KR20160054822A - Organic light emitting display device and method of manufacturing the same - Google Patents

Abstract

Provided are an organic light emitting display device and a manufacturing method of the organic light emitting display device. A lower substrate includes a display area and a non-display area. The non-display area surrounds the display area. In the display area of the lower substrate, a thin film transistor and an organic light emitting component are placed. A sealing layer is placed in the display area and the non-display area of the lower substrate. The sealing layer are placed on the organic light emitting component to cover the organic light emitting component. A gap compensation pattern is placed between the lower substrate and the sealing layer in the non-display area. The gap compensation pattern is made of an insulation material. An upper substrate faces the lower substrate. An upper over coating layer is placed under the upper substrate. The upper over coating layer is placed between the upper substrate and an adhesive layer, has one or more grooves or holes in the non-display area, and flattens the lower part of the upper substrate in the display area. The adhesive layer attaches the upper substrate and the lower substrate. According to an embodiment of the present invention, the organic light emitting device can resolve the issue of non-attachment between the lower substrate and the upper substrate due to a gap between the upper substrate and the lower substrate using the gap compensation pattern. Therefore, the present invention can prevent generation of an inflow path for moisture or oxygen due to the gap.

Description

Technical Field [0001] The present invention relates to an organic light emitting diode (OLED) display device,

The present invention relates to an organic light emitting diode (OLED) display and a method of manufacturing an organic light emitting diode (OLED) display. More particularly, the present invention relates to an organic light emitting diode An organic light emitting display, and a method of manufacturing an organic light emitting display.

The organic light emitting display device is a self-emission type display device, unlike a liquid crystal display device, a separate light source is not required, and thus it can be manufactured in a light and thin shape. Further, the organic light emitting display device is not only advantageous from the viewpoint of power consumption by low voltage driving, but also excellent in color implementation, response speed, viewing angle, and contrast ratio (CR), and is being studied as a next generation display.

1 is a schematic cross-sectional view illustrating a conventional method of manufacturing an organic light emitting display device. FIG. 1 shows a first panel area PA1 and a second panel area PA2 in a state where the lower and upper main substrate 190 and the upper main substrate 195 are bonded together.

In the conventional method of manufacturing an organic light emitting diode display device, a thin film transistor 120, an organic light emitting diode 140, and the like are arranged on a lower and a upper substrate 190 and a lower substrate 190 on which a plurality of panel regions are defined. An organic light emitting display is manufactured in such a manner that the primary substrate 190 and the upper primary substrate 195 are bonded together and the respective panel regions are separated.

1, a thin film transistor 120 is disposed in a display area DA of a lower substrate 190 on which a supporting substrate 119 is mounted. In the process of disposing the thin film transistor 120, The gate insulating layer 131 and the interlayer insulating layer 132 are disposed in the display area DA and the non-display area NA of the main substrate 190 and the display area DA and the non- NA), a lower overcoat layer 133 is disposed. The organic light emitting device 140 is disposed on the lower overcoat layer 133 and the bank layer 134 is disposed on the side of the organic light emitting device 140. Various wiring lines 129 and circuit portions may be disposed in the non-display area NA.

The sealing layer 135 for protecting the organic light emitting element 140 is disposed before the upper and lower substrate 195 and the lower substrate 190 are bonded together by the adhesive layer 170. Since the lower overcoating layer 133 and the bank layer 134 are disposed only in a part of the non-display area NA as shown in FIG. 1, the sealing layer 135 is arranged so as to have a step in the non- do.

After the sealing layer 135 is disposed, the upper and lower substrate strips 195 and 190 are bonded together using the adhesive layer 170. However, since the sealing layer 135 is arranged so as to have a step, the adhesive layer 170 can not be completely bonded to the upper and lower main substrate units 195 and 190 in the non-display area NA, An uncoated space S as shown in Fig. Particularly, when a thin thickness adhesive layer 170 is used to reduce the cell gap of the organic light emitting display device and improve the viewing angle of the organic light emitting display device, the above-mentioned problem of non-sticking can be further exacerbated.

The upper layer substrate 195 and the lower layer substrate 190 are bonded together, so that the adhesive layer 170 is hardened. However, the applied pressure can be concentrated in the non-display area NA because of the non-sticking space S existing in the non-display area NA. Inorganic layers such as the wiring 129 and the gate insulating layer 131, the interlayer insulating layer 132, and the like disposed on the sub-substrate 190 on which the pressure is concentrated can be cracked, and the cracks generated in one component Very easily lead to cracking of other components. Even when the cracking phenomenon described above does not occur during the adhesive layer curing process, even when the cutting process for separating the respective panel areas, that is, the laser cutting process or the mechanical scribing process, There is still a possibility of cracking of the wiring 129 or the inorganic layers.

In addition, in the conventional method of manufacturing an organic light emitting display device, when each of the panel regions is separated after the upper and lower substrate strips 195 and 190 are bonded together, a gap between the adhesive layer 170 and the lower substrate, (S) exists. Therefore, the adhesive layer 170 and the lower substrate may be lifted, the lower substrate and the upper substrate may not be fixed properly, and peeling may occur, or a process failure may occur in various processes performed thereafter. In addition, since moisture or oxygen can penetrate through the non-adhered space S from the side of the organic light emitting display device, the lifetime and reliability of the organic light emitting device 140 may be deteriorated.

In addition, when the organic light emitting display device is implemented as a flexible display device, the size of the non-adhered space S may increase during repeated bending or folding, The adhesive force may be lowered and the peeling phenomenon between the upper substrate and the lower substrate may be further intensified.

[Related Technical Literature]

1. A light emitting display and a method of manufacturing the same (Korean Patent Application No. 10-2007-0090457)

The inventors of the present invention invented a new structure of an organic light emitting display and a method of manufacturing the same to solve the problems caused by using the conventional method of manufacturing an organic light emitting display as described above.

Accordingly, it is an object of the present invention to provide an organic light emitting display device and a method of manufacturing an organic light emitting display device, in which the space for adhesion of the adhesive layer caused by the step of the sealing layer can be minimized.

Another problem to be solved by the present invention is to provide an organic light emitting display device and a method of manufacturing an organic light emitting display device in which cracking of a wiring in a laminating process and minimization of substrate lifting phenomenon can be minimized by minimizing a space where the adhesive layer is not adhered will be.

Another object of the present invention is to provide an organic light emitting display device and a method of manufacturing an organic light emitting display device, which can prevent penetration of moisture and oxygen through an uncoated space of an adhesive layer.

Another object of the present invention is to provide an organic light emitting display device and a method of manufacturing an organic light emitting display device which can minimize an adhesive strength of an adhesive layer during bending or folding by increasing an adhesive area of an adhesive layer.

The problems of the present invention are not limited to the above-mentioned problems, and other problems not mentioned can be clearly understood by those skilled in the art from the following description.

