CN218550262U - Printed circuit board and electronic device - Google Patents
Printed circuit board and electronic device Download PDFInfo
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- CN218550262U CN218550262U CN202222158697.8U CN202222158697U CN218550262U CN 218550262 U CN218550262 U CN 218550262U CN 202222158697 U CN202222158697 U CN 202222158697U CN 218550262 U CN218550262 U CN 218550262U
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Abstract
The utility model discloses a printed circuit board and electron device, wherein, printed circuit board includes: the surface of at least one side of the inner layer substrate is formed by a medium layer; the metal substrate is attached to one side of the inner substrate, on which the dielectric layer is formed; the metal substrate comprises a metal base and an electroplated metal layer wrapping the metal base; the outer-layer substrate is attached to one side, away from the inner-layer substrate, of the metal substrate; the outer substrate comprises a medium layer and a conducting layer which are arranged in a laminating way; wherein, the dielectric layer is attached to the metal substrate. Through the structure, the utility model discloses can improve printed circuit board's radiating efficiency.
Description
Technical Field
The utility model discloses be applied to printed circuit board's technical field, especially printed circuit board and electron device.
Background
A Printed Circuit Board (PCB), also called Printed Circuit Board or Printed Circuit Board, is an important electronic component used in a wide range of applications, is a support for electronic components, and is also a carrier for electrical connection of electronic components.
The traditional PCB heat dissipation method mainly comprises PCB external passive heat dissipation, and the main method for PCB external passive heat dissipation is to add a radiator or a heat pipe on a heating element and to dissipate heat by cooling air flow at the position of reasonably distributed heating elements.
The heat dissipation scheme has high requirements on element distribution and assembly space, and the heat dissipation effect is not good due to poor height consistency during component assembly and welding.
SUMMERY OF THE UTILITY MODEL
The utility model provides a printed circuit board and electron device to solve the not good problem of printed circuit board radiating effect.
In order to solve the technical problem, the utility model provides a printed circuit board, include: the surface of at least one side of the inner layer substrate is formed by a medium layer; the metal substrate is attached to one side of the inner layer substrate, on which the dielectric layer is formed; the metal substrate comprises a metal base and an electroplated metal layer wrapping the metal base; the outer layer substrate is attached to one side, away from the inner layer substrate, of the metal substrate; the outer substrate comprises a medium layer and a conducting layer which are arranged in a fitting mode; the dielectric layer is attached to the metal substrate.
The heat dissipation structure comprises outer-layer substrates, a plurality of heat dissipation holes, a plurality of metal substrates and a plurality of conducting layers, wherein the dielectric layers of the outer-layer substrates are provided with the plurality of heat dissipation holes, heat dissipation pieces are filled in the heat dissipation holes, one ends of the heat dissipation pieces are connected with the corresponding metal substrates, and the other ends of the heat dissipation pieces are connected with the corresponding conducting layers of the outer-layer substrates.
Wherein the heat sink comprises a plated metal piece.
The inner substrate comprises at least one dielectric layer and at least one conductive layer which are sequentially and circularly stacked and attached.
The printed circuit board is provided with a plurality of conductive holes so as to be electrically connected with different conductive layers through the conductive holes, and each metal substrate is provided with a plurality of through holes; at least part of the conductive Kong Chuanshe is connected with different conductive layers through the corresponding through holes.
The conductive holes comprise one or more of conductive through holes, conductive blind holes and conductive buried holes; and the conductive through holes and the conductive blind holes penetrate through the corresponding through holes.
And a gasket is arranged between the inner wall of the conductive hole and the inner wall of the corresponding through hole.
Wherein the thickness of the metal matrix ranges from 0.050 to 1.200 mm; the thickness range of the electroplated metal layer is 2-50 microns.
Wherein a brown layer is formed on the outer surface of the electroplating metal layer.
In order to solve the technical problem, the utility model also provides an electronic device, electronic device includes the printed circuit board of above-mentioned arbitrary item.
