CN110137375A - A kind of organic light emitting display panel, device and method - Google Patents

A kind of organic light emitting display panel, device and method Download PDF

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Publication number
CN110137375A
CN110137375A CN201910458740.2A CN201910458740A CN110137375A CN 110137375 A CN110137375 A CN 110137375A CN 201910458740 A CN201910458740 A CN 201910458740A CN 110137375 A CN110137375 A CN 110137375A
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CN
China
Prior art keywords
organic light
layer
isolated location
insulation layer
inorganic insulation
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CN201910458740.2A
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Chinese (zh)
Inventor
张鹏
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Tianma Microelectronics Co Ltd
Shanghai Tianma AM OLED Co Ltd
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Shanghai Tianma AM OLED Co Ltd
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Priority to CN201910458740.2A priority Critical patent/CN110137375A/en
Publication of CN110137375A publication Critical patent/CN110137375A/en
Pending legal-status Critical Current

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    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/28Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part
    • H01L27/32Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part with components specially adapted for light emission, e.g. flat-panel displays using organic light-emitting diodes [OLED]
    • H01L27/3241Matrix-type displays
    • H01L27/3244Active matrix displays
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L51/00Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
    • H01L51/50Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof specially adapted for light emission, e.g. organic light emitting diodes [OLED] or polymer light emitting devices [PLED]
    • H01L51/52Details of devices
    • H01L51/5237Passivation; Containers; Encapsulation, e.g. against humidity
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L51/00Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
    • H01L51/50Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof specially adapted for light emission, e.g. organic light emitting diodes [OLED] or polymer light emitting devices [PLED]
    • H01L51/52Details of devices
    • H01L51/5237Passivation; Containers; Encapsulation, e.g. against humidity
    • H01L51/524Sealing arrangements having a self-supporting structure, e.g. containers
    • H01L51/525Vertical spacers, e.g. arranged between the sealing arrangement and the OLED
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L51/00Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
    • H01L51/50Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof specially adapted for light emission, e.g. organic light emitting diodes [OLED] or polymer light emitting devices [PLED]
    • H01L51/52Details of devices
    • H01L51/5237Passivation; Containers; Encapsulation, e.g. against humidity
    • H01L51/5253Protective coatings
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L51/00Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
    • H01L51/50Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof specially adapted for light emission, e.g. organic light emitting diodes [OLED] or polymer light emitting devices [PLED]
    • H01L51/56Processes or apparatus specially adapted for the manufacture or treatment of such devices or of parts thereof
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2251/00Indexing scheme relating to organic semiconductor devices covered by group H01L51/00
    • H01L2251/50Organic light emitting devices
    • H01L2251/56Processes specially adapted for the manufacture or treatment of OLED

Abstract

The invention discloses a kind of organic light emitting display panel, device and method, which includes: underlay substrate, and underlay substrate includes viewing area and the non-display area around viewing area;Inorganic insulation layer positioned at underlay substrate side;Positioned at inorganic insulation layer far from underlay substrate side and positioned at the organic light-emitting structure of viewing area;Thin-film encapsulation layer, thin-film encapsulation layer cover organic light-emitting structure, and thin-film encapsulation layer includes an at least organic layer and an at least inorganic layer;At least one isolated location, isolated location are located at non-display area and around viewing areas;At least one isolated location is provided at least two hatch frames in the corresponding inorganic insulation layer of upright projection of non-display area;Hatch frame is arranged around viewing area, and at least one isolated location fills hatch frame.Organic light emitting display panel provided by the invention improves the adhesiveness between isolated location and inorganic insulation layer, is conducive to the narrow frame of organic light emitting display panel.

Description

A kind of organic light emitting display panel, device and method
Technical field
The present embodiments relate to field of display technology more particularly to a kind of organic light emitting display panels, device and method.
Background technique
Organic light emitting display panel is due to using temperature model with high brightness, low-power consumption, wide viewing angle, high response speed, width The advantages that enclosing is widely used in various high-performance display fields.
However, the steam and oxygen in ambient enviroment drastically influence the service life of organic light emitting display panel.The prior art In be often used the method for thin-film package to guarantee luminous organic material in organic light emitting display panel and electrode not by extraneous ring The erosion of steam and oxygen in border.But the effect of extension of inorganic film and organic film in thin-film package will lead to it is organic Light emitting display panel frame size increases.It is existing in order to avoid the effect of extension of inorganic film and organic film in thin-film package There is technology that at least one isolated location is often set around organic light-emitting structure.
With the narrow frame of organic light emitting display panel, the width of isolated location can be gradually reduced.When isolated location When width reduces, the adhesiveness between isolated location and inorganic insulation layer can be reduced, and then isolated location is caused to prepare at it It is lacked in other process after, to lose the effect for preventing inorganic film and organic film from extending.
