CN110246879B - Organic light-emitting display panel and device - Google Patents
Organic light-emitting display panel and device Download PDFInfo
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- CN110246879B CN110246879B CN201910505946.6A CN201910505946A CN110246879B CN 110246879 B CN110246879 B CN 110246879B CN 201910505946 A CN201910505946 A CN 201910505946A CN 110246879 B CN110246879 B CN 110246879B
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- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
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Abstract
The invention discloses an organic light-emitting display panel and an organic light-emitting display device. The organic light emitting display panel includes a display area and a non-display area surrounding the display area; the organic light emitting display panel further includes: a substrate base plate; the thin film packaging layer is positioned on one side of the substrate base plate, covers the display area and extends to a part of the non-display area; the thin film packaging layer comprises at least one organic layer and at least one inorganic layer, the organic layer is located between the substrate base plate and the at least one inorganic layer, the organic layer close to the substrate base plate at least comprises an organic layer lower surface close to one side of the substrate base plate, and the vertical distance from the organic layer lower surface to the substrate base plate surface close to one side of the thin film packaging layer of the substrate base plate is gradually reduced along the direction departing from the display area. The organic light-emitting display panel provided by the embodiment of the invention is beneficial to narrowing the frame of the organic light-emitting display panel; meanwhile, the flow speed of the organic layer material is accelerated, and the time for the organic layer to cut off in advance is reduced.
Description
Technical Field
The embodiment of the invention relates to the technical field of display, in particular to an organic light-emitting display panel and an organic light-emitting display device.
Background
Organic light emitting display panels are widely used in various high performance display fields due to their advantages of high brightness, low power consumption, wide viewing angle, high response speed, wide temperature range, etc.
However, moisture and oxygen in the ambient environment seriously affect the life span of the organic light emitting display panel. In the prior art, a thin film encapsulation method is often used to ensure that the organic light emitting material and the electrode in the organic light emitting display panel are not corroded by water vapor and oxygen in the external environment. However, the extension effect of the organic film layer in the film package may increase the frame size of the organic light emitting display panel, which is not favorable for narrowing the frame of the organic light emitting display panel.
Disclosure of Invention
The invention provides an organic light-emitting display panel and an organic light-emitting display device, which are beneficial to narrowing the frame of the organic light-emitting display panel.
In a first aspect, an embodiment of the present invention provides an organic light emitting display panel, including a display area and a non-display area surrounding the display area;
the organic light emitting display panel further includes:
a substrate base plate;
the thin film packaging layer is positioned on one side of the substrate base plate, covers the display area and extends to a part of the non-display area;
the thin film packaging layer comprises at least one organic layer and at least one inorganic layer, the organic layer is located between the substrate base plate and the at least one inorganic layer, the organic layer close to the substrate base plate at least comprises an organic layer lower surface close to one side of the substrate base plate, and the vertical distance from the organic layer lower surface to the substrate base plate surface close to one side of the thin film packaging layer is gradually reduced along the direction deviating from the display area.
In a second aspect, the embodiment of the present invention further provides an organic light emitting display device, including the organic light emitting display panel.
In the organic light emitting display panel provided by the embodiment of the invention, the vertical distance from the lower surface of the organic layer close to the substrate in the film encapsulation layer to the surface of the substrate on the side of the substrate close to the film encapsulation layer is gradually reduced along the direction away from the display area, that is, compared with the display area, the thickness of the functional film layer structure below the organic layer in the film encapsulation layer in the non-display area is gradually reduced, because the volume of the material of the organic layer is fixed before the organic layer is formed, when the thickness of the functional film layer structure below the organic layer in the film encapsulation layer in the non-display area is gradually reduced, the volume for accommodating the organic layer is increased, so that a part of the volume in the organic layer can be positioned in the area with the reduced thickness of the functional film layer structure below the organic layer, even if a part of the volume in the organic layer is lost in the thinned area, so as to cut off the organic layer in advance, the extension effect of an organic layer in the film packaging is prevented from causing the increase of the frame size of the organic light-emitting display panel, and the narrow frame of the organic light-emitting display panel is facilitated; simultaneously, the vertical distance from the lower surface of the organic layer to the surface of the substrate base plate on the side, close to the thin film packaging layer, of the substrate base plate is gradually reduced, the flowing speed of the organic layer material is accelerated, and therefore the time for the organic layer to stop in advance is shortened. In addition, the thickness of the functional film layer structure under the organic layer in the thin film encapsulation layer of the non-display region is gradually reduced in the present application, however, in the prior art, the offset between the organic layer and the bottom of the barrier unit near the display region is large, so that the organic layer easily overflows the barrier unit, thus, a plurality of barrier units are required to prevent the stretching effect of the organic film layer in the film package, thereby increasing the frame size of the organic light emitting display panel, and the offset between the organic layer and the bottom of the barrier unit near the display area is gradually reduced, so that the organic layer does not overflow the barrier unit near the display area, therefore, the number of the blocking units can be reduced, the frame size of the organic light-emitting display panel is further prevented from being increased due to the extension effect of the organic layer in the film packaging, and the narrow frame of the organic light-emitting display panel is facilitated.
Drawings
FIG. 1 is a schematic diagram of an organic light emitting display panel according to the prior art;
fig. 2 is a schematic top view of an organic light emitting display panel according to an embodiment of the present invention;
FIG. 3 is a schematic cross-sectional view taken along the direction QQ' in FIG. 2;
fig. 4 is a schematic cross-sectional view illustrating an organic light emitting display panel according to an embodiment of the present invention;
FIG. 5 is a schematic cross-sectional view illustrating another organic light emitting display panel according to an embodiment of the present invention;
FIG. 6 is a schematic cross-sectional view illustrating another organic light emitting display panel according to an embodiment of the present invention;
fig. 7 is a schematic cross-sectional view illustrating another organic light emitting display panel according to an embodiment of the present invention;
FIG. 8 is a schematic cross-sectional view illustrating another organic light emitting display panel according to an embodiment of the present invention;
fig. 9 is a schematic cross-sectional view illustrating another organic light emitting display panel according to an embodiment of the present invention;
fig. 10 is a schematic structural diagram of an organic light emitting display device according to an embodiment of the present invention.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting of the invention. It should be further noted that, for the convenience of description, only some of the structures related to the present invention are shown in the drawings, not all of the structures.
