CN110137375B - Organic light-emitting display panel, device and method - Google Patents
Organic light-emitting display panel, device and method Download PDFInfo
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- CN110137375B CN110137375B CN201910458740.2A CN201910458740A CN110137375B CN 110137375 B CN110137375 B CN 110137375B CN 201910458740 A CN201910458740 A CN 201910458740A CN 110137375 B CN110137375 B CN 110137375B
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8428—Vertical spacers, e.g. arranged between the sealing arrangement and the OLED
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
Abstract
The invention discloses an organic light-emitting display panel, a device and a method, wherein the organic light-emitting display panel comprises: a substrate base including a display region and a non-display region surrounding the display region; an inorganic insulating layer on one side of the substrate base plate; the organic light-emitting structure is positioned on one side of the inorganic insulating layer, which is far away from the substrate base plate, and is positioned in the display area; the thin film packaging layer covers the organic light-emitting structure and comprises at least one organic layer and at least one inorganic layer; the isolation unit is positioned in the non-display area and surrounds the display area; at least two opening structures are arranged on the inorganic insulating layer corresponding to the vertical projection of the at least one isolation unit in the non-display area; the opening structure is disposed around the display area, and at least one isolation unit fills the opening structure. The organic light-emitting display panel provided by the invention improves the adhesion between the isolation unit and the inorganic insulating layer, and is beneficial to narrowing the frame of the organic light-emitting display panel.
Description
Technical Field
The embodiment of the invention relates to the technical field of display, in particular to an organic light-emitting display panel, an organic light-emitting display device and an organic light-emitting display method.
Background
Organic light emitting display panels are widely used in various high performance display fields due to their advantages of high brightness, low power consumption, wide viewing angle, high response speed, wide temperature range, etc.
However, moisture and oxygen in the ambient environment seriously affect the life span of the organic light emitting display panel. In the prior art, a thin film encapsulation method is often used to ensure that the organic light emitting material and the electrode in the organic light emitting display panel are not corroded by water vapor and oxygen in the external environment. However, the stretching effect of the inorganic film layer and the organic film layer in the thin film encapsulation may cause an increase in the bezel size of the organic light emitting display panel. In order to avoid the stretching effect of the inorganic film layer and the organic film layer in the thin film encapsulation, at least one isolation unit is often disposed around the organic light emitting structure in the prior art.
With the narrowed frame of the organic light emitting display panel, the width of the isolation unit is gradually reduced. When the width of the isolation unit is reduced, the adhesion between the isolation unit and the inorganic insulating layer may be reduced, thereby causing the isolation unit to be missing in other processes after the preparation thereof is completed, thereby losing the effect of preventing the extension of the inorganic film layer and the organic film layer.
Disclosure of Invention
The invention provides an organic light-emitting display panel, an organic light-emitting display device and an organic light-emitting display method, which can improve the adhesion between an isolation unit and an inorganic insulating layer and are beneficial to narrowing the frame of the organic light-emitting display panel.
In a first aspect, an embodiment of the present invention provides an organic light emitting display panel, including: a substrate base including a display area and a non-display area surrounding the display area;
an inorganic insulating layer located at one side of the substrate base plate;
the organic light-emitting structure is positioned on one side, far away from the substrate, of the inorganic insulating layer and positioned in the display area;
the thin film packaging layer covers the organic light-emitting structure and comprises at least one organic layer and at least one inorganic layer;
at least one isolation unit located in the non-display area and surrounding the display area;
at least two opening structures are arranged on the inorganic insulating layer corresponding to the vertical projection of the at least one isolation unit in the non-display area; the opening structure is disposed around the display area, and at least one of the isolation units fills the opening structure.
In a second aspect, an embodiment of the present invention further provides an organic light emitting display device, including the organic light emitting display panel.
In a third aspect, an embodiment of the present invention further provides a method for manufacturing an organic light emitting display panel, including:
providing a substrate, wherein the substrate comprises a display area and a non-display area surrounding the display area;
forming an inorganic insulating layer on one side of the substrate base plate;
forming at least two opening structures on the inorganic insulating layer corresponding to the non-display area; the opening structure is arranged around the display area;
forming an organic light-emitting structure in the display area and on one side of the inorganic insulating layer, which is far away from the substrate;
forming at least one isolation unit in the non-display area, wherein the bottom of the at least one isolation unit is embedded in the opening structure;
and forming a thin film packaging layer on one side of the organic light-emitting structure, which is far away from the inorganic insulating layer, wherein the thin film packaging layer comprises at least one organic layer and at least one inorganic layer.