An organic light emitting display according to an embodiment of the present invention is provided. The lower substrate has a display region and a non-display region, and the non-display region surrounds the display region. A thin film transistor and an organic light emitting element are disposed in a display region of the lower substrate. The sealing layer is disposed in the display region and the non-display region of the lower substrate. The sealing layer is disposed on the organic light emitting element to cover the organic light emitting element. A step difference compensation pattern is disposed between the lower substrate and the sealing layer in the non-display area. The step difference compensation pattern is made of an insulating material. The upper substrate faces the lower substrate. An upper overcoat layer is disposed below the upper substrate. The upper overcoat layer is disposed between the upper substrate and the adhesive layer and has at least one groove or hole in the non-display area to flatten the lower part of the counter substrate in the display area. The adhesive layer bonds the upper substrate and the lower substrate. In the OLED display according to an exemplary embodiment of the present invention, the problem of non-sticking of the lower substrate and the upper substrate, which may be caused by the difference in level between the upper substrate and the lower substrate, is solved by using the step difference compensation pattern disposed in the non- . Therefore, it is possible to prevent the infiltration path of moisture or oxygen from occurring due to the non-adhered space. In addition, in the organic light emitting diode display according to an embodiment of the present invention, the adhesion area of the adhesive layer is increased by grooves or holes of the upper overcoat layer corresponding to the level difference compensation pattern and the level difference compensation pattern, It is possible to prevent the adhesive strength of the adhesive layer from lowering.

According to another aspect of the present invention, an organic light emitting display includes a lower overcoat layer disposed in a display region and a sub-pixel region in a display region to flatten the upper portion of the thin film transistor, and further includes a bank layer disposed on the lower overcoat layer And the step difference compensation pattern includes a first step compensation pattern made of the same material as the lower overcoat layer and a second step compensation pattern made of the same material as the bank layer.

According to another aspect of the present invention, an OLED display further includes at least one of a buffer layer, a gate insulating layer, an interlayer insulating layer, and a passivation layer disposed in a display region and a non-display region, And the buffer layer, the gate insulating layer, the interlayer insulating layer, and the passivation layer are in contact with each other between the first level compensation patterns.

According to another aspect of the present invention, the end of the level difference compensating pattern is flush with the end of the lower substrate.

According to another aspect of the present invention, the organic light emitting display further includes a spacer disposed on the bank layer, wherein the level difference compensation pattern further includes a third level compensation pattern made of the same material as the spacer.

According to still another aspect of the present invention, the grooves or holes of the upper overcoat layer are arranged so as to overlap the step difference compensation pattern.

According to another aspect of the present invention, the upper substrate and the lower substrate are made of a material having flexibility.

According to another aspect of the present invention, an OLED display is configured to be folded in a first direction, and the step difference compensation pattern includes one or more line patterns extending in a second direction different from the first direction .

According to another aspect of the present invention, the first direction and the second direction are perpendicular to each other.

According to another aspect of the present invention, the step difference compensation pattern includes a plurality of dot patterns separated from each other in the non-display area.

According to another aspect of the present invention, an organic light emitting diode display further includes a color filter or a touch sensing unit disposed between an upper substrate and an upper overcoat layer, wherein the upper overcoat layer includes a lower portion of the color filter or a lower portion Is flattened.

A method of manufacturing an organic light emitting display device according to an embodiment of the present invention is provided. A method of manufacturing an organic light emitting display device includes the steps of: providing a lower substrate having a plurality of panel regions defined therein having a display region and a non-display region surrounding the display region; forming a thin film transistor in the display region; Forming an organic light emitting element on the transistor, forming a step difference compensation pattern made of an insulating material in the non-display area, forming an encapsulation layer on the organic light emitting element in the display area and on the step difference compensation pattern in the non- Forming an upper overcoat layer on the lower portion of the upper laminating board to flatten the lower portion of the upper laminating board in the display region, the upper laminating board and the lower laminating board using one or more grooves or holes in the non- A step of attaching the substrates and a step of joining the plurality of panel regions . ≪ / RTI > In the method of manufacturing an organic light emitting diode display according to an embodiment of the present invention, a step compensation pattern can be formed in a manufacturing process of insulating layers formed in a display region without additional steps for forming a step difference compensation pattern. The yield, lifetime and reliability are improved, and additional processing time and process cost are not generated.

According to another aspect of the present invention, there is provided a method of fabricating an organic light emitting display, comprising: forming a lower overcoat layer on a display area to flatten a top of the thin film transistor; forming a bank layer on the lower overcoat layer, Wherein forming the step difference compensation pattern includes forming a first step difference compensation pattern with the same material as the lower overcoat layer and forming a second step difference compensation pattern with the same material as the bank layer .

According to another aspect of the present invention, the step of forming the lower overcoat layer and the step of forming the first step difference compensation pattern are simultaneously performed, and the step of forming the bank layer and the step of forming the second step difference compensation pattern are simultaneously performed .

According to another aspect of the present invention, there is provided a method of manufacturing an organic light emitting display, the method including forming at least one of a buffer layer, a gate insulating layer, an interlayer insulating layer, and a passivation layer in a display region and a non- Forming the encapsulation layer such that the encapsulation layer is in contact with any one of the buffer layer, the gate insulation layer, the interlayer insulation layer, and the passivation layer between the lower overcoat layer and the first level difference compensation pattern.

According to another aspect of the present invention, a method of manufacturing an organic light emitting display further includes forming a spacer on a bank layer, and the step of forming a level difference compensating pattern includes forming a third level compensating pattern with the same material as the spacer The method comprising the steps of:

According to still another aspect of the present invention, the step of forming the spacer and the step of forming the third step compensation pattern are performed simultaneously.

According to still another aspect of the present invention, the grooves or holes of the upper overcoat layer are arranged so as to overlap the step difference compensation pattern.

According to still another aspect of the present invention, the step of forming the step difference compensation pattern includes a step of forming a plurality of dot patterns or a plurality of line patterns separated from each other in the non-display area.

The details of other embodiments are included in the detailed description and drawings.

The present invention can remove the unadhered space of the adhesive layer using the step difference compensation pattern disposed in the non-display area.

In addition, the present invention can minimize the cracks in the wiring and the inorganic layer that may occur when the upper substrate and the lower substrate are bonded together, thereby improving the yield and reliability of the OLED display.

Also, the present invention can reduce the process failure rate by suppressing the substrate lifting phenomenon and the peeling phenomenon that may occur during the manufacturing process of the organic light emitting display device.

In addition, the present invention minimizes the penetration of moisture and oxygen from the side surface of the organic light emitting diode display, thereby improving the lifetime and reliability of the OLED display.

Further, the present invention can disperse the stress generated at the time of bending or folding of the organic light emitting display device by using the step difference compensation pattern and the groove or hole of the upper overcoat layer.

The effects according to the present invention are not limited by the contents exemplified above, and more various effects are included in the specification.

