CN210488486U - Water cooling head of double-layer radiating water-cooling radiator - Google Patents
Water cooling head of double-layer radiating water-cooling radiator Download PDFInfo
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- CN210488486U CN210488486U CN201922011369.3U CN201922011369U CN210488486U CN 210488486 U CN210488486 U CN 210488486U CN 201922011369 U CN201922011369 U CN 201922011369U CN 210488486 U CN210488486 U CN 210488486U
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Abstract
The utility model discloses a double-deck radiating water-cooling radiator's water-cooling head, include: the heat dissipation device comprises a first heat exchange area, a second heat exchange area, a motor, a first connecting pipe, a second connecting pipe and a heat dissipation module. The bottom of the first heat exchange area is fixed on the CPU; the second heat exchange area is fixed at the top of the first heat exchange area; the first heat exchange area is communicated with the second heat exchange area through a first connecting pipe and a second connecting pipe; the heat dissipation module is fixed at the top of the second heat exchange area; the cooling liquid enters the first heat exchange area from a first water inlet of the first heat exchange area, sequentially flows through the first heat exchange area, the first connecting pipe, the second heat exchange area and the second connecting pipe, flows out from a first water outlet of the first heat exchange area, flows into a water inlet of the heat dissipation row, flows out from a water outlet of the heat dissipation row and flows into a first water inlet of the first heat exchange area, and therefore cooling circulation is formed. Therefore, the utility model discloses a double-deck radiating water-cooled radiator's water-cooling head has promoted the radiating efficiency greatly.
Description
Technical Field
The utility model relates to a computer CPU's water-cooling radiator technical field especially relates to a double-deck radiating water-cooling radiator's water-cooling head.
Background
As is known, an integrated circuit inside a computer generates a large amount of heat, which may cause unstable operation of the system, shorten the service life, and even possibly burn some components, so a heat sink is required to absorb the heat to ensure that the temperature of the computer components is normal.
The liquid cooling radiator commonly used for radiating the computer processor dissipates heat through the circulation of cooling liquid. The cooling liquid can carry away the heat at the heating end, releases the heat at the heat dissipation section, thereby achieving the purpose of heat dissipation.
All devices in the existing scheme comprise a water cooling head, a pipeline, a heat dissipation plate and the like. Under the drive of a water pump in the water cooling head, cooling liquid flows through the water cooling head, the pipeline, the heat dissipation and discharge and other components in sequence. And matching the water cooling heads and the heat dissipation bars with different specifications according to heat dissipation requirements. The heat dissipation capacity depends on the heat dissipation area of the heat dissipation row, and the larger the area, the better the heat dissipation capacity.
However, the existing solutions are limited by compatibility, the size of the heat dissipation bar is often limited by the size of the chassis and the arrangement of the installation positions, and the heat dissipation capability of the system is limited by the size of the heat dissipation bar.
The information disclosed in this background section is only for enhancement of understanding of the general background of the invention and should not be taken as an acknowledgement or any form of suggestion that this information constitutes prior art already known to a person skilled in the art.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a double-deck radiating water-cooling radiator's water-cooling head, it can promote the radiating efficiency greatly.
In order to achieve the above object, the utility model provides a double-deck radiating water-cooling radiator's water-cooling head, include: the heat dissipation device comprises a first heat exchange area, a second heat exchange area, a motor, a first connecting pipe, a second connecting pipe and a heat dissipation module. The bottom of the first heat exchange area is fixed on the CPU; the second heat exchange area is fixed on the first heat exchange area; the motor is arranged between the first heat exchange area and the second heat exchange area; the first heat exchange area is communicated with the second heat exchange area through a first connecting pipe and a second connecting pipe; the heat dissipation module is fixed at the top of the second heat exchange area; the cooling liquid enters the first heat exchange area from a first water inlet of the first heat exchange area, sequentially flows through the first heat exchange area, the first connecting pipe, the second heat exchange area and the second connecting pipe, flows out from a first water outlet of the first heat exchange area, flows into a water inlet of the heat dissipation row, flows out from a water outlet of the heat dissipation row and flows into the first water inlet of the first heat exchange area, and therefore a cooling cycle is formed; the heat dissipation module is used for dissipating heat of the cooling liquid flowing through the second heat exchange area.
