JP2005183209A - Organic electroluminescent display device and method of manufacturing the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an organic electroluminescent display device that has reduced deterioration in display characteristics. <P>SOLUTION: The organic electroluminescent display device according to the present invention comprises: a plurality of anode wirings 1 arranged on a substrate 11; a connection terminal 26 provided correspondingly to the plurality of anode wirings 1; an edge cover resin 29 formed to cover the connection terminal 26; an opposite board 51 provided opposite to the substrate 11; and a seal member 53 deposited inside the connection terminal 26, wherein the connection terminal 26 has a laminated metal film, which is formed with a barrier layer on an upper most layer thereof for preventing electrolytic corrosion of an underlying metal. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to an organic EL display device and a manufacturing method thereof.

With the rapid progress of technological development in the information and communication field in recent years, great expectations are placed on a flat display replacing CRT. In particular, organic EL displays are actively studied because they are excellent in terms of high-speed response, visibility, brightness, and the like.

  An organic EL device announced by Tang et al. Of Kodak Company in 1987 has a two-layer structure of organic thin films, and uses tris (8-quinolinolato) aluminum (hereinafter abbreviated as “Alq”) as a light emitting layer. In addition, green light was emitted when driven at a low voltage of 10 V or less, and a high luminance of 1000 cd / m 2 was obtained. The luminous efficiency was 1.5 lumen / W (Appl. Phys. Lett., 51, 913 (1987)).

  Since then, research for rapid practical use has been advanced, and various stacked organic EL devices having about 1 to 10 organic layers sandwiched between a hole injection electrode and an electron injection electrode have been developed. .

  With regard to organic EL materials, organic EL can be obtained by forming thin films of various low-molecular compounds by a method such as spin coating, ink jet, die coating, or flexographic printing, as well as a method of forming a thin film of various low-molecular compounds by vacuum deposition. A method of creating an element has been proposed.

  In addition, technical information about organic EL elements created by the “Technical Field Patent Map Creation Committee” is posted on the JPO homepage, so-called basic patents, various materials, manufacturing methods, device structures, driving methods In regard to color technology, durability improvement, applications, etc., patent reports are published and registered patents are cited and reported collectively.

  An organic EL element substrate used in an organic EL display has an anode formed on the substrate, a thin organic compound layered on the anode, and a transparent layer formed on the organic compound layer on the substrate. In this structure, the cathode is formed so as to face the anode. An organic EL element is a current-driven display element that emits light when a current is supplied to an organic compound layer disposed between an anode and a cathode. Hereinafter, a thin film of an organic compound to be laminated is referred to as an organic thin film layer. A display pixel is a portion where an anode, a plurality of organic thin film layers, and a cathode are stacked. Then, light is extracted from the transparent anode and a desired image is displayed.

  By the way, the organic EL display device uses a current drive element, and in the passive drive type organic EL display device, it is necessary to emit light instantaneously within a time when each row is selected. As a result, a large current flows into the electrode as compared with the case where a voltage-driven display element such as a liquid crystal device is used.

  Therefore, it is important to make the cathode wiring and anode wiring low resistance. As panels become larger, higher definition, and higher brightness, the resistance of these wirings will need to be further reduced, and at the same time, contacts and driving circuits between these wirings and auxiliary wiring Lowering the resistance between the connection terminal and the auxiliary wiring has been an issue. In this regard, there is a disclosed prior art regarding cathode auxiliary wiring connected to the cathode wiring of the organic EL display device (for example, Patent Document 1).

  In this prior art, a transparent electrode material is used for the drive circuit connection terminal, and the cathode material and the cathode auxiliary wiring material are the same. In this case, if the cathode surface or the cathode auxiliary wiring surface is not oxidized before the connection between the cathode material and the cathode auxiliary wiring material, the possibility of solving the problem of contact resistance between the cathode and the cathode auxiliary wiring is increased.

  Further, an organic electroluminescence display element that attempts to eliminate an increase in contact resistance of a metal electrode due to baking at the time of manufacture is disclosed (for example, Patent Document 2). Therefore, a barrier layer is formed on the surface layer of the extraction electrode provided on the transparent substrate, and the extraction electrode is brought into contact with the metal electrode laminated on the transparent substrate via the organic light emitting layer via the barrier layer.

  The extraction electrode is formed of a metallic conductive material such as Cr, Al, Cu, Ag, Au, Pt, Pd, Ni, Mo, Ta, Ti, W, C, Fe, In, Ag-Mn, and Zn. The barrier layer is formed of a refractory metal, a noble metal, an oxide, a nitride, or an oxynitride having good heat resistance and alteration.

  Therefore, it is described that the contact resistance between the extraction electrode and the metal electrode is kept low even when heating is performed at the time of forming the interlayer insulating film or the like, and the driving can be performed at a low voltage. Further, when the extraction electrode is formed via the adhesion improving layer, the adhesion of the extraction electrode to the transparent substrate is improved, and a good electrical connection between the extraction electrode and the metal electrode is maintained.

  On the other hand, since the anode wiring is usually formed of a transparent conductive film, a metal oxide film such as ITO (Indium Tin Oxides) is used. Since such a metal oxide film generally has a higher specific resistance than a metal, it is difficult to reduce the wiring resistance. Accordingly, it is possible to reduce the resistance by providing an anode auxiliary wiring made of a metal material outside the display region. Furthermore, by supplying a signal to the anode wiring through the connection terminal made of a metal material, the contact resistance with the external wiring can be reduced.

  A configuration of an organic EL display device provided with a connection terminal made of a metal material will be described with reference to FIG. FIG. 8 is a top view showing the configuration of the organic EL element substrate 100 used in the organic EL display device.

  On the substrate 11, a plurality of anode wirings 1 are arranged in parallel by a transparent conductive film. A plurality of connection terminals 26 corresponding to each anode wiring 1 are formed on the substrate end side of the anode wiring 1. The connection terminal 26 is patterned so as to overlap the anode wiring 1. Thereby, the anode wiring 1 and the connection terminal 26 are connected. Since the connection terminal 26 is formed of a metal material, the contact resistance can be reduced.

  The connection terminal 26 is mainly made of Al or Al alloy having a low specific resistance. Further, for example, a refractory metal film is used as a barrier layer in the upper layer and the lower layer. The refractory metal film under the Al layer is formed to improve the contact resistance with the transparent conductive film. The refractory metal film on the upper layer of Al is formed in order to prevent the contact resistance from deteriorating due to the deterioration of Al due to oxidation or the like in a later step.

