CN221103650U - Multilayer PCB circuit board for liquid crystal display - Google Patents
Multilayer PCB circuit board for liquid crystal display Download PDFInfo
- Publication number
- CN221103650U CN221103650U CN202322800436.6U CN202322800436U CN221103650U CN 221103650 U CN221103650 U CN 221103650U CN 202322800436 U CN202322800436 U CN 202322800436U CN 221103650 U CN221103650 U CN 221103650U
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- CN
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- Prior art keywords
- pcb
- layer pcb
- heat conducting
- dovetail
- support bar
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- 239000004973 liquid crystal related substance Substances 0.000 title abstract description 22
- 239000002356 single layer Substances 0.000 claims abstract description 34
- 239000003292 glue Substances 0.000 claims abstract description 10
- 239000010410 layer Substances 0.000 claims description 38
- 238000007789 sealing Methods 0.000 claims description 2
- CEOCDNVZRAIOQZ-UHFFFAOYSA-N pentachlorobenzene Chemical compound ClC1=CC(Cl)=C(Cl)C(Cl)=C1Cl CEOCDNVZRAIOQZ-UHFFFAOYSA-N 0.000 claims 10
- 230000000149 penetrating effect Effects 0.000 abstract description 2
- 230000017525 heat dissipation Effects 0.000 description 31
- FPWNLURCHDRMHC-UHFFFAOYSA-N 4-chlorobiphenyl Chemical compound C1=CC(Cl)=CC=C1C1=CC=CC=C1 FPWNLURCHDRMHC-UHFFFAOYSA-N 0.000 description 16
- 230000008878 coupling Effects 0.000 description 5
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- 239000000565 sealant Substances 0.000 description 3
- XOMKZKJEJBZBJJ-UHFFFAOYSA-N 1,2-dichloro-3-phenylbenzene Chemical compound ClC1=CC=CC(C=2C=CC=CC=2)=C1Cl XOMKZKJEJBZBJJ-UHFFFAOYSA-N 0.000 description 2
- 230000000712 assembly Effects 0.000 description 2
- 238000000429 assembly Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000004576 sand Substances 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 241001391944 Commicarpus scandens Species 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 210000002421 cell wall Anatomy 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a multilayer PCB circuit board for a liquid crystal display, which comprises support bars, a connecting frame plate and a single-layer PCB, wherein the single-layer PCB is distributed between the two support bars, and the opposite surfaces of the two support bars are provided with connecting grooves corresponding to the single-layer PCB; according to the utility model, one surfaces of two support strips with connecting grooves are close to a single-layer PCB in opposite directions, so that the two support strips are kept connected with two ends of the single-layer PCB through the connecting grooves and heat conducting glue arranged in the connecting grooves, then the two connection frame plates are contacted with the two support strips, and are connected with screw grooves on the connecting plates in a threaded manner through inclined holes penetrating through triangular blocks through flat head screws, so that the support strips, the connection frame plates and the single-layer PCB form a unit PCB assembly part.
Description
Technical Field
The utility model relates to the technical field of display screen PCB boards, in particular to a multilayer PCB circuit board for a liquid crystal display screen.
Background
The Liquid crystal display screen, english is called LCD, is called Liquid CRYSTAL DISPLAY, which belongs to a flat panel display. The screen display device is used for screen display of a television and a computer. The display screen has the advantages of low power consumption, small volume and low radiation. The liquid crystal display screen uses liquid crystal solution in two pieces of polarized materials, so that crystals can be rearranged to achieve the imaging purpose when current passes through the liquid, the PCB circuit board is an important component of the liquid crystal display screen, and the quality of the PCB board of the liquid crystal display screen determines the display effect and the service life of the liquid crystal display screen.
At present, for a PCB circuit board, generated heat can directly influence a light-emitting component of a liquid crystal display screen through the PCB, so that the light-emitting component of the liquid crystal display screen is influenced, the whole structural property and the heat dissipation performance of the traditional LED circuit board are not very good, and after long-time use, the circuit board is easy to break and the LED is easy to damage.