Summary of the invention
The present invention provides a kind of organic light emitting display panel, device and method, can be improved isolated location and inorganic insulation Adhesiveness between layer, is conducive to the narrow frame of organic light emitting display panel.
In a first aspect, the embodiment of the invention provides a kind of organic light emitting display panels, comprising: underlay substrate, the lining Substrate includes viewing area and the non-display area around the viewing area;
Inorganic insulation layer, the inorganic insulation layer are located at the underlay substrate side;
Organic light-emitting structure, the organic light-emitting structure are located at one of the inorganic insulation layer far from the underlay substrate Side, and it is located at the viewing area;
Thin-film encapsulation layer, the thin-film encapsulation layer cover the organic light-emitting structure, and the thin-film encapsulation layer includes at least One organic layer and at least an inorganic layer;
At least one isolated location, the isolated location are located at the non-display area and around the viewing areas;
The upright projection corresponding inorganic insulation layer setting of at least one described isolated location in the non-display area There are at least two hatch frames;The hatch frame is arranged around the viewing area, and at least one described isolated location filling The hatch frame.
Second aspect, the embodiment of the invention also provides a kind of organic light-emitting display devices, including organic hair described above Light display panel.
The third aspect, the embodiment of the invention also provides a kind of preparation methods of organic light emitting display panel, comprising:
A underlay substrate is provided, the underlay substrate includes viewing area and the non-display area around the viewing area;
Inorganic insulation layer is formed in the side of the underlay substrate;
At least two hatch frames are formed in the part that the inorganic insulation layer corresponds to the non-display area;The opening knot Structure is arranged around the viewing area;
In the viewing area, and it is located at the inorganic insulation layer and forms organic light-emitting junction far from the side of the underlay substrate Structure;
At least one isolated location is formed in the non-display area, described in the bottom insertion of at least one isolated location In hatch frame;
Thin-film encapsulation layer, the thin-film encapsulation layer are formed far from the inorganic insulation layer side in the organic light-emitting structure Including an at least organic layer and an at least inorganic layer.
The embodiment of the present invention by least one isolated location non-display area the corresponding inorganic insulation of upright projection Layer at least two hatch frame of setting, and are filled in isolated location in hatch frame, increase inorganic insulation layer be isolated singly The contact area of member, and then the adhesiveness between inorganic insulation layer and isolated location is increased, so as to reduce isolated location Width, prevent thin-film package in inorganic film and organic film extend while be conducive to the narrow of organic light emitting display panel Frame.In addition, at least two hatch frames of inorganic insulation layer setting, can also make the stress in organic light emitting display panel It is released.
Detailed description of the invention
Fig. 1 is a kind of overlooking structure diagram of organic light emitting display panel provided in an embodiment of the present invention;
Fig. 2 is the schematic diagram of the section structure in the direction QQ ' along Fig. 1;
Fig. 3 is a kind of structural schematic diagram of inorganic insulation layer provided in an embodiment of the present invention;
Fig. 4 is the structural schematic diagram of another inorganic insulation layer provided in an embodiment of the present invention;
Fig. 5 is the structural schematic diagram of another inorganic insulation layer provided in an embodiment of the present invention;
Fig. 6 is the structural schematic diagram of another inorganic insulation layer provided in an embodiment of the present invention;
Fig. 7 is the structural schematic diagram of another inorganic insulation layer provided in an embodiment of the present invention;
Fig. 8 is the structural schematic diagram of another inorganic insulation layer provided in an embodiment of the present invention;
Fig. 9 is the structural schematic diagram of another inorganic insulation layer provided in an embodiment of the present invention;
Figure 10 is the structural schematic diagram of another inorganic insulation layer provided in an embodiment of the present invention;
Figure 11 is a kind of the schematic diagram of the section structure of organic light emitting display panel provided in an embodiment of the present invention;
Figure 12 is the schematic diagram of the section structure of another organic light emitting display panel provided in an embodiment of the present invention;
Figure 13 is the schematic diagram of the section structure of another organic light emitting display panel provided in an embodiment of the present invention;
Figure 14 is a kind of structural schematic diagram of organic light-emitting display device provided in an embodiment of the present invention;
Figure 15 is a kind of flow chart of the preparation method of organic light emitting display panel provided in an embodiment of the present invention.
Specific embodiment
The present invention is described in further detail with reference to the accompanying drawings and examples.It is understood that this place is retouched The specific embodiment stated is used only for explaining the present invention rather than limiting the invention.It also should be noted that in order to just Only the parts related to the present invention are shown in description, attached drawing rather than entire infrastructure.
