CN112071200A - Display panel, binding substrate and binding method of display panel and binding substrate - Google Patents
Display panel, binding substrate and binding method of display panel and binding substrate Download PDFInfo
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- CN112071200A CN112071200A CN202010945163.2A CN202010945163A CN112071200A CN 112071200 A CN112071200 A CN 112071200A CN 202010945163 A CN202010945163 A CN 202010945163A CN 112071200 A CN112071200 A CN 112071200A
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
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Abstract
The invention provides a display panel, a binding substrate and a binding method of the display panel and the binding substrate. The display panel is provided with a display area and a binding area, a pad arrangement area is arranged in the binding area, the pad arrangement area is trapezoidal, and the pad arrangement area comprises a pad assembly arranged in a fan-shaped mode. The binding substrate is adapted to the display panel. According to the invention, the pad assembly is arranged in a fan-shaped mode, so that the flexible wiring substrate or the driving chip can be prevented from being bonded and pressed due to the self expansion and contraction factors of materials, particularly when the upper end and the lower end of the flexible wiring substrate or the driving chip are not uniformly expanded, the longitudinal direction position of the bonding pad is adjusted to compensate the expansion amount in the transverse direction, and the electric connection of all bonding pad positions is ensured, the rapid and accurate positioning is facilitated, and the bonding dislocation is avoided.
Description
Technical Field
The invention relates to the field of display, in particular to a display panel, a binding substrate and a binding method of the display panel and the binding substrate.
Background
Generally, on a flexible display panel (hereinafter referred to as a "display panel"), driving of the display panel or external connection of control signals need to be realized by pressing the display panel and a flexible wiring substrate or pressing the display panel and a driving chip, which is called binding connection.
In order to bond and press the display panel and the flexible wiring substrate or the driving chip, the display panel includes a plurality of input pads (Pad), and the flexible wiring substrate or the driving chip includes a plurality of output pads. Because the flexible wiring substrate or the driving chip has expansion and contraction factors of materials, under the condition of laminating with the display panel, under the influence of cutter head heat and pressure (temperature, pressure and time), the output bonding pad on the flexible wiring substrate or the driving chip expands and becomes larger and is not matched with the size of the input bonding pad. In order to realize the size matching of the input bonding pad and the output bonding pad after pressing, certain size expansion compensation needs to be performed on the flexible wiring substrate or the driving chip in advance. Even so, also can't avoid flexible wiring base plate or driver chip because the breathing factor of material self, especially when flexible wiring base plate or driver chip upper and lower extreme inflation is inhomogeneous, because the pad is the rectangle strip structure of evenly spaced arrangement, lead to binding the input pad on the pressfitting back display panel and can't match together with the output pad on flexible wiring base plate or the driver chip, can influence the electrically conductive connection effect of display panel and flexible wiring base plate or driver chip.
Disclosure of Invention
The invention aims to provide a display panel, a binding substrate and a binding method of the display panel and the binding substrate, which are used for solving the technical problem that an input bonding pad on the display panel cannot be matched with an output bonding pad on the flexible wiring substrate or the driving chip together to influence a conductive connection effect after binding and pressing because the conventional bonding pads are in rectangular strip structures which are uniformly distributed at intervals, and the flexible wiring substrate or the driving chip cannot avoid expansion and shrinkage factors of materials, especially when the upper end and the lower end of the flexible wiring substrate or the driving chip are not uniformly expanded.
In order to solve the above problems, the present invention provides a display panel, which is provided with a display area and a bonding area, wherein the bonding area is provided with a pad arrangement area, the pad arrangement area is trapezoidal, and the pad arrangement area comprises pad components arranged in a sector mode; the welding disc assembly comprises a plurality of long-strip-shaped gaskets, and the gaskets are uniformly distributed in the welding disc distribution area by taking the longitudinal central shaft of the welding disc distribution area as a symmetrical shaft.
Furthermore, the edges of the upper side and the lower side of the pad coincide with the edges of the upper side and the lower side of the pad arrangement area, and the edges of the left side and the right side of the pad located at the outermost side coincide with the edges of the left side and the right side of the pad arrangement area.
Further, the pad assembly includes a first side pad and a second side pad; the first side bonding pad is arranged on one side of a longitudinal central shaft of the bonding pad arrangement area; the second side pad is arranged on the other side of the longitudinal central shaft of the pad arrangement area.
Furthermore, the first side pad comprises a plurality of first sub-pads which are arranged at intervals, the first sub-pads are in a parallelogram structure and are inclined along the same direction, and the distance between the top of each first sub-pad and the longitudinal central axis of the pad arrangement area is smaller than the distance between the bottom of each first sub-pad and the longitudinal central axis of the pad arrangement area; and/or the second side pad comprises a plurality of second sub-pads which are arranged at intervals, the second sub-pads are in parallelogram structures and incline along the same direction, and the distance between the top of each second sub-pad and the longitudinal central axis of the pad arrangement area is smaller than the distance between the bottom of each second sub-pad and the longitudinal central axis of the pad arrangement area.
Furthermore, the first side pad comprises a plurality of first sub-pads arranged at intervals, the second side pad comprises a plurality of second sub-pads arranged at intervals, and the first sub-pads and the second sub-pads are arranged in a mirror image manner with the longitudinal central axis of the pad arrangement area as a symmetry axis.
Furthermore, an included angle between a central axis of the first sub-pad and a longitudinal central axis of the pad arrangement region is positively correlated with a distance between the first sub-pad and the longitudinal central axis of the pad arrangement region; an included angle between a central axis of the second subpad and a longitudinal central axis of the pad arrangement area is positively correlated with a distance between the second subpad and the longitudinal central axis of the pad arrangement area; the intersection points of the central axis of the first sub-gasket and the central axis of the second sub-gasket are both positioned on the longitudinal central axis of the pad arrangement area.
Furthermore, the pad assembly also comprises a middle pad, and the middle pad is arranged at the longitudinal central axis position of the pad arrangement area; the first side bonding pad and the second side bonding pad are arranged on two sides of the middle bonding pad; the middle bonding pad comprises at least one middle sub-pad, and the middle sub-pad is rectangular.
The invention further provides a binding substrate, the binding substrate is bound with the display panel, the binding substrate comprises a binding pad arranged corresponding to the pad component of the display panel, and the shape of the binding pad is the same as or similar to that of the pad component.
Further, the binding substrate is a flexible wiring substrate or a driving chip.
The invention also provides a binding method of the display panel and the binding substrate, which comprises the following steps:
providing a display panel and a binding substrate;
arranging a bonding pad assembly of the display panel and a bonding pad of the binding substrate correspondingly, and inserting an anisotropic conductive film between the bonding pad assembly and the bonding pad; and
the bonding pad assembly, the bonding pad and the anisotropic conductive film are heated, and when the bonding pad is heated and expands to be matched with the size of the bonding pad, the bonding pad is bonded and pressed after the position of the longitudinal direction of the bonding pad is adjusted to compensate the expansion amount of the transverse direction of the bonding pad.
The invention has the beneficial effects that: the utility model provides a display panel, bind base plate and display panel and bind method of base plate, through setting up the pad subassembly into the structure that sector mode was arranged, can avoid flexible wiring base plate or driver chip because the breathing factor of material self, especially when flexible wiring base plate or driver chip upper and lower extreme inflation is inhomogeneous, bind the pressfitting after the inflation volume through adjusting the longitudinal direction position of bonding pad in order to compensate its horizontal direction, guaranteed all electric connection of binding pad position, and be convenient for quick accurate location, avoid binding the dislocation.
Drawings
The technical solution and other advantages of the present application will become apparent from the detailed description of the embodiments of the present application with reference to the accompanying drawings.
FIG. 1 is a schematic structural diagram of a display panel according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of a bond pad assembly according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of a bonding substrate according to an embodiment of the present invention when the bonding substrate is a flexible wiring substrate;
fig. 4 is a schematic structural diagram of the bonding substrate of the embodiment of the invention when the bonding substrate is a driver chip;
fig. 5 is a schematic plan view of the display panel and the flexible wiring substrate before being bonded together according to the embodiment of the present invention;
fig. 6 is a schematic plan view illustrating the display panel and the flexible wiring substrate after being laminated according to the embodiment of the present invention;
fig. 7 is a schematic plan view of the display panel and the driving chip before being bonded according to the embodiment of the present invention;
fig. 8 is a schematic plan view illustrating the display panel and the driving chip after being bonded in the embodiment of the present invention;
FIG. 9 is a schematic diagram of a structure for adjusting the compensation expansion and contraction of the bonding pad assembly in the longitudinal direction when the bonding pad is matched with the bonding pad assembly according to the embodiment of the invention.
The components in the figure are identified as follows:
1. pad assembly, 2, bond pad, 10, pad,
11. a first side pad, 12, a second side pad, 13, a middle pad,
100. a display panel, 101, a first subpad, 102, a second subpad,
103. middle subpad, 110, display area, 120, binding area,
121. pad arrangement region, 200, binding substrate, 201, integrated circuit chip.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It is to be understood that the embodiments described are only a few embodiments of the present application and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
Referring to fig. 1 and 2, an embodiment of the present invention provides a display panel 100, which includes a display area 110 and a bonding area 120, wherein a pad arrangement area 121 is disposed in the bonding area 120, the pad arrangement area 121 is trapezoidal, the trapezoid of the pad arrangement area 121 is preferably an isosceles trapezoid or an inverted isosceles trapezoid, and the pad arrangement area 121 includes pad assemblies 1 arranged in a sector pattern. I.e., the pad structure shape of the pad assembly 1 within the bonding zone 120 is arranged in a fan-shaped pattern. The fan-shaped mode refers to the arrangement mode of the fan handle when the fan is in an open state, and the liner structure is equivalent to the fan handle.
Referring to fig. 1 and fig. 2, in the present embodiment, the pad assembly 1 includes a plurality of strip-shaped pads 10, and the plurality of pads 10 are uniformly arranged in the pad arrangement area 121 by taking a longitudinal central axis of the pad arrangement area 121 as a symmetry axis; the edges of the upper and lower sides of the gasket 10 coincide with the upper and lower edges of the pad arranging region 121, and the edges of the left and right sides of the gasket 10 located at the outermost side coincide with the left and right edges of the pad arranging region 121. It is understood that the pad arrangement region 121 is an area surrounded by the outermost edge of the pad assembly 1.
Referring to fig. 2, in the present embodiment, the pad assembly 1 includes a first side pad 11 and a second side pad 12; the first side pad 11 is disposed on one side of the longitudinal central axis of the pad arrangement region 121; the second side pad 12 is disposed on the other side of the longitudinal center axis of the pad arrangement region 121.
In this embodiment, the first side pad 11 includes a plurality of first sub-pads 101 arranged at intervals, the first sub-pads 101 are all in a parallelogram structure and inclined along the same direction, and a distance between a top of the first sub-pad 101 and a longitudinal central axis of the pad arrangement region 121 is smaller than a distance between a bottom thereof and the longitudinal central axis of the pad arrangement region 121. In fig. 1 and 2, the first sub-pads 101 each have a right-angled parallelogram structure.
The second side pad 12 includes a plurality of second sub-pads 102 arranged at intervals, the second sub-pads 102 are all in a parallelogram structure and are inclined along the same direction, and a distance between a top of each second sub-pad 102 and a longitudinal central axis of the pad arrangement region 121 is smaller than a distance between a bottom thereof and the longitudinal central axis of the pad arrangement region 121. In fig. 1 and 2, the second sub-pads 102 each have a left-leaning parallelogram structure.
In this embodiment, the first side pad 11 includes a plurality of first sub-pads 101 arranged at intervals, the second side pad 12 includes a plurality of second sub-pads 102 arranged at intervals, and the first sub-pads 101 and the second sub-pads 102 are arranged in a mirror image with a longitudinal central axis of the pad arrangement area 121 as a symmetry axis.
In this embodiment, an included angle between a central axis of the first sub pad 101 and a longitudinal central axis of the pad arrangement region 121 is positively correlated with a distance between the first sub pad 101 and the longitudinal central axis of the pad arrangement region 121; that is, the included angle between the central axis of the first sub-pad 101 and the longitudinal central axis of the pad arrangement region 121 increases as the distance between the first sub-pad 101 and the longitudinal central axis of the pad arrangement region 121 becomes larger, and vice versa. An included angle between a central axis of the second subpad 102 and a longitudinal central axis of the pad arrangement region 121 is positively correlated with a distance between the second subpad 102 and the longitudinal central axis of the pad arrangement region 121; that is, the included angle between the central axis of the second sub-pad 102 and the longitudinal central axis of the pad arrangement region 121 increases as the distance between the second sub-pad 102 and the longitudinal central axis of the pad arrangement region 121 becomes larger, and vice versa.
As shown in fig. 2, the intersection points of the central axis of the first sub-pad 101 and the central axis of the second sub-pad 102 are located on the longitudinal central axis of the pad arrangement region 121. More specifically, the central axis of the first sub-gasket 101 and the central axis of the second sub-gasket 102 are indicated by a dotted line in fig. 2, and are hereinafter referred to as "imaginary lines". The first sub-pad 101 is a structure of the first side pad 11 on the left side in fig. 2, the first sub-pad 101 includes PL1-PL 5; the second sub-pad 102 is a structure of the second side pad 12 on the right side, and the second sub-pad 102 includes PR1-PR 5.
The imaginary lines extending from the upper and lower center points in the transverse direction of the first sub-pad 101 of the first side pad 11 and the imaginary lines extending from the upper and lower center points in the transverse direction of the second sub-pad 102 corresponding to the second side pad 12 intersect with each other two by two on the longitudinal center axis P of the pad layout area 121, for example: an imaginary line L1 from which the PL1 of the first sub-cushion 101 extends intersects with an imaginary line R1 from which the PR1 of the second sub-cushion 102 extends at a point P1, a point P1 is located on the central axis P, an imaginary line L2 from which the PL2 of the first sub-cushion 101 extends intersects with an imaginary line R2 from which the PR2 of the second sub-cushion 102 extends at a point P2, a point P2 is located on the central axis P, an imaginary line L3 from which the PL3 of the first sub-cushion 101 extends intersects with an imaginary line R3 from which the PR3 of the second sub-cushion 102 extends at a point P3, a point P3 is located on the central axis P, an imaginary line L3 from which the PL3 of the first sub-cushion 101 extends intersects with an imaginary line R3 from which the PR3 of the second sub-cushion 102 extends at a point P3, and a point P3 is located on the central axis P3, and a point P3 from which the imaginary line L3 from which the PL3 of the first sub-cushion 101 extends out intersects with the second sub-PR 3 of the second sub-cushion 102, the point P5 is on the central axis P, and P1, P2, P3, P4 and P5 belong to different position points. In summary, the imaginary line Ln extended from the first sub-pad 101PLn and the imaginary line Rn extended from the PRn of the second sub-pad 102 intersect with each other at Pn, n is different, Pn belongs to different positions, and all Pn positions are on the central axis P.
Referring to fig. 2, in the present embodiment, the pad assembly 1 further includes a middle pad 13, and the middle pad 13 is disposed at a longitudinal central axis position of the pad arrangement region 121; the first side pad 11 and the second side pad 12 are disposed at both sides of the middle pad 13; the middle pad 13 includes at least one middle sub-pad 103, and the middle sub-pad 103 has a rectangular shape. Namely, the first sub-gasket 101 and the second sub-gasket 102 on the left and right sides are symmetrically designed with the central sub-gasket 103 as a central axis.
It is understood that the pad 10 includes three types of the first subpad 101 and the second subpad 102 and the middle subpad 103, and the structures thereof may be the same or different.
In other embodiments, the first sub-pad 101 and the second sub-pad 102 may also be different, that is, the width of the first sub-pad 101 is different from that of the second sub-pad 102, or the separation distance between the first side pad 11 and two adjacent pads in the second side pad 12 is different. That is, the widths of the first side pad 11 and the second side pad 12 may be designed to have different values.
Referring to fig. 3 and 4, the present invention further provides a bonding substrate 200, where the bonding substrate 200 is bonded to the display panel 100, the bonding substrate 200 includes a bonding pad 2 disposed corresponding to a bonding pad assembly 1 of the display panel 100, and a shape of the bonding pad 2 is the same as or similar to a shape of the bonding pad assembly 1. By "similar" it is meant that the shape of the bonding pad 2 is abbreviated or exaggerated to a scale as the shape of the pad assembly 1.
In this embodiment, the bonding substrate 200 is a flexible wiring substrate or a driver chip. Fig. 3 is a schematic structural diagram of the bonding substrate 200 according to the embodiment of the present invention when it is a flexible wiring substrate; fig. 4 is a schematic structural diagram of the bonding substrate 200 according to the embodiment of the present invention when it is a driver chip.
Referring to fig. 3, when the bonding substrate 200 is a flexible wiring substrate, the flexible wiring substrate further includes an integrated circuit chip 201 (IC).
The present invention also provides a method for binding a display panel 100 and a binding substrate 200, which comprises the steps of:
providing a display panel 100 and a bonding substrate 200 as described above;
disposing a pad assembly 1 of the display panel 100 to correspond to a bonding pad 2 of the bonding substrate 200, and inserting an anisotropic conductive film (not shown) between the pad assembly 1 and the bonding pad 2; and
heating the pad assembly 1, the bonding pad 2 and the Anisotropic Conductive Film (ACF), and binding and stitching after adjusting the longitudinal direction position of the bonding pad 2 to compensate the expansion amount of the transverse direction when the bonding pad 2 is heated to expand to be matched with the size of the bonding pad 2.
When the bonding substrate 200 is a flexible wiring substrate, as shown in fig. 5, the pad assemblies 1 are arranged on the display panel 100 in a one-to-one correspondence, the bonding pads 2 are arranged on the flexible wiring substrate, and the bonding pads 2 and the pad assemblies 1 are aligned. When the display panel 100 and the flexible wiring substrate are aligned to allow the pad assembly 1 and the bonding pad 2 to be aligned with each other, an Anisotropic Conductive Film (ACF) is attached between the pad assembly 1 and the bonding pad 2, and then, when heat and pressure (temperature, pressure, time) are applied to a bonding area on the display panel 100 by a pressing head, the corresponding pad assembly 1 and the bonding pad 2 are conductively connected through the Anisotropic Conductive Film (ACF), thereby achieving bonding of the display panel 100 and the flexible wiring substrate. The flexible wiring substrate has the expansion and contraction property of materials, is influenced by heat and pressure of a pressure head, and the bonding pad 2 on the flexible wiring substrate expands and becomes, is not matched with the size of the welding disc assembly 1, compensates the expansion amount in the transverse direction by adjusting the position in the longitudinal direction, and enables the bonding pad 2 to be matched with the size of the welding disc assembly 1 together, as shown in fig. 6.
When the bonding substrate 200 is a driving chip, as shown in fig. 7, the pad assembly 1 is disposed on the display panel 100 in a one-to-one correspondence, the bonding pads 2 are disposed on the driving chip, and the pad assembly 1 and the bonding pads 2 are aligned. When the display panel 100 and the driving chip are aligned to allow the pad assembly 1 and the bonding pad 2 to be aligned with each other, an Anisotropic Conductive Film (ACF) is inserted between the pad assembly 1 and the bonding pad 2, and then, when heat and pressure (temperature, pressure, time) processing is applied to a bonding area on the display panel 100 by a pressing head, the corresponding pad assembly 1 and the bonding pad 2 are conductively connected through the Anisotropic Conductive Film (ACF), thereby achieving bonding of the display panel 100 and the driving chip. The driving chip has the expansion and contraction property of the material, is influenced by the heat and the pressure of a pressure head, expands and enlarges the bonding pad 2 on the driving chip, is not matched with the size of the welding disc assembly 1, compensates the expansion amount of the transverse direction by adjusting the position of the longitudinal direction, and enables the bonding pad 2 to be matched with the size of the welding disc assembly 1 together, as shown in fig. 8.
As shown in fig. 9, when the bonding pad 2 of the bonding substrate 200 is expanded, the expansion is converged by adjusting the upward deviation of the longitudinal direction of the bonding pad 2. On the contrary, when the bonding pad 2 of the bonding substrate 200 is retracted, the retraction is converged by adjusting the downward deviation of the longitudinal direction of the bonding pad 2. Even when the upper and lower end of flexible wiring substrate or drive chip inflation is inhomogeneous like this, bind the pressfitting after the inflation volume through adjusting the longitudinal direction position of nation bonding pad 2 with its horizontal direction of compensation, guaranteed all electric connection who binds the pad position, the quick accurate location of being convenient for moreover avoids binding the dislocation.
The display panel, the binding substrate and the binding method of the display panel and the binding substrate have the advantages that the bonding pad assembly is arranged into a fan-shaped mode arrangement structure, the flexible wiring substrate or the driving chip can be prevented from expanding and contracting due to the material, particularly when the upper end and the lower end of the flexible wiring substrate or the driving chip are not expanded uniformly, the binding and pressing are carried out after the longitudinal direction position of the binding bonding pad is adjusted to compensate the expansion amount in the transverse direction, the electric connection of all the binding bonding pad positions is guaranteed, the rapid and accurate positioning is facilitated, and the binding dislocation is avoided.
The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, various modifications and decorations can be made without departing from the principle of the present invention, and these modifications and decorations should also be regarded as the protection scope of the present invention.
Claims (10)
1. A display panel is provided with a display area and a binding area, and is characterized in that a pad arrangement area is arranged in the binding area, the pad arrangement area is trapezoidal, and pad components arranged in a fan-shaped mode are included in the pad arrangement area; the welding disc assembly comprises a plurality of long-strip-shaped gaskets, and the gaskets are uniformly distributed in the welding disc distribution area by taking the longitudinal central shaft of the welding disc distribution area as a symmetrical shaft.
2. The display panel according to claim 1, wherein edges of upper and lower sides of the gasket coincide with edges of upper and lower sides of the pad layout region, and edges of left and right sides of the gasket located at the outermost side coincide with edges of left and right sides of the pad layout region.
3. The display panel of claim 1, wherein the pad assembly comprises:
the first side bonding pad is arranged on one side of a longitudinal central shaft of the bonding pad arrangement area; and
and the second side bonding pad is arranged on the other side of the longitudinal central shaft of the bonding pad arrangement area.
