CN115050908B - Display panel and manufacturing method thereof - Google Patents
Display panel and manufacturing method thereof Download PDFInfo
- Publication number
- CN115050908B CN115050908B CN202210653806.5A CN202210653806A CN115050908B CN 115050908 B CN115050908 B CN 115050908B CN 202210653806 A CN202210653806 A CN 202210653806A CN 115050908 B CN115050908 B CN 115050908B
- Authority
- CN
- China
- Prior art keywords
- layer
- inorganic
- forming
- display panel
- groove structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 20
- 238000005538 encapsulation Methods 0.000 claims abstract description 80
- 238000005520 cutting process Methods 0.000 claims abstract description 78
- 239000000758 substrate Substances 0.000 claims abstract description 56
- 239000010410 layer Substances 0.000 claims description 224
- 238000004806 packaging method and process Methods 0.000 claims description 36
- 239000012044 organic layer Substances 0.000 claims description 23
- 238000000034 method Methods 0.000 claims description 19
- 230000000694 effects Effects 0.000 abstract description 11
- 208000037656 Respiratory Sounds Diseases 0.000 abstract description 6
- 239000010408 film Substances 0.000 description 20
- 229910052760 oxygen Inorganic materials 0.000 description 12
- 239000001301 oxygen Substances 0.000 description 12
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 10
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 10
- 238000000059 patterning Methods 0.000 description 8
- 239000010409 thin film Substances 0.000 description 7
- 230000008569 process Effects 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 5
- 238000005137 deposition process Methods 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 230000009545 invasion Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000004642 Polyimide Substances 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 238000007641 inkjet printing Methods 0.000 description 2
- 238000002955 isolation Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000012536 packaging technology Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/40—OLEDs integrated with touch screens
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Road Signs Or Road Markings (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
The application provides a display panel and a manufacturing method thereof, wherein the display panel comprises: a substrate; a display device on the substrate; an encapsulation layer on the display device; the display panel further comprises a non-cutting channel region and a cutting channel region positioned outside the non-cutting channel region, wherein the cutting channel region is provided with a groove structure. Through set up groove structure in the cutting district, when adopting two cutting processes of module to cut the panel, can cut because the crackle that the cutting produced, the crackle that produces when avoiding the cutting extends to the display area, simultaneously, strengthens the encapsulation effect of panel to improve the yield and the reliability of panel.
Description
[ field of technology ]
The application relates to the technical field of display, in particular to a display panel and a manufacturing method thereof.
[ background Art ]
Organic Light Emitting Diode (OLED) display panels have received great attention in the academia and industry because of their great potential for development in the direction of solid state lighting and flat panel displays. Moreover, the OLED display technology will be a trend in the future, since the OLED display panel can be made lighter and thinner. In an OLED display panel, a flexible substrate is made of PI (polyimide) and the like, and a thin film transistor is arranged on the flexible substrate and is used for controlling the light emission of an OLED device through signal control. And the OLED device is also coated with an encapsulation layer which comprises an inorganic film layer and an organic film layer which are overlapped, so that water and oxygen protection is realized. The packaging layer is covered with a touch layer to realize the touch function of the display panel.
In the process of manufacturing the OLED display panels, a plurality of OLED display panels need to be manufactured on a motherboard, after each OLED display panel is packaged, each OLED display panel is cut along a cutting line (that is, a second cutting process of a module is adopted to cut a screen body), so that a display panel (panel) with a corresponding size is formed. The packaging layer is provided with an inorganic film layer, the inorganic film layer is excellent in water and oxygen resistance, however, the packaging layer is brittle, micro cracks are easy to generate after a module two-cutting process is adopted or when a rear module and an arc edge are bent, and the micro cracks can even extend into a screen body (such as a display area of a panel), so that the packaging effect is influenced.
Accordingly, the prior art has drawbacks and needs to be improved and developed.
[ application ]
The application provides a display panel and a manufacturing method thereof, which are used for improving the water-oxygen isolation capability of the display panel, thereby improving the yield and the reliability of the panel.
In order to solve the above problems, the present application provides a display panel including: a substrate; a display device on the substrate; an encapsulation layer on the display device; the display panel further comprises a non-cutting channel region and a cutting channel region positioned outside the non-cutting channel region, wherein the cutting channel region is provided with a groove structure.
The packaging layer comprises a first inorganic packaging layer, an organic packaging layer and a second inorganic packaging layer which are arranged on the display device in a stacked mode, wherein the first inorganic packaging layer and/or the second inorganic packaging layer cover at least part of the cutting channel area.
The display panel further comprises a touch layer, the touch layer is located on the packaging layer, and the touch layer covers the cutting channel area.
