CN111697151A - OLED flexible display panel, device and manufacturing method - Google Patents

OLED flexible display panel, device and manufacturing method Download PDF

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Publication number
CN111697151A
CN111697151A CN201910183608.5A CN201910183608A CN111697151A CN 111697151 A CN111697151 A CN 111697151A CN 201910183608 A CN201910183608 A CN 201910183608A CN 111697151 A CN111697151 A CN 111697151A
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China
Prior art keywords
flexible substrate
layer
dam structure
display panel
plane
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CN201910183608.5A
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Chinese (zh)
Inventor
尤莹
薛丽红
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EverDisplay Optronics Shanghai Co Ltd
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EverDisplay Optronics Shanghai Co Ltd
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Priority to CN201910183608.5A priority Critical patent/CN111697151A/en
Publication of CN111697151A publication Critical patent/CN111697151A/en
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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/84Passivation; Containers; Encapsulations
    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09FDISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/301Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/84Passivation; Containers; Encapsulations
    • H10K50/842Containers
    • H10K50/8426Peripheral sealing arrangements, e.g. adhesives, sealants
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

The invention discloses an OLED flexible display panel, a device and a manufacturing method, wherein the flexible display panel comprises: the display device comprises a flexible substrate, a light emitting layer and a light receiving layer, wherein the flexible substrate is limited to a display area and a non-display area, the non-display area surrounds the display area, and the organic light emitting layer is arranged in the display area of the flexible substrate; the dam structure is arranged in the non-display area of the flexible substrate and surrounds the display area; and a thin film encapsulation layer covering the dam structure and the organic light emitting layer; the dam structure is arranged above the scanning circuit in the flexible substrate, namely the array substrate, so that the barrier effect on external water and oxygen is achieved, the width of a non-display area in the flexible display panel is further reduced, a frame is reduced, and a smaller frame can be obtained while the water blocking capacity is ensured.

