CN116783544A - Display module, manufacturing method thereof and display device - Google Patents
Display module, manufacturing method thereof and display device Download PDFInfo
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- CN116783544A CN116783544A CN202280000041.3A CN202280000041A CN116783544A CN 116783544 A CN116783544 A CN 116783544A CN 202280000041 A CN202280000041 A CN 202280000041A CN 116783544 A CN116783544 A CN 116783544A
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 11
- 239000000758 substrate Substances 0.000 claims abstract description 147
- 238000000034 method Methods 0.000 abstract description 9
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 6
- 229910052710 silicon Inorganic materials 0.000 description 6
- 239000010703 silicon Substances 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000003190 augmentative effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 239000002210 silicon-based material Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
Abstract
The disclosure provides a display module, a manufacturing method thereof and a display device, and belongs to the technical field of display. The display module includes: a first binding area of the circuit board is provided with a first row of circuit board bonding pads and a second row of circuit board bonding pads, and each row of circuit board bonding pads comprises a plurality of circuit board bonding pads which are arranged at intervals along a first direction; a plurality of substrate bonding pads arranged along the first direction are arranged on a second binding area of the display substrate, orthographic projection of the display substrate on the circuit board is not overlapped with the first binding area, and the second binding area is close to the first binding area; the circuit board bonding pad is bound with the substrate bonding pad through a suspended wiring; the second row of circuit board bonding pads comprise a first circuit board bonding pad and a second circuit board bonding pad, wiring bound with the substrate bonding pad is not arranged on the second circuit board bonding pad, and the distance between the first row of circuit board bonding pads is smaller than the distance between the second row of circuit board bonding pads. The technical scheme of the disclosure can improve the process yield and reliability of the display module.
Description
The disclosure relates to the technical field of display, in particular to a display module, a manufacturing method thereof and a display device.
An OLED (Organic Light-Emitting Diode) display device has been listed as a next-generation display technology with great development prospects due to its advantages of thinness, lightness, wide viewing angle, active Light emission, continuous and adjustable Light emission color, low cost, fast response speed, low energy consumption, low driving voltage, wide operating temperature range, simple production process, high Light emission efficiency, flexible display, and the like.
A silicon-based OLED microdisplay is a display device that integrates millions or even more light emitting pixels on a substrate (silicon-based material) of a size below 2 inches. In recent years, with the advent of high-tech products such as AR (augmented reality)/VR (virtual reality), the demand for silicon-based OLED micro-displays is increasing.
Disclosure of Invention
The technical problem to be solved by the disclosure is to provide a display module, a manufacturing method thereof and a display device, and the process yield and reliability of the display module can be improved.
In order to solve the above technical problems, the embodiments of the present disclosure provide the following technical solutions:
in one aspect, a display module is provided, including:
the circuit board comprises a first binding area, wherein the first binding area is provided with two rows of circuit board bonding pads, and each row of circuit board bonding pads comprises a plurality of circuit board bonding pads which are arranged at intervals along a first direction;
the display substrate is positioned on the circuit board and comprises a second binding area, a plurality of substrate bonding pads arranged along a first direction are arranged on the second binding area, orthographic projection of the display substrate on the circuit board is not overlapped with the first binding area, and the second binding area is close to the first binding area;
the circuit board bonding pad is bound with the substrate bonding pad through a suspended wiring;
wherein the two rows of circuit board pads comprise a first row of circuit board pads and a second row of circuit board pads,
the second row of circuit board bonding pads comprise first circuit board bonding pads and second circuit board bonding pads, the first circuit board bonding pads and the second circuit board bonding pads are alternately arranged, wiring bound with the substrate bonding pads is not arranged on the second circuit board bonding pads, and the distance between the first row of circuit board bonding pads is smaller than the distance between the second row of circuit board bonding pads.
In some embodiments, the area of the orthographic projection of the first circuit board pad on the display substrate is larger than the area of the orthographic projection of the second circuit board pad on the display substrate.
In some embodiments, the area of the orthographic projection of the first circuit board pad on the display substrate is larger than the area of the substrate pad, and the area of the orthographic projection of the second circuit board pad on the display substrate is larger than the area of the substrate pad.
In some embodiments, in the second row of circuit board pads, the first circuit board pads are spaced apart from the second circuit board pads and are equal in number.
In some embodiments, the substrate pads include a plurality of groups of first pads for transmitting high-speed differential signals and second pads other than the first pads, each group of first pads includes two first pads, the second pads are not disposed between the two first pads, at least one second pad is disposed between two adjacent groups of first pads, and the connection trace length of each group of first pads and the corresponding circuit board pad is equal.
In some embodiments, the trace length of the connection of the second row of circuit board pads to the substrate pads is greater than the trace length of the connection of the first row of circuit board pads to the substrate pads.
In some embodiments, the circuit board pads have a maximum width in a second direction that is greater than a maximum width in the first direction, the second direction being perpendicular or substantially perpendicular to the first direction.
In some embodiments, the second circuit board pads are located in a middle portion of the second row of circuit board pads.