The substrate comprises a first organic layer, an inorganic layer and a second organic layer which are arranged in a stacked mode, and the groove structure penetrates through the second organic layer and is connected with the inorganic layer.
The distance between the groove structure and the outer edge of the cutting channel area in the first direction is 0-120um, and the first direction is parallel to the substrate.
The width of the groove structure is larger than 5um, and the depth range of the groove structure is 1-20um.
The number of the groove structures is multiple, the distance between two adjacent groove structures in the first direction is larger than 10um, and/or the groove structures have different depths, and the first direction is a direction parallel to the substrate.
In order to solve the above problems, the present application further provides a method for manufacturing a display panel, including: providing a substrate, wherein the substrate comprises a cutting channel region and a non-cutting channel region; forming a groove in the cutting channel region; forming a display device on a substrate, wherein part of a film layer of the display device is partially positioned in the groove to form a first sub-groove structure; forming a packaging layer on the display device, wherein part of the film layer of the packaging layer is partially positioned in the groove to form a second sub-groove structure; the groove structure comprises a first sub-groove structure and a second sub-groove structure.
The substrate comprises a first organic layer, an inorganic layer and a second organic layer, and the step of forming the groove further comprises the step of forming the groove to penetrate through the second organic layer and be connected with the inorganic layer.
The method for forming the display device specifically comprises the following steps:
forming an array layer on a substrate;
forming a pixel definition layer on the array layer;
wherein the step of forming the display device further comprises forming a planarization layer on the array layer, the step of forming the recess being located before the step of forming the pixel defining layer, or the step of forming the recess being located before the step of forming the planarization layer.
The beneficial effects of the application are as follows: unlike the prior art, the application provides a display panel and a manufacturing method thereof, wherein the display panel comprises: a substrate; a display device on the substrate; an encapsulation layer on the display device; the display panel further comprises a non-cutting channel region and a cutting channel region positioned outside the non-cutting channel region, wherein the cutting channel region is provided with a groove structure. Through set up groove structure in the cutting district, when adopting two cutting processes of module to cut the panel, can cut because the crackle that the cutting produced, the crackle that produces when avoiding the cutting extends to the display area, simultaneously, strengthens the encapsulation effect of panel to improve the yield and the reliability of panel.
[ description of the drawings ]
Fig. 1 is a schematic structural diagram of a display panel according to an embodiment of the present application;
FIG. 2 is a schematic diagram of a structure including a groove structure according to a first embodiment of the present application;
FIG. 3 is a schematic view of a structure including a groove structure according to a second embodiment of the present application;
FIG. 4 is a schematic view of a structure including a groove structure according to a third embodiment of the present application;
fig. 5 is a schematic flow chart of a display panel according to an embodiment of the application.
[ detailed description ] of the application
The application is described in further detail below with reference to the drawings and examples. It is specifically noted that the following examples are only for illustrating the present application, but do not limit the scope of the present application. Likewise, the following examples are only some, but not all, of the examples of the present application, and all other examples, which a person of ordinary skill in the art would obtain without making any inventive effort, are within the scope of the present application.
Furthermore, the terms first, second, third and the like in accordance with the present application may be used herein to describe various elements, but these elements should not be limited by these terms. These terms are only used to distinguish one element from another. For example, a first may be referred to as a second, and similarly, a second may be referred to as a first, without departing from the scope of the application. Accordingly, the terminology used is for the purpose of describing and understanding the application and is not intended to be limiting of the application. In the various drawings, like elements are designated by like reference numerals. For clarity, the various features of the drawings are not drawn to scale. Furthermore, some well-known portions may not be shown in the drawings.
In addition, in the respective drawings, units having similar structures are denoted by the same reference numerals. When an element is referred to as being "connected to" another element, it can be directly connected or be indirectly connected to the other element through an intervening element.
The present application will be described in further detail with reference to the accompanying drawings, in order to make the objects, technical solutions and advantages of the present application more apparent.
As shown in fig. 1, the present application provides a display panel including: a substrate 110; a display device (not shown in the figures) on the substrate 110; an encapsulation layer 120 on the display device; the display panel further includes a non-scribe line area A1, and a scribe line area A2 outside the non-scribe line area A1, wherein the scribe line area A2 is provided with a groove structure 130.
In addition, it should be noted that fig. 1 only shows the structure related to the embodiment of the present application, and the display panel of the present application may further include other components and/or structures for realizing the complete functions of the display panel.
