CN113782693B - Packaging structure, display panel and preparation method of display panel - Google Patents
Packaging structure, display panel and preparation method of display panel Download PDFInfo
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- CN113782693B CN113782693B CN202111057860.5A CN202111057860A CN113782693B CN 113782693 B CN113782693 B CN 113782693B CN 202111057860 A CN202111057860 A CN 202111057860A CN 113782693 B CN113782693 B CN 113782693B
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 25
- 238000002360 preparation method Methods 0.000 title abstract description 12
- 238000000034 method Methods 0.000 claims description 14
- 239000000758 substrate Substances 0.000 claims description 14
- 238000004519 manufacturing process Methods 0.000 claims description 3
- 230000005540 biological transmission Effects 0.000 abstract description 17
- 239000012528 membrane Substances 0.000 abstract description 8
- 239000010410 layer Substances 0.000 description 119
- 239000010408 film Substances 0.000 description 118
- 230000000903 blocking effect Effects 0.000 description 13
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 8
- 229910052760 oxygen Inorganic materials 0.000 description 8
- 239000001301 oxygen Substances 0.000 description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 8
- 230000000694 effects Effects 0.000 description 5
- 239000012044 organic layer Substances 0.000 description 5
- 239000004642 Polyimide Substances 0.000 description 4
- 229920001721 polyimide Polymers 0.000 description 4
- -1 acryl Chemical group 0.000 description 3
- 238000005229 chemical vapour deposition Methods 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 2
- 229920001230 polyarylate Polymers 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 229910052814 silicon oxide Inorganic materials 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 229920002430 Fibre-reinforced plastic Polymers 0.000 description 1
- 229920012266 Poly(ether sulfone) PES Polymers 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000011151 fibre-reinforced plastic Substances 0.000 description 1
- 239000011152 fibreglass Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/122—Pixel-defining structures or layers, e.g. banks
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
The embodiment of the application relates to the technical field of display, and discloses a packaging structure, a display panel and a preparation method thereof. The package structure of the present application includes: the first inorganic layer, first inorganic layer includes first inorganic membrane and second inorganic membrane, and first inorganic membrane includes first structure, and the second inorganic membrane includes the second structure, and the second structure includes partly laminated first body and first arch, and first body and first structure set up with the layer, and first protruding part stacks on the first structure adjacent with the second structure. The application also provides a display panel and a preparation method thereof. The packaging structure, the display panel and the preparation method thereof can improve the transmission of cracks in the packaging structure and improve the packaging reliability.
Description
Technical Field
The embodiment of the application relates to the technical field of display, in particular to a packaging structure, a display panel and a preparation method thereof.
Background
The flexible panel can be bent and folded, various screen forms can be created on the equipment, the inherent appearance of the hard screen is broken, and curved screens and folding screens in the market are gradually developed nowadays. To maintain the bending ability and folding characteristics of the flexible panel, the flexible panel is typically made of TFE (Thin-Film Encapsulation, thin film encapsulation). Conventional TFE packages include full face inorganic-organic-inorganic tri-layer stacked packages.
The inventor finds that at least the following problems exist in the prior art: the inorganic layer at the edge of the screen body is affected by external force or environmental changes such as cold and hot impact, so that cracks are easily generated, and the reliability of packaging is affected.
Disclosure of Invention
The embodiment of the application aims to provide a packaging structure, a display panel and a preparation method thereof, which can improve the transmission of cracks in the packaging structure and improve the packaging reliability.
In order to solve the above technical problems, an embodiment of the present application provides a packaging structure, including: the first inorganic layer, first inorganic layer includes first inorganic membrane and second inorganic membrane, first inorganic membrane includes first structure, the second inorganic membrane includes the second structure, the second structure includes partly laminated first body and first arch, first body with first structure homolayer sets up, first protruding part stack in with the second structure is adjacent first structure.
The embodiment of the application also provides a display panel, which comprises: the light-emitting diode comprises a substrate, a light-emitting layer arranged on the substrate and the packaging structure, wherein the packaging structure is arranged on the light-emitting layer, and the first bulge faces to one side far away from the light-emitting layer.
The embodiment of the application also provides a preparation method of the display panel, which comprises the following steps: forming a light emitting layer on a substrate; forming a first inorganic film on the light emitting layer, wherein the first inorganic film includes a first structure; forming a second inorganic film on the first inorganic film, wherein the second inorganic film includes a second structure including a first body and a first bump partially stacked, the first body being disposed in a same layer as the first structure, the first bump partially stacked on the first structure adjacent to the second structure.