Through retrieving, publication number CN219181762U discloses a multilayer PCB board for display screen, relate to display screen PCB board technical field, including first support piece, second support piece and individual layer PCB board, the individual layer PCB board is connected between first support piece and second support piece, first support piece and second support piece top and bottom all are provided with the coupling assembling who is used for connecting, coupling assembling is used for stacking a plurality of first support pieces and second support piece and connects, coupling assembling is including the connection notch of seting up at first support piece and second support piece top, first support piece and second support piece bottom an organic whole is provided with the connection sand grip that matches with the connection notch, all be provided with the magnetic sheet on connection notch bottom surface cell wall and the connection sand grip. The utility model solves the technical problems of small application range and single applicable type of the existing display multilayer PCB support connecting component, can complete circuit design by stacking and connecting a plurality of first supporting pieces and second supporting pieces according to actual PCB connection requirements, and has wider application range.
In the above-mentioned scheme, adopt first support piece, second support piece and coupling assembling, realize the installation of individual layer PCB board to the circuit design is accomplished in the stacking connection of multilayer PCB board, and application scope is wider, but because first support piece, second support piece and coupling assembling in this scheme do not set up the heat radiation structure of PCB board, along with the function that liquid crystal display added constantly increases, if do not dispel the heat fast to the PCB board, causes adverse effect to the life-span of PCB board.
Therefore, the multilayer PCB circuit board for the liquid crystal display is provided, has the advantages of convenience in stacking and assembling the multilayer PCB boards and auxiliary heat dissipation, and further solves the problems in the background technology.
Disclosure of utility model
The utility model aims to solve the defects in the prior art, and provides a multilayer PCB circuit board for a liquid crystal display.
In order to achieve the above purpose, the present utility model adopts the following technical scheme: the utility model provides a multilayer PCB circuit board for LCD screen, includes support bar, connection frame board and individual layer PCB board, individual layer PCB board distributes between two support bars, and two support bar opposite sides all correspond the individual layer PCB board and offer the spread groove to the spread groove junction of individual layer PCB board and support bar is provided with the heat conduction glue, the inboard embedding of support bar is installed the heat conduction piece, and the one side of heat conduction piece links to each other with the individual layer PCB board through the heat conduction glue to the other end integrated into one piece of heat conduction piece has a plurality of radiating fins, the support bar is kept away from the laminating of the one end of individual layer PCB board and is had connection frame board, and the vent is seted up to the surface of connection frame board corresponding radiating fin to the peripheral welding of vent of connection frame board has two connecting plates, one of them the surface welding of connecting plate has the dovetails piece, and the surface of triangle piece alternates and is connected with the flat head screw, the one end of screw and the connecting plate threaded connection of connection frame board, the individual layer board is provided with a plurality of, and a plurality of individual layer PCB boards are arranged by last to down in proper order and each individual layer frame board corresponds the adjacent PCB board has two adjacent PCB to connect between the PCB board, and the adjacent PCB has two adjacent PCB boards to connect.
As a further description of the above technical solution: the support bar, the connecting frame plate and the single-layer PCB form a unit PCB assembly part, the unit PCB assembly part is provided with a plurality of units from top to bottom, and a plurality of unit PCB assembly parts are stacked to form a multi-layer PCB circuit board structure.
As a further description of the above technical solution: the support bar is provided with two sloping surfaces, each sloping surface is welded with a triangular block, the surface of each triangular block is provided with inclined holes corresponding to the flat head screw, and the surface of the connecting plate is provided with a thread groove corresponding to the flat head screw in an inclined manner.
As a further description of the above technical solution: two dovetail blocks are arranged on one connecting plate of the connecting frame plate, and two dovetail grooves are correspondingly formed in the other connecting plate of the connecting frame plate.
As a further description of the above technical solution: the two adjacent unit PCB assembly components are connected through the dovetail block and the dovetail groove, and sealant is filled between the dovetail block and the dovetail groove.
As a further description of the above technical solution: and one end of the radiating fin, which is far away from the heat conducting block, is uniformly provided with a plurality of U-shaped grooves.