1 is a schematic cross-sectional view illustrating a conventional method of manufacturing an organic light emitting display device.
2 is a schematic plan view illustrating a lower substrate of an OLED display according to an embodiment of the present invention.
FIG. 3 is a schematic cross-sectional view illustrating an organic light emitting display according to an embodiment of the present invention, taken along the line III-III 'of FIG.
4 is a schematic cross-sectional view illustrating an OLED display according to another embodiment of the present invention.
5 to 7 are schematic plan views for explaining the shape of a level difference compensation pattern of an organic light emitting display according to various embodiments of the present invention.
8 is a flowchart illustrating a method of manufacturing an organic light emitting display according to an embodiment of the present invention.
9A to 9H are cross-sectional views illustrating a method of manufacturing an organic light emitting display according to an embodiment of the present invention.

BRIEF DESCRIPTION OF THE DRAWINGS The advantages and features of the present invention, and the manner of achieving them, will be apparent from and elucidated with reference to the embodiments described hereinafter in conjunction with the accompanying drawings. The present invention may, however, be embodied in many different forms and should not be construed as being limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. Is provided to fully convey the scope of the invention to those skilled in the art, and the invention is only defined by the scope of the claims.

The shapes, sizes, ratios, angles, numbers, and the like disclosed in the drawings for describing the embodiments of the present invention are illustrative, and thus the present invention is not limited thereto. Like reference numerals refer to like elements throughout the specification. In the following description, well-known functions or constructions are not described in detail since they would obscure the invention in unnecessary detail. Where the terms "comprises", "having", "done", and the like are used in this specification, other portions may be added unless "only" is used. Unless the context clearly dictates otherwise, including the plural unless the context clearly dictates otherwise.

In interpreting the constituent elements, it is construed to include the error range even if there is no separate description.

In the case of a description of the positional relationship, for example, if the positional relationship between two parts is described as 'on', 'on top', 'under', and 'next to' Or " direct " is not used, one or more other portions may be located between the two portions.

An element or layer is referred to as being another element or layer "on ", including both intervening layers or other elements directly on or in between.

Although the first, second, etc. are used to describe various components, these components are not limited by these terms. These terms are used only to distinguish one component from another. Therefore, the first component mentioned below may be the second component within the technical spirit of the present invention.

Like reference numerals refer to like elements throughout the specification.

The sizes and thicknesses of the individual components shown in the figures are shown for convenience of explanation and the present invention is not necessarily limited to the size and thickness of the components shown.

It is to be understood that each of the features of the various embodiments of the present invention may be combined or combined with each other partially or entirely and technically various interlocking and driving is possible as will be appreciated by those skilled in the art, It may be possible to cooperate with each other in association.

Various embodiments of the present invention will now be described in detail with reference to the accompanying drawings.

2 is a schematic plan view illustrating a lower substrate of an OLED display according to an embodiment of the present invention. FIG. 3 is a schematic cross-sectional view illustrating an organic light emitting display according to an embodiment of the present invention, taken along the line III-III 'of FIG. 2 and 3, the OLED display 200 includes a lower substrate 210, a thin film transistor 220, an organic light emitting diode 240, an encapsulation layer 235, an adhesive layer 270, An upper overcoat layer 260, and an upper substrate 215, The organic light emitting diode display 200 according to an embodiment of the present invention is a top emission type organic light emitting display in which light emitted from the organic light emitting diode 240 is emitted to the upper substrate 215. In FIG. 3, only one sub pixel region is schematically shown in the display region DA for convenience of explanation.

The lower substrate 210 supports various elements of the OLED display 200. The lower substrate 210 is formed of an insulating material. Specifically, the lower substrate 210 may be made of a material having flexibility, and may be made of plastic such as polyimide or the like. As the lower substrate 210 is formed of a material having flexibility, a back plate for supporting the lower substrate 210 can be used.

Referring to FIG. 2, the lower substrate 210 has a display area DA, a non-display area NA, and a pad area TA. The display area DA refers to an area where an image is displayed in the OLED display 200. The non-display area NA is an area where the image is not displayed in the organic light emitting display device 200, and is a region where the wiring 229 or the circuit part is formed. The non-display area NA surrounds the display area DA. In FIG. 2, the pad region TA is a region where the pad portion of the organic light emitting diode display device 200 is formed, and the flexible printed circuit board may be connected to the pad region TA. The pad area TA may be adjacent to one side of the non-display area NA.

A thin film transistor 220 including an active layer 221, a gate electrode 222, a source electrode 223, and a drain electrode 224 is disposed in a display region DA of the lower substrate 210. Specifically, an active layer 221 is formed on the lower substrate 210, and a gate insulating layer 231 is formed on the active layer 221 to insulate the active layer 221 from the gate electrode 222 . The gate insulating layer 231 is formed in the display area DA and the non-display area NA and may be made of an inorganic material such as silicon nitride (SiNx) or silicon oxide (SiOx). A gate electrode 222 is formed on the gate insulating layer 231 so as to overlap with the active layer 221 and an interlayer insulating layer 232 is formed on the gate electrode 222 and the gate insulating layer 231. [ The interlayer insulating layer 232 is formed in the display area DA and the non-display area NA and may be made of an inorganic material such as silicon nitride or silicon oxide. A source electrode 223 and a drain electrode 224 are formed on the interlayer insulating layer 232. The source electrode 223 and the drain electrode 224 are electrically connected to the active layer 221. For convenience of description, only the thin film transistors 220 among the various thin film transistors 220 included in the organic light emitting display 200 are shown in this specification. In this specification, the thin film transistor 220 is described as a coplanar structure, but a thin film transistor having an inverted staggered structure may also be used.

A wiring 229 is disposed in the non-display area NA of the lower substrate 210. [ The wiring 229 is electrically connected to the thin film transistor 220 or the organic light emitting diode 240 formed in the display area DA to transmit a signal. The wiring 229 may be formed of the same material as one of the various conductive components formed in the display area DA. For example, as shown in FIG. 3, the wiring 229 may be formed of the same material as the source electrode 223 and the drain electrode 224, but is not limited thereto.

A lower overcoat layer 233 is disposed on the thin film transistor 220. The lower overcoat layer 233 flattens the upper portion of the thin film transistor 220 in the display area DA. 3, the lower overcoating layer 233 is formed in a part of the display area DA and the non-display area NA. However, the lower overcoating layer 233 may be formed only in the display area DA. The lower overcoat layer 233 includes a contact hole for electrically connecting the thin film transistor 220 to the anode 241 of the organic light emitting diode 240.