Compared with the prior art, the embodiment of the application has the advantages that the first body and the first structure are arranged in the same layer, the first bulge part is stacked on the first structure adjacent to the second structure, namely, the first bulge part and the first structure part are stacked to form the dykes, and the formed dykes can be used for blocking the transmission of the same-plane transverse force, so that the transmission of cracks in the packaging structure is reduced, the corrosion of external water and oxygen to the film layer to be packaged below the packaging layer through the cracks is avoided, and the reliability of the display panel is improved.
In addition, the first inorganic film comprises a plurality of first structures which are sequentially arranged at intervals in a first direction, the second inorganic film comprises a plurality of second structures which are sequentially arranged at intervals in the first direction, and the plurality of first structures and the plurality of second structures are alternately arranged; the first body comprises a first side face and a second side face which are perpendicular to the first direction and are oppositely arranged, and the first side face and the second side face are respectively connected with the adjacent first structure. Since the first inorganic film includes: a plurality of first structures disposed at intervals from each other, that is, a plurality of first structures are independent from each other, and the second inorganic film includes: the second structures are arranged at intervals, namely, the second structures are mutually independent and separated, so that the peeling phenomenon of the partial area cannot be extended to cause the whole film layer to be peeled off, and the reliability of the display panel is improved; and, because the said first side and said second side meet with adjacent said first structure separately, form the continuous membranous layer, or stated another way, there is no membranous layer of the through hole in the thickness direction of membranous layer, thus cover the membranous layer to be encapsulated below, avoid water oxygen from entering to wait to encapsulate membranous layer; in addition, the first inorganic film and the second inorganic film are formed by forming two films respectively, and the second inorganic film is lapped on the first inorganic film to form a dam, so that the dam is formed to avoid the transmission of cracks, the process is fewer, and the cost advantage is realized.
In addition, the second structure further comprises a second protrusion, the second protrusion is stacked with the first body portion, the first protrusion is stacked on one adjacent first structure, and the second protrusion is stacked on another adjacent first structure. The first inorganic film and the second inorganic film are respectively formed through two film forming processes, and two ends of the second inorganic film are lapped on two adjacent first inorganic films to form two dykes, so that more dykes are formed to better avoid the transmission of cracks under the condition of not additionally adding working procedures.
In addition, the first inorganic film comprises a plurality of first structures which are sequentially arranged at intervals in a first direction, the second inorganic film comprises a plurality of second structures which are sequentially arranged at intervals in the first direction, and the plurality of first structures and the plurality of second structures are alternately arranged; the first body comprises a first side face and a second side face which are perpendicular to the first direction and are oppositely arranged, the second side face is arranged at intervals from the adjacent first structure, and the first protruding part is laminated at one end, close to the first side face, of the first body; the first inorganic layer further comprises a third inorganic film, the third inorganic film comprises a plurality of third structures which are sequentially arranged at intervals in the first direction, and the third structures are respectively positioned between the adjacent first structures and the second structures; the third structure includes: the second body and the first structure are arranged in the same layer and positioned between the adjacent first structure and the first body, the third protruding part is stacked on the adjacent first structure, and the fourth protruding part is stacked on the adjacent first body. The first inorganic film, the second inorganic film and the third inorganic film are respectively formed through three films, one end of the second inorganic film is overlapped on the first inorganic film to form a dam, and the other end of the second inorganic film is covered by the third inorganic film to form another dam, so that the first inorganic film and the second inorganic film are not easy to peel.
In addition, the first inorganic film includes: a plurality of rows of first structures sequentially arranged in the second direction, each row of first structures comprising a plurality of first structures arranged at intervals in the first direction, wherein the first structures of even rows and the first structures of odd rows are arranged in a staggered manner; the first direction and the second direction are perpendicular to each other and are perpendicular to the stacking direction of the first protrusion and the first structure. By the arrangement, the dykes and dams formed by stacking the first bulges and the first structure part are arranged in a staggered mode, the propagation path of cracks can be better blocked, and meanwhile, the diffusion path of water and oxygen in the packaging structure (particularly, in an organic layer on the first inorganic layer) is increased.
In addition, the second inorganic film includes: a plurality of rows of second structures sequentially arranged in the second direction, each row of second structures comprising a plurality of second structures arranged at intervals in the first direction, wherein the first structures of even rows and the second structures of odd rows are arranged in a staggered manner; each row of second structures is disposed in a stacked relationship with the first structure portions of the adjacent rows. In this way, the first structure can also be laminated with the second structure portions of adjacent rows to form a dam, so that the crack can be better blocked from being transferred in the second direction.