Description

OLED flexible display panel, device and manufacturing method
Technical Field
The invention relates to the technology in the field of OLED, in particular to an OLED flexible display panel, an OLED flexible display device and a manufacturing method.
Background
Organic Light-Emitting Display (OLED) devices have been rapidly developed in the Display field due to their advantages of being ultra-thin, low power consumption, high brightness, high Light-Emitting efficiency, and applicable to flexible displays, but their development has been restricted by the drawback of short service life. The attack of OLED devices by water and oxygen is a major cause affecting their lifetime. On one hand, the cathode of the OLED device is usually metal with relatively active chemical properties, and electrochemical corrosion is easy to occur in a water-oxygen environment to cause the failure of the device; on the other hand, a carbonyl compound generated by the oxidation of oxygen and a light-emitting functional layer in the OLED device is an effective quencher, the luminous quantum efficiency of the OLED device can be reduced, and meanwhile, water vapor can hydrolyze the organic layer compound in the OLED device to reduce the conductivity, so that the service life of the device is greatly shortened.
Since OLED devices are highly susceptible to water and oxygen attack, the OLED devices need to be strictly separated from the water and oxygen in the environment to extend the lifetime of the OLED devices. In the prior art, a Thin Film Encapsulation (TFE) layer is usually coated on the surface of the OLED device to isolate the water and oxygen attack.
The width from the display area of the existing OLED display panel to the edge of the panel is too wide, the design of a narrow frame is not facilitated, the capability of blocking water and oxygen is too low, and the OLED device cannot be strictly separated from the water and oxygen.
Disclosure of Invention
In view of the problems in the prior art, an object of the present invention is to provide an OLED flexible display panel, an OLED flexible display device, and a method for manufacturing the OLED flexible display panel, in which a dam structure is disposed above a scan circuit in a flexible substrate, i.e., an array substrate, so as to block external water and oxygen, further reduce the width of a non-display area in the flexible display panel, and thus reduce a bezel, i.e., a smaller bezel can be obtained while ensuring a water blocking capability.
According to an aspect of the present invention, there is provided an OLED flexible display panel including:
a flexible substrate defined as a display area and a non-display area surrounding the display area,
the organic light-emitting layer is arranged in the display area of the flexible substrate;
a dam structure disposed in a non-display area of the flexible substrate and surrounding the display area; and
a thin film encapsulation layer covering the dam structure and the organic light emitting layer;
the scanning circuit is arranged in the flexible substrate and is positioned in a non-display area of the flexible substrate, and a projection area of the scanning circuit on the surface of the flexible substrate comprises a projection area of the dam structure on the surface of the flexible substrate.
Preferably, the dam structure includes a first plane parallel to the flexible substrate, a second plane intersecting the flexible substrate and the first plane of the dam structure, and a third plane intersecting the flexible substrate and the first plane of the dam structure;
and an included angle between the second plane of the dam structure and the flexible substrate is larger than an included angle between the third plane of the dam structure and the flexible substrate.
Preferably, an included angle between the second plane of the dam structure and the flexible substrate is 75-85 degrees;
and an included angle between the third plane of the dam structure and the flexible substrate is 75-85 degrees.
Preferably, the first plane of the dam structure is provided with a plurality of first grooves for matching with the thin film packaging layer to increase the adhesion of the thin film packaging layer;
the plurality of first grooves are uniformly distributed along a first direction, each first groove extends along a second direction, and the first direction is perpendicular to the second direction.
Preferably, the thin film encapsulation layer includes:
a first inorganic layer covering the dam structure and the organic light emitting layer;
the organic layer is arranged on one side, far away from the flexible substrate, of the first inorganic layer;
a second inorganic layer covering the organic layer and the first inorganic layer.
Preferably, the material of the dam structure is carbon fiber, glass fiber or carbon nanotube.
Preferably, the thin film encapsulation layer includes:
a first inorganic layer covering the dam structure and the organic light emitting layer;
the organic layer is arranged on one side, far away from the flexible substrate, of the first inorganic layer;
a second inorganic layer covering the organic layer and the first inorganic layer;
wherein a distance between a side surface of the second inorganic layer of the display region, which is remote from the organic layer, and a side surface of the flexible substrate, which is opposite to the organic light emitting layer, is smaller than a distance between the first plane of the dam structure and a side surface of the flexible substrate, which is opposite to the organic light emitting layer.
Preferably, a plurality of second grooves are formed in the surface of the first inorganic layer, which is far away from the flexible substrate, and are used for reducing the flow speed of the organic material forming the organic layer;
the plurality of second grooves are uniformly distributed along a first direction, each second groove extends along a second direction, and a projection of each second groove on the surface of the flexible substrate is located in the non-display area, wherein the first direction is perpendicular to the second direction.
According to an aspect of the present invention, there is provided a display device including the OLED flexible display panel described above.
According to an aspect of the present invention, there is provided a method of manufacturing an OLED flexible display panel, including:
forming a dam structure in a non-display area of a flexible substrate, wherein the dam structure surrounds the display area, and a plurality of scanning circuits are included in the flexible substrate, and a projection area of the scanning circuits on the flexible substrate comprises a projection area of the dam structure on the flexible substrate;
forming an organic light emitting layer in a display area of the flexible substrate;
and forming a thin film packaging layer covering the dam structure and the organic light emitting layer.
Preferably, the dam structure includes a first plane parallel to the flexible substrate, and the method further includes:
the dam structure comprises a film packaging layer, a plurality of first grooves and a plurality of second grooves, wherein the film packaging layer is arranged on the first plane of the dam structure, the first grooves are used for being matched with the film packaging layer to increase the adhesive force of the film packaging layer, the first grooves are uniformly distributed along a first direction, each first groove extends along a second direction, and the first direction is perpendicular to the second direction.