Specifically, the substrate 110 may be a glass substrate 110, and may also include the glass substrate 110 and one or more thin films on the glass substrate 110. Wherein the one or more films may be conductive films and/or functional films. In addition, the substrate 110 may be a flexible substrate 110, and in general, a material of the flexible substrate 110 may include PI (polyimide). Wherein the display panel (not shown in the drawings) has a non-dicing street area A1 and a dicing street area A2, the dicing street area A2 may be disposed around the non-dicing street area A1, that is, the dicing street area A2 is disposed outside the non-dicing street area A1. The non-scribe line area A1 generally includes a display area (not shown in the drawing) and a non-display area (e.g., a frame area, not shown in the drawing). A cutting line C1-C1 (cutting line) is marked at the junction of the cutting line area A2 and the non-cutting line area A1, for cutting along the cutting line C1-C1 to finally form a panel. Among them, the display device is not particularly limited, and the display device may be an OLED display device. Wherein, when the display device is an OLED display device, the display panel may be a flexible OLED display panel.
In addition, as shown in fig. 1, the display device may include an array layer 140 on the substrate 110, a pixel definition layer 150 (PDL) and a planarization layer 160 (PLN) on the array layer 140. In addition, the display device may further include an anode layer, a light emitting layer, a cathode layer (not shown in the drawings), and the like, and thus, the description thereof will not be repeated since it is not an inventive point of the embodiment of the present application.
In addition, the cross-sectional shape of the groove structure 130 is not particularly limited, and the cross-sectional shape of the groove structure 130 in a plane perpendicular to the substrate 110 (XZ plane) may be triangular, inverted trapezoidal, elliptical, or rectangular, or may be a combination of at least two of triangular, inverted trapezoidal, elliptical, and rectangular.
In particular, organic Light Emitting Diode (OLED) display panels have received great attention in academia and industry because of their great development potential in the direction of solid state lighting and flat panel display. Moreover, the OLED display technology will be a trend in the future, since the OLED display panel can be made lighter and thinner. In an OLED display panel, a flexible substrate is made of PI (polyimide) and the like, and a thin film transistor is arranged on the flexible substrate and is used for controlling the light emission of an OLED device through signal control. The OLED device is further coated with an encapsulation layer 120 comprising an inorganic film layer and an organic film layer overlapped to realize water-oxygen protection. The encapsulation layer 120 is covered with a touch film layer to realize a touch function of the display panel.
In the process of manufacturing the OLED display panels, a plurality of OLED display panels need to be manufactured on a motherboard, after each OLED display panel is packaged, each OLED display panel is cut along a cutting line (for example, a module two-cutting process is adopted to cut a screen body), so as to form a panel (panel) with a corresponding size. The packaging layer 120 has an inorganic film layer, which has excellent water and oxygen resistance, but is brittle, and after the module two-stage cutting process is adopted, or when the rear module and the arc edge are bent, micro cracks are easy to generate, and the generated micro cracks even extend into the screen body, so that the packaging effect is affected.
Based on this, by adopting the display panel of the embodiment of the present application, the groove structure 130 is provided in the scribe line region A2, and when the panel is diced by adopting the die set two-dicing process, the cracks generated by the dicing can be cut off, so that the cracks generated by the dicing are prevented from extending toward the display region, and at the same time, the packaging effect of the panel is enhanced, thereby improving the yield and reliability of the panel. In addition, on the basis of ensuring the display performance and the product yield of the display panel, the frame width of the display panel is greatly reduced, and the screen occupation ratio of the display panel is effectively improved, so that the display panel of the embodiment of the application can be applied to products such as narrow frames and the like.
The substrate 110 includes a first organic layer 111, an inorganic layer 112, and a second organic layer 113 stacked together, and the groove structure 130 passes through the second organic layer 113 and is connected to the inorganic layer 112.
Specifically, the groove structure 130 is connected with the inorganic layer 112, so that the slopes and bottoms of the inorganic layer 112 and the groove structure 130 are overlapped to form a complete packaging area, water and oxygen invasion can be blocked, the water and oxygen invasion path is prolonged, and the packaging effect is more facilitated.
The encapsulation layer 120 includes a first inorganic encapsulation layer 121, an organic encapsulation layer 122, and a second inorganic encapsulation layer 123 stacked on the display device, wherein the first inorganic encapsulation layer 121 and/or the second inorganic encapsulation layer 123 covers at least a portion of the scribe line region A2.