In addition, the first inorganic layer includes a central region, and an edge region surrounding the central region; the first structure and the second structure are positioned in the edge area; the first inorganic layer further includes a faceted structure, the faceted structure being located in the central region. The dam formed by the first structure and the second structure can avoid that cracks of the edge area extend to the central area, the reliability of the display panel is improved, and the influence on the display effect of the central area when the patterned film layer is stacked to form the dam can be avoided by the whole surface structure of the central area (the whole surface structure is a film layer without through holes formed by one preparation process, or a stacked film layer structure formed by multiple preparation processes, wherein each process forms a film layer without through holes in the thickness direction of the film layer).
In addition, the first structure and the second structure are both annular structures arranged around the central area, and the orthographic projection of the inner edge of the first structure in the thickness direction of the first inorganic layer is positioned in the orthographic projection of the second structure in the thickness direction of the first inorganic layer; an orthographic projection of an outer edge of the second structure in a thickness direction of the first inorganic layer is located at an orthographic projection of the first structure in the thickness direction of the first inorganic layer. By the arrangement, annular dams can be formed at the stacking positions, so that the annular dams are used for blocking the transmission of the coplanar transverse force, and the transmission of cracks from the periphery in the packaging structure is reduced.
Drawings
One or more embodiments are illustrated by way of example and not limitation in the figures of the accompanying drawings, in which like references indicate similar elements, and in which the figures of the drawings are not to be taken in a limiting sense, unless otherwise indicated.
Fig. 1 is a cross-sectional view of a first inorganic layer provided in a first embodiment of the present application;
fig. 2 is a cross-sectional view of another first inorganic layer provided in the first embodiment of the present application;
fig. 3 is a cross-sectional view of yet another first inorganic layer provided by the first embodiment of the present application;
fig. 4 is a top view of a first inorganic film provided in a first embodiment of the present application;
fig. 5 is a top view of a first inorganic layer provided in a first embodiment of the present application;
fig. 6 is a partial view of a first inorganic layer provided in a first embodiment of the present application;
fig. 7 is a cross-sectional view of still another first inorganic layer provided in the first embodiment of the present application;
fig. 8 is a schematic view of a package structure according to a first embodiment of the present application;
fig. 9 is a schematic view of a display panel according to a second embodiment of the present application;
fig. 10 is a cross-sectional view of a third embodiment of the present application after a light-emitting layer is formed on a substrate;
fig. 11 is a cross-sectional view of a third embodiment of the present application after forming a patterned first inorganic film on a light-emitting layer;
fig. 12 is a cross-sectional view of a third embodiment of the present application after forming a patterned second inorganic film on a first inorganic film;
fig. 13 is a cross-sectional view of a third embodiment of the present application after forming a patterned third inorganic film on a second inorganic film.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present application more apparent, the following detailed description of the embodiments of the present application will be given with reference to the accompanying drawings. However, those of ordinary skill in the art will understand that in various embodiments of the present application, numerous technical details have been set forth in order to provide a better understanding of the present application. However, the claimed application may be practiced without these specific details and with various changes and modifications based on the following embodiments.
A first embodiment of the present application relates to a package structure 100, as shown in fig. 1, 2, 3, 4, 5, 6, and 7, wherein the package structure 100 includes: the first inorganic layer 11, the first inorganic layer 11 includes a first inorganic film and a second inorganic film, the first inorganic film includes a first structure 111, the second inorganic film includes a second structure 112, the second structure 112 includes a first body 112a and a first protrusion 112b partially stacked, the first body 112a is disposed in the same layer as the first structure 111, and the first protrusion 112b is partially stacked on the first structure 111 adjacent to the second structure 112. The partially stacked first body 112a and first protrusion 112b means that the first end of the first protrusion 112b overlaps the first body 112a, and the orthographic projection of the first end of the first protrusion 112b in the direction perpendicular to the thickness direction of the package structure 100 is located in the orthographic projection of the first body 112a in the direction perpendicular to the thickness direction of the package structure 100.
