JP3482881B2 - Semiconductor mounting structure, liquid crystal device and electronic equipment - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor mounting structure for mounting a semiconductor chip on a substrate. The present invention also relates to a liquid crystal device including the semiconductor mounting structure. The present invention also relates to an electronic device including the liquid crystal device.

[0002]

2. Description of the Related Art In recent years, a liquid crystal device has been widely used as a part of a mobile phone, a mobile electronic terminal, an electronic notebook, and other electronic devices, for example, an image display unit. This liquid crystal device is manufactured, for example, as follows. That is, a pair of substrates (in most cases, transparent substrates) each having an electrode (for example, a transparent electrode) are attached to each other, and liquid crystal is sealed in a gap formed between these substrates, a so-called cell gap. Is formed by A polarizing plate is further mounted on the outer surface of the substrate as needed, and a color filter is provided on the inner surface of one substrate as needed.

If the orientation of the liquid crystal is controlled by controlling the voltage applied to the electrodes facing each other across the liquid crystal, the light supplied to the liquid crystal can be modulated, whereby images such as letters, numbers and pictures can be obtained. Can be displayed.

In order to control application of a predetermined voltage between opposed transparent electrodes, in a normal liquid crystal device, a substrate side terminal formed on a substrate and an IC side terminal of a liquid crystal driving IC chip which is a semiconductor, for example, Align the bumps with each other,
That is, after they are aligned, they are conductively connected to each other, and a predetermined voltage is applied between the electrodes according to the instruction from the IC chip.

Various methods are conventionally known for mounting the liquid crystal driving IC chip on the substrate.
For example, as seen in a so-called COG (Chip On Glass) type liquid crystal device, a semiconductor mounting structure of a type in which an IC chip is directly connected to a substrate forming a liquid crystal panel is known.

According to this semiconductor mounting structure, as shown in FIG.
As shown in, the bump 5 which is a terminal on the IC chip 54 side
7 and the tip portion of the substrate-side terminal 56 on the substrate 52 side are formed to have the same size so as not to protrude from each other, or the width of the substrate-side terminal 56 is formed to be slightly smaller than the bump size.

[0007]

However, in the above-mentioned conventional semiconductor mounting structure, the bump 57 and the bump 57 are caused by an alignment error between the bump 57 and the board-side terminal 56, an error at the time of pressure bonding, and the like. There is a problem in that a positional deviation occurs between the board-side terminal 56 and the overlap margin between the two cannot be sufficiently secured, and the electrical connection between the two becomes unstable.

By the way, in some semiconductor mounting structures, terminal pitches P1 and P2 of terminal rows on two adjacent sides are arranged so as to be different from each other. Assuming now that the horizontal terminal pitch P1 is larger than the vertical terminal pitch P2, that is, P1> P2, the bumps in the terminal arrangement direction in which the terminal pitch is narrower, that is, in the vertical direction, are bumps. It is necessary to avoid as much as possible a relative dimensional error between the board 57 and the board-side terminal 56, and therefore the dimensional accuracy in that direction is controlled with high accuracy. In contrast,
In the arrangement direction of the terminal row having the wider terminal pitch, that is, in the lateral direction, it is possible to provide a margin for the dimensional error due to the wider terminal pitch.

The present invention has been made in view of the above problems, and a simple improvement is made to a board-side terminal in a semiconductor mounting structure in which terminal pitches of terminal rows on two adjacent sides are different. By adding them, a sufficient connection area is always secured between the semiconductor side terminals such as bumps and the substrate side terminals, thereby improving the yield in the manufacturing process of the liquid crystal device and reducing the cost, and further improving the reliability of the liquid crystal device. The purpose is to improve the sex.

[0010]

(1) In order to achieve the above object, a semiconductor mounting structure according to the present invention has a plurality of semiconductors arranged such that the pitch between terminals is different between adjacent two sides. In a semiconductor mounting structure for mounting a semiconductor chip having side terminals on a substrate having a plurality of board-side terminals arranged so as to correspond to those semiconductor-side terminals, the semiconductor chip is a reference mounting of the board. Of the board-side terminals so that the tip edges of the board-side terminals formed on the side of the board-side terminals having a narrower pitch between terminals may exceed the edges of the semiconductor-side terminals when mounted on the position. It is characterized by the increased length.