Specifically, the defects of the traditional packaging technology can be overcome through the thin film packaging technology, the OLED display device does not need to be packaged through a packaging cover plate and frame glue, the traditional glass packaging is replaced by the thin film packaging, the packaging of the large-size OLED display device can be achieved, and the OLED display panel is made to be light and thin. The thin film encapsulation is to form an inorganic and organic alternate layer on the surface of the OLED and to isolate water and oxygen by depositing a thin film. The main components of the first inorganic encapsulation layer 121 and the second inorganic encapsulation layer 123 are silicon oxide, silicon nitride, and the like, which are effective barriers to water/oxygen, but some pinholes or foreign object defects may be generated during the preparation of the inorganic encapsulation layers, and the organic encapsulation layer 122 (the main components are high molecular polymers, resins, and the like) has the function of covering the defects of the inorganic encapsulation layers, so as to realize planarization, release stress between the inorganic encapsulation layers, and realize flexible encapsulation. Among them, the organic encapsulation layer 122 is mainly formed by means of inkjet printing (IJP). Accordingly, the encapsulation layer 120 may include a first inorganic encapsulation layer 121, an organic encapsulation layer 122, and a second inorganic encapsulation layer 123 disposed on the display device in a stacked manner, wherein the first inorganic encapsulation layer 121 and/or the second inorganic encapsulation layer 123 may cover at least a portion of the scribe line region A2. For example, the first inorganic encapsulation layer 121 and/or the second inorganic encapsulation layer 123 covers a portion of the scribe line region A2. For example, the first inorganic encapsulation layer 121 and/or the second inorganic encapsulation layer 123 entirely covers a portion of the dicing street area A2. When the first inorganic encapsulation layer 121 and/or the second inorganic encapsulation layer 123 completely covers a portion of the scribe line region A2, the groove structure 130 includes a portion of the first inorganic encapsulation layer 121 and/or the second inorganic encapsulation layer 123.
Generally, the inorganic encapsulation layers (e.g., the first inorganic encapsulation layer 121 and the second inorganic encapsulation layer 123) are formed by patterning a metal mask, and the metal mask cannot achieve zero clearance when contacting the substrate 110, so that a certain range of shadow (shadow) exists in the edge area of the non-scribe line area A1 near the scribe line area A2, and when the shadow is located in the scribe line area A2, the formed inorganic encapsulation layer is prone to crack. Since the groove structure 130 is disposed in the scribe line region A2 in the embodiment of the present application, when the panel is cut by the die set two-step cutting process, the cracks generated by the cutting process can be cut off, and the cracks generated during the cutting process are prevented from extending toward the display region, so that a portion of the inorganic encapsulation layer may remain in the scribe line region A2, or the inorganic encapsulation layer in the scribe line region A2 may be removed without patterning (i.e., the inorganic encapsulation layer completely covers the scribe line region A2). Compared with the prior art, the embodiment of the application improves the problem of cracks, reduces the process steps of patterning treatment, correspondingly reduces masks (also called photomasks), and reduces the production cost and the process steps. Meanwhile, the inorganic encapsulation layer completely covers all areas, so that the extension of the encapsulation effective area can be realized.
The display panel further includes a touch layer 170, the touch layer 170 is disposed on the encapsulation layer 120, and the touch layer 170 covers the scribe line region A2.
Specifically, the display panel further includes a touch layer 170, and the touch layer 170 may be located in the non-scribe line area A1 for implementing a touch function of the display panel. In addition, the touch layer 170 may cover the whole scribe line region A2, that is, the touch layer 170 may be formed in the non-scribe line region A1 and the scribe line region A2 by a deposition process, without performing patterning treatment, to remove the touch layer 170 located in the scribe line region A2. In the prior art, if the touch layer 170 covers the non-cutting area A1 and the cutting area A2, when the panel is cut by the module two-step cutting process, the touch layer 170 is only located in the non-cutting area A1 because the cracks generated by the cutting easily extend towards the display area, which affects the touch effect of the panel. In the prior art, the formation process of the touch layer 170 may be that a layer of touch material is formed on the encapsulation layer 120, the touch material covers the non-scribe line area A1 and the scribe line area A2, and then the touch material located in the scribe line area A2 is removed by patterning process to form the touch layer 170. Since the groove structure 130 is disposed in the scribe line region A2 in the embodiment of the present application, when the panel is cut by the module two-step cutting process, the cracks generated by the cutting process can be cut off, and the cracks generated during the cutting process are prevented from extending toward the display region, so that the touch layer 170 located in the scribe line region A2 can be removed without using patterning. Compared with the prior art, the embodiment of the application reduces the process steps of patterning treatment, correspondingly reduces the mask plate and reduces the production cost and the process steps. Meanwhile, the touch layer 170 completely covers all areas (such as the non-scribe line area A1 and the scribe line area A2), so as to extend the package active area. It is understood that when the touch layer 170 completely covers all areas (such as the non-scribe line area A1 and the scribe line area A2), the groove structure 130 includes a portion of the touch layer 170.
The distance a between the groove structure 130 and the outer edge of the scribe line region A2 in the first direction is in the range of 0-120um, and the first direction is parallel to the substrate 110.