  An insulating film 22 having an opening 23 corresponding to the pixel electrode is formed from above. For the insulating film 22, for example, a photosensitive polyimide resin is used. In the step of forming the opening 23, a contact hole 25 for connecting the cathode auxiliary wiring 25 and the cathode wiring 5 is formed. And in order to isolate | separate the cathode wiring 5, the partition 10 of a reverse taper structure is formed. An organic thin film layer (not shown) is formed thereon, and a cathode wiring 5 is formed thereon. The cathode wiring 5 is separated by the partition wall 10 and formed so as to intersect the anode wiring 1.

  A signal electrode driver is connected to a connection terminal 26 provided at an end portion of the anode wiring 1, and a scanning electrode driver is connected to a terminal portion of the cathode auxiliary wiring 21 in the same manner. Specifically, a TCP with a built-in drive circuit is crimped to the terminal portion via an ACF. Thereby, current can be supplied to the anode wiring 1 and the cathode wiring 5. In the opening 23 provided at the position where the cathode wiring 5 and the anode wiring 1 intersect, a current flows through the organic thin film layer to emit light. The element substrate 100 is formed as described above.

  And a sealing material is apply | coated to the opposing board | substrate (not shown) in which the water catching material was arrange | positioned, and it is made to oppose with the element substrate 100. FIG. The sealing material is applied to the counter substrate using a dispenser so as to be arranged in the seal pattern 50 on the element substrate 100 side. The sealing material is irradiated with light from the back side of the substrate to cure the sealing material, and the element substrate 100 and the counter substrate are bonded together.

  The connection terminal 26 is disposed outside the sealed space. When the connection terminal 26 is arranged in a high temperature and high humidity environment, there are the following problems.

  In the case of a simple matrix display device, the cathode side becomes a ground potential when selected, and is fixed at a high voltage when not selected. The voltage at this time is about 10 to 20 V, for example. On the other hand, on the anode side, if the line is in a lighting state, a voltage necessary for flowing a predetermined current is applied, and is usually about 10 to 20 V because it is equivalent to the non-selection potential of the cathode. . If it is not lit, it is fixed at the ground potential. Therefore, when a stripe pattern is displayed, the voltage between adjacent anodes may reach 20 V, which is higher than the voltage applied in the liquid crystal display device.

  In this way, when a high voltage is applied between the adjacent anode wirings, Al of the connection terminal 26 may be eroded. That is, an electrochemical corrosion phenomenon occurs in the connection terminal 26, and the exposed portion of Al may be oxidized. In particular, when the pitch of the anode wiring is narrowed for high definition, the electric field strength is further increased between the adjacent anode wirings. For this reason, electric corrosion of Al is more likely to occur. When Al is oxidized by electrolytic corrosion, there is a problem that the contact resistance is deteriorated.

The connection terminal 26 is disposed outside the space sealed with the sealing material. Therefore, especially when using an organic EL display device in a high temperature and high humidity environment, the electrolytic corrosion of Al gradually proceeds. The display characteristics of the organic EL display device deteriorate due to the deterioration of the contact resistance caused by the electrolytic corrosion. In addition, even after the connection terminal 26 is connected to the ACF and the connection portion is covered with a resin in order to prevent electric corrosion, the resin may contain moisture or the like, and thus electric corrosion occurs. .
JP 11-317292 A JP 2001-351778 A

  As described above, in the conventional organic EL display device, when a metal is used for the connection terminal, there is a problem that display characteristics deteriorate due to the electrolytic corrosion of the metal constituting the connection terminal.

  The present invention has been made in view of the above-described problems, and an object thereof is to provide an organic EL display device in which deterioration of display characteristics is reduced.

  The organic EL display device according to the first aspect of the present invention includes a plurality of first wirings (for example, anode wirings in the present embodiment) arranged on a first substrate (for example, the substrate 11 in the present embodiment). 1), a plurality of second wirings arranged to intersect the first wiring (for example, the cathode wiring 5 in the present embodiment), and the first wiring and the second wiring. A plurality of organic layers (for example, the organic thin film layer in the present embodiment) and the plurality of first wirings or the plurality of second wirings are provided, and the first wirings or the second wirings are externally provided. A connection terminal for supplying a signal (for example, the connection terminal 26 in the present embodiment), a protective film (for example, the edge cover resin 29 in the present embodiment) provided so as to cover the side surface of the connection terminal; The organic layer of the first substrate is A second substrate (for example, the counter substrate 51 in the present embodiment) provided to face the placed surface, the first substrate and the second substrate for sealing the organic layer, And a sealing material (for example, the sealing material 53 in the present embodiment) disposed inside the connection terminal and surrounding the organic layer, and the connection terminal is formed of a lower metal on the uppermost layer. Also has a laminated metal film on which a barrier layer having a high oxidation potential is formed. Thereby, deterioration of display characteristics can be reduced.

  In the organic EL display device according to the second aspect of the present invention, in the organic EL display device described above, the connection terminal has Al or an Al alloy, and the barrier layer has an oxidation potential higher than that of the Al or Al alloy. Is. Thereby, good contact resistance can be obtained, and deterioration of display characteristics can be reduced.

  The organic EL display device according to the third aspect of the present invention is the organic EL display device described above, wherein the barrier layer is made of Mo or Mo alloy. Thereby, good contact resistance can be obtained, and deterioration of display characteristics can be reduced.

  An organic EL display device according to a fourth aspect of the present invention is the above-described organic EL display device, wherein the first wiring is formed of ITO, and the lowermost layer of the connection terminal provided on the first wiring is Mo. Or it is formed with Mo alloy. Thereby, good contact resistance can be obtained, and deterioration of display characteristics can be reduced.

  An organic EL display device according to a fifth aspect of the present invention is the above-described organic EL display device, wherein an opening (for example, an opening in the present embodiment) is formed at a position where the first wiring and the second wiring intersect. And an insulating film (for example, the insulating film 22 in the present embodiment) provided between the first wiring and the second wiring, and the insulating film and the protective film are the same It is formed of the material. Thereby, deterioration of display characteristics can be reduced by a simple manufacturing process.

  An organic EL display device according to a sixth aspect of the present invention is the above-described organic EL display device, further comprising a partition wall (for example, the partition wall 10 in the present embodiment) for patterning the second wiring, The protective film is formed of the same material. Thereby, deterioration of display characteristics can be reduced by a simple manufacturing process.

  An organic EL display device according to a seventh aspect of the present invention is the organic EL display device described above, wherein the sealing material is formed inside the protective film. Thereby, the water | moisture content etc. which penetrate | invade into the space where the organic layer was sealed can be reduced.

