KR20180025058A - Organic light emitting display device - Google Patents

Abstract

An organic light emitting display device is provided. The organic light emitting display device includes a lower substrate having an active region and an inactive region, an organic light emitting element disposed in the active region, one or more dams disposed in the inactive region, a first inorganic layer disposed in the active region and the inactive region so as to cover the organic light emitting element and the one or more dams, an organic protective film covering the active region on the first inorganic layer, a second inorganic layer disposed to cover the organic protective film and touching the first inorganic layer in the inactive region, and a delamination prevention pattern disposed between the first inorganic layer and the second inorganic layer outside the one or more dams. It is possible to prevent the delamination of a first sealing layer and a second sealing layer.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to an organic light-

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to an organic light emitting diode (OLED) display, and more particularly, to an OLED display in which peeling phenomenon of a sealing portion is minimized.

As the era of informationization becomes full-scale, the field of display devices for visually displaying electrical information signals is rapidly developing. Accordingly, studies are being continued to develop performance such as thinning, lightening, and low power consumption for various types of flat panel display devices. Typical examples of such flat panel display devices include a liquid crystal display device (LCD), a plasma display panel (PDP), a field emission display (FED) An electro-wetting display device (EWD), and an organic light emitting display device (OLED).

In particular, the organic light emitting display device is a self light emitting display device, and unlike a liquid crystal display device, a separate light source is not required, and thus it can be manufactured in a light and thin shape. Further, the organic light emitting display device is advantageous not only in power consumption in accordance with low voltage driving but also in response speed, viewing angle, and contrast ratio, and is being studied as a next generation display. However, despite these advantages, the organic light emitting display device has a drawback that it is very vulnerable to moisture and oxygen. Therefore, it is very important to seal the organic light emitting element in the manufacturing process of the organic light emitting display device to block moisture and penetration from the outside of the organic light emitting display device.

Accordingly, the organic light emitting diode displays an encapsulation layer formed by alternately laminating an inorganic film and an organic film on the organic light emitting device to effectively block penetration of moisture and oxygen.

The general encapsulation layer includes a first encapsulation layer made of an inorganic film on the organic light emitting element, a foreign material compensation layer made of an organic film on the first encapsulation layer, and a second encapsulation layer made of an inorganic film on the foreign material compensation layer, Layer.

In recent organic light emitting display devices, since the foreign substance compensating layer in the encapsulating layer can be a moisture permeating path for moisture and oxygen from the outside, in order to prevent this, the structure of the encapsulating layer disposed in the outermost region of the lower substrate, And the second sealing layer are laminated.

On the sealing layer, cracks are likely to be generated in the sealing layer during the manufacturing process of the organic light emitting display, so that a protective film for protecting the sealing layer is disposed on the sealing layer. Such a protective film is removed during the process of the organic light emitting display device. However, when the protective film is removed, the first sealing layer and the second sealing layer disposed in the outermost region of the lower substrate are peeled off due to strong adhesive force of the protective film .

Accordingly, a problem to be solved by the present invention is to prevent the first sealing layer and the second sealing layer from being peeled off through the peeling prevention layer between the first sealing layer and the second sealing layer disposed in the outermost region of the lower substrate And an organic light emitting display device.

Another problem to be solved by the present invention is that a plurality of adhesion improving patterns are disposed between the first sealing layer and the second sealing layer disposed in the outermost region of the lower substrate to bond the first sealing layer and the second sealing layer And an organic light emitting display device.

The problems of the present invention are not limited to the above-mentioned problems, and other problems not mentioned can be clearly understood by those skilled in the art from the following description.

According to an aspect of the present invention, there is provided an OLED display including a lower substrate having an active region and an inactive region, an organic light emitting diode disposed in the active region, A first inorganic layer disposed on the active region and the nonactive region so as to cover the dam, the organic light emitting element and the at least one dam, an organic passivation film covering the active region on the first inorganic layer, A second inorganic layer in contact with the first inorganic layer in the non-active region, and a peel prevention pattern disposed between the first inorganic layer and the second inorganic layer outside the at least one dam.