The utility model has the following beneficial effects:
According to the utility model, one sides of the two support strips with the connecting grooves are close to the single-layer PCB in opposite directions, so that the two support strips are kept connected with two ends of the single-layer PCB through the connecting grooves and the heat conducting glue arranged in the connecting grooves, then the two connection frame plates are contacted with the two support strips, and are connected with the threaded grooves on the connecting plates through the inclined holes of the flat head screws, so that the support strips, the connection frame plates and the single-layer PCB form a unit PCB assembly part.
Drawings
FIG. 1 is a schematic diagram of a multi-layer PCB circuit board for a liquid crystal display according to the present utility model;
FIG. 2 is a schematic diagram of a structure of a connection frame of a multi-layer PCB circuit board for a liquid crystal display according to the present utility model;
Fig. 3 is a schematic diagram of a supporting strip structure of a multi-layer PCB circuit board for a liquid crystal display according to the present utility model.
Legend description:
1. A support bar; 2. connecting a frame plate; 3. a single layer PCB board; 4. a connecting plate; 5. a heat conduction block; 6. a heat radiation fin; 7. an electrical connection tube; 8. triangular blocks; 9. a flat head screw; 10. a thread groove; 11. dovetail blocks; 12. a dovetail groove; 13. a vent; 14. inclined holes; 15. and a connecting groove.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
According to an embodiment of the utility model, a multilayer PCB circuit board for a liquid crystal display is provided.
The utility model will be further described with reference to the accompanying drawings and the specific embodiments, as shown in fig. 1-3, a multi-layer PCB circuit board for a liquid crystal display according to an embodiment of the utility model includes a supporting bar 1, a connection frame 2 and a single-layer PCB 3, the single-layer PCB 3 is distributed between the two supporting bars 1, opposite sides of the two supporting bars 1 are provided with a connection slot 15 corresponding to the single-layer PCB 3, a connection slot 15 of the single-layer PCB 3 and the supporting bar 1 is provided with a heat-conducting glue, the inner side of the supporting bar 1 is embedded with a heat-conducting block 5, one side of the heat-conducting block 5 is connected with the single-layer PCB 3 through the heat-conducting glue, the other end of the heat-conducting block 5 is integrally formed with a plurality of heat-dissipating fins 6, one end of the supporting bar 1 away from the single-layer PCB 3 is attached with a connection frame 2, the surface of the connection frame 2 is provided with a vent 13 corresponding to the heat-dissipating fins 6, and the periphery of the vent 13 of the connection frame 2 is welded with two connection plates 4, the surface of one connecting plate 4 is welded with a dovetail block 11, the surface of the other connecting plate 4 is provided with a dovetail groove 12 corresponding to the dovetail block 11, the outer surface of the supporting bar 1 is welded with a triangular block 8, the surface of the triangular block 8 is connected with flat head screws 9 in a penetrating way, one end of each flat head screw 9 is in threaded connection with the connecting plate 4 of the connecting frame plate 2, a plurality of single-layer PCB plates 3 are arranged in sequence from top to bottom, each single-layer PCB plate 3 is correspondingly provided with a group of supporting bars 1 and connecting frame plates 2, an electric connecting pipe 7 is connected between two adjacent single-layer PCB plates 3 by adopting a bonding pad, the heat dissipation structure formed by the heat conducting block 5 and the heat dissipation fins 6 of the device is attached to the heat dissipation structure of the traditional multi-layer PCB circuit board, the heat dissipation structure formed by the heat conducting block 5 and the heat dissipation fins 6 mainly plays the role of auxiliary heat dissipation, the heat dissipation structure is matched with a traditional multi-layer PCB circuit board heat dissipation structure (the traditional multi-layer PCB circuit board heat dissipation structure is usually a heat dissipation fan and a copper heat conduction structure arranged on the PCB circuit board) so as to achieve the purpose of high-efficiency heat dissipation of the multi-layer PCB circuit board;
In one embodiment, the support bar 1, the connection frame plate 2 and the single-layer PCB 3 form a unit PCB assembly part, and the unit PCB assembly part is provided with a plurality of unit PCB assembly parts from top to bottom, the plurality of unit PCB assembly parts are stacked to form a multi-layer PCB circuit board structure, and the arrangement of the plurality of unit PCB assembly parts is beneficial to carrying out lap joint and design of the multi-layer PCB circuit board structure according to the actual requirements of the liquid crystal display screen, so that the flexibility of the multi-layer PCB circuit board structure is improved, and the application range is wider.