4. The display panel according to claim 3, wherein the first side pad comprises a plurality of first sub-pads arranged at intervals, the first sub-pads are each in a parallelogram structure and inclined in the same direction, and the distance between the top of each first sub-pad and the longitudinal central axis of the pad arrangement region is smaller than the distance between the bottom of each first sub-pad and the longitudinal central axis of the pad arrangement region; and/or the presence of a gas in the gas,
the second side pad comprises a plurality of second sub-pads which are arranged at intervals, the second sub-pads are all in a parallelogram structure and are inclined along the same direction, and the distance between the top of each second sub-pad and the longitudinal central axis of the pad arrangement area is smaller than the distance between the bottom of each second sub-pad and the longitudinal central axis of the pad arrangement area.
5. The display panel according to claim 3, wherein the first side pad comprises a plurality of first sub-pads arranged at intervals, the second side pad comprises a plurality of second sub-pads arranged at intervals, and the first sub-pads and the second sub-pads are arranged in a mirror image with respect to a central longitudinal axis of the pad arrangement region as a symmetry axis.
6. The display panel according to claim 5,
an included angle between a central axis of the first subpad and a longitudinal central axis of the pad arrangement area is positively correlated with a distance between the first subpad and the longitudinal central axis of the pad arrangement area; an included angle between a central axis of the second subpad and a longitudinal central axis of the pad arrangement area is positively correlated with a distance between the second subpad and the longitudinal central axis of the pad arrangement area;
the intersection points of the central axis of the first sub-gasket and the central axis of the second sub-gasket are both positioned on the longitudinal central axis of the pad arrangement area.
7. The display panel of claim 3, wherein the pad assembly further comprises:
the middle bonding pad is arranged at the position of the longitudinal central axis of the bonding pad arrangement area; the first side bonding pad and the second side bonding pad are arranged on two sides of the middle bonding pad;
the middle bonding pad comprises at least one middle sub-pad, and the middle sub-pad is rectangular.
8. A binding substrate, wherein the binding substrate is bound with the display panel according to any one of claims 1 to 7, the binding substrate comprises a binding pad disposed corresponding to a pad assembly of the display panel, and the shape of the binding pad is the same as or similar to the shape of the pad assembly.
9. The bonding substrate according to claim 8, wherein the bonding substrate is a flexible wiring substrate or a driver chip.
10. A method for binding a display panel and a binding substrate is characterized by comprising the following steps:
providing a display panel according to any one of claims 1 to 7 and a binding substrate according to claim 8 or 9;
arranging a bonding pad assembly of the display panel and a bonding pad of the binding substrate correspondingly, and inserting an anisotropic conductive film between the bonding pad assembly and the bonding pad; and
the bonding pad assembly, the bonding pad and the anisotropic conductive film are heated, and when the bonding pad is heated and expands to be matched with the size of the bonding pad, the bonding pad is bonded and pressed after the position of the longitudinal direction of the bonding pad is adjusted to compensate the expansion amount of the transverse direction of the bonding pad.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010945163.2A CN112071200A (en) | 2020-09-10 | 2020-09-10 | Display panel, binding substrate and binding method of display panel and binding substrate |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202010945163.2A CN112071200A (en) | 2020-09-10 | 2020-09-10 | Display panel, binding substrate and binding method of display panel and binding substrate |
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| CN112071200A true CN112071200A (en) | 2020-12-11 |
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| CN202010945163.2A Pending CN112071200A (en) | 2020-09-10 | 2020-09-10 | Display panel, binding substrate and binding method of display panel and binding substrate |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113053257A (en) * | 2021-03-31 | 2021-06-29 | 合肥维信诺科技有限公司 | Display panel and display device |
| CN114973995A (en) * | 2022-05-27 | 2022-08-30 | 福州京东方光电科技有限公司 | Display panel, display device and binding method thereof |
| WO2023039861A1 (en) * | 2021-09-17 | 2023-03-23 | 京东方科技集团股份有限公司 | Circuit board assembly, display module and manufacturing method therefor, and display device |
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| CN114973995B (en) * | 2022-05-27 | 2024-03-26 | 福州京东方光电科技有限公司 | Display panel, display device and binding method thereof |
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Application publication date: 20201211 |