An organic light emitting display according to another embodiment of the present invention includes a lower substrate, an organic light emitting element disposed on the lower substrate, a first sealing layer, a second sealing layer, and a second sealing layer disposed on the organic light emitting element to protect the organic light emitting element, An encapsulation portion including a foreign material compensation layer surrounded by the first encapsulation layer and the second encapsulation layer, at least one dam disposed outside the organic light emitting element on the lower substrate and configured to prevent the flow of the foreign material compensation layer, And an adhesion improving member arranged between the first sealing layer and the second sealing layer outside the dam to improve the adhesion between the first sealing layer and the second sealing layer.

The details of other embodiments are included in the detailed description and drawings.

The present invention provides an organic light emitting display device capable of enhancing the adhesive force between the first sealing layer and the second sealing layer in the edge region of the lower substrate.

The effects according to the present invention are not limited by the contents exemplified above, and more various effects are included in the specification.

1 is a plan view schematically showing an organic light emitting display according to an embodiment of the present invention.
2 is a cross-sectional view schematically showing the organic light emitting display device taken along the line II-II 'in FIG.
3A and 3B are cross-sectional views illustrating a comparative example of an organic light emitting display according to an embodiment of the present invention.
4 is a cross-sectional view illustrating a method of manufacturing an organic light emitting display according to an embodiment of the present invention.
5 is a plan view schematically illustrating an OLED display according to another embodiment of the present invention.
6 is a cross-sectional view schematically showing an organic light emitting display device taken along line VI-VI 'of FIG.
7 is a cross-sectional view illustrating a method of manufacturing an OLED display device according to another embodiment of the present invention.

BRIEF DESCRIPTION OF THE DRAWINGS The advantages and features of the present invention, and the manner of achieving them, will be apparent from and elucidated with reference to the embodiments described hereinafter in conjunction with the accompanying drawings. The present invention may, however, be embodied in many different forms and should not be construed as being limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. Is provided to fully convey the scope of the invention to those skilled in the art, and the invention is only defined by the scope of the claims.

The shapes, sizes, ratios, angles, numbers, and the like disclosed in the drawings for describing the embodiments of the present invention are illustrative, and thus the present invention is not limited thereto. Like reference numerals refer to like elements throughout the specification. In the following description, well-known functions or constructions are not described in detail since they would obscure the invention in unnecessary detail. Where the terms "comprises", "having", "done", and the like are used in this specification, other portions may be added unless "only" is used. Unless the context clearly dictates otherwise, including the plural unless the context clearly dictates otherwise.

In interpreting the constituent elements, it is construed to include the error range even if there is no separate description.

In the case of a description of the positional relationship, for example, if the positional relationship between two parts is described as 'on', 'on top', 'under', and 'next to' Or " direct " is not used, one or more other portions may be located between the two portions.

An element or layer is referred to as being another element or layer "on ", including both intervening layers or other elements directly on or in between.

Although the first, second, etc. are used to describe various components, these components are not limited by these terms. These terms are used only to distinguish one component from another. Therefore, the first component mentioned below may be the second component within the technical spirit of the present invention.

Like reference numerals refer to like elements throughout the specification.

The sizes and thicknesses of the individual components shown in the figures are shown for convenience of explanation and the present invention is not necessarily limited to the size and thickness of the components shown.

It is to be understood that each of the features of the various embodiments of the present invention may be combined or combined with each other partially or entirely and technically various interlocking and driving is possible as will be appreciated by those skilled in the art, It may be possible to cooperate with each other in association.

Various embodiments of the present invention will now be described in detail with reference to the accompanying drawings.

1 is a plan view schematically showing an organic light emitting display according to an embodiment of the present invention. 2 is a cross-sectional view schematically showing the organic light emitting display device taken along the line II-II 'in FIG. 3A and 3B are views for explaining a comparative example of an organic light emitting display according to an embodiment of the present invention.

1, a lower substrate 110 of an OLED display 100 according to an exemplary embodiment of the present invention includes an active region AA, an inactive region NA, and a pad region PA . The active area AA is an area where an image is displayed and the nonactive area NA is an area surrounding the active area AA and the pad area PA is a region where the pad part of the organic light emitting diode display 100 is arranged And an integrated circuit or a flexible printed circuit board may be disposed in the pad area PA.