The embodiment of the present invention provides a kind of organic light emitting display panel, including underlay substrate, and underlay substrate includes viewing area With the non-display area for surrounding viewing area;Inorganic insulation layer, inorganic insulation layer are located at underlay substrate side;Organic light-emitting structure has Machine light emitting structure is located at side of the inorganic insulation layer far from underlay substrate, and is located at viewing area;Thin-film encapsulation layer, thin-film encapsulation layer Organic light-emitting structure is covered, thin-film encapsulation layer includes an at least organic layer and an at least inorganic layer;At least one isolated location, every It is located at non-display area from unit and around viewing area;At least one isolated location is corresponding inorganic in the upright projection of non-display area Insulating layer is provided at least two hatch frames;Hatch frame is arranged around viewing area, and the filling of at least one isolated location is opened Mouth structure.By adopting the above technical scheme, by corresponding inorganic in the upright projection of non-display area at least one isolated location At least two hatch frames are arranged in insulating layer, and are filled in isolated location in hatch frame, increase inorganic insulation layer with every Contact area from unit, and then the adhesiveness between inorganic insulation layer and isolated location is increased, so as to reduce isolation The width of unit prevents inorganic film and organic film in thin-film package from also helping organic light emitting display face while extension The narrow frame of plate.In addition, at least two hatch frames of inorganic insulation layer setting, can also make in organic light emitting display panel Stress be released.
It is core of the invention thought above, following will be combined with the drawings in the embodiments of the present invention, to the embodiment of the present invention In technical solution be clearly and completely described.Based on the embodiments of the present invention, those of ordinary skill in the art are not having Under the premise of making creative work, every other embodiment obtained be shall fall within the protection scope of the present invention.
Fig. 1 is a kind of overlooking structure diagram of organic light emitting display panel provided in an embodiment of the present invention, and Fig. 2 is along figure The schematic diagram of the section structure in the direction QQ ' in 1.Please refer to organic light emitting display provided in an embodiment of the present invention shown in Fig. 1 and Fig. 2 Panel includes underlay substrate 10, and underlay substrate 10 includes the viewing area AA and non-display area AB around viewing area AA;Inorganic insulation Layer 20, inorganic insulation layer 20 is located at 10 side of underlay substrate;Organic light-emitting structure 30, organic light-emitting structure 30 are located at inorganic insulation 20 side far from underlay substrate 10 of layer, and it is located at viewing area AA;Thin-film encapsulation layer 40, thin-film encapsulation layer 40 cover organic light emission Structure 30, thin-film encapsulation layer 40 include an at least organic layer and an at least inorganic layer, and thin-film encapsulation layer is illustratively arranged in Fig. 2 40 include one layer of organic layer 42 and two layers of inorganic layer 41, and organic layer 42 is located between two layers inorganic layer 41, inorganic layer 41 with it is organic Light emitting structure 30 contacts.It should be noted that the present embodiment does not limit the quantity of organic layer in thin-film encapsulation layer and inorganic layer It is fixed.At least one isolated location 50, isolated location 50 are located at non-display area AB and around viewing area AA, at least one isolated locations 50 are provided at least two hatch frames 60 in the corresponding inorganic insulation layer 20 of upright projection of non-display area AB;Hatch frame 60 It is arranged around viewing area AA, and at least one isolated location 50 fills hatch frame 60.In Fig. 2 illustratively be provided with two every From unit 50, and upright projection corresponding inorganic insulation layer 20 of two isolated locations 50 in non-display area AB is respectively arranged with three A hatch frame 60.
Wherein, the material of underlay substrate 10 for example may include polyether sulfone, polyacrylate, polyetherimide, poly- naphthalene two Formic acid glycol ester, polyethylene terephthalate, polyphenylene sulfide, polyarylate, polyimides, polycarbonate and acetate propionate One of fluoropolymer resin of cellulose or multiple combinations.Inorganic insulation layer 20 for example may include buffer layer, gate insulator Layer, interlayer insulating film, interlayer dielectric layer and passivation layer.Buffer layer, gate insulating layer, interlayer insulating film, interlayer dielectric layer and blunt The material for changing layer may be the same or different.Buffer layer, gate insulating layer, interlayer insulating film, interlayer dielectric layer and passivation layer Material for example may include any one or any two kinds or more in silica, silicon nitride and silicon oxynitride.Buffer layer, Gate insulating layer, interlayer insulating film, interlayer dielectric layer and passivation layer can be formed by chemical vapor deposition or atomic layer deposition.Every Material from unit 50 for example may include the organic materials such as polyimides.