Since the second structure 112 includes the first body 112a and the first protrusion 112b which are partially stacked, the first body 112a and the first structure 111 are arranged in the same layer, the first protrusion 112b is partially stacked on the first structure 111 adjacent to the second structure 112, specifically, the lower surface of the first protrusion 112b is in contact with (i.e., partially attached to) the upper surface of the adjacent first structure 111, that is, the first protrusion 112b extends from the first body 112a to the first structure 111 adjacent to the first body 112a, the first protrusion 112b is partially stacked with the first body 112a and partially stacked with the first structure 111 to form a dam, and the formed dam can block the transmission of the same-plane transverse force, thereby reducing the transmission of cracks in the package structure, avoiding the external water oxygen from corroding the film layer to be packaged under the package layer via the cracks, and improving the reliability of the display panel; also, since the first inorganic layer includes a bank structure formed by partially stacking the first structure 111 and the second structure 112, a contact area between the first structure 111 and the second structure 112 is larger and a contact area between the two and other adjacent film layers is also larger, compared to a scheme of directly forming the bump as a bank, so that the first structure 111 and the second structure 112 are less likely to be peeled off.
The specific structure of the first inorganic layer 11 will be described below with reference to fig. 1 to 7:
fig. 1 is a schematic cross-sectional view of a first inorganic layer provided in this embodiment, referring to fig. 1, specifically, the first inorganic film may include a plurality of first structures 111 sequentially spaced apart in a first direction X (in a row direction), the second inorganic film includes a plurality of second structures 112 sequentially spaced apart in the first direction X, and the plurality of first structures 111 and the plurality of second structures 112 are alternately arranged; the first body 112a includes a first side surface and a second side surface perpendicular to the first direction X and disposed opposite to each other, and the first side surface and the second side surface are respectively connected to the adjacent first structures 111 to form a continuous film layer.
Since the first inorganic film includes the plurality of first structures 111 which are spaced apart from each other in the first direction, that is, the plurality of first structures 111 are independent from each other and separated from each other in the first direction, and the second inorganic film includes the plurality of second structures 112 which are spaced apart from each other in the first direction, that is, the plurality of second structures 112 are independent from each other and separated from each other in the first direction, the peeling phenomenon of the partial region is not extended to cause the whole film layer to be peeled off, and the reliability of the display panel is improved; and, because the first side and the second side are respectively connected with the adjacent first structures 111 to form a continuous film layer, or, the side, opposite to the first side, of the first structure perpendicular to the first direction is contacted with the first side, and the side, opposite to the second side, of the first structure perpendicular to the first direction is contacted with the second side, so that a continuous film layer is formed to cover the film layer to be packaged below, and water and oxygen are prevented from entering the film layer to be packaged. In addition, because the second structure includes the first body and the first arch of partial range upon range of, first body and first structure homolayer setting, first protruding part stacks on the first structure adjacent with the second structure, or the projection of first protruding on the layer that first body is located all has the overlap with first body and adjacent first structure, increases contact stability when avoiding the crack transmission. In addition, the first inorganic film and the second inorganic film can be formed by adopting two films, the second inorganic film is lapped on the first inorganic film, the working procedures are fewer, and the cost advantage is achieved.
As shown in fig. 1, in the first direction X (row direction), each of the second structures 112 is partially stacked on the first structure 111 at only one side to form one bank.
Specifically, the first body 112a includes a first side surface and a second side surface disposed opposite to the first side surface perpendicular to the first direction X, and the first protrusion 112b is partially stacked on an end of the first body 112a near the first side surface, and the second side surface is connected to the adjacent first structure 111 without overlapping (i.e., not stacking).
Fig. 2 is a schematic cross-sectional view of another first inorganic layer provided in this embodiment, and referring to fig. 2, in a first direction X (in a row direction), both sides of a second structure 112 are partially stacked on the first structure 111 to form two banks.
Specifically, the second structure 112 further includes a second protrusion 112c, where the second protrusion 112c is partially stacked with the first body 112a, the first protrusion 112b is partially stacked on one adjacent first structure 111, and the second protrusion 112c is partially stacked on another adjacent first structure 111. The first inorganic film and the second inorganic film can be formed by forming the films respectively for two times, and two ends of the second inorganic film are lapped on two adjacent first inorganic films to form two dykes and dams, so that more dykes and dams are formed to better avoid the transmission of cracks under the condition of not additionally adding working procedures.
Fig. 3 is a schematic cross-sectional view of a first inorganic layer provided in this embodiment, referring to fig. 3, in a first direction X (in a row direction), each of the second structures 112 is partially stacked on the first structure 111 to form a dam, and is spaced apart from the first structure 111 on the other side, a third structure 113 is provided on the spaced portion, and two sides of the third structure 113 are partially stacked on the first structure 111 and the second structure 112 to form two dams, respectively.