Fig. 1 is a schematic structural diagram of an organic light emitting display panel in the prior art, and as shown in fig. 1, the organic light emitting display panel includes a display area AA 'and a non-display area AB', and further includes: the thin film encapsulation layer 70 ', the thin film encapsulation layer 70 ' including an organic layer 71 ' and an inorganic layer 72 ', and at least two barrier units 80 ', because the material of the organic layer 71 ' has fluidity, which causes it to extend toward the non-display AB ', the extension effect of the organic layer 71 ' in the thin film encapsulation layer 70 ' causes the frame size of the organic light emitting display panel to increase; in addition, if the difference between the organic layer 71 'and the bottom of the barrier unit 80 near the display region is large, the organic layer may easily overflow the barrier unit 80, so that a plurality of barrier units 80' (fig. 1 only shows that two barrier units are provided for exemplary purposes) need to be provided, which further increases the frame size of the organic light emitting display panel, and is not beneficial to the narrowing of the frame of the organic light emitting display panel.
In view of the above technical problem, an embodiment of the present invention provides a display panel, including a display area and a non-display area surrounding the display area; the organic light emitting display panel further includes: a substrate base plate; the thin film packaging layer is positioned on one side of the substrate base plate, covers the display area and extends to a part of the non-display area; the thin film packaging layer comprises at least one organic layer and at least one inorganic layer, the organic layer is located between the substrate base plate and the at least one inorganic layer, the organic layer close to the substrate base plate at least comprises an organic layer lower surface close to one side of the substrate base plate, and the vertical distance from the organic layer lower surface to the substrate base plate surface close to one side of the thin film packaging layer of the substrate base plate is gradually reduced along the direction departing from the display area. By adopting the technical scheme, the vertical distance from the lower surface of the organic layer close to the substrate in the film packaging layer to the surface of the substrate on one side of the substrate close to the film packaging layer is gradually reduced, so that part of the volume of the organic layer can be positioned in the area with reduced thickness of the functional film layer structure below the organic layer, the organic layer is cut off in advance, the frame size of the organic light-emitting display panel is prevented from being increased due to the extension effect of the organic layer in the film packaging, compared with the prior art, the size of the area DD in the figure 1 is reduced, and the narrow frame of the organic light-emitting display panel is facilitated; and because the offset between the organic layer of this application and the bottom of being close to the separation unit of display area reduces gradually, further prevent that the organic layer from overflowing the separation unit that is close to the display area, further prevent that the extension effect of the organic layer in the film package can lead to organic light emitting display panel frame size to increase, be favorable to organic light emitting display panel's narrow frame.
The above is the core idea of the present invention, and the technical solution in the embodiment of the present invention will be clearly and completely described below with reference to the drawings in the embodiment of the present invention. All other embodiments obtained by a person of ordinary skill in the art based on the embodiments of the present invention without any creative work belong to the protection scope of the present invention.
Fig. 2 is a schematic top view illustrating an organic light emitting display panel according to an embodiment of the present invention, and fig. 3 is a schematic cross-sectional view along a direction QQ' in fig. 1, please refer to fig. 2 and fig. 3, in which the organic light emitting display panel according to an embodiment of the present invention includes a display area AA and a non-display area AB surrounding the display area AA; the organic light emitting display panel further includes: a base substrate 10; the film packaging layer 70, the film packaging layer 70 is located on one side of the substrate base plate 10, and the film packaging layer 70 covers the display area AA and extends to a part of the non-display area AB; the thin film encapsulation layer 70 includes at least one organic layer 71 and at least one inorganic layer 72, the organic layer 71 is located between the substrate 10 and the at least one inorganic layer 72, the organic layer 71 near the substrate 10 at least includes an organic layer lower surface 710 near one side of the substrate 10, and a vertical distance from the organic layer lower surface 710 to the substrate surface 110 of the substrate 10 near one side of the thin film encapsulation layer 70 is gradually reduced along a direction away from the display area AA.
The gradual reduction in the embodiment of the present invention includes continuous reduction or discontinuous reduction, that is, the gradual reduction of the vertical distance from the lower surface 710 of the organic layer to the substrate surface 110 of the substrate 10 on the side close to the thin film encapsulation layer 70 includes continuous reduction of the vertical distance from the lower surface 710 of the organic layer to the substrate surface 110 of the substrate 10 on the side close to the thin film encapsulation layer 70, or discontinuous reduction of the vertical distance from the lower surface 710 of the organic layer to the substrate surface 110 of the substrate 10 on the side close to the thin film encapsulation layer 70, and fig. 2 only illustrates the discontinuous reduction of the vertical distance from the lower surface 710 of the organic layer to the substrate surface 110 of the substrate 10 on the side close to the thin film encapsulation layer 70. The thin film encapsulation layer 70 may include, for example, an organic layer 71 and an inorganic layer 72, wherein the organic layer 71 and the inorganic layer 72 are sequentially disposed on the substrate base 10 side along the X direction; the thin film encapsulation layer 70 may further include an organic layer 71 and two inorganic layers 72, wherein, in the X direction, the inorganic layer 72, the organic layer 71 and the inorganic layer 72 are sequentially disposed on the side of the substrate 10, and at this time, it can be understood that, because the inorganic layer 72 has a thin and uniform thickness, the inorganic layer 72 close to the substrate 10 does not affect the scheme that the vertical distance from the lower surface 710 of the organic layer to the substrate surface 110 of the substrate 10 close to the thin film encapsulation layer 70 is gradually reduced; the thin film encapsulation layer 70 may further include two organic layers 71 and two organic layers 72, wherein the organic layer 71, the inorganic layer 72, the organic layer 71 and the inorganic layer 72 are sequentially disposed on the side of the substrate 10 along the X direction, and the lower surface of the organic layer in the case that the vertical distance from the lower surface 710 of the organic layer to the substrate surface 110 of the substrate 10 on the side close to the thin film encapsulation layer 70 is gradually reduced refers to the lower surface of the organic layer 71 on the side close to the substrate 10. The number and stacking order of the organic layer 71 and the inorganic layer 72 in the thin film encapsulation layer 70 include, but are not limited to, the above examples, and those skilled in the art can set the number and stacking order of the organic layer 71 and the inorganic layer 72 according to the product requirement, and the invention is not limited in particular, and fig. 2 only shows that the thin film encapsulation layer 70 includes an organic layer 71 and an organic layer 72 by way of example.