In some embodiments, an included angle between a first orthographic projection of a connection line of the first row of circuit board pads and the substrate pads on the circuit board and an extending direction of the first row of circuit board pads is smaller than an included angle between a first orthographic projection of a connection line of the second row of circuit board pads and the substrate pads on the circuit board and an extending direction of the second row of circuit board pads.
In some embodiments, a distance between the first row of circuit board pads and the second row of circuit board pads is less than a distance between adjacent circuit board pads in the first row of circuit board pads.
In some embodiments, the orthographic projection of the first binding region in the first direction exceeds the orthographic projection of the second binding region in the first direction, and a minimum distance between a first boundary of the first binding region in a second direction perpendicular or substantially perpendicular to the first direction and a second boundary of the second binding region in the second direction is less than a preset first threshold.
In some embodiments, the orthographic projection of the first binding region in the first direction is located within the orthographic projection of the second binding region in the first direction.
In some embodiments, an included angle between the trace and a second direction is smaller than a preset second threshold, and the second direction is perpendicular or substantially perpendicular to the first direction.
In some embodiments, the first binding region has an extension in the first direction that is greater than an extension in the first direction of the second binding region.
In some embodiments, the circuit board pads in the first row of circuit board pads are staggered with the circuit board pads in the second row of circuit board pads in the first direction.
In some embodiments, a trace length of a connection of each set of the first pads and the corresponding circuit board pads is greater than a distance of the first row of circuit board pads and the second row of circuit board pads in a second direction, the second direction being perpendicular or substantially perpendicular to the first direction.
In some embodiments, the display area of the display substrate includes a plurality of sub-pixels, and the distance between the first row of circuit board pads and the second row of circuit board pads in a second direction is greater than a maximum width of the sub-pixels, and the second direction is perpendicular or substantially perpendicular to the first direction.
In some embodiments, the maximum width of the second circuit board pad in a second direction is less than the maximum width of the first circuit board pad in a second direction, the second direction being perpendicular or substantially perpendicular to the first direction.
In some embodiments, the number of first circuit board pads is greater than the number of second circuit board pads.
The embodiment of the disclosure also provides a display device, which comprises the display module.
The embodiment of the disclosure also provides a manufacturing method of the display module, which comprises the following steps:
providing a circuit board, wherein the circuit board comprises a first binding area, the first binding area is provided with two rows of circuit board bonding pads, and each row of circuit board bonding pads comprises a plurality of circuit board bonding pads which are arranged at intervals along a first direction;
forming a display substrate on the circuit board, wherein the display substrate comprises a second binding area, a plurality of substrate bonding pads arranged along a first direction are arranged on the second binding area, orthographic projection of the display substrate on the circuit board is not overlapped with the first binding area, and the second binding area is close to the first binding area;
forming a suspended wiring binding the circuit board bonding pad and the substrate bonding pad;
wherein the two rows of circuit board pads comprise a first row of circuit board pads and a second row of circuit board pads,
the second row of circuit board bonding pads comprise first circuit board bonding pads and second circuit board bonding pads, the first circuit board bonding pads and the second circuit board bonding pads are alternately arranged, wiring bound with the substrate bonding pads is not arranged on the second circuit board bonding pads, and the distance between the first row of circuit board bonding pads is smaller than the distance between the second row of circuit board bonding pads.
The embodiment of the disclosure has the following beneficial effects:
in the scheme, the two rows of circuit board bonding pads are arranged on the circuit board, so that the arrangement of the circuit board bonding pads is more concentrated, the width of the first binding area can be reduced, the circuit board bonding pads are closer to the substrate bonding pads, the length of wires binding the circuit board bonding pads and the substrate bonding pads is reduced, the binding angle of the wires can be increased, and the reliability of a wire bonding process is ensured.
Fig. 1 and 2 are schematic diagrams of a conventional display module;
fig. 3-5 are schematic diagrams of a display module according to an embodiment of the disclosure.
Reference numerals
1. Display substrate
2. Circuit board
3. Protective adhesive
4. Wiring
5. Circuit board bonding pad
6. Substrate bonding pad
61. First bonding pad
62. Second bonding pad
53. First circuit board bonding pad
52. Second circuit board bonding pad
In order to make the technical problems, technical solutions and advantages to be solved by the embodiments of the present disclosure more apparent, the following detailed description will be given with reference to the accompanying drawings and the specific embodiments.
As shown in fig. 1 and 2, in the conventional display module, a row of circuit board pads 5 is disposed on a circuit board 2, and the circuit board pads 5 are arranged along a first direction; a row of substrate pads 6 are arranged on the display substrate 1, and the substrate pads 6 are arranged along a first direction; the circuit board bonding pad 5 and the substrate bonding pad 6 are bound through the wire 4, and the protective glue 3 is coated on the circuit board bonding pad 5, the wire 4 and the substrate bonding pad 6. The process of binding the circuit board pads 5 and the substrate pads 6 through the wires 4 is called a wire bonding process, and since the manufacturing accuracy of the circuit board is much worse than that of the display substrate, when the number of the circuit board pads is equal to that of the substrate pads, the width of the area where the circuit board pads are located is much larger than that of the display substrate, so that when the wire bonding process is performed, it can be obviously seen that the length of the wires 4 between the circuit board pads 5 at the edge and the corresponding substrate pads 6 is relatively large, and the binding angle (the included angle between the wires 4 and the first direction) is obviously smaller, which is extremely unfavorable for the reliability of the wire bonding process.