  An organic EL display device according to an eighth aspect of the present invention is the above-described organic EL display device, wherein the auxiliary wiring provided on the first wiring and made of the same material as the connection terminal, and the auxiliary wiring A coating film (for example, the coating film 31 in the present embodiment) that covers (for example, the anode auxiliary wiring 30 in the present embodiment) with the same material as the protective film is further provided. Thereby, good contact resistance can be obtained, and deterioration of display characteristics can be reduced.

  An organic EL display device according to a ninth aspect of the present invention is the above-described organic EL display device, wherein the sealing material is disposed between the coating film and the protective film. Thereby, the water | moisture content etc. which penetrate | invade into the space where the organic layer was sealed can be reduced.

  The organic EL display device according to the tenth aspect of the present invention is the organic EL display device described above, wherein the oxidation potential of the barrier layer is 1 V or more higher than the oxidation potential of the lower metal.

  A method for manufacturing an organic EL display device according to an eleventh aspect of the present invention includes a plurality of first wirings arranged on a first substrate and a plurality of second wirings arranged to intersect the first wiring. And a method of manufacturing an organic EL display device comprising an organic layer provided between the first wiring and the second wiring, wherein a conductive material is formed on the first substrate (for example, Step S101 in the embodiment of the present invention, and patterning the conductive material to form a plurality of auxiliary wirings or the plurality of first wirings connected corresponding to the plurality of second wirings (For example, S102 in the embodiment of the present invention) and a step of forming a laminated metal film on the first wiring or the auxiliary wiring, the uppermost layer serving as a barrier layer having a higher oxidation potential than the lower metal (for example, Embodiments of the present invention Step S103) and patterning the laminated metal film to form a plurality of connection terminals for supplying signals from the outside in association with the plurality of first wirings or the plurality of auxiliary wirings (for example, book S104 in the embodiment of the invention, a step of providing a protective film covering the side surface of the connection terminal (for example, step S106 in the embodiment of the present invention), and a step of forming an organic layer on the first wiring ( For example, step S108) in the embodiment of the present invention, the step of forming the second wiring on the organic layer formed on the first wiring (for example, step S109 in the embodiment of the present invention), A step of disposing a second substrate on a surface of the first substrate on which the organic layer is formed, and a step between the first substrate and the second substrate. It was a sealing material, in which and a step of bonding the first substrate and the second substrate via the sealing material disposed inside of the connection terminal. Thereby, good contact resistance can be obtained, and deterioration of display characteristics can be reduced.

  A manufacturing method of an organic EL display device according to a twelfth aspect of the present invention includes a plurality of first wirings arranged on a first substrate and a plurality of second wirings arranged to intersect the first wiring. And a method of manufacturing an organic EL display device comprising an organic layer provided between the first wiring and the second wiring, the step of forming a conductive material on the first substrate; Forming a laminated metal film whose uppermost layer is a barrier layer having an oxidation potential higher than that of the lower metal on the conductive material; and patterning the laminated metal film to send an external signal to the plurality of second layers. Forming a plurality of connection terminals to be supplied in association with one wiring or the plurality of second wirings, and patterning the conductive material to connect the plurality of connection terminals to the plurality of second wirings A plurality of auxiliary wirings or the plurality of first wirings Forming a protective film covering a side surface of the connection terminal, forming the organic layer on the first wiring, and forming the organic layer on the organic wiring on the first wiring. A step of forming a second wiring; a step of disposing a second substrate opposite to the surface of the first substrate on which the organic layer is formed; and providing between the first substrate and the second substrate. And a step of bonding the first substrate and the second substrate through a sealing material disposed inside the connection terminal. Thereby, deterioration of display characteristics can be reduced.

  According to a thirteenth aspect of the present invention, there is provided a method for manufacturing an organic EL display device, wherein the first wiring and the second wiring intersect each other in the step of forming the protective film in the method for manufacturing the organic EL display device described above. An insulating film having an opening is formed between the first wiring and the second wiring. Thereby, the organic EL display device in which the deterioration of display characteristics is reduced can be manufactured by a simple manufacturing process.

  In the method of manufacturing the organic EL display device according to the fourteenth aspect of the present invention, a partition for patterning the second wiring is formed in the step of forming the protective film of the method for manufacturing the organic EL display device described above. is there. Thereby, the organic EL display device in which the deterioration of display characteristics is reduced can be manufactured by a simple manufacturing process.

  In the organic EL display device manufacturing method according to the fifteenth aspect of the present invention, a partition for patterning the second wiring is formed in the step of forming the protective film of the organic EL display device manufacturing method. It is. Thereby, the organic EL display device in which the deterioration of display characteristics is reduced can be manufactured by a simple manufacturing process.

  An organic EL display device manufacturing method according to a tenth aspect of the present invention is the above-described organic EL display device manufacturing method, wherein the oxidation potential of the barrier layer is 1 V or more higher than the oxidation potential of the lower metal. .

  According to the present invention, an organic EL display device with reduced contact resistance and reduced display characteristics can be provided.

Hereinafter, embodiments to which the present invention can be applied will be described. The following description explains the embodiment of the present invention, and the present invention is not limited to the following embodiment. For clarity of explanation, the following description is omitted and simplified as appropriate. Further, those skilled in the art will be able to easily change, add, and convert each element of the following embodiments within the scope of the present invention. In addition, what attached | subjected the same code | symbol in each figure has shown the same element, and abbreviate | omits description suitably.
Embodiment 1 of the Invention

  An element substrate on which an organic EL light emitting element of the organic EL display device according to the present embodiment is formed will be described with reference to FIG. FIG. 1 is a plan view showing a configuration of an element substrate 100 of an organic EL display device. Reference numeral 1 denotes an anode wiring, 5 denotes a cathode wiring, 10 denotes a partition, 11 denotes a substrate, 21 denotes a cathode auxiliary wiring, 22 denotes an insulating film, 23 denotes an opening, 25 denotes a contact hole, and 35 denotes a terminal portion.

  A plurality of anode wirings 1 are formed on the substrate 11 so as to be in contact with the surface of the substrate 11. The plurality of anode wirings 1 are arranged in parallel. A plurality of terminal portions 35 associated with each anode wiring 1 are arranged at the end of the anode wiring 1. A cathode wiring 5 is disposed so as to intersect the anode wiring 1, and a cathode auxiliary wiring 21 is formed at the end of the cathode wiring 5. The cathode auxiliary wiring 21 is formed corresponding to the number of the cathode wirings 5. The terminal portion 35 is provided with a connection terminal and is connected to an external wiring and a drive circuit.

  The anode wiring 1 is formed of a transparent conductive film such as ITO. The terminal portion 35 includes a connection terminal (not shown in FIG. 1) formed of a metal film having a multilayer structure. For example, a laminated metal film serving as a connection terminal is formed in the order of Mo layer, Al layer, and Mo layer from the bottom. In addition, the cathode auxiliary wiring 21 may be formed of a metal film having a multilayer structure similarly to the connection terminal. Alternatively, the cathode auxiliary wiring 21 may be formed by the same process as the anode wiring 1. Furthermore, the cathode auxiliary wiring 21 may be formed by laminating a transparent conductive film and a laminated metal film. An insulating film 22 is formed on the substrate on which these wirings are formed. The film thickness of the insulating film 22 is 0.7 μm, for example. In the insulating film 22, an opening 23 is provided at a position where the anode wiring 1 and the cathode wiring 5 intersect (that is, a position serving as a display pixel).

  A contact hole 25 is formed in the insulating film 22 to connect the cathode auxiliary wiring 21 and the cathode wiring 5 to the outside of the display area. In the contact hole 25, the cathode wiring 5 and the cathode auxiliary wiring 21 are connected. A terminal portion (not shown) is provided at the end of the cathode auxiliary wiring 21 and is connected to an external wiring and a drive circuit. Thereby, an electric current can be sent through the organic thin film layer sandwiched between the anode wiring 1 and the cathode wiring 5 in the opening 23, and the organic thin film layer emits light. The area where the opening 23 is provided becomes a display area, and a desired image can be displayed.

  A plurality of organic thin film layers (organic compound layers) and the cathode wiring 5 are sequentially stacked on the insulating film 22. Accordingly, the organic thin film layer is sandwiched between the cathode wiring 5 and the anode wiring 1. However, illustration of the organic thin film layer is omitted in FIG. In addition, before the organic thin film layer is formed, a separation structure (hereinafter referred to as a partition wall 10) that separates adjacent cathode wirings is provided. The barrier rib 10 is formed in a desired pattern before the cathode wiring 5 is formed by vapor deposition or the like. For example, as shown in FIG. 1, a plurality of partition walls 10 orthogonal to the anode wiring 1 are formed on the anode wiring 1 in order to form a plurality of cathode wirings 5 orthogonal to the anode wiring 1.

  The partition wall 10 preferably has an inverted taper structure. That is, it is preferable that the cross-section is formed so as to be separated from the substrate 11. Thereby, the side wall and the rising portion of the partition wall 10 are the shadow of the vapor deposition, and the cathode wiring 5 can be separately disposed. The partition wall 10 can be formed with a height of 3.4 μm and a width of 10 μm, for example.

  After the partition wall 10 is formed, an organic thin film layer is formed by a vapor deposition method or a coating method. Further, a metal is deposited on the organic thin film layer. The deposited metal film is divided by a partition wall 10 having a reverse taper structure to form a plurality of cathode wirings 5. The cathode wiring 5 is patterned along the partition wall 10, and the cathode wiring 5 is arranged in parallel with the partition wall 10. The metal film to be the cathode wiring 5 is deposited using a mask so as not to be formed outside the partition wall 10. The organic EL element substrate has the above-described configuration.

  The terminal portion 35 is provided with a connection terminal that is connected to an external wiring. For example, an anisotropic conductive film (ACF) is attached to the terminal portion 35 provided on the substrate end side of the anode wiring 1 and a TCP (Tape Carrier Package) provided with a drive circuit is connected. Thereby, a driving voltage can be supplied to each anode wiring 1. Further, a part of the auxiliary cathode wiring 21 becomes a terminal portion connected to the external wiring, and is connected to the TCP via the ACF.

  A counter substrate for sealing the organic thin film layer is bonded to the element substrate 100. Specifically, a sealing material is applied to the counter substrate having a water capturing material. The sealing material is applied to the counter substrate by a dispenser so that the sealing material is arranged in the seal pattern 50 on the element substrate side. By stacking the element substrate 100 and the counter substrate so as to face each other, the organic thin film layer is stabbed and the organic EL display device is completed. Since the terminal portion 35 is provided outside the seal pattern 50, the terminal portion 35 is disposed outside the space sealed with the sealing material.

  Next, the configuration around the terminal portion 35 will be described with reference to FIGS. FIG. 2 is an enlarged top view showing the configuration around the terminal portion 35. FIG. 3 is a cross-sectional view showing the configuration around the terminal portion 35. 26 is a connection terminal, 29 is an edge cover resin, 51 is a counter substrate, 52 is a water catching material, 53 is a sealing material, 61 is an ACF, 62 is an FPC (Flexible Printed Circuit), and 63 is a conductive layer provided on the FPC 62. is there.

  In FIG. 2, the lower side is a display area. In FIG. 3, the right side is a display area. A connection terminal 26 is formed at the end of the anode wiring 1. The connection terminal 26 is formed on the anode wiring 1 with substantially the same width as the anode wiring 1 or slightly narrower. That is, the connection terminal 26 is formed in an island shape on the anode wiring 1. For example, the connection terminal 26 is formed of a laminated metal film including three layers of an Mo layer, an Al layer, and an Mo layer. The connection terminal 26 is formed corresponding to each anode wiring 1. Therefore, since the connection terminals 26 are arranged in parallel like the anode wiring 1, the distance between the terminals is shortened.

  An edge cover resin 29 is formed so as to cover the outer periphery of the connection terminal 26. The edge cover resin 29 is formed by the same process as the insulating film 22. The edge cover resin 29 partially protrudes from the anode wiring 1 and is directly disposed on the substrate 11. That is, the edge cover resin 29 is formed wider than the anode wiring 1. As shown in FIG. 2, the edge cover resin 29 corresponding to the adjacent anode wirings 1 is formed separately. For this reason, a gap is generated in the edge cover resin 29 corresponding to each wiring between the anode wirings. As a result, the ACF 51 comes into contact with the exposed portion of the substrate, and the adhesion with the ACF 61 can be improved.

  As shown in FIG. 3, the connection terminal 26 is formed directly on the anode wiring 1 provided on the substrate 11. Therefore, the connection terminal 26 and the anode wiring 1 are electrically connected. An edge cover resin 29 is formed so as to cover the entire side surface of the connection terminal 26. The edge cover resin 29 is partially removed so that the upper surface of the connection terminal 26 is exposed. The edge cover resin 29 is removed, and the ACF 61 is provided in the portion where the connection terminal 26 is exposed.