Illustratively, as shown in fig. 3, the vertical distance from the lower surface 710 of the organic layer in the display area AA to the surface 110 of the substrate 10 on the side close to the thin film encapsulation layer 70 is H1, and the vertical distance from the lower surface 710 of the organic layer in the non-display area AB to the surface 110 of the substrate 10 on the side close to the thin film encapsulation layer 70 is H2, and H2 is smaller than H1. Because the volume of the material of the organic layer 71 is fixed before the organic layer 71 is formed, when the vertical distance from the lower surface 710 of the organic layer to the substrate surface 110 of the substrate 10 close to the thin film encapsulation layer 70 is changed from H1 to H2, a part of the volume CC of the organic layer 71 is located in a thinned region where the vertical distance from the lower surface 710 of the organic layer to the substrate surface 110 of the substrate 10 close to the thin film encapsulation layer 70 is changed from H1 to H2, so that the volume of the remaining organic layer 71 is reduced, and the size of the organic layer 71 extending in the direction away from the display area AA is reduced, even if the organic layer 71 is cut off in advance, thereby preventing the extension effect of the organic layer 71 in the thin film encapsulation from causing the size of the bezel of the organic light emitting display panel and being beneficial to the narrowing of the bezel of the organic light emitting display panel.
It is to be understood that the organic light emitting display panel includes a plurality of film layers, and for convenience of description, only some of the film layers, not all of the film layers, which are relevant to the present invention, are shown in the drawings.
In the organic light emitting display panel provided by the embodiment of the invention, the vertical distance from the lower surface of the organic layer close to the substrate in the thin film encapsulation layer to the surface of the substrate on the side of the substrate close to the thin film encapsulation layer is gradually reduced along the direction away from the display area, that is, compared with the display area, the thickness of the functional film layer structure under the organic layer in the thin film encapsulation layer of the non-display area is gradually reduced, because the volume of the material of the organic layer is fixed before the organic layer is formed, when the vertical distance from the lower surface of the organic layer of the non-display area to the surface of the substrate on the side of the substrate close to the thin film encapsulation layer is reduced, the volume for accommodating the organic layer is increased, a part of the volume in the organic layer is located in the thinned area, even if a part of the volume in the organic layer is lost in the thinned area, the organic layer is cut off in advance, and the extension effect of the organic layer in the thin film encapsulation is prevented from causing the increase of the frame size of the organic light emitting display panel, the narrow frame of the organic light-emitting display panel is facilitated; simultaneously, the vertical distance from the lower surface of the organic layer to the surface of the substrate base plate on the side, close to the thin film packaging layer, of the substrate base plate is gradually reduced, the flowing speed of the organic layer material is accelerated, and therefore the time for the organic layer to stop in advance is shortened. In addition, the thickness of the functional film layer structure below the organic layer in the film packaging layer of the non-display area in the application is gradually reduced, and the break between the organic layer and the bottom of the separation unit close to the display area in the prior art is large, then the organic layer overflows the separation unit very easily, thus, the extension effect of the organic film layer in the film packaging is prevented by a plurality of separation units, and further the frame size of the organic light-emitting display panel is increased, and the break between the organic layer of the application and the bottom of the separation unit close to the display area is gradually reduced, thus, the separation unit close to the display area can not be overflowed by the organic layer, the number of the separation units can be reduced, further, the extension effect of the organic layer in the film packaging can be prevented from increasing the frame size of the organic light-emitting display panel, and the narrow frame of the organic light-emitting display panel is facilitated.
On the basis of the above scheme, optionally, with continuing reference to fig. 3, the organic light emitting display panel further includes: a buffer layer 20, the buffer layer 20 being positioned on the substrate base plate 10; a pixel circuit array layer 30, the pixel circuit array layer 30 is located on one side of the buffer layer 20 away from the substrate base plate 10, the pixel circuit array layer 30 includes at least one insulating layer 31, fig. 2 only illustrates the pixel circuit layer as two insulating layers 31, the pixel circuit array layer 30 is located in the display area AA, and the insulating layer 31 in the pixel circuit array layer 30 extends to the non-display area AB; a planarization layer 40 located on a side of the pixel circuit array layer 30 away from the substrate base plate 10; an organic light emitting structure 50 located on a side of the planarization layer 40 facing away from the substrate base plate 10; a pixel defining layer 60, an opening of which defines the organic light emitting structure 50; the thin film encapsulation layer 70 covers the organic light emitting structure 50; wherein the non-display area AB comprises a film layer thinning area; at least one of the buffer layer 20 of the film layer thinning-out region, the at least one insulating layer 31 of the pixel circuit array layer 30, the planarization layer 40 and the pixel defining layer 60 has a thickness smaller than that of the corresponding same film layer in the display region AA.