As described above, if the length of the board-side terminal having the narrower pitch between terminals is made longer in the lengthwise direction and the preliminary region is formed at the tip portion thereof, the board-side terminal having the narrower pitch between terminals is formed. In the length direction, that is, in the width direction of the board-side terminals having a wider terminal pitch, even if the semiconductor chip is connected in a state of being displaced with respect to the board, the deviation amount of As long as it is within the range, a sufficient margin can be always formed between the semiconductor-side terminal and the substrate-side terminal. As a result, high connection reliability can always be ensured between the semiconductor-side terminal and the board-side terminal.
When the semiconductor chip is mounted on the substrate, it is possible to make a large dimensional control tolerance in the length direction of the substrate-side terminals. The fact that a large dimensional tolerance can be taken means that the yield in the manufacture of liquid crystal devices can be improved.

(2) In the above semiconductor mounting structure,
The length of the board-side terminal is appropriately set according to the distance between adjacent semiconductor chip-side terminals, that is, the pitch, etc. When considering the pitch of the semiconductor chip side terminals, for example, about 50 μm to 70 μm,
The front edge of the board-side terminal is 15 μm to 2 mm along the edge of the IC-side terminal
It is desirable to increase the length of the board-side terminal so that it exceeds about 0 μm.

According to this structure, it is possible to surely compensate the positional deviation of the semiconductor chip with respect to the substrate without making the substrate-side terminal too long.

(3) Next, the liquid crystal device according to the present invention is
A liquid crystal device having a pair of substrates facing each other across a gap and a liquid crystal sealed in the gap is characterized by having the IC mounting structure described in (1) or (2) above.

According to this liquid crystal device, high connection reliability can be always ensured between the semiconductor-side terminal and the substrate-side terminal for the same reason as described in relation to the semiconductor mounting structure. In addition, when mounting the semiconductor chip on the substrate, a large dimensional control tolerance in the length direction of the substrate-side terminals can be taken, and therefore, the yield in manufacturing the liquid crystal device can be improved.

(4) Next, the electronic device according to the present invention is
The liquid crystal device having the above structure and a control unit for controlling the operation of the liquid crystal device are provided. According to this electronic device, for the same reason as described in connection with the semiconductor mounting structure and the liquid crystal device, the connection reliability between the semiconductor side terminal and the substrate side terminal in the liquid crystal device is always high. Can be secured. In addition, when mounting the semiconductor chip on the substrate, a large dimensional control tolerance in the length direction of the substrate-side terminals can be taken, and therefore, the yield in manufacturing the liquid crystal device can be improved. Further, the liquid crystal device of the present invention is
It has two substrates bonded to each other, one of
The substrate projects outward from a predetermined side of the other substrate
Adjacent to each other in a liquid crystal device having an overhang
Having a first side and a second side and
And a semiconductor chip disposed on the first side and arranged along the first side.
A plurality of first semiconductor terminals arranged in a row and a plurality of first semiconductor terminals along the second side.
And arranged more than the plurality of first semiconductor terminals
A plurality of second semiconductor terminals having a narrow pitch, and a first semiconductor
A first board-side terminal conductively connected to the terminal and a second semiconductor
A second board-side terminal conductively connected to the body terminal,
The first side of the semiconductor chip is the other side of the substrate.
Arranged along the predetermined side, the first substrate side
The terminal is wider than the first semiconductor terminal and is
The front edge of the second board-side terminal is the end of the second semiconductor terminal.
It must be placed so that it exceeds the edge by 15 to 20 μm.
And are characterized.

[0017]

DESCRIPTION OF THE PREFERRED EMBODIMENTS (First Embodiment) FIG. 2 shows an embodiment of a liquid crystal device using a semiconductor mounting structure according to the present invention. The liquid crystal device 1 shown here is a so-called COG in which a liquid crystal driving IC is directly mounted on a substrate.
(Chip On Glass) type liquid crystal device. The liquid crystal device 1 includes a liquid crystal panel 3 formed by bonding substrates 2a and 2b to each other with a sealing material 11, and a liquid crystal driving IC chip 4 which is a semiconductor mounted on the liquid crystal panel 3.
Have and.

The substrates 2a and 2b are made of a translucent material such as glass or plastic.
Further, the active surface 4a of the liquid crystal driving IC chip 4 has a structure shown in FIG.
As shown in, a plurality of bumps 7, that is, semiconductor-side terminals (hereinafter referred to as IC-side terminals) are formed along the outer peripheral edge. A polarizing plate 10 is attached to the outer surface of each of the substrates 2a and 2b, and if necessary, an illuminating device such as a backlight and a light reflecting member are attached to one of the substrates.