Specifically, the first inorganic film includes: a plurality of first structures 111 sequentially arranged at intervals in the first direction X, the second inorganic film including: a plurality of second structures 112 sequentially arranged at intervals in the first direction X, the plurality of first structures 111 and the plurality of second structures 112 being alternately arranged; the first body 112a includes a first side surface and a second side surface perpendicular to the first direction X and disposed opposite to each other, the second side surface is disposed at a distance from the adjacent first structure 111, and the first protrusion 112b is partially stacked on one end of the first body 112a near the first side surface; the first inorganic layer 11 further includes: a third inorganic film comprising: a plurality of third structures 113 sequentially arranged at intervals in the first direction X, the plurality of third structures 113 being respectively located between adjacent first structures 111 and second structures 112; the third structure 113 includes: the second body, and the third protruding and fourth protruding that are located the second body opposite sides, third protruding and fourth protruding all with the second body part range upon range of setting, the second body with first structure 111 homolayer setting and lie between adjacent first structure 111 and first body 112a, the third protruding part stacks on adjacent first structure 111, the fourth protruding part stacks on adjacent first body 112 a. The first inorganic film, the second inorganic film and the third inorganic film can be formed respectively through three films, one end of the second inorganic film is overlapped on the first inorganic film to form a dam, and the other end of the second inorganic film is covered by the third inorganic film to form another dam, so that the first inorganic film and the second inorganic film are not easy to peel.
For any of the above solutions, as shown in fig. 4, 5, and 6, the first inorganic film may include: and a plurality of rows of first structures 111 sequentially arranged in a second direction Y (column direction), each row of first structures 111 including a plurality of first structures 111 arranged at intervals in a first direction X, the even-numbered rows of first structures 111 and the odd-numbered rows of first structures 111 being arranged in a staggered manner, wherein the first direction X and the second direction Y are perpendicular to each other and are perpendicular to the stacking direction of the first protrusions 112b and the first structures 111. By arranging the first protrusions 112b and the first structures 111 in a staggered manner, the propagation path of cracks can be better blocked, and meanwhile, the diffusion path of water oxygen in the packaging structure (specifically, in the organic layer 13 on the first inorganic layer 11) is increased.
Optionally, the second inorganic film may further include: a plurality of rows of second structures 112 sequentially arranged in the second direction Y, each row of second structures 112 including a plurality of second structures 112 arranged at intervals in the first direction X, the first structures 111 of even rows and the second structures 112 of odd rows being arranged in a staggered manner; each row of second structures 112 is partially stacked with the first structures 111 of an adjacent row. In this way, the first structures 111 may also be partially stacked with the second structures 112 of adjacent rows to form a dam, so that the crack can be better blocked from being transferred in the second direction Y.
Optionally, the second inorganic film may further include: and a plurality of rows of third structures 113 sequentially arranged in the second direction Y, each row of third structures 113 including a plurality of third structures 113 arranged at intervals in the first direction X, the even-numbered rows of first structures 111 and the odd-numbered rows of third structures 113 being arranged in a staggered manner, each row of third structures 113 being partially stacked with the adjacent rows of first structures 111. In this way, the first structure 111 may also be partially stacked with the third structure 113 of an adjacent row to form a dam, so that the crack can be better blocked from being transferred in the second direction Y.
When the package structure of the present application is applied to a display panel, in order to prevent the film thickness of the first inorganic layer 11 from being uneven, the first, second and third structures 111, 112 and 113 of the first inorganic layer 11 forming the bank may be disposed only in the non-display region (i.e., the edge region 21) of the display panel, while a conventional full-surface structure is used in the display region of the display panel.
Specifically, the first inorganic layer 11 may include a central region 20, and an edge region 21 surrounding the central region 20, where the first structure 111, the second structure 112, and the third structure 113 are located in the edge region 21, and the first inorganic layer 11 further includes a flat overall structure located in the central region 20. The dam formed by the first structure 111, the second structure 112 and the third structure 113 can prevent the crack of the edge area 21 from extending to the central area 20, improve the reliability of the display panel, and can avoid the influence on the display effect of the central area 20 when the patterned film layers are stacked to form the dam by the whole surface structure (the whole surface structure can be a continuous film layer formed by one preparation process) of the central area 20. The entire structure in the central region 20 may be prepared simultaneously with the first inorganic film or the second inorganic film, specifically, for example, by using a mask plate with a continuous opening in the middle and a patterned opening at the edge, or may be prepared separately.
Still further, the non-display region of the display panel includes a barrier region disposed around the display region, and a frame region disposed around the barrier region, and the edge region 21 may be located at the frame region, i.e., the first structure 111, the second structure 112, and the third structure 113 are disposed at the frame region. The blocking region of the display panel may include a blocking structure, and the display region of the display panel may include a light emitting layer, and the blocking structure may prevent the light emitting layer from overflowing.