According to the embodiment of the invention, the at least two opening structures are arranged on the inorganic insulating layer corresponding to the vertical projection of the at least one isolation unit in the non-display area, and the isolation unit is filled in the opening structures, so that the contact area between the inorganic insulating layer and the isolation unit is increased, and the adhesion between the inorganic insulating layer and the isolation unit is further increased, thereby reducing the width of the isolation unit, preventing the inorganic film layer and the organic film layer in the film package from extending, and being beneficial to narrowing the frame of the organic light-emitting display panel. In addition, the at least two opening structures arranged on the inorganic insulating layer can release stress in the organic light-emitting display panel.
Drawings
Fig. 1 is a schematic top view of an organic light emitting display panel according to an embodiment of the present invention;
FIG. 2 is a schematic cross-sectional view taken along the direction QQ' in FIG. 1;
FIG. 3 is a schematic view of an inorganic insulating layer according to an embodiment of the present invention;
FIG. 4 is a schematic structural diagram of another inorganic insulating layer provided in an embodiment of the present invention;
FIG. 5 is a schematic view of a structure of another inorganic insulating layer provided by an embodiment of the present invention;
FIG. 6 is a schematic structural diagram of another inorganic insulating layer provided in an embodiment of the present invention;
fig. 7 is a schematic structural diagram of another inorganic insulating layer according to an embodiment of the present invention;
fig. 8 is a schematic structural diagram of another inorganic insulating layer according to an embodiment of the present invention;
fig. 9 is a schematic structural diagram of another inorganic insulating layer provided in an embodiment of the present invention;
fig. 10 is a schematic structural diagram of another inorganic insulating layer provided in an embodiment of the present invention;
fig. 11 is a schematic cross-sectional view illustrating an organic light emitting display panel according to an embodiment of the present invention;
FIG. 12 is a schematic cross-sectional view illustrating another organic light emitting display panel according to an embodiment of the present invention;
fig. 13 is a schematic cross-sectional view illustrating another organic light emitting display panel according to an embodiment of the present invention;
fig. 14 is a schematic structural diagram of an organic light emitting display device according to an embodiment of the present invention;
fig. 15 is a flowchart of a method for manufacturing an organic light emitting display panel according to an embodiment of the present invention.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting of the invention. It should be further noted that, for the convenience of description, only some of the structures related to the present invention are shown in the drawings, not all of the structures.
The embodiment of the invention provides an organic light-emitting display panel, which comprises a substrate base plate, a display area and a non-display area, wherein the substrate base plate comprises the display area and the non-display area surrounding the display area; the inorganic insulating layer is positioned on one side of the substrate; the organic light-emitting structure is positioned on one side of the inorganic insulating layer, which is far away from the substrate base plate, and is positioned in the display area; the thin film packaging layer covers the organic light-emitting structure and comprises at least one organic layer and at least one inorganic layer; the isolation unit is positioned in the non-display area and surrounds the display area; at least two opening structures are arranged on the inorganic insulating layer corresponding to the vertical projection of the at least one isolation unit in the non-display area; the opening structure is disposed around the display area, and at least one of the isolation units fills the opening structure. By adopting the technical scheme, the at least two opening structures are arranged on the inorganic insulating layer corresponding to the vertical projection of the at least one isolation unit in the non-display area, the isolation units are filled in the opening structures, the contact area between the inorganic insulating layer and the isolation units is increased, and the adhesion between the inorganic insulating layer and the isolation units is further increased, so that the width of the isolation units can be reduced, the inorganic film layer and the organic film layer in the film package are prevented from extending, and meanwhile, the narrow frame of the organic light-emitting display panel is facilitated. In addition, the at least two opening structures arranged on the inorganic insulating layer can release stress in the organic light-emitting display panel.
The above is the core idea of the present invention, and the technical solution in the embodiment of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiment of the present invention. All other embodiments, which can be obtained by a person skilled in the art based on the embodiments of the present invention without any creative work, belong to the protection scope of the present invention.
Fig. 1 is a schematic top view of an organic light emitting display panel according to an embodiment of the present invention, and fig. 2 is a schematic cross-sectional view along a QQ' direction in fig. 1. Referring to fig. 1 and 2, an organic light emitting display panel according to an embodiment of the present invention includes a substrate 10, where the substrate 10 includes a display area AA and a non-display area AB surrounding the display area AA; an inorganic insulating layer 20, the inorganic insulating layer 20 being located on the substrate 10 side; the organic light emitting structure 30, the organic light emitting structure 30 is located on one side of the inorganic insulating layer 20 far away from the substrate 10, and is located in the display area AA; a thin film encapsulation layer 40, the thin film encapsulation layer 40 covering the organic light emitting structure 30, the thin film encapsulation layer 40 including at least one organic layer and at least one inorganic layer, the thin film encapsulation layer 40 exemplarily arranged in fig. 2 including one organic layer 42 and two inorganic layers 41, the organic layer 42 being located between the two inorganic layers 41, the inorganic layers 41 being in contact with the organic light emitting structure 30. In this embodiment, the number of the organic layer and the inorganic layer in the thin film encapsulation layer is not limited. At least one isolation unit 50, the isolation unit 50 being located in the non-display area AB and surrounding the display area AA, at least two opening structures 60 being disposed on the inorganic insulating layer 20 corresponding to the vertical projection of the at least one isolation unit 50 in the non-display area AB; the opening structure 60 is disposed around the display area AA, and the at least one isolation unit 50 fills the opening structure 60. Two isolation units 50 are exemplarily provided in fig. 2, and three opening structures 60 are respectively provided on the inorganic insulating layers 20 corresponding to the vertical projections of the two isolation units 50 in the non-display area AB.