The utility model discloses an in an embodiment, double-deck radiating water-cooled radiator's water-cooling head still includes the fan, is fixed in on the thermal module, and the fan is used for dispelling the heat to the thermal module.
In an embodiment of the present invention, the first heat exchange area includes: heat exchange copper bottom and copper bottom bin. The bottom of the heat exchange copper bottom is fixed on the CPU and used for absorbing the heat of the CPU; the copper bottom bin is fixed on the heat exchange copper bottom and comprises a water feeding area and a water return area; wherein, first water inlet and first delivery port are seted up on the lateral wall in copper end storehouse.
In an embodiment of the present invention, the second heat exchange area includes an impeller chamber, an impeller, a water distribution plate and a heat dissipation cover plate, the impeller is disposed in the impeller chamber, the water distribution plate is covered on the impeller, the heat dissipation cover plate is covered on the water distribution plate and is fixedly connected to the top of the impeller chamber, the bottom of the heat dissipation module is fixed to the top of the heat dissipation cover plate, and the heat dissipation cover plate is used for sealing the second heat exchange area; wherein, the impeller storehouse has second water inlet and second delivery port.
In one embodiment of the present invention, the first heat exchange area has a housing on the outside.
The utility model discloses an in an embodiment, double-deck radiating water-cooled radiator's water-cooling head still includes: a water inlet nozzle and a water outlet nozzle. One end of the water inlet nozzle is fixedly connected and communicated with the first water inlet, and the other end of the water inlet nozzle is communicated with the water outlet of the heat dissipation bar; and the water outlet nozzle is fixedly connected and communicated with the first water outlet, and the other end of the water outlet nozzle is communicated with the water inlet of the heat dissipation row.
Compared with the prior art, according to the utility model discloses a double-deck radiating water-cooled radiator's water-cooling head has increased heat radiation module and fan under the condition that does not change the heat dissipation row specification, has promoted the radiating efficiency of system greatly, makes the better operation of computer system.
Drawings
Fig. 1 is a schematic overall structural view of a water cooling head of a double-layer heat radiation water-cooling heat sink according to an embodiment of the present invention;
fig. 2 is an exploded schematic view of a water cooling head of a double-layered heat-dissipating water-cooled heat sink according to an embodiment of the present invention;
fig. 3 is an exploded schematic view of a second heat exchange area of a water cooling head of a double-layered heat-dissipating water-cooled heat sink according to an embodiment of the present invention.
Description of the main reference numerals:
1-heat exchange copper bottom, 2-copper bottom bin, 21-water feeding area, 22-water returning area, 23-first water inlet, 24-first water outlet, 3-impeller bin, 4-motor, 5-impeller, 6-water dividing plate, 61-water dividing sheet, 7-heat dissipation module, 8-first connecting pipe, 9-second connecting pipe, 10-fan, 11-heat dissipation row, 12-shell, 13-water inlet nozzle, 14-water outlet nozzle and 15-heat dissipation cover plate.
Detailed Description
The following detailed description of the present invention is provided in conjunction with the accompanying drawings, but it should be understood that the scope of the present invention is not limited by the following detailed description.
Throughout the specification and claims, unless explicitly stated otherwise, the word "comprise", or variations such as "comprises" or "comprising", will be understood to imply the inclusion of a stated element or component but not the exclusion of any other element or component.
Fig. 1 is a schematic view of the overall structure of a water cooling head of a double-layer heat-dissipating water-cooling radiator according to an embodiment of the present invention, as shown in fig. 1, according to the present invention, a water cooling head of a double-layer heat-dissipating water-cooling radiator includes: a first heat exchange area, a second heat exchange area, a motor 4, a first connection pipe 8 and a second connection pipe 9, and a heat dissipation module 7. The bottom of the first heat exchange area is fixed on the CPU; the second heat exchange area is fixed on the first heat exchange area; the motor 4 is arranged between the first heat exchange area and the second heat exchange area; the first heat exchange area is communicated with the second heat exchange area through a first connecting pipe 8 and a second connecting pipe 9; the heat dissipation module 7 is fixed on the second heat exchange area; the cooling liquid enters the first heat exchange area from a first water inlet 23 of the first heat exchange area, sequentially flows through the first heat exchange area, the first connecting pipe 8, the second heat exchange area and the second connecting pipe 9, flows out of the first heat exchange area from a first water outlet 24 of the first heat exchange area, flows into a water inlet of the heat dissipation row 11, flows out of a water outlet of the heat dissipation row 11 and flows into the first water inlet 23 of the first heat exchange area, and thus a cooling cycle is formed; the heat dissipation module 7 is used for dissipating heat of the cooling liquid flowing through the second heat exchange area; the water cooling head of the double-layer radiating water-cooling radiator also comprises a fan 10 which is fixed on the radiating module 7, and the fan 10 is used for radiating the radiating module 7; wherein the exterior of the first heat exchange zone has an outer shell 12.
As shown in fig. 1, in an embodiment of the present invention, the water cooling head of the double-layer heat dissipation water-cooling heat sink further includes: a water inlet nozzle 13 and a water outlet nozzle 14. One end of the water inlet nozzle 13 is fixedly connected and communicated with the first water inlet 23, and the other end of the water inlet nozzle 13 is communicated with the water outlet of the heat dissipation bar 11; the water outlet nozzle 14 is fixedly connected and communicated with the first water outlet 24, and the other end of the water outlet nozzle 14 is communicated with the water inlet of the heat dissipation bar 11
Fig. 2 is an exploded schematic view of a water cooling head of a double-layer heat-dissipating water-cooled heat sink according to an embodiment of the present invention, as shown in fig. 2, in an embodiment of the present invention, a first heat exchange area includes: a heat exchange copper bottom 1 and a copper bottom bin 2. The bottom of the heat exchange copper bottom 1 is fixed on the CPU and used for absorbing the heat of the CPU; the copper bottom bin 2 is fixed on the heat exchange copper bottom 1, and the copper bottom bin 2 comprises a water feeding area 21 and a water return area 22; wherein, the first water inlet 23 and the first water outlet 24 are arranged on the side wall of the copper bottom bin 2.
Fig. 3 is according to the utility model discloses an embodiment's decomposition structure schematic diagram in the second heat exchange area of double-deck radiating water-cooled radiator's water-cooling head, as shown in fig. 3 the utility model discloses an embodiment, second heat exchange area includes impeller storehouse 3, impeller 5, water diversion plate 6, water diversion sheet 61 and heat dissipation apron 15, motor 4 sets up in the lower part of impeller storehouse 3, impeller 5 sets up in impeller storehouse 3, water diversion plate 6 lid is located on impeller 5, water diversion sheet 61 sets up on water diversion plate 6, heat dissipation apron 15 lid locate on water diversion plate 6 and with impeller storehouse 3's top fixed connection, on heat dissipation module 7's bottom is fixed in heat dissipation apron 15's top, and heat dissipation apron 15 is used for sealing up second heat exchange area.
In practical application, the utility model discloses a double-deck radiating water-cooling radiator's water-cooling head, 1 at the bottom of the coolant liquid contact heat transfer copper in the first heat exchange area, the heat at the bottom of the heat transfer copper 1 can be passed to CPU to the coolant liquid, and then have thermal coolant liquid and flow to second heat exchange area through last water zone 21 and first connecting pipe 8, when the coolant liquid was through the second heat exchange area, thermal module 7 and fan 10 dispel the heat to the coolant liquid (carry out the first heat dissipation to the coolant liquid in second heat exchange area), such setting can be under the condition that does not change the heat dissipation and arrange 11 specifications, increase heat radiating area. The cooling liquid after heat dissipation flows to the water inlet of the heat dissipation row 11 through the impeller 5, the impeller bin 3, the second connecting pipe 9, the water return area 22, the first water outlet 24 and the water outlet nozzle 14, and the cooling liquid after heat dissipation through the heat dissipation row 11 flows back to the copper bottom bin 2 through the water inlet nozzle 13 and the first water inlet 23 (the heat dissipation row 11 performs secondary heat dissipation on the passing cooling liquid), so that a cooling cycle is formed.
In a word, the utility model discloses a double-deck radiating water-cooling radiator's water-cooling head is under the condition that does not change the heat dissipation and arranges the specification, has increased heat radiating area, has promoted the radiating efficiency of system greatly, makes the better operation of computer system.
The foregoing descriptions of specific exemplary embodiments of the present invention have been presented for purposes of illustration and description. It is not intended to limit the invention to the precise form disclosed, and obviously many modifications and variations are possible in light of the above teaching. The exemplary embodiments were chosen and described in order to explain certain principles of the invention and its practical application to enable one skilled in the art to make and use various exemplary embodiments of the invention and various alternatives and modifications as are suited to the particular use contemplated. It is intended that the scope of the invention be defined by the claims and their equivalents.
Claims (6)
1. The utility model provides a double-deck radiating water-cooled radiator's water-cooling head which characterized in that includes:
the bottom of the first heat exchange area is fixed on the CPU;
a second heat exchange area fixed to the first heat exchange area;
a motor disposed between the first heat exchange zone and the second heat exchange zone;
the first heat exchange area is communicated with the second heat exchange area through the first connecting pipe and the second connecting pipe; and
the heat dissipation module is fixed at the top of the second heat exchange area;
the cooling liquid enters the first heat exchange area from a first water inlet of the first heat exchange area, sequentially flows through the first heat exchange area, the first connecting pipe, the second heat exchange area and the second connecting pipe, flows out from a first water outlet of the first heat exchange area, flows into a water inlet of the heat dissipation row, flows out from a water outlet of the heat dissipation row and flows into the first water inlet of the first heat exchange area, and thus a cooling cycle is formed;
the heat dissipation module is used for dissipating heat of the cooling liquid flowing through the second heat exchange area.
2. The water cooling head of the double-deck heat dissipation water-cooled heat sink as recited in claim 1, further comprising a fan fixed to the heat dissipation module, wherein the fan is configured to dissipate heat from the heat dissipation module.
3. The water-cooled head of a double-deck heat-dissipating water-cooled heat sink as recited in claim 1, wherein the first heat exchange area comprises:
the bottom of the heat exchange copper bottom is fixed on the CPU and used for absorbing the heat of the CPU; and
the copper bottom bin is fixed on the heat exchange copper bottom and comprises a water feeding area and a water return area;
the first water inlet and the first water outlet are formed in the side wall of the copper bottom bin.
4. The water-cooling head of the double-layer heat-dissipation water-cooling heat sink as recited in claim 1, wherein the second heat exchange area comprises an impeller chamber, an impeller, a water diversion plate and a heat dissipation cover plate, the impeller is disposed in the impeller chamber, the water diversion plate is covered on the impeller, the heat dissipation cover plate is covered on the water diversion plate and is fixedly connected with the top of the impeller chamber, the bottom of the heat dissipation module is fixed on the top of the heat dissipation cover plate, and the heat dissipation cover plate is used for sealing the second heat exchange area;
wherein, the impeller storehouse has second water inlet and second delivery port.
5. The water-cooled head of a double-deck heat-dissipating water-cooled heat sink as recited in claim 1, wherein the first heat exchange area has an outer shell on the outside thereof.
6. The water cooling head of the double-deck heat-dissipating water-cooled heat sink as recited in claim 1, further comprising:
one end of the water inlet nozzle is fixedly connected and communicated with the first water inlet, and the other end of the water inlet nozzle is communicated with the water outlet of the heat dissipation bar; and
and the water outlet nozzle is fixedly connected and communicated with the first water outlet, and the other end of the water outlet nozzle is communicated with the water inlet of the heat dissipation bar.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922011369.3U CN210488486U (en) | 2019-11-20 | 2019-11-20 | Water cooling head of double-layer radiating water-cooling radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922011369.3U CN210488486U (en) | 2019-11-20 | 2019-11-20 | Water cooling head of double-layer radiating water-cooling radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210488486U true CN210488486U (en) | 2020-05-08 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922011369.3U Active CN210488486U (en) | 2019-11-20 | 2019-11-20 | Water cooling head of double-layer radiating water-cooling radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210488486U (en) |
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2019
- 2019-11-20 CN CN201922011369.3U patent/CN210488486U/en active Active
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