CN213122890U

CN213122890U - Radiating mechanism for single chip microcomputer

Info

Publication number: CN213122890U
Application number: CN202022536543.9U
Authority: CN
Inventors: 夏敏豪; 薛智勇; 汪志平; 代雅旋; 王欣; 高旋旋; 罗宇航
Original assignee: Individual
Current assignee: Individual
Priority date: 2020-11-05
Filing date: 2020-11-05
Publication date: 2021-05-04
Anticipated expiration: 2030-11-05

Abstract

The utility model discloses a heat dissipation mechanism for a single chip microcomputer, which comprises a box body, a first fixed frame is fixedly arranged at the upper end of the box body, a second fixed frame is fixedly connected at the lower end of the box body, a dust cover is fixedly arranged at the upper ends of the inner parts of the first fixed frame and the second fixed frame, a heat dissipation backboard is fixedly connected at the back end surface of the box body, a cooling water pipe is fixedly arranged on the surface of the heat dissipation backboard, one end of the cooling water pipe is fixedly connected with a circulating water pump, the back end surface of the heat dissipation backboard is fixedly connected with heat dissipation fins, a spring is fixedly connected at the upper end and the lower end of the inner part of the box body, a clamping plate is fixedly connected at one end of the spring, and a PCB is fixedly arranged between the clamping plates, the utility model has simple structure and, the heat dissipation effect is improved.

Description

Radiating mechanism for single chip microcomputer

Technical Field

The utility model relates to a singlechip technical field specifically is a heat dissipation mechanism for singlechip.

Background

The single chip computer is an integrated circuit chip, which is a small and perfect microcomputer system formed by integrating the functions of a central processing unit CPU with data processing capacity, a random access memory RAM, a read only memory ROM, various I/O ports, an interrupt system, a timer/counter and the like (possibly comprising a display driving circuit, a pulse width modulation circuit, an analog multiplexer, an A/D converter and other circuits) on a silicon chip by adopting a super-large scale integrated circuit technology, and is widely applied to the field of industrial control.

The technical problems in the prior art are as follows: the singlechip is when continuously operating, can produce a large amount of heats, because the singlechip is installed on the PCB board, the radiating effect is relatively poor, easily leads to the singlechip overheated, and the hot melt takes place for the pin welding department, causes PCB board and the direct overheated damage of singlechip, influences the normal use of singlechip.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a singlechip is with heat dissipation mechanism to solve the problem that proposes among the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme: the improved box comprises a box body, box body upper end fixed mounting has first fixed frame, the fixed frame of box body lower extreme fixedly connected with second, the equal fixed mounting in the inside upper end of first fixed frame and the fixed frame of second has the dust cover, box body back of the body terminal surface fixedly connected with heat dissipation backplate, heat dissipation backplate fixed surface installs condenser tube, condenser tube one end fixedly connected with circulating water pump, heat dissipation backplate back of the body terminal surface fixedly connected with heat radiation fins, the inside equal fixedly connected with spring of lower extreme of going up of box body, spring one end fixedly connected with splint, fixed mounting has the PCB board between the splint.

Further, the inside fixed mounting of first fixed frame has air intake fan, the inside fixed mounting of the fixed frame of second has air outlet fan.

Furthermore, the cooling water pipe is fixedly arranged on the surface of the heat dissipation back plate in a serpentine structure.

Furthermore, the radiating fins extend into the radiating back plate and are connected with the cooling water pipe.

Furthermore, a plurality of radiating grooves are formed in the box body.

Furthermore, two sets of springs are arranged at one end of the spring inside the box body and are respectively fixed at two ends of the clamping plate.

Compared with the prior art, the beneficial effects of the utility model are that:

1. the utility model discloses a first fixed frame and the second fixed frame that set up to be provided with air inlet fan and air-out fan inside, make can circulate the air of inside when the singlechip carries out work, guarantee to enter the cooling through air inlet fan and use the wind to dispel the heat to the PCB board, and discharge the hot-blast of inside through air-out fan, guarantee the normal work of singlechip;

2. the utility model discloses a heat dissipation backplate that sets up to the condenser tube that sets up on the surface makes can contact the PCB board, makes can cool off the PCB board, guarantees the normal clear of work, and through the heat radiation fin who sets up at the back, makes can carry out by a wide margin the heat that condenser tube received and distribute, can cool off the coolant liquid in the condenser tube more fast, makes the radiating effect better;

3. the utility model discloses simple structure, the modern design can carry out more efficient heat dissipation to the inside PCB board of singlechip through two kinds of radiating modes, and whole radiating process can not cause radiating loss, promotes the radiating effect.

Drawings

FIG. 1 is a schematic view of the overall structure of the present invention;

fig. 2 is a schematic view of the front structure of the heat dissipation back plate of the present invention;

fig. 3 is a schematic view of the back structure of the heat dissipation back plate of the present invention;

fig. 4 is a schematic view of the fixing frame structure of the present invention.

In FIGS. 1-4: 1-box body; 2-a first fixed frame; 3-a second fixed frame; 4-a heat dissipation back plate; 5-a spring; 6-clamping plate; 7-a PCB board; 8-a cooling water pipe; 9-a circulating water pump; 10-heat dissipation fins; 11-dust cover.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-4, the present invention provides a technical solution: comprising a box body 1.

Wherein, 1 upper end fixed mounting of box body has first fixed frame 2, the fixed frame 3 of 1 lower extreme fixedly connected with second of box body, the equal fixed mounting in the inside upper end of the fixed frame 3 of first fixed frame 2 and second has dust cover 11.

The heat dissipation device comprises a box body 1, a heat dissipation back plate 4, a cooling water pipe 8, a circulating water pump 9 and heat dissipation fins 10, wherein the back end face of the box body 1 is fixedly connected with the heat dissipation back plate 4, the surface of the heat dissipation back plate 4 is fixedly provided with the cooling water pipe 8, and the back end face of the cooling water pipe 8 is fixedly connected with the circulating water pump 9.

Wherein, the equal fixedly connected with spring 5 of lower extreme about 1 inside of box body, 5 one end fixedly connected with splint 6 of spring, fixed mounting has PCB board 7 between splint 6.

Further, the inside fixed mounting of first fixed frame 2 has air intake fan, the inside fixed mounting of the fixed frame 3 of second has air outlet fan.

Further, the cooling water pipe 8 is fixedly installed on the surface of the heat dissipation back plate 4 in a serpentine structure.

Further, the heat dissipation fins 10 extend into the heat dissipation back plate 4 to be connected with the cooling water pipes 8.

Furthermore, a plurality of radiating grooves are formed in the box body 1.

Furthermore, two groups of springs 5 are arranged at one end of the box body 1 and fixed at two ends of the clamping plate 6 respectively.

The working principle is as follows: when the single chip microcomputer cooling box is used, when a PCB 7 is installed into the box body 1 to work, the PCB 7 can be cooled through the arranged first fixing frame 2 and the second fixing frame 3 and the air inlet fan and the air outlet fan are arranged in the single chip microcomputer, so that air in the single chip microcomputer can be circulated when the single chip microcomputer works, the PCB 7 can be guaranteed to be cooled through the air inlet fan entering cooling air, hot air in the single chip microcomputer can be discharged through the air outlet fan, normal work of the single chip microcomputer is guaranteed, meanwhile, the PCB 7 can be contacted through the arranged heat dissipation back plate 4 and the cooling water pipe 8 arranged on the surface, the PCB 7 can be cooled, normal work is guaranteed, heat received by the cooling water pipe 8 can be greatly dissipated through the heat dissipation fins 10 arranged on the back surface, and cooling liquid in the cooling pipe 8 can be cooled more quickly, so that the heat dissipation effect is better.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a heat dissipation mechanism for singlechip, includes box body (1), its characterized in that: box body (1) upper end fixed mounting has first fixed frame (2), the fixed frame (3) of box body (1) lower extreme fixedly connected with second, the equal fixed mounting in the inside upper end of first fixed frame (2) and the fixed frame (3) of second has dust cover (11), box body (1) back of the body terminal surface fixedly connected with heat dissipation backplate (4), heat dissipation backplate (4) fixed surface installs cooling water pipe (8), cooling water pipe (8) one end fixedly connected with circulating water pump (9), heat dissipation backplate (4) back of the body terminal surface fixedly connected with heat radiation fins (10), the equal fixedly connected with spring (5) of lower extreme about box body (1) inside, spring (5) one end fixedly connected with splint (6), fixed mounting has PCB board (7) between splint (6).

2. The heat dissipating mechanism for a single chip microcomputer according to claim 1, wherein: the air inlet fan is fixedly arranged in the first fixing frame (2), and the air outlet fan is fixedly arranged in the second fixing frame (3).

3. The heat dissipating mechanism for a single chip microcomputer according to claim 1, wherein: the cooling water pipe (8) is fixedly arranged on the surface of the heat dissipation back plate (4) in a serpentine structure.

4. The heat dissipating mechanism for a single chip microcomputer according to claim 1, wherein: the radiating fins (10) extend into the radiating back plate (4) and are connected with the cooling water pipe (8).

5. The heat dissipating mechanism for a single chip microcomputer according to claim 1, wherein: a plurality of radiating grooves are formed in the box body (1).

6. The heat dissipating mechanism for a single chip microcomputer according to claim 1, wherein: two sets of springs (5) are arranged at one end inside the box body (1) and are respectively fixed at two ends of the clamping plate (6).