CN114973995B - Display panel, display device and binding method thereof - Google Patents
Display panel, display device and binding method thereof Download PDFInfo
- Publication number
- CN114973995B CN114973995B CN202210586021.0A CN202210586021A CN114973995B CN 114973995 B CN114973995 B CN 114973995B CN 202210586021 A CN202210586021 A CN 202210586021A CN 114973995 B CN114973995 B CN 114973995B
- Authority
- CN
- China
- Prior art keywords
- pads
- bonding
- alignment
- display panel
- binding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 230000027455 binding Effects 0.000 title claims abstract description 64
- 238000000034 method Methods 0.000 title claims abstract description 30
- 239000000758 substrate Substances 0.000 claims abstract description 28
- 238000012937 correction Methods 0.000 claims description 28
- 238000006073 displacement reaction Methods 0.000 claims description 22
- 230000001154 acute effect Effects 0.000 claims description 12
- 230000000694 effects Effects 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 239000011295 pitch Substances 0.000 description 5
- 238000013519 translation Methods 0.000 description 4
- 238000013461 design Methods 0.000 description 3
- 230000007423 decrease Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 230000009870 specific binding Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
- G09F9/335—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes being organic light emitting diodes [OLED]
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/35—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being liquid crystals
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Optics & Photonics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
Abstract
The application discloses a display panel, a display device and a binding method thereof, wherein the display panel of the embodiment of the application comprises a first binding area, and the first binding area comprises a plurality of first bonding pads bound with a flexible wiring substrate, wherein the first bonding pads are parallelograms. The display panel provided by the application is characterized in that the first bonding pad in the first bonding area is set to be parallelogram, so that bonding alignment can be performed more flexibly, bonding pad dislocation and circuit failure caused by alignment deviation are avoided, the reliability of products is improved, the cost is reduced, and the display panel has a wide application prospect.
Description
Technical Field
The present disclosure relates to the field of display technologies, and in particular, to a display panel, a display device, and a binding method thereof.
Background
The display device generally includes a display panel (e.g., an organic electroluminescence display panel (OLED), a liquid crystal display panel (LCD), etc.) and a flexible wiring substrate mounted on the display panel. The flexible wiring substrate is required to provide display data or control signals to the display panel to complete the display process. In order for the two electronic components to be electrically connected to each other, the display panel includes a plurality of input pads, and the flexible wiring substrate includes a plurality of output pads corresponding to the plurality of input pads. The two electronic components may be electrically connected to each other by para-binding of the respective pad areas.
However, the shape of the bonding pads is rectangular at present, when the input bonding pads and the output bonding pads are aligned, the input bonding pads and the output bonding pads can only be repeatedly aligned again if left and right misalignment occurs, and as the resolution of the display product increases, the number of bonding pads is increased, the bonding pad spacing is decreased, the alignment difficulty of the existing bonding pad design is high, and binding dislocation is easy to occur.
Disclosure of Invention
In order to solve at least one of the above problems, a first aspect of the present application provides a display panel including a first bonding region including a plurality of first pads bonded to a flexible wiring substrate,
wherein the first bonding pad is parallelogram.
In some alternative embodiments, at least one row of the first pads is included, each row of the first pads is arranged along a first direction, the first pads includes a pair of first sides parallel to the first direction, and a pair of second sides parallel to each other, and a height Y of the first pads along a direction perpendicular to the first direction satisfies:
X≥2·Y·tanθ
wherein X represents the length of the first side, and θ represents the acute included angle between the first side and the second side.
In some alternative embodiments, a plurality of rows of first pads arranged along a second direction, each row of first pads arranged along a first direction, the first pads including a pair of first sides parallel to the first direction, and a pair of second sides parallel to each other, wherein the first direction is perpendicular to the second direction,
spacing Y between every two rows of first bonding pads gap The method meets the following conditions:
Y gap ≤X·tanθ
wherein X represents the length of the first side, and θ represents the acute included angle between the first side and the second side.
In some alternative embodiments, the first pad includes a pair of first sides parallel to each other and a pair of second sides parallel to each other, the acute included angle θ of the first sides and the second sides satisfying: θ is more than or equal to 45 degrees and less than or equal to 75 degrees.
In some alternative embodiments, the first binding region further includes at least one alignment mark including a first alignment sub-portion extending along the first direction.
In some alternative embodiments, the alignment mark further includes a second alignment sub-portion having the same shape as the first pad.