Specifically, in order to ensure the strength and reliability of the display panel after the panel is cut by the die set two-cutting process, the distance a between the groove structure 130 and the outer edge of the scribe line region A2 in the first direction (X direction) is in the range of 0-120um. The first direction is a direction parallel to the substrate 110, and similar to this, the description is omitted.
The width c of the groove structure 130 is greater than 5um, and the depth h of the groove structure 130 ranges from 1 um to 20um.
Specifically, in order to ensure that when the panel is cut using the die set two-cutting process, cracks generated due to cutting are cut off, an effect that cracks generated during cutting extend toward the display area is avoided, and strength and reliability of the display panel after the panel is cut using the die set two-cutting process are ensured, a width c of the groove structure 130 is greater than 5um, and a depth h of the groove structure 130 ranges from 1 to 20um. As shown in fig. 2, the cross-sectional shape of the groove structure 130 is triangular, and the width c of the groove structure is greater than 5um.
The number of the groove structures 130 is plural, the distance b between two adjacent groove structures 130 in the first direction is greater than 10um, and/or the groove structures 130 have different depths, and the first direction is a direction parallel to the substrate 110.
Specifically, the number of the grooves 131 may be plural, and in order to ensure the strength and reliability of the display panel after the panel is cut by the die set two-cutting process, the distance b between two adjacent groove structures 130 in the first direction (X direction) is greater than 10um.
The cross-sectional shape of the groove structure 130 may be triangular, inverted trapezoidal, oval or rectangular. As shown in fig. 2, a schematic structural diagram including a groove structure 130 according to a first embodiment of the present application is provided. As can be seen from fig. 2, the cross-sectional shape of the groove structure 130 in the XZ plane is triangular. In the display panel provided in the first embodiment of the present application, the number of the groove structures 130 may be plural. As shown in fig. 3, a schematic structural diagram including a groove structure 130 according to a second embodiment of the present application is provided. As can be seen from fig. 3, the cross-sectional shape of the groove structure 130 in the XZ plane is an inverted trapezoid, and the minimum width d of the groove structure 130 is greater than 5um. In the display panel provided in the second embodiment of the present application, the number of the groove structures 130 may be plural. As shown in fig. 4, a schematic structural diagram including a groove structure 130 according to a third embodiment of the present application is provided. As can be seen from fig. 4, the cross-sectional shape of the groove structure 130 in the XZ plane is an inverted trapezoid, and the minimum width d of the groove structure 130 is greater than 5um. In the display panel according to the third embodiment of the present application, the number of the groove structures 130 may be plural, and the groove structures 130 may have different depths. In addition, when the number of the groove structures 130 is plural, the depths of the plural groove structures 130 may be the same or different, and are not particularly limited.
Based on the display panel described in the above embodiment of the present application, the present application further provides a method for manufacturing a display panel, as shown in fig. 5, including:
s101, step: providing a substrate 110, wherein the substrate 110 comprises a cutting channel area A2 and a non-cutting channel area A1;
s102, step: forming a groove 131 in the scribe line region A2; forming a display device on the substrate 110, a portion of a film layer of the display device being partially within the recess 131 to form a first sub-recess structure (not shown in the figures);
s103, step: forming an encapsulation layer 120 on the display device, a portion of the film layer of the encapsulation layer 120 being partially within the recess 131 to form a second sub-recess structure (not shown in the figures); wherein the groove structure 130 comprises a first sub-groove structure and a second sub-groove structure.
The method for forming the display device specifically comprises the following steps:
forming an array layer 140 on the substrate 110;
forming a pixel defining layer 150 on the array layer 140; wherein the step of forming the display device further includes forming a planarization layer 160 on the array layer 140, the step of forming the recess 131 is located before the step of forming the pixel defining layer 150, or the step of forming the recess 131 is located before the step of forming the planarization layer 160.