An organic light emitting diode 240 is disposed on the lower overcoat layer 233. The organic light emitting diode 240 is formed on the lower overcoat layer 233 and includes an anode 241 electrically connected to the thin film transistor 220, an organic light emitting layer 242 formed on the anode 241, And a cathode 243 formed thereon. The anode 241 includes a reflective layer 244 for reflecting the light emitted from the organic light emitting layer 242 toward the upper substrate 215 and a reflective layer 244 for reflecting the light emitted from the organic light emitting layer 242 toward the upper substrate 215. The organic light emitting display device 200 is a top- And a transparent conductive layer 245 for supplying a hole to the hole 242. Although the reflective layer 244 is shown in FIG. 3 as being included in the anode 241, the anode 241 includes only the transparent conductive layer 245, and the reflective layer 244 is defined as a separate component from the anode 241. . The organic light emitting layer 242 is a white organic light emitting layer as an organic layer for emitting light of a specific color. 3, a color filter may be formed on the upper substrate 215 side. The organic light emitting layer 242 may be formed as a single layer over the entire display area DA. 3, the thickness of the organic light emitting diode 240 is much thinner than the thickness of the adhesive layer 270, although the thickness of the organic light emitting diode 240 is shown excessively.

A bank layer 234 is disposed on the anode 241 and the lower overcoat layer 233. The bank layer 234 defines a sub pixel region in a manner that distinguishes adjacent sub pixel regions in the display region DA. In addition, the bank layer 234 may define a pixel region composed of a plurality of sub pixel regions. 3, the bank layer 234 is formed in a part of the display area DA and the non-display area NA, but the bank layer 234 may be formed only in the display area DA.

The level difference compensation pattern 280 is disposed in the non-display area NA. The level difference compensation pattern 280 is formed in the non-display area NA to compensate the level difference between the upper substrate 215 and the lower substrate 210 in the non-display area NA. Further, the level difference compensation pattern 280 can increase the contact area where the sealing layer 235 and the adhesive layer 270 are in contact with each other. The level difference compensation pattern 280 is disposed on the interlayer insulating layer 232 in the non-display area NA and disposed between the interlayer insulating layer 232 and the sealing layer 235. [

The level difference compensation pattern 280 includes a first level difference compensation pattern 281 and a second level difference compensation pattern 282 on the first level difference compensation pattern 281. The first level difference compensation pattern 281 is formed of the same material as the lower overcoat layer 233 as an insulating material on the interlayer insulating layer 232. Also, the first level difference compensation pattern 281 may be formed to have the same height as the lower overcoat layer 233. The second level compensating pattern 282 is formed of the same material as the bank layer 234 as an insulating material on the first level compensating pattern 281. Further, the second level difference compensation pattern 282 may be formed to have the same height as the bank layer 234. In order to minimize the deformation of the shape of the first level difference compensation pattern 281 and the second level difference compensation pattern 282 during the bonding process of the organic light emitting diode display 200 or the bending or folding of the OLED display 200, The first level difference compensating pattern 281 and the second level compensating pattern 282 are formed to have a tapered shape and the area of the upper surface of the first level difference compensating pattern 281 is larger than that of the second level compensating pattern 282 Can be larger than the area of the lower surface.

The level difference compensation pattern 280 may be formed in a line pattern or a dot pattern on a plane. The shape of the level difference compensation pattern 280 will be described later in detail with reference to FIGS. 5 to 7. FIG.

The sealing layer 235 is a layer for protecting the organic light emitting diode 240 from moisture or oxygen from the outside of the organic light emitting diode display 200. Although the sealing layer 235 is shown as a single layer structure in FIG. 3, as the sealing layer 235, a sealing layer 235 having various structures such as an inorganic film single deposition structure or an organic / inorganic film alternating deposition structure can be used have. As the sealing layer 235, a film deposited with, for example, silicon nitride, silicon oxide, or the like may be used. Only the inorganic film of the sealing layer 235 is disposed in the portion corresponding to the end of the lower substrate 210 and the inorganic film of the sealing layer 235 is disposed in the portion corresponding to the end of the lower substrate 210. [ The organic film does not extend just beyond the end of the lower substrate 210.

The sealing layer 235 is disposed in the display area DA and the non-display area NA. That is, the sealing layer 235 is disposed over the entire lower substrate 210 between the lower substrate 210 and the upper substrate 215 to cover the organic light emitting device 240 and the level difference compensating pattern 280.

The sealing layer 235 is formed between the step difference compensating pattern 280 and the lower overcoating layer 233 and between the end of the OLED display 200 and the step difference compensating pattern 280, As shown in FIG. The level difference compensating pattern 280 is generally formed of the same material as the lower overcoat layer 233 and the bank layer 234 made of an organic material, and the organic material is vulnerable to penetration of moisture and oxygen relative to the inorganic material. Accordingly, in the organic light emitting diode display 200 according to an embodiment of the present invention, the sealing layer 235 is disposed in contact with the gate insulating layer 231 made of an inorganic material in the non-display area NA, It is possible to minimize permeation of moisture and oxygen from the side of the substrate 200.

In some embodiments, when the interlayer insulating layer 232 is formed only in the display region DA and not in the non-display area NA, the gap between the level difference compensating pattern 280 and the lower overcoat layer 233, The encapsulation layer 235 between the end of the display device 200 and the step difference compensating pattern 280 can be disposed in contact with the gate insulating layer 231 formed in the entire display area DA and the non-display area NA .

The upper substrate 215 is disposed opposite the lower substrate 210 to support the various components of the OLED display 200. Specifically, the upper substrate 215 is opposed to the display area DA and the non-display area NA of the lower substrate 210, but not to the pad area TA of the lower substrate 210. The upper substrate 215 may be made of a material having flexibility or may be made of the same material as the lower substrate 210.

A barrier layer 236 is disposed on the lower surface of the upper substrate 215. The barrier layer 236 functions as a layer for protecting the touch sensing portion 250 and the organic light emitting element 240 from moisture, oxygen, which penetrates from the top of the upper substrate 215. The barrier layer 236 is disposed from the lower surface of the upper substrate 215 across the display area DA and the non-display area NA. However, the barrier layer 236 is an optional component and is not necessarily included in the OLED display 200.

The touch sensing unit 250 is disposed below the upper substrate 215. Specifically, the touch sensing unit 250 is disposed on the lower surface of the barrier layer 236 disposed on the lower surface of the upper substrate 215. The touch sensing unit 250 includes a touch sensing electrode 251 arranged to correspond to the display area DA and a wiring 252 arranged to correspond to the non-display area NA. The wiring 252 carries a touch sensing signal from the touch sensing electrode 251. The touch sensing unit 250 may be formed below the upper substrate 215 as shown in FIG. 3. Accordingly, in the OLED display 200 according to an exemplary embodiment of the present invention, -cell) type touch screen panel can be implemented.

An upper overcoat layer 260 is disposed under the touch sensing unit 250. The upper overcoat layer 260 is a layer for planarizing the lower portion of the upper substrate 215 and the lower portion of the touch sensing portion 250 in the display region DA and is formed between the upper substrate 215 and the adhesive layer 270, (DA) and the non-display area (NA). The upper overcoat layer 260 may be formed of the same material as the lower overcoat layer 233.