A second aspect of the present application provides a display device, including:
the display panel described above;
the flexible wiring substrate comprises a second binding area, the second binding area comprises second bonding pads corresponding to the first bonding pads one by one, and the first bonding pads are bound with the second bonding pads correspondingly.
In some alternative embodiments, the flexible wiring substrate further includes a third bonding region including a plurality of third pads, the third pads having a parallelogram shape,
the display device further comprises a printed circuit board, wherein the printed circuit board comprises a driving chip and a plurality of fourth bonding pads electrically connected with the driving chip, and the fourth bonding pads are bound with the third bonding pads in a one-to-one correspondence manner.
A third aspect of the present application provides a binding method for the display device described above, wherein the display panel includes at least one row of first pads, each row of first pads being arranged along a first direction, the first pads including a pair of first sides parallel to the first direction and a pair of second sides parallel to each other, including:
initially aligning the first binding area with the second binding area based on the alignment mark;
measuring displacement deviation between the first bonding pad and the second bonding pad along a first direction based on the alignment mark;
calculating an alignment correction value based on the displacement deviation;
and translating the display panel or the flexible wiring substrate along a second direction based on the alignment correction value, and binding the first bonding pad and the second bonding pad.
In some alternative embodiments, the alignment correction value Δy satisfies:
ΔY＝ΔX·tanθ
wherein DeltaX represents displacement deviation, and theta represents an acute included angle between the first side and the second side.
The beneficial effects of this application are as follows:
aiming at the existing problems at present, the display panel, the display device and the binding method thereof are formulated, and the first bonding pad in the first binding area is set to be parallelogram, so that binding alignment can be more flexibly carried out, bonding pad dislocation and circuit failure caused by alignment deviation are avoided, and the reliability of products is improved; in addition, the binding efficiency can be improved, so that the manufacturing cost of the product is reduced, and the binding method has a wide application prospect.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 (a) and (b) show two effect diagrams at the time of pad alignment in a display panel in the related art;
FIG. 2 shows a schematic diagram of a display panel according to an embodiment of the present application;
FIG. 3 shows a schematic diagram of a first bonding pad binding alignment in a display panel according to an embodiment of the present application;
FIG. 4 shows a schematic diagram of a first bonding pad binding alignment in a display panel according to an embodiment of the present application;
fig. 5 shows a schematic view of a first pad in a display panel according to another embodiment of the present application;
FIG. 6 shows a schematic diagram of a display device according to an embodiment of the present application; and
fig. 7 shows a flowchart of a binding method of a display device according to an embodiment of the present application.
Detailed Description
For a clearer description of the present application, the present application is further described below with reference to preferred embodiments and the accompanying drawings. Like parts in the drawings are designated by the same or similar reference numerals. It is to be understood by persons skilled in the art that the following detailed description is intended to be illustrative, and not restrictive, and that this invention is not to be limited to the specific embodiments shown.
It should be noted that, in this application, the terms "having," "including," "comprising," and the like are all open-ended, that is, when a module is described as "having," "including," or "comprising" a first element, a second element, and/or a third element, it is meant that the module includes other elements in addition to the first element, the second element, and/or the third element. In addition, ordinal numbers such as "first", "second", and "third" in this application are not intended to limit a specific order, but merely to distinguish between the individual portions.
In the related art, the input pads of the bonding areas in the display panel are rectangular in shape. When such input pads are employed to bond with identically shaped output pads in a flexible wiring substrate. The binding contact effect is divided into two cases shown in fig. 1 according to a conventional binding effect determination criterion. Wherein (a) shows the case where the bonding effect of the input pad and the output pad can be accepted, that is, the width of the overlapping area of the input pad and the output pad after bonding is L1, L1 is greater than half the width W of the pad, that is, L1> W/2, where the area of bonding together is greater than the area S/2 of the pad, and the bonding can be considered acceptable as long as the area of bonding together is greater than or equal to S/2; and (b) shows the case where the bonding effect of the input pad and the output pad is not acceptable, i.e., the width of the overlapping area of the input pad and the output pad after bonding is L2, L2 is less than half the width W of the pad, i.e., L1< W/2, and the area of bonding together is less than the area S/2 of the pad, which bonding effect is not acceptable. When the bonding pads are bound, unacceptable conditions exist, the bonding pads after bonding may have poor contact, and the binding yield is affected.