Specifically, the manufacturing method of the display panel may be to provide the substrate 110, where the substrate 110 includes a scribe line area A2 and a non-scribe line area A1. Then, a portion of the substrate 110 may be partially etched away at the scribe line region A2 by a laser technique, and the groove 131 may be formed in the substrate 110. Then, forming a display device on the substrate 110, wherein one or more film layers formed during the formation of the display device may be formed in the scribe line region A2, for example, when forming the array layer 140 (i.e., array composite layer) in the non-scribe line region A1 by a deposition process, the array layer 140 may be formed in the scribe line region A2, that is, a portion of the array layer 140 is located on the inner wall of the groove 131, and the array layer 140 located on the inner wall of the groove 131 forms a first sub-groove structure; after forming the display device, in order to isolate moisture, the encapsulation layer 120 may be formed on the display device, and in general, the encapsulation layer 120 includes a first inorganic encapsulation layer 121, an organic encapsulation layer 122, and a second inorganic encapsulation layer 123, one or more film layers formed during the formation of the encapsulation layer 120 may also be formed in the scribe line region A2, for example, when the first inorganic encapsulation layer 121 and the second inorganic encapsulation layer 123 are formed in the non-scribe line region A1 through a deposition process, the first inorganic encapsulation layer 121 and the second inorganic encapsulation layer 123 may also be formed in the scribe line region A2, that is, a portion of the inorganic encapsulation layer is located at the inner wall of the recess 131, and a portion of the inorganic encapsulation layer located at the inner wall of the recess 131 forms a second sub-recess structure (not shown in the drawing); wherein the groove structure 130 comprises a first sub-groove structure and a second sub-groove structure. In addition, after the encapsulation layer 120 is formed, the touch layer 170 may be further formed on the encapsulation layer 120. The recess structure may further include a touch layer 170 partially disposed in the recess 131.
Specifically, by adopting the manufacturing method of the display panel in the embodiment of the application, the groove structure 130 is formed in the cutting channel region A2, when the panel is cut by adopting the module two-cutting process, cracks generated by cutting can be cut off, the cracks generated by cutting are prevented from extending towards the display region, and meanwhile, the packaging effect of the panel is enhanced, so that the yield and reliability of the panel are improved. In addition, on the basis of ensuring the display performance and the product yield of the display panel, the frame width of the display panel is greatly reduced, the screen occupation ratio of the display panel is effectively improved, and the display panel provided by the embodiment of the application can be applied to products such as narrow frames.
In addition, when the array layer 140, the first inorganic encapsulation layer 121 and the second inorganic encapsulation layer 123 are formed in the non-scribe line region A1, the array layer 140, the first inorganic encapsulation layer 121 and the second inorganic encapsulation layer 123 may be formed in the scribe line region A2, respectively, so that the number of corresponding process steps for patterning the film layer is reduced, and correspondingly, the number of masks is reduced, and the production cost and the process steps are reduced. Meanwhile, forming the array layer 140, the first inorganic encapsulation layer 121, and the second inorganic encapsulation layer 123 may completely cover all areas, thereby realizing extension of the encapsulation active area.
Specifically, the step of forming the display device may specifically include forming the array layer 140 (i.e. array composite layer) on the substrate 110 corresponding to the non-scribe line region A1 by a deposition process, or forming the array layer 140 in the scribe line region A2, that is, a portion of the array layer 140 is located on the inner wall of the groove 131, and the array layer 140 located on the inner wall of the groove 131 forms a first sub-groove structure; then, a pixel defining layer 150 is formed on the array layer 140. In addition, the step of forming the display device further includes forming a planarization layer 160 on the array layer 140, and the step of forming the recess 131 may be located before the step of forming the pixel defining layer 150 or may be located before the step of forming the planarization layer 160. In addition, the step of forming the display device further includes forming an anode layer, a light emitting layer, a cathode layer, and the like, which are not described in detail herein.
Wherein the substrate 110 includes a first organic layer 111, an inorganic layer 112, and a second organic layer 113, and the step of forming the recess 131 further includes forming the recess 131 through the second organic layer 113 and contacting the inorganic layer 112.
Specifically, as can be seen from the above, a portion of the substrate 110 may be partially etched away by a laser technique to form the groove 131. In forming the grooves 131, the grooves 131 may be formed to a specific depth by controlling process parameters of the laser technology, such as an operation time or an operation energy of the laser technology, etc., such that the grooves 131 pass through the second organic layer 113 and extend into the inorganic layer 112 to interface with the inorganic layer 112. After forming the recess 131 of a certain depth, a portion of the film layer forming the display device and the encapsulation layer 120 may be formed on the inner wall of the recess 131 to finally form the recess structure 130, i.e., the finally formed recess structure 130 passes through the second organic layer 113 and meets the inorganic layer 112. By adopting the groove structure 130 to connect with the inorganic layer 112, the slopes and the bottoms of the inorganic layer 112 and the groove structure 130 are overlapped to form a complete packaging area, which can obstruct water and oxygen invasion, prolongs the path of water and oxygen invasion and is more beneficial to packaging effect.
In addition, it should be noted that, when the recess structure 130 includes the first inorganic package layer 121 and the second inorganic package layer 123, by adopting the recess structure 130 to connect with the inorganic layer 112, the inorganic layer 112 and the second inorganic package layer 123 overlap at the slope and the bottom of the recess structure 130, that is, the second inorganic package layer 123 in the package layer 120 is directly contacted with the inorganic layer 112 in the substrate 110, so that the risk of package failure caused by peeling of the inorganic and organic films in the prior art can be eliminated due to direct contact between the two inorganic layers (such as the second inorganic package layer 123 and the inorganic layer 112) while ensuring the isolation of water and oxygen.