The upper overcoat layer 260 has at least one groove 261 and the groove 261 is disposed at the non-display area NA. Further, the grooves 261 of the upper overcoat layer 260 are disposed so as to correspond to the level difference compensating patterns 280. That is, the groove 261 of the level difference compensating pattern 280 is formed so as to overlap the upper overcoat layer 260. Although the upper overcoat layer 260 is illustrated as having grooves 261 in FIG. 3, the upper overcoat layer 260 may be formed to have holes. In addition, the shape of the groove 261 of the upper overcoat layer 260 is not limited to the example shown in Fig. 3, and may be various shapes.

An adhesive layer 270 is interposed between the upper substrate 215 and the lower substrate 210. The adhesive layer 270 is composed of an adhesive material for bonding the upper substrate 215 and the lower substrate 210 to each other and faces the upper substrate 215 and the lower substrate 210. The adhesive layer 270 functions to protect the organic light emitting diode 240 from the penetration of moisture or oxygen from the outside of the organic light emitting diode display 200 by sealing the organic light emitting diode 240 formed on the lower substrate 210 You may. As the adhesive layer 270, various materials may be used. For example, various adhesive materials such as OCA (Optical Clear Adhesive) and OCR (Optical Clear Resin) may be used.

The adhesive layer 270 fills a space between the sealing layer 235 and the upper overcoat layer 260 in the display area DA and the non-display area NA. 3, the adhesive layer 270 may be disposed to be in contact with the upper surface of the sealing layer 235 to fill a space between the lower overcoat layer 233 and the level difference compensating pattern 280, The groove 261 of the coating layer 260 can be filled.

In the OLED display 200 according to an exemplary embodiment of the present invention, the level difference compensation pattern 280 is formed in the non-display area NA using the level difference compensation pattern 280 formed in the non-display area NA, The space between the substrate 215 and the lower substrate 210 can be filled. That is, in the organic light emitting diode display 200 according to the embodiment of the present invention, the level difference compensation pattern 280 compensates the level difference between the upper substrate 215 and the lower substrate 210, It is possible to minimize the occurrence of a space in which the adhesive layer 270 is not cemented between the substrates 210. Further, in the process of bonding the upper substrate 215 and the lower substrate 210 by minimizing the uncoated space, the pressure applied to the wirings 229 and 252 and the inorganic layer can be reduced, and moisture or oxygen Can be prevented from penetrating. Therefore, the yield, lifetime, and reliability of the OLED display 200 can be improved.

In the OLED display 200 according to an exemplary embodiment of the present invention, a level difference compensation pattern 280 is formed on the lower substrate 210 side and a groove 261 is formed on the upper substrate 215 side. A coating layer 260 is formed. The area of the adhesive layer 270 in contact with the uppermost component disposed on the lower substrate 210 side is increased as compared with the case where the level difference compensating pattern 280 is not disposed on the lower substrate 210 side. A groove 261 is formed in the upper overcoat layer 260 even if the upper overcoat layer 260 is not disposed on the upper substrate 215 or the upper overcoat layer 260 is disposed on the upper substrate 215 side. The area of the adhesive layer 270 in contact with the lowermost component arranged on the upper substrate 215 side is increased. Therefore, in the organic light emitting diode display 200 according to the embodiment of the present invention, the contact area of the adhesive layer 270 is increased to maintain the adhesive force of the adhesive layer 270 even when the OLED display 200 is bent or folded .

In the OLED display 200 according to an exemplary embodiment of the present invention, a level difference compensating pattern 280 formed on the lower substrate 210 and a plurality of grooves 230 formed on the upper overcoat layer 260 (261) correspond to each other. That is, the level difference compensating pattern 280 and the groove 261 of the upper overcoat layer 260 are arranged to overlap. Therefore, in the organic light emitting diode display 200 according to the embodiment of the present invention, the stress that may occur when bending or folding the OLED display 200 can be minimized.

In some embodiments, a buffer layer may be formed between the lower substrate 210 and the thin film transistor 220. The buffer layer is an insulating layer for protecting the thin film transistor 220 from moisture or oxygen that can penetrate through the lower substrate 210, and may be made of an inorganic material such as silicon nitride or silicon oxide. The buffer layer is formed in the display area DA and the non-display area NA, so that a buffer layer can be formed between the substrate and the gate insulating layer 231 in the non-display area NA.

In some embodiments, a passivation layer may be formed to cover the thin film transistor 220 and the wiring 229. The passivation layer may be made of an inorganic material such as silicon nitride or silicon oxide as an insulating layer for protecting the thin film transistor 220 from moisture or oxygen that can penetrate from the top of the thin film transistor 220 to the thin film transistor 220 . The passivation layer may be formed in the display area DA and the non-display area NA and formed on the interlayer insulating layer 232 in the non-display area NA. Accordingly, the lower overcoat layer 233 and the level difference compensating pattern 280 can be formed on the passivation layer.

In some embodiments, the encapsulant layer 235 is formed between the bottom overcoat layer 233 and the first level difference compensating pattern 281 by either a buffer layer, a gate insulating layer 231, an interlayer insulating layer 232 and a passivation layer . That is, at least one of the buffer layer, the gate insulating layer 231, the interlayer insulating layer 232, and the passivation layer may be included in the organic light emitting diode display 200, and the uppermost layer and the sealing layer 235 ). The gate insulating layer 231, the interlayer insulating layer 232 and the passivation layer among the buffer layer, the gate insulating layer 231, the interlayer insulating layer 232 and the passivation layer are included in the organic light emitting display 200 The uppermost passivation layer can be in contact with the sealing layer 235.

In some embodiments, the end of the level difference compensating pattern 280 may be flush with the end of the lower substrate 210. That is, the step difference compensation pattern 280 may be exposed on the side surface of the OLED display 200. At this time, when the step difference compensation pattern 280 is made of an organic material, penetration of moisture or oxygen through the step difference compensation pattern 280 may be easy. However, since the sealing layer 235 made of an inorganic material is in contact with the interlayer insulating layer 232 made of an inorganic material between the lower overcoat layer 233 and the level difference compensating pattern 280, the penetration of moisture or oxygen through the organic material is blocked .

In some embodiments, a color filter may be disposed on the lower surface of the lower substrate 210. That is, a color filter may be disposed on the lower surface of the lower substrate 210 to convert the white light emitted from the organic light emitting layer 242 into light of a different color. In this case, the upper overcoat layer 260 may be arranged to planarize the lower portion of the color filter in the display area DA, and may include a groove 261 corresponding to the level difference compensation pattern 280 in the non-display area NA have.

4 is a schematic cross-sectional view illustrating an OLED display according to another embodiment of the present invention. The organic light emitting diode display 400 shown in FIG. 4 differs from the OLED display 200 shown in FIG. 2 and FIG. 3 in that the organic light emitting layer 442 and the step difference compensation pattern 480 are different, And the other components are substantially the same, so redundant description will be omitted.

Referring to FIG. 4, the organic light emitting layer 442 of the organic light emitting device 440 may be formed in a space defined by the bank layer 234. That is, the organic light emitting layer 442 may be formed separately for each sub-pixel region. In this case, the organic luminescent layer 442 may be one of a red organic luminescent layer, a green organic luminescent layer, and a blue organic luminescent layer.