A minute gap, a so-called cell gap, is formed between the substrate 2a and the substrate 2b, and liquid crystal is sealed in the cell gap. A linear transparent electrode 8a is formed on the inner surface of the substrate 2a, and a linear electrode 8b orthogonal to the electrode 8a is formed on the inner surface of the substrate 2b. These electrodes 8a and 8b are made of, for example, ITO (Indium Tin).
Oxide). Also, these electrodes 8a
The intersection of the electrode 8b and the electrode 8b constitutes one pixel for displaying an image. The electrodes 8a and 8b are not limited to the linear electrodes, but may be an appropriate pattern such as a mark or a pattern.

The substrate 2b has a projecting portion that projects outward from the opposite substrate 2a, and a plurality of substrate-side terminals 6 are formed on the surface of the projecting portion by ITO (Indium Tin Oxide) or the like. These board-side terminals 6 include those that extend integrally from the electrode 8b and those that are connected to the electrode 8a via a conductive material.

The electrodes 8a and 8b and the substrate side terminal 6
In reality, many are formed on the substrate 2a and the substrate 2b at extremely narrow intervals, but in FIG. 2, the intervals are enlarged and schematically shown in order to make the structure easy to understand. Further, the connection state between the board-side terminal 6 and the electrodes 8a and 8b is also omitted in FIG.

The liquid crystal driving IC 7 is mounted on the substrate 2 of the liquid crystal panel 3.
At the time of mounting, that is, mounting on b, first, the film-like joining member ACF (Anisotropic Conductive Fi
lm: anisotropic conductive film) 9 is attached to the IC mounting area A on the substrate 2b. The ACF 9 is a bonding member known per se and is formed by dispersing conductive fine particles in a resin film. The ACF 9 is sandwiched between a pair of conductive terminals to be conductively connected. By heating and pressurizing, that is, by pressure bonding, the corresponding conductive terminals are electrically connected by the conductive fine particles, and the adjacent conductive terminals are maintained in the insulating state by the resin film.

After that, an alignment mark (not shown) provided on the active surface 4a of the liquid crystal driving IC 4 and a substrate 2 are provided.
The liquid crystal driving IC 4 is placed at a fixed position on the substrate 2b with reference to an alignment mark (not shown) provided at an appropriate position on the surface of b, and further heated and pressed. Then,
The conductive fine particles in the ACF 9 come into contact with both the IC-side bumps 7 and the substrate-side terminals 6 to establish a conductive connection between them.

In this embodiment, when the liquid crystal driving IC 4 is accurately joined to the reference mounting position of the board 2b, as shown in FIG. 4, the board-side terminals 6c arranged in the horizontal direction and the board-side terminals arranged in the vertical direction. 6b individually conductively connects to the bumps 7 of the liquid crystal driving IC 4. An enlarged view of the area of arrow B is as shown in FIG. In the present embodiment, as shown in FIG. 1, the inter-terminal pitches P1 and P2 of the terminal arrangement on two adjacent sides are set to be P1> P2.
Further, the longitudinal direction L of the board-side terminals 6b is set so that the leading end edge 6a of the board-side terminals 6b in the terminal row having a narrower pitch between terminals exceeds the end edge 7a of the bump 7 on the IC side.
The length of 1 is set longer than that of the conventional case shown in FIG. As a result, a preliminary region C indicated by diagonal lines is formed at the tip of the board-side terminal 6b.

Regarding the board-side terminals 6c in the row,
Similar to the conventional case shown in FIG. 6, the lengths are set so that the tip edges thereof are substantially at the same positions as the edge edges of the bumps 7. Since the terminal pitch P1 of the board-side terminals 6c is wide,
If necessary, the terminal width of each substrate-side terminal 6c may be made wider than the width of the bump 7.

Specific dimensional specifications relating to the board-side terminals 6 and the bumps 7 can be set as follows, for example.