The organic light emitting structure 50 is located in the display area AA, and the organic light emitting structure 50 includes an anode layer 51, an organic light emitting layer 52 and a cathode layer 53, wherein the anode layer 51 and the cathode layer 53 extend to the non-display area AB for receiving a cathode signal. Fig. 3, 4, 5, 6, and 7 are all only exemplary illustrations of the discontinuous reduction in the vertical distance from the bottom surface 710 of the organic layer to the substrate surface 110 of the substrate 10 on the side closer to the thin-film encapsulation layer 70.
Illustratively, with continued reference to fig. 3, fig. 3 is only illustrative of the fact that the thickness of buffer layer 20 in the region of reduced thickness of the film layer is less than the corresponding thickness of the same film layer in display area AA. In particular, since the volume of the material of the organic layer 71 is fixed before the organic layer 71 is formed, when the thickness of the buffer layer 20 in the film thinning-out region is smaller than that in the display region AA, which is correspondingly located in the same film, the volume for accommodating the organic layer is increased, such that a portion of the volume CC of the organic layer 71 will be located in the thinned region of the film layer, and the thickness of the buffer layer 20 is smaller than the corresponding portion of the thinned region located in the same film layer in the display area AA, even if a part of the volume of the organic layer is lost in the thinned region, the volume of the remaining organic layer 71 is reduced, thereby reducing the size of the organic layer 71 extending in the direction away from the display area AA, even if the organic layer 71 is cut off in advance, the extension effect of the organic layer 71 in the thin film package is prevented from causing the increase of the frame size of the organic light-emitting display panel, which is beneficial to the narrowing of the frame of the organic light-emitting display panel; simultaneously, the vertical distance from the lower surface of the organic layer to the surface of the substrate base plate on the side, close to the thin film packaging layer, of the substrate base plate is gradually reduced, the flowing speed of the organic layer material is accelerated, and therefore the time for the organic layer to stop in advance is shortened.
For example, with continued reference to fig. 4, fig. 4 only illustrates that the thickness of at least one insulating layer 31 of the pixel circuit array layer 30 is smaller than the thickness of the corresponding same film layer in the display area AA, and the pixel circuit array layer 30 includes one insulating layer. In particular, since the volume of the material of the organic layer 71 is fixed before the organic layer 71 is formed, when the thickness of the insulating layer of the film-thinned region is smaller than the thickness of the corresponding same film in the display area AA, the volume for accommodating the organic layer is increased, so that a part of the volume CC of the organic layer 71 will be located in the region where the thickness of the insulating layer in the region of the reduced thickness of the film layer is smaller than that in the corresponding region of the display area AA where the thickness of the same film layer is reduced, even if a part of the volume of the organic layer is lost in the thinned region, the volume of the remaining organic layer 71 is reduced, thereby reducing the size of the organic layer 71 extending in the direction away from the display area AA, even if the organic layer 71 is cut off in advance, the extension effect of the organic layer 71 in the thin film package is prevented from causing the increase of the frame size of the organic light-emitting display panel, which is beneficial to the narrowing of the frame of the organic light-emitting display panel; simultaneously, the vertical distance from the lower surface of the organic layer to the surface of the substrate base plate on the side, close to the thin film packaging layer, of the substrate base plate is gradually reduced, the flowing speed of the organic layer material is accelerated, and therefore the time for the organic layer to stop in advance is shortened.
Illustratively, with continued reference to fig. 5, fig. 5 is only illustrative of the fact that the thickness of the planarization layer 40 in the film layer thinning-out region is less than the thickness of the corresponding same film layer in the display area AA. In particular, since the volume of the material of the organic layer 71 is fixed before the organic layer 71 is formed, when the thickness of the planarization layer 40 in the film-thinning-out region is smaller than the thickness of the corresponding same film in the display area AA, the volume for accommodating the organic layer is increased, so that a portion of the volume CC of the organic layer 71 will be located in the area where the thickness of the planarization layer 40 in the film layer thinning region is smaller than the corresponding area in the display area AA where the portion of the thickness of the same film layer is thinned, even if a part of the volume of the organic layer is lost in the thinned region, the volume of the remaining organic layer 71 is reduced, thereby reducing the size of the organic layer 71 extending in the direction away from the display area AA, even if the organic layer 71 is cut off in advance, the extension effect of the organic layer 71 in the thin film package is prevented from causing the increase of the frame size of the organic light-emitting display panel, which is beneficial to the narrowing of the frame of the organic light-emitting display panel; simultaneously, the vertical distance from the lower surface of the organic layer to the surface of the substrate base plate on the side, close to the thin film packaging layer, of the substrate base plate is gradually reduced, the flowing speed of the organic layer material is accelerated, and therefore the time for the organic layer to stop in advance is shortened.
Optionally, as exemplified by a process in which the thickness of the planarization layer 40 is discontinuously and gradually reduced along a direction away from the display area AA, a mask may be placed on the planarization layer 40, because the mask has different light transmittances in the display area AA and the non-display area AB, and for example, the transmittance of the display area AA is 100% and the transmittance of the non-display area AB is 50%, when the planarization layer 40 is irradiated, the etched volume is different, so that the planarization layer 40 having a thickness of the film-layer-reduced area smaller than that of the display area AA and located at the same thickness is formed, and at the boundary between the display area AA and the non-display area AB, because the transmittance thereof is between 50% and 100%, the etched volume is located between the etched volume of the display area AA and the etched volume of the non-display area AB, thereby forming an intermediate slope surface.