For solving the technical problem, the utility model discloses a printed circuit board is through setting up metal substrate between inside and outside base plate to make the heat pass through metal substrate conduction to flange limit, give off to the outside air in, the radiating effect is better, can play the radiating effect simultaneously to the heating element of a plurality of printed circuit board interior optional position, improves printed circuit board's radiating efficiency. The metal substrate comprises a metal base and an electroplating metal layer wrapping the metal base, so that the binding force between the metal base and the dielectric layer is enhanced through the electroplating metal layer, the layering phenomenon is reduced, and the structural stability and reliability of the metal base are enhanced. The arrangement mode of the metal substrate is not limited by the laminated structure, and the metal substrate can be suitable for any lamination and has wide application range.
Drawings
Fig. 1 is a schematic structural diagram of an embodiment of a printed circuit board provided by the present invention;
fig. 2 is a schematic view of a partial structure of the gasket of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work all belong to the protection scope of the present invention.
It should be noted that, if directional indications (such as up, down, left, right, front, and back … …) are involved in the embodiment of the present invention, the directional indications are only used to explain the relative position relationship between the components, the motion situation, etc. in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indications are changed accordingly.
In addition, if there is a description relating to "first", "second", etc. in the embodiments of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, the technical solutions in the embodiments may be combined with each other, but it must be based on the realization of those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should not be considered to exist, and is not within the protection scope of the present invention.
Referring to fig. 1, fig. 1 is a schematic structural diagram of an embodiment of a printed circuit board according to the present invention.
The printed circuit board 100 of the embodiment includes an inner substrate 110, at least one metal substrate 120, and at least one outer substrate 130.
Wherein, the surface of at least one side of the inner layer substrate 110 is formed by the dielectric layer 140. The metal substrate 120 is attached to the side of the inner substrate 110 where the dielectric layer 140 is formed. In a specific application scenario, the surface of one side of the inner substrate 110 is formed by the dielectric layer 140, and the dielectric layer 140 on the side is attached to the metal substrate 120. And the outer layer of the other side of the inner substrate 110 may be formed of the conductive layer 150. In another specific application scenario, the outer layers on two opposite sides of the inner substrate 110 may be formed by the dielectric layers 140, and the dielectric layers 140 on two opposite sides of the inner substrate 110 are respectively attached to the corresponding metal substrates 120.
The outer substrate 130 is attached to a side of the metal substrate 120 away from the inner substrate 110, that is, when a layer of the metal substrate 120 is attached to a side of the inner substrate 110, the outer substrate 130 is attached to a side of the layer of the metal substrate 120 away from the inner substrate 110. When the two opposite sides of the inner substrate 110 are respectively attached with one metal substrate 120, the sides of the two metal substrates 120 far away from the inner substrate 110 are respectively attached with the outer substrate 130.
The outer substrate 130 includes a dielectric layer 140 and a conductive layer 150; the dielectric layer 140 is attached to the metal substrate 120. That is, the two opposite sides of the metal substrate 120 are respectively attached to the dielectric layers 140 corresponding to the surfaces of the inner substrate 110 and the outer substrate 130, so that the metal substrate 120 is bonded and fixed to the corresponding inner substrate 110 and the corresponding outer substrate 130 through the dielectric layers 140.
The metal substrate 120 includes a metal base 121 and a plated metal layer 122 wrapping the metal base 121. The plating metal layer 122 may wrap the outer surface of the metal base 121, thereby enhancing the bonding force between the metal base 121 and the dielectric layer 140, and enhancing the structural stability and reliability of the metal base 121.
Through setting up metal substrate 120 between inner substrate 110 and outer base plate 130, can place metal substrate 121 in printed circuit board 100 in, heat accessible metal substrate 120's flange distributes to the outside air in, the radiating effect is better, improves printed circuit board 100's horizontal heat-sinking capability, and can play the simultaneous cooling effect to the heating element of a plurality of optional positions, improves printed circuit board 100's radiating efficiency.
In a specific application scenario, the size of the projection of the metal substrate 120 on the inner substrate 110 is the same as that of the inner substrate 110, so as to increase the contact area between the metal substrate 120 and each of the inner substrate 110 and the outer substrate 130 as much as possible and increase the heat dissipation and conduction area.