Specifically, being set at least one isolated location 50 in the corresponding inorganic insulation layer 20 of upright projection of non-display area AB At least two hatch frames 60 are set, hatch frame 60 is arranged around viewing area AA.And isolated location 50 is made to be filled in hatch frame In 60, the setting of hatch frame 60 increases the contact area between isolated location 50 and inorganic insulation layer 20.Because isolation is single The material of member 50 is organic material, and the material of inorganic insulation layer 20 is inorganic material, when isolated location 50 and inorganic insulation layer When contact area between 20 increases, the adhesiveness between isolated location 50 and inorganic insulation layer 20 also be will increase.In this way, isolation Under the premise of guaranteeing to prevent inorganic film and the organic film extension in thin-film package, width can reduce unit 50, have Conducive to the narrow frame of organic light emitting display panel.In addition, at least two hatch frames 60 are set in inorganic insulation layer 20, it can be with Absorb the stress generated when underlay substrate 10 is bent.
It is understood that organic light emitting display panel includes multiple film layers, for ease of description, the embodiment of the present invention is attached Only the parts related to the present invention are shown in figure and not all film layer.
The embodiment of the present invention by least one isolated location non-display area the corresponding inorganic insulation of upright projection Layer at least two hatch frame of setting, and are filled in isolated location in hatch frame, increase inorganic insulation layer be isolated singly The contact area of member, and then the adhesiveness between inorganic insulation layer and isolated location is increased, so as to reduce isolated location Width, prevent thin-film package in inorganic film and organic film extend while also help organic light emitting display panel Narrow frame.In addition, at least two hatch frames of inorganic insulation layer setting, can also make flexible organic light emitting display panel exist The stress generated when bending is released.
Optionally, each hatch frame can be arranged around the continuous edge of viewing area AA, as shown in figure 3, Fig. 3 is this hair An isolated location is illustratively arranged non-aobvious in Fig. 3 in a kind of structural schematic diagram for inorganic insulation layer that bright embodiment provides Show that there are three hatch frames 60 for the corresponding setting of inorganic insulation layer 20 of the upright projection of area AB.Optionally, each hatch frame 60 Can also discontinuously it be arranged around the edge of viewing area AA, as shown in figure 4, Fig. 4 is another nothing provided in an embodiment of the present invention The structural schematic diagram of machine insulating layer, the upright projection that an isolated location is illustratively arranged in Fig. 4 in non-display area AB are corresponding The setting of inorganic insulation layer 20 there are three hatch frame 60, each hatch frame 60 includes multiple separated son openings 61, and Son opening 61 in different openings structure 60 is staggered arrangement.It should be noted that the son opening 61 in different openings structure 60 can With the arrangement that is staggered, arrangement can also be corresponded to.
Preferably, each hatch frame 60 is arranged around the continuous edge of viewing area AA, and is filled in isolated location 50 In hatch frame 60.In this way, the contact area between isolated location 50 and inorganic insulation layer 20 can be further increased, and then make Adhesiveness between isolated location 50 and inorganic insulation layer 20 increases, and so as to reduce the width of isolated location, prevents film Inorganic film and organic film in encapsulation also help the narrow frame of organic light emitting display panel while extension.
When each hatch frame can be around the continuous edge setting of viewing area, optionally, each hatch frame is being served as a contrast The shape of upright projection on substrate is in straight-flanked ring, zigzag ring or waveform ring.
Illustratively, with continued reference to Fig. 3, illustratively show an isolated location in the vertical of non-display area AB in Fig. 3 Projecting the corresponding setting of inorganic insulation layer 20, there are three hatch frames 60, and each hatch frame 60 is vertical on underlay substrate The shape of projection is in straight-flanked ring.Fig. 5 is the structural schematic diagram of another inorganic insulation layer provided in an embodiment of the present invention, referring to figure Illustratively show that upright projection corresponding inorganic insulation layer 20 of the isolated location in non-display area AB is provided in 5, Fig. 5 Three hatch frames 60, and the shape indention ring of upright projection of each hatch frame 60 on underlay substrate.Fig. 6 is this Inventive embodiments provide another inorganic insulation layer structural schematic diagram, illustratively shown referring to Fig. 6, in Fig. 6 one every From unit non-display area AB the setting of upright projection corresponding inorganic insulation layer 20 there are three hatch frame 60, and each opening The wavy ring of shape of upright projection of the structure 60 on underlay substrate.
It should be noted that the shape of the present embodiment not upright projection to each hatch frame 60 on underlay substrate 10 It is specifically limited, need to only meet the contact area increase between isolated location 50 and inorganic insulation layer 20.
The technical program, by least one isolated location non-display area the corresponding inorganic insulation layer of upright projection At least two hatch frames are set, and the shape of upright projection of each hatch frame on underlay substrate is in straight-flanked ring, sawtooth Shape ring or waveform ring, and it is filled in isolated location in hatch frame, increase contact of the inorganic insulation layer with isolated location Area, and then the adhesiveness between inorganic insulation layer and isolated location is increased, so as to reduce the width of isolated location, resistance Be conducive to the narrow frame of organic light emitting display panel while only the inorganic film in thin-film package and organic film extend.