Because the pad size is small and the device has errors, further positional adjustment of the input pad and the output pad is required after pre-alignment of the bonding area during the bonding process. However, as the resolution of the display product is higher and higher, the number of input pads for driving the pixels in the display panel is also larger and larger, for example, for a 16K display product, the resolution is 15360×rgb×8640, and there are 46080 columns of sub-pixels, so that the number of source channels of the driving chip is up to 46080, and more input pads are arranged in a limited space, which directly results in smaller and smaller pad pitches and pad sizes. When the width and the spacing of the bonding pads are too small, the minimum stepping capability of the equipment is directly exceeded, for rectangular bonding pads, the alignment adjustment can only be carried out along the width direction of the bonding pads, when the spacing of the bonding pads exceeds the stepping capability of the equipment, the alignment adjustment is not carried out, the repeated pre-alignment process is needed, the alignment time is prolonged, and the working efficiency is seriously reduced; however, since the rectangular pad can be adjusted only in the pad width direction, and as the pad pitch decreases and the device stepping capability is limited, even if the adjustable space is reduced, once the alignment binding occurs in the case of (b) in fig. 1, the direct alignment fails, and the yield is low.
In view of the above, embodiments of the present application provide a display panel including a first bonding region including a plurality of first pads bonded to a flexible wiring substrate,
wherein the first bonding pad is parallelogram.
In the embodiment, the first bonding pad in the first bonding area is set to be parallelogram, so that bonding alignment can be more flexibly carried out, bonding pad dislocation and circuit failure caused by alignment deviation are avoided, and the reliability of products is improved; in addition, the binding efficiency can be improved, so that the manufacturing cost of the product is reduced, and the binding method has a wide application prospect.
The following describes a technical solution of the display panel of the present application with reference to fig. 2 to 5 in combination with specific examples.
In a specific example, referring to fig. 2, the display panel 1 includes a display area AA including sub-pixels arranged in an array, and a non-display area NA surrounding the display area AA.
Examples of the sub-pixels arranged in the RGB order are schematically shown in the drawings, but the present application is not limited thereto, and the arrangement order of the sub-pixels and the sub-pixel types may have other various forms.
The display panel 1 includes a first bonding area 10 therein, and the first bonding area 10 includes a plurality of first pads 110. Particularly, the shape of the first bonding pad 110 in the application is a parallelogram, and by designing the first bonding pad 110 of the parallelogram, a more flexible binding alignment process can be provided by means of the shape characteristics of the first bonding pad, and the alignment precision and the alignment difficulty are improved.
For a further understanding of the present application, the structural advantages and specific structural features of the present application are described in detail below in connection with a specific alignment process of the first bonding pad.
Referring to fig. 2, the first bonding region 10 in the display panel 1 includes a row of first pads 110, the first pads 110 being aligned along a first direction x and including a pair of first sides parallel to the first direction x and another pair of second sides parallel to each other. The number of the first pads 110 is not limited, and is also limited to a specific number of output channels in the driving chip and a specific number of those output channels participating in the control of the display panel, depending on the number of sub-pixels in the display panel 1.
It should be noted that, although fig. 2 shows the first bonding region 10 having only one row of first bonding pads 110, the present application is not limited thereto, and the first bonding region may also include a plurality of rows of first bonding pads, each row of first bonding pads being arranged along a second direction y, and the second direction y being perpendicular to the first direction x. When a plurality of rows of first pads are included, the number of first pads per row is not limited, and depends on the size of the specific binding area.
It will be appreciated by those skilled in the art that the first pads 110 in the first bonding region 10 are typically bonded to corresponding second pads in a corresponding second bonding region in the flexible wiring substrate. The flexible wiring substrate may be a Chip On Film (COF) or a flexible circuit board (Flexible Printed Circuit, FPC) or the like. The second pads in the flexible wiring substrate are identical in shape, size, and layout to the first pads 110.
Referring to fig. 3, a partially enlarged view of the display panel is shown when the first bonding region 10 is initially aligned with the second bonding region in the flexible wiring substrate.
In this example, the light-contoured graph represents a localized area of the first bonding region 10, and the dark-contoured graph represents a localized area of the second bonding region in the flexible wiring substrate.
It should be noted that, the initial alignment refers to aligning the entire areas of the first binding area 10 and the second binding area, and the alignment is generally performed based on the alignment mark.