It should be understood that, the specific structure and the manufacturing process of the manufacturing method of the display panel in the embodiment of the present application may refer to the above-mentioned embodiment of the display panel, and will not be repeated herein.
According to the above, the present application provides a display panel and a manufacturing method thereof, the display panel includes: a substrate; a display device on the substrate; an encapsulation layer on the display device; the display panel further comprises a non-cutting channel region and a cutting channel region positioned outside the non-cutting channel region, wherein the cutting channel region is provided with a groove structure. Through set up groove structure in the cutting district, when adopting two cutting processes of module to cut the panel, can cut because the crackle that the cutting produced, the crackle that produces when avoiding the cutting extends to the display area, simultaneously, strengthens the encapsulation effect of panel to improve the yield and the reliability of panel.
The foregoing description of the preferred embodiments of the application is not intended to be limiting, but rather is intended to cover all modifications, equivalents, and alternatives falling within the spirit and principles of the application.
Claims (6)
1. A display panel, comprising:
a substrate including a first organic layer, an inorganic layer, and a second organic layer, which are stacked;
a display device on the second organic layer;
the packaging layer is positioned on the display device and comprises a first inorganic packaging layer, an organic packaging layer and a second inorganic packaging layer which are arranged on the display device in a stacked mode;
the touch control layer is positioned on the packaging layer;
the display panel further comprises a non-cutting channel region and a cutting channel region positioned outside the non-cutting channel region, wherein the cutting channel region is provided with a groove structure; the groove structure penetrates through the second organic layer and the inorganic layer; the number of the groove structures is multiple, the distance between two adjacent groove structures in a first direction is larger than 10um, the first direction is a direction parallel to the substrate, the first inorganic packaging layer and/or the second inorganic packaging layer cover at least part of the cutting channel area, the touch layer covers the cutting channel area, and the groove structures comprise part of the touch layer and part of the first inorganic packaging layer and/or part of the second inorganic packaging layer;
the cross section of any groove structure is one of triangle, inverted trapezoid, ellipse and rectangle.
2. The display panel of claim 1, wherein the groove structure is spaced from an outer edge of the scribe line region by a distance ranging from 0 to 120um in a first direction, the first direction being a direction parallel to the substrate.
3. The display panel of claim 1, wherein the groove structure has a width greater than 5um and a depth ranging from 1 um to 20um.
4. The display panel of claim 1, wherein a plurality of the groove structures have different depths.
5. A method for manufacturing a display panel, comprising:
providing a substrate, wherein the substrate comprises a first organic layer, an inorganic layer and a second organic layer which are stacked, and the substrate comprises a cutting channel area and a non-cutting channel area;
forming a plurality of grooves in the cutting channel region, wherein the grooves penetrate through the second organic layer and the inorganic layer, and the cross section of any groove structure is one of triangle, inverted trapezoid, ellipse and rectangle;
forming a display device on the second organic layer, wherein part of the film layer of the display device is positioned in the grooves to form a plurality of first sub-groove structures;
forming an encapsulation layer on the display device, wherein the encapsulation layer comprises a first inorganic encapsulation layer, an organic encapsulation layer and a second inorganic encapsulation layer which are stacked on the display device; part of the film layer of the packaging layer is positioned in the grooves to form a plurality of second sub-groove structures;
forming a touch layer on the packaging layer, wherein part of the touch layer is positioned in the grooves;
each groove structure comprises a first sub-groove structure, a second sub-groove structure and a part of the touch layer, the distance between two adjacent groove structures in a first direction is larger than 10um, and the first direction is parallel to the substrate.