On the basis of above scheme, optionally, each hatch frame includes multiple sub- hatch frames;Multiple sub- opening knots Structure is arranged successively along the edge around viewing area.
Illustratively, Fig. 7 is the structural schematic diagram of another inorganic insulation layer provided in an embodiment of the present invention, referring to Fig. 7, Illustratively show that upright projection corresponding inorganic insulation layer 20 of the isolated location in non-display area AB is provided with three in Fig. 7 A hatch frame 60.Each hatch frame 60 includes multiple sub- hatch frames 61;Multiple sub- hatch frames 61 are along around viewing area The edge of AA is arranged successively.
When at least one isolated location 50 the corresponding inorganic insulation layer 20 of upright projection of non-display area AB be provided with to Few two hatch frames;Hatch frame is arranged around viewing area AA, and each hatch frame includes multiple sub- hatch frames;It is multiple Sub- hatch frame is arranged successively along the edge around viewing area, and when being filled in isolated location in hatch frame, increases nothing The contact area of machine insulating layer and isolated location, and then the adhesiveness between inorganic insulation layer and isolated location is increased, thus It can reduce the width of isolated location, inorganic film and organic film in thin-film package prevented to also help while extension The narrow frame of machine light emitting display panel.
On the basis of above scheme, optionally, the shape of upright projection of the sub- hatch frame on underlay substrate is in V word Shape, arc or circular ring shape.
Illustratively, with continued reference to Fig. 7, vertical throwing of the sub- hatch frame on underlay substrate is illustratively shown in Fig. 7 The shape of shadow is in the shape of the letter V.Fig. 8 is the structural schematic diagram of another inorganic insulation layer provided in an embodiment of the present invention, referring to Fig. 8, Illustratively show that the shape of upright projection of the sub- hatch frame on underlay substrate is arc-shaped in Fig. 8.Fig. 9 is implementation of the present invention The structural schematic diagram for another inorganic insulation layer that example provides, illustratively shows that sub- hatch frame is serving as a contrast referring to Fig. 9, in Fig. 9 The shape of upright projection on substrate is in circular ring shape, and the son opening 61 between different openings structure 60 is staggered arrangement.It needs Illustrate, the son opening 61 in different openings structure 60 can be staggered arrangement, can also correspond to arrangement, in the present embodiment not Specifically limited.
It should be noted that the shape of the present embodiment not upright projection to sub- hatch frame on underlay substrate has Body limits, and need to only meet the contact area increase between isolated location 50 and inorganic insulation layer 20.
The technical program, by the way that upright projection of the sub- hatch frame on underlay substrate is shaped to V-shaped, arc Shape or circular ring shape, and it is filled in isolated location in hatch frame, the contact area of inorganic insulation layer and isolated location is increased, And then the adhesiveness between inorganic insulation layer and isolated location is increased, so as to reduce the width of isolated location, prevent thin Inorganic film and organic film in film encapsulation are conducive to the narrow frame of organic light emitting display panel while extension.
On the basis of above scheme, optionally, upright projection of the adjacent sub- hatch frame on underlay substrate is overlapping.
Illustratively, Figure 10 is the structural schematic diagram of another inorganic insulation layer provided in an embodiment of the present invention, referring to figure Illustratively show that upright projection corresponding inorganic insulation layer 20 of the isolated location in non-display area AB is arranged in 10, Figure 10 There are two hatch frame 60, and the shape of upright projection of the sub- hatch frame 61 on underlay substrate in each hatch frame 60 In circular ring shape.Upright projection of the adjacent sub- hatch frame 61 on underlay substrate is overlapping.
When upright projection of the adjacent sub- hatch frame 61 on the underlay substrate is overlapping, sub- hatch frame can be increased 61 quantity, in this way, the contact area between isolated location 50 and inorganic insulation layer 20 can be further increased, and then further Increase the adhesiveness between isolated location 50 and inorganic insulation layer 20, so as to reduce the width of isolated location, prevents thin Inorganic film and organic film in film encapsulation also help the narrow frame of organic light emitting display panel while extension.
On the basis of above scheme, optionally, on the direction perpendicular to underlay substrate, the cross sectional shape of hatch frame Such as may include rectangle (referring to Fig. 1), inverted trapezoidal (referring to Figure 11) or hatch frame side wall in concave-convex undulated, such as It may include hourglass shape (referring to Figure 12).
Preferably, on the direction perpendicular to underlay substrate, the side wall of hatch frame is in concave-convex undulated.