2, a thin film transistor (TFT) including an active layer 121, a gate electrode 122, a source electrode 123, and a drain electrode 124 is formed in an active region AA of a lower substrate 210, : TFT, 120) are arranged. Specifically, an active layer 121 is formed on the lower substrate 110, and a gate insulating layer 131 is formed on the active layer 121 to isolate the active layer 121 from the gate electrode 122 . A gate electrode 122 is formed on the gate insulating layer 131 so as to overlap with the active layer 121 and a first interlayer insulating layer 132 is formed on the gate electrode 122 and the gate insulating layer 131. A source electrode 123 and a drain electrode 124 are formed on the first interlayer insulating layer 132 and the source electrode 123 and the drain electrode 124 are electrically connected to the active layer 121. Although the thin film transistor 120 is described as having a coplanar structure in the embodiment of the present invention, the present invention is not limited thereto, and various thin film transistors 120 ) Can be used.

A second interlayer insulating layer 133 is disposed on the thin film transistor 120. A planarization layer 134 is disposed on the second interlayer insulating layer 133. [ The second interlayer insulating layer 133 and the planarization layer 134 include a contact hole for electrically connecting the thin film transistor 120 and the anode 141 of the organic light emitting diode 140.

The organic light emitting diode 140 is disposed on the planarization layer 134. The organic light emitting device 140 includes an anode 141 on the planarization layer 134, an organic light emitting layer 142 on the anode 141, and a cathode 143 on the organic light emitting layer 142.

The anode 141 supplies holes to the organic light emitting layer 142 and may be made of a conductive material having a high work function. Here, the anode 141 may further include a reflective layer (not shown) for reflecting the light toward the upper side when the organic light emitting diode display 100 is a top emission structure. In an embodiment of the present invention, the reflective layer is included in the anode 141. However, the reflective layer may be defined separately from the anode 141. [

The organic light emitting layer 142 may be one of a red organic light emitting layer, a green organic light emitting layer, a blue organic light emitting layer, and a white organic light emitting layer. In this case, when the organic light emitting layer 142 is formed of a white organic light emitting layer, a color filter may be further disposed on the organic light emitting element 140.

The cathode 143 may supply electrons to the organic light emitting layer 142 and may be made of a conductive material having a low work function.

The bank layer 135 is disposed on the planarization layer 134 so as to cover a part of the anode 141. The bank layer 135 defines a sub pixel region in a manner that distinguishes adjacent sub pixel regions in the active region AA. Further, the bank layer 135 may define a pixel region composed of a plurality of pixel regions. The bank layer 135 is extended not only to the active area AA but also to a part of the active area AA and a part of the inactive area NA adjacent thereto.

On the bank layer 135, spacers 136 are disposed. The spacers 136 buffer the void space between the lower substrate 110 and the upper substrate (not shown) on the lower substrate 110 to minimize damage to the OLED display 100 from external impacts . The spacer 136 may be formed of an insulating material.

The sealing portion 150 is disposed on the entire surface of the active area AA. The sealing portion 150 may be made of a transparent material so that light emitted from the organic light emitting diode 140 is transmitted. The sealing portion 150 includes a first sealing layer 151, a foreign material compensation layer 152, and a second sealing layer 153.

The first sealing layer 151 and the second sealing layer 153 may be made of an inorganic material having transparency. For example, a material such as silicon nitride (SiNx), silicon oxide (SiOx), or aluminum oxide (AlxOy) may be used.

The foreign material compensation layer 152 is disposed between the first sealing layer 151 and the second sealing layer 153. The foreign material compensation layer 152 compensates for foreign particles or particles due to a crack (or breakage) that may be caused by the process of forming the first sealing layer 151 or the second sealing layer 152 . The foreign material compensation layer 152 may be made of an organic material having flow transparency. For example, an epoxy resin, an acrylic resin, or a material such as silicon oxycarbide (SiOC) may be used.

The sealing portion 150, the gate insulating layer 131, the first interlayer insulating layer 132 and the second interlayer insulating layer 133 on the lower substrate 110 are formed from the active region AA to the inactive region NA, As shown in FIG. At this time, the first sealing layer 151 and the second sealing layer 153 are disposed in contact with the edge region of the lower substrate 110.

At least one dam 160, a signal wiring 170 and an anti-peeling layer 180 are disposed on the interlayer insulating layer 132 in the inactive region NA of the lower substrate 110.