6. The method of manufacturing a display panel according to claim 5, wherein the step of forming the display device comprises:
forming an array layer on the second organic layer;
forming a pixel definition layer on the array layer;
wherein the step of forming the display device further comprises forming a planarization layer on the array layer, the step of forming the plurality of grooves being located before the step of forming the pixel defining layer, or the step of forming the plurality of grooves being located before the step of forming the planarization layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210653806.5A CN115050908B (en) | 2022-06-09 | 2022-06-09 | Display panel and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210653806.5A CN115050908B (en) | 2022-06-09 | 2022-06-09 | Display panel and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN115050908A CN115050908A (en) | 2022-09-13 |
| CN115050908B true CN115050908B (en) | 2023-12-01 |
Family
ID=83162234
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210653806.5A Active CN115050908B (en) | 2022-06-09 | 2022-06-09 | Display panel and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115050908B (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105226079A (en) * | 2015-11-05 | 2016-01-06 | 上海天马微电子有限公司 | Display device |
| CN110246879A (en) * | 2019-06-12 | 2019-09-17 | 上海天马有机发光显示技术有限公司 | A kind of organic light emitting display panel and device |
| CN110391350A (en) * | 2019-07-29 | 2019-10-29 | 云谷（固安）科技有限公司 | Display panel and display device |
| CN111261643A (en) * | 2020-02-10 | 2020-06-09 | 武汉华星光电半导体显示技术有限公司 | Flexible display panel and preparation method |
| WO2020124916A1 (en) * | 2018-12-18 | 2020-06-25 | 武汉华星光电半导体显示技术有限公司 | Full-screen display panel and fabrication method therefor |
| CN111403621A (en) * | 2020-03-25 | 2020-07-10 | 武汉华星光电半导体显示技术有限公司 | O L ED display panel, preparation method thereof and O L ED display device |
| CN111430566A (en) * | 2020-03-30 | 2020-07-17 | 武汉华星光电半导体显示技术有限公司 | O L ED display panel and display device |
| CN112467053A (en) * | 2020-11-26 | 2021-03-09 | Oppo广东移动通信有限公司 | Display panel and display device |
-
2022
- 2022-06-09 CN CN202210653806.5A patent/CN115050908B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105226079A (en) * | 2015-11-05 | 2016-01-06 | 上海天马微电子有限公司 | Display device |
| WO2020124916A1 (en) * | 2018-12-18 | 2020-06-25 | 武汉华星光电半导体显示技术有限公司 | Full-screen display panel and fabrication method therefor |
| CN110246879A (en) * | 2019-06-12 | 2019-09-17 | 上海天马有机发光显示技术有限公司 | A kind of organic light emitting display panel and device |
| CN110391350A (en) * | 2019-07-29 | 2019-10-29 | 云谷（固安）科技有限公司 | Display panel and display device |
| CN111261643A (en) * | 2020-02-10 | 2020-06-09 | 武汉华星光电半导体显示技术有限公司 | Flexible display panel and preparation method |
| CN111403621A (en) * | 2020-03-25 | 2020-07-10 | 武汉华星光电半导体显示技术有限公司 | O L ED display panel, preparation method thereof and O L ED display device |
| CN111430566A (en) * | 2020-03-30 | 2020-07-17 | 武汉华星光电半导体显示技术有限公司 | O L ED display panel and display device |
| CN112467053A (en) * | 2020-11-26 | 2021-03-09 | Oppo广东移动通信有限公司 | Display panel and display device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN115050908A (en) | 2022-09-13 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN109065552B (en) | OLED display device | |
| EP3660938B1 (en) | Encapsulation structure, display panel and manufacturing method therefor | |
| WO2020191875A1 (en) | Display panel and display device | |
| JP2022516590A (en) | Flexible substrate, its manufacturing method, display device | |
| CN110544714B (en) | Display panel, manufacturing method thereof and display device | |
| CN111710691B (en) | Flexible Micro-LED display panel and manufacturing method thereof | |
| KR20100138816A (en) | Display apparatus | |
| CN110473983B (en) | Display panel mother board and preparation method of display panel mother board | |
| WO2021097690A1 (en) | Display substrate and manufacturing method therefor, and display device | |
| CN111900260A (en) | Display panel, preparation method thereof and display device | |
| WO2020211288A1 (en) | Display panel and display device | |
| KR102272883B1 (en) | Method and structure for encapsulating thin films, display device | |
| US20180335677A1 (en) | Display Panel, Method Of Manufacturing Display Panel And Display Device | |
| CN111554831A (en) | Flexible display substrate, preparation method thereof and display device | |
| CN110690259A (en) | Array substrate, OLED display panel and mask plate | |
| US8044578B2 (en) | Organic electroluminescence display device and method of fabricating the same | |
| WO2022226686A1 (en) | Display substrate, fabrication method therefor, and display device | |
| CN115050908B (en) | Display panel and manufacturing method thereof | |
| US20240047378A1 (en) | Display panel and mobile terminal | |
| CN111415967A (en) | Display panel and manufacturing method thereof | |
| US20230403889A1 (en) | Display panel and manufacturing method thereof | |
| US20220149325A1 (en) | Display substrate and method for forming display substrate, and display device | |
| US10833290B2 (en) | Encapsulation method of organic light emitting diode device and encapsulation structure encapsulated using same | |
| CN113764608B (en) | Display panel and preparation method thereof | |
| CN115207245B (en) | Display panel, manufacturing method thereof and display device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |