CN221058493U - Circuit board assembly with water cooling and heat dissipation functions - Google Patents

Circuit board assembly with water cooling and heat dissipation functions Download PDF

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Publication number
CN221058493U
CN221058493U CN202322618735.8U CN202322618735U CN221058493U CN 221058493 U CN221058493 U CN 221058493U CN 202322618735 U CN202322618735 U CN 202322618735U CN 221058493 U CN221058493 U CN 221058493U
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China
Prior art keywords
circuit board
water cooling
fixedly connected
threaded
board body
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CN202322618735.8U
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Chinese (zh)
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敖文均
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Shenzhen Chuangyou Rice Technology Co ltd
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Shenzhen Chuangyou Rice Technology Co ltd
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Abstract

The utility model relates to the technical field of circuit boards, in particular to a circuit board assembly with a water cooling and heat radiating function, which comprises a mounting seat, wherein four corners at the upper end of the mounting seat are fixedly connected with threaded mounting rods, four threaded mounting rods are jointly inserted and movably connected with a circuit board body, the outer surfaces of the four threaded mounting rods are connected with mounting mechanisms in a threaded manner, the four mounting mechanisms are positioned at the upper part of the circuit board body, and the lower end of the circuit board body is connected with a water cooling and heat radiating mechanism in an adhesive manner. According to the circuit board assembly with the water cooling and heat radiating function, the water cooling and heat radiating mechanism is arranged and is bonded with the lower end of the circuit board body through the adhesive layer, and then the two connectors are connected with the external water pump, so that cooling liquid circulates in the water cooling pipe.