One or more dams 160 are arranged to surround the active area AA, as shown in Fig. The at least one dam 160 must be formed to a region where the foreign material compensation layer 152 made of a flowable organic material is to be formed, that is, an inactive region NA close to the active region AA, Overflows beyond the region where the second electrode 152 should be formed. Accordingly, the at least one dam 160 may include a first dam 161 that primarily prevents the overflow of the foreign material compensation layer 152, and a second foreign matter compensation layer 152 that overflows the first dam 161 And a second dam 162 for preventing overflow.

The first dam 161 includes a first sub dam 161a disposed on the interlayer insulating layer 132 of the lower substrate 110 and a second sub dam 161b disposed on the first sub dam 161a . At this time, the first sub dam 161a is formed of the same material as the planarization layer 134, and may be formed when the planarization layer 134 is formed. The second sub dam 161b may be formed of the same material as the banks 135 and may be formed when the banks 135 are formed.

The second dam 162 is disposed apart from the first dam 161 and disposed closer to the outer region of the lower substrate 110 than the first dam 161. In other words, the second dam 162 is disposed closer to the end of the lower substrate 110 than the first dam 161 with respect to the end of the lower substrate 110. The second dam 162 may include a third sub dam 162a disposed on the interlayer insulating layer 132 and a fourth sub dam 162b disposed on the third sub dam 162a. The third sub dam 162a may be formed when the planarization layer 134 is formed of the same material as the planarization layer 134 in the same manner as the first sub dam 161a and the fourth sub dam 162b may be formed The banks 135 may be formed of the same material as that of the banks 135 in the same manner as the sub dams 161b.

The dam 160 may include only the first dam 161 and the second dam 162. However, the present invention is not limited to this, and the application amount of the foreign matter compensation layer 152 in the process And may consist of two or more dams.

Also, in one embodiment of the present invention, the at least one dam 160 is formed by stacking two layers such as the first sub dam 161a and the second sub dam 161b. However, the present invention is not limited thereto, But may be formed of only a single layer, or may be formed by stacking two or more layers.

Although one or more dams 160 may be formed of the same material as the planarization layer 134 and the banks 135 in the exemplary embodiment of the present invention, The banks 135 and the spacers 136 may be formed of the same material as that of the planarization layer 134, the banks 135 and the spacers 136. In the case where two or more layers are stacked, the planarization layer 134, 136). ≪ / RTI >

The signal wiring 170 is disposed on the first interlayer insulating layer 132 of the lower substrate 110. A second interlayer insulating layer 133 is disposed on the signal wiring 170 to insulate the signal wiring 170. The signal line 170 is disposed under one or more dams 160. The signal wiring 170 transmits a signal to a gate line or a data line arranged in the active area AA. In the present embodiment, the signal wiring 170 is described as being for transmitting a signal to the gate line or the data line arranged in the active area AA. However, the signal wiring 170 is not limited to this and the signal wiring 170 is configured to apply the VSS voltage VSS voltage wiring.

1, the peeling prevention layer 180, which is an adhesion improving member between the first sealing layer 151 and the second sealing layer 153 according to an embodiment of the present invention, Respectively. More specifically, the anti-peeling layer 180 is disposed in an edge area of the inactive area NA of the lower substrate 110, rather than one or more dams 160 arranged to surround the active area AA, As shown in Fig. In one embodiment of the present invention, the anti-peeling layer 180 is described as being disposed so as to surround the active area AA. However, the present invention is not limited thereto and may be arranged to surround at least a part of the active area AA. For example, assuming that the active area AA includes four sides, the anti-peeling layer 180 may be arranged to surround at least two sides along the removal direction of the protective film disposed on the sealing part 150 have.

3A, the first encapsulation layer 151 and the second encapsulation layer 153 are formed in the active area AA between the end of the lower substrate 110 and the second dam 162, And the first sealing layer 151 and the second sealing layer 153 are disposed so as to be in contact with each other. The reason why the first sealing layer 151 and the second sealing layer 153 are disposed in contact with each other in the edge region of the lower substrate 110 is that the foreign material compensation layer 152 is not excellent in the ability to delay moisture infiltration Moisture, and oxygen. Accordingly, when the first sealing layer 151 and the second sealing layer 153 are disposed in contact with each other at the edge region of the lower substrate 110, it is possible to directly remove moisture and oxygen from the external moisture and oxygen.