With continued reference to Figure 11 and Figure 12, inorganic insulation layer 20 for example may include buffer layer 21, gate insulating layer 22, interlayer Insulating layer 23, interlayer dielectric layer 24 and passivation layer 25.Buffer layer 21, gate insulating layer 22, interlayer insulating film 23, inter-level dielectric Layer 24 and passivation layer 25 material may include respectively silica, silicon nitride and silicon oxynitride any one or it is two kinds any Or more.The technical program, it is linearly compared to side wall, when the side wall of hatch frame is undulated in bumps, Ke Yijin One step increases the contact area between isolated location and inorganic insulation layer, and then makes between isolated location 50 and inorganic insulation layer 20 Adhesiveness increase, so as to reduce the width of isolated location, inorganic film and organic film in thin-film package is prevented to prolong The narrow frame of organic light emitting display panel is also helped while stretching.
Optionally, with continued reference to Figure 12, the difference of the part that the side wall of hatch frame 60 is fallen in and the part of protrusion is L2,2 μm≤L2≤5 μm.
The difference of part and the part of protrusion that the side wall of hatch frame is fallen in is set 2 μm and 5 by the technical program Between μm, to increase the contact area between isolated location and inorganic insulation layer, and then make isolated location 50 and inorganic insulation layer Adhesiveness between 20 increases, and so as to reduce the width of isolated location, prevents inorganic film in thin-film package and organic Film layer also helps the narrow frame of organic light emitting display panel while extension.
On the basis of above scheme, optionally, with continued reference to Fig. 2, hatch frame 60 is vertical on underlay substrate 10 Projection is located at isolated location 50 in the upright projection on underlay substrate 10.
Specifically, when at least one isolated location 50 is set in the corresponding inorganic insulation layer 20 of upright projection of non-display area AB When being equipped at least two hatch frames, along being parallel on the direction of underlay substrate 10, the width L3 of at least two hatch frames is small In the width L4 of isolated location.When the width L3 of at least two hatch frames be less than isolated location width L4 when, increase every From unit 50 and inorganic insulation layer close to the contact area of organic light-emitting structure side, further increase isolated location and it is inorganic absolutely Contact area between edge layer, and then increase the adhesiveness between isolated location 50 and inorganic insulation layer 20, so as to subtract The width of small isolated location prevents inorganic film and organic film in thin-film package from also helping organic light emission while extension The narrow frame of display panel.
On the basis of above scheme, optionally, with continued reference to Fig. 2, Figure 11 and Figure 12, the bottom of hatch frame 60 to lining Vertical range of the substrate 10 close to 20 side of inorganic insulation layer is L1, L1 > 100nm.
Specifically, it because when hatch frame 60 is arranged, needs to perform etching inorganic insulation layer 20.Due to etching technics Fluctuation, the bottom of hatch frame 60 need to be made to be greater than to underlay substrate 10 close to the vertical range of 20 side of inorganic insulation layer 100nm, so, it is ensured that underlay substrate 10 will not be damaged to when hatch frame 60 is set in inorganic insulation layer 20.
The technical program can also increase between isolated location and inorganic insulation layer 20 while protecting underlay substrate Contact area, and then increase the adhesiveness between isolated location and inorganic insulation layer, so as to reduce the width of isolated location Degree prevents inorganic film and organic film in thin-film package from also helping the narrow side of organic light emitting display panel while extension Frame.
Optionally, isolated location can make when any film layer simultaneously in forming organic light-emitting structure, can also be independent It is formed, isolated location may include that single layer structure also may include multilayered structure, and the present embodiment does not limit this.Figure 13 is this The schematic diagram of the section structure for another organic light emitting display panel that inventive embodiments provide, as shown in figure 13, organic light emission knot Structure 30 includes pixel confining layer 31, first electrode 32, light emitting functional layer 33 and second electrode 34, and organic light-emitting structure 30 is also wrapped Multiple luminescence units 36 are included, are provided with support column 35 between at least partially luminescent unit 36.Isolated location 50 includes being stacked First part and second part, first part and 31 same layer of pixel confining layer make, second part is set with 35 same layer of support column It sets.Can also be arranged in other embodiments isolated location 50 include far from orientation substrate successively lamination setting first Point, second part and Part III, wherein first part and planarization layer (not shown) same layer make, planarization layer position Between passivation layer 25 and organic light-emitting structure 30, second part and 31 same layer of pixel confining layer are made, Part III and support The production of 35 same layer of column.The benefit being arranged in this way is only to need an etching technics in the production process, without being that isolated location 50 is single Solely production mask plate, saves cost, reduces processing procedure quantity, improve production efficiency.
On the basis of above scheme, optionally, with continued reference to Fig. 2, organic light emitting display panel includes that two isolation are single Member 50, respectively the first isolated location 51 and the second isolated location 52;First isolated location 51 be located at viewing area AA and second every From between unit 52;The corresponding inorganic insulation layer 20 of upright projection of at least the first isolated location 51 on underlay substrate 10 is arranged There are at least two hatch frames.