Description

Circuit board assembly with water cooling and heat dissipation functions
Technical Field
The utility model relates to the technical field of circuit board assemblies, in particular to a circuit board assembly with a water cooling and heat dissipation function.
Background
The circuit board is divided into a single panel, a double panel and a multi-layer circuit board according to the number of layers, almost every electronic device, such as an electronic watch, a calculator, a computer, a communication electronic device and a military weapon system, only electronic elements such as an integrated circuit are needed, the circuit board is needed for electrically interconnecting all the elements, and at least the following defects exist in the use process of the traditional circuit board assembly: 1. most of the existing circuit board assemblies dissipate heat through air cooling in the use process, the heat dissipation effect is limited, and when the circuit board is used under high load, the heat dissipation requirement is difficult to reach through the air cooling only; 2. the existing circuit board assembly is required to be installed and fixed in the using process, but at present, when the circuit board is fixed, the fixing piece is easy to crush the circuit board, so that the circuit board assembly is damaged, and therefore, the circuit board assembly with the water cooling and heat dissipation functions is provided.
Disclosure of utility model
The utility model mainly aims to provide a circuit board assembly with a water cooling and heat radiating function, which can effectively solve the problems in the background technology.
In order to achieve the above purpose, the technical scheme adopted by the utility model is as follows:
The utility model provides a circuit board subassembly with water-cooling heat dissipation function, includes the mount pad, the equal fixedly connected with screw thread installation pole in mount pad upper end four corners, four screw thread installation pole interlude swing joint has the circuit board body jointly, four equal threaded connection of screw thread installation pole surface has mounting mechanism, four mounting mechanism all is located circuit board body upper portion, circuit board body lower extreme bonding is connected with water-cooling heat dissipation mechanism.
Preferably, the water cooling mechanism comprises an outer shell, the upper end of the outer shell is provided with a notch, the front end and the rear end of the outer shell are provided with a plurality of heat dissipation through holes penetrating through from front to back, the lower groove wall of the notch is fixedly connected with a lifting frame, the right groove wall of the notch is penetrated and fixedly connected with a water cooling pipe, the two ends of the water cooling pipe are fixedly connected with connectors, the two connectors are penetrated and fixedly connected with the right end of the outer shell, the lifting frame is penetrated and movably connected with the water cooling pipe, the four corners of the outer surface of the outer shell are provided with arc grooves, and the upper end of the outer shell is fixedly connected with an adhesive layer.
Preferably, four clamping grooves are formed in the upper end of the lifting frame, and the four clamping grooves are jointly connected with the water cooling pipe in a penetrating and movable mode.
Preferably, the adhesive layer is connected with the lower end of the circuit board body in an adhesive manner, and the four arc-shaped grooves are respectively connected with the four threaded mounting rods in a penetrating and movable manner.
Preferably, the mounting mechanism comprises a fastener, a plurality of poking sheets are fixedly connected to the outer surface of the fastener, and a rubber pressing plate is fixedly connected to the lower end of the fastener.
Preferably, the fastener is in threaded connection with the threaded mounting rod, the rubber pressing plate is in threaded movable connection with the threaded mounting rod, the rubber pressing plate is not in contact with the threaded mounting rod, and the rubber pressing plate is in contact with the upper end of the circuit board body.
Compared with the prior art, the utility model has the following beneficial effects:
1. The water cooling mechanism is adhered and connected with the lower end of the circuit board body through the adhesive layer, and then the two connectors are connected with the external water pump, so that cooling liquid circulates in the water cooling pipe;
2. Through setting up installation mechanism, link together circuit board body and four screw thread erection bars interlude, link together installation mechanism and screw thread erection bar threaded connection again, rotatory fastener makes rubber clamp plate and circuit board body contact and spacing to can avoid the fastener to cause the extrusion damage to circuit board body, through setting up a plurality of plectrum, can be convenient for rotate the fastener, improve the operation convenience.
Drawings
Fig. 1 is a schematic diagram of the overall structure of a circuit board assembly with water cooling and heat dissipation functions according to the present utility model;
Fig. 2 is a schematic diagram of the overall structure of a water cooling mechanism of a circuit board assembly with water cooling function according to the present utility model;
Fig. 3 is a schematic diagram of the overall structure of a lifting frame of a circuit board assembly with water cooling and heat dissipation functions;
Fig. 4 is a schematic diagram of the overall structure of a circuit board assembly with water cooling function according to the present utility model.
In the figure: 1. a mounting base; 2. a threaded mounting rod; 3. a mounting mechanism; 4. a circuit board body; 5. a water-cooling heat dissipation mechanism; 31. a fastener; 32. a rubber press plate; 33. a pulling piece; 51. an outer housing; 52. a heat dissipation through hole; 53. a connector; 54. a water-cooled tube; 55. a lifting frame; 56. a notch; 57. an adhesive layer; 58. an arc-shaped groove; 551. a clamping groove.
Detailed Description
The utility model is further described in connection with the following detailed description, in order to make the technical means, the creation characteristics, the achievement of the purpose and the effect of the utility model easy to understand.
In the description of the present utility model, it should be noted that the directions or positional relationships indicated by the terms "upper", "lower", "inner", "outer", "front", "rear", "both ends", "one end", "the other end", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of describing the present utility model and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific direction, be configured and operated in the specific direction, and thus should not be construed as limiting the present utility model. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present utility model, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "provided," "connected," and the like are to be construed broadly, and may be fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.
Referring to fig. 1-4, the present utility model provides a technical solution:
The utility model provides a circuit board subassembly with water-cooling heat dissipation function, includes mount pad 1, the equal fixedly connected with screw thread installation pole 2 in mount pad 1 upper end four corners, and four screw thread installation poles 2 alternate swing joint jointly and have circuit board body 4, and four screw thread installation pole 2 surface equal threaded connection have installation mechanism 3, and four installation mechanism 3 all are located circuit board body 4 upper portion, and circuit board body 4 lower extreme bonding is connected with water-cooling heat dissipation mechanism 5.
In this embodiment, the water cooling mechanism 5 includes a casing 51, a notch 56 is opened at the upper end of the casing 51, a plurality of heat dissipation through holes 52 penetrating from front to back are opened at the front end and the rear end of the casing 51, a lifting frame 55 is fixedly connected to the lower groove wall of the notch 56, a water cooling pipe 54 is fixedly connected to the right groove wall of the notch 56 in a penetrating manner, connectors 53 are fixedly connected to both ends of the water cooling pipe 54, the two connectors 53 are fixedly connected to the right end of the casing 51 in a penetrating manner, the lifting frame 55 is movably connected to the water cooling pipe 54 in a penetrating manner, arc-shaped grooves 58 are opened at four corners of the outer surface of the casing 51, and an adhesive layer 57 is fixedly connected to the upper end of the casing 51; four clamping grooves 551 are formed in the upper end of the lifting frame 55, and the four clamping grooves 551 are jointly connected with the water cooling pipe 54 in a penetrating and movable mode; the adhesive layer 57 is connected with the lower end of the circuit board body 4 in an adhesive manner, the four arc-shaped grooves 58 are respectively inserted into the four threaded mounting rods 2 in a movable connection manner, and after the four arc-shaped grooves 58 are inserted into the four threaded mounting rods 2, the outer shell 51 can be limited through the four threaded mounting rods 2, so that the displacement of the outer shell 51 is avoided.
In the embodiment, the mounting mechanism 3 comprises a fastener 31, a plurality of poking sheets 33 are fixedly connected to the outer surface of the fastener 31, and a rubber pressing plate 32 is fixedly connected to the lower end of the fastener 31; the fastener 31 is in threaded connection with the threaded mounting rod 2, the rubber pressing plate 32 is in threaded movable connection with the threaded mounting rod 2, the rubber pressing plate 32 is not in contact with the threaded mounting rod 2, and the rubber pressing plate 32 is in contact with the upper end of the circuit board body 4.
It should be noted that, in the use process, the release paper on the adhesive layer 57 is torn off, the outer shell 51 is connected with the lower end of the circuit board body 4 in an adhesive manner, because the outer shell 51 is provided with four arc grooves 58, the installation of the circuit board body 4 can be prevented from being influenced, the two connectors 53 are connected with an external water pump together, the cooling liquid flows in the water cooling pipe 54, so that the bottom of the circuit board body 4 dissipates heat, the heat dissipation efficiency can be improved, the overhigh temperature of the circuit board body 4 during high-load operation can be avoided, the circuit board body 4 is connected with four threaded installation rods 2 in a penetrating manner during installation of the circuit board body 4, the four installation mechanisms 3 are connected with the four threaded installation rods 2 in a threaded manner, the fastening piece 31 is rotated, the rubber pressing plate 32 is enabled to be contacted with the circuit board body 4 and limited, the fastening piece 31 can be prevented from being extruded and damaged, the fastening piece 31 can be conveniently rotated, and the convenience of operation of the fastening piece 31 can be improved.
The foregoing has shown and described the basic principles and main features of the present utility model and the advantages of the present utility model. It will be understood by those skilled in the art that the present utility model is not limited to the embodiments described above, and that the above embodiments and descriptions are merely illustrative of the principles of the present utility model, and various changes and modifications may be made without departing from the spirit and scope of the utility model, which is defined in the appended claims. The scope of the utility model is defined by the appended claims and equivalents thereof.