(First Specification) Pitch P2 of Vertical Bumps 7 = 70 μm Gap of Terminals on Substrate 6 G = 20 μm Width of Terminals on Substrate 6 = 50 μm Width of Bump 7 = 50 μm Length of Bump 7 = 80 μm Preliminary Area Length of C in the longitudinal direction D = 15 μm to 20 μm (second specification) Pitch of vertical bump 7 P2 = 50 μm Gap of substrate side terminal 6 G = 15 μm Width of substrate side terminal 6 = 35 μm Bump 7 width = 35 μm The length of the bump 7 = 60 μm The length D of the preliminary region C in the longitudinal direction D = 15 μm In general, the alignment work and the pressure bonding work between the liquid crystal driving IC 7 and the substrate 2b are performed using an automatic machine. The dimensional error in that case is usually about ± 15 μm at the maximum. In each of the above specification examples, the length D of the preliminary area C is 15 μm
The setting of 20 μm is based on the dimensional error of such an automatic machine.

As described above, the length in the longitudinal direction of the substrate-side terminal 6b having a narrower pitch between terminals, that is, the pitch between terminals is P2, is increased so that the preliminary region is formed in a portion beyond the edge of the bump 7. If C is formed, even if the liquid crystal driving IC 4 is bonded to the substrate 2b in a state of being displaced in the longitudinal direction L1 of the substrate side terminals 6b in the column, the amount of displacement is within the range of the preliminary region C. Within the range, it is possible to always secure a sufficient margin for overlapping between the bump 7 on the IC side and the terminal 6b on the substrate side.

As a result, a high connection reliability can be always ensured between the bump 7 on the IC side and the terminal 6b on the substrate side.
When mounting the liquid crystal driving IC 4 on the substrate 2b, it is possible to make a large margin of dimensional control tolerance in the length direction of the substrate side terminal 6b. The fact that a large dimensional tolerance can be taken means that the yield in the manufacture of liquid crystal devices can be improved.

In FIG. 1, since the terminal pitch P2 of the board-side terminals 6b in the column is set to be narrow, the vertical direction L
No large positional deviation is allowed for 2, so that accurate dimensional control is performed for the vertical direction L2. For this reason, in this embodiment, since it is considered that there is no large positional deviation in the vertical direction L2, the lengths of the board-side terminals 6c extending in the vertical direction L2 are set so that a preliminary region is formed at their tips. Need not be set long.

(Second Embodiment) FIG. 5 shows a mobile phone which is an embodiment of an electronic apparatus according to the present invention. The mobile phone 20 shown here includes an antenna 21 and a speaker 2.
2, liquid crystal device 1, key switch 23, microphone 24
It is configured by storing various components such as the like in the outer case 26. Further, inside the outer case 26, a control circuit board 27 for controlling the operation of each of the above components is provided. The liquid crystal device 1 is composed of the liquid crystal device 1 shown in FIG.

In this mobile phone 20, the key switch 2
A signal input through the microphone 3 and the microphone 24, received data received by the antenna 21, and the like are input to the control circuit on the control circuit board 27. Then, the control circuit displays images such as numbers, characters, and patterns on the display surface of the liquid crystal device 1 based on the input various data, and further,
The transmission data is transmitted from the antenna 21.

As shown in FIG. 1, the liquid crystal device 1 used in this portable telephone 20 has a tip edge 6 of the board-side terminal 6b.
Since the length of the board-side terminal 6b in the longitudinal direction L1 is long so that a exceeds the edge 7a of the IC-side bump 7,
Even if the mounting position of the liquid crystal driving IC 4 is slightly displaced when the liquid crystal device 1 is manufactured, a reliable contact area can always be ensured between the bump 7 and the board-side terminal 6, and thus the defective liquid crystal device It is possible to prevent 1 from being mistakenly assembled in the mobile phone 20.

(Other Embodiments) The present invention has been described above with reference to the preferred embodiments, but the present invention is not limited to the embodiments and various modifications are possible within the scope of the invention described in the claims. Can be modified to

For example, in the embodiment shown in FIG. 2, COG
The present invention is applied to the liquid crystal device of the system, but instead of this,
A COB (Chip On Board) type liquid crystal device having a structure in which an IC chip is mounted on a substrate other than glass such as an epoxy substrate, or a COF (Chip On FPC) having a structure in which an IC chip is mounted on an FPC (Flexible Printed Circuit). The present invention can also be applied to a liquid crystal device of the type.

In the embodiment shown in FIG. 5, the case where the liquid crystal device of the present invention is used in a mobile phone as an electronic device is illustrated, but the liquid crystal device of the present invention is used in other electronic devices such as a portable information terminal and an electronic device. It can also be applied to notebooks, viewfinders of video cameras, etc.

