit board 70 can be mounted using the anisotropic conductive film 72.

  Here, the organic EL driving IC chip 60 controls light emission of a desired pixel of the passive matrix organic EL element 30 based on a signal input through a flexible printed circuit board. The printed circuit board 70 is a flexible external wiring means, and any of them is not particularly limited, and a known one can be used.

  Next, as shown in FIG. 5, a resin 80 is applied to the periphery of the organic EL driving IC chip 60 and the periphery of the flexible printed circuit board 70 in the circuit pattern 20 and exposed to the outside. The exposed part of the pattern 20 is protected.

  Here, the material of the resin 80 is not particularly limited. For example, a silicone resin or the like can be used.

  In the present embodiment, when the resin 80 is applied, the levee layer 58 is formed along the planned cutting area SL, so that the applied resin 80 is prevented from protruding onto the planned cutting area SL. .

  Subsequently, as shown in FIG. 6, the transparent substrate 10 is cut along the scheduled cutting region SL to obtain a separated organic EL panel PN. Here, the cutting method is not particularly limited, and can be performed with a cutting tool such as a diamond cutter or a laser. For example, a scribing groove may be formed using a cutting tool, and then the scribing groove may be bent and cut, or may be directly cut with a cutting tool without undergoing a bending step. Thereby, as shown in FIG. 6B, the surface of the transparent substrate 10 is cut with the width of the planned cutting area SL as a cutting margin.

  And according to this embodiment, since the dike layer 58 is formed along the cutting plan area | region SL, it can suppress that the resin 80 for protection protrudes on the cutting plan area | region SL. Therefore, it is possible to suitably perform the cutting process of the planned cutting area. If the resin 80 is present on the planned cutting area SL, various problems such as cutting a part off the planned cutting area SL, making it difficult to cut with a laser, and shortening the service life due to the resin on the diamond wheel. However, in the present embodiment, these can be suppressed.

  In addition, when the bank layer 58 is formed, it becomes easy to align a cutting tool such as a diamond cutter with the planned cutting area SL in the cutting process.

  Furthermore, since the strength in the vicinity of the planned cutting area SL is increased by the dike layer 58, cracks and the like during cutting are reduced, and the yield is improved.

  In addition, this invention is not limited to the said embodiment, A various deformation | transformation aspect is possible.

  For example, in the above embodiment, as shown in FIGS. 2B, 5B, and 6B, the levee layer 58 is separated from the planned cutting area SL, that is, WG> 0. However, as shown in FIG. 7, the dike layer 58 is formed so as to protrude into the planned cutting area SL, that is, WGA> 0, and a part of the dike layer 58 is removed in the subsequent cutting process. However, the transparent substrate 10 may be cut. Of course, WG = WGA = 0 may be sufficient.

  In this case, the bank layer 58 serves to protect the edge E formed when the transparent substrate 10 is cut, and the edge E can be prevented from being chipped. Here, it is preferable that the protrusion width WGA of the dike layer 58 to the planned cutting area SL is 1 μm or less.

  In addition, as shown in FIG. 8, levee layers 58 </ b> A and 58 </ b> B may be provided at a part away from the planned cutting area SL, for example, at the end of the transparent substrate 10.

  Moreover, in the said embodiment, although formation of the bank layer 58 and formation of the interlayer insulation film 40 or the separator 42 are performed in the same process, the bank layer 58 is a process different from formation of the interlayer insulation film 40 or the separator 42. May be formed. In this case, the bank layer 58 is not necessarily formed of a resist material, and can be formed of an inorganic material such as a metal oxide layer or a metal layer.

  Moreover, in the said embodiment, although both the IC chip 60 and the flexible printed circuit board 70 are mounted, the case where only one is mounted may be sufficient.

  Further, the configurations of the organic EL element 30, the circuit pattern 20, and the like are not particularly limited, and various modes are possible.

FIG. 1 is a top view showing a method for manufacturing an organic EL panel according to an embodiment of the present invention. FIG. 2 is a view subsequent to FIG. 1 showing the method for manufacturing the organic EL panel according to the embodiment of the present invention, in which (a) is a top view and (b) is a view taken along the line bb in FIG. . FIG. 3 is a view taken along arrow III-III in FIG. FIG. 4 is a partially broken perspective view of the organic EL element of FIG. 5A and 5B are views subsequent to FIG. 2 illustrating the method for manufacturing the organic EL panel according to the embodiment of the present invention, in which FIG. 5A is a top view and FIG. 5B is a view taken along the line bb in FIG. . 6A and 6B are views subsequent to FIG. 5 illustrating the method for manufacturing the organic EL panel according to the embodiment of the present invention, in which FIG. 6A is a top view and FIG. 6B is a view taken along the line bb in FIG. . FIG. 7 is a cross-sectional view in the vicinity of a planned cutting area showing a method for manufacturing an organic EL panel according to another embodiment of the present invention. FIG. 8 is a top view showing a method for manufacturing an organic EL panel according to still another embodiment of the present invention.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 10 ... Transparent substrate, 20 ... Circuit pattern, 30 ... Organic EL element, 40 ... Interlayer insulation film, 42 ... Separator, 58 ... Levee layer, 60 ... Organic EL drive IC chip (IC chip), 70 ... Flexible printed circuit board, 80: Protection part (resin), SL: Planned cutting area, PN: Organic EL panel.

Claims (4)

For each of a plurality of organic EL panel circuit patterns formed on a transparent substrate, forming an organic EL element and mounting an IC chip or a flexible printed circuit board,
Applying a resin to each exposed portion of each circuit pattern;
Cutting the transparent substrate coated with the resin along the planned cutting region located between the circuit patterns,
A method for producing an organic EL panel, further comprising a step of forming an embankment layer along the planned cutting region on the transparent substrate before the step of applying the resin. In the formation of the organic EL element, there is a step of forming a resist film on the transparent substrate,
The method of manufacturing an organic EL panel according to claim 1, wherein the step of forming the bank layer and the step of forming the resist film are performed simultaneously.   The method of manufacturing an organic EL panel according to claim 1, wherein the levee layer is electrically insulating. A transparent substrate;
A circuit pattern formed on the transparent substrate;
An organic EL element electrically connected to the circuit pattern;
An IC chip or a flexible printed circuit board mounted on the circuit pattern;
A resin covering the circuit pattern;
A dike layer provided along an edge of the transparent substrate on the transparent substrate;
An organic EL panel comprising

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