3A, after the encapsulation 150 is formed on the lower substrate 110, a first protective film (not shown) is formed to protect the organic light emitting display 100 having the encapsulation 150 formed thereon 310 and the second protective film 320 are attached. In particular, the second protective film 320 is a temporary protective film (TPF) and is attached to protect the OLED display 100 during the scribing process. This second protective film 320 is removed after the scribing process for the OLED display 100, as shown in FIG. 3A.

3B, between the first sealing layer 151 and the second sealing layer 153 disposed in contact with the edge region of the lower substrate 110, the strong adhesion of the second protective film 320 A crack may be caused. When the gap between the first encapsulation layer 151 and the second encapsulation layer 153 in the edge region of the lower substrate 110 is increased as described above, moisture between the first encapsulation layer 151 and the second encapsulation layer 153 And oxygen penetrate into the organic light emitting display device 100, thereby lowering the yield of the organic light emitting display device 100.

In order to solve such a problem, the OLED display 100 according to an embodiment of the present invention includes a first encapsulation layer 151 and a second encapsulation layer 153 disposed in the edge region of the lower substrate 100, The anti-peeling layer 180 made of an organic material is disposed between the first sealing layer 151 and the second sealing layer 153 to improve the adhesion of the anti- The anti-peeling layer 180 may be made of the same material as the foreign material compensation layer 152. That is, the anti-peeling layer 180 may be made of a material such as epoxy resin, acrylic resin, or silicon oxycarbide (SiOC), for example.

The organic light emitting diode display 100 according to an embodiment of the present invention can be manufactured by interposing the peeling prevention layer 180 between the first sealing layer 151 and the second sealing layer 153 in the edge region of the lower substrate 110 , The adhesion between the first sealing layer 151 and the second sealing layer 153 can be improved.

Accordingly, the organic light emitting diode display 100 according to the embodiment of the present invention can prevent the temporary protective film from being separated from the first encapsulation layer 151 and the second encapsulation layer 153 when the temporary protection film is removed after the scribing process. Can be minimized.

A method for manufacturing the anti-peeling layer 180 will be described in detail with reference to FIG.

4 is a cross-sectional view illustrating a method of manufacturing an organic light emitting display according to an embodiment of the present invention.

4, the anti-peeling layer 180 may be formed on the entire surface of the lower substrate 110 after the first encapsulation layer 151 is patterned in the patterning process of the foreign material compensation layer 152, And may be formed using an inkjet process. In more detail, a plurality of nozzles 410 for applying an organic material are disposed on the lower substrate 110 on which the first sealing layer 151 is formed. At this time, the active area AA on the lower substrate 110 among the plurality of nozzles 410 and a part of the nozzles 410 arranged on the area where the anti-peeling layer 180 is disposed among the inactive areas NA are opened open to apply the organic material. On the other hand, some of the plurality of nozzles 410 disposed on the area where at least one of the inactive areas NA on the lower substrate 110 is disposed is closed, Do not apply the material.

The organic light emitting diode display 100 according to an embodiment of the present invention includes a plurality of nozzles 410 that are turned off and a plurality of open nozzles 410 The amount of ink applied to the other open nozzles disposed on the region where the anti-peeling layer 180 is disposed on the inactive area NA of the light emitting element 410 is different. More specifically, the amount of ink applied in the nozzles turned off on the active area AA is greater than the amount of ink applied in the nozzles turned off on the inactive area AA. In particular, the amount of ink applied in the nozzles opened on the inactive area AA must be applied in such an amount that the edge area of the lower substrate 110 is not overflowed. Accordingly, the anti-peeling layer 180 according to an embodiment of the present invention may be formed to have a thickness smaller than the thickness of the foreign material compensation layer 152, as shown in FIG.

The organic light emitting diode display 100 according to an embodiment of the present invention includes an edge region of the inactive region NA of the lower substrate 110 and more specifically an edge region of the first encapsulation layer The peeling prevention layer 180 is interposed between the first sealing layer 151 and the second sealing layer 153 in a region where the first sealing layer 151 and the second sealing layer 153 are in contact with each other, Peeling between the first sealing layer 151 and the second sealing layer 153 due to the adhesive force of the film 300 can be prevented.

5 is a plan view schematically illustrating an OLED display according to another embodiment of the present invention. 6 is a cross-sectional view schematically showing an organic light emitting display device taken along line VI-VI 'of FIG.