The material of the base substrate 10 may include, for example, one or a combination of more of polyether sulfone, polyacrylate, polyetherimide, polyethylene naphthalate, polyethylene terephthalate, polyphenylene sulfide, polyarylate, polyimide, polycarbonate, and a polymer resin of cellulose acetate propionate. The inorganic insulating layer 20 may include, for example, a buffer layer, a gate insulating layer, an interlayer dielectric layer, and a passivation layer. The buffer layer, the gate insulating layer, the interlayer dielectric layer and the passivation layer may be made of the same material or different materials. The materials of the buffer layer, the gate insulating layer, the interlayer dielectric layer, and the passivation layer may include, for example, any one or any two or more of silicon oxide, silicon nitride, and silicon oxynitride. The buffer layer, the gate insulating layer, the interlayer dielectric layer, and the passivation layer may be formed by chemical vapor deposition or atomic layer deposition. The material of the isolation unit 50 may include an organic material such as polyimide, for example.
Specifically, at least two opening structures 60 are disposed on the inorganic insulating layer 20 corresponding to the vertical projection of the at least one isolation unit 50 in the non-display area AB, and the opening structures 60 are disposed around the display area AA. And the isolation unit 50 is filled in the opening structure 60, and the provision of the opening structure 60 increases the contact area between the isolation unit 50 and the inorganic insulating layer 20. Since the material of the isolation unit 50 is an organic material and the material of the inorganic insulating layer 20 is an inorganic material, when the contact area between the isolation unit 50 and the inorganic insulating layer 20 increases, the adhesion between the isolation unit 50 and the inorganic insulating layer 20 also increases. Thus, the width of the isolation unit 50 can be reduced on the premise of preventing the extension of the inorganic film layer and the organic film layer in the film package, which is beneficial to the narrowing of the frame of the organic light emitting display panel. In addition, at least two opening structures 60 are provided in the inorganic insulating layer 20, so that stress generated when the base substrate 10 is bent can be absorbed.
It is to be understood that the organic light emitting display panel includes a plurality of film layers, and for convenience of description, only some of the film layers, not all of the film layers, which are relevant to the present invention, are shown in the drawings.
According to the embodiment of the invention, the at least two opening structures are arranged on the inorganic insulating layer corresponding to the vertical projection of the at least one isolation unit in the non-display area, and the isolation units are filled in the opening structures, so that the contact area between the inorganic insulating layer and the isolation units is increased, and the adhesion between the inorganic insulating layer and the isolation units is further increased, thereby reducing the width of the isolation units, preventing the extension of the inorganic film layer and the organic film layer in the film package, and being beneficial to the narrowing of the frame of the organic light-emitting display panel. In addition, at least two opening structures arranged on the inorganic insulating layer can release stress generated when the flexible organic light-emitting display panel is bent.
Alternatively, each of the opening structures may be continuously disposed around the edge of the display area AA, as shown in fig. 3, fig. 3 is a schematic structural diagram of an inorganic insulating layer provided in an embodiment of the present invention, and in fig. 3, three opening structures 60 are disposed on the inorganic insulating layer 20 corresponding to a vertical projection of an exemplary isolation unit in the non-display area AB. Alternatively, each of the opening structures 60 may also be discontinuously disposed around the edge of the display area AA, as shown in fig. 4, fig. 4 is a schematic structural diagram of another inorganic insulating layer provided in an embodiment of the present invention, in fig. 4, an exemplary isolation unit is disposed, and three opening structures 60 are disposed on the inorganic insulating layer 20 corresponding to the vertical projection of the non-display area AB, each opening structure 60 includes a plurality of sub openings 61 disconnected therebetween, and the sub openings 61 in different opening structures 60 are arranged in a staggered manner. It should be noted that the sub-openings 61 in different opening structures 60 may be arranged in a staggered manner, or may be arranged correspondingly.