As shown in fig. 7, in another possible example, the first inorganic layer 11 may include a ring-shaped bank.
Specifically, the first structure 111 and the second structure 112 may both be annular structures disposed around the central area 20, and the orthographic projection of the inner edge of the first structure 111 in the thickness direction of the first inorganic layer 11 (the "orthographic projection in the thickness direction of the first inorganic layer 11" refers to the orthographic projection of the first inorganic layer 11 in which the direction of the projection light is the thickness direction of the first inorganic layer 11 and the projection plane is a plane perpendicular to the thickness direction of the first inorganic layer 11) is located within the orthographic projection of the second structure 112 in the thickness direction of the first inorganic layer 11, and the orthographic projection of the outer edge of the second structure 112 in the thickness direction of the first inorganic layer 11 is located within the orthographic projection of the first structure in the thickness direction of the first inorganic layer 11, so that an annular dam may be formed at the stacking position, so that the transfer of the transverse force from the periphery is blocked by the annular shape, and the transfer of cracks from the periphery in the package structure is reduced. Wherein, the dike formed by stacking the outer edge of the first structure 111 and the inner edge of the second structure 112 is located in the frame area.
Specifically, the second structure 112 includes a first body 112a and a first protrusion 112b that are partially stacked, where the first body 112a and the first protrusion 112b are both annular, the first body 112a is disposed on the same layer as the first structure 111 and is connected to an inner edge of the first structure 111, and the first protrusion 112b is partially stacked on the first structure 111 and covers the inner edge of the first structure 111.
In this example, the whole surface structure and the second structure 112 are manufactured in the same process, and the whole surface structure is just completely jointed with the inner edge of the second structure 112. Of course, the whole structure may be prepared in the same process as the first structure 111, or a two-layer structure in which "a film layer prepared in the same process as the first structure 111" and "a film layer prepared in the same process as the second structure 112" are stacked.
In practical application, as shown in fig. 8, the package structure may further include: the organic layer 13 and the second inorganic layer 12 stacked on the first inorganic layer 11, where the first inorganic layer 11 and the second inorganic layer 12 are mainly used to block water and oxygen, and the organic layer 13 is mainly used to realize planarization, and a specific structure of the second inorganic layer 12 may be similar to that of the first inorganic layer 11, which is not described herein again. Of course, the second inorganic layer 12 can also be directly prepared into a whole layer of continuous inorganic film by using a large-opening mask instead of a scheme consisting of multiple patterned inorganic film layers.
The first and second inorganic layers 11 and 12 may be formed of an inorganic material such as silicon oxide (SiOx), silicon nitride (SiNx), silicon oxynitride (SiOxNy), aluminum oxide (AlOx), or aluminum nitride (AlNx) deposited by Chemical Vapor Deposition (CVD), and the organic layer 13 may be formed of an organic material such as acryl (acryl), polyimide (PI), polyester, glue, ink, or the like.
Compared with the prior art, the dam is formed by partially stacking the first structure 111 and the second structure 112, the contact area between the first structure 111 and the second structure 112 is larger, and the contact area between the first structure 111 and the second structure 112 and the adjacent film layer is also larger, so that the first structure 111 and the second structure 112 are not easy to peel off, and the dam can be used for blocking the transmission of the same-plane transverse force, thereby reducing the transmission of cracks in the packaging structure and improving the reliability of the display panel; meanwhile, the first inorganic layer 11 is formed by at least two layers of patterned inorganic films instead of the whole layer which is directly prepared, and the adhesion exists at the overlapping position of the lamination layers, so that the lamination layers are not easy to peel.
A second embodiment of the present application relates to a display panel, as shown in fig. 9, including: the substrate 14, the light emitting layer 15 on the substrate 14, and any of the package structures 100 as in the first embodiment, the package structure 100 is on the light emitting layer 15, and the first bump faces the side away from the light emitting layer 15. Specifically, the light-emitting layer is an organic light-emitting layer, and the display panel is an organic light-emitting display panel, such as an OLED display panel.
The dam formed in the packaging structure 100 can block the transmission of the same-plane transverse force, so that the transmission of cracks in the packaging structure is reduced, the corrosion of external water and oxygen to a film layer to be packaged below the packaging layer by the cracks is avoided, and the reliability of the display panel is improved; and, compared to the scheme of directly forming the bump as a dam, the first inorganic layer in the package structure 100 includes a dam structure formed by stacking the first structure and the second structure portion, the contact area between the first structure and the second structure is larger, and the contact area between the first structure and the second structure and other adjacent film layers is also larger, so that the first structure and the second structure are less likely to be peeled off.