5 and 6, the organic light emitting diode display 500 according to another embodiment of the present invention includes the organic light emitting diode display 100 according to an embodiment of the present invention shown in FIGS. 1 and 2, The formation patterns of the blocking layers 180 and 580 are different, and the other structures are the same. Accordingly, a description of the overlapped structure is omitted, and only the anti-peeling layer 580 is described.

5 and 6, the anti-peeling layer 580 of the organic light emitting diode display 500 according to another embodiment of the present invention includes a plurality of adhesion improving layers 580 in an outer region of at least one dam 160 on the lower substrate 110, Pattern 580. < / RTI >

The plurality of adhesive force improving patterns 580 are disposed between the first sealing layer 151 and the second sealing layer 153 to improve the adhesive force between the first sealing layer 151 and the second sealing layer 153.

As shown in FIG. 5, the plurality of adhesion improvement patterns 580 may be arranged so that each of the adhesion improvement patterns 580 is spaced apart from each other and has a zigzag shape. At this time, the plurality of adhesion improving patterns 580 are not longer than the ends of the first sealing layer 151 and the second sealing layer 153, as shown in Fig. That is, the plurality of adhesive force improving patterns 580 are arranged so as not to overflow the ends of the first sealing layer 151 and the second sealing layer 153.

The plurality of adhesion improving patterns 580 may be made of an organic material, and in particular, may be made of the same material as the foreign material compensation layer 152.

The plurality of adhesive force improving patterns 580 according to another embodiment of the present invention may be formed through an inkjet process.

The OLED display 500 according to another embodiment of the present invention is different from the OLED display 100 according to an embodiment of the present invention in that a plurality of The adhesive strength improving pattern 580 strengthens the adhesive force between the first sealing layer 151 and the second sealing layer 153 to improve the adhesion strength between the peeling prevention layer 180 of one embodiment and the end of the lower substrate 110 It is possible to more easily prevent overflow of the material constituting the adhesion improving pattern 580. FIG. 7 is a cross-sectional view illustrating a method of manufacturing an organic light emitting display according to another embodiment of the present invention.

Comparing FIG. 7 with the process of FIG. 4, a plurality of nozzles 710 are arranged on a region where a plurality of adhesion improvement patterns 580 are disposed. More specifically, in FIG. 4, since the anti-peeling layer 180 formed of one layer is formed instead of the plurality of adhesion improving patterns 580, a plurality of anti-peeling layers 180 disposed on the inactive area NA on which the anti- The nozzles 410 of all the nozzles 410 are open.

7, the organic light emitting diode display 500 according to another embodiment of the present invention includes a plurality of nozzles (not shown) on an inactive area NA on which a plurality of adhesion improving patterns 580 are disposed, 710) are opened and some of them are closed. Accordingly, the OLED display 500 according to another exemplary embodiment of the present invention includes a plurality of adhesion improving patterns (for example, a plurality of adhesion improving patterns) for improving the adhesion between the first sealing layer 151 and the second sealing layer 153 580 are formed, it is easy to control the organic materials of the plurality of adhesion improving patterns 580. [

The organic light emitting diode display 500 according to another embodiment of the present invention may include a first encapsulant disposed in an outermost region of the lower substrate 110, that is, an area between the second dam 162 and the lower end of the lower substrate 110, The adhesion between the first sealing layer 151 and the second sealing layer 153 can be improved by disposing a plurality of adhesion improving patterns 580 between the layer 151 and the second sealing layer 153.

An organic light emitting display according to an embodiment of the present invention can be described as follows.

An organic light emitting display according to an embodiment of the present invention includes a lower substrate having an active region and an inactive region, an organic light emitting element disposed in the active region, at least one dam disposed in the inactive region, an organic light emitting element, A first inorganic layer disposed on the active region and the non-active region so as to cover the dam, an organic protective film covering the active region on the first inorganic layer, and an organic protective film, And a peeling prevention pattern disposed between the first inorganic layer and the second inorganic layer outside the at least one dam.

The peeling prevention pattern may be arranged to surround at least a part of the active region.

The peeling prevention patterns are provided in plural and can be disposed apart from each other.

The peeling prevention pattern can be arranged in a zigzag shape.