Preferably, the thin film encapsulation layer includes:
a first inorganic layer covering the dam structure and the organic light emitting layer;
the organic layer is arranged on one side, far away from the flexible substrate, of the first inorganic layer;
a second inorganic layer covering the organic layer and the first inorganic layer;
wherein a distance between a side surface of the second inorganic layer of the display region, which is remote from the organic layer, and a side surface of the flexible substrate, which is opposite to the organic light emitting layer, is smaller than a distance between the first plane of the dam structure and a side surface of the flexible substrate, which is opposite to the organic light emitting layer.
The beneficial effects of the above technical scheme are:
according to the OLED flexible display panel, the OLED flexible display device and the manufacturing method, the dam structure is arranged above the scanning circuit in the flexible substrate, namely the array substrate, so that the barrier effect on external water and oxygen is achieved, the width of a non-display area in the flexible display panel is further reduced, and a frame is reduced, namely a smaller frame can be obtained while the water resistance is ensured.
Further features and advantages of the invention, as well as the structure and operation of various embodiments of the invention, are described in detail below with reference to the accompanying drawings. It should be noted that the present invention is not limited to the specific embodiments described herein. These examples are given herein for illustrative purposes only.
Drawings
Other features, objects and advantages of the present invention will become more apparent upon reading of the following detailed description of non-limiting embodiments thereof, with reference to the accompanying drawings.
FIG. 1 is a schematic plan view of an OLED flexible display panel according to a preferred embodiment of the present invention;
FIG. 2 is a schematic partial cross-sectional view of the flexible display panel of FIG. 1 in a preferred embodiment of the present invention;
fig. 3 is a flowchart illustrating a method for manufacturing an OLED flexible display panel according to a preferred embodiment of the invention.
List of reference numerals:
100 flexible display panel
101 non-display area
102 display area
103 scanning circuit
110 thin film encapsulation layer
111 first inorganic layer
112 organic layer
113 second inorganic layer
120 flexible substrate
130 organic light emitting layer
140 dam structure
141 first plane
142 second plane
143 third plane
The features and advantages of the present invention will become more apparent from the following detailed description taken in conjunction with the accompanying drawings. Throughout the drawings, like reference numerals designate corresponding elements. In the drawings, like reference numbers generally indicate identical, functionally similar, and/or structurally similar elements.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be obtained by a person skilled in the art without inventive effort based on the embodiments of the present invention, are within the scope of the present invention.
As used in this application, the terms "first," "second," and the like do not denote any order, quantity, or importance, but rather are used to distinguish one element from another. The word "comprising" or "comprises", and the like, means that the element or item listed before the word covers the element or item listed after the word and its equivalents, but does not exclude other elements or items. The terms "connected" or "coupled" and the like are not restricted to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "upper", "lower", "left", "right", and the like are used merely to indicate relative positional relationships, and when the absolute position of the object being described is changed, the relative positional relationships may also be changed accordingly.
It should be noted that the embodiments and features of the embodiments may be combined with each other without conflict.
The invention is further described with reference to the following drawings and specific examples, which are not intended to be limiting.
According to an aspect of the present invention, there is provided an OLED flexible display panel.
Fig. 1 is a schematic plan view of an OLED flexible display panel. The flexible display panel 100 shown in fig. 1 includes a flexible substrate 120, an organic light emitting layer 130, a dam structure 140, a thin film encapsulation layer 110, and a scan circuit 103. The flexible display panel 100 in fig. 1 has a rectangular shape, and is divided into a display region 102 and a non-display region 101, and the corresponding flexible substrate 120 is also divided into the display region 102 and the non-display region 101. A scanning circuit 103 is disposed in the non-display region 101 of the flexible substrate 120, i.e., the flexible array substrate, and the scanning circuit 103 surrounds the display region 102 (a part of the scanning circuit 103 is shown in fig. 1) for controlling the on and off of the TFT switches in the flexible substrate 120.
Fig. 2 is a schematic partial cross-sectional view of the flexible display panel plane in fig. 1. The surface of the flexible substrate 120 is provided with an organic light emitting layer 130, and the organic light emitting layer 130 is located in the display region 102. A dam structure 140 is disposed in the non-display area 101 of the flexible substrate 120, the dam structure 140 surrounding the display area 102. The organic light emitting layer and the dam structure 140 are covered with the thin film encapsulation layer 110. The projection area of the scan circuit 103 on the surface of the flexible substrate 120 in the flexible substrate 120 includes the projection area of the dam structure 140 on the surface of the flexible substrate 120, i.e. the dam structure 140 is located above the scan circuit 103 (i.e. in the X direction).
In some embodiments, the flexible substrate 120 (array substrate) includes a substrate, a buffer layer disposed on the substrate, and a plurality of thin film transistors disposed on a side of the buffer layer away from the substrate and arranged in an array, wherein the thin film transistors include a semiconductor active layer, a gate insulating layer, a gate electrode, an interlayer insulating layer, a source drain electrode, a passivation layer, and a planarization layer sequentially disposed on the buffer layer. The organic light emitting layer 130 is disposed on the surface of the flexible substrate 120, and mainly includes a first electrode, a pixel defining layer, an organic functional film layer such as a light emitting layer, a second electrode, and the like.
The thin film encapsulation layer 110 covers the organic light emitting layer 130 and the dam structure 140, and can protect the organic light emitting layer 130 to prevent external moisture and oxygen from affecting the operation characteristics of the devices in the organic light emitting layer 130. The thin film encapsulation layer 110 includes a first inorganic layer 111 covering the organic light emitting layer 130 and the dam structure 140, an organic layer 112 disposed on a side of the first inorganic layer 111 away from the flexible substrate 120, and a second inorganic layer 113 disposed on a side of the organic layer 112 away from the first inorganic layer 111.