  A TCP FPC 62 mounted with a drive circuit (not shown) is attached on the ACF 61. Therefore, the conductive layer 63 provided on the lower side of the FPC 62 and the connection terminal 26 are connected via the ACF 61. Thereby, a signal from the drive circuit can be supplied to the anode wiring 1 through the connection terminal 26. The connection terminal 26 is provided on each of the plurality of anode wirings 1 and can supply a signal corresponding to each anode wiring 1.

  With the above-described configuration, the upper surface of the Al layer disposed in the middle of the connection terminal 26 is covered with the Mo layer, which is a barrier layer having a higher oxidation potential than the Al layer and hardly oxidizes, and the side surface is covered with the edge cover resin 29. The lower surface of the Al layer is covered with a lower Mo layer. Thereby, the entire Al layer of the connection terminal 26 can be covered, and the portion where the Al layer is exposed is eliminated. Even when a DC voltage is applied between the adjacent anode wirings 1, corrosion of the Al layer can be prevented. Therefore, it is possible to prevent the contact resistance from being deteriorated due to the corrosion of the Al layer, and to prevent the display characteristics from being deteriorated. Note that the oxidation potential of the barrier layer is desirably 1 V or more higher than the oxidation potential of the underlying metal.

  Furthermore, the contact resistance with ACF61 can be reduced by making Mo the uppermost layer of a laminated metal film. Moreover, it becomes the structure which Mo layer and the anode wiring 1 contact by making the lowest layer of a laminated metal film into Mo. Thereby, contact resistance with the anode wiring 1 made of ITO can be reduced, and wiring resistance can be reduced.

  As shown in FIG. 3, the connection terminal 26 and the edge cover resin 29 are disposed outside the sealing material 53. A part of the counter substrate 51 is thinned by etching. This thinned portion becomes the water catching material storage portion. A water catching material 52 is placed in the water catching material storage unit. The counter substrate 51 provided with the water catching material 52 is attached to the substrate 11 through a sealing material 53. The sealing material 53 is provided directly on the anode wiring 1 so as to cross the anode wiring 1. Thereby, it is possible to prevent moisture and the like from entering the sealed space.

  Next, the manufacturing method of the organic EL display concerning a present Example is demonstrated using FIG. FIG. 4 is a flowchart showing an example of a method for manufacturing an organic EL display according to this example.

  First, an ITO film to be the anode wiring 1 is formed on the substrate 11 (step S101). As the substrate 11, for example, a transparent substrate such as a glass substrate is used. As the glass substrate, for example, soda lime glass can be used. The thickness of the ITO film is usually 50 to 200 nm. More preferably, it is 100-150 nm. Typically, it is an ITO film having a thickness of 150 nm manufactured by a DC sputtering method. In addition to the above, the ITO film can be generally produced by physical vapor deposition (PVD) such as vacuum deposition or ion plating. In this description, an ITO film is used. Of course, other than ITO, a conductive film made of a transparent metal oxide such as IZO may be used.

  ITO can be formed on the entire surface of the glass substrate with good uniformity by sputtering or vapor deposition. The ITO film is patterned by photolithography and etching to form the anode wiring 1 (step S102). A phenol novolac resin is used as the resist, and exposure development is performed. Etching may be either wet etching or dry etching. For example, ITO can be patterned using a mixed aqueous solution of hydrochloric acid and nitric acid. As the resist stripping material, for example, monoethanolamine can be used.

  Next, a laminated metal film of Mo layer, Al layer, and Mo layer is formed by DC sputtering (step S103). These can be continuously formed. In addition, the laminated metal film may be produced by a physical vapor deposition method (PVD) such as a vacuum deposition method or an ion plating method, or a plating method such as electrolytic plating or electroless plating.

  The thicknesses of the upper and lower Mo layers are usually 50 to 200 nm, and the thickness of the Al layer is usually 200 to 400 nm. When Mo alloy is used instead of Mo, corrosion resistance is improved. As the Mo alloy, it is preferable to use binary Mo-W, Mo-Nb, Mo-V, Mo-Ta, or the like.

  An Al alloy can be used instead of Al. When pure Al is applied as a layer made of either Al or Al alloy, it is preferable to set the film forming temperature to 100 ° C. or lower in order to suppress generation of hillocks. When using an Al alloy, it is preferable to use Al—Nd because the resistance can be reduced during curing. Furthermore, Al—Si, ternary Al—Si—Cu, and the like are also applicable. Here, a combination of three layers of Mo, Al, and Mo is used.

  Thereafter, the laminated metal film is patterned (step S104). For example, the resist is patterned by a photolithography process, the laminated metal film is etched, and the resist is peeled off. Any known resist may be used as long as it does not contradict the spirit of the present invention.

  For the etching, for example, an etching solution made of a mixed aqueous solution of phosphoric acid, acetic acid and nitric acid can be used. Any known stripping agent may be used for stripping the resist as long as it does not violate the gist of the present invention.

  The Mo layer and the Al layer can be collectively etched with this etching solution. Thereby, the connection terminal 26 is formed. In this step, the cathode auxiliary wiring 21 is patterned. The cathode auxiliary wiring 21 can be formed not only in this step but also in the ITO patterning step (S102). In this case, the cathode auxiliary wiring 21 made of ITO is formed. Furthermore, the cathode auxiliary wiring 21 can be formed by both this step (step S104) and the ITO patterning step (S102). In this case, the cathode auxiliary wiring 21 has a multilayer structure of ITO and a laminated metal film.

  Instead of the ITO film forming step (S101) to the laminated metal film patterning step (step S104), an ITO film and a laminated metal film are sequentially formed by sputtering, and then the laminated metal film and It is also possible to pattern the ITO film in this order. That is, the anode wiring 1 in the order of the ITO film forming step (step S101), the laminated metal film forming step (step S103), the laminated metal film patterning step (step S104), and the ITO patterning step (step S102). It is also possible to form the connection terminal 26. Note that a silica coat film may be formed on the entire surface of the substrate before the ITO film forming step (step S101).

  Next, the insulating film 22 is formed on the surface of the substrate 11 provided with the anode wiring 1, the connection terminal 26, and the cathode auxiliary wiring 21 (step S105). For example, a photosensitive polyimide solution is applied by spin coating. The thickness of the insulating film 22 may be set to 0.7 μm, for example. The insulating film 22 is patterned (step S106). For example, the insulating film layer is patterned by a photolithography process and a developing process, and then cured, and the insulating film at a position to be a display pixel is removed to provide an opening 23. The intersection between the cathode wiring 5 and the anode wiring 1 formed in step S109, which will be described later, is a position where a display pixel is formed.

  In this step, a pattern of the edge cover resin 29 that covers the entire side surface of the connection terminal 26 is formed on the outer periphery of the connection terminal 26. Since the edge cover resin 29 is formed by the patterning process of the insulating film 22, the edge cover resin 29 is made of the same material as the insulating film 22. Thereby, a manufacturing process can be simplified and productivity can be improved.

  Then, patterning is performed so that the surface of the connection terminal 26 is exposed. In the Al layer that is an intermediate layer of the connection terminal 26, the upper surface is covered with the Mo layer that is the barrier layer, and the side surface is covered with the edge cover resin 29. The lower layer is covered with a Mo layer. Thereby, the entire Al layer of the connection terminal 26 can be covered. Even when a high voltage is constantly applied between adjacent anode wirings, Al oxidation due to electrolytic corrosion can be prevented. Therefore, it is possible to prevent display characteristics from being deteriorated due to reduction in contact resistance. By providing this configuration, the pitch between the wirings is narrow, so that the distance between the connection terminals is shortened, and even when the connection terminals 26 are arranged close to each other, Al electrolytic corrosion of the connection terminals 26 can be prevented.

  At the same time, a contact hole 25 for connecting the cathode wiring 5 and the cathode auxiliary wiring 21 is formed. For example, the opening 23 corresponding to the pixel is formed with a size of about 300 μm × 300 μm. The contact hole 25 between the cathode wiring 5 and the cathode auxiliary wiring 21 is formed with, for example, 200 μm × 200 μm or less. In the case where the pixel opening is about 300 μm × 300 μm, it is preferable that the contact forming portion between the cathode and the auxiliary wiring is 200 μm × 200 μm or less because it does not affect the size of the entire device.

  Subsequently, the partition 10 is formed on the surface of the insulating film (polyimide layer) so that the 64 cathode wirings 5 can be separated and arranged (step S107). In FIG. 1, the number of wires is reduced and shown. The partition 10 is formed by applying a photosensitive resin such as a novolac resin or an acrylic resin film on the upper layer of the insulating film. For example, a photosensitive resin is spin-coated, patterned by a photolithography process, and then photoreacted to form cathode barrier ribs. It is desirable to use a negative type photosensitive resin so that the cathode partition has an inversely tapered structure.

  When a negative photosensitive resin is used, when light is irradiated from above, the photoreaction becomes insufficient at deeper locations. As a result, when viewed from above, the cross-sectional area of the cured portion has a structure that is narrower on the lower side than on the upper side. This means that it has an inverted taper structure. With such a structure, the cathodes can be separated from each other because the portions that are shaded when viewed from the vapor deposition source during vapor deposition of the cathodes do not reach the vapor deposition.

  Note that the edge cover resin 29 is formed in the patterning step of the insulating film 22 (step S106), but may be formed in the step of forming the partition wall 10 (step S107). That is, patterning is performed so as to cover the outer periphery of the connection terminal 26 with a novolac resin or the like which is a material of the partition wall 10. Therefore, the edge cover resin 29 is formed of the same material as the partition wall 10. Thereby, a manufacturing process can be simplified and productivity can be improved. In this case, the edge cover resin 29 has a reverse taper structure.

  Further, in order to modify the surface of the ITO layer in the opening 23, oxygen plasma or ultraviolet light may be irradiated. For example, using a parallel plate RF plasma (high frequency plasma) apparatus, oxygen plasma irradiation is performed to modify the surface of the ITO film.

  Thereafter, an organic thin film layer is stacked (step S108). First, a metal mask having an opening is attached to a glass substrate. At this time, the metal mask opening and the organic thin film layer are disposed so as to overlap each other, and are attached so that a space of 50 μm is left between the metal mask and the glass substrate. Then, an ethyl benzoate solution in which 0.5% (percentage by mass) of polyvinyl carbazole is dissolved is applied by a mask spray method. Then, the solution is concentrated and dried to form a hole injection layer. It is also possible to form a hole injection layer by a vapor deposition method.

  Subsequently, α-NPD (N, N′-di (naphthalen-1-yl) -N, N′-diphenyl-benzidine) is deposited on the upper layer of the hole injection layer to form a hole transport layer having a thickness of 40 nm. Form. Further, Alq (tris (8-hydroxynato) aluminum) serving as the host compound of the light emitting layer and coumarin 6 serving as the fluorescent dye of the guest compound are simultaneously vapor deposited on the upper layer to form a light emitting layer having a thickness of 60 nm. Form. Subsequently, LiF is deposited on the light emitting layer to form a cathode interface layer having a thickness of 0.5 nm.

  Thereafter, a metal material such as aluminum is vapor-deposited to form a cathode wiring 5 having a thickness of 100 nm (step S109). As a result, the aluminum film is patterned by the partition walls 10 and separated and arranged on the respective cathode wirings 5. A cathode wiring 5 intersecting with the anode wiring 1 can be formed between the respective partition walls. For example, 64 cathode wirings 5 are formed corresponding to the number of pixels. An organic EL element substrate is formed by these steps.

  Next, in order to seal the organic EL light emitting element of the organic EL element substrate 100 formed by the above-described steps, a step of manufacturing a sealing counter substrate will be described. First. A glass substrate different from the element substrate is prepared. The glass substrate is processed to form a water catching material storage for storing the water catching material. The water catching material storage part applies a resist to the glass substrate and exposes a part of the substrate by exposure and development. The exposed part is formed by etching to form a water catching material storage part.

  After a water catching material such as calcium oxide is disposed in the water catching material storage portion, the two substrates are stacked and bonded. Specifically, a sealing material is applied to the surface of the counter substrate on which the water catching material storage unit is provided using a dispenser. For example, an epoxy-based ultraviolet curable resin can be used as the sealing material. The sealing material is applied to the entire outer periphery of the region facing the organic EL element. After the two substrates are aligned and face each other, the sealing material is cured by irradiating ultraviolet rays, and the substrates are bonded to each other. Thereafter, heat treatment is performed in a clean oven at 80 ° C. for 1 hour in order to further accelerate the curing of the sealing material. As a result, the sealing material 53 and the pair of substrates separate the substrate where the organic EL element exists from the outside of the substrate. By disposing the water catching material, it is possible to prevent the organic EL element from being deteriorated due to moisture remaining or entering the sealed space.

  The sealing material 53 is provided directly on the anode wiring 1 as shown in FIG. The position of the sealing material 53 is the position of the sealing pattern 50 in FIG. Therefore, the sealing material 53 is disposed on the inner side (display area side) of the connection terminal 26. Thereby, it is possible to prevent moisture and the like from entering the space sealed by the sealing material 53.

  Unnecessary portions near the outer periphery of the substrate are cut and removed, a signal electrode driver is connected to the anode auxiliary wiring 26, and a scanning electrode driver is similarly connected to the terminal portion of the cathode auxiliary wiring 21. The cathode auxiliary wiring 21 is formed with a terminal portion at the substrate end in the same manner as the anode wiring. An anisotropic conductive film (ACF) is attached to this terminal portion, and a TCP (Tape Carrier Package) provided with a drive circuit is connected. Since the ACF 61 is in contact with the connection terminal 26 whose uppermost layer is an Mo layer, the contact resistance can be reduced.

  Specifically, ACF is temporarily crimped to the terminal portion. ACF uses Hitachi Chemical Anisolm 7106U. The temporary pressure bonding temperature is 80 ° C., the pressure bonding pressure is 1.0 MPa, and the pressure bonding time is 5 seconds. Next, the TCP with the built-in drive circuit is finally bonded to the terminal portion. The main pressure bonding temperature is 170 degrees, the pressure bonding pressure is 2.0 MPa, and the pressure bonding time is 20 seconds. Thereby, a drive circuit is mounted. This organic EL display panel is attached to the housing, and the organic EL display device is completed.

  In the above description, the outer periphery of the Al layer of the laminated metal film constituting the connection terminal 26 is covered with the edge cover resin 29, but the outer periphery may be covered with a protective film other than this. For example, if the photolithography process is increased, it is possible to cover the Al layer with the uppermost Mo layer constituting the laminated metal film. Specifically, after forming and patterning a Mo layer and an Al layer, the uppermost Mo layer is patterned so as to cover the Mo layer and the Al layer. As a result, the Al layer disposed in the middle of the connection terminal 26 has a configuration in which the upper surface and side surfaces are covered with the Mo layer which is a barrier layer. By providing such a configuration, the oxidation of Al based on the electrolytic corrosion of the Al layer can be prevented, and the deterioration of the light emission characteristics can be prevented.

  The above-described configuration can also be applied to the cathode auxiliary wiring 21 connected to the cathode wiring 5. For example, in the process described above, the cathode auxiliary wiring 21 is formed with the transparent conductive film constituting the anode wiring 1, and the connection terminal made of the laminated metal film is formed thereon. Further, an edge cover resin that covers the side surfaces of the connection terminals is formed in the partition wall formation step (step S107) or the insulating film formation step (step S106). Thereby, the cathode auxiliary wiring 21 connected to the cathode wiring 5 can also have the same configuration as that shown in FIGS. 2 and 3, and the same effect can be obtained.

Embodiment 2 of the Invention
The configuration of the organic EL display device according to this embodiment will be described with reference to FIGS. FIG. 5 is a top view showing the configuration around the terminal portion of the organic EL element substrate of the organic EL display device according to the present embodiment. 6 is a cross-sectional view taken along the line AA in FIG. The description of the same structure as that described in Embodiment 1 is omitted.

  The organic EL display device according to the present embodiment further includes an anode auxiliary wiring 30 connected to the anode wiring 1. As shown in FIG. 6, the anode auxiliary wiring 30 is provided directly on the anode wiring 1. The anode auxiliary wiring 30 is formed separately from the connection terminal 26 on the display area side of the connection terminal 26. Since the anode auxiliary wiring 30 is formed by the same process as the connection terminal 26, it is formed by the same material as the connection terminal 26. Thereby, a manufacturing process can be simplified and productivity can be improved. The anode auxiliary wiring 30 is composed of, for example, a laminated metal film of a Mo layer, an Al layer, and a Mo layer. The anode auxiliary wiring 30 is disposed in a space sealed with a sealing material 53.

  As shown in FIG. 5, a coating film 31 is formed on the anode auxiliary wiring 30 so as to cover the whole anode auxiliary wiring 30. Since the coating film 31 is formed in the same process as the edge cover resin 29, the edge cover resin 29 and the coating film 31 can be formed of the same material. The covering film 31 can prevent oxidation of the anode auxiliary wiring 30 made of the laminated metal film, and can reduce resistance deterioration.

  Since the anode auxiliary wiring 30 is directly formed on the anode wiring 1, the anode wiring 1 and the anode auxiliary wiring 30 are electrically connected. The laminated metal film constituting the anode auxiliary wiring 30 usually has a specific resistance lower than that of the ITO constituting the anode wiring 1. Therefore, by providing the anode auxiliary wiring 30, the wiring resistance of the anode wiring can be reduced.

  In the present embodiment, as shown in FIG. 5, a seal pattern 50 can be disposed between the edge cover resin 29 and the coating film 31. For example, when a resin constituting the insulating film 22 or the partition wall 10 is disposed under the sealing material 53, moisture or the like enters from the resin. By arranging the seal pattern 50 between the edge cover resin 29 that covers the connection terminal 26 and the coating film 31 that covers the anode auxiliary wiring 30 as in the above-described configuration, the seal material 53 is directly formed as shown in FIG. Arranged on the anode wiring. Thereby, it becomes possible to prevent intrusion of moisture and the like, and it is possible to reduce deterioration of display characteristics.

  The above-described configuration can also be applied to the cathode auxiliary wiring 21 connected to the cathode wiring 5. For example, in the process described above, the cathode auxiliary wiring 21 is formed with the transparent conductive film constituting the anode wiring 1, and the connection terminal 26 made of a laminated metal film and the auxiliary wiring on the cathode auxiliary wiring 21 are formed thereon. . Further, an edge cover resin 29 and a coating film 31 that cover the side surfaces of the connection terminals are formed in a partition wall formation step (step S107) or an insulating film formation step (step S106). The cathode auxiliary wiring 21 connected to the cathode wiring 5 can also have the same configuration as that shown in FIGS. Thereby, the same effect can be acquired.

Embodiment 3 of the Invention
The configuration of the organic EL display device according to this embodiment will be described with reference to FIG. FIG. 7 is a cross-sectional view of the organic EL element substrate of the organic EL display device according to the present embodiment. The description of the same configuration as that described in Embodiments 1 and 2 is omitted.

  In the present embodiment, the connection terminal 26 provided on the anode wiring 1 extends to the outside of the end portion of the anode wiring 1. That is, the connection terminal 26 is formed so as to cross the end of the anode wiring 1. The connection terminal 26 is arranged so as to run on the anode wiring 1 from above the substrate 11.