Preferably, each of the opening structures 60 is continuously disposed around the edge of the display area AA, and the isolation unit 50 is filled in the opening structure 60. Therefore, the contact area between the isolation unit 50 and the inorganic insulating layer 20 can be further increased, and the adhesiveness between the isolation unit 50 and the inorganic insulating layer 20 is increased, so that the width of the isolation unit can be reduced, the inorganic film layer and the organic film layer in the film package are prevented from extending, and the narrow frame of the organic light-emitting display panel is facilitated.
When each opening structure may be continuously disposed around the edge of the display area, the shape of the vertical projection of each opening structure on the substrate base plate may be a rectangular ring, a zigzag ring, or a wavy ring, which is optional.
Exemplarily, with continuing reference to fig. 3, it is exemplarily shown in fig. 3 that the inorganic insulating layer 20 corresponding to the vertical projection of one isolation unit in the non-display area AB is provided with three opening structures 60, and the vertical projection of each opening structure 60 on the substrate base plate is shaped as a rectangular ring. Fig. 5 is a schematic structural diagram of another inorganic insulating layer provided by an embodiment of the invention, and referring to fig. 5, it is exemplarily shown in fig. 5 that three opening structures 60 are provided on the inorganic insulating layer 20 corresponding to a vertical projection of one isolation unit on the non-display area AB, and a vertical projection of each opening structure 60 on the substrate is shaped as a zigzag ring. Fig. 6 is a schematic structural diagram of another inorganic insulating layer provided by an embodiment of the present invention, and referring to fig. 6, it is exemplarily shown in fig. 6 that three opening structures 60 are provided on the inorganic insulating layer 20 corresponding to a vertical projection of one isolation unit in the non-display area AB, and a vertical projection of each opening structure 60 on the substrate is shaped as a wavy ring.
It should be noted that, in the present embodiment, the shape of the vertical projection of each opening structure 60 on the substrate 10 is not specifically limited, and only the contact area between the isolation unit 50 and the inorganic insulating layer 20 needs to be increased.
This technical scheme, set up two at least open structure through the inorganic insulating layer that at least one isolation unit corresponds in the vertical projection of non-display area, and every open structure is rectangular ring, sawtooth ring or wavy ring in the shape of the vertical projection on the substrate base plate, and make isolation unit fill in open structure, the area of contact of inorganic insulating layer with isolation unit has been increased, and then the adhesion between inorganic insulating layer and the isolation unit has been increased, thereby can reduce the width of isolation unit, be favorable to organic light emitting display panel's narrow frame when preventing inorganic rete and organic rete in the film package to extend.
On the basis of the above scheme, optionally, each opening structure includes a plurality of sub-opening structures; the plurality of sub-aperture structures are sequentially arranged along an edge surrounding the display area.
Fig. 7 is a schematic structural diagram of another inorganic insulating layer provided in an embodiment of the present invention, and referring to fig. 7, fig. 7 exemplarily shows that three opening structures 60 are provided on the inorganic insulating layer 20 corresponding to a vertical projection of one isolation unit in the non-display area AB. Each opening structure 60 comprises a plurality of sub-opening structures 61; the plurality of sub-opening structures 61 are sequentially arranged along the edge around the display area AA.
When the at least one isolation unit 50 is vertically projected in the non-display area AB, the corresponding inorganic insulating layer 20 is provided with at least two opening structures; the opening structures are arranged around the display area AA, and each opening structure comprises a plurality of sub-opening structures; the plurality of sub-opening structures are sequentially arranged along the edge surrounding the display area, and when the isolation unit is filled in the opening structure, the contact area between the inorganic insulating layer and the isolation unit is increased, so that the adhesiveness between the inorganic insulating layer and the isolation unit is increased, the width of the isolation unit can be reduced, the inorganic film layer and the organic film layer in the film package are prevented from extending, and meanwhile, the narrow frame of the organic light-emitting display panel is facilitated.
On the basis of the above scheme, optionally, the shape of the vertical projection of the sub-opening structure on the substrate base plate is in a V shape, an arc shape or a circular ring shape.
Continuing to refer to fig. 7, exemplary, the shape of the perpendicular projection of the sub-opening structure on the substrate base plate is shown in fig. 7 as a V-shape. Fig. 8 is a schematic structural diagram of another inorganic insulating layer provided by an embodiment of the present invention, and referring to fig. 8, fig. 8 exemplarily shows that a shape of a vertical projection of a sub-opening structure on a substrate is an arc. Fig. 9 is a schematic structural diagram of another inorganic insulating layer provided in an embodiment of the present invention, and referring to fig. 9, fig. 9 exemplarily shows that the shape of the vertical projection of the sub-opening structure on the substrate is circular, and the sub-openings 61 between different opening structures 60 are staggered. It should be noted that the sub-openings 61 in the different opening structures 60 may be arranged in a staggered manner, or may be arranged correspondingly, and are not specifically limited in this embodiment.