Illustratively, with continued reference to fig. 6, fig. 6 is only illustrative of the pixel defining layer 60 having a thinner region of the film layer having a thickness less than the corresponding thickness of the same film layer in the display area AA. Specifically, the pixel defining layer 60 includes a first pixel defining layer 61 located in the display area AA and a second pixel defining layer 62 located in the film layer thinning-out area, wherein the thickness of the second pixel defining layer 62 located in the film layer thinning-out area is smaller than that of the first pixel defining layer 61 located in the display area AA. Since the volume of the material of the organic layer 71 is fixed before the organic layer 71 is formed, when the thickness of the pixel defining layer 60 in the film thinning-out region is smaller than the corresponding thickness of the same film layer in the display region AA, that is, the thickness of the pixel defining layer 62 in the film thinning-out region is smaller than the thickness of the first pixel defining layer 61 in the display region AA, the volume for accommodating the organic layer is increased such that a portion of the volume CC of the organic layer 71 is located in a region where the thickness of the pixel defining layer 60 in the film thinning-out region is smaller than the corresponding portion of the same film layer in the display region AA, even if a portion of the volume of the organic layer is lost in the thinned region, and thus the volume of the remaining organic layer 71 is reduced, thereby reducing the size of the organic layer 71 extending in the direction away from the display region AA, even if the organic layer 71 is cut off in advance, preventing the extension effect of the organic layer 71 in the film package from causing the frame size of the organic light emitting display panel to increase, the narrow frame of the organic light-emitting display panel is facilitated; simultaneously, the vertical distance from the lower surface of the organic layer to the surface of the substrate base plate on the side, close to the thin film packaging layer, of the substrate base plate is gradually reduced, the flowing speed of the organic layer material is accelerated, and therefore the time for the organic layer to stop in advance is shortened.
It should be noted that, in fig. 3, fig. 4, fig. 5 and fig. 6, only the thickness of one of the buffer layer 20 in the film thinning-out region, the at least one insulating layer of the pixel circuit array layer 30, the planarization layer 40 and the pixel definition layer 60 is exemplarily described as being smaller than the thickness of the corresponding same film layer in the display region AA, and it should be understood that, on the premise of not affecting the performance of the organic light emitting display panel, the thicknesses of the plurality of film layers in the buffer layer 20 in the film thinning-out region, the at least one insulating layer of the pixel circuit array layer 30, the planarization layer 40 and the pixel definition layer 60 may be smaller than the thicknesses of the corresponding plurality of film layers in the display region AA.
On the basis of the above scheme, optionally, the thickness of at least one of the buffer layer, the at least one insulating layer, the planarization layer and the pixel defining layer in the film layer thinning-out region is continuously gradually reduced along a direction away from the display region.
Fig. 7 is a schematic cross-sectional structure diagram of another organic light emitting display panel according to an embodiment of the present invention, and referring to fig. 7, fig. 7 illustrates only that the thickness of the planarization layer 40 in the film layer thinning region continuously and gradually decreases in a direction away from the display region AA. In particular, since the volume of the material of the organic layer 71 is fixed before the organic layer 71 is formed, when the thickness of the planarization layer 40 in the film-thinning-out region is smaller than the thickness of the corresponding same film in the display area AA, the volume for accommodating the organic layer is increased, so that a portion of the volume CC of the organic layer 71 will be located in the area where the thickness of the planarization layer 40 in the film layer thinning region is smaller than the corresponding area in the display area AA where the portion of the thickness of the same film layer is thinned, even if a part of the volume of the organic layer is lost in the thinned region, the volume of the remaining organic layer 71 is reduced, thereby reducing the size of the organic layer 71 extending in the direction away from the display area AA, even if the organic layer 71 is cut off in advance, the extension effect of the organic layer 71 in the thin film package is prevented from causing the increase of the frame size of the organic light-emitting display panel, which is beneficial to the narrowing of the frame of the organic light-emitting display panel; meanwhile, the vertical distance from the lower surface of the organic layer to the surface of the substrate base plate on the side, close to the thin film packaging layer, of the substrate base plate is continuously and gradually reduced, so that the flowing speed of the organic layer material is accelerated, and the time for the organic layer to stop in advance is reduced.
Alternatively, as exemplified by a process in which the thickness of the planarization layer 40 is continuously gradually reduced along the direction away from the display area AA, a mask may be first placed on the planarization layer 40, because the light transmittances of the display area AA and the non-display area AB of the mask are different, and for example, the transmittance of the display area AA is 100%, and the transmittances of the non-display area AB along the direction from the display area AA to the non-display area AB are 90%, 80%/, 70%, 60%, 50%, 40%, 30%, and 20%, respectively, so that when the planarization layer 40 is irradiated, the etched volume is different, and the planarization layer 40 with the thickness continuously gradually reduced along the direction away from the display area is further formed.
On the basis of the above scheme, optionally, at least one of the buffer layer, the at least one insulating layer, the planarization layer and the pixel defining layer in the film thinning-out region forms at least one step structure in the film thinning-out region.
Illustratively, with continued reference to fig. 5, fig. 5 illustrates only the planarization layer 40 of the film thinning-out region forming a step structure in the film thinning-out region. Specifically, because the volume of the material of the organic layer 71 is fixed before the organic layer 71 is formed, when the planarization layer 40 in the film thinning region forms a step structure in the film thinning region, a part of the volume CC of the organic layer 71 is located in the step structure, so that the volume of the remaining organic layer 71 is reduced, and the size of the organic layer 71 extending in the direction away from the display region AA is reduced, even if the organic layer 71 is cut off in advance, the organic layer 71 in the film package is prevented from extending to increase the size of the frame of the organic light emitting display panel, which is beneficial to narrowing the frame of the organic light emitting display panel.