A mask may be used to form the organic light emitting layer 442 for each sub-pixel region. Specifically, the organic luminescent layer 442 can be formed by depositing an organic luminescent material after disposing a mask having an open portion corresponding to each sub pixel region on the bank layer 234 in close proximity. When the organic luminescent layer 442 is formed using a mask, a spacer 437 for supporting the mask may be used. A spacer 437 is formed on the bank layer 234 as shown in FIG.

The level difference compensating pattern 480 includes a first level compensating pattern 281, a second level compensating pattern 282 and a third level compensating pattern 483. The first level difference compensating pattern 281 is formed of the same material as the lower overcoating layer 233 and the second level compensating pattern 282 is formed of the same material as the bank layer 234. [ The third step compensation pattern 483 is formed of the same material as the spacer 437. Further, the third step compensation pattern 483 may be formed to have the same height as the spacer 437. [ In order to minimize the deformation of the shape of the third step compensation pattern 483 when the OLED display 400 is attached or the bending or folding of the OLED display 400, the third step compensation pattern 483 The area of the upper surface of the first level difference compensating pattern 281 may be larger than the area of the lower surface of the second level compensating pattern 282. [

In the OLED display 400 according to another embodiment of the present invention, when the spacer 437 is used to form the organic light emitting layer 442, the step compensation pattern 480 may be formed of the same material as the spacer 437 And further includes a three-level difference compensation pattern 483. 4, the third-order compensating pattern 483 is formed on the second-order compensating pattern 282, so that the step compensating pattern 480 has a step difference between the upper substrate 215 and the lower substrate 210, Can be further reduced. In addition, as the third level compensating pattern 483 is formed, the contact area of the adhesive layer 270 in contact with the sealing layer 435 can be further increased, thereby enhancing the adhesive force of the adhesive layer 270.

5 to 7 are schematic plan views for explaining the shape of a level difference compensation pattern of an organic light emitting display according to various embodiments of the present invention. 5 to 7, only the lower substrates 510, 610, and 710 and the step difference compensation patterns 580, 680, and 780 are schematically shown for convenience of explanation. Sectional shape and material of the level difference compensating patterns 580, 680 and 780 shown in Figs. 5 to 7 may be the same as one of the level compensating patterns 280 and 480 shown in Figs. 3 and 4, 7 to 7, the shape of the step difference compensation patterns 580, 680, 780 on the plane will be described.

5, the OLED display 500 may be configured to be folded in a specific direction. For example, the OLED display 500 may be configured to be folded in one specific direction during manufacture.

The OLED display 500 may be configured to be folded in a first direction. The fact that the organic light emitting diode display 500 is folded in the first direction means that one end of the OLED display 500 which overlaps with a virtual straight line parallel to the first direction overlaps a virtual straight line parallel to the first direction Means that it is folded toward the other end of the OLED display 500. For example, in the organic light emitting diode display 500 shown in FIG. 5, the organic light emitting display 500 is folded in the first direction when the organic light emitting display 500 having the pad region TA is disposed The upper end thereof is folded toward the lower end of the organic light emitting display device 500 or the lower end of the organic light emitting display device 500 is folded toward the upper end of the organic light emitting display device 500. [

Referring to FIG. 5, the level difference compensation pattern 580 includes one or more line patterns. Specifically, the level difference compensation pattern 580 includes at least one line pattern extending in a second direction different from the first direction in which the OLED display 500 is folded. When the organic light emitting display 500 is folded in the first direction, the step difference compensation pattern 580 disposed on the lower substrate 510 is subjected to a tensile force. Particularly, when the step difference compensation pattern 580 extends in the same direction as the first direction, the OLED display 500 receives the largest tensile force at the time of folding. Therefore, the line pattern of the level difference compensating pattern 580 is formed to extend in the second direction, which is different from the first direction, so that the tensile force received by the level difference compensating pattern 580 is reduced, Peeling of the substrate 510, the adhesive layer, the upper substrate and the like can be minimized. In particular, when the step difference compensating pattern 580 is formed to extend in the second direction perpendicular to the first direction, the tensile force received by the step difference compensating pattern 580 can be minimized.

Next, referring to FIG. 6, the OLED display 600 may be configured to be folded in a second direction. In this case, the level difference compensation pattern 680 may include one or more line patterns extending in a first direction different from the second direction in which the OLED display 600 is folded. Accordingly, when folding the organic light emitting display 600, the tensile force received by the level difference compensating pattern 680 is reduced, and the peeling of the lower substrate 610, the adhesive layer, the upper substrate, etc. of the organic light emitting display 600 is minimized .

Although the line patterns of the level difference compensation patterns 580 and 680 are shown as being not formed in the non-display area NA between the pad area TA and the display area DA in FIGS. 5 and 6, And 680 are also formed in the non-display area NA between the pad area TA and the display area DA so that the level difference compensation patterns 580 and 680 may be arranged to surround the display area DA have.

5 and 6, the level difference compensating patterns 580 and 680 are shown as extending straight. However, the level compensating patterns 580 and 680 may have various shapes such as a zigzag shape, a sinusoidal shape, and the like.

Next, referring to FIG. 7, the level difference compensation pattern 780 may include a plurality of dot patterns separated from each other in the non-display area NA. When the OLED display 700 is folded in the direction in which the level difference compensating pattern 780 includes the line pattern and the line pattern extends, the line pattern of the level compensating pattern 780 is subjected to the maximum tensile force. That is, when the level difference compensating pattern 780 is formed to have a line shape, the tensile force received by the line pattern of the level difference compensating pattern 780 does not decrease with respect to a specific direction. For example, when the level difference compensating pattern 780 includes a line pattern extending in the first direction and the OLED display 700 is folded in the first direction, the tensile force received by the level difference compensating pattern 780 is not reduced . 7, when the step difference compensation pattern 780 is configured to include a dot pattern, the tensile force received by the step difference compensation pattern 780 does not depend on the folding direction of the organic light emitting display 700, . Accordingly, the OLED display 700 can be configured to be foldable in all directions. That is, the folding direction of the organic light emitting display 700 is not defined in advance, and the user can fold the organic light emitting display 700 in any direction.

Further, a plurality of dot patterns of the level difference compensation pattern 780 can be randomly arranged in the non-display area NA. Accordingly, a crack may be generated at the outermost portion of the organic light emitting diode display 700, and progressive cracks proceeding into the organic light emitting display 700 may be stopped in the dot pattern of the step difference compensation pattern 780 randomly arranged . Therefore, penetration of moisture or oxygen from the outside of the OLED display 700 can be additionally blocked.

8 is a flowchart illustrating a method of manufacturing an organic light emitting display according to an embodiment of the present invention. 9A to 9H are cross-sectional views illustrating a method of manufacturing an organic light emitting display according to an embodiment of the present invention. 9A to 9H are process cross-sectional views for manufacturing the organic light emitting diode display 200 shown in FIGS. 2 and 3, wherein a redundant description of the parts described with reference to FIGS. 2 and 3 is omitted do.