It should be noted that the shape of the vertical projection of the sub-opening structure on the substrate is not specifically limited in this embodiment, and only the contact area between the isolation unit 50 and the inorganic insulating layer 20 needs to be increased.
According to the technical scheme, the shape of the vertical projection of the sub-opening structure on the substrate base plate is set into a V shape, an arc shape or a circular ring shape, the isolation unit is filled in the opening structure, the contact area of the inorganic insulating layer and the isolation unit is increased, the adhesion between the inorganic insulating layer and the isolation unit is increased, the width of the isolation unit can be reduced, the inorganic film layer and the organic film layer in the film packaging are prevented from extending, and meanwhile, the narrow frame of the organic light-emitting display panel is facilitated.
On the basis of the above scheme, optionally, the vertical projections of the adjacent sub-opening structures on the substrate base plate overlap.
Fig. 10 is a schematic structural diagram of another inorganic insulating layer provided in an embodiment of the present invention, and referring to fig. 10, it is exemplarily shown in fig. 10 that two opening structures 60 are provided on the inorganic insulating layer 20 corresponding to a vertical projection of one isolation unit in the non-display area AB, and a shape of a vertical projection of a sub-opening structure 61 in each opening structure 60 on the substrate base plate is a circular ring. The perpendicular projections of adjacent sub-aperture structures 61 on the substrate base plate overlap.
When the perpendicular projections of the adjacent sub-opening structures 61 on the substrate are overlapped, the number of the sub-opening structures 61 can be increased, so that the contact area between the isolation unit 50 and the inorganic insulating layer 20 can be further increased, and the adhesion between the isolation unit 50 and the inorganic insulating layer 20 can be further increased, so that the width of the isolation unit can be reduced, the inorganic film layer and the organic film layer in the film package can be prevented from extending, and the narrow frame of the organic light-emitting display panel can be facilitated.
On the basis of the above scheme, optionally, in a direction perpendicular to the substrate base plate, the cross-sectional shape of the opening structure may include, for example, a rectangle (see fig. 1), an inverted trapezoid (see fig. 11), or a concave-convex shape of the side wall of the opening structure, for example, an hourglass shape (see fig. 12).
Preferably, the side wall of the opening structure has a concave-convex shape in a direction perpendicular to the substrate base plate.
With continued reference to fig. 11 and 12, the inorganic insulating layer 20 may include, for example, a buffer layer 21, a gate insulating layer 22, an interlayer insulating layer 23, an interlayer dielectric layer 24, and a passivation layer 25. The buffer layer 21, the gate insulating layer 22, the interlayer insulating layer 23, the interlayer dielectric layer 24, and the passivation layer 25 may include any one or any two or more of silicon oxide, silicon nitride, and silicon oxynitride, respectively. This technical scheme is compared in that the lateral wall is the linearity, when being unsmooth undulation with open structure's lateral wall, can further increase the area of contact between isolation unit and the inorganic insulating layer, and then makes the adhesion between isolation unit 50 and the inorganic insulating layer 20 increase to can reduce isolation unit's width, still be favorable to organic light emitting display panel's narrow frame when preventing inorganic rete and the organic rete extension in the film package.
Optionally, with continued reference to FIG. 12, the difference between the recessed portion and the protruding portion of the sidewall of the opening structure 60 is L2, and L2 is greater than or equal to 2 μm and less than or equal to 5 μm.
According to the technical scheme, the difference value between the concave part and the convex part of the side wall of the opening structure is set to be between 2 micrometers and 5 micrometers, so that the contact area between the isolation unit and the inorganic insulating layer is increased, the adhesion between the isolation unit 50 and the inorganic insulating layer 20 is increased, the width of the isolation unit can be reduced, and the inorganic film layer and the organic film layer in the film package are prevented from extending, so that the narrow frame of the organic light-emitting display panel is facilitated.
On the basis of the above solution, optionally, with continued reference to fig. 2, the vertical projection of the opening structure 60 on the substrate base plate 10 is located within the vertical projection of the isolation unit 50 on the substrate base plate 10.
Specifically, when the inorganic insulating layer 20 corresponding to the vertical projection of the at least one isolation unit 50 on the non-display area AB is provided with at least two opening structures, the width L3 of the at least two opening structures is smaller than the width L4 of the isolation unit in the direction parallel to the base substrate 10. When the widths L3 of the at least two opening structures are smaller than the width L4 of the isolation unit, the contact area between the isolation unit 50 and the inorganic insulating layer near the organic light emitting structure is increased, the contact area between the isolation unit and the inorganic insulating layer is further increased, and the adhesion between the isolation unit 50 and the inorganic insulating layer 20 is further increased, so that the width of the isolation unit can be reduced, the inorganic film layer and the organic film layer in the film package are prevented from extending, and the narrow frame of the organic light emitting display panel is facilitated.