Through above-mentioned structure, the printed circuit board of this embodiment is through setting up metal substrate between inside and outside base plate to make the heat conduct to the flange limit through metal substrate, give off to the outside air in, the radiating effect is better, can play the effect of dispelling the heat simultaneously to the heating element of the interior optional position of a plurality of printed circuit boards, improves printed circuit board's radiating efficiency. The metal substrate comprises a metal base and an electroplating metal layer wrapping the metal base, so that the binding force between the metal base and the dielectric layer is enhanced through the electroplating metal layer, the layering phenomenon is reduced, and the structural stability and reliability of the metal base are enhanced. The arrangement mode of the metal substrate is not limited by the laminated structure, and the metal substrate can be suitable for any lamination and has wide application range.
In other embodiments, a plurality of heat dissipation holes 142 are formed in the dielectric layer 140 of each outer substrate 130, each heat dissipation hole 142 is filled with a heat dissipation member 141, one end of each heat dissipation member 141 is connected to the corresponding metal substrate 120, specifically, the metal plating layer 122 of the metal substrate 120, and the other end of each heat dissipation member 141 is connected to the corresponding conductive layer 150 of the outer substrate 130.
Through the arrangement of the heat dissipation holes 142 filled with the heat dissipation members 141 on the dielectric layer 140 of the outer substrate 130, the heat on the metal substrate 120 can be conducted to the outer substrate 130 through the heat dissipation holes 142, and then diffused into the air, so as to increase the longitudinal heat dissipation capability of the printed circuit board 100.
The heat sink 141 may include metal parts such as silver, copper, aluminum, stainless steel, and alloy, a metal frame filled with a phase change material, and the like, which is not limited herein.
In a specific application scenario, the plurality of heat dissipation holes 142 on the dielectric layer 140 of each outer substrate 130 may be uniformly distributed on the corresponding dielectric layer 140, so as to uniformly conduct heat on the metal substrate 120, thereby improving the overall heat dissipation efficiency of the metal substrate 120. In another specific application scenario, the plurality of heat dissipation holes 142 on the dielectric layer 140 of each outer substrate 130 may also be correspondingly arranged based on the device positions on the printed circuit board 100, so as to improve the targeted heat dissipation efficiency for each device. The specific heat dissipation holes 142 can be set based on actual requirements.
Since the metal substrate 120 is disposed between the inner substrate 110 and the outer substrate 130, and the outer substrate 130 only includes the dielectric layer 140 and the conductive layer 150, the metal substrate 120 is disposed on the second outer layer of the printed circuit board 100, so that the metal substrate 121 can be disposed inside the printed circuit board 100, the heat dissipation efficiency of the metal substrate 121 is improved, the length of the heat dissipation member 141 is shortened, and the difficulty in manufacturing the heat dissipation member 141 is simplified.
In other embodiments, heat spreader 141 comprises a plated metal piece. That is, the heat sink 141 of the present embodiment is formed by electroplating the heat dissipation holes 142 until the heat dissipation holes 142 are filled, and the conductive layer 150 on the outer substrate 130 may also be formed during electroplating. The heat sink 141 formed by electroplating can be integrally formed with the metal layer 122 on the metal substrate 120 and the conductive layer 150 on the outer substrate 130, thereby increasing connection stability.
In other embodiments, the inner substrate 110 includes at least one dielectric layer 140 and at least one conductive layer 150, which are sequentially stacked and attached cyclically. That is, the inner substrate 110 is formed by sequentially stacking a dielectric layer 140, a conductive layer 150.
The conductive layer 150 may include one or more of a copper layer, lv Ceng, a silver layer, an alloy layer, and other metal conductive layers.
The dielectric layer 140 may specifically include one or more of epoxy, polyimide, bismaleimide Triazine (BT), and ceramic based.
Fig. 1 schematically illustrates the number of the dielectric layers 140 in the inner substrate 110 being 3 and the number of the conductive layers 150 being 2, but in other embodiments, the number of the dielectric layers 140 and the number of the conductive layers 150 in the inner substrate 110 may be other numbers, and is not limited herein.
In other embodiments, a plurality of conductive vias 160 are formed on the printed circuit board 100 to electrically connect different conductive layers 150 through the conductive vias 160, and a plurality of vias 123 are formed on each metal substrate 120.