Thus, in some alternative embodiments, as shown with reference to fig. 2 and 3, the first binding region 1 includes at least one alignment mark for the initial alignment process of the first binding region 10. The alignment mark includes a first alignment sub-portion 121 extending along a first direction x. By providing the first alignment sub-portion 121, it is convenient to accurately and easily acquire the displacement deviation in the first direction x after the initial alignment.
In order to facilitate initial alignment and to avoid excessive space occupation of the alignment marks, which affect the first pad layout, the alignment marks preferably further include a second alignment sub-portion 122 having the same shape as the first pad 110. That is, when two alignment marks are included as shown in fig. 2, the second alignment sub-portions 122 may be disposed at both sides of the row of first pad areas 110 where the alignment marks are disposed in the same pitch arrangement as the first pads 110. Of course, the number of alignment marks may not be limited to two.
Of course, those skilled in the art will understand that this is only exemplary, and the alignment marks may be other shapes and be disposed at other positions on the display panel with more attention paid to the left and right side spaces and with more space on the upper and lower sides, so long as the basic requirement of including the first alignment sub-portion 121 is satisfied.
With continued reference to fig. 3, because the initial alignment process is to perform alignment with reference to alignment marks respectively located in the two components, there is often a deviation after the alignment, as shown in the figure, resulting in a displacement deviation Δx along the first direction X.
With continued reference to fig. 4, because the first pads 110 are parallelograms, there are a pair of second sides that are oblique and parallel with respect to the first direction x. Thus, when the second bonding region is translated in the second direction Y perpendicular to the first direction X, the displacement deviation Δx between the first bonding pad 110 and the second bonding pad in the first direction X tends to decrease, and when the second bonding region is translated in the second direction Y by a distance Δy, the corresponding second sides of the first bonding pad 110 and the second bonding pad completely coincide, i.e., the displacement deviation Δx in the first direction X can be completely eliminated by translation along the second direction Y, which distance Δy is referred to as an alignment correction value.
Therefore, by designing the first pads 110 as a parallelogram, the first pads and the second pads to be bound correspondingly can be aligned in the second dimension perpendicular to the arrangement direction of the first pads 110 by using a pair of inclined and parallel second sides, so that the alignment flexibility is increased.
By using this flexibility, translating one device in a minimum step may cause such a problem that adjacent pads are misaligned and overlap with respect to closely arranged rectangular pads, and by using translation in the second direction y, all pads translate simultaneously in the oblique direction because the second sides are oblique and parallel, even though the pitch is less than the minimum step, without causing different pad misalignment overlap.
Further, referring to fig. 4, for the displacement deviation Δx, the alignment correction value Δy for the translation in the second direction Y is: Δx is tan θ, where θ is the acute included angle between the first side and the second side. It can be seen that the adjustable range can be increased by setting the angular magnitude of θ such that a small displacement deviation Δx is converted into a second directional distance Δy that is greater than Δx.
More specifically, as shown in fig. 4, after the alignment correction value Δy is translated along the second direction, the overlapping area between the first pad 110 and the second pad should be bound, and the area of the overlapping area should be greater than or equal to half the area of the pad, if the height of the first pad 110 along the second direction Y is Y, and the length of the first side is X, it should be satisfied that: (Y- Δy) X is greater than or equal to Y X/2, wherein Δy should take the limit value, i.e. X tan θ.
Therefore, the condition that the alignment correction ensures that the good binding effect meeting the standard is obtained is that the height Y of the first pad 110 along the second direction Y should satisfy:
Y≥2·X·tanθ (1)
in some alternative embodiments, referring to fig. 5, the first bonding region 10 includes a plurality of rows of first pads 110 arranged along the second direction y, each row of first pads 110 arranged along the first direction x, the first pads 110 including a first pad parallel to the first direction xA pair of first sides, and a pair of second sides parallel to each other. In order to ensure that after alignment correction along the second direction Y, the second bonding pad corresponding to one row of the first bonding pads 110 is not in error lap joint with the adjacent other row of the first bonding pads 110 due to translation, the spacing Y between every two rows of the first bonding pads should be set gap The method meets the following conditions:
Y gap ≤X·tanθ (2)
however, it should be noted that, on the basis of satisfying that the first bonding pad 110 is parallelogram, the smaller the acute angle θ between the first side and the second side is, the smaller the alignment correction value Δy of the first bonding pad 110 translating along the second direction Y is, the larger the overlapping area of the first bonding pad 110 and the second bonding pad is after the alignment correction, and the better the binding effect is; however, in the case where the length X of the first side of the first bonding pad 110 is already small, accordingly, the smaller the alignment correction value Δy is, the closer or possibly smaller than the stepping value of the device, and when the acute angle θ of the first side and the second side of the first bonding pad 110 is smaller, the more the first bonding pad 110 is inclined, the first bonding pads 110 located at both sides of the first bonding region occupy more area of the display panel and require more design margin, which is disadvantageous for the narrow bezel design of the display panel.