Referring to fig. 2, the dam structure 140 is disposed between the flexible substrate 120 and the thin film encapsulation layer 110 and above (i.e., in the X direction) the scan circuit 103 of the non-display region 101. The organic layer 112 is generally formed using an inkjet printing process in which droplets of ink having an organic material dissolved therein are spread on the inner side of the dam structure 140 and the first inorganic layer 111, and then cured, thereby forming the organic layer 112. The dam structure 140 has a barrier effect on the organic layer 112 because the ink droplets have fluidity before curing.
The dam structure 140 includes a first plane 141 parallel to the flexible substrate 120, a second plane 142 intersecting the flexible substrate 120 and the first plane 141 of the dam structure 140, and a third plane 143 intersecting the flexible substrate 120 and the first plane 141 of the dam structure 140, wherein an angle between the second plane 142 of the dam structure 140 and the flexible substrate 120 is smaller than an angle between the third plane 143 of the dam structure 140 and the flexible substrate 120. For example, the angle α between the second plane 142 of the dam structure 140 and the flexible substrate 120 is 75-85 °, and the angle β between the third plane 143 of the dam structure 140 and the flexible substrate 120 is 75-85 °.
In some embodiments, the first plane 141 of the dam structure 140 is provided with a plurality of first grooves for cooperating with the thin film encapsulation layer 110 to increase the adhesion of the thin film encapsulation layer 110. The first grooves are uniformly distributed along a first direction, each first groove extends along a second direction (Y direction), and the first direction is perpendicular to the second direction (Z direction). After the first plane 141 is provided with the plurality of first grooves, the first inorganic layer 111 is disposed, so that the adhesion between the first inorganic layer 111 and the first plane 141 of the dam structure 140 can be increased, so as to increase the oxygen blocking and water blocking effects of the thin film encapsulation layer 110. The material of the dam structure 140 is carbon fiber, glass fiber, carbon nanotube, polyacrylate resin, epoxy resin, phenol resin, polyamide resin, polyimide resin, unsaturated polyester resin, polyphenylene ether resin, polyphenylene sulfide resin, or benzocyclobutene (BCB).
A distance H between a side surface of the second inorganic layer 113 of the display region 102, which is away from the organic layer 112, and a side surface of the flexible substrate 120 opposite to the organic light emitting layer 130 is smaller than a distance H between the first plane 141 of the dam structure 140 and the side surface of the flexible substrate 120 opposite to the organic light emitting layer 130. The height of the dam structure 140 is significantly greater than the thickness of the thin film encapsulation layer 110 and the thickness of the organic light emitting layer 130, i.e., h, so that a groove can be formed on the surface of the second inorganic layer 113. The protective film covering the top of the thin film encapsulation layer 110 can form a cavity with the groove, so that pressure can be effectively isolated when a human finger touches the flexible display panel 100, thereby further preventing damage to devices in the thin film encapsulation layer 110.
In some embodiments, a surface of the first inorganic layer 111 on a side away from the flexible substrate 120 is provided with a plurality of second grooves for reducing a flow velocity of the organic material forming the organic layer 112. The plurality of second grooves are uniformly distributed along a first direction, each second groove extends along a second direction, and a projection of each second groove on the surface of the flexible substrate is located in the non-display area 101, wherein the first direction is perpendicular to the second direction.
According to an aspect of the present invention, there is provided a method of manufacturing an OLED flexible display panel.
Fig. 3 is a schematic flow chart of a method for manufacturing an OLED flexible display panel. The method of manufacturing the flexible display panel shown in fig. 3 includes: step S302, step S304, and step S306. In step S302, a dam structure 140 is formed in the non-display area 101 of the flexible substrate 120, the dam structure 140 surrounds the display area 102, and the flexible substrate 120 includes a plurality of scanning circuits 103, and the projection area of the scanning circuits 103 on the flexible substrate 120 includes the projection area of the dam structure 140 on the flexible substrate 120. In step S304, the organic light emitting layer 130 is formed in the display region 102 of the flexible substrate 120. In step S306, a thin film encapsulation layer 110 covering the dam structure 140 and the organic light emitting layer 130 is formed. The dam structure 140 includes a first planar surface 141 parallel to the flexible substrate 120, and the method further includes: a plurality of first grooves are disposed on the first plane 141 of the dam structure 140 for matching with the thin film encapsulation layer 110 to increase the adhesion of the thin film encapsulation layer 110, the plurality of first grooves are uniformly distributed along a first direction, each first groove extends along a second direction, and the first direction is perpendicular to the second direction. The thin film encapsulation layer 110 includes: a first inorganic layer 111 covering the dam structure 140 and the organic light emitting layer 130; an organic layer 112 disposed on a side of the first inorganic layer 111 away from the flexible substrate 120; a second inorganic layer 113 covering the organic layer 112 and the first inorganic layer 111; wherein a distance between a surface of the second inorganic layer 113 of the display region 102 on a side away from the organic layer 112 and a surface of the flexible substrate 120 on a side opposite to the organic light emitting layer 130 is smaller than a distance between the first plane 141 of the dam structure 140 and a surface of the flexible substrate 120 on a side opposite to the organic light emitting layer 130.
According to an aspect of the present invention, there is provided a display device including the OLED flexible display panel described above.
In summary, according to the OLED flexible display panel, the device and the manufacturing method of the present invention, the dam structure is disposed above the scan circuit in the flexible substrate, i.e., the array substrate, so as to block external water and oxygen, further reduce the width of the non-display area in the flexible display panel, and reduce the bezel, i.e., obtain a smaller bezel while ensuring the water blocking capability.
The foregoing is a more detailed description of the invention in connection with specific preferred embodiments and it is not intended that the invention be limited to these specific details. For those skilled in the art to which the invention pertains, several simple deductions or substitutions can be made without departing from the spirit of the invention, and all shall be considered as belonging to the protection scope of the invention.

Claims (12)

1. An OLED flexible display panel, comprising:
a flexible substrate defined as a display area and a non-display area surrounding the display area,
the organic light-emitting layer is arranged in the display area of the flexible substrate;
a dam structure disposed in a non-display area of the flexible substrate and surrounding the display area; and
a thin film encapsulation layer covering the dam structure and the organic light emitting layer;
the scanning circuit is arranged in the flexible substrate and is positioned in a non-display area of the flexible substrate, and a projection area of the scanning circuit on the surface of the flexible substrate comprises a projection area of the dam structure on the surface of the flexible substrate.
2. The OLED flexible display panel of claim 1, wherein the dam structure comprises a first plane parallel to the flexible substrate, a second plane intersecting the flexible substrate and the first plane of the dam structure, and a third plane intersecting the flexible substrate and the first plane of the dam structure;
and an included angle between the second plane of the dam structure and the flexible substrate is smaller than an included angle between the third plane of the dam structure and the flexible substrate.
3. The OLED flexible display panel of claim 2, wherein an included angle between the second plane of the dam structure and the flexible substrate is 75 ° to 85 °;
and an included angle between the third plane of the dam structure and the flexible substrate is 75-85 degrees.
4. The OLED flexible display panel of claim 2, wherein the first plane of the dam structure is provided with a plurality of first grooves for cooperating with the thin film encapsulation layer to increase adhesion of the thin film encapsulation layer;
the plurality of first grooves are uniformly distributed along a first direction, each first groove extends along a second direction, and the first direction is perpendicular to the second direction.
5. The OLED flexible display panel of claim 1, wherein the thin film encapsulation layer comprises:
a first inorganic layer covering the dam structure and the organic light emitting layer;
the organic layer is arranged on one side, far away from the flexible substrate, of the first inorganic layer;
a second inorganic layer covering the organic layer and the first inorganic layer.
6. The OLED flexible display panel of claim 1, wherein the material of the dam structure is carbon fiber, glass fiber, or carbon nanotubes.
7. The OLED flexible display panel of claim 2, wherein the thin film encapsulation layer comprises:
a first inorganic layer covering the dam structure and the organic light emitting layer;
the organic layer is arranged on one side, far away from the flexible substrate, of the first inorganic layer;
a second inorganic layer covering the organic layer and the first inorganic layer;
wherein a distance between a side surface of the second inorganic layer of the display region, which is remote from the organic layer, and a side surface of the flexible substrate, which is opposite to the organic light emitting layer, is smaller than a distance between the first plane of the dam structure and a side surface of the flexible substrate, which is opposite to the organic light emitting layer.
8. The OLED flexible display panel according to claim 7, wherein a surface of the first inorganic layer on a side away from the flexible substrate is provided with a plurality of second grooves for reducing a flow velocity of an organic material forming the organic layer;
the plurality of second grooves are uniformly distributed along a first direction, each second groove extends along a second direction, and a projection of each second groove on the surface of the flexible substrate is located in the non-display area, wherein the first direction is perpendicular to the second direction.
9. A display device comprising the OLED flexible display panel according to any one of claims 1 to 8.
10. A manufacturing method of an OLED flexible display panel is characterized by comprising the following steps:
forming a dam structure in a non-display area of a flexible substrate, wherein the dam structure surrounds the display area, and a plurality of scanning circuits are included in the flexible substrate, and a projection area of the scanning circuits on the flexible substrate comprises a projection area of the dam structure on the flexible substrate;
forming an organic light emitting layer in a display area of the flexible substrate;
and forming a thin film packaging layer covering the dam structure and the organic light emitting layer.
11. The method of manufacturing an OLED flexible display panel according to claim 10, wherein the dam structure includes a first plane parallel to the flexible substrate, the method further comprising:
the dam structure comprises a film packaging layer, a plurality of first grooves and a plurality of second grooves, wherein the film packaging layer is arranged on the first plane of the dam structure, the first grooves are used for being matched with the film packaging layer to increase the adhesive force of the film packaging layer, the first grooves are uniformly distributed along a first direction, each first groove extends along a second direction, and the first direction is perpendicular to the second direction.
12. The method of manufacturing an OLED flexible display panel according to claim 11, wherein the thin film encapsulation layer includes:
a first inorganic layer covering the dam structure and the organic light emitting layer;
the organic layer is arranged on one side, far away from the flexible substrate, of the first inorganic layer;
a second inorganic layer covering the organic layer and the first inorganic layer;
wherein a distance between a side surface of the second inorganic layer of the display region, which is remote from the organic layer, and a side surface of the flexible substrate, which is opposite to the organic light emitting layer, is smaller than a distance between the first plane of the dam structure and a side surface of the flexible substrate, which is opposite to the organic light emitting layer.
CN201910183608.5A 2019-03-12 2019-03-12 OLED flexible display panel, device and manufacturing method Pending CN111697151A (en)

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Application Number Priority Date Filing Date Title
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CN107507931A (en) * 2017-08-23 2017-12-22 京东方科技集团股份有限公司 Method for packing, encapsulating structure and the display device of oled display substrate
CN206976349U (en) * 2017-06-30 2018-02-06 昆山国显光电有限公司 Oled display panel
CN108878480A (en) * 2018-06-07 2018-11-23 武汉华星光电半导体显示技术有限公司 Display panel and display device
CN108962947A (en) * 2018-07-04 2018-12-07 上海天马微电子有限公司 Flexible display panel and display device

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20170287995A1 (en) * 2016-04-04 2017-10-05 Samsung Display Co., Ltd. Display device with protection and encapsulation layers to seal display unit
US20170365814A1 (en) * 2016-06-16 2017-12-21 Samsung Display Co., Ltd. Display device having improved environmental tolerance
CN107068720A (en) * 2017-04-19 2017-08-18 上海天马微电子有限公司 Organic light-emitting diode display panel and display device
CN206976349U (en) * 2017-06-30 2018-02-06 昆山国显光电有限公司 Oled display panel
CN107507931A (en) * 2017-08-23 2017-12-22 京东方科技集团股份有限公司 Method for packing, encapsulating structure and the display device of oled display substrate
CN108878480A (en) * 2018-06-07 2018-11-23 武汉华星光电半导体显示技术有限公司 Display panel and display device
CN108962947A (en) * 2018-07-04 2018-12-07 上海天马微电子有限公司 Flexible display panel and display device

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Application publication date: 20200922

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