Optionally, the planarization layer 40 is etched above the driving circuit 90, because the width of the driving circuit 90 is between 250 μm and 350 μm along the direction in which the display area AA points to the non-display area AB, enough space is provided for the etching process, so that the planarization layer 40 forms a step structure in the film thinning area, so that a part of the volume CC of the organic layer 71 is located in the step structure, and thus, the volume of the remaining organic layer 71 is reduced, thereby reducing the dimension of the organic layer 71 extending in the direction away from the display area AA, even if the organic layer 71 is cut off in advance, preventing the extension effect of the organic layer 71 in the thin film package from causing the increase of the frame size of the organic light emitting display panel, and facilitating the frame narrowing of the organic light emitting display panel.
On the basis of the scheme, the gradient of the step structure is W, and W is more than or equal to 25 degrees and less than or equal to 35 degrees.
For example, referring to fig. 5, when the slope of the step structure is W, and W is greater than or equal to 25 ° and less than or equal to 35 °, the extension effect of the organic layer 71 in the thin film package is prevented from causing an increase in the frame size of the organic light emitting display panel, which is beneficial to narrowing the frame of the organic light emitting display panel, and does not affect the signal transmission in the anode layer 51 and the cathode layer 52 on the planarization layer 40.
On the basis of the above solution, optionally, fig. 8 is a schematic cross-sectional structure diagram of another organic light emitting display panel provided in the embodiment of the present invention, where the organic light emitting display panel further includes: a buffer layer 20, the buffer layer 20 being positioned on the substrate base plate 10; the pixel circuit array layer 30, the pixel circuit array layer 30 is located on one side of the buffer layer 20 away from the substrate base plate 10, the pixel circuit array layer 30 includes at least one insulating layer, the pixel circuit array layer 30 is located in the display area AA, and at least one insulating layer in the pixel circuit array layer 30 extends to the non-display area AB; a planarization layer 40 located on a side of the pixel circuit array layer 30 away from the substrate base plate 10; an organic light emitting structure 50 located on a side of the planarization layer 40 facing away from the substrate base plate 10; a pixel defining layer 60, an opening of the pixel defining layer 60 defining the organic light emitting structure 60; the thin film encapsulation layer 70 covers the organic light emitting structure 50; the pixel circuit array layer 30 includes a passivation layer 33, and the passivation layer 33 is located on a side of the planarization layer 40 away from the thin film encapsulation layer 70; the non-display area AB includes at least one of the passivation layer 33 and the planarization layer 40.
Illustratively, in the prior art, the passivation layer 33 is disposed on the driving circuit 90 for preventing the interference of signals between the driving circuit 90 in the non-display area AB and the anode layer 51 in the non-display area, and then the planarization layer 40 is disposed on the passivation layer 33, in this embodiment, the vertical distance from the lower surface 710 of the organic layer in the non-display area AB to the substrate surface 110 of the substrate 10 on the side close to the thin film encapsulation layer 70 is reduced by etching one of the passivation layer 33 and the planarization layer 40 in the non-display area AB, that is, the non-display area AB only includes the passivation layer 33 or only includes the planarization layer 40, that is, the passivation layer 33 or the planarization layer 40 in the non-display area AB is reduced to 0, so that a part of the volume CC in the organic layer 71 is located in a region where the vertical distance from the lower surface 710 of the organic layer to the substrate surface 110 of the substrate 10 on the side close to the thin film encapsulation layer 70 is changed from H1 to H2, in this way, the volume of the remaining organic layer 71 is reduced, and the size of the organic layer 71 extending in the direction away from the display area AA is further reduced, even if the organic layer 71 is cut off in advance, the extension effect of the organic layer 71 in the thin film package is prevented from causing the increase of the frame size of the organic light emitting display panel, which is beneficial to the narrowing of the frame of the organic light emitting display panel, and the interference of signals between the driving circuit 90 in the non-display area AB and the anode layer 51 in the non-display area can be prevented. It should be noted that fig. 8 exemplifies that the pixel circuit array layer 30 includes the passivation layer 33, the non-display area AB includes the passivation layer 33 and the planarization layer 40 in the planarization layer 40.
Based on the above scheme, optionally, with continued reference to fig. 5, the step structure includes a planarization layer step structure EE; the planarization layer 40 forms at least one planarization layer step structure EE, the height of which is H3, H3 is 0.5 μm or more and 1.5 μm or less.
The height of the step structure EE of the planarization layer is H3, H3 is greater than or equal to 0.5 μm and less than or equal to 1.5 μm, that is, the height of the planarization layer 40 etched away in the non-display area AB, which can effectively meet the requirement of the organic layer 71 being cut off in advance, prevent the extension effect of the organic layer 71 in the thin film package from causing the increase of the frame size of the organic light emitting display panel, is beneficial to the narrow frame formation of the organic light emitting display panel, and can also ensure the planarization effect of the planarization layer 40 in the non-display area AB.
Based on the above solution, optionally, with continued reference to fig. 5, the planarization layer step structure EE at least includes a first step surface W1, a second step surface W2, and a slope surface W3 connected in a stepped manner, where the first step surface W1 is located in the display area AA and/or the non-display area AB, the second step surface W2 and the slope surface W3 are located in the non-display area AB, a first end of the slope surface W3 is connected to the first step surface W1, and a second end of the slope surface W3 is connected to the second step surface W2; the second step surface W2 is provided below the first step surface W1 by a slope surface W3; the width of the second step surface W2 is H4, and H4 is 150 μm or more in the direction away from the display area AA toward the non-display area AB.
When the width of the second step surface W2 is H4 and H4 is greater than or equal to 150 μm, i.e., the width etched away by the planarization layer 40 in the non-display area AB, the width can effectively meet the requirement of the organic layer 71 being cut off in advance, so as to prevent the extension effect of the organic layer 71 in the thin film package from increasing the frame size of the organic light emitting display panel, which is beneficial to the frame narrowing of the organic light emitting display panel.