First, a sub-substrate 990 is defined in which a plurality of panel regions having a display area DA and a non-display area NA surrounding the display area DA are defined (S80).

Referring to FIG. 9A, a first panel area PA1 and a second panel area PA2 are defined on the lower substrate 990. Each of the first panel area PA1 and the second panel area PA2 has a display area DA and a non-display area NA surrounding the display area DA. Each of the first panel area PA1 and the second panel area PA2 may have a pad area TA formed on one side of the non-display area NA. In FIG. 7A, two panel regions are illustrated as being defined in the lower substrate 990 for convenience of explanation. However, the number of panel regions defined in the lower substrate 990 is not limited thereto.

Subsequently, a thin film transistor 920 is formed in the display region DA (S81), an organic light emitting element 940 is formed on the thin film transistor 920 in the display region DA (S82), and a non-display region NA) is formed (step S83). In Fig. 8, although step S83 is shown as being performed after step S81 and step S82, step S83 can be performed simultaneously with step S81 and step S82, respectively.

Referring to FIG. 9B, a thin film transistor 920 is formed on a lower substrate 990 supported by a supporting substrate 919. The thin film transistor 920 is formed in the display area DA of the first panel area PA1 and the second panel area PA2. The gate insulating layer 931 and the interlayer insulating layer 932 are formed in the display area DA and the non-display area NA of the first panel area PA1 and the second panel area PA2 when the thin film transistor 920 is formed. . The wiring 929 is formed in the non-display area NA adjacent to the display area DA when the thin film transistor 920 is formed.

After forming the thin film transistor 920, a lower overcoat layer 933 for planarizing the upper portion of the thin film transistor 920 is formed. When the lower overcoat layer 933 is formed, a first level difference compensation pattern 981 may be formed together. Specifically, a material for a lower overcoat layer is disposed on a lower substrate 990 on which a thin film transistor 920 is formed, and a material for a lower overcoat layer is patterned. In this manner, a lower overcoat layer 933, (981) can be formed at the same time. Accordingly, the first level difference compensation pattern 981 can be formed during the manufacturing process of the organic light emitting device 940 without any additional process.

9C, organic light emitting devices 940 are formed on the lower overcoat layer 933 in the display areas DA of the first panel area PA1 and the second panel area PA2. A bank layer 934 defining a sub pixel region is formed when the organic light emitting element 940 is formed. When the bank layer 934 is formed, a second level difference compensation pattern 982 may be formed together. More specifically, the bank layer 934 and the second level difference compensating pattern 982 are formed simultaneously by arranging the bank layer material on the lower substrate 990 on which the anode 941 is formed and patterning the material for the bank layer . Accordingly, the second level difference compensation pattern 982 can be formed during the manufacturing process of the organic light emitting device 940 without any additional process.

Although not shown in FIG. 9C, the level difference compensation pattern 980 including the first level difference compensation pattern 981 and the second level difference compensation pattern 982 includes a plurality of dot patterns separated from each other in the non-display area NA And may be formed in a plurality of line patterns. The shape of the level difference compensating pattern 980 on the plane is substantially the same as the shape of the level difference compensating patterns 580, 680 and 780 shown in FIGS. 5 to 7, and thus redundant description will be omitted.

Subsequently, an encapsulating layer 935 is formed on the organic light emitting element 940 in the display area DA and on the level difference compensating pattern 980 in the non-display area NA (S84).

9D, an encapsulation layer 935 is formed in the display area DA and the non-display area NA of the first panel area PA1 and the second panel area PA2. The sealing layer 935 is formed on the entire lower substrate 990. The encapsulation layer 935 is formed to cover the level difference compensation pattern 980 in the non-display area NA. The encapsulation layer 935 is formed in contact with the interlayer insulating layer 932 between the lower overcoat layer 933 and the level difference compensating pattern 980.

Although not shown in FIG. 9D, at least one of the buffer layer and the passivation layer may be formed in the display area DA and the non-display area NA, as described above with reference to FIGS. 2 and 3, 935 may be in contact with any one of the buffer layer, the gate insulating layer 931, the interlayer insulating layer 932, and the passivation layer between the lower overcoat layer 933 and the first level difference compensating pattern 981.

Subsequently, an upper overcoat layer 960 for flattening the lower portion of the upper main substrate 995 in the display area DA with at least one groove 961 or hole in the non-display area NA is formed on the upper main substrate 995 (S85). In Fig. 8, although step S85 is shown as being performed after steps S80 to S84, step S85 may be performed before or simultaneously with steps S80 to S84.

Referring to FIG. 9E, a barrier layer 936, a touch sensing portion 950, and an upper overcoat layer 960 are formed on the upper substrate 1005. That is, the barrier layer 936 is disposed on the lower surface of the upper main substrate 995, the touch sensing electrode 951 and the wiring 952 of the touch sensing unit 950 are disposed on the lower surface of the barrier layer 936, An upper overcoat layer 960 is disposed to cover the touch sensing portion 950. The upper overcoat layer 960 is disposed in both the display area DA and the non-display area NA.

The upper overcoat layer 960 flatens the lower portion of the upper main substrate 995 in the display area DA. Further, the upper overcoat layer 960 has at least one groove 961 in the non-display area NA. In FIG. 9E, the upper overcoat layer 960 has a groove 961, but the upper overcoat layer 960 may have a hole.

Subsequently, the upper and lower main substrate 995 and the lower main substrate 990 are bonded together using the adhesive layer 970 (S86).

Referring to FIG. 9F, an adhesive layer 970 is disposed on the upper main substrate 995. The adhesive layer 970 is disposed on both the display area DA and the non-display area NA of the upper main substrate 995 and fills the grooves 961 of the upper overcoat layer 960.

9G, the upper and lower main substrate units 995 and 990 are bonded together in such a manner that the upper and lower main substrate units 995 and 990 having the adhesive layer 970 are adhered to each other. The adhesive layer 970 can be cured in such a manner that heat and / or pressure is applied to the upper raw substrate 995 after the upper raw substrate 995 on which the adhesive layer 970 is disposed and the lower raw substrate 990 are bonded together .

Subsequently, a plurality of panel regions are separated along the boundaries of the plurality of panel regions (S87).

9G and 9H, the upper and lower main substrate 995 and the lower main substrate 990 joined together by the adhesive layer 970 are separated into a first panel area PA1 and a second panel area PA2. Specifically, the first panel area PA1 and the second panel area PA2 are formed by cutting the boundary between the first panel area PA1 and the second panel area PA2 using a laser cutting process or a mechanical scribing process. ) Can be separated.