Specifically, the display panel comprises a display area and a non-display area surrounding the display area, the light-emitting layer is located in the display area, the first structure and the second structure are both located in the non-display area, and the packaging structure of the display area adopts a whole-surface structure so as to ensure the display effect.
Specifically, the display panel includes a display area M, a blocking area N surrounding the display area, and a frame area P surrounding the blocking area N, and it is understood that the non-display area includes the blocking area N and the frame area P, the light emitting layer is located in the display area M, and the first structure and the second structure are both located in the frame area P. The blocking area N may include a blocking structure 30, where a larger height difference is provided around the blocking structure 30, and only the first structure and the second structure are provided in the frame area, so that the difficulty in manufacturing the process is reduced while blocking crack transmission.
Wherein the substrate 14 may be formed of a flexible insulating material, for example, the substrate 14 may be formed of a polymer material such as Polyimide (PI), polycarbonate (PC), polyethersulfone (PES), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyarylate (PAR), or glass Fiber Reinforced Plastic (FRP); the light emitting layer 15 may be composed of OLED light emitting pixels.
Since the first embodiment corresponds to the present embodiment, the present embodiment can be implemented in cooperation with the first embodiment. The related technical details mentioned in the first embodiment are still valid in this embodiment, and the technical effects achieved in the first embodiment may also be achieved in this embodiment, so that the repetition is reduced, and a detailed description is omitted here. Accordingly, the related art details mentioned in the present embodiment can also be applied to the first embodiment.
A third embodiment of the present application relates to a method for manufacturing a display panel, including: forming a light emitting layer on a substrate; forming a first inorganic film on the light emitting layer, wherein the first inorganic film includes a first structure; forming a second inorganic film on the first inorganic film, wherein the second inorganic film includes a second structure including a first body and a first bump partially stacked, the first body being disposed in a same layer as the first structure, the first bump partially stacked on the first structure adjacent to the second structure. The specific structure of the first inorganic film and the second inorganic film can be referred to in the first embodiment.
The following is an example of the preparation of the first inorganic layer 11 by three film-forming steps:
step 1: a light emitting layer 15 is formed on the substrate 14.
As shown in fig. 10, a light emitting layer 15 is located on the substrate 14.
Step 2: a first inorganic film is formed on the light emitting layer 15.
As shown in fig. 11, the first inorganic film includes: a plurality of first structures 111 arranged at intervals in the first direction in order.
Step 3: a second inorganic film is formed on the first inorganic film.
As shown in fig. 12, the second inorganic film includes: a plurality of second structures 112 disposed at intervals in the first direction in order, the plurality of first structures 111 and the plurality of second structures 112 being alternately arranged; the first body 112a includes a first side surface and a second side surface perpendicular to the first direction X and disposed opposite to each other, the second side surface is disposed at a distance from the adjacent first structure 111, and the first protrusion 112b is partially stacked on an end of the first body 112a near the first side surface.
Step 4: a third inorganic film is formed on the second inorganic film.
As shown in fig. 13, the third inorganic film includes: a plurality of third structures 113 disposed at intervals in the first direction in sequence, the plurality of third structures 113 being respectively located between the adjacent first structures 111 and second structures 112; the third structure 113 includes: the second body and the first structure 111 are arranged in the same layer and between the adjacent first structure 111 and the first body 112a, the third bulge part is stacked on the adjacent first structure 111, and the fourth bulge part is stacked on the adjacent first body 112 a.
It should be noted that, the step 2, the step 3 and the step 4 may all be prepared by chemical vapor deposition, and the step 2, the step 3 and the step 4 may be performed by using the same mask plate, and only the mask plate is required to be used in a staggered manner with the previous step, which may, of course, also be prepared by using different mask plates, and the method is not limited herein.
Since the first embodiment corresponds to the present embodiment, the present embodiment can be implemented in cooperation with the first embodiment. The related technical details mentioned in the first embodiment are still valid in this embodiment, and the technical effects achieved in the first embodiment may also be achieved in this embodiment, so that the repetition is reduced, and a detailed description is omitted here. Accordingly, the related art details mentioned in the present embodiment can also be applied to the first embodiment.
It will be understood by those of ordinary skill in the art that the foregoing embodiments are specific examples of carrying out the application and that various changes in form and details may be made therein without departing from the spirit and scope of the application.