On the basis of the above scheme, optionally, with continued reference to fig. 2, 11 and 12, the vertical distance from the bottom of the opening structure 60 to the side of the base substrate 10 close to the inorganic insulating layer 20 is L1, and L1 > 100nm.
Specifically, since the inorganic insulating layer 20 needs to be etched when the opening structure 60 is provided. Due to the fluctuation of the etching process, the vertical distance from the bottom of the opening structure 60 to the side of the substrate 10 close to the inorganic insulating layer 20 needs to be greater than 100nm, so that the substrate 10 is not damaged when the opening structure 60 is disposed in the inorganic insulating layer 20.
According to the technical scheme, the contact area between the isolation unit and the inorganic insulating layer 20 can be increased while the substrate base plate is protected, so that the adhesion between the isolation unit and the inorganic insulating layer is increased, the width of the isolation unit can be reduced, and the narrow frame of the organic light-emitting display panel is facilitated while the inorganic film layer and the organic film layer in the film packaging are prevented from extending.
Optionally, the isolation unit may be simultaneously manufactured when any film layer in the organic light emitting structure is formed, or may be separately formed, and the isolation unit may include a single-layer structure or a multi-layer structure, which is not limited in this embodiment. Fig. 13 is a schematic cross-sectional structure view of another organic light-emitting display panel according to an embodiment of the present invention, and as shown in fig. 13, the organic light-emitting structure 30 includes a pixel defining layer 31, a first electrode 32, a light-emitting functional layer 33, and a second electrode 34, the organic light-emitting structure 30 further includes a plurality of light-emitting units 36, and support pillars 35 are disposed between at least some of the light-emitting units 36. The isolation unit 50 includes a first portion and a second portion that are stacked, the first portion being fabricated in the same layer as the pixel defining layer 31, and the second portion being disposed in the same layer as the support pillar 35. In other embodiments, the isolation unit 50 may further include a first portion, a second portion, and a third portion stacked in sequence in a direction away from the substrate, wherein the first portion is fabricated in the same layer as a planarization layer (not shown in the drawings), the planarization layer is located between the passivation layer 25 and the organic light emitting structure 30, the second portion is fabricated in the same layer as the pixel defining layer 31, and the third portion is fabricated in the same layer as the support pillar 35. The advantage of this setting is that only once etching process is needed in the manufacturing process, and it is not necessary to separately manufacture the mask for the isolation unit 50, thereby saving the cost, reducing the number of processes, and improving the production efficiency.
On the basis of the above scheme, optionally, with continued reference to fig. 2, the organic light emitting display panel includes two isolation units 50, which are a first isolation unit 51 and a second isolation unit 52; the first isolating unit 51 is located between the display area AA and the second isolating unit 52; the inorganic insulating layer 20 corresponding to the vertical projection of at least the first isolation unit 51 on the substrate base plate 10 is provided with at least two opening structures.
According to the technical scheme, when the two isolation units are arranged, the extension of an inorganic film layer and an organic film layer in the film packaging can be further prevented.
Based on the same inventive concept, an organic light emitting display device is further provided in the embodiments of the present invention, and fig. 14 is a schematic structural diagram of an organic light emitting display device provided in the embodiments of the present invention. Referring to fig. 14, the organic light emitting display device 300 includes the display panel 200 according to the embodiment of the present invention, and has corresponding advantages, which are not described herein again.
Based on the same inventive concept, an embodiment of the present invention further provides a method for manufacturing an organic light emitting display panel, fig. 15 is a flowchart of the method for manufacturing an organic light emitting display panel according to the embodiment of the present invention, and as shown in fig. 15, the method for manufacturing an organic light emitting display panel includes:
s110, providing a substrate, wherein the substrate comprises a display area and a non-display area surrounding the display area;
s120, forming an inorganic insulating layer on one side of the substrate;
s130, forming at least two opening structures on the part of the inorganic insulating layer corresponding to the non-display area; the opening structure is arranged around the display area;
wherein, at least two opening structures can be formed on the inorganic insulating layer corresponding to the non-display region by etching process.
S140, forming an organic light-emitting structure in the display area and on the side, away from the substrate, of the inorganic insulating layer;
s150, forming at least one isolation unit in the non-display area, wherein the bottom of the at least one isolation unit is embedded into the opening structure;
and S160, forming a thin film packaging layer on one side of the organic light-emitting structure, which is far away from the inorganic insulating layer, wherein the thin film packaging layer comprises at least one organic layer and at least one inorganic layer.