The embodiment of the disclosure provides a display module, a manufacturing method thereof and a display device, and can improve the process yield and reliability of the display module.
Embodiments of the present disclosure provide a display module, including:
the circuit board comprises a first binding area, wherein the first binding area is provided with two rows of circuit board bonding pads, and each row of circuit board bonding pads comprises a plurality of circuit board bonding pads which are arranged at intervals along a first direction;
the display substrate is positioned on the circuit board and comprises a second binding area, a plurality of substrate bonding pads arranged along a first direction are arranged on the second binding area, orthographic projection of the display substrate on the circuit board is not overlapped with the first binding area, and the second binding area is close to the first binding area;
the circuit board bonding pad is bound with the substrate bonding pad through a suspended wiring;
wherein the two rows of circuit board pads comprise a first row of circuit board pads and a second row of circuit board pads,
the second row of circuit board bonding pads comprise first circuit board bonding pads and second circuit board bonding pads, the first circuit board bonding pads and the second circuit board bonding pads are alternately arranged, wiring bound with the substrate bonding pads is not arranged on the second circuit board bonding pads, and the distance between the first row of circuit board bonding pads is smaller than the distance between the second row of circuit board bonding pads.
In this embodiment, be provided with two rows of circuit board pads on the circuit board for the arrangement of circuit board pad is more concentrated, can reduce the width of first binding region like this, and makes the circuit board pad be close to the base plate pad, reduces the length of the wiring of binding circuit board pad and base plate pad, and can increase the binding angle of wiring, guarantees the reliability of routing technology.
The wiring can be made of metal with good conductivity, such as aluminum, gold, etc. The display substrate may be a silicon-based display substrate, and of course, the display substrate is not limited to a silicon-based display substrate, but may be other types of display substrates.
The number of circuit board pads may be slightly greater than the number of substrate pads due to the arrangement of the second circuit board pads.
In this embodiment, the first binding region may be provided with not only two rows of circuit board pads but also three or more rows of circuit board pads. In a specific example, as shown in fig. 3 to 5, two rows of circuit board pads 5 are disposed on the circuit board 2, and the circuit board pads 5 are all arranged along the first direction; a row of substrate pads 6 are arranged on the display substrate 1, and the substrate pads 6 are arranged along a first direction; the circuit board pads 5 and the substrate pads 6 are bound by the traces 4.
In some embodiments, as shown in fig. 4 and 5, the at least two rows of circuit board pads include a first row of circuit board pads and a second row of circuit board pads, the substrate pads include a plurality of groups of first pads 61 for transmitting high-speed differential signals and second pads 62 other than the first pads, each group of the first pads includes two first pads 61, the second pads 62 are not disposed between the two first pads 61, and at least one second pad 62 is disposed between two adjacent groups of the first pads 61.
To ensure the integrity of the high-speed differential signal, the traces 4 connected to the same set of first pads 61 need to meet the requirement of equal length and width, and the length of the traces connected to each set of first pads and the corresponding circuit board pad is equal.
To ensure the integrity of the high-speed differential signal, the first pads 61 are bonded to the circuit board pads of the first row of circuit board pads in a one-to-one correspondence, as shown in fig. 4. The number of the first pads 61 may be equal to or different from the number of the circuit board pads of the first row of circuit board pads. In this embodiment, the same group of first pads 61 are connected to a pair of pads of the circuit board located in the same row and closest to each other, and the traces 4 connected to the same group of first pads 61 can meet the requirement of equal length and equal width, so as to ensure the integrity of the high-speed differential signal.
In some embodiments, to reduce the length of the trace 4 connected to the first pad 61, the second row of circuit board pads may be located on a side of the first row of circuit board pads remote from the display substrate. Of course, the second row of circuit board pads may also be located on a side of the first row of circuit board pads near the display substrate.
When the second row of circuit board bonding pads are positioned on one side of the first row of circuit board bonding pads far away from the display substrate, the wiring length of the connection of the second row of circuit board bonding pads and the substrate bonding pads is larger than that of the connection of the first row of circuit board bonding pads and the substrate bonding pads.
In some embodiments, as shown in fig. 4, since the first pads are all connected with the first row of circuit board pads in a binding manner, the number of circuit board pads bound with the second pads is smaller in the second row of circuit board pads, in order to ensure uniform arrangement of the second row of circuit board pads, the second row of circuit board pads include first circuit board pads 53 and second circuit board pads 52, the first circuit board pads 53 and the second circuit board pads 52 are alternately arranged, no routing bound with the substrate pads is arranged on the second circuit board pads 52, and the number of the first circuit board pads 53 may be greater than the number of the second circuit board pads 52. In order to ensure reliable connection of the first circuit board pad and the substrate pad, the area of the orthographic projection of the first circuit board pad 53 on the display substrate may be larger than the area of the orthographic projection of the second circuit board pad 52 on the display substrate, specifically, the maximum width of the second circuit board pad in the second direction is smaller than the maximum width of the first circuit board pad in the second direction, and the maximum width of the second circuit board pad in the first direction may be smaller than or equal to the maximum width of the first circuit board pad in the first direction.