On the basis of the above solution, optionally, fig. 9 is a schematic cross-sectional structure diagram of another organic light emitting display panel provided in the embodiment of the present invention, as shown in fig. 9, the pixel circuit array layer 30 includes an active layer 34, a first metal layer 35, a second metal layer 36, and a third metal layer 37, which are sequentially disposed; the first metal layer 35 includes a gate and a first electrode of a capacitor; the second metal layer 36 comprises the second electrode of the capacitor; the third metal layer 37 includes source and drain electrodes; the pixel circuit array layer 30 further comprises a gate insulating layer 38 positioned between the active layer 34 and the first metal layer 35, an interlayer insulating layer 39 positioned between the first metal layer 35 and the second metal layer 36, an interlayer dielectric layer 32 positioned between the second metal layer 36 and the third metal layer 37, and a passivation layer 33 positioned on the side of the third metal layer 37 away from the substrate base plate 10; at least one of the gate insulating layer 38, the interlayer insulating layer 39, the interlayer dielectric layer 32 and the passivation layer 33 in the film thinning-out region has a thickness smaller than that of the corresponding same film in the display region AA.
Because the gate insulating layer 38, the interlayer insulating layer 39, the interlayer dielectric layer 32 and the passivation layer 33 in the pixel circuit array layer 30 extend to the non-display area AB, in this embodiment, at least one of the gate insulating layer 38, the interlayer insulating layer 39, the interlayer dielectric layer 32 and the passivation layer 33 in the non-display area AB is etched, so that the thickness of the gate insulating layer in the non-display area AB is smaller than that of the display area AA, and further, a part of the volume CC of the organic layer 71 is located in the thinned area, so that the volume of the remaining organic layer 71 is reduced, and further, the size of the organic layer 71 extending in the direction away from the display area AA is reduced, even if the organic layer 71 is cut off in advance, which prevents the extending effect of the organic layer 71 in the thin film package from causing the increase of the frame size of the organic light emitting display panel, and is beneficial to the narrowing of the frame of the organic light emitting display panel.
It should be noted that fig. 9 only illustrates that the thickness of the interlayer dielectric layer 32 is smaller than the thickness of the corresponding same film layer in the display area AA, and the thickness is not continuously reduced.
On the basis of the above scheme, optionally, with continued reference to fig. 2 and 3, the organic light emitting display panel further includes at least one barrier unit 80 located in the non-display area AB and disposed around the display area AA; the organic layer 71 of the thin film encapsulation layer 70 is located in an area surrounded by the barrier unit 80 disposed most adjacent to the display area AA.
Since it is found through many experiments that when the vertical distance from the lower surface 710 of the organic layer to the substrate surface 110 of the substrate 10 on the side close to the thin film encapsulation layer 70 is gradually decreased along the direction away from the display area AA, the distance from the barrier unit 80 close to the display area AA is between about 500 μm and 700 μm, compared to the prior art in which the distance from the non-display area AB to the display area AA is along the direction of the non-display area AB, the distance from the barrier unit 80 close to the display area AA is H4, and the distance from 250 μm H4 μm 550 μm, the barrier unit 80 is disposed at the position where the distance from the display area AA is H4 and the distance from 250 μm H4 μm 550 μm when the barrier unit 80 is prepared. The technical scheme can further prevent the extension effect of the organic layer in the thin film packaging.
Fig. 10 is a schematic structural diagram of an organic light emitting display device according to an embodiment of the present invention, and as shown in fig. 10, the organic light emitting display device 100 may include the display panel 101 according to any embodiment of the present invention, so that the organic light emitting display device 100 according to the embodiment of the present invention also has the beneficial effects described in the foregoing embodiments, and details are not repeated herein. The organic light emitting display device 100 may be a mobile phone as shown in fig. 10, or may be a computer, a television, an intelligent wearable display device, and the like, which is not particularly limited in this embodiment of the present invention.
It is to be noted that the foregoing is only illustrative of the preferred embodiments of the present invention and the technical principles employed. It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments described herein, but is capable of various obvious changes, rearrangements and substitutions as will now become apparent to those skilled in the art without departing from the scope of the invention. Therefore, although the present invention has been described in greater detail by the above embodiments, the present invention is not limited to the above embodiments, and may include other equivalent embodiments without departing from the spirit of the present invention, and the scope of the present invention is determined by the scope of the appended claims.
Claims (12)
1. An organic light emitting display panel comprising a display region and a non-display region surrounding the display region;
the organic light emitting display panel further includes:
a substrate base plate;
the thin film packaging layer is positioned on one side of the substrate base plate, covers the display area and extends to a part of the non-display area;
the thin film packaging layer comprises at least one organic layer and at least one inorganic layer, the organic layer is positioned between the substrate base plate and the at least one inorganic layer, the organic layer close to the substrate base plate at least comprises an organic layer lower surface close to one side of the substrate base plate, and the vertical distance from the organic layer lower surface to the substrate base plate surface close to one side of the thin film packaging layer of the substrate base plate is gradually reduced along the direction deviating from the display area;
the non-display area comprises a thickness-reduced area, and the thickness-reduced area is positioned on one side, close to the display area, of the non-display area; in the display area, the vertical distance from the lower surface of the organic layer to the surface of the substrate base plate on the side, close to the thin film encapsulation layer, of the substrate base plate is greater than that in the thickness reduction area, and the vertical distance from the lower surface of the organic layer to the surface of the substrate base plate on the side, close to the thin film encapsulation layer, of the substrate base plate, so that a containing space for containing the organic layer is formed in the thickness reduction area; and the organic layer has different thicknesses at different positions of the thickness reduction region.
2. The organic light-emitting display panel according to claim 1, further comprising:
the buffer layer is positioned on the substrate base plate;
the pixel circuit array layer is positioned on one side, far away from the substrate, of the buffer layer and comprises at least one insulating layer, and the pixel circuit array layer is positioned in the display area;
the planarization layer is positioned on one side of the pixel circuit array layer, which is far away from the substrate;
the organic light-emitting structure is positioned on one side, away from the substrate, of the planarization layer;
a pixel defining layer, an opening of which defines the organic light emitting structure;
the thin film packaging layer covers the organic light-emitting structure;
wherein the non-display region includes a film layer thinning region; at least one of the buffer layer of the film layer thinning area, the at least one insulating layer of the pixel circuit array layer, the planarization layer and the pixel defining layer has a thickness smaller than that of the corresponding same film layer in the display area.
3. The organic light-emitting display panel according to claim 2, wherein a thickness of at least one of the buffer layer, the at least one insulating layer, the planarization layer, and the pixel defining layer of the film layer thinning-out region is continuously gradually reduced in a direction away from the display region.
4. The organic light-emitting display panel according to claim 2, wherein at least one of the buffer layer, the at least one insulating layer, the planarization layer, and the pixel definition layer of the film thinning-out region forms at least one step structure in the film thinning-out region.
5. The organic light-emitting display panel according to claim 4, wherein the step structure has a gradient W of 25 ° ≦ W ≦ 35 °.
6. The organic light-emitting display panel according to claim 1, further comprising:
the buffer layer is positioned on the substrate base plate;
the pixel circuit array layer is positioned on one side, far away from the substrate, of the buffer layer and comprises at least one insulating layer, and the pixel circuit array layer is positioned in the display area;
the planarization layer is positioned on one side of the pixel circuit array layer, which is far away from the substrate;
the organic light-emitting structure is positioned on one side, away from the substrate, of the planarization layer;
a pixel defining layer, an opening of which defines the organic light emitting structure;
the thin film packaging layer covers the organic light-emitting structure;
wherein the pixel circuit array layer comprises a passivation layer located on one side of the planarization layer away from the thin film encapsulation layer; the non-display region includes at least one of the passivation layer and the planarization layer.
7. The organic light-emitting display panel according to claim 4, wherein the step structure comprises a planarization layer step structure; the planarization layer forms at least one planarization layer step structure, the height of the planarization layer step structure is H3, and H3 is more than or equal to 0.5 mu m and less than or equal to 1.5 mu m.
8. The organic light-emitting display panel according to claim 7, wherein the planarization layer step structure comprises at least a first step surface, a second step surface and a slope surface connected in a stepwise manner, the first step surface is located in the display region and/or the non-display region, the second step surface and the slope surface are located in the non-display region, a first end of the slope surface is connected to the first step surface, and a second end of the slope surface is connected to the second step surface;
the second step surface is arranged below the first step surface through the slope surface;
the width of the second step surface along the direction departing from the display area is H4, and H4 is more than or equal to 150 mu m.
9. The organic light-emitting display panel according to claim 2, wherein the pixel circuit array layer comprises an active layer, a first metal layer, a second metal layer, and a third metal layer arranged in this order;
the first metal layer comprises a grid and a first electrode of a capacitor;
the second metal layer comprises a second electrode of the capacitor;
the third metal layer comprises a source drain electrode;
the pixel circuit array layer further comprises a gate insulating layer positioned between the active layer and the first metal layer, an interlayer insulating layer positioned between the first metal layer and the second metal layer, an interlayer dielectric layer positioned between the second metal layer and the third metal layer, and a passivation layer positioned on one side of the third metal layer far away from the substrate;
at least one of the gate insulating layer, the interlayer dielectric layer and the passivation layer in the film layer thinning region has a thickness smaller than that of the corresponding same film layer in the display region.
10. The organic light-emitting display panel according to claim 1, further comprising at least one barrier unit located in the non-display region and disposed around the display region;
the organic layer of the thin film encapsulation layer is located in an area surrounded by the barrier unit disposed most adjacent to the display area.
11. The panel of claim 10, wherein the distance from the blocking unit near the display region to the display region is H4, 250 μm & ltoreq H4 & ltoreq 550 μm in the direction from the non-display region to the display region.
12. An organic light emitting display device comprising the organic light emitting display panel according to any one of claims 1 to 11.
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| CN110634390A (en) * | 2019-09-20 | 2019-12-31 | 武汉天马微电子有限公司 | Display panel and display device |
| CN110729311B (en) * | 2019-10-31 | 2023-09-05 | 京东方科技集团股份有限公司 | Array substrate, display panel and display device |
| DE112021001343T5 (en) * | 2021-03-29 | 2023-01-12 | Boe Technology Group Co., Ltd. | PIXEL CIRCUIT, DISPLAY PANEL AND DISPLAY DEVICE |
| WO2022226941A1 (en) * | 2021-04-29 | 2022-11-03 | 京东方科技集团股份有限公司 | Display apparatus, display substrate and preparation method therefor |
| CN113809268B (en) * | 2021-09-18 | 2023-08-22 | 云谷（固安）科技有限公司 | Display panel and electronic equipment |
| CN114170902B (en) * | 2021-12-02 | 2023-11-10 | 京东方科技集团股份有限公司 | Flexible display panel and slide roll display device |
| CN114420861B (en) * | 2022-01-04 | 2023-06-30 | 深圳市华星光电半导体显示技术有限公司 | Display panel and manufacturing method thereof |
| CN114863814B (en) * | 2022-04-28 | 2024-04-16 | 昆山国显光电有限公司 | Display panel, manufacturing method of display panel and display device |
| CN115050908B (en) * | 2022-06-09 | 2023-12-01 | 武汉华星光电半导体显示技术有限公司 | Display panel and manufacturing method thereof |
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