The technical program can further prevent inorganic film in thin-film package and organic when two isolated locations are arranged Film layer extends.
Based on same inventive concept, the embodiment of the invention also provides a kind of organic light-emitting display device, Figure 14 is this A kind of structural schematic diagram for organic light-emitting display device that inventive embodiments provide.Referring to Figure 14, the organic light-emitting display device 300 include display panel 200 provided in an embodiment of the present invention, has corresponding beneficial effect, which is not described herein again.
Based on same inventive concept, the embodiment of the invention also provides a kind of preparation sides of organic light emitting display panel Method, Figure 15 are a kind of flow charts of the preparation method of organic light emitting display panel provided in an embodiment of the present invention, as shown in figure 15, The preparation method of the organic light emitting display panel includes:
S110, a underlay substrate is provided, underlay substrate includes viewing area and the non-display area around viewing area;
S120, inorganic insulation layer is formed in the side of underlay substrate;
S130, at least two hatch frames are formed in the part that inorganic insulation layer corresponds to non-display area;Hatch frame surrounds Viewing area setting;
Wherein it is possible to form at least two opening knots in the part that inorganic insulation layer corresponds to non-display area by etching technics Structure.
S140, organic light-emitting structure is formed far from the side of underlay substrate in viewing area, and positioned at inorganic insulation layer;
S150, at least one isolated location, the bottom insertion opening knot of at least one isolated location are formed in non-display area In structure;
S160, thin-film encapsulation layer is formed far from inorganic insulation layer side in organic light-emitting structure, thin-film encapsulation layer includes extremely A few organic layer and an at least inorganic layer.
The embodiment of the present invention by least one isolated location non-display area the corresponding inorganic insulation of upright projection Layer at least two hatch frame of setting, and are filled in isolated location in hatch frame, increase inorganic insulation layer be isolated singly The contact area of member, and then the adhesiveness between inorganic insulation layer and isolated location is increased, so as to reduce isolated location Width, prevent thin-film package in inorganic film and organic film extend while also help organic light emitting display panel Narrow frame.In addition, at least two hatch frames of inorganic insulation layer setting, can also make flexible organic light emitting display panel exist The stress generated when bending is released.
On the basis of above scheme, optionally, inorganic insulation layer includes at least one layer of silicon nitride layer and at least one layer Silicon oxide layer;
At least two hatch frames are formed in the part that the inorganic insulation layer corresponds to non-display area, comprising:
At least two inverted trapezoidals opening is formed in the part that inorganic insulation layer corresponds to non-display area using dry etch process Architecture prototyping;
The side wall of at least two inverted trapezoidal hatch frame prototypes is etched using wet-etching technology, forms at least two openings Structure;Wherein, the side wall of hatch frame is in concave-convex undulated.
Illustratively, inorganic insulation layer includes buffer layer, gate insulating layer, interlayer insulating film, interlayer dielectric layer and passivation Layer.Because buffer layer, gate insulating layer, interlayer insulating film, interlayer dielectric layer and passivation layer material can be identical, can also not Together.Buffer layer, gate insulating layer, interlayer insulating film, interlayer dielectric layer and passivation layer material for example may include silica, nitrogen Any one in SiClx and silicon oxynitride or any two kinds or more.Because silicon nitride, silica and silicon oxynitride use When wet etching, etch rate is different, for example, the etch rate of silicon nitride is 2 angstroms per seconds, silica is 10 angstroms per seconds, so working as Buffer layer, gate insulating layer, interlayer insulating film, interlayer dielectric layer and passivation layer material difference when, i.e., at least one layer of silicon nitride Layer and at least one layer of silicon oxide layer, buffer layer, gate insulating layer, interlayer insulating film, interlayer dielectric layer and passivation layer etch away Area it is different.
Specifically, it is fallen using dry etch process in the part formation at least two that inorganic insulation layer corresponds to non-display area terraced Then shape hatch frame prototype etches the side wall of at least two inverted trapezoidal hatch frame prototypes using wet-etching technology, formed At least two hatch frames.Because buffer layer, gate insulating layer, interlayer insulating film, interlayer dielectric layer and passivation layer material not Together, so, the area etched away using wet-etching technology is different, and then makes the side wall of hatch frame in concave-convex undulated.
The technical program, it is linearly compared to side wall, when the side wall of hatch frame is undulated in bumps, Ke Yijin One step increases the contact area between isolated location and inorganic insulation layer, and then makes viscous between isolated location and inorganic insulation layer Attached property increases, and so as to reduce the width of isolated location, inorganic film and organic film in thin-film package is prevented to extend The narrow frame of organic light emitting display panel is also helped simultaneously.