Claims (5)

1. The utility model provides a circuit board subassembly with water-cooling heat dissipation function, includes mount pad (1), its characterized in that: the four corners of the upper end of the mounting seat (1) are fixedly connected with threaded mounting rods (2), the four threaded mounting rods (2) are jointly inserted and movably connected with a circuit board body (4), the outer surfaces of the four threaded mounting rods (2) are connected with mounting mechanisms (3) in a threaded manner, the four mounting mechanisms (3) are positioned on the upper part of the circuit board body (4), and the lower end of the circuit board body (4) is connected with a water cooling mechanism (5) in an adhesive manner;
The water cooling mechanism (5) comprises an outer shell (51), a notch (56) is formed in the upper end of the outer shell (51), a plurality of heat dissipation through holes (52) penetrating through the front end and the rear end of the outer shell (51) are formed in the front end and the rear end of the outer shell, a lifting frame (55) is fixedly connected to the lower groove wall of the notch (56), a water cooling pipe (54) is fixedly connected to the right groove wall of the notch (56), connectors (53) are fixedly connected to the two ends of the water cooling pipe (54), the connectors (53) are fixedly connected to the right end of the outer shell (51), the lifting frame (55) is movably connected with the water cooling pipe (54) in a penetrating mode, arc grooves (58) are formed in four corners of the outer surface of the outer shell (51), and an adhesive layer (57) is fixedly connected to the upper end of the outer shell (51).
2. The circuit board assembly with water cooling function according to claim 1, wherein: four clamping grooves (551) are formed in the upper end of the lifting frame (55), and the four clamping grooves (551) are jointly connected with the water cooling pipe (54) in an penetrating and movable mode.
3. The circuit board assembly with water cooling function according to claim 1, wherein: the adhesive layer (57) is connected with the lower end of the circuit board body (4) in an adhesive mode, and the four arc-shaped grooves (58) are respectively connected with the four threaded mounting rods (2) in a penetrating and movable mode.
4. The circuit board assembly with water cooling function according to claim 1, wherein: the mounting mechanism (3) comprises a fastener (31), a plurality of poking sheets (33) are fixedly connected to the outer surface of the fastener (31), and a rubber pressing plate (32) is fixedly connected to the lower end of the fastener (31).
5. The circuit board assembly with water cooling function according to claim 4, wherein: the fastener (31) is in threaded connection with the threaded mounting rod (2), the rubber pressing plate (32) is in threaded movable connection with the threaded mounting rod (2), the rubber pressing plate (32) is not in contact with the threaded mounting rod (2), and the rubber pressing plate (32) is in contact with the upper end of the circuit board body (4).
CN202322618735.8U 2023-09-26 2023-09-26 Circuit board assembly with water cooling and heat dissipation functions Active CN221058493U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202322618735.8U CN221058493U (en) 2023-09-26 2023-09-26 Circuit board assembly with water cooling and heat dissipation functions

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202322618735.8U CN221058493U (en) 2023-09-26 2023-09-26 Circuit board assembly with water cooling and heat dissipation functions

Publications (1)

Publication Number Publication Date
CN221058493U true CN221058493U (en) 2024-05-31

Family

ID=91200975

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202322618735.8U Active CN221058493U (en) 2023-09-26 2023-09-26 Circuit board assembly with water cooling and heat dissipation functions

Country Status (1)

Country Link
CN (1) CN221058493U (en)

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