According to the embodiment of the invention, the at least two opening structures are arranged on the inorganic insulating layer corresponding to the vertical projection of the at least one isolation unit in the non-display area, and the isolation unit is filled in the opening structures, so that the contact area between the inorganic insulating layer and the isolation unit is increased, and the adhesion between the inorganic insulating layer and the isolation unit is further increased, thereby reducing the width of the isolation unit, preventing the extension of the inorganic film layer and the organic film layer in the film package, and being beneficial to the narrowing of the frame of the organic light-emitting display panel. In addition, at least two opening structures arranged on the inorganic insulating layer can release stress generated when the flexible organic light-emitting display panel is bent.
On the basis of the above scheme, optionally, the inorganic insulating layer includes at least one silicon nitride layer and at least one silicon oxide layer;
forming at least two opening structures at the part of the inorganic insulating layer corresponding to the non-display area, including:
forming at least two inverted trapezoid opening structure prototypes on the inorganic insulating layer corresponding to the non-display area by adopting a dry etching process;
etching the side walls of the at least two inverted trapezoidal opening structure prototypes by adopting a wet etching process to form at least two opening structures; wherein, the side wall of the opening structure is in a concave-convex shape.
Illustratively, the inorganic insulating layer includes a buffer layer, a gate insulating layer, an interlayer dielectric layer, and a passivation layer. Since the materials of the buffer layer, the gate insulating layer, the interlayer dielectric layer, and the passivation layer may be the same or different. The materials of the buffer layer, the gate insulating layer, the interlayer dielectric layer, and the passivation layer may include, for example, any one or any two or more of silicon oxide, silicon nitride, and silicon oxynitride. Because the silicon nitride, the silicon oxide and the silicon oxynitride are etched by a wet etching method at different etching rates, for example, the etching rate of the silicon nitride is 2 angstroms/second and the etching rate of the silicon oxide is 10 angstroms/second, when the buffer layer, the gate insulating layer, the interlayer dielectric layer and the passivation layer are made of different materials, that is, at least one silicon nitride layer and at least one silicon oxide layer, and the areas etched by the buffer layer, the gate insulating layer, the interlayer dielectric layer and the passivation layer are different.
Specifically, at least two inverted trapezoidal opening structure prototypes are formed on the part, corresponding to the non-display area, of the inorganic insulating layer by adopting a dry etching process, and then the side walls of the at least two inverted trapezoidal opening structure prototypes are etched by adopting a wet etching process to form at least two opening structures. Because the materials of the buffer layer, the gate insulating layer, the interlayer dielectric layer and the passivation layer are different, the etched areas by adopting a wet etching process are different, and the side wall of the opening structure is in a concave-convex shape.
This technical scheme is compared in the lateral wall and is the linearity, when being unsmooth undulation with opening structure's lateral wall, can further increase the area of contact between isolation unit and the inorganic insulating layer, and then makes the adhesion between isolation unit and the inorganic insulating layer increase to can reduce the width of isolation unit, still be favorable to organic light emitting display panel's narrow frame when preventing inorganic rete and the organic rete in the film package to extend.
It is to be noted that the foregoing is only illustrative of the preferred embodiments of the present invention and the technical principles employed. It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments described herein, but is capable of various obvious changes, rearrangements and substitutions as will now become apparent to those skilled in the art without departing from the scope of the invention. Therefore, although the present invention has been described in greater detail by the above embodiments, the present invention is not limited to the above embodiments, and may include other equivalent embodiments without departing from the spirit of the present invention, and the scope of the present invention is determined by the scope of the appended claims.
Claims (9)
1. An organic light emitting display panel, comprising:
a substrate base including a display area and a non-display area surrounding the display area;
an inorganic insulating layer located at one side of the substrate base plate;
the organic light-emitting structure is positioned on one side, far away from the substrate, of the inorganic insulating layer and positioned in the display area;
the thin film packaging layer covers the organic light-emitting structure and comprises at least one organic layer and at least one inorganic layer;
at least one isolation unit located in the non-display area and surrounding the display area; the isolation unit is in contact with the thin film packaging layer;
at least two opening structures are arranged on the inorganic insulating layer corresponding to the vertical projection of the at least one isolation unit in the non-display area; the opening structure is arranged around the display area, and at least one isolation unit fills the opening structure;
each of the opening structures is continuously disposed along an edge around the display area;
the isolation unit is of a multilayer structure;
the organic light-emitting structure comprises a pixel limiting layer, a first electrode, a light-emitting functional layer and a second electrode, and further comprises a plurality of light-emitting units, and support columns are arranged among at least part of the light-emitting units; the isolation unit comprises a first part and a second part which are arranged in a stacked mode, the first part and the pixel limiting layer are manufactured in the same layer, and the second part and the supporting column are manufactured in the same layer;
in the direction perpendicular to the substrate base plate, the side wall of the opening structure is in a concave-convex shape.