Note that the above is only a better embodiment of the present invention and the applied technical principle.It will be appreciated by those skilled in the art that The invention is not limited to the specific embodiments described herein, be able to carry out for a person skilled in the art it is various it is apparent variation, It readjusts and substitutes without departing from protection scope of the present invention.Therefore, although being carried out by above embodiments to the present invention It is described in further detail, but the present invention is not limited to the above embodiments only, without departing from the inventive concept, also It may include more other equivalent embodiments, and the scope of the invention is determined by the scope of the appended claims.

Claims (14)

1. a kind of organic light emitting display panel characterized by comprising
Underlay substrate, the underlay substrate include viewing area and the non-display area around the viewing area;
Inorganic insulation layer, the inorganic insulation layer are located at the underlay substrate side;
Organic light-emitting structure, the organic light-emitting structure are located at side of the inorganic insulation layer far from the underlay substrate, and Positioned at the viewing area;
Thin-film encapsulation layer, the thin-film encapsulation layer cover the organic light-emitting structure, and the thin-film encapsulation layer has including at least one Machine layer and at least an inorganic layer;
At least one isolated location, the isolated location are located at the non-display area and around the viewing areas;
At least one described isolated location the corresponding inorganic insulation layer of upright projection of the non-display area be provided with to Few two hatch frames;The hatch frame is arranged around the viewing area, and described at least one described isolated location filling Hatch frame.
2. organic light emitting display panel according to claim 1, which is characterized in that each hatch frame is along around described The continuous edge of viewing area is arranged.
3. organic light emitting display panel according to claim 2, which is characterized in that each hatch frame is in the substrate The shape of upright projection on substrate is in straight-flanked ring, zigzag ring or waveform ring.
4. organic light emitting display panel according to claim 1, which is characterized in that each hatch frame includes multiple sons Hatch frame;Multiple sub- hatch frames are arranged successively along the edge around the viewing area.
5. organic light emitting display panel according to claim 4, which is characterized in that the sub- hatch frame is in the substrate base The shape of upright projection on plate is in the shape of the letter V, arc or circular ring shape.
6. organic light emitting display panel according to claim 4, which is characterized in that the adjacent sub- hatch frame is in the lining Upright projection on substrate is overlapping.
7. organic light emitting display panel according to claim 1, which is characterized in that in the direction perpendicular to the underlay substrate On, the side wall of the hatch frame is in concave-convex undulated.
8. organic light emitting display panel according to claim 1, which is characterized in that the hatch frame is in the underlay substrate On upright projection be located at the isolated location in the upright projection on the underlay substrate.
9. organic light emitting display panel according to claim 1, which is characterized in that the bottom of the hatch frame to the lining Vertical range of the substrate close to the inorganic insulation layer side is L1, L1 > 100nm.
10. organic light emitting display panel according to claim 1, which is characterized in that the organic light emitting display panel packet Include two isolated locations, respectively the first isolated location and the second isolated location;
First isolated location is between the viewing area and second isolated location;
The upright projection corresponding inorganic insulation layer of at least described first isolated location on the underlay substrate is provided with At least two hatch frames.
11. organic light emitting display panel according to claim 1, which is characterized in that the material of the isolated location is to have Machine material.
12. a kind of organic light-emitting display device, which is characterized in that including organic light emission of any of claims 1-11 Display panel.
13. a kind of preparation method of organic light emitting display panel characterized by comprising
A underlay substrate is provided, the underlay substrate includes viewing area and the non-display area around the viewing area;
Inorganic insulation layer is formed in the side of the underlay substrate;
At least two hatch frames are formed in the part that the inorganic insulation layer corresponds to the non-display area;The hatch frame encloses It is arranged around the viewing area;
In the viewing area, and it is located at the inorganic insulation layer and forms organic light-emitting structure far from the side of the underlay substrate;
At least one isolated location is formed in the non-display area, the bottom of at least one isolated location is embedded in the opening In structure;
Thin-film encapsulation layer is formed far from the inorganic insulation layer side in the organic light-emitting structure, the thin-film encapsulation layer includes An at least organic layer and at least an inorganic layer.
14. the preparation method of 3 organic light emitting display panels according to claim 1, which is characterized in that the inorganic insulation layer Including at least one layer of silicon nitride layer and at least one layer of silicon oxide layer;
It is described to form at least two hatch frames in the part that the inorganic insulation layer corresponds to the non-display area, comprising:
At least two inverted trapezoidals are formed in the part that the inorganic insulation layer corresponds to the non-display area using dry etch process Hatch frame prototype;
The side wall of at least two inverted trapezoidals hatch frame prototype is etched using wet-etching technology, forms at least two openings Structure;Wherein, the side wall of the hatch frame is in concave-convex undulated.
CN201910458740.2A 2019-05-29 2019-05-29 A kind of organic light emitting display panel, device and method Pending CN110137375A (en)

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