Therefore, it is preferable that the acute angle θ between the first edge and the second edge satisfies: 45 deg. or more and 75 deg. or less, more preferably, θ satisfies: θ is more than or equal to 50 degrees and less than or equal to 75 degrees. When θ is 50 ° or more, it is possible to ensure that the translational correction value Δy is greater than the alignment translational distance in the first direction x, so that the size and pitch of the first pads 110 are extremely small, and when the translational movement in the first direction may exceed the stepping capability of the apparatus, the second correction is easily achieved by using the translational correction value Δy in the second direction Y.
Based on the same inventive concept, referring to fig. 6, an embodiment of the present application further provides a display device including:
the display panel 1 described in the above embodiment; and
the flexible wiring substrate 2 includes a second bonding region 20, the second bonding region 20 including second bonding pads 210 in one-to-one correspondence with the first bonding pads 110, the first bonding pads 110 being bonded in correspondence with the second bonding pads 210.
The flexible wiring board 2 may be a flip-chip film, a flexible circuit board, or the like. The flexible wiring substrate 2 may or may not include a drive control chip as shown in fig. 6, and the drive control chip may be a display control chip or a drive control chip integrated with touch control and display. When the driving control chip is included, the corresponding output pins in the driving control chip may be correspondingly electrically connected with the second pads 210 in the second bonding area 20 to input the control signals to the display panel 1 via the first pads 110. Of course, if the flexible wiring substrate does not include the driving control chip, the external chip provides the signal completely, and the description thereof is omitted.
Of course, those skilled in the art should also understand that the second binding area 20 also includes alignment marks corresponding to the first binding area 10, which are not described herein.
By the arrangement, the first bonding pad 110 and the second bonding pad 210 which are parallelogram can be used for corresponding binding, so that the binding alignment flexibility is improved, the dislocation of the bonding pads and the circuit failure caused by alignment deviation are avoided, and the reliability of products is improved; in addition, the binding efficiency can be improved, so that the manufacturing cost of the product is reduced.
In some alternative embodiments, referring to fig. 6, the flexible wiring substrate 2 further includes a third bonding region 21, the third bonding region 21 including a plurality of third pads 211, the third pads 211 also having a parallelogram shape,
the display device further includes a printed circuit board 3, and the printed circuit board 3 includes a driving chip (not shown) and a plurality of fourth pads 310 electrically connected to the driving chip, the fourth pads 310 being bonded in one-to-one correspondence with the third pads 211.
It should be understood by those skilled in the art that the driving chip in the printed circuit board 3 may be a power driving chip to provide power for the driving control chip on the display panel 1 and the flexible wiring substrate 2, or the driving chip may also partially or completely replace the control function in the driving control chip, which is not described herein.
In this embodiment, the display device may be any product or component with a display function, such as a mobile phone, a tablet computer, a television, a display, a notebook computer, a vehicle-mounted display, a digital photo frame, or a navigator, and by loading the display panel, the display device has low production cost and high product yield.
Based on the same inventive concept, referring to fig. 7, an embodiment of the present application further provides a binding method using the display device as in the above embodiment, including:
s1, carrying out initial alignment on a first binding area and a second binding area based on an alignment mark;
s2, measuring displacement deviation between the first bonding pad and the second bonding pad along a first direction based on the alignment mark;
s3, calculating an alignment correction value based on the displacement deviation;
s4, translating the display panel or the flexible wiring substrate along a second direction based on the alignment correction value, and binding the first bonding pad and the second bonding pad.
By utilizing the parallelogram first bonding pad, calculating an alignment correction value along the second direction based on displacement deviation along the first direction after initial alignment, and further performing alignment correction, the two dimensions can be flexibly bound for alignment, bonding pad dislocation and circuit failure caused by alignment deviation are avoided, and product reliability is improved; in addition, the binding efficiency can be improved, so that the manufacturing cost of the product is reduced, and the binding method has a wide application prospect.