  An edge cover resin 29 is formed on the outer periphery of the connection terminal 26 so as to cover the side surface. Therefore, the edge cover resin 29 is also formed so as to cross the end portion of the anode wiring 1. The edge cover resin 29 is disposed so as to run on the anode wiring 1 from above the substrate 11. Even with such a configuration, the wiring resistance can be reduced as in the first embodiment. Further, the Al layer in the laminated metal film forming the connection terminal 26 is covered with the Mo layer and the edge cover resin 29. Thereby, the oxidation of Al resulting from electrolytic corrosion can be prevented, and the deterioration of the light emission characteristics can be reduced.

It is a top view which shows the structure of the organic electroluminescence display concerning Embodiment 1 of this invention. 1 is a top view showing a configuration around a connection terminal in an organic EL display device according to a first exemplary embodiment of the present invention. In the organic EL display device according to the first exemplary embodiment of the present invention, it is a cross-sectional view illustrating a configuration around a connection terminal. It is a flowchart which shows the manufacturing process of the organic electroluminescence display concerning this invention. FIG. 6 is a top view showing a configuration around a connection terminal in an organic EL display device according to a second exemplary embodiment of the present invention. In the organic EL display device according to the second exemplary embodiment of the present invention, FIG. In the organic EL display device according to the third exemplary embodiment of the present invention, it is a cross-sectional view showing the configuration around the positive connection terminal. It is a top view which shows the structure of the conventional organic electroluminescence display.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Anode wiring 5 Cathode wiring 10 Partition 11 Board | substrate 21 Cathode auxiliary wiring 22 Insulating film 23 Opening part 25 Contact hole 26 Connection terminal 29 Edge cover resin 30 Anode auxiliary wiring 31 Cover resin 35 Terminal part 51 Opposite substrate 52 Water catching material 53 Sealing material 61 ACF
62 FPC
63 FPC conductive layer 100 Organic EL element substrate

Claims (15)

A plurality of first wirings arranged on the first substrate;
A plurality of second wirings arranged to intersect the first wiring;
An organic layer disposed between the first wiring and the second wiring;
A plurality of connection terminals provided corresponding to the plurality of first wirings or the plurality of second wirings, and supplying a signal from the outside to the first wiring or the second wiring;
A protective film provided to cover the side surface of the connection terminal;
A second substrate provided facing the surface of the first substrate on which the organic layer is disposed;
A sealing material provided to surround the organic layer between the first substrate and the second substrate for sealing the organic layer, and disposed inside the connection terminal;
The organic EL display device, wherein the connection terminal includes a laminated metal film in which a barrier layer having an oxidation potential higher than that of the lower metal is formed on the uppermost layer. The connection terminal has Al or Al alloy,
The organic EL display device according to claim 1, wherein the barrier layer has an oxidation potential higher than that of the Al or Al alloy.   The organic EL display device according to claim 1, wherein the barrier layer is formed of Mo or an Mo alloy. The first wiring is formed of ITO;
The organic EL display device according to claim 1, wherein a lowermost layer of the connection terminal provided on the first wiring is formed of Mo or Mo alloy. An opening formed at a position where the first wiring and the second wiring intersect, and further comprising an insulating film provided between the first wiring and the second wiring;
The organic EL display device according to claim 1, wherein the insulating film and the protective film are formed of the same material. A partition for patterning the second wiring;
The organic EL display device according to claim 1, wherein the partition and the protective film are formed of the same material.   The organic EL display device according to claim 1, wherein the sealing material is formed inside the protective film. An auxiliary wiring disposed on the first wiring or the second wiring and formed of the same material as the connection terminal;
The organic EL display device according to claim 1, further comprising a coating film that covers the auxiliary wiring with the same material as the protective film.   The organic EL display device according to claim 8, wherein the sealing material is disposed between the coating film and the protective film.   The display device according to claim 1, wherein an oxidation potential of the barrier layer is 1 V or more higher than an oxidation potential of the lower metal. A plurality of first wirings arranged on the first substrate;
A plurality of second wirings arranged to intersect the first wiring;
A method for manufacturing an organic EL display device comprising an organic layer provided between the first wiring and the second wiring,
Depositing a conductive material on the first substrate;
Patterning the conductive material to form a plurality of auxiliary wirings or the plurality of first wirings connected corresponding to the plurality of second wirings;
Depositing a laminated metal film on the first wiring or the auxiliary wiring, the uppermost layer being a barrier layer having a higher oxidation potential than the lower metal;
Patterning the laminated metal film to form a plurality of connection terminals for supplying signals from the outside in association with the plurality of first wirings or the plurality of auxiliary wirings;
Providing a protective film covering a side surface of the connection terminal;
Forming the organic layer on the first wiring;
Forming a second wiring on the organic layer formed on the first wiring;
Disposing a second substrate opposite to the surface of the first substrate on which the organic layer is formed;
A sealing material provided between the first substrate and the second substrate, wherein the first substrate and the second substrate are attached via a sealing material disposed inside the connection terminal. A method for manufacturing the organic EL display device. A plurality of first wirings arranged on the first substrate;
A plurality of second wirings arranged to intersect the first wiring;
A method for manufacturing an organic EL display device comprising an organic layer provided between the first wiring and the second wiring,
Depositing a conductive material on the first substrate;
Forming a laminated metal film on the conductive material, the uppermost layer being a barrier layer having a higher oxidation potential than the lower metal;
Patterning the laminated metal film to form a plurality of connection terminals for supplying signals from the outside in association with the plurality of first wirings or the plurality of second wirings;
Patterning the conductive material to form a plurality of auxiliary wirings or the plurality of first wirings for connecting the plurality of connection terminals and the plurality of second wirings;
Providing a protective film covering a side surface of the connection terminal;
Forming the organic layer on the first wiring;
Forming the second wiring on the organic layer formed on the first wiring;
Disposing a second substrate opposite to the surface of the first substrate on which the organic layer is formed;
A sealing material provided between the first substrate and the second substrate, wherein the first substrate and the second substrate are attached via a sealing material disposed inside the connection terminal. A method for manufacturing the organic EL display device. In the step of forming the protective film,
The organic EL display device according to claim 11 or 12, wherein an insulating film having an opening at a position intersecting the first wiring and the second wiring is formed between the first wiring and the second wiring. Production method. In the step of forming the protective film,
The method for manufacturing an organic EL display device according to claim 11, wherein a partition wall for patterning the second wiring is formed. The method for manufacturing a display device according to claim 11, wherein an oxidation potential of the barrier layer is higher by 1 V or more than an oxidation potential of the lower metal.

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