At least some of the conductive vias 160 are formed through the corresponding vias 123 to connect different conductive layers 150.
The through hole 123 on the metal substrate 120 is a pre-drilled hole, and the through hole 123 is prepared on the metal substrate 120 in advance, so that the subsequent conductive hole 160 and the through hole 123 form a through hole to ensure the normal electrical connection of the printed circuit board 100 through the through hole 123.
In other embodiments, conductive via 160 includes one or more of conductive via 161, conductive blind via 163, and conductive buried via 162. The type and number of the conductive holes 160 in the printed circuit board 100 can be set based on actual requirements, and are not limited herein.
Since the metal substrate 120 is disposed on the second outer layer of the printed circuit board 100, each conductive via 161 and each conductive blind via 163 need to be inserted through the corresponding via 123, and the conductive buried via 162 may or may not be inserted through the corresponding via 123 depending on the disposed position.
In other embodiments, a spacer is disposed between an inner wall of the conductive via 160 and an inner wall of the corresponding via 123. Referring to fig. 2, fig. 2 is a schematic view of a partial structure of the gasket according to the present invention.
In the present embodiment, the spacer 170 is filled in the through hole 123 of the metal substrate 120 to occupy the inner space of the through hole 123, so that other spaces in the through hole 123 can be filled with the flowing glue of the dielectric layer 140 during the subsequent pressing, thereby saving the step of plugging the hole with the resin and saving the use of the resin.
After the conductive vias 160 are formed on the printed circuit board 100, at least a portion of the conductive vias 160 may penetrate the spacers 170 to achieve via connection, and finally the spacers 170 are disposed between the inner walls of the conductive vias 160 and the inner walls of the corresponding through holes 123.
The printed circuit board 100 of the embodiment does not need to additionally plug the metal substrate 120 with resin, and directly uses the resin of the dielectric layer 140 to fill the through hole 123 during lamination, when the dielectric layer 140 is a prepreg PP, the prepreg PP can be used for laminating and filling, and when the through hole 123 is large, the FR4 gasket + PP filling can be used to fill the through hole 123, so as to avoid the problems of void, unevenness and the like of the through hole 123.
In other embodiments, the thickness of the metal base 121 ranges from 0.050 to 1.200 mm, and the thickness of the metal base 121 may be 0.050 mm, 0.065 mm, 0.075 mm, 0.080 mm, 0.083 mm, 0.089 mm, 0.090 mm, 0.092 mm, 0.095 mm, 0.096 mm, 0.105 mm, 0.200 mm, 0.560 mm, 0.780 mm, 0.890 mm, 1.000 mm, 1.100 mm, 1.156 mm, 1.200 mm, or the like, and preferably, the thickness of the metal base 121 ranges from 0.075 to 1.000 mm.
The metal base 121 within the above range can ensure a good heat dissipation effect and prevent the occurrence of an influence on the miniaturization of the printed circuit board 100 due to an excessively large size.
The metal matrix 121 may include a copper block, a silver block, a gold block, an aluminum block, an alloy block, or the like, which is not limited herein.
The thickness of the plated metal layer 122 is in the range of 2-50 microns. The thickness of the plated metal layer 122 may be 2 microns, 3 microns, 6 microns, 9 microns, 10 microns, 12 microns, 15 microns, 16 microns, 19 microns, 20 microns, 25 microns, 26 microns, 29 microns, 31 microns, 35 microns, 38 microns, 40 microns, 43 microns, 46 microns, or 50 microns, etc., and preferably, the thickness of the plated metal layer 122 ranges from 5 to 35 microns.
The electroplated metal layer 122 within the above range can not only increase the bonding force with the dielectric layer 140, but also avoid the occurrence of the condition that the miniaturization of the printed circuit board 100 is influenced due to the oversize size.
In other embodiments, the outer surface of the plated metal layer 122 is formed with a brown oxide layer (not shown).
The browning treatment is performed on the outer surface of the electroplated metal layer 122, so that the bonding force between the metal substrate 120 and the dielectric layers 140 on the upper side and the lower side can be further improved, the layering phenomenon on the two sides of the metal substrate 120 is reduced, and the structural stability and reliability of the printed circuit board 100 are improved.