Claims (9)
1. The utility model provides a packaging structure, is applied to the display panel, the display panel includes display area and surrounds the non-display area of display area, its characterized in that includes: a first inorganic layer including a first inorganic film and a second inorganic film, the first inorganic film including a first structure and the second inorganic film including a second structure, the second structure including a first body and a first protrusion partially stacked, the first body being disposed in-layer with the first structure, the first protrusion partially stacked on the first structure adjacent to the second structure;
the first inorganic layer includes a central region, and an edge region surrounding the central region; the first structure and the second structure are positioned in the edge area; the first inorganic layer further comprises a whole-surface structure, and the whole-surface structure is positioned in the central area; the central area is arranged corresponding to the display area, and the edge area is arranged corresponding to the non-display area.
2. The package structure according to claim 1, wherein the first inorganic film includes a plurality of the first structures sequentially spaced apart in a first direction, the second inorganic film includes a plurality of the second structures sequentially spaced apart in the first direction, and the plurality of the first structures and the plurality of the second structures are alternately arranged;
the first body comprises a first side face and a second side face which are perpendicular to the first direction and are oppositely arranged, and the first side face and the second side face are respectively connected with the adjacent first structure.
3. The package structure of claim 2, wherein the second structure further comprises a second bump, the second bump being stacked with the first body portion, the first bump portion being stacked on an adjacent first structure, the second bump portion being stacked on another adjacent first structure.
4. The package structure according to claim 1, wherein the first inorganic film includes a plurality of the first structures sequentially spaced apart in a first direction, the second inorganic film includes a plurality of the second structures sequentially spaced apart in the first direction, and the plurality of the first structures and the plurality of the second structures are alternately arranged;
the first body comprises a first side face and a second side face which are perpendicular to the first direction and are oppositely arranged, the second side face is located at one end far away from the first protrusion, and the second side face is arranged at intervals with the adjacent first structure;
the first inorganic layer further comprises a third inorganic film, the third inorganic film comprises a plurality of third structures which are sequentially arranged at intervals in the first direction, and the third structures are respectively positioned between the adjacent first structures and the second structures;
the third structure includes: the second body and the first structure are arranged in the same layer and positioned between the adjacent first structure and the first body, the third protruding part is stacked on the adjacent first structure, and the fourth protruding part is stacked on the adjacent first body.
5. The package structure according to any one of claims 2 to 4, wherein the first inorganic film includes: a plurality of rows of first structures sequentially arranged in the second direction, each row of first structures comprising a plurality of first structures arranged at intervals in the first direction, wherein the first structures of even rows and the first structures of odd rows are arranged in a staggered manner;
the first direction and the second direction are perpendicular to each other and are perpendicular to the stacking direction of the first protrusion and the first structure.
6. The package structure of claim 5, wherein the second inorganic film comprises: a plurality of rows of second structures sequentially arranged in the second direction, each row of second structures comprising a plurality of second structures arranged at intervals in the first direction, wherein the first structures of even rows and the second structures of odd rows are arranged in a staggered manner;
each row of second structures is disposed in a stacked relationship with the first structure portions of the adjacent rows.
7. The package structure of claim 1, wherein the first structure and the second structure are each annular structures disposed around the central region;
an orthographic projection of an inner edge of the first structure in a thickness direction of the first inorganic layer is located within an orthographic projection of the second structure in the thickness direction of the first inorganic layer;
an orthographic projection of an outer edge of the second structure in a thickness direction of the first inorganic layer is located at an orthographic projection of the first structure in the thickness direction of the first inorganic layer.
8. A display panel, comprising: a substrate, a light emitting layer on the substrate, and a package structure as claimed in any one of claims 1 to 7, the package structure being on the light emitting layer with the first bump facing away from the light emitting layer.
9. A method for manufacturing a display panel, comprising:
forming a light emitting layer on a substrate;
forming a first inorganic film on the light emitting layer, wherein the first inorganic film includes a first structure;
forming a second inorganic film on the first inorganic film, wherein the second inorganic film includes a second structure including a first body and a first bump partially stacked, the first body being disposed in a same layer as the first structure, the first bump partially stacked on the first structure adjacent to the second structure;
the display panel comprises a display area and a non-display area surrounding the display area, wherein the first inorganic film and the second inorganic film are arranged in a central area and an edge area surrounding the central area, the first structure and the second structure are arranged in the edge area, the first inorganic film and the second inorganic film also comprise an integral structure, and the integral structure is arranged in the central area; the central area is arranged corresponding to the display area, and the edge area is arranged corresponding to the non-display area.
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