In one embodiment, two sloping surfaces are arranged on the supporting bar 1, triangular blocks 8 are welded on each sloping surface, inclined holes 14 are formed in the surfaces of the triangular blocks 8 corresponding to the flat head screws 9, screw grooves 10 are formed in the surfaces of the connecting plates 4 corresponding to the flat head screws 9 in an inclined mode, the flat head screws 9 are arranged in a yielding mode through the inclined holes 14, the flat head screws 9 are connected with the connecting plates 4 through the screw grooves 10, and therefore the supporting bar 1, the connecting frame plates 2 and the single-layer PCB 3 are fixedly connected.
In one embodiment, two dovetail blocks 11 are arranged on one connecting plate 4 of the connecting frame plate 2, two dovetail grooves 12 are correspondingly arranged on the connecting plate 4 of the other connecting frame plate 2, and connection between two unit PCB assembly components is facilitated through arrangement of the dovetail blocks 11 and the dovetail grooves 12, so that stacking and assembly of the multilayer PCB circuit boards are facilitated.
In one embodiment, two adjacent unit PCB assembly components are connected through the dovetail block 11 and the dovetail groove 12, and sealant is filled between the dovetail block 11 and the dovetail groove 12, and through the arrangement of the sealant, the two adjacent unit PCB assembly components are prevented from sliding relatively, so that the reliability of installation between the two adjacent unit PCB assembly components is guaranteed.
In one embodiment, the end of the heat dissipation fin 6 far away from the heat conduction block 5 is uniformly provided with a plurality of U-shaped grooves, and the contact area between the heat dissipation fin 6 and the air is increased through the arrangement of the plurality of U-shaped grooves.
Working principle:
During the use, through being close to individual layer PCB 3 in opposite directions with the one side that two support bars 1 had spread groove 15, make two support bars 1 keep being connected through spread groove 15 and the both ends that its inside set up with individual layer PCB 3, then two connection frame plates 2 are contacted with two support bars 1, and run through the inclined hole 14 of triangular block 8 and the thread groove 10 threaded connection on connecting plate 4 through flat head screw 9, make support bar 1, connect frame plates 2 and individual layer PCB 3 form a unit PCB package assembly spare, when stacking a plurality of individual layer circuit boards, because set up the forked tail piece 11 on one of them connecting plate 4 of connection frame plates 2, set up the dovetail 12 on another connecting plate 4, through adopting forked tail piece 11 and dovetail 12 to link to each other with a plurality of unit PCB package assemblies spare that pile up, both adjacent two unit PCB package assemblies keep being connected through forked tail piece 11 and dovetail 12 of connecting plate 4, and the sealing gum of packing between forked tail piece 11 and dovetail 12, again by the electric connection pipe 7 that sets up between adjacent two individual layer PCB 3, so that support bars 1, connect frame plates 2 and individual layer PCB 3 and a plurality of individual layer PCB 3 and heat dissipation piece 5 are installed through the heat dissipation piece 5 when a plurality of individual layer PCB 3 are stacked on the individual layer PCB 3, the heat dissipation piece is set up through the heat dissipation piece 5 and the heat dissipation piece is continuous through the individual layer PCB 5, the heat dissipation piece is realized through the heat dissipation piece 5, and the heat dissipation piece is set up through the heat dissipation piece is further on the individual layer PCB 5, the individual layer 3, and the heat dissipation piece is further has the heat dissipation piece is connected through the heat dissipation piece 5, and the heat dissipation piece is more than the heat dissipation piece is connected through the heat dissipation piece is by the heat dissipation piece.