Through above-mentioned structure, the printed circuit board of this embodiment is through setting up metal substrate between inside and outside base plate to make the heat conduct to the flange limit through metal substrate, give off to the outside air in, the radiating effect is better, can play the effect of dispelling the heat simultaneously to the heating element of the interior optional position of a plurality of printed circuit boards, improves printed circuit board's radiating efficiency. The metal substrate comprises a metal base and an electroplating metal layer wrapping the metal base, so that the bonding force between the metal base and the dielectric layer is enhanced through the electroplating metal layer and the browning layer, the layering phenomenon is reduced, and the structural stability and reliability of the metal base are enhanced. The metal substrate is not limited by a laminated structure, can be applied to any laminated layer, has a wide application range, does not need to slot a printed circuit board, does not have the problem of glue overflow, and can increase the flatness and the rigidity strength of the PCB.
Based on the same utility model concept, the utility model also provides an electronic device, electronic device includes the printed circuit board 100 of any above-mentioned embodiment.
The electronic device of the embodiment can be applied to the fields of base stations, optical modules, automotive electronics, smart phones, aerospace and the like, and is not limited herein.
The electronic device of the embodiment can improve the heat dissipation efficiency. And the layering phenomenon can be reduced, and the structural stability and reliability of the electronic device are enhanced.
The above only is the embodiment of the present invention, not limiting the patent scope of the present invention, all the equivalent structures or equivalent processes that are used in the specification and the attached drawings or directly or indirectly applied to other related technical fields are included in the patent protection scope of the present invention.
Claims (10)
1. A printed circuit board, comprising:
the surface of at least one side of the inner layer substrate is formed by a medium layer;
the metal substrate is attached to one side of the inner substrate, on which the dielectric layer is formed; the metal substrate comprises a metal base and an electroplated metal layer wrapping the metal base;
the outer layer substrate is attached to one side, away from the inner layer substrate, of the metal substrate; the outer substrate comprises a medium layer and a conducting layer which are arranged in a fitting mode; the dielectric layer is attached to the metal substrate.
2. The printed circuit board of claim 1, wherein a plurality of heat dissipation holes are formed in the dielectric layer of each outer substrate, a heat dissipation member is filled in each heat dissipation hole, one end of each heat dissipation member is connected to the corresponding metal substrate, and the other end of each heat dissipation member is connected to the corresponding conductive layer of the outer substrate.
3. The printed circuit board of claim 2, wherein the heat sink comprises a plated metal piece.
4. The printed circuit board of claim 1,
the inner substrate comprises at least one dielectric layer and at least one conductive layer which are sequentially and circularly stacked and attached.
5. The printed circuit board of claim 4, wherein a plurality of conductive vias are formed in the printed circuit board to electrically connect different conductive layers through the conductive vias, and a plurality of through holes are formed in each of the metal substrates;
at least part of the through holes corresponding to the conductive Kong Chuanshe are connected with different conductive layers.
6. The printed circuit board of claim 5, wherein the conductive via comprises one or more of a conductive via, a conductive blind via, and a conductive buried via;
and the conductive through holes and the conductive blind holes penetrate through the corresponding through holes.
7. The printed circuit board of claim 5,
and a gasket is arranged between the inner wall of the conductive hole and the corresponding inner wall of the through hole.
8. The printed circuit board of claim 1,
the thickness range of the metal base is 0.050-1.200 mm; the thickness range of the electroplated metal layer is 2-50 microns.
9. The printed circuit board of claim 1,
a brown layer is formed on the outer surface of the electroplating metal layer.
10. An electronic device, characterized in that it comprises a printed circuit board according to any of the preceding claims 1-9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222158697.8U CN218550262U (en) | 2022-08-16 | 2022-08-16 | Printed circuit board and electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222158697.8U CN218550262U (en) | 2022-08-16 | 2022-08-16 | Printed circuit board and electronic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218550262U true CN218550262U (en) | 2023-02-28 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222158697.8U Active CN218550262U (en) | 2022-08-16 | 2022-08-16 | Printed circuit board and electronic device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218550262U (en) |
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2022
- 2022-08-16 CN CN202222158697.8U patent/CN218550262U/en active Active
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