The thickness of the anti-peeling pattern may be thinner than the thickness of the organic protective film.

The signal wiring may be included in the inactive area, and one or more dams may be disposed on the signal wiring.

The at least one dam may comprise the same material as at least one of the bank and the spacer.

An organic light emitting diode display according to another embodiment of the present invention includes a lower substrate, an organic light emitting element disposed on the lower substrate, a second sealing layer disposed on the organic light emitting element to protect the organic light emitting element, An encapsulant comprising a first encapsulant layer and a second encapsulant layer surrounded by the first encapsulant layer and the second encapsulant layer, at least one dam disposed outside the organic light emitting device on the lower substrate to prevent the flow of the dewar compensation layer and And an adhesion improving member disposed between the first sealing layer and the second sealing layer outside the at least one dam to improve adhesion between the first sealing layer and the second sealing layer.

The adhesion improving member may be formed of an organic material that improves the adhesion between the first sealing layer and the second sealing layer.

The adhesion improving member may be made of the same organic material as the foreign material compensation layer.

The adhesion improving member may be formed together with the foreign matter compensation layer in the same process.

The foreign material compensation layer can be formed by an inkjet process.

Although the embodiments of the present invention have been described in detail with reference to the accompanying drawings, it is to be understood that the present invention is not limited to those embodiments and various changes and modifications may be made without departing from the scope of the present invention. .

Therefore, the embodiments disclosed in the present invention are intended to illustrate rather than limit the scope of the present invention, and the scope of the technical idea of the present invention is not limited by these embodiments. The scope of protection of the present invention should be construed according to the following claims, and all technical ideas within the scope of equivalents should be construed as falling within the scope of the present invention.

100, 500: organic light emitting display
110: Lower substrate
120: thin film transistor
140: Organic light emitting device
150:
151: first sealing layer
152: Foreign body compensation layer
153: second sealing layer
160: one or more dams
170: signal wiring
180: Peeling prevention layer
580: Multiple adhesion improvement patterns
410, 710: a plurality of nozzles

Claims (12)

A lower substrate having an active region and a non-active region;
An organic light emitting diode disposed in the active region;
At least one dam disposed in the inactive area;
A first inorganic layer disposed in the active region and the non-active region to cover the organic light emitting device and the at least one dam;
An organic protective film covering the active region on the first inorganic layer;
A second inorganic layer disposed to cover the organic passivation layer and in contact with the first inorganic layer in the nonactive region; And
And a peeling prevention pattern disposed between the first inorganic layer and the second inorganic layer outside the at least one dam. The method according to claim 1,
Wherein the peeling prevention pattern is disposed so as to surround at least a part of the active region. 3. The method of claim 2,
Wherein the peeling prevention pattern is provided in a plurality of locations and is disposed apart from each other. The method of claim 3,
Wherein the peeling prevention pattern is arranged in a zigzag shape. 5. The method of claim 4,
Wherein the thickness of the peeling prevention pattern is thinner than the thickness of the organic passivation layer. The method according to claim 1,
The signal wiring is included in the non-active region, and the at least one dam is disposed on the signal wiring. The method according to claim 1,
Further comprising a bank and a spacer disposed in the active region,
Wherein the at least one dam has a layer made of the same material as at least one of the bank and the spacer. A lower substrate;
An organic light emitting diode disposed on the lower substrate;
An encapsulating portion disposed on the organic light emitting element to protect the organic light emitting element, the encapsulation portion including a first encapsulation layer, a second encapsulation layer, and a foreign material compensation layer surrounded by the first encapsulation layer and the second encapsulation layer;
At least one dam disposed outside the organic light emitting device on the lower substrate to prevent the flow of the foreign material compensation layer; And
And an adhesion improving member arranged between the first sealing layer and the second sealing layer outside the at least one dam to improve adhesion between the first sealing layer and the second sealing layer. . 9. The method of claim 8,
Wherein the adhesive force improving member is made of an organic material which improves the adhesive force between the first sealing layer and the second sealing layer. 10. The method of claim 9,
Wherein the adhesion improving member is made of the same organic material as the foreign material compensation layer. 11. The method of claim 10,
Wherein the adhesion improving member is formed together with the foreign material compensation layer in the same process. 12. The method of claim 11,
Wherein the foreign material compensation layer is formed by an inkjet process.

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