Specifically, as shown in fig. 3 and fig. 4, after initial alignment is performed based on the alignment mark in step S1, that is, step S2 is performed, and a displacement deviation Δx along the first direction between the first pad and the second pad is measured, in this step, it may be determined based on the displacement deviation Δx, if the displacement deviation is smaller than a reference value, for example, 0 or a preset value that is far smaller than a movable step of the apparatus, it is determined that no alignment deviation occurs, and if the displacement deviation is greater than or equal to the reference value, the binding operation is directly performed, and if the displacement deviation is greater than or equal to the reference value, step S3 is performed; in step S3, the alignment correction value Δy satisfies:
ΔY＝ΔX·tanθ (3)
wherein Δx represents the displacement deviation, and θ represents an acute included angle between the first side and the second side.
In step S4, the alignment correction process is completed by moving the display panel or the flexible circuit substrate, and the first bonding pad and the second bonding pad are bonded to each other after the alignment correction. It should be understood by those skilled in the art that the alignment correction process is to perform the change of the relative position of the display panel or the flexible circuit substrate according to the alignment correction value, so that only the movement is required to be performed in a direction of eliminating the displacement deviation, and any one of the movement is only required to be performed, which is not described herein.
It will be appreciated by those skilled in the art that although the above steps only give one alignment correction along the second direction, those skilled in the art will appreciate that translational correction along the first direction for the second direction after the initial alignment may also be used in combination in the method of the present application, and will not be described in detail herein.
In addition, the binding process of the flexible circuit substrate and the printed circuit board is similar to the above method, and will not be described again here.
Aiming at the existing problems at present, the display panel, the display device and the binding method thereof are formulated, and the first bonding pad in the first binding area is set to be parallelogram, so that binding alignment can be more flexibly carried out, bonding pad dislocation and circuit failure caused by alignment deviation are avoided, and the reliability of products is improved; in addition, the binding efficiency can be improved, so that the manufacturing cost of the product is reduced, and the binding method has a wide application prospect.
It should be apparent that the foregoing examples of the present application are merely illustrative of the present application and not limiting of the embodiments of the present application, and that various other changes and modifications may be made by one of ordinary skill in the art based on the foregoing description, and it is not intended to be exhaustive of all embodiments, and all obvious changes and modifications that come within the scope of the present application are intended to be embraced by the technical solution of the present application.
Claims (9)
1. A display panel is characterized by comprising a first binding region, wherein the first binding region comprises a plurality of first bonding pads bound with a flexible wiring substrate, the first bonding pads are parallelogram,
the plurality of first bonding pads are a plurality of rows of the first bonding pads arranged along a second direction, each row of the first bonding pads is arranged along a first direction, the first bonding pads comprise a pair of first edges parallel to the first direction and a pair of second edges parallel to each other, wherein the first direction is perpendicular to the second direction,
spacing Y between every two rows of the first bonding pads gap The method meets the following conditions:
Y gap ≤X·tanθ
wherein X represents the length of the first edge, and θ represents the acute included angle between the first edge and the second edge.
2. The display panel of claim 1, wherein each row of the first pads is aligned along the first direction, and a height Y of the first pads along a direction perpendicular to the first direction satisfies:
Y≥2·X·tanθ
wherein X represents the length of the first side.
3. The display panel of claim 1, wherein the acute angle θ between the first edge and the second edge satisfies: θ is more than or equal to 45 degrees and less than or equal to 75 degrees.
4. The display panel of any one of claims 2-3, wherein the first binding region further comprises at least one alignment mark comprising a first alignment sub-portion extending along the first direction.
5. The display panel of claim 4, wherein the alignment mark further comprises a second alignment sub-portion having the same shape as the first pad.
6. A display device, comprising:
the display panel of any one of claims 1-5;
the flexible wiring substrate comprises a second binding area, wherein the second binding area comprises second bonding pads corresponding to the first bonding pads one by one, and the first bonding pads are bound with the second bonding pads correspondingly.
7. The display device of claim 6, wherein the flexible wiring substrate further comprises a third bonding region including a plurality of third pads in the shape of a parallelogram,
the display device further comprises a printed circuit board, wherein the printed circuit board comprises a driving chip and a plurality of fourth bonding pads electrically connected with the driving chip, and the fourth bonding pads are bound with the third bonding pads in a one-to-one correspondence manner.