After the first panel area PA1 and the second panel area PA2 are separated, the module process is performed, and the supporting substrate 919 supporting the lower substrate 910 is removed using a laser or the like, A back plate can be attached to the substrate 910. [

In the method of manufacturing an organic light emitting display according to an embodiment of the present invention, a level difference compensation pattern 980 may be formed in a manufacturing process of insulating layers formed in the display area DA without using any additional process. Accordingly, the yield, lifetime, and reliability of the OLED display 900 may be improved, and additional processing time, process cost, and the like may not be generated.

Although the embodiments of the present invention have been described in detail with reference to the accompanying drawings, it is to be understood that the present invention is not limited to those embodiments and various changes and modifications may be made without departing from the scope of the present invention. . Therefore, the embodiments disclosed in the present invention are intended to illustrate rather than limit the scope of the present invention, and the scope of the technical idea of the present invention is not limited by these embodiments. The scope of protection of the present invention should be construed according to the following claims, and all technical ideas within the scope of equivalents should be construed as falling within the scope of the present invention.

210, 510, 610, 710, 910:
215, 915: upper substrate
119, 919: Support substrate
120, 220, 920: thin film transistors
221: active layer
222: gate electrode
223: source electrode
224: drain electrode
129, 229, 929: Wiring
131, 231, 931: gate insulating layer
132, 232, and 932: an interlayer insulating layer
133, 233, 933: Lower overcoat layer
134, 234, 934: bank layer
135, 235, 435, 935: seal layer
136, 236, 936: barrier layer
437: Spacer
140, 240, 440, 940: organic light emitting element
241: anode
242, 442: organic light emitting layer
243: cathode
244: Reflective layer
245: transparent conductive layer
250, 950: Touch sensing unit
251, 951: touch sensing electrode
252, 952: Wiring
260, 960: upper overcoat layer
261, 961: Home
170, 270, 970: adhesive layer
280, 480, 580, 680, 780, 980: step difference compensation pattern
281, 981: First-order compensation pattern
282, 982: 2nd order compensation pattern
483: 3rd order compensation pattern
190, 990: Substrate substrate
195, 995: upper main substrate
200, 400, 500, 600, 700, 900: organic light emitting display
S: Cemented space
DA: Display area
NA: non-display area
TA: pad area
PA1: first panel area
PA2: second panel area

Claims (19)

A lower substrate having a display region and a non-display region surrounding the display region;
A thin film transistor arranged in the display region;
An organic light emitting element disposed on the thin film transistor in the display region;
A sealing layer disposed on both the display region and the non-display region, the sealing layer disposed on the organic light emitting element;
A step difference compensation pattern which is disposed between the lower substrate and the sealing layer in the non-display area and is made of an insulating material;
An upper substrate facing the lower substrate;
An adhesive layer for bonding the upper substrate and the lower substrate; And
And an upper overcoat layer disposed between the upper substrate and the adhesive layer and having at least one groove or hole in the non-display area and planarizing the lower part of the upper substrate in the display area. Display device. The method according to claim 1,
A lower overcoat layer disposed on the display region to flatten the upper portion of the thin film transistor; And
Further comprising a bank layer disposed on the lower overcoat layer and defining a sub pixel region in the display region,
Wherein the step difference compensation pattern includes a first step compensation pattern made of the same material as the lower overcoat layer and a second step compensation pattern made of the same material as the bank layer. 3. The method of claim 2,
Further comprising at least one of a buffer layer, a gate insulating layer, an interlayer insulating layer, and a passivation layer disposed in the display region and the non-display region,
Wherein the sealing layer is in contact with any one of the buffer layer, the gate insulating layer, the interlayer insulating layer, and the passivation layer between the lower overcoat layer and the first step difference compensation pattern. The method of claim 3,
Wherein an end of the step difference compensation pattern is flush with an end of the lower substrate. 3. The method of claim 2,
Further comprising a spacer disposed on the bank layer,
Wherein the step difference compensation pattern further comprises a third step difference compensation pattern made of the same material as the spacer. The method according to claim 1,
Wherein the groove or the hole of the upper overcoat layer overlaps the step difference compensation pattern. The method according to claim 1,
Wherein the upper substrate and the lower substrate are made of a material having flexibility. 8. The method of claim 7,
Wherein the organic light emitting display device is configured to be folded in a first direction,
Wherein the step difference compensation pattern includes one or more line patterns extending in a second direction different from the first direction. 9. The method of claim 8,
Wherein the first direction and the second direction are perpendicular to each other. The method according to claim 1,
Wherein the step difference compensation pattern includes a plurality of dot patterns separated from each other in the non-display area. The method according to claim 1,
Further comprising a color filter or a touch sensing unit disposed between the upper substrate and the upper overcoat layer,
Wherein the upper overcoat layer flattens the lower part of the color filter or the lower part of the touch sensing part in the display area. Providing a sub-director board having a plurality of panel areas defined therein having a display area and a non-display area surrounding the display area;
Forming a thin film transistor in the display region;
Forming an organic light emitting element on the thin film transistor in the display region;
Forming a step difference compensation pattern made of an insulating material in the non-display area;
Forming an encapsulation layer on the organic light emitting element of the display area and on the level difference compensation pattern of the non-display area;
Forming an upper overcoat layer on the lower portion of the upper substrate to flatten the lower portion of the upper substrate in the display region, the substrate having at least one groove or hole in the non-display region;
Attaching the upper and lower laminates to each other using an adhesive layer; And
And separating each of the plurality of panel regions along a boundary of the plurality of panel regions. 13. The method of claim 12,
Forming a lower overcoat layer on the display region to flatten the upper portion of the thin film transistor; And
Forming a bank layer defining a sub pixel region on the lower overcoat layer in the display region,
Wherein forming the step difference compensation pattern comprises:
Forming a first level difference compensation pattern with the same material as the lower overcoat layer; And
And forming a second level difference compensation pattern using the same material as the bank layer. 14. The method of claim 13,
The step of forming the lower overcoat layer and the step of forming the first level difference compensation pattern are performed simultaneously,
Wherein the step of forming the bank layer and the step of forming the second level difference compensating pattern are simultaneously performed. 14. The method of claim 13,
Further comprising forming at least one of a buffer layer, a gate insulating layer, an interlayer insulating layer, and a passivation layer in the display region and the non-display region,
The step of forming the encapsulation layer may include forming the encapsulation layer so that any one of the buffer layer, the gate insulation layer, the interlayer insulation layer, and the passivation layer is in contact with the encapsulation layer between the lower overcoat layer and the first level difference compensation pattern. And forming the organic light emitting display device. 14. The method of claim 13,
Further comprising forming a spacer on the bank layer,
Wherein the step of forming the step difference compensation pattern further comprises forming an upper third step compensation pattern with the same material as the spacer. 17. The method of claim 16,
Wherein the step of forming the spacer and the step of forming the third step compensation pattern are simultaneously performed. 13. The method of claim 12,
Wherein the groove or the hole of the upper overcoat layer overlaps the step difference compensation pattern. 13. The method of claim 12,
Wherein the step of forming the step difference compensation pattern includes forming a plurality of dot patterns or a plurality of line patterns separated from each other in the non-display area.

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