2. The organic light-emitting display panel according to claim 1, wherein a vertical projection of each of the opening structures on the substrate base plate is shaped as a rectangular ring, a zigzag ring, or a wavy ring.
3. The organic light-emitting display panel according to claim 1, wherein a vertical projection of the opening structure on the substrate base plate is located within a vertical projection of the isolation unit on the substrate base plate.
4. The organic light-emitting display panel according to claim 1, wherein a vertical distance from a bottom of the opening structure to a side of the base substrate adjacent to the inorganic insulating layer is L1, and L1 > 100nm.
5. The organic light emitting display panel according to claim 1, wherein the organic light emitting display panel comprises two isolation units, a first isolation unit and a second isolation unit;
the first isolation unit is positioned between the display area and the second isolation unit;
at least two opening structures are arranged on the inorganic insulating layer corresponding to the vertical projection of at least the first isolation unit on the substrate base plate.
6. The organic light-emitting display panel according to claim 1, wherein a material of the barrier unit is an organic material.
7. An organic light emitting display device comprising the organic light emitting display panel according to any one of claims 1 to 6.
8. A method for manufacturing an organic light emitting display panel includes:
providing a substrate, wherein the substrate comprises a display area and a non-display area surrounding the display area;
forming an inorganic insulating layer on one side of the substrate base plate;
forming at least two opening structures on the inorganic insulating layer corresponding to the non-display area; the opening structure is arranged around the display area, wherein the side wall of the opening structure is in a concave-convex shape;
forming an organic light-emitting structure in the display area and on one side of the inorganic insulating layer, which is far away from the substrate;
forming at least one isolation unit in the non-display area, wherein the bottom of at least one isolation unit is embedded in the opening structures, and each opening structure is continuously arranged along the edge surrounding the display area;
the isolation unit is of a multilayer structure;
the organic light-emitting structure comprises a pixel limiting layer, a first electrode, a light-emitting functional layer and a second electrode, and further comprises a plurality of light-emitting units, and support columns are arranged among at least part of the light-emitting units; the isolation unit comprises a first part and a second part which are arranged in a stacked mode, the first part and the pixel limiting layer are manufactured in the same layer, and the second part and the supporting column are manufactured in the same layer; the isolation units are manufactured simultaneously when any film layer in the organic light-emitting structure is formed;
forming a thin film packaging layer on one side, far away from the inorganic insulating layer, of the organic light-emitting structure, wherein the thin film packaging layer comprises at least one organic layer and at least one inorganic layer; the isolation unit is in contact with the thin film encapsulation layer.
9. The method for manufacturing an organic light-emitting display panel according to claim 8, wherein the inorganic insulating layer comprises at least one silicon nitride layer and at least one silicon oxide layer;
the forming of at least two opening structures at the portion of the inorganic insulating layer corresponding to the non-display area includes:
forming at least two inverted trapezoid opening structure prototypes on the part, corresponding to the non-display area, of the inorganic insulating layer by adopting a dry etching process;
and etching the side walls of the at least two inverted trapezoidal opening structure prototypes by adopting a wet etching process to form at least two opening structures.
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| CN110416282A (en) * | 2019-08-28 | 2019-11-05 | 云谷（固安）科技有限公司 | Display device and its display base plate |
| JP7386653B2 (en) | 2019-09-06 | 2023-11-27 | キヤノン株式会社 | Light emitting devices and their manufacturing methods, printers, display devices, photoelectric conversion devices, electronic equipment, lighting devices, and mobile objects |
| CN111312926A (en) * | 2020-02-27 | 2020-06-19 | 武汉华星光电半导体显示技术有限公司 | Display panel, display device and manufacturing method |
| CN111653592A (en) * | 2020-06-11 | 2020-09-11 | Oppo广东移动通信有限公司 | Array substrate, manufacturing method thereof, display panel and electronic equipment |
| CN111834543B (en) * | 2020-06-28 | 2022-08-30 | 昆山国显光电有限公司 | Flexible display panel and display device |
| CN114023794B (en) * | 2021-10-27 | 2023-05-05 | 深圳市华星光电半导体显示技术有限公司 | Display panel and manufacturing method thereof |
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| KR102420461B1 (en) * | 2015-02-06 | 2022-07-14 | 삼성디스플레이 주식회사 | Display apparatus and method of manufacturing the same |
| KR20180060851A (en) * | 2016-11-29 | 2018-06-07 | 엘지디스플레이 주식회사 | Organic light emitting display device |
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| CN109166825A (en) * | 2018-08-01 | 2019-01-08 | 云谷（固安）科技有限公司 | Display panel and display device with it |
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