In some embodiments, since the first pads are all connected with the first row of circuit board pads in a binding manner, and the number of circuit board pads to be bound with the second pads is smaller in the second row of circuit board pads, the second row may be provided with fewer circuit board pads, and in order to ensure uniform arrangement of the second row of circuit board pads, the distance between the first row of circuit board pads (i.e., the distance between adjacent circuit pads in the first row of circuit board pads) is smaller than the distance between the second row of circuit board pads (i.e., the distance between adjacent circuit pads in the second row of circuit board pads). For example, a distance between adjacent circuit board pads in the first row of circuit board pads is d, and a width of the circuit board pad in the first direction is S; the distance between adjacent circuit board bonding pads in the second row of circuit board bonding pads is 2d+S. According to the technical scheme, when binding is performed, the two signal values of the same pair of high-speed differential signals are guaranteed to be on the same side of the circuit board bonding pad, and the integrity of the high-speed differential signals is guaranteed.
In some embodiments, the arrangement space of the substrate pads is smaller, the arrangement space of the circuit board pads is two rows, and the layout space is larger, so that the orthographic projection area of the first circuit board pad on the display substrate is larger than the area of the substrate pad, and the orthographic projection area of the second circuit board pad on the display substrate is larger than the area of the substrate pad, so that the binding difficulty can be reduced.
In some embodiments, as shown in fig. 5, the second circuit board pads 52 are located in the middle of the second row of circuit board pads. Of course, the second circuit board pad 52 is not limited to be located in the middle of the second row of circuit board pads, but may be located in other areas of the second row of circuit board pads.
In some embodiments, since the distance between the second row of circuit board pads and the substrate pad is further, the binding angle of the second row of circuit board pads may be reduced, and the included angle between the first orthographic projection of the connection line of the first row of circuit board pads and the substrate pad on the circuit board and the extending direction of the first row of circuit board pads is smaller than the included angle between the first orthographic projection of the connection line of the second row of circuit board pads and the substrate pad on the circuit board and the extending direction of the second row of circuit board pads.
In some embodiments, to avoid the trace 4 coming into contact with the circuit board pads, the length of the trace connecting each set of the first pads with the corresponding circuit board pads is greater than the distance between the first row of circuit board pads and the second row of circuit board pads in a second direction, which is perpendicular or substantially perpendicular to the first direction.
In order to avoid contact between different wires 4, as shown in fig. 3-4, among the at least two rows of circuit board pads, the circuit board pads in the first row of circuit board pads and the circuit board pads in the second row of circuit board pads are staggered in the first direction, and each circuit board pad in two adjacent rows of circuit board pads is staggered by a set distance in the first direction.
In some embodiments, the set distance may be one half of S, where S is a width of the circuit board pad in the first direction. Of course, the set distance is not limited to one half of S, but may be other values.
In this embodiment, through setting up multirow circuit board pad, can make the quantity of single-row circuit board pad reduce, the width of first binding region reduces, first binding region can draw close to the centre of display substrate more, thereby make the distance between the circuit board pad at first binding region edge and the base plate pad at second binding region edge reduce as far as, reduce the length of walking line 4, and can make the contained angle between walking line 4 and the second direction be less than the second threshold value of predetermineeing, increase binding angle, guarantee the reliability of routing technology. Wherein the second direction is perpendicular or substantially perpendicular to the first direction.
In order to reduce the width of the first binding region as much as possible in the first direction, the maximum width of the circuit board pad 5 in the second direction is larger than the maximum width in the first direction, and the second direction is perpendicular or substantially perpendicular to the first direction.
In some embodiments, to reduce the width of the first binding region in the second direction, a distance between the first row of circuit board pads and the second row of circuit board pads is less than a distance between adjacent circuit board pads in the first row of circuit board pads.
In some embodiments, the orthographic projection of the first binding region in the first direction exceeds the orthographic projection of the second binding region in the first direction, and a minimum distance between a first boundary of the first binding region in the second direction and a second boundary of the second binding region in the second direction is smaller than a preset first threshold, and the second direction is perpendicular to the first direction, so that a distance between a circuit board pad at an edge of the first binding region and a circuit board pad at an edge of the second binding region can be ensured to be as small as possible. Of course, in this embodiment, the extension length of the first binding area along the first direction may also be greater than the extension length of the second binding area along the first direction.
In some embodiments, the orthographic projection of the first binding region in the first direction may be located within the orthographic projection of the second binding region in the first direction, so that a distance between the circuit board pad at the edge of the first binding region and the substrate pad at the edge of the second binding region may be ensured to be as small as possible.