Finally, it should be noted that: the foregoing description is only illustrative of the preferred embodiments of the present utility model, and although the present utility model has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described, or equivalents may be substituted for elements thereof, and any modifications, equivalents, improvements or changes may be made without departing from the spirit and principles of the present utility model.
Claims (6)
1. The utility model provides a multilayer PCB circuit board for LCD screen, includes support bar (1), connects framed board (2) and individual layer PCB board (3), its characterized in that: the single-layer PCB (3) is distributed between the two support bars (1), the opposite surfaces of the two support bars (1) are respectively corresponding to the single-layer PCB (3) and provided with a connecting groove (15), the connecting part of the single-layer PCB (3) and the connecting groove (15) of the support bar (1) is provided with heat conducting glue, the inner side of the support bar (1) is embedded and provided with a heat conducting block (5), one surface of the heat conducting block (5) is connected with the single-layer PCB (3) through the heat conducting glue, the other end of the heat conducting block (5) is integrally formed with a plurality of radiating fins (6), one end of the support bar (1) far away from the single-layer PCB (3) is attached with a connecting frame plate (2), the surface of the connecting frame plate (2) is provided with a vent (13) corresponding to the radiating fins (6), the periphery of the vent (13) of the connecting frame plate (2) is welded with two connecting plates (4), the surface of one connecting plate (4) is welded with a dovetail block (11), the surface of the other connecting plate (4) is provided with a plurality of heat conducting fins (12) through the heat conducting glue, the other end of the support bar (1) is far away from the single-layer PCB (3), the flat screw (8) is connected with the flat screw (9), and the flat screw (9) is connected with the flat screw (9), the single-layer PCB (3) is provided with a plurality of single-layer PCB (3), and a plurality of single-layer PCB (3) are arranged in sequence from top to bottom, and each single-layer PCB (3) is provided with a group of support bars (1) and connection frame plates (2) respectively, and two adjacent single-layer PCB (3) adopt the pad to be connected with electric connecting pipe (7).
2. The multilayer PCB of claim 1, wherein: the support bar (1), the connecting frame plate (2) and the single-layer PCB (3) form a unit PCB assembly part, a plurality of unit PCB assembly parts are arranged from top to bottom, and a plurality of unit PCB assembly parts are stacked to form a multi-layer PCB circuit board structure.
3. The multilayer PCB of claim 1, wherein: two sloping surfaces are arranged on the support bar (1), triangular blocks (8) are welded on each sloping surface, inclined holes (14) are formed in the surfaces of the triangular blocks (8) corresponding to the flat head screws (9), and threaded grooves (10) are obliquely formed in the surfaces of the connecting plates (4) corresponding to the flat head screws (9).
4. The multilayer PCB of claim 1, wherein: two dovetail blocks (11) are arranged on one connecting plate (4) of the connecting frame plates (2), and two dovetail grooves (12) are correspondingly formed in the other connecting plate (4) of the connecting frame plates (2).
5. The multilayer PCB of claim 2, wherein: the two adjacent unit PCB assembly components are connected through a dovetail block (11) and a dovetail groove (12), and sealing glue is filled between the dovetail block (11) and the dovetail groove (12).
6. The multilayer PCB of claim 1, wherein: and one end, far away from the heat conducting block (5), of the radiating fin (6) is uniformly provided with a plurality of U-shaped grooves.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322800436.6U CN221103650U (en) | 2023-10-18 | 2023-10-18 | Multilayer PCB circuit board for liquid crystal display |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322800436.6U CN221103650U (en) | 2023-10-18 | 2023-10-18 | Multilayer PCB circuit board for liquid crystal display |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN221103650U true CN221103650U (en) | 2024-06-07 |
Family
ID=91327933
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322800436.6U Active CN221103650U (en) | 2023-10-18 | 2023-10-18 | Multilayer PCB circuit board for liquid crystal display |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN221103650U (en) |
-
2023
- 2023-10-18 CN CN202322800436.6U patent/CN221103650U/en active Active
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