Further, in the liquid crystal driving IC 4 shown in FIG.
Although the bumps 7 are provided in an annular shape over the entire area of the four sides of the IC chip, the bumps 7 may be provided on any two sides of the IC chip or on any three sides instead of this.

In general, a bump is an electrode that projects to the outside on the active surface of an IC chip. In the IC mounting structure and the like according to the present invention, the IC-side terminal provided on the IC chip is not limited to such bumps, and may be an electrode of any other structure.

[0039]

According to the IC mounting structure, the liquid crystal device, and the electronic equipment of the present invention, the length of the board-side terminal having the narrower pitch between terminals is lengthened in the lengthwise direction, and the spare area is provided at the tip portion thereof. Therefore, the IC is formed in the length direction of the board-side terminals having the narrower terminal pitch, that is, in the width direction of the board-side terminals having the wider terminal pitch.
Even if the chip is connected to the substrate in a misaligned state, as long as the displacement amount is within the range of the above-mentioned spare area, there is always a sufficient overlap margin between the IC side terminal and the board side terminal. Can be formed.

As a result, a high connection reliability can always be ensured between the IC-side terminal and the board-side terminal, and when the IC chip is mounted on the board, dimensional control in the lengthwise direction of the board-side terminal is allowed. A large error can be taken. The fact that a large dimensional tolerance can be taken means that the yield in the manufacture of liquid crystal devices can be improved.

[Brief description of drawings]

FIG. 1 is a plan view showing a main part of an embodiment of an IC mounting structure according to the present invention.

FIG. 2 is a perspective view showing an embodiment of a liquid crystal device according to the present invention.

FIG. 3 is a plan view showing an active surface of an example of an IC chip.

FIG. 4 is a diagram schematically showing a state in which bumps of an IC chip and substrate-side terminals on a substrate are conductively connected.

FIG. 5 is a perspective view showing an embodiment of an electronic device according to the invention.

FIG. 6 is a plan view showing an example of a conventional IC mounting structure.

[Explanation of symbols]

1 Liquid crystal device 2a, 2b substrate 3 LCD panel 4 LCD driving IC 6 Board side terminal 6a Leading edge of board side terminal 6b Board-side terminals in tandem 6c Horizontal board side terminals 7 bumps (IC side terminals) 7a Edge of bump A IC mounting area C Board side spare area D Tip length of board side terminal L1, L2 longitudinal direction

Claims (5)

(57) [Claims] 1. A semiconductor chip having a plurality of semiconductor-side terminals arranged so that the pitch between terminals is different between two adjacent sides, a plurality of semiconductor chips being arranged so as to correspond to those semiconductor-side terminals. In a semiconductor mounting structure for mounting on a board having board-side terminals, when the semiconductor chip is mounted on a standard mounting position of the board, the board-side terminals are formed on the side with a narrower terminal pitch. A semiconductor mounting structure, characterized in that the length of the board-side terminal is increased so that the leading edge of the board-side terminal exceeds the edge of the semiconductor-side terminal. 2. The semiconductor mounting structure according to claim 1, wherein the length of the board-side terminal is increased so that the tip edge of the board-side terminal exceeds the edge of the semiconductor-side terminal by 15 μm to 20 μm. . 3. A liquid crystal device having a pair of substrates facing each other across a gap and a liquid crystal sealed in the gap, having the semiconductor mounting structure according to claim 1 or 2. Liquid crystal device. 4. An electronic device comprising: the liquid crystal device according to claim 3; and a control unit that controls the operation of the liquid crystal device. 5. The two substrates bonded to each other
And one of the substrates is a predetermined side of the other substrate.
In a liquid crystal device that has an overhanging portion that juts out from the outside
And A first side and a second side that are adjacent to each other, and
A semiconductor chip arranged on the projecting portion, A plurality of first semiconductor ends arranged along the first side
With a child Are arranged along the second side, and the plurality of first
A plurality of second semiconductor terminals having a narrower pitch than the semiconductor terminals
When, First board-side terminal conductively connected to the first semiconductor terminal
When, Second board-side terminal conductively connected to the second semiconductor terminal
When, Equipped with The first side of the semiconductor chip is the other side of the substrate.
Along the predetermined side Is arranged like The first board-side terminal is more than the first semiconductor terminal.
Wide, The tip edge of the second substrate-side terminal is the second semiconductor end.
It is placed so that it exceeds the edge of the child by 15 to 20 μm.
Liquid crystal device characterized by being.