In some embodiments, as shown in fig. 3, the first row of circuit board pads is bound with the substrate pads through a first wire, the second row of circuit board pads is bound with the substrate pads through a second wire, the second row of circuit board pads is located at a side of the first row of circuit board pads away from the display substrate, the first wire and the second wire are arc-shaped wires, the first wire is located at a side of the second wire close to the circuit board, and in this embodiment, mutual interference between the wires bound on the two rows of circuit board pads can be avoided through wire arcs with different heights.
In some embodiments, the display area of the display substrate includes a plurality of sub-pixels, and the distance between the first row of circuit board pads and the second row of circuit board pads in the second direction is greater than the maximum width of the sub-pixels, so that mutual interference between wires bound on the two rows of circuit board pads can be avoided.
The embodiment of the disclosure also provides a display device, which comprises the display module.
The display device includes, but is not limited to: the system comprises a radio frequency unit, a network module, an audio output unit, an input unit, a sensor, a display unit, a user input unit, an interface unit, a memory, a processor, a power supply and the like. It will be appreciated by those skilled in the art that the structure of the display device described above is not limiting of the display device, and that the display device may include more or less components described above, or may be combined with certain components, or may have different arrangements of components. In the embodiments of the present disclosure, the display apparatus includes, but is not limited to, a display, a mobile phone, a tablet computer, a television, a wearable electronic device, a navigation display device, and the like.
The display device may be: any product or component with display function such as a television, a display, a digital photo frame, a mobile phone, a tablet computer and the like, wherein the display device further comprises a flexible circuit board, a printed circuit board and a backboard.
The embodiment of the disclosure also provides a manufacturing method of the display module, which comprises the following steps:
providing a circuit board, wherein the circuit board comprises a first binding area, the first binding area is provided with two rows of circuit board bonding pads, and each row of circuit board bonding pads comprises a plurality of circuit board bonding pads which are arranged at intervals along a first direction;
forming a display substrate on the circuit board, wherein the display substrate comprises a second binding area, a plurality of substrate bonding pads arranged along a first direction are arranged on the second binding area, orthographic projection of the display substrate on the circuit board is not overlapped with the first binding area, and the second binding area is close to the first binding area;
forming a suspended wiring binding the circuit board bonding pad and the substrate bonding pad;
wherein the two rows of circuit board pads comprise a first row of circuit board pads and a second row of circuit board pads,
the second row of circuit board bonding pads comprise first circuit board bonding pads and second circuit board bonding pads, the first circuit board bonding pads and the second circuit board bonding pads are alternately arranged, wiring bound with the substrate bonding pads is not arranged on the second circuit board bonding pads, and the distance between the first row of circuit board bonding pads is smaller than the distance between the second row of circuit board bonding pads.
In this embodiment, be provided with two rows of circuit board pads on the circuit board for the arrangement of circuit board pad is more concentrated, can reduce the width of first binding region like this, and makes the circuit board pad be close to the base plate pad, reduces the length of the wiring of binding circuit board pad and base plate pad, and can increase the binding angle of wiring, guarantees the reliability of routing technology.
The wiring can be made of metal with good conductivity, such as aluminum, gold, etc. The display substrate may be a silicon-based display substrate, and of course, the display substrate is not limited to a silicon-based display substrate, but may be other types of display substrates.
The number of circuit board pads may be slightly greater than the number of substrate pads due to the arrangement of the second circuit board pads.
In this embodiment, not only two rows of circuit board pads but also three or more rows of circuit board pads may be formed in the first binding region. In a specific example, as shown in fig. 3 to 6, two rows of circuit board pads 5 are formed on the circuit board 2, and the circuit board pads 5 are arranged along the first direction; a row of substrate pads 6 is formed on the display substrate 1, and the substrate pads 6 are arranged along a first direction; the circuit board pads 5 and the substrate pads 6 are bound by the traces 4.
In a specific example, as shown in fig. 3 to 5, two rows of circuit board pads 5 are disposed on the circuit board 2, and the circuit board pads 5 are all arranged along the first direction; a row of substrate pads 6 are arranged on the display substrate 1, and the substrate pads 6 are arranged along a first direction; the circuit board pads 5 and the substrate pads 6 are bound by the traces 4.
In some embodiments, as shown in fig. 4 and 5, the at least two rows of circuit board pads include a first row of circuit board pads and a second row of circuit board pads, the substrate pads include a plurality of groups of first pads 61 for transmitting high-speed differential signals and second pads 62 other than the first pads, each group of the first pads includes two first pads 61, the second pads 62 are not disposed between the two first pads 61, and at least one second pad 62 is disposed between two adjacent groups of the first pads 61.
To ensure the integrity of the high-speed differential signal, the traces 4 connected to the same set of first pads 61 need to meet the requirement of equal length and width, and the length of the traces connected to each set of first pads and the corresponding circuit board pad is equal.
To ensure the integrity of the high-speed differential signal, the first pads 61 are bonded to the circuit board pads of the first row of circuit board pads in a one-to-one correspondence, as shown in fig. 4. The number of the first pads 61 may be equal to or different from the number of the circuit board pads of the first row of circuit board pads. In this embodiment, the same group of first pads 61 are connected to a pair of pads of the circuit board located in the same row and closest to each other, and the traces 4 connected to the same group of first pads 61 can meet the requirement of equal length and equal width, so as to ensure the integrity of the high-speed differential signal.
In some embodiments, to reduce the length of the trace 4 connected to the first pad 61, the second row of circuit board pads may be located on a side of the first row of circuit board pads remote from the display substrate. Of course, the second row of circuit board pads may also be located on a side of the first row of circuit board pads near the display substrate.
When the second row of circuit board bonding pads are positioned on one side of the first row of circuit board bonding pads far away from the display substrate, the wiring length of the connection of the second row of circuit board bonding pads and the substrate bonding pads is larger than that of the connection of the first row of circuit board bonding pads and the substrate bonding pads.
In some embodiments, as shown in fig. 4, since the first pads are all connected with the first row of circuit board pads in a binding manner, the number of circuit board pads bound with the second pads is smaller in the second row of circuit board pads, in order to ensure uniform arrangement of the second row of circuit board pads, the second row of circuit board pads includes first circuit board pads 53 and second circuit board pads 52, the first circuit board pads 53 and the second circuit board pads 52 are alternately arranged, and no trace bound with the substrate pads is disposed on the second circuit board pads 52. In order to ensure reliable connection of the first circuit board pads to the substrate pads, the area of the first circuit board pads 53 may be larger than the area of the second circuit board pads 52.
In some embodiments, since the first pads are all connected with the first row of circuit board pads in a binding manner, and the number of circuit board pads to be bound with the second pads is smaller in the second row of circuit board pads, the second row may be provided with fewer circuit board pads, and in order to ensure uniform arrangement of the second row of circuit board pads, the distance between the first row of circuit board pads (i.e., the distance between adjacent circuit pads in the first row of circuit board pads) is smaller than the distance between the second row of circuit board pads (i.e., the distance between adjacent circuit pads in the second row of circuit board pads). For example, a distance between adjacent circuit board pads in the first row of circuit board pads is d, and a width of the circuit board pad in the first direction is S; the distance between adjacent circuit board bonding pads in the second row of circuit board bonding pads is 2d+S. According to the technical scheme, when binding is performed, the two signal values of the same pair of high-speed differential signals are guaranteed to be on the same side of the circuit board bonding pad, and the integrity of the high-speed differential signals is guaranteed.
In some embodiments, the substrate pads are arranged in a row with smaller layout space, the circuit board pads are arranged in two rows with larger layout space, so that the area of the first circuit board pad is larger than that of the substrate pad, and the area of the second circuit board pad is larger than that of the substrate pad, so that the difficulty of binding can be reduced.
In some embodiments, as shown in fig. 5, the second circuit board pads 52 are located in the middle of the second row of circuit board pads. Of course, the second circuit board pad 52 is not limited to be located in the middle of the second row of circuit board pads, but may be located in other areas of the second row of circuit board pads.
In some embodiments, since the distance between the second row of circuit board pads and the substrate pad is further, the binding angle of the second row of circuit board pads may be reduced, and the included angle between the first orthographic projection of the connection line of the first row of circuit board pads and the substrate pad on the circuit board and the extending direction of the first row of circuit board pads is smaller than the included angle between the first orthographic projection of the connection line of the second row of circuit board pads and the substrate pad on the circuit board and the extending direction of the second row of circuit board pads.
In some embodiments, to avoid the trace 4 coming into contact with the circuit board pads, the length of the trace connecting each set of the first pads with the corresponding circuit board pads is greater than the distance between the first row of circuit board pads and the second row of circuit board pads in a second direction, which is perpendicular or substantially perpendicular to the first direction.
In order to avoid contact between different wires 4, as shown in fig. 3-4, among the at least two rows of circuit board pads, the circuit board pads in the first row of circuit board pads and the circuit board pads in the second row of circuit board pads are staggered in the first direction, and each circuit board pad in two adjacent rows of circuit board pads is staggered by a set distance in the first direction.
In some embodiments, the set distance may be one half of S, where S is a width of the circuit board pad in the first direction. Of course, the set distance is not limited to one half of S, but may be other values.
In this embodiment, by forming multiple rows of circuit board pads, the number of single row of circuit board pads can be reduced, the width of the first binding area is reduced, and the first binding area can be closer to the middle of the display substrate, so that the distance between the circuit board pads at the edge of the first binding area and the substrate pads at the edge of the second binding area is reduced as much as possible, the length of the routing wire 4 is reduced, the included angle between the routing wire 4 and the second direction is smaller than a preset second threshold value, the binding angle is increased, and the reliability of the routing process is ensured. Wherein the second direction is perpendicular or substantially perpendicular to the first direction.
In order to reduce the width of the first binding region as much as possible in the first direction, the maximum width of the circuit board pad 5 in the second direction is larger than the maximum width in the first direction, and the second direction is perpendicular or substantially perpendicular to the first direction.
In some embodiments, to reduce the width of the first binding region in the second direction, a distance between the first row of circuit board pads and the second row of circuit board pads is less than a distance between adjacent circuit board pads in the first row of circuit board pads.
In some embodiments, the orthographic projection of the first binding region in the first direction exceeds the orthographic projection of the second binding region in the first direction, and a minimum distance between a first boundary of the first binding region in the second direction and a second boundary of the second binding region in the second direction is smaller than a preset first threshold, and the second direction is perpendicular to the first direction, so that a distance between a circuit board pad at an edge of the first binding region and a circuit board pad at an edge of the second binding region can be ensured to be as small as possible. Of course, in this embodiment, the extension length of the first binding area along the first direction may also be greater than the extension length of the second binding area along the first direction.
In some embodiments, the orthographic projection of the first binding region in the first direction may be located within the orthographic projection of the second binding region in the first direction, so that a distance between the circuit board pad at the edge of the first binding region and the substrate pad at the edge of the second binding region may be ensured to be as small as possible.
In some embodiments, as shown in fig. 3, the first row of circuit board pads is bound with the substrate pads through a first wire, the second row of circuit board pads is bound with the substrate pads through a second wire, the second row of circuit board pads is located at a side of the first row of circuit board pads away from the display substrate, the first wire and the second wire are arc-shaped wires, the first wire is located at a side of the second wire close to the circuit board, and in this embodiment, mutual interference between the wires bound on the two rows of circuit board pads can be avoided through wire arcs with different heights.
In some embodiments, the display area of the display substrate includes a plurality of sub-pixels, and the distance between the first row of circuit board pads and the second row of circuit board pads in the second direction is greater than the maximum width of the sub-pixels, so that mutual interference between wires bound on the two rows of circuit board pads can be avoided.
In this specification, all embodiments are described in a progressive manner, and identical and similar parts of the embodiments are all referred to each other, and each embodiment is mainly described in a different way from other embodiments. In particular, for the embodiments, since they are substantially similar to the product embodiments, the description is relatively simple, and the relevant points are found in the section of the product embodiments.
Unless defined otherwise, technical or scientific terms used in this disclosure should be given the ordinary meaning as understood by one of ordinary skill in the art to which this disclosure belongs. The terms "first," "second," and the like, as used in this disclosure, do not denote any order, quantity, or importance, but rather are used to distinguish one element from another. The word "comprising" or "comprises", and the like, means that elements or items preceding the word are included in the element or item listed after the word and equivalents thereof, but does not exclude other elements or items. The terms "connected" or "connected," and the like, are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "upper", "lower", "left", "right", etc. are used merely to indicate relative positional relationships, which may also be changed when the absolute position of the object to be described is changed.
It will be understood that when an element such as a layer, film, region or substrate is referred to as being "on" or "under" another element, it can be "directly on" or "under" the other element or intervening elements may be present.
In the description of the above embodiments, particular features, structures, materials, or characteristics may be combined in any suitable manner in any one or more embodiments or examples.
The foregoing is merely specific embodiments of the disclosure, but the protection scope of the disclosure is not limited thereto, and any person skilled in the art can easily think about changes or substitutions within the technical scope of the disclosure, and it is intended to cover the scope of the disclosure. Therefore, the protection scope of the present disclosure shall be subject to the protection scope of the claims.
Claims (21)
- A display module, comprising:the circuit board comprises a first binding area, wherein the first binding area is provided with two rows of circuit board bonding pads, and each row of circuit board bonding pads comprises a plurality of circuit board bonding pads which are arranged at intervals along a first direction;the display substrate is positioned on the circuit board and comprises a second binding area, a plurality of substrate bonding pads arranged along a first direction are arranged on the second binding area, orthographic projection of the display substrate on the circuit board is not overlapped with the first binding area, and the second binding area is close to the first binding area;the circuit board bonding pad is bound with the substrate bonding pad through a suspended wiring;wherein the two rows of circuit board pads comprise a first row of circuit board pads and a second row of circuit board pads,the second row of circuit board bonding pads comprise first circuit board bonding pads and second circuit board bonding pads, the first circuit board bonding pads and the second circuit board bonding pads are alternately arranged, wiring bound with the substrate bonding pads is not arranged on the second circuit board bonding pads, and the distance between the first row of circuit board bonding pads is smaller than the distance between the second row of circuit board bonding pads.
- The display module of claim 1, wherein an area of the orthographic projection of the first circuit board pad on the display substrate is greater than an area of the orthographic projection of the second circuit board pad on the display substrate.
- The display module of claim 1, wherein an area of the orthographic projection of the first circuit board pad on the display substrate is greater than an area of the substrate pad, and an area of the orthographic projection of the second circuit board pad on the display substrate is greater than an area of the substrate pad.
- The display module of claim 1, wherein in the second row of circuit board pads, the first circuit board pads are spaced apart from the second circuit board pads by an equal number.
- The display module of claim 1, wherein the substrate pads include a plurality of groups of first pads for transmitting high-speed differential signals and second pads other than the first pads, each group of first pads includes two first pads, the second pads are not disposed between the two first pads, at least one second pad is disposed between two adjacent groups of first pads, and a trace length of connection between each group of first pads and a corresponding circuit board pad is equal.
- The display module of claim 1, wherein a trace length of the connection of the second row of circuit board pads to the substrate pads is greater than a trace length of the connection of the first row of circuit board pads to the substrate pads.
- The display module of claim 1, wherein a maximum width of the circuit board pads in a second direction is greater than a maximum width in the first direction, the second direction being perpendicular or substantially perpendicular to the first direction.
- The display module of claim 1, wherein the second circuit board pads are located in a middle portion of the second row of circuit board pads.
- The display module of claim 1, wherein an angle between a first orthographic projection of a line connecting the first row of circuit board pads and the substrate pads on the circuit board and an extending direction of the first row of circuit board pads is smaller than an angle between a first orthographic projection of a line connecting the second row of circuit board pads and the substrate pads on the circuit board and an extending direction of the second row of circuit board pads.
- The display module of claim 1, wherein a distance between the first row of circuit board pads and the second row of circuit board pads is less than a distance between adjacent circuit board pads in the first row of circuit board pads.
- The display module of claim 1, wherein an orthographic projection of the first binding region in the first direction exceeds an orthographic projection of the second binding region in the first direction, and a minimum distance between a first boundary of the first binding region in a second direction perpendicular or substantially perpendicular to the first direction and a second boundary of the second binding region in the second direction is less than a preset first threshold.
- The display module of claim 1, wherein an orthographic projection of the first binding region in the first direction is located within an orthographic projection of the second binding region in the first direction.
- The display module of claim 1, wherein an included angle between the trace and a second direction is smaller than a preset second threshold, and the second direction is perpendicular or substantially perpendicular to the first direction.
- The display module assembly of claim 1, wherein an extension of the first binding region along the first direction is greater than an extension of the second binding region along the first direction.
- The display module of claim 1, wherein circuit board pads in the first row of circuit board pads are staggered with circuit board pads in the second row of circuit board pads in the first direction.
- The display module of claim 5, wherein a trace length of a connection of each set of the first pads to a corresponding circuit board pad is greater than a distance of the first row of circuit board pads to the second row of circuit board pads in a second direction, the second direction being perpendicular or substantially perpendicular to the first direction.
- The display module of claim 1, wherein the display area of the display substrate includes a plurality of sub-pixels, the first row of circuit board pads and the second row of circuit board pads being spaced apart in a second direction that is perpendicular or substantially perpendicular to the first direction by a distance greater than a maximum width of the sub-pixels.
- The display module of claim 1, wherein a maximum width of the second circuit board pad in a second direction is less than a maximum width of the first circuit board pad in a second direction, the second direction being perpendicular or substantially perpendicular to the first direction.
- The display module of claim 1, wherein the number of first circuit board pads is greater than the number of second circuit board pads.
- A display device comprising a display module according to any one of claims 1-19.
- The manufacturing method of the display module is characterized by comprising the following steps:providing a circuit board, wherein the circuit board comprises a first binding area, the first binding area is provided with two rows of circuit board bonding pads, and each row of circuit board bonding pads comprises a plurality of circuit board bonding pads which are arranged at intervals along a first direction;forming a display substrate on the circuit board, wherein the display substrate comprises a second binding area, a plurality of substrate bonding pads arranged along a first direction are arranged on the second binding area, orthographic projection of the display substrate on the circuit board is not overlapped with the first binding area, and the second binding area is close to the first binding area;forming a suspended wiring binding the circuit board bonding pad and the substrate bonding pad;wherein the two rows of circuit board pads comprise a first row of circuit board pads and a second row of circuit board pads,the second row of circuit board bonding pads comprise first circuit board bonding pads and second circuit board bonding pads, the first circuit board bonding pads and the second circuit board bonding pads are alternately arranged, wiring bound with the substrate bonding pads is not arranged on the second circuit board bonding pads, and the distance between the first row of circuit board bonding pads is smaller than the distance between the second row of circuit board bonding pads.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CN2022/072264 WO2023133874A1 (en) | 2022-01-17 | 2022-01-17 | Display module, fabrication method therefor, and display apparatus thereof |
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| CN116783544A true CN116783544A (en) | 2023-09-19 |
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| CN202280000041.3A Pending CN116783544A (en) | 2022-01-17 | 2022-01-17 | Display module, manufacturing method thereof and display device |
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| CN (1) | CN116783544A (en) |
| WO (1) | WO2023133874A1 (en) |
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| JP3437477B2 (en) * | 1999-02-10 | 2003-08-18 | シャープ株式会社 | Wiring board and semiconductor device |
| CN206961822U (en) * | 2017-06-30 | 2018-02-02 | 北京忆芯科技有限公司 | The encapsulating structure and printed circuit board (PCB) of chip |
| CN109856734A (en) * | 2019-02-11 | 2019-06-07 | 武汉电信器件有限公司 | A kind of shell of optical device |
| CN110286535B (en) * | 2019-06-20 | 2021-08-31 | 上海天马微电子有限公司 | Display module, manufacturing method of display module and display device |
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2022
- 2022-01-17 WO PCT/CN2022/072264 patent/WO2023133874A1/en active Application Filing
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