8. A binding method for the display device of claim 6 or 7, wherein the display panel includes at least one row of the first pads, each row of the first pads being arranged along a first direction, the first pads including a pair of first sides parallel to the first direction and a pair of second sides parallel to each other, comprising:
performing initial alignment on the first binding area and the second binding area based on the alignment mark;
measuring displacement deviation between the first bonding pad and the second bonding pad along the first direction based on the alignment mark;
calculating an alignment correction value based on the displacement deviation;
and translating the display panel or the flexible wiring substrate in a second direction based on the alignment correction value, and binding the first bonding pad and the second bonding pad.
9. The binding method according to claim 8, wherein the alignment correction value Δy satisfies:
ΔY＝ΔX·tanθ
wherein Δx represents the displacement deviation, and θ represents an acute included angle between the first side and the second side.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210586021.0A CN114973995B (en) | 2022-05-27 | 2022-05-27 | Display panel, display device and binding method thereof |
| PCT/CN2023/093038 WO2023226750A1 (en) | 2022-05-27 | 2023-05-09 | Display panel and binding method therefor, and display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210586021.0A CN114973995B (en) | 2022-05-27 | 2022-05-27 | Display panel, display device and binding method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114973995A CN114973995A (en) | 2022-08-30 |
| CN114973995B true CN114973995B (en) | 2024-03-26 |
Family
ID=82955698
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210586021.0A Active CN114973995B (en) | 2022-05-27 | 2022-05-27 | Display panel, display device and binding method thereof |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN114973995B (en) |
| WO (1) | WO2023226750A1 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114973995B (en) * | 2022-05-27 | 2024-03-26 | 福州京东方光电科技有限公司 | Display panel, display device and binding method thereof |
Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104123902A (en) * | 2013-04-29 | 2014-10-29 | 三星显示有限公司 | Display panel, electronic device including same, and bonding method thereof |
| KR20150022211A (en) * | 2013-08-22 | 2015-03-04 | 하이디스 테크놀로지 주식회사 | Display panel, ic chip and liquid crystal display device having fan-shaped arrangement structure of pads and bumps |
| CN105529339A (en) * | 2016-02-17 | 2016-04-27 | 京东方科技集团股份有限公司 | Array substrate, chip on film and display device |
| CN105720028A (en) * | 2016-02-04 | 2016-06-29 | 京东方科技集团股份有限公司 | Chip on film, flexible display panel and display device |
| CN208705626U (en) * | 2018-07-23 | 2019-04-05 | Oppo广东移动通信有限公司 | Mobile terminal and its display device |
| CN109686712A (en) * | 2018-12-26 | 2019-04-26 | 厦门天马微电子有限公司 | Display panel and display device |
| CN110286535A (en) * | 2019-06-20 | 2019-09-27 | 上海天马微电子有限公司 | Display module, manufacturing method of display module and display device |
| CN111383554A (en) * | 2019-11-06 | 2020-07-07 | 上海中航光电子有限公司 | Display panel and display device |
| CN112071200A (en) * | 2020-09-10 | 2020-12-11 | 武汉华星光电半导体显示技术有限公司 | Display panel, binding substrate and binding method of display panel and binding substrate |
| CN113257126A (en) * | 2021-05-10 | 2021-08-13 | Tcl华星光电技术有限公司 | Flexible display panel |
| CN113421491A (en) * | 2021-06-17 | 2021-09-21 | 合肥维信诺科技有限公司 | Chip on film, display panel and display device |
| CN113421494A (en) * | 2021-06-22 | 2021-09-21 | 合肥维信诺科技有限公司 | Chip on film, display panel and display device |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102477230B1 (en) * | 2018-01-25 | 2022-12-13 | 삼성디스플레이 주식회사 | Display device |
| WO2020113384A1 (en) * | 2018-12-03 | 2020-06-11 | 深圳市柔宇科技有限公司 | Display device |
| CN109523912B (en) * | 2018-12-13 | 2021-03-16 | 厦门天马微电子有限公司 | Display panel and display device |
| US11139362B2 (en) * | 2019-07-23 | 2021-10-05 | Wuhan China Star Optoelectronics | Display panel with asymmetrically disposed pads |
| CN112748613B (en) * | 2020-12-31 | 2022-07-26 | 湖北长江新型显示产业创新中心有限公司 | Display substrate, display panel and display device |
| CN113157143B (en) * | 2021-05-26 | 2024-04-23 | 京东方科技集团股份有限公司 | Display panel and display device |
| CN114973995B (en) * | 2022-05-27 | 2024-03-26 | 福州京东方光电科技有限公司 | Display panel, display device and binding method thereof |
-
2022
- 2022-05-27 CN CN202210586021.0A patent/CN114973995B/en active Active
-
2023
- 2023-05-09 WO PCT/CN2023/093038 patent/WO2023226750A1/en unknown
Patent Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104123902A (en) * | 2013-04-29 | 2014-10-29 | 三星显示有限公司 | Display panel, electronic device including same, and bonding method thereof |
| KR20150022211A (en) * | 2013-08-22 | 2015-03-04 | 하이디스 테크놀로지 주식회사 | Display panel, ic chip and liquid crystal display device having fan-shaped arrangement structure of pads and bumps |
| CN105720028A (en) * | 2016-02-04 | 2016-06-29 | 京东方科技集团股份有限公司 | Chip on film, flexible display panel and display device |
| CN105529339A (en) * | 2016-02-17 | 2016-04-27 | 京东方科技集团股份有限公司 | Array substrate, chip on film and display device |
| CN208705626U (en) * | 2018-07-23 | 2019-04-05 | Oppo广东移动通信有限公司 | Mobile terminal and its display device |
| CN109686712A (en) * | 2018-12-26 | 2019-04-26 | 厦门天马微电子有限公司 | Display panel and display device |
| CN110286535A (en) * | 2019-06-20 | 2019-09-27 | 上海天马微电子有限公司 | Display module, manufacturing method of display module and display device |
| CN111383554A (en) * | 2019-11-06 | 2020-07-07 | 上海中航光电子有限公司 | Display panel and display device |
| CN113971909A (en) * | 2019-11-06 | 2022-01-25 | 上海中航光电子有限公司 | Display panel and display device |
| CN112071200A (en) * | 2020-09-10 | 2020-12-11 | 武汉华星光电半导体显示技术有限公司 | Display panel, binding substrate and binding method of display panel and binding substrate |
| CN113257126A (en) * | 2021-05-10 | 2021-08-13 | Tcl华星光电技术有限公司 | Flexible display panel |
| CN113421491A (en) * | 2021-06-17 | 2021-09-21 | 合肥维信诺科技有限公司 | Chip on film, display panel and display device |
| CN113421494A (en) * | 2021-06-22 | 2021-09-21 | 合肥维信诺科技有限公司 | Chip on film, display panel and display device |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2023226750A1 (en) | 2023-11-30 |
| CN114973995A (en) | 2022-08-30 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP4254883B2 (en) | Wiring board, mounting structure, and manufacturing method thereof | |
| US7432213B2 (en) | Electrical connection pattern in an electronic panel | |
| CN110133924B (en) | Display apparatus | |
| US11327373B2 (en) | Display device and wiring substrate | |
| KR100856640B1 (en) | Mount structure, electrooptic device, and electronic device | |
| US20070222777A1 (en) | Electrooptic device, wiring board, method for manufacturing electrooptic device, and electronic device | |
| CN100461984C (en) | Circuit assembling structure | |
| US20080067635A1 (en) | Chip-mounted film package | |
| WO2020039709A1 (en) | Display device and integrated circuit module | |
| CN114973995B (en) | Display panel, display device and binding method thereof | |
| CN113031357A (en) | Array substrate, liquid crystal display panel and liquid crystal display device | |
| CN112748612B (en) | Display apparatus | |
| JP4380681B2 (en) | Mounting structure, electro-optical device, electronic apparatus, and manufacturing method of mounting structure | |
| US7760315B2 (en) | Electrooptical device, mounting assembly, method for producing electrooptical device, and electronic apparatus | |
| JP2003289086A (en) | Semiconductor device and electro-optical device including the same | |
| US20220107525A1 (en) | Display device and method of manufacturing the same | |
| JP5317777B2 (en) | Mounting structure, electro-optical device, and electronic apparatus | |
| US20070246836A1 (en) | Electric terminal device and method of connecting the same | |
| US11716814B2 (en) | Technologies for mounting display driver integrated circuit chips on display panels | |
| JP2007240809A (en) | Electro-optical device, electronic apparatus, and method for manufacturing electro-optical device | |
| JP3482881B2 (en) | Semiconductor mounting structure, liquid crystal device and electronic equipment | |
| EP4189785A1 (en) | Connector assembly for sensor device | |
| JPH09179137A (en) | Liquid crystal display device | |
| JP2008083312A (en) | Package structure, electrooptic device and electronic equipment | |
| JP2005234459A (en) | Display apparatus